KR101854770B1 - Optical member and display device having the same - Google Patents

Abstract

An optical member and a display device including the same are disclosed. The optical member comprises a host; A plurality of light conversion particles disposed in the host; And a bonding strength reinforcing material disposed in the host.

Description

TECHNICAL FIELD [0001] The present invention relates to an optical member and a display device including the optical member.

An embodiment relates to an optical member and a display device including the optical member.

Recently, flat panel display devices such as a liquid crystal display (LCD), a plasma display panel (PDP), and an organic light emitting diode (OLED) have been developed in place of the conventional CRT.

The liquid crystal display device includes a thin film transistor substrate, a color filter substrate, and a liquid crystal display panel in which liquid crystal is injected between both substrates. Since the liquid crystal display panel is a non-light emitting device, a backlight unit for supplying light to the bottom surface of the thin film transistor substrate is positioned. The amount of light irradiated from the backlight unit is adjusted according to the alignment state of the liquid crystal.

The backlight unit is divided into edge type and direct type according to the position of the light source. The edge type is a structure in which a light source is provided on a side surface of the light guide plate.

The direct type is a structure that is mainly developed with the size of a liquid crystal display device being enlarged. One or more light sources are arranged on the lower surface of the liquid crystal display panel to supply light to the liquid crystal display panel.

The direct-type backlight unit has advantages in that it can utilize a larger number of light sources than the edge-type backlight unit and can secure a high luminance, but has a disadvantage that the thickness becomes thicker than the edge type in order to ensure uniformity of brightness have.

In order to overcome this problem, a quantum dot bar in which a plurality of quantum dots dispersed in a red wavelength or a green wavelength is dispersed is provided in front of a blue LED emitting blue light constituting a backlight unit, Thus, light mixed with blue light, red light and green light by a plurality of quantum dots dispersed in the quantum dot bar is incident on the light guide plate to provide white light.

At this time, when white light is provided to the light guide plate using the quantum dot bar, high color reproduction can be realized.

The backlight unit may include an FPCB (Flexible Printed Circuits Board) for transmitting and supplying LEDs and signals to one side of a blue LED emitting blue light, and an adhesive member may be further provided on the lower surface of the FPCB.

As such, when a light emitted from a blue LED is leaked, a display device for displaying an image in various forms using white light provided to the light guide plate through the quantum dot bar is widely used.

A display device to which such a quantum dot is applied is disclosed in Korean Patent Laid-Open Publication No. 10-2011-0068110.

Embodiments provide an optical member having improved reliability and durability and a display device including the optical member.

An optical member according to an embodiment includes a host; A plurality of light conversion particles disposed in the host; And a bonding strength reinforcing material disposed within the host and represented by the following formula (1) or (2).

Formula 1

Here, Si is silicon, and R1, R2, R3, and R4 are each selected from a vinyl group, an amino group, a chloro group, an epoxy group, or a mercapto group.

(2)

Wherein Si is silicon and at least one of R5, R6, R7 and R8 is selected from a vinyl group, an amino group, a chloro group, an epoxy group or a mercapto group, and the remaining of R5, R6, R7 and R8 is an alkoxy group.

A display device according to an embodiment includes a light source; A light conversion member on which light from the light source is incident; And a display panel on which light from the light conversion member is incident, the light conversion member comprising: a host; A plurality of light conversion particles disposed in the host; And a bonding strength reinforcing material disposed within the host and represented by the above formula (1) or (2).

The optical member and the display device according to the embodiment include a bonding force strengthening material. Accordingly, the bonding force reinforcing material improves the bonding force in the host. That is, the binding force enhancing material improves the binding force of the material constituting the host.

Further, the bonding force reinforcing material may improve the bonding force between the host and the protective member in direct contact with the host. Accordingly, the bonding force reinforcing material can prevent peeling between the host and the protection member.

Therefore, the optical member and the display device according to the embodiment can have improved reliability and durability.

1 is an exploded perspective view showing a liquid crystal display device according to a first embodiment.
2 is a perspective view showing the light conversion sheet.
FIG. 3 is a cross-sectional view showing a section cut along AA 'in FIG. 2. FIG.
4 is an exploded perspective view showing a liquid crystal display device according to a second embodiment.
5 is a perspective view showing the light converting member.
FIG. 6 is a cross-sectional view showing a section cut along BB 'in FIG. 5; FIG.
7 is a cross-sectional view showing one end surface of the light guide plate, the light emitting diode, and the light conversion member.
FIG. 8 is a perspective view showing a photo-conversion member according to the third embodiment. FIG.
FIG. 9 is a cross-sectional view showing a section taken along CC 'in FIG.
10 is an exploded perspective view showing a liquid crystal display device according to a fourth embodiment.
11 is a perspective view showing the photo-conversion member according to the fourth embodiment.
12 is a cross-sectional view showing a section cut along DD 'in FIG.
13 is a cross-sectional view showing one end surface of the light guide plate, the light emitting diode, and the light conversion member.

In the description of the embodiments, it is described that each substrate, frame, sheet, layer or pattern is formed "on" or "under" each substrate, frame, sheet, In this case, "on" and "under " all include being formed either directly or indirectly through another element. In addition, the upper or lower reference of each component is described with reference to the drawings. The size of each component in the drawings may be exaggerated for the sake of explanation and does not mean the size actually applied.

1 is an exploded perspective view showing a liquid crystal display device according to a first embodiment. 2 is a perspective view showing the light conversion sheet. 3 is a cross-sectional view showing a section taken along line A-A in Fig.

1 to 3, a liquid crystal display device according to an embodiment includes a backlight unit 10 and a liquid crystal panel 20.

The backlight unit 10 emits light to the liquid crystal panel 20. The backlight unit 10 is a surface light source and can uniformly irradiate the bottom surface of the liquid crystal panel 20 with light.

The backlight unit 10 is disposed under the liquid crystal panel 20. The backlight unit 10 includes a bottom cover 100, a light guide plate 200, a reflective sheet 300, a plurality of light emitting diodes 400, a printed circuit board 401 and a plurality of optical sheets 500 do.

The bottom cover 100 has a top opened shape. The bottom cover 100 accommodates the light guide plate 200, the light emitting diodes 400, the printed circuit board 401, the reflection sheet 300, and the optical sheets 500.

The light guide plate 200 is disposed in the bottom cover 100. The light guide plate 200 is disposed on the reflective sheet 300. The light guide plate 200 emits light upward from the light emitting diodes 400 through total reflection, refraction and scattering.

The reflective sheet 300 is disposed under the light guide plate 200. More specifically, the reflective sheet 300 is disposed between the light guide plate 200 and the bottom surface of the bottom cover 100. The reflective sheet 300 reflects light emitted from the lower surface of the light guide plate 200 upward.

The light emitting diodes 400 are light sources for generating light. The light emitting diodes 400 are disposed on one side of the light guide plate 200. The light emitting diodes 400 generate light and enter the light guide plate 200 through a side surface of the light guide plate 200.

The light emitting diodes 400 may be a blue light emitting diode for generating blue light or a UV light emitting diode for generating ultraviolet light. That is, the light emitting diodes 400 may emit blue light having a wavelength range of about 430 nm to about 470 nm or ultraviolet light having a wavelength band of about 300 nm to about 400 nm.

The light emitting diodes 400 are mounted on the printed circuit board 401. The light emitting diodes 400 are disposed under the printed circuit board 401. The light emitting diodes 400 are driven by receiving a drive signal through the printed circuit board 401.

The printed circuit board 401 is electrically connected to the light emitting diodes 400. The printed circuit board 401 may mount the light emitting diodes 400. The printed circuit board (401) is disposed inside the bottom cover (100).

The optical sheets 500 are disposed on the light guide plate 200. The optical sheets 500 change or enhance the characteristics of light emitted from the upper surface of the light guide plate 200 and supply the light to the liquid crystal panel 20. [

The optical sheets 500 may be a light conversion sheet 501, a diffusion sheet 502, a first prism sheet 503, and a second prism sheet 504.

The light conversion sheet 501 is disposed on the light guide plate 200. More specifically, the light conversion sheet 501 may be interposed between the light guide plate 200 and the diffusion sheet 502. The light conversion sheet 501 can convert the wavelength of incident light and emit the light upward.

For example, when the light emitting diodes 400 are a blue light emitting diode, the light converting sheet 501 may convert blue light emitted upward from the light guide plate 200 into green light and red light. That is, the light conversion sheet 501 converts a part of the blue light into green light having a wavelength band of about 520 nm to about 560 nm, and converts the other part of the blue light to a light having a wavelength band of about 630 nm to about 660 nm It can be converted into red light.

When the light emitting diodes 400 are UV light emitting diodes, the light conversion sheet 501 may convert ultraviolet light emitted from the upper surface of the light guide plate 200 into blue light, green light, and red light. That is, the light conversion sheet 501 converts part of the ultraviolet ray into blue light having a wavelength range of about 430 nm to about 470 nm, and converts the other part of the ultraviolet light to a light having a wavelength range of about 520 nm to about 560 nm Green light, and another part of the ultraviolet light into red light having a wavelength band between about 630 nm and about 660 nm.

Accordingly, light passing through the light conversion sheet 501 without being converted and light converted by the light conversion sheet 501 can form white light. That is, the blue light, the green light, and the red light may be combined, and the white light may be incident on the liquid crystal panel 20.

The light conversion sheet 501 corresponds to a light conversion member for converting the wavelength of the incident light. That is, the light conversion sheet 501 is an optical member that changes the characteristics of incident light.

As shown in FIGS. 2 and 3, the light conversion sheet 501 includes a lower substrate 510, an upper substrate 520, and a light conversion layer 530.

The lower substrate 510 is disposed under the light conversion layer 530. The lower substrate 510 is transparent and flexible. The lower substrate 510 may be in close contact with the lower surface of the light conversion layer 530.

The lower substrate 510 may include an organic material. More specifically, examples of the material used for the lower substrate 510 include transparent polymers such as polyethylene terephthalate (PET) and the like.

Alternatively, the lower substrate 510 may include an inorganic material. Examples of materials used for the lower substrate 510 include glass and the like.

The upper substrate 520 is disposed on the light conversion layer 530. The upper substrate 520 is transparent and flexible. The upper substrate 520 may be in close contact with the upper surface of the light conversion layer 530.

The upper substrate 520 may include an organic material. More specifically, examples of materials used for the upper substrate 520 include transparent polymers such as polyethylene terephthalate and the like.

Alternatively, the upper substrate 520 may comprise an inorganic material. Examples of materials used for the upper substrate 520 include glass and the like.

The lower substrate 510 and the upper substrate 520 sandwich the light conversion layer 530. The lower substrate 510 and the upper substrate 520 support the light conversion layer 530. The lower substrate 510 and the upper substrate 520 protect the light conversion layer 530 from external physical impacts. That is, the lower substrate 510 and the upper substrate 520 are protective substrates for protecting the light conversion layer 530. More specifically, the lower substrate 510 and the upper substrate 520 are protective members that are in direct contact with the light conversion layer 530.

In addition, the lower substrate 510 and the upper substrate 520 have low oxygen permeability and moisture permeability. Accordingly, the lower substrate 510 and the upper substrate 520 can protect the light conversion layer 530 from external chemical impacts such as moisture and / or oxygen.

The light conversion layer 530 is interposed between the lower substrate 510 and the upper substrate 520. The light conversion layer 530 may be in close contact with the upper surface of the lower substrate 510 and may be in close contact with the lower surface of the upper substrate 520.

The light conversion layer 530 includes a plurality of photo-conversion particles 531, a host 532, and a bonding strength reinforcing material.

The photo-conversion particles 531 are disposed between the lower substrate 510 and the upper substrate 520. More specifically, the photo-conversion particles 531 are uniformly dispersed in the host 532, and the host 532 is disposed between the lower substrate 510 and the upper substrate 520.

The photoconversion particles 531 convert the wavelength of the light emitted from the light emitting diodes 400. The light conversion particles 531 receive the light emitted from the light emitting diodes 400 and convert the wavelength. For example, the light conversion particles 531 may convert blue light emitted from the light emitting diodes 400 into green light and red light. That is, some of the light conversion particles 531 convert the blue light into green light having a wavelength range of about 520 nm to about 560 nm, and another part of the light conversion particles 531 converts the blue light to about 630 And can be converted into red light having a wavelength band of from about nm to about 660 nm.

Alternatively, the light conversion particles 531 may convert ultraviolet light emitted from the light emitting diodes 400 into blue light, green light, and red light. That is, some of the light conversion particles 531 convert the ultraviolet light into blue light having a wavelength range of about 430 nm to about 470 nm, and another part of the light conversion particles 531 converts the ultraviolet light to about 520 Can be converted into green light having a wavelength band between nm and 560 nm. Further, another part of the photo-converted particles 531 may convert the ultraviolet ray into red light having a wavelength band of about 630 nm to about 660 nm.

That is, when the light emitting diodes 400 are blue light emitting diodes that generate blue light, the light conversion particles 531 that convert blue light into green light and red light, respectively, may be used. Alternatively, when the light emitting diodes 400 are UV light emitting diodes that generate ultraviolet rays, the light conversion particles 531 that convert ultraviolet light into blue light, green light, and red light, respectively, may be used.

The photoconversion particles 531 may be a plurality of quantum dots (QDs). The quantum dot may include core nanocrystals and shell nanocrystals surrounding the core nanocrystals. In addition, the quantum dot may include an organic ligand bound to the shell nanocrystal. In addition, the quantum dot may include an organic coating layer surrounding the shell nanocrystals.

The shell nanocrystals may be formed of two or more layers. The shell nanocrystals are formed on the surface of the core nanocrystals. The quantum dot may convert the wavelength of the light incident on the core core crystal into a long wavelength through the shell nanocrystals forming the shell layer and increase the light efficiency.

The quantum dot may include at least one of a group II compound semiconductor, a group III compound semiconductor, a group V compound semiconductor, and a group VI compound semiconductor. More specifically, the core nanocrystals may include Cdse, InGaP, CdTe, CdS, ZnSe, ZnTe, ZnS, HgTe or HgS. The shell nanocrystals may include CuZnS, CdSe, CdTe, CdS, ZnSe, ZnTe, ZnS, HgTe or HgS. The diameter of the quantum dot may be 1 nm to 10 nm.

The wavelength of light emitted from the quantum dots can be controlled by the size of the quantum dots or the molar ratio of the molecular cluster compound and the nanoparticle precursor in the synthesis process. The organic ligand may include pyridine, mercapto alcohol, thiol, phosphine, phosphine oxide, and the like. The organic ligands serve to stabilize unstable quantum dots after synthesis. After synthesis, a dangling bond is formed on the outer periphery, and the quantum dots may become unstable due to the dangling bonds. However, one end of the organic ligand is in an unbonded state, and one end of the unbound organic ligand bonds with the dangling bond, thereby stabilizing the quantum dot.

Particularly, when the quantum dot has a size smaller than the Bohr radius of an exciton formed by electrons and holes excited by light, electricity or the like, a quantum confinement effect is generated to have a staggering energy level and an energy gap The size of the image is changed. Further, the charge is confined within the quantum dots, so that it has a high luminous efficiency.

Unlike general fluorescent dyes, the quantum dots vary in fluorescence wavelength depending on the particle size. That is, as the size of the particle becomes smaller, it emits light having a shorter wavelength, and the particle size can be adjusted to produce fluorescence in a visible light region of a desired wavelength. In addition, since the extinction coefficient is 100 to 1000 times higher than that of a general dye, and the quantum yield is also high, it produces very high fluorescence.

The quantum dot can be synthesized by a chemical wet process. Here, the chemical wet method is a method of growing particles by adding a precursor material to an organic solvent, and the quantum dots can be synthesized by a chemical wet method.

The host 532 surrounds the photo-conversion particles 531. That is, the host 532 uniformly disperses the light-converted particles 531 therein. The host 532 may be comprised of a polymer. The host 532 is transparent. That is, the host 532 may be formed of a transparent polymer.

Examples of the polymer used as the host 532 include a silicone resin, an epoxy resin, and an acrylic resin.

The host 532 is disposed between the lower substrate 510 and the upper substrate 520. The host 532 may be in close contact with the upper surface of the lower substrate 510 and the lower surface of the upper substrate 520.

The bonding force reinforcing material is disposed in the host 532. More specifically, the bonding force reinforcing material is uniformly dispersed in the host 532. The bonding force reinforcing material may be combined with the polymer included in the host 532. That is, the bonding force reinforcing material may combine with the material forming the host 532 to improve the bonding force of the host 532 itself.

The bonding force reinforcing material may be a silane-based material. The bonding force reinforcing material may be represented by the following chemical formula (1).

Formula 1

Wherein Si is silicon and R1, R2, R3 and R4 are independently selected from the group consisting of a vinyl group, an amino group, a chloro group, an epoxy group or a mercapto group Is selected.

When a functional group such as R 1, R 2, R 3 and R 4 is selected from a vinyl group, an amino group, a chloro group, an epoxy group or a mercapto group, the functional group may have a high binding force with an organic material.

Accordingly, when the organic material is used for the host 532, the binding force reinforcing material can strengthen the binding force between the materials constituting the host 532. [ When the lower substrate 510 and the upper substrate 520 include an organic material such as a polymer or the like, the bonding force reinforcing material may be a bonding force between the host 532 and the lower substrate 510, 532 and the upper substrate 520 can be improved.

In particular, when one of R1, R2, R3, and R4 is an amino group, the bonding reinforcing material can easily dissolve water. Accordingly, the residues generated in the process of forming the host 532 can be easily cleaned by water. In addition, the amino group may function as a curing agent or a curing accelerator of an epoxy resin. Accordingly, when an epoxy resin is used to form the host 532, the bonding force reinforcing material can improve the bonding force inside the host 532.

The bonding strength reinforcing material may be represented by the following formula (2).

(2)

Here, some of R5, R6, R7 and R8 may be selected from a vinyl group, an amino group, a chloro group, an epoxy group or a mercapto group, and the remaining of R5, R6, R7 and R8 may be an alkoxy group. For example, R5 is selected from a vinyl group, an amino group, a chloro group, an epoxy group or a mercapto group, and R6, R7 and R8 may be an alkoxy group. Also, R5 and R6 may be selected from a vinyl group, an amino group, a chloro group, an epoxy group or a mercapto group, and R7 and R8 may be an alkoxy group. R5, R6 and R7 may be selected from a vinyl group, an amino group, a chloro group, an epoxy group or a mercapto group, and R8 may be an alkoxy group. At this time, the alkoxy group may be a methoxy group or an ethoxy group.

In the formulas (1) and (2), the amino group may be represented by the following formula (3).

(3)

Here, R9 and R10 may be selected from hydrogen, an alkyl group having 1 to 30 carbons, an aryl group, a heteroaryl group, a halogen atom or an epoxy group.

In the above formulas (1) and (2), the alkoxy group may be represented by the following formulas (4) to (6).

Formula 4

Formula 5

6

In formulas (4) to (6), R9 and R10 may be selected from hydrogen, an alkyl group having 1 to 30 carbon atoms, an aryl group, a heteroaryl group, a halogen atom or an epoxy group.

The alkoxy group may have a high binding force with an inorganic substance. Accordingly, some of R5, R6, R7, and R8 have a high binding force with an organic material, and some of R5, R6, R7, and R8 have a high binding force with an inorganic material.

Accordingly, the bonding force reinforcing material can improve the bonding force between the organic material layer and the inorganic material layer. In particular, when the lower substrate 510 and the upper substrate 520 include an inorganic material, the bonding force reinforcing material may increase the bonding force between the host 532 and the lower substrate 510, The bonding force between the upper substrates 520 can be improved.

More specifically, the bonding strength reinforcing material may include 3-glycidoxy propyl trimethoxy silane, 3-glycidoxy propyl methyl dimethoxy silane, 3-glycidoxy propyl trimethoxy silane, 3-amino propyl triethoxy silane, or 3-aminopropyl methyl diethoxy silane.

The bonding force reinforcing material may be added to the host 532 at a ratio of about 1 wt% to about 3 wt%.

Referring again to FIG. 1, the diffusion sheet 502 is disposed on the light conversion sheet 501. The diffusion sheet 502 improves the uniformity of light passing therethrough. The diffusion sheet 502 may include a plurality of beads.

The first prism sheet 503 is disposed on the diffusion sheet 502. The second prism sheet 504 is disposed on the first prism sheet 503. The first prism sheet 503 and the second prism sheet 504 increase the straightness of light passing therethrough.

The liquid crystal panel 20 is disposed on the optical sheets 500. Further, the liquid crystal panel 20 is disposed on the panel guide 23. The liquid crystal panel 20 may be guided by the panel guide 23.

The liquid crystal panel 20 displays an image by adjusting the intensity of light passing through the liquid crystal panel 20. That is, the liquid crystal panel 20 is a display panel for displaying an image using light emitted from the backlight unit 10. [ The liquid crystal panel 20 includes a TFT substrate 21, a color filter substrate 22, and a liquid crystal layer interposed between the two substrates. In addition, the liquid crystal panel 20 includes polarizing filters.

Although not shown in detail in the drawings, the TFT substrate 21 and the color filter substrate 22 will be described in detail. The TFT substrate 21 defines pixels by intersecting a plurality of gate lines and data lines, A thin film transistor (TFT) is provided for each region and is connected in a one-to-one correspondence with the pixel electrodes mounted on the respective pixels. The color filter substrate 22 includes color filters of R, G and B colors corresponding to the respective pixels, a black matrix for covering the gate lines, the data lines, the thin film transistors, etc., .

And a driving PCB 25 for supplying a driving signal to the gate line and the data line is provided at an edge of the liquid crystal display panel 210.

The drive PCB 25 is electrically connected to the liquid crystal panel 20 by a chip on film (COF) 24. Here, the COF 24 may be changed to a TCP (Tape Carrier Package).

As described above, the host 532 includes a bonding force strengthening material. Accordingly, the bonding force reinforcing material improves the bonding force in the host 532. That is, the bonding force reinforcing material improves the bonding force of the material constituting the host 532.

Further, the bonding force reinforcing material may improve the bonding force between the host 532 and the protective member such as the lower substrate 510 and the upper substrate 520. [ Accordingly, the bonding force reinforcing material can prevent peeling between the host 532 and the protective member 510, 520.

Therefore, the liquid crystal display according to the embodiment can have improved reliability and durability.

4 is an exploded perspective view showing a liquid crystal display device according to a second embodiment. 5 is a perspective view showing the light converting member. 6 is a cross-sectional view showing a section taken along line B-B 'in FIG. 7 is a cross-sectional view showing one end surface of the light guide plate, the light emitting diode, and the light conversion member. FIG. 8 is a perspective view showing a photo-conversion member according to the third embodiment. FIG. Fig. 9 is a cross-sectional view showing a section cut along the line C-C 'in Fig. 8; In the description of the embodiments, reference is made to the description of the preceding embodiments. That is, the description of the above-described liquid crystal display device can be essentially combined with the description of the present liquid crystal display device except for the changed portions.

4 to 9, the liquid crystal display according to the present exemplary embodiment includes a light conversion member 600 instead of the light conversion sheet 501. The light conversion member 600 is interposed between the light emitting diodes 400 and the light guide plate 200.

The light-converting member 600 may have a shape elongated in one direction. More specifically, the light conversion member 600 may have a shape extending along one side of the light guide plate 200. More specifically, the light conversion member 600 may have a shape extending along the incident surface of the light guide plate 200.

The light conversion member 600 receives the light emitted from the light emitting diodes 400 and converts the wavelength. For example, the light conversion member 600 may convert blue light emitted from the light emitting diodes 400 into green light and red light. That is, the light conversion member 600 converts a part of the blue light into green light having a wavelength band of about 520 nm to about 560 nm, and converts the other part of the blue light to a light having a wavelength range of about 630 nm to about 660 nm It can be converted into red light.

The light conversion member 600 may convert ultraviolet rays emitted from the light emitting diodes 400 into blue light, green light, and red light. That is, the light conversion member 600 converts a part of the ultraviolet ray into blue light having a wavelength band of about 430 nm to about 470 nm, and converts the other part of the ultraviolet light to a light having a wavelength range of about 520 nm to about 560 nm Green light, and another part of the ultraviolet light into red light having a wavelength band between about 630 nm and about 660 nm.

Accordingly, the light passing through the light conversion member 600 and the light converted by the light conversion member 600 can form white light. That is, the blue light, the green light, and the red light may be combined, and the white light may be incident on the light guide plate 200.

5 to 7, the light conversion member 600 includes a lower substrate 610, an upper substrate 620, and a light conversion layer 630.

As shown in FIG. 6, the lower substrate 610 is disposed under the light conversion layer 630. The lower substrate 610 is transparent and flexible. The lower substrate 610 may be in close contact with the lower surface of the light conversion layer 630.

Also, as shown in FIG. 7, the lower substrate 610 faces the light emitting diodes 400. That is, the lower substrate 610 is disposed between the light emitting diodes 400 and the light conversion layer 630.

As shown in FIG. 6, the upper substrate 620 is disposed on the light conversion layer 630. The upper substrate 620 is transparent and flexible. The upper substrate 620 may be in close contact with the upper surface of the light conversion layer 630.

7, the upper substrate 620 is opposed to the light guide plate 200. As shown in FIG. That is, the upper substrate 620 is disposed between the light guide plate 200 and the light conversion layer 630.

The light conversion layer 630 is interposed between the lower substrate 610 and the upper substrate 620. The light conversion layer 630 is sandwiched by the lower substrate 610 and the upper substrate 620. The light conversion layer 630 may have substantially the same characteristics as the light conversion layer 630 in the previous embodiment.

The light-converting layer 630 may include a bonding strength reinforcing material. At this time, the coupling force between the light conversion layer 630 and the lower substrate 610 and the coupling force between the light conversion layer 630 and the upper substrate 620 can be improved by the bonding force reinforcing material.

Accordingly, the light conversion member 600 according to the present embodiment can have improved mechanical characteristics and chemical resistance.

8 and 9, the light conversion member according to the third embodiment includes a tube 640, a host 632, a plurality of light conversion particles 631, and a bonding strength reinforcing material.

The tube 640 receives the encapsulant 650, the photo-conversion particles 631, and the host 632. That is, the tube 640 is a receiving portion for receiving the sealing portion 650, the light converting particles 631, and the host 632. In addition, the tube 640 has a shape elongated in one direction.

The tube 640 may have a square pipe shape. That is, the cross section perpendicular to the longitudinal direction of the tube 640 may have a rectangular shape. Further, the width of the tube 640 may be about 0.6 mm, and the height of the tube 640 may be about 0.2 mm. That is, the tube 640 may be a capillary tube.

The tube 640 is transparent. The tube 640 may comprise an inorganic material such as glass or an organic material such as a polymer.

The sealing portion 650 is disposed inside the tube 640. The sealing portion 650 is disposed at the end of the tube 640. The sealing part (650) seals the inside of the tube (640). The sealing portion 650 may include an epoxy resin.

The tube 640 and the sealing portion 650 isolate the photoconversion particles 631 and the host 632 from the outside. That is, the tube 640 and the sealing portion 650 are sealing members that receive the light conversion particles 631 and seal the sealing member from the outside.

The photo-conversion particles 631 are disposed inside the tube 640. More specifically, the light conversion particles 631 are uniformly dispersed in the host 632, and the host 632 is disposed inside the tube 640.

The light conversion particles 631 convert the wavelength of the light emitted from the light emitting diode 300. The light conversion particles 631 receive the light emitted from the light emitting diode 300 and convert the wavelength.

The host 632 surrounds the photo-conversion particles 631. That is, the host 632 uniformly disperses the light conversion particles 631 therein. The host 632 may be comprised of a polymer. The host 632 is transparent. That is, the host 632 may be formed of a transparent polymer.

The host 632 is disposed within the tube 640. That is, the host 632 is entirely filled in the tube 640. The host 632 may be in close contact with the inner surface of the tube 640.

The bonding force reinforcing material is disposed in the host 632. The bonding force reinforcing material may be uniformly dispersed in the host 632. The binding force of the substance itself used as the host 632 and the binding force between the host 632 and the tube 640 can be improved by the binding force reinforcing material.

An air layer is formed between the sealing portion 650 and the host 632. The air layer 450 is filled with nitrogen. The air layer functions as a buffer between the sealing portion 650 and the host 632.

In the liquid crystal display device according to this embodiment, the light conversion layer 630 has a relatively small size as compared with the sheet-shaped light conversion member. Therefore, in manufacturing the liquid crystal display device according to the present embodiment, a small amount of the light conversion particles 631 can be used.

Accordingly, the liquid crystal display device according to the present embodiment can be easily manufactured at a low cost, by reducing the use of the light conversion particles 631. [

10 is an exploded perspective view showing a liquid crystal display device according to a fourth embodiment. 11 is a perspective view showing the photo-conversion member according to the fourth embodiment. 12 is a cross-sectional view showing a section taken along the line D-D 'in FIG. 13 is a cross-sectional view showing one end surface of the light guide plate, the light emitting diode, and the light conversion member. In the description of the present embodiment, the description of the preceding embodiments will be made. That is, the description of the preceding liquid crystal display devices can be essentially combined with the description of the present liquid crystal display device except for the changed portions.

Referring to FIGS. 10 to 13, the liquid crystal display according to the present embodiment includes a plurality of light converting members 700. The light conversion members 700 correspond to the light emitting diodes 400, respectively.

In addition, the light conversion members 700 are disposed between the light emitting diodes 400 and the light guide plate 200. That is, each light conversion member 600 is disposed between the corresponding light emitting diode and the light guide plate 200.

Further, the light conversion members 700 convert the wavelength of the light emitted from the corresponding light emitting diode. Here, the light converting members 700 may include first light converting members for converting light emitted from the light emitting diode into light having a first wavelength such as green light, and second light converting members for converting light emitted from the light emitting diode into light having a second wavelength, And can be divided into light conversion members.

The light conversion members 700 may have a wider planar area than the light emitting diodes 400. Accordingly, most of the light emitted from each light emitting diode can be incident on the corresponding photo-conversion member 600.

11-13, the photo-conversion members 700 include a lower substrate 710, an upper substrate 720, and a photo-conversion layer 730. The photo-

The characteristics of the lower substrate 710, the upper substrate 720, and the light conversion layer 730 may be substantially the same as those described in the embodiments described above.

In addition, the light conversion layer 730 includes a bonding strength reinforcing material. The coupling force between the light conversion layer 730 and the lower substrate 710 and the coupling force between the light conversion layer 730 and the upper substrate 720 are different from each other Can be strengthened.

In the liquid crystal display device according to the present embodiment, the light conversion layer 730 has a relatively small size. Therefore, in manufacturing the liquid crystal display device according to the present embodiment, a small amount of the light conversion particles 731 can be used.

Therefore, the liquid crystal display device according to the present embodiment can be easily manufactured at a low cost by reducing the use of the light conversion particles 731.

Further, the characteristics of the respective photo-conversion members 700 can be modified to match the corresponding light-emitting diodes. Accordingly, the liquid crystal display device according to the embodiment can have improved brightness and uniform color reproducibility.

In addition, the features, structures, effects and the like described in the embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects and the like illustrated in the embodiments can be combined and modified by other persons skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Experimental Example # 1

A silicon-based resin composition containing 1.5 wt% of quantum dots was injected into a square cap-shaped glass capillary having an inner surface width of about 200 mu m and a height of about 600 mu m. The resin composition contained a crosslinking agent at about 2 wt%, and contained about 2.7 wt% 3-aminopropyltriethoxysilane as a bonding strength reinforcing material. Thereafter, the resin composition was cured, epoxy resin was injected into the capillary, and cured to seal the inside of the capillary. Thus, the photo-conversion member # 1 was formed.

Experimental Example # 2

Approximately 2.7 wt% of 3-aminopropylmethyldiethoxysilane was used as the bonding strength reinforcing material, and the rest was the same as Experimental Example # 1.

Comparative Example

The bonding strength reinforcing material was not used, and the rest was the same as Experimental Example # 1.

result

The photo-conversion members of Experimental Example # 1, Experimental Example # 2 and Comparative Example were exposed for about 500 hours under a severe condition of about 80 캜, and the efficiency deterioration was measured. In the photo-conversion member of the comparative example, the photo-conversion efficiency was lowered by about 46% and the photo-conversion efficiency of the photo-conversion member of Experimental Example # 1 was reduced by about 27% The light conversion efficiency was lowered by about 19%.

Claims (10)

A lower substrate;
An upper substrate on the lower substrate; And
And a light conversion layer disposed between the lower substrate and the upper substrate,
Wherein the light conversion layer comprises:
Host;
A plurality of light conversion particles disposed in the host; And
And a bonding strength reinforcing material disposed within the host and represented by the following formula (1)
Formula 1

(Wherein Si is silicon and R1, R2, R3 and R4 are amino groups).
Wherein the lower substrate and the upper substrate comprise polyethylene terephthalate,
Wherein the host comprises a polymer comprising an organic material,
Wherein the photo-conversion particles comprise quantum dots. The optical member according to claim 1, wherein the amino group is represented by the following formula (3).
(3)

Wherein R9 and R10 are selected from hydrogen, an alkyl group having 1 to 30 carbons, an aryl group, a heteroaryl group, a halogen atom or an epoxy group. Light source;
A light conversion member on which light from the light source is incident; And
And a display panel on which light from the photo-conversion member is incident,
Wherein the photo-
A lower substrate;
An upper substrate on the lower substrate; And
And a light conversion layer disposed between the lower substrate and the upper substrate,
Wherein the light conversion layer comprises:
Host;
A plurality of light conversion particles disposed in the host; And
And a bonding strength reinforcing material disposed within the host and represented by the following formula (1)
Formula 1

(Wherein Si is silicon and R1, R2, R3 and R4 are amino groups).
Wherein the lower substrate and the upper substrate comprise polyethylene terephthalate,
Wherein the host comprises a polymer comprising an organic material,
Wherein the photo-conversion particles comprise quantum dots. The method of claim 3,
Further comprising a light guide plate,
Wherein the light source is disposed on a side surface of the light guide plate,
And the light conversion member is disposed on the light guide plate. The method of claim 3,
Further comprising a light guide plate,
Wherein the light source is disposed on a side surface of the light guide plate,
Wherein the light-converting member is disposed between the light source and the light guide plate, 6. The method of claim 5,
Wherein the light source includes a plurality of light sources disposed apart from each other,
Wherein the light conversion member includes a plurality of light conversion members disposed facing each other. delete delete delete delete

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