KR101861820B1 - temperature control system for heating medium oil using heating and cooling device of pressure seal type - Google Patents

temperature control system for heating medium oil using heating and cooling device of pressure seal type Download PDF

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KR101861820B1
KR101861820B1 KR1020170175962A KR20170175962A KR101861820B1 KR 101861820 B1 KR101861820 B1 KR 101861820B1 KR 1020170175962 A KR1020170175962 A KR 1020170175962A KR 20170175962 A KR20170175962 A KR 20170175962A KR 101861820 B1 KR101861820 B1 KR 101861820B1
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South Korea
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heating
control valve
pipe
medium oil
heating device
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KR1020170175962A
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Korean (ko)
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전창열
이창식
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(주)강원엔.티.에스
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B30PRESSES
    • B30BPRESSES IN GENERAL
    • B30B15/00Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/34Heating or cooling presses or parts thereof
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00Control of temperature
    • G05D23/19Control of temperature characterised by the use of electric means

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Mechanical Engineering (AREA)
  • Press Drives And Press Lines (AREA)

Abstract

The present invention relates to a system to control temperature of heat medium oil using a hermetic heating and cooling device, capable of rapidly heating or cooling heat medium oil used for performing a work to press a raw printed circuit board (PCB) substrate. According to one embodiment of the present invention, the system comprises: a first control valve installed on an outlet side of an inlet pipe from which heat medium oil is supplied from arbitrary equipment to be able to be opened/closed; a heating device installed on a middle side of a heating pipe whose inlet side communicates with the first control valve; a first pump installed on the heating pipe towards an upstream of the heating device; a second control valve installed on the heating pipe towards a downstream of the heating device to be able to be opened/closed; a heat exchanger installed on a cooling pipe whose inlet side communicates with the first control valve and whose outlet side communicates with a multi-pipe through which the heat medium oil to be heated or cooled passes; and a second pump installed on an outlet of the multi-pipe, and to supply the heat medium oil, which is heated at arbitrary temperature by the heating device or is cooled at arbitrary temperature by the heat exchanger to be moved to the multi-pipe.

Description

밀폐형 히팅 및 쿨링 장치를 이용한 열매체유 온도 제어시스템{temperature control system for heating medium oil using heating and cooling device of pressure seal type}BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a control system for a heating medium oil using a sealed heating and cooling apparatus,

본 명세서는 밀폐형 히팅 및 쿨링 장치에 관한 것으로, 보다 구체적으로 설명하면, PCB 원판을 프레스 성형하는 작업 등을 수행하기 위해 사용되는 열매체유를 고온으로 급상승시키거나 급냉시킬 수 있도록 한, 밀폐형 히팅 및 쿨링 장치를 이용한 열매체유 온도 제어시스템에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a hermetically sealed heating and cooling apparatus, and more particularly, to a hermetic type heating and cooling apparatus which is capable of rapidly heating or quenching thermal oil used for press- And more particularly, to a heat medium oil temperature control system using the apparatus.

일반적으로, 인쇄회로기판(PCB)은 절연기판 상에 배선이 집적되어 다양한 소자들이 실장되거나 소자 간의 전기적 연결이 가능하도록 구성된 부품을 의미하며, 일 예로서 램(ram), 메인 보드(main board), 랜 카드 등을 들 수 있다.In general, a printed circuit board (PCB) refers to a component that is integrated with a wiring board on an insulating substrate so that various components can be mounted or an electrical connection between the components can be performed. Examples of the component include a ram, a main board, , LAN cards, and the like.

인쇄회로기판은 도 1에 도시된 바와 같은 동박 적층판(1)에 의해 제조된다. 동박 적층판은 인쇄회로기판을 제조하기 위한 기본 재료로서, CCL(copper clad laminate) 원판 이라 칭한다.The printed circuit board is manufactured by the copper-clad laminate 1 as shown in Fig. A copper clad laminate is a basic material for producing a printed circuit board, and is referred to as a CCL (copper clad laminate) original plate.

즉, 인쇄회로기판은 CCL 원판을 재단하여 워킹 패널을 만들고, 워킹 패널의 일면 또는 양면에 회로를 형성하여 다수개의 PCB 패널을 배열 형성한 후, PCB 패널들의 외곽을 각각 가공하게 된다.That is, the printed circuit board is formed by cutting a CCL disc to form a working panel, and a circuit is formed on one or both sides of the working panel to arrange a plurality of PCB panels, and then the outer edges of the PCB panels are processed.

이때, CCL 원판은 유리섬유에 에폭시 또는 페놀 수지가 포함된 프리 드레그의 상하부에 동박을 부착하고, 라미네이팅한 것을 말하며, 워킹 패널에 회로를 형성할 때, PCB 패널에도 다수개의 단위기판이 배열 형성된다. At this time, the CCL circular plate is a laminate of copper foil attached to the upper and lower portions of the free legs containing epoxy or phenolic resin in the glass fiber, and when a circuit is formed on the working panel, a plurality of unit substrates are arranged on the PCB panel .

도 1에서와 같이, 동박 적층판(1)은 에폭시 수지 재질로 형성되는 절연부재(2)의 양면에 구리 재질의 도전층(3,4)이 적층되는 구조를 갖는다. 동박 적층판(1)(인쇄회로기판을 말함)의 배선은 도전층(3,4)을 에칭하여 형성되는 회로패턴에 의해 이루어지며, 절연부재(2)의 한쪽 면에만 배선을 형성한 인쇄회로기판을 단면 인쇄회로기판이라 칭하고, 절연부재(2)의 양쪽면에 배선을 형성한 인쇄회로기판을 양면 인쇄회로기판이라고 칭한다.As shown in Fig. 1, the copper-clad laminate 1 has a structure in which conductive layers 3 and 4 made of copper are laminated on both sides of an insulating member 2 made of an epoxy resin material. The wiring of the copper-clad laminate 1 (referred to as a printed circuit board) is formed by a circuit pattern formed by etching the conductive layers 3 and 4, Is referred to as a single-sided printed circuit board, and a printed circuit board on which wiring is formed on both sides of the insulating member 2 is referred to as a double-sided printed circuit board.

도면에는 미 도시되었으나, 종래 기술에 의한 PCB 원판을 프레스 성형하기 위한 히팅 및 쿨링 장치는 팽창탱크 및 시스템 구조의 특성상 배관의 최상부에 팽창탱크(expansion tank)를 설치하게 되므로, 팽창탱크를 설치하는 장소에 제한을 받게 되는 단점이 있다.Although not shown in the drawing, a heating and cooling apparatus for press-molding a PCB original plate according to the prior art has an expansion tank at the top of the pipe due to the nature of the expansion tank and the system structure. Therefore, There is a drawback in that it is limited.

이로 인해, 높이가 낮은 건물에는 히팅 및 쿨링 장치를 설치할 수 없게 되고, 제한된 건물 높이를 낮출 수 없게 되므로 건물을 신축공사시 높게 건축하거나, 또는 기존의 건물 구조를 변경해야 되는 문제점을 갖게 된다.As a result, it is impossible to install a heating and cooling device in a low-height building and the height of a limited building can not be lowered. Therefore, the building is required to be highly constructed when a new building is constructed, or the existing building structure must be changed.

또한, 팽창탱크가 밀폐형 구조로 형성되지 않아 PCB 원판을 프레스 성형시킬 경우 팽창탱크의 수축 팽창에 따른 용적 변화로 인해 기타 유해한 유증기 및 벤트가 발생될 수 있는 문제점을 갖게 된다.In addition, since the expansion tank is not formed in a hermetically sealed structure, when the original plate of the PCB is press-molded, there is a problem that other harmful vapor and vent may be generated due to the volume change due to expansion and contraction of the expansion tank.

대한민국 등록특허공보 등록번호 10-1110706호에 인쇄회로기판용 원판 및 그 제조방법이 게시되어 있다.Korean Patent Registration No. 10-1110706 discloses an original plate for a printed circuit board and a manufacturing method thereof.

따라서, 본 명세서의 실시예는, 건물 높이에 제한을 받지않고 밀폐형 팽창탱크를 설치할 수 있어 실용성을 갖도록 한, 밀폐형 히팅 및 쿨링 장치를 이용한 열매체유 온도 제어시스템과 관련된다.Accordingly, the embodiments of the present invention relate to a heat medium oil temperature control system using a hermetically sealed heating and cooling device, in which a sealed expansion tank can be installed without being restricted by a building height, thereby realizing practical use.

본 명세서의 실시예는, PCB용 원판을 프레스 성형하는 임의설비에 공급하기 위해 히팅장치에 의해 가열시킨 열매체유와, 열교환기에 의해 쿨링시킨 열매체유의 충돌되는 것을 방지하여 작업성을 향상시킬 수 있도록 한, 밀폐형 히팅 및 쿨링 장치를 이용한 열매체유 온도 제어시스템과 관련된다.The embodiment of the present invention is an apparatus and method for preventing the collision of a heating medium oil heated by a heating device and a heating medium oil cooled by a heat exchanger to supply an arbitrary facility for press molding a PCB for a PCB, , A thermal oil temperature control system using a sealed heating and cooling device.

상기 및 기타 본 명세서의 목적을 달성하기 위하여 본 명세서의 일 실시예에 따르면,In order to achieve the above and other objects of the present disclosure, according to one embodiment of the present disclosure,

임의설비로부터 열매체유가 유입되는 유입관로의 출구측에 개폐가능하게 설치되는 제1컨트롤밸브;A first control valve that is openably and closably provided on an outlet side of an inflow conduit through which heat medium oil flows from an arbitrary facility;

상기 제1컨트롤밸브에 입구측이 연통되는 히팅관로 중간측에 설치되는 히팅장치;A heating device installed at an intermediate side of a heating pipe through which the inlet side communicates with the first control valve;

상기 히팅장치 상류측으로 상기 히팅관로에 설치되는 제1펌프;A first pump installed on the heating pipe toward the upstream side of the heating device;

상기 히팅장치의 하류측으로 상기 히팅관로에 개폐가능하게 설치되는 제2컨트롤밸브;A second control valve that is openably and closably provided in the heating pipe to the downstream side of the heating device;

상기 제1컨트롤밸브에 입구측이 연통되고, 히팅 또는 쿨링되는 열매체유가 통과되는 멀티관로에 출구측이 연통되는 쿨링관로에 설치되는 열교환기;A heat exchanger connected to the first control valve at an inlet side thereof and installed at a cooling line where the outlet side communicates with a multi-channel line through which heating medium oil to be heated or cooled passes;

상기 멀티관로의 출구에 설치되고, 상기 히팅장치에 의해 임의온도로 가열되거나 상기 열교환기에 의해 임의온도로 쿨링되어 상기 멀티관로에 이동되는 열매체유를 상기 임의설비로 공급하기 위한 제2펌프;를 구비하는 것을 특징으로 하는 밀폐형 히팅 및 쿨링 장치를 이용한 열매체유 온도 제어시스템을 제공한다.And a second pump installed at an outlet of the multi-channel pipe and heated to an arbitrary temperature by the heating device or cooled to a predetermined temperature by the heat exchanger to supply the heating oil to the multi- The present invention provides a system for controlling a temperature of a heating medium oil using a closed heating and cooling apparatus.

전술한 바와 같이 구성되는 본 명세서의 실시예는 아래와 같은 이점을 갖는다.The embodiment of the present invention configured as described above has the following advantages.

건물을 높게 건축하거나 기존 건물의 구조를 변경하지않고도 밀폐형 팽창탱크(reflex expansion tank) 및 벤트탱크(vent tank)를 설치할 수 있어 실용성 및 편리성을 갖게 된다.A reflex expansion tank and a vent tank can be installed without building a high building or changing the structure of an existing building, thereby providing practicality and convenience.

또한, PCB용 원판을 프레스 성형시키는 임의설비에 공급하기 위해 히팅장치에 의해 가열시킨 열매체유와, 열교환기에 의해 쿨링시킨 열매체유의 혼합되는 것을 방지하여 작업성을 향상시킴에 따라 생산성을 향상시킬 수 있게 된다.In addition, since the heat medium oil heated by the heating device and the heat medium oil cooled by the heat exchanger are prevented from being mixed to supply the optional equipment for press molding the PCB for the PCB, productivity can be improved by improving the workability do.

도 1은 종래 기술에 의한 인쇄회로기판의 동박 적층판의 개략도,
도 2는 본 명세서의 바람직한 실시예에 따른 밀폐형 히팅 및 쿨링 장치를 이용한 열매체유 온도 제어시스템의 개략도,
도 3은 도 2에 도시된 제어시스템에서, 열매체유를 고온으로 히팅시키는 과정을 나타내는 사용상태도,
도 4는 도 2에 도시된 제어시스템에서, 열매체유를 쿨링시키는 과정을 나타내는 사용상태도,
도 5는 도 2에 도시된 제어시스템에서, 히팅 또는 쿨링되는 열매체유의 온도를 제어하기 위한 시간과 온도의 상관 관계를 나타내는 그래프이다.
1 is a schematic view of a conventional copper clad laminate of a printed circuit board,
2 is a schematic diagram of a heat medium oil temperature control system using a hermetically sealed heating and cooling device in accordance with a preferred embodiment of the present disclosure;
Fig. 3 is a use state diagram showing a process of heating the heat medium oil to a high temperature in the control system shown in Fig. 2,
FIG. 4 is a use state diagram showing a process of cooling the heat medium oil in the control system shown in FIG. 2,
FIG. 5 is a graph showing a correlation between time and temperature for controlling the temperature of a heating oil to be heated or cooled in the control system shown in FIG. 2. FIG.

이하, 첨부도면을 참조하여 본 명세서의 바람직한 실시예에 따른 밀폐형 히팅 및 쿨링 장치를 이용한 열매체유 온도 제어시스템을 상세히 설명하기로 한다.DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a heat medium oil temperature control system using a hermetically sealed heating and cooling device according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

도 2 내지 도 5를 참조하면, 본 명세서의 일 실시예에 따른 밀폐형 히팅 및 쿨링 장치를 이용한 열매체유 온도 제어시스템은2 to 5, a thermal oil temperature control system using a hermetically sealed heating and cooling device according to an embodiment of the present invention includes:

임의설비(일 예로서, PCB 원판을 프레스 성형하기 위한 장치를 말함)로부터 열매체유가 유입되는 유입관로(10)의 출구측에 개폐가능하게 설치되는 제1컨트롤밸브(20);A first control valve 20 which is openably and closably provided at an outlet side of an inflow conduit 10 into which a heat medium oil flows from any facility (for example, a device for press-molding a PCB original plate);

제1컨트롤밸브(20)에 입구측이 연통되는 히팅관로(30) 중간측에 설치되는 히팅장치(50);A heating device (50) installed at a middle side of the heating channel (30) in which the inlet side communicates with the first control valve (20);

히팅장치(50) 상류측으로 히팅관로(30)에 설치되는 제1펌프(40);A first pump (40) installed on the heating pipe (30) on the upstream side of the heating device (50);

히팅장치(50)의 하류측으로 히팅관로(30)에 개폐가능하게 설치되는 제2컨트롤밸브(60);A second control valve (60) installed on the heating pipe (30) so as to be openable and closable to the downstream side of the heating device (50);

제1컨트롤밸브(20)에 입구측이 연통되고, 히팅 또는 쿨링되는 열매체유가 통과되는 멀티관로(70)에 출구측이 연통되는 쿨링관로에 설치되는 열교환기(100);A heat exchanger 100 installed in a cooling pipe communicating an inlet side with the first control valve 20 and having an outlet side communicated with a multi pipe line 70 through which heating oil to be heated or cooled passes;

멀티관로(70)의 출구에 설치되고, 히팅장치(50)에 의해 임의온도로 가열되거나 열교환기(100)에 의해 임의온도로 쿨링되어 멀티관로(70)에 이동되는 열매체유를 배출관로(110)를 따라 임의설비로 공급하기 위한 제2펌프(80);를 구비한다.The heating medium oil which is installed at the outlet of the multi-channel furnace 70 and is heated to a certain temperature by the heating device 50 or cooled to a certain temperature by the heat exchanger 100 to be moved to the multi- And a second pump 80 for supplying the waste water to an arbitrary facility.

더욱 바람직한 실시예에 따르면, 전술한 제1컨트롤밸브(20) 및 제2컨트롤밸브(60)는According to a more preferred embodiment, the first control valve 20 and the second control valve 60, described above,

제어부(160)로부터 인가되는 전기적신호에 비례하여 액츄에이터(미 도시됨)가 구동할 경우 연동되어 에어 유입량에 대응되게 개구량이 조절되는 삼방밸브가 사용될 수 있다.A three-way valve interlocked when the actuator (not shown) is driven in proportion to the electric signal applied from the controller 160 and whose opening amount is adjusted to correspond to the air inflow amount may be used.

제2컨트롤밸브(60)에 입구측이 연통되고 히팅장치(50)의 상류측 히팅관로(30) 임의위치에 출구측이 연통되며, 열교환기(100)에 의해 쿨링된 후 제2펌프(80)측으로 이동되는 쿨링된 열매체유와, 히팅장치(50)에 의해 가열된 후 제2펌프(80)측으로 이동되는 히팅된 열매체유가 서로 충돌되는 것을 방지하기 위한 분기관로(120);를 더 구비할 수 있다.The inlet side is communicated with the second control valve 60 and the outlet side is communicated with any position of the upstream side heating pipe 30 of the heating device 50. After being cooled by the heat exchanger 100, And a branch pipe 120 for preventing the heated heat medium oil, which is heated by the heating device 50 and then moved to the second pump 80 side, from colliding with each other can do.

열교환기(100)에 연통되는 밀폐형 팽창탱크(130)(reflex expansion tank);A closed expansion tank 130 (reflex expansion tank) communicating with the heat exchanger 100;

유입관로(10)에 관로(L-14)를 통해 입구측이 연통되거나, 히팅장치(50)와 제2컨트롤밸브(60)사이의 히팅관로(30)에 관로(L-13)를 통해 입구측이 연통되거나, 또는 히팅장치(50)에 관로(L-150)를 통해 입구측이 연통되는 벤트 탱크(140)(vent tank);를 더 구비할 수 있다.The inlet side is connected to the inflow conduit 10 through the conduit L-14 or the inlet port is connected to the heating conduit 30 between the heating device 50 and the second control valve 60 through the conduit L- Or a vent tank 140 through which the inlet side communicates with the heating device 50 through a conduit L-150.

이때, 열매체유의 온도 변화에 따른 팽창 또는 수축시 배관 내의 압력을 적절하게 제어함에 따라 배관시스템의 구성중 내압이 상대적으로 낮은 부분이 파열되거나 또는 누수되는 것을 방지하기 위한 밀폐형 팽창탱크(130)와, 탱크 내의 압력을 설정압력으로 유지하기 위한 벤트 탱크(140)는 본 명세서가 속하는 기술분야에서 사용되는 기술내용이므로 이들의 구성 및 작동에 대한 상세한 설명은 생략함을 밝혀둔다.In this case, a closed expansion tank 130 for preventing a portion of the piping system having a relatively low internal pressure from being ruptured or leaking due to the control of the pressure in the piping during expansion or contraction according to the temperature change of the heat medium oil, It is noted that the vent tank 140 for maintaining the pressure in the tank at the set pressure is a technical content used in the technical field of the present invention, and thus detailed description of the construction and operation thereof is omitted.

도면중 미 설명부호 150은 열교환기(100)에 의해 쿨링시킨 열매체유를 멀티관로(70)를 경유하여 임의설비에 공급시킬 경우 히팅장치(50)에 의해 가열된 열매체유가 멀티관로(70)로 이동되어 쿨링된 열매체유와 혼합되는 것을 방지하기 위한 체크밸브이다.In the drawings, reference numeral 150 denotes a heat medium oil which is heated by the heating device 50 when the heat medium oil cooled by the heat exchanger 100 is supplied to an arbitrary facility via the multi-channel heat exchanger 70 It is a check valve to prevent it from mixing with the heat medium that is moved and cooled.

이하에서, 본 명세서의 일 실시예에 따른 밀폐형 히팅 및 쿨링 장치를 이용한 열매체유 온도 제어시스템을 상세하게 설명하기로 한다.Hereinafter, a heat medium oil temperature control system using a hermetically sealed heating and cooling device according to an embodiment of the present invention will be described in detail.

가) 임의설비에서 사용하기 위한 열매체유를 고온(일 예로서, 200∼300℃정도를 말함)으로 히팅시키는 것을 첨부도면에 따라 설명한다.(A) Heating oil for use in a certain facility is heated at a high temperature (for example, about 200 to 300 캜).

도 2 및 도 3에서와 같이, 임의설비(미 도시됨)로부터 배출되는 열매체유가 유입관로(10)(L-1)의 입구부(도면부호 미 표기됨)를 통해 유입될 경우 유입관로(10) 출구측에 설치된 제1컨트롤밸브(20)에 의해 열매체유는 히팅관로(30)로 이동된다.2 and 3, when the heat medium oil discharged from an arbitrary facility (not shown) flows through the inlet portion (not shown) of the inflow conduit 10 (L-1), the inflow conduit 10 The heat medium oil is moved to the heating pipe 30 by the first control valve 20 provided at the outlet side.

즉, 제1컨트롤밸브(20)의 볼(미 도시됨) 절환됨에 의해 유입관로(10)(L-1)에 대해 히팅관로(30)(L-2)는 연통되도록 연결되고, 이와 반면에 유입관로(10)(L-1)에 대해 쿨링관로(90)(L-9)는 닫힌상태를 유지하게 된다.That is, by switching the ball (not shown) of the first control valve 20, the heating channel 30 (L-2) is connected to the inlet channel 10 (L-1) The cooling line 90 (L-9) is kept closed with respect to the inflow conduit 10 (L-1).

이로 인해, 유입관로(10)(L-1)에 유입된 열매체유는 제1컨트롤밸브(20)를 통과한 후, 히팅관로(30) 중간측에 설치된 제1펌프(40)의 흡입력에 의해 히팅관로(30)를 따라 이동되어 체크밸브(150) 및 제1펌프(40)를 차례로 경유하여 히팅장치(50)에 이동된다.Therefore, the heat medium oil flowing into the inlet pipe 10 (L-1) passes through the first control valve 20, and is then sucked by the suction force of the first pump 40 installed on the middle side of the heating pipe 30 And is moved to the heating device 50 via the check valve 150 and the first pump 40 in turn.

즉, 임의설비로부터 유입관로(10)(L-1)에 유입된 열매체유는 제1컨트롤밸브(20) - 히팅관로(30)를 이루는 L-2 - 체크밸브(150) - 히팅관로(30)를 이루는 L-3 - 제1펌프(40) - 히팅관로(30)를 이루는 L-4를 차례로 경유하여 히팅장치(50)에 이동된다.That is, the heat medium oil flowing into the inlet pipe 10 (L-1) from the arbitrary equipment is supplied to the first control valve 20 through the L-2 check valve 150 and the heating pipe 30 The first pump 40 and the L-4 constituting the heating pipe 30 are sequentially moved to the heating device 50. The L-

히팅장치(50)에 이동된 열매체유는 열원(hot source)(일 예로서, 전기(electric), 또는 스팀(steam) 등이 사용될 수 있음)에 의해 임의온도로 가열될 수 있다.The heat medium oil transferred to the heating device 50 may be heated to a certain temperature by a hot source (for example, electricity, steam, or the like may be used).

이때, 열원에 의해 열매체유를 임의온도로 가열시키는 히팅장치(50)의 기술내용은 당해분야에서 사용되는 것이므로 이들의 구성에 대한 상세한 설명은 생략한다.Here, the technical content of the heating device 50 for heating the heating medium oil to a certain temperature by the heat source is used in the related art, and thus detailed description of the configuration thereof is omitted.

히팅장치(50)에 의해 임의온도로 상승되도록 가열된 열매체유는 히팅관로(30)를 이루는 L-5를 따라 이동되어 제2컨트롤밸브(60)에 이동된다. The heating fluid heated to be raised to a certain temperature by the heating device 50 is moved along the L-5 forming the heating pipe 30 and is moved to the second control valve 60.

이때, 제2컨트롤밸브(60)의 볼(미 도시됨) 절환됨에 의해 히팅관로(30)의 L-5에 히팅관로(30)의 L-6은 연통되도록 연결되고, 이와 반면에 히팅관로(30)의 L-5에 대해 분기관로(120)(L-12)는 닫힌상태를 유지하게 된다.At this time, the L-6 of the heating pipe 30 is connected to the L-5 of the heating pipe 30 by being switched to the ball (not shown) of the second control valve 60, The branch passage 120 (L-12) is kept closed with respect to the L-5 of the branch passage 120 (L-12).

이로 인해, 히팅장치(50)에 의해 가열된 열매체유는 히팅관로(30)의 L-5를 따라 이동되어 제2컨트롤밸브(60)에 이동된 후, 멀티관로(70)(L-7)와 배출관로(110)(L-8)사이의 관로에 설치된 제2펌프(80)의 흡입력에 의해 히팅관로(30)의 L-6 - 멀티관로(70)(L-7) - 제2펌프(80)를 차례로 경유하게 되므로 배출관로(110)(L-8)를 통과하여 임의설비에 공급된다.The heating fluid heated by the heating device 50 is moved along the L-5 of the heating pipe 30 and moved to the second control valve 60 and then the multi-channel line 70 (L-7) 6-multi-channel line 70 (L-7) of the heating line 30 by the suction force of the second pump 80 installed in the channel between the discharge line 110 and the discharge line 110 (L-8) (L-8), and is supplied to an arbitrary facility.

전술한 바와 같이 임의설비로부터 배출되어 임의온도의 히팅이 요구되는 열매체유는 유입관로(10)(L-1) - 제1컨트롤밸브(20) - 히팅관로(30)(L-2) - 체크밸브(150) - 히팅관로(30)(L-3) - 제1펌프(40) - 히팅관로(30)(L-4) - 히팅장치(50) - 히팅관로(30)(L-5) - 제2컨트롤밸브(60) - 히팅관로(30)(L-6) - 멀티관로(70)(L-7) - 제2펌프(80) - 배출관로(110)(L-8)를 따라 차례로 이동된 후 임의설비로 공급될 수 있다.As described above, the heat medium oil discharged from an arbitrary facility and requiring heating at a certain temperature is supplied to the inlet pipe 10 (L-1) - the first control valve 20 - the heating pipe 30 (L-2) The valve 150 is connected to the heating pipe 30 and the first pump 40 to the heating pipe 30 and the heating device 50 to the heating pipe 30, The second control valve 60 is connected to the heating pipe 30 through the multi-pipe 70 and the second pump 80 through the discharge pipe 110 and the pipe L-8. And may be fed to any facility after being moved in turn.

나) 임의설비에서 사용하기 위한 열매체유를 쿨링시키는 것을 첨부도면에 따라 설명한다.B) Cooling the thermal oil for use in any facility will be described with reference to the accompanying drawings.

도 2 및 도 4에서와 같이, 임의설비(미 도시됨)로부터 배출되는 열매체유가 유입관로(10)(L-1)의 입구부(도면부호 미 표기됨)를 통해 유입될 경우 유입관로(10) 출구측에 설치된 제1컨트롤밸브(20)에 의해 열매체유는 쿨링관로(90)로 이동된다.2 and 4, when the heat medium oil discharged from an arbitrary facility (not shown) flows through the inlet portion (not shown) of the inflow conduit 10 (L-1), the inflow conduit 10 The heat medium oil is moved to the cooling pipe 90 by the first control valve 20 provided at the outlet side.

즉, 제1컨트롤밸브(20)의 볼(미 도시됨) 절환됨에 의해 유입관로(10)(L-1)에 대해 쿨링관로(90)(L-9)는 연통되도록 연결되고, 이와 반면에 유입관로(10)(L-1)에 대해 히팅관로(30)(L-2)는 닫힌상태를 유지하게 된다.That is, by switching the ball (not shown) of the first control valve 20, the cooling line 90 (L-9) is connected to the inlet line 10 (L-1) The heating channel 30 (L-2) is kept closed with respect to the inflow conduit 10 (L-1).

이로 인해, 유입관로(10)(L-1)에 유입된 열매체유는 제1컨트롤밸브(20)를 통과한 후, 쿨링관로(90)에 설치된 열교환기(100)에 이동된다. Accordingly, the heat medium oil flowing into the inlet pipe 10 (L-1) passes through the first control valve 20, and is then transferred to the heat exchanger 100 installed in the cooling pipe 90.

따라서, 열교환기(100)에 유입된 열매체유는 유입관(a) 및 배출관(b)을 따라 유입 및 배출되는 냉각수(cooling source)와 상호 열교환을 하게 된다.Therefore, the heat medium oil flowing into the heat exchanger 100 exchanges heat with the cooling source flowing in and out along the inlet pipe (a) and the outlet pipe (b).

이때, 냉각수와 상호 열교환에 의해 임의설비로부터 배출된 열매체유를 가열시키는 열교환기(100)의 기술내용은 당해분야에서 사용되는 것이므로 이들의 구성에 대한 상세한 설명은 생략한다.At this time, the technical content of the heat exchanger 100 for heating the heat medium oil discharged from the arbitrary facility by mutual heat exchange with the cooling water is used in the related art, and therefore detailed description of the structure thereof will be omitted.

열교환기(100)에서 냉각수와 상호 열교환되어 임의온도로 냉각된 열매체유는 열교환기(100)에서 배출된 후, 멀티관로(70)(L-7)와 배출관로(110)(L-8)사이의 관로에 설치된 제2펌프(80)의 흡입력에 의해 쿨링관로(90)(L-10) - 멀티관로(70)(L-7) - 제2펌프(80) - 배출관로(110)(L-8)를 차례로 이동되므로 임의설비에 공급된다. The heat medium oil that has been heat-exchanged with the cooling water in the heat exchanger 100 and cooled to a certain temperature is discharged from the heat exchanger 100 and then discharged through the multi pipe line L-7 and the discharge pipe line 110 (L-8) (L-10), the multi-channel line 70 (L-7), the second pump 80, and the discharge line passage 110 (refer to FIG. 1) by the suction force of the second pump 80 installed in the channel between the cooling channel 90 L-8) are sequentially moved to be supplied to an arbitrary facility.

전술한 바와 같이 임의설비로부터 배출되어 임의온도로 쿨링이 요구되는 열매체유는 유입관로(10)(L-1) - 제1컨트롤밸브(20) - 쿨링관로(90)(L-9) - 열교환기(100) - 쿨링관로(90)(L-10) - 멀티관로(70)(L-7) - 제2펌프(80) - 배출관로(110)(L-8)를 따라 차례로 이동된 후 임의설비로 공급될 수 있다.As described above, the heat medium oil discharged from an arbitrary facility and required to be cooled at an arbitrary temperature flows through the inlet pipe 10 (L-1) -the first control valve 20-the cooling pipe 90 (L-9) (100) -cooling line 90 (L-10) -multilinear line 70 (L-7) -secondary pump 80 -outlet line 110 (L-8) It can be supplied in any facility.

이때, 제2컨트롤밸브(60)가 볼 절환됨에 의해 히팅관로(30)(L-5)에 대해 히팅관로(30)(L-6)는 닫힌상태를 유지하고, 히팅관로(30)(L-5)에 대해 분기관로(120)(L-12)는 연통된 상태를 유지하게 된다.At this time, the second control valve 60 is changed over to the ball so that the heating channel 30 (L-6) remains closed with respect to the heating channel 30 (L-5) -5), the branch passages 120 (L-12) are kept in a communicated state.

이로 인해, 히팅장치(50)에 의해 임의온도로 가열된 열매체유가 히팅관로(30)(L-5) - 제2컨트롤밸브(60) - 분기관로(120) - 제1펌프(40) - 히팅장치(50)로 순환되는 과정을 반복하게 된다.Accordingly, the heating medium oil heated to a predetermined temperature by the heating device 50 flows through the heating pipe 30 (L-5), the second control valve 60, the branch pipe 120, the first pump 40, The process of circulation to the heating device 50 is repeated.

따라서, 열교환기(100)에 의해 임의온도로 냉각된 후 멀티관로(70)(L-7) - 제2펌프(80)- 배출관로(110)(L-8)를 따라 이동되어 임의설비로 공급되는 열매체유와, 히팅장치(50)에 의해 임의온도로 가열된 열매체유와 혼합되는 것을 방지할 수 있게 된다.Accordingly, the refrigerant is cooled to a predetermined temperature by the heat exchanger 100 and then moved along the multi-channel line 70 (L-7) - the second pump 80 - the discharge line 110 (L-8) It is possible to prevent the supplied heat medium oil from mixing with the heat medium oil heated to a certain temperature by the heating device 50. [

또한, 도 5에서와 같이, 임의설비로부터 배출되는 열매체유를 히팅장치(50) 또는 열교환기(100)를 경유시켜 온도를 제어할 경우 시간과 온도의 함수관계를 나타내는 그래프 선도에 의해 임의온도로 히팅시키거나, 또는 쿨링시킨 후 임의설비로 재공급할 수 있게 된다.As shown in FIG. 5, when the temperature is controlled through the heating device 50 or the heat exchanger 100, the heating oil discharged from an arbitrary facility is controlled at a predetermined temperature Heating, or cooling, and then re-supplied to any facility.

이때, 열매체유를 히팅 또는 쿨링시키기 위한 온도 제어는 제어부(160)에 의해 자동 또는 수동에 의해 제어될 수 있음은 물론이다.It is needless to say that the temperature control for heating or cooling the heat medium oil can be controlled automatically or manually by the control unit 160.

여기에서, 전술한 본 명세서에서는 바람직한 실시예를 참조하여 설명하였지만, 해당 기술분야에서 숙련된 당업자는 하기의 청구범위에 기재된 본 명세서의 사상 및 영역으로부터 벗어나지 않는 범위 내에서 본 명세서를 다양하게 수정 및 변경할 수 있음을 이해할 수 있을 것이다.It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the disclosure as defined in the following claims. As will be understood by those skilled in the art.

10; 유입관로
20; 제1컨트롤밸브
30; 히팅관로
40; 제1펌프
50; 히팅장치
60; 제2컨트롤밸브
70; 멀티관로
80; 제2펌프
90; 쿨링관로
100; 열교환기
110; 배출관로
120; 분기관로
130; 밀폐형 팽창탱크
140; 벤트 탱크
150; 체크밸브
160; 제어부
10; Inlet channel
20; The first control valve
30; Heating pipe
40; The first pump
50; Heating device
60; The second control valve
70; Multi-channel
80; The second pump
90; Cooling pipe
100; heat transmitter
110; As discharge pipe
120; By branch
130; Sealed expansion tank
140; Vent tank
150; Check valve
160; The control unit

Claims (4)

임의설비로부터 열매체유가 유입되는 유입관로의 출구측에 개폐가능하게 설치되는 제1컨트롤밸브;
상기 제1컨트롤밸브에 입구측이 연통되는 히팅관로 중간측에 설치되는 히팅장치;
상기 히팅장치 상류측으로 상기 히팅관로에 설치되는 제1펌프;
상기 히팅장치의 하류측으로 상기 히팅관로에 개폐가능하게 설치되는 제2컨트롤밸브;
상기 제1컨트롤밸브에 입구측이 연통되고, 히팅 또는 쿨링되는 열매체유가 통과되는 멀티관로에 출구측이 연통되는 쿨링관로에 설치되는 열교환기;
상기 멀티관로의 출구에 설치되고, 상기 히팅장치에 의해 임의온도로 가열되거나 상기 열교환기에 의해 임의온도로 쿨링되어 상기 멀티관로에 이동되는 열매체유를 상기 임의설비로 공급하기 위한 제2펌프;를 구비하는 밀폐형 히팅 및 쿨링 장치를 이용한 열매체유 온도 제어시스템에 있어서:
상기 제2컨트롤밸브에 입구측이 연통되고 상기 히팅장치의 상류측 히팅관로 임의위치에 출구측이 연통되며, 상기 열교환기에 의해 쿨링되어 상기 제2펌프측으로 이동되는 쿨링된 열매체유와, 상기 히팅장치에 의해 가열되어 상기 제2펌프측으로 이동되는 히팅된 열매체유가 서로 충돌되는 것을 방지하기 위한 분기관로;를 더 구비하는 것을 특징으로 하는 밀폐형 히팅 및 쿨링 장치를 이용한 열매체유 온도 제어시스템.
A first control valve that is openably and closably provided on an outlet side of an inflow conduit through which heat medium oil flows from an arbitrary facility;
A heating device installed at an intermediate side of a heating pipe through which the inlet side communicates with the first control valve;
A first pump installed on the heating pipe toward the upstream side of the heating device;
A second control valve that is openably and closably provided in the heating pipe to the downstream side of the heating device;
A heat exchanger connected to the first control valve at an inlet side thereof and installed at a cooling line where the outlet side communicates with a multi-channel line through which heating medium oil to be heated or cooled passes;
And a second pump installed at an outlet of the multi-channel pipe and heated to an arbitrary temperature by the heating device or cooled to a predetermined temperature by the heat exchanger to supply the heating oil to the multi- A heat medium oil temperature control system using a hermetically sealed heating and cooling device, comprising:
A cooling fluid which is communicated at the inlet side to the second control valve and communicated at an optional position with respect to the heating pipe at the upstream side of the heating device and cooled by the heat exchanger to be moved to the second pump side, Further comprising: a branch pipe for preventing the heated heat medium oil, which is heated by the first pump and is moved to the second pump side, from colliding with each other.
제1항에 있어서,
상기 제1컨트롤밸브 및 제2컨트롤밸브는
인가되는 전기적신호에 비례하여 액츄에이터가 구동할 경우 연동되어 에어 유입량에 대응되게 개구량이 조절되는 삼방밸브가 사용되는 것을 특징으로 하는 밀폐형 히팅 및 쿨링 장치를 이용한 열매체유 온도 제어시스템.
The method according to claim 1,
The first control valve and the second control valve
Wherein the three-way valve is interlocked when the actuator is driven in proportion to the applied electric signal and the opening amount is adjusted to correspond to the air inflow amount.
삭제delete 제1항에 있어서,
상기 열교환기에 연통되는 밀폐형 팽창탱크;
상기 유입관로에 입구측이 연통되거나, 상기 히팅장치와 제2컨트롤밸브사이의 히팅관로에 입구측이 연통되거나, 또는 상기 히팅장치에 입구측이 연통되는 벤트 탱크;를 더 구비하는 것을 특징으로 하는 밀폐형 히팅 및 쿨링 장치를 이용한 열매체유 온도 제어시스템.
The method according to claim 1,
An enclosed expansion tank communicating with the heat exchanger;
And a vent tank in which the inlet side communicates with the inflow conduit or the inlet side communicates with the heating channel between the heating device and the second control valve or the inlet side communicates with the heating device Thermal oil temperature control system using closed type heating and cooling device.
KR1020170175962A 2017-12-20 2017-12-20 temperature control system for heating medium oil using heating and cooling device of pressure seal type KR101861820B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111459209A (en) * 2020-04-28 2020-07-28 广东一钛科技有限公司 TCU temperature control system and TCU temperature control method
CN115339030A (en) * 2022-09-02 2022-11-15 中隆能源科技(东莞)有限公司 Temperature control system for rapid temperature rise and temperature reduction of gas heat-conducting oil mold temperature controller

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200256615Y1 (en) * 2001-09-04 2001-12-24 김영재 Device for temperature control of press using thermal oil boiler

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200256615Y1 (en) * 2001-09-04 2001-12-24 김영재 Device for temperature control of press using thermal oil boiler

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111459209A (en) * 2020-04-28 2020-07-28 广东一钛科技有限公司 TCU temperature control system and TCU temperature control method
CN115339030A (en) * 2022-09-02 2022-11-15 中隆能源科技(东莞)有限公司 Temperature control system for rapid temperature rise and temperature reduction of gas heat-conducting oil mold temperature controller
CN115339030B (en) * 2022-09-02 2023-06-09 中隆能源科技(东莞)有限公司 Temperature control system for quickly heating and cooling gas heat conduction oil mold temperature machine

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