KR101832894B1 - Method of fabricating lightweight and thin liquid crystal display device - Google Patents

Abstract

The present invention relates to a method of manufacturing a multilayer ceramic capacitor in which diamond-like carbon (DLC) is deposited on one surface or both surfaces of a glass substrate having a first thickness and a glass fiber reinforced material is coated to form a reinforcing layer having a second thickness ; Forming a thin film transistor and a pixel electrode on the first substrate on which the enhancement layer is formed, the gate line and the data line intersecting with each other; Forming a color filter layer on the second substrate on which the reinforcing layer is formed; And forming a seal pattern along the edge of the first and second process panels in a state in which the pixel electrode and the color filter layer are opposed to each other and bonding them together through the liquid crystal layer .

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method of fabricating a lightweight thin liquid crystal display device,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device, and more particularly, to a method of manufacturing a lightweight thin liquid crystal display device using a glass substrate having a thickness of 0.1 t to 0.5 t.

Recently, a display field for processing and displaying a large amount of information has been rapidly developed according to the society's full-fledged information age. Recently, thin-film transistors (TFTs) having excellent performance such as thinning, light- Film Transistor (TFT) type liquid crystal display (TFT-LCD) has been developed and replacing the existing cathode ray tube (CRT).

The image forming principle of a liquid crystal display device utilizes the optical anisotropy and polarization property of a liquid crystal. As is known, a liquid crystal has optical anisotropy having a long and narrow molecular structure and a directional arrangement, Has a changing polarizing property. Accordingly, a liquid crystal display device has a liquid crystal panel formed by laminating an array substrate and a color filter substrate on which a pixel electrode and a common electrode are formed on opposite sides of each other with a liquid crystal layer interposed therebetween as an essential component And is a non-light emitting device that artificially adjusts the arrangement direction of liquid crystal molecules through an electric field change between these electrodes and displays various images by using the transmittance of light which changes at this time.

In recent years, an active matrix type display device, in which pixels, which are basic units of image representation, are arranged in a matrix manner and a switching element is arranged in each pixel to independently control the device, Attention has been paid to the TFT-LCD (Thin Film Transistor Liquid Crystal Display) device in which a thin film transistor (TFT) is used as a switching device.

1, the general liquid crystal display device has a configuration in which the array substrate 10 and the color filter substrate 20 are bonded to each other with the liquid crystal layer 30 interposed therebetween, as shown in FIG. 1, The array substrate 10 of the first embodiment includes a first transparent substrate 12 and a plurality of gate wirings 14 and data wirings 16 which are arranged longitudinally and laterally crosswise on an upper surface of the first transparent substrate 12 to define a plurality of pixel regions P, A thin film transistor T is provided at the intersection of the two wirings 14 and 16 and connected in a one-to-one correspondence with the pixel electrode 18 provided in each pixel region P.

The upper portion of the color filter substrate 20 opposes the second transparent substrate 22 and a non-display region such as the gate wiring 14, the data wiring 16, and the thin film transistor T, (R), G (green), and B (blue), which are sequentially and repeatedly arranged in correspondence to the respective pixel regions P within these lattices, ) Color filter patterns 26a, 26b, and 26c, and a transparent common electrode 28 is provided over the entire surface.

Although not explicitly shown in the figure, these array substrates and color filter substrates 10 and 20 are sealed together with a sealing agent along the edges to prevent leakage of the liquid crystal layer 30 interposed therebetween And an upper and a lower alignment film (not shown) are provided at the boundary between the array and color filter substrates 10 and 20 and the liquid crystal layer 30 to provide reliability in the molecular arrangement direction of the liquid crystal. First and second polarizing plates (not shown) are attached to outer surfaces of the first and second polarizing plates 10 and 20, respectively.

On / off signals of the thin film transistor T are sequentially scanned and applied through the gate wiring 14 to form a pixel region P (P) ) Is selected and an image signal is transmitted to the pixel electrode 18 of the pixel region P through the data line 16, the liquid crystal molecules therebetween are driven by the vertical electric field therebetween, and the light transmittance Various images can be displayed by the change.

On the other hand, in the liquid crystal display device having such a configuration, the first and second transparent substrates 12 and 22, which are the matrix substrate of the array substrate 10 and the color filter substrate 20, A substrate is used.

That is, the array substrate 10 and the color filter substrate 20 are manufactured by carrying out a number of unit processes for forming the array elements and the color filter layer 26 using a glass substrate. The glass substrate is warped and cracked during the movement or the unit process.

Therefore, each of the glass substrates has a thickness of about 0.7t in order to minimize process errors due to cracking and warping.

Therefore, the liquid crystal panel completed using such a glass substrate having a thickness of 0.7t is relatively heavy in weight and thick, making it difficult to realize a lightweight thin display device.

2. Description of the Related Art [0002] Recently, personal portable terminals such as notebook computers and PDAs have become widespread, and liquid crystal display devices mounted on these devices are also required to be lightweight and thin.

Therefore, in order to pursue a lightweight thin liquid crystal display device, the outer surfaces of the array substrate and the color filter substrate are partially etched by exposing the glass to a fluoric acid etching solution in the liquid crystal panel state before the first and second polarizing plates are attached, And the substrate has a thickness of 0.5 t or less.

However, as shown in FIG. 2 (a unit process for etching the surface of the liquid crystal panel for light weight thinning of the conventional liquid crystal display device), before the first and second polarizing plates (not shown) are attached, When the outer surfaces of the array substrate 10 and the color filter substrate 20 are etched by spraying a fluoric acid solution on both outer sides of the liquid crystal panel 50 using the etching liquid injector 90 in the state 50, Since the etching does not proceed at the same speed with respect to all portions of the substrate, fine recesses or irregularities are generated on the outer surface of the array substrate 10 and the color filter substrate 20 to increase the roughness do.

If the first and second polarizing plates (not shown) are attached to both outer sides of the liquid crystal panel 50 in this state, the adhesive force is reduced due to the grooves or unevenness of the surface, and further, Particularly, when the tensile stress acts on the glass substrate having the increased surface roughness, stress concentration occurs at the tip of the groove and cracks occur in the material. As a result, There is a problem that cracks or the like are easily generated by the cracks and the cracks are finally broken.

In addition, the etching of the glass substrate by the hydrofluoric acid solution takes several tens of minutes to several tens of minutes, thereby deteriorating the productivity per unit time.

After a glass substrate having a thickness of 0.7t is manufactured at a cost higher than that of a glass substrate having a thickness of 0.5t for a reason of material cost or the like and a glass substrate having a cost of 0.7t is used, And the color filter substrate to have a thickness of 0.5t is very inefficient in terms of cost and process.

Since the cost due to the progress of the etching process for the lightweight thin type is about 55% of the cost of the glass substrate (0.7t of the cost of the glass substrate + etching process), the glass substrate is etched The etching process of the substrate is one of the great factors that reduce the price competitiveness of the liquid crystal display device.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a liquid crystal display device capable of suppressing breakage and warping by using a glass substrate having a thickness of 0.5 t or less without etching a glass substrate, And it is an object of the present invention to provide a method of manufacturing a liquid crystal display device capable of reducing the manufacturing cost and improving the productivity per unit time of the substrate.

According to another aspect of the present invention, there is provided a method of manufacturing a liquid crystal display (DLC) device, the method comprising the steps of: depositing diamond-like carbon (DLC) on one surface or both surfaces of a glass substrate having a first thickness, ) Or coating a glass fiber reinforced material to form a reinforcing layer of a second thickness; Forming a thin film transistor and a pixel electrode on the first substrate on which the enhancement layer is formed, the gate line and the data line intersecting with each other; Forming a color filter layer on the second substrate on which the reinforcing layer is formed; And forming a seal pattern along the edges of the first and second process panels in a state in which the pixel electrode and the color filter layer are opposed to each other and bonding them together through the liquid crystal layer.

At this time, the first thickness is 0.1 t to 0.5 t, and the second thickness is 0.5 to 5 μm.

The step of forming the reinforcing layer on one side or both sides of each of the first and second substrates may include the steps of: manufacturing a bottom glass substrate that is continuously connected by a roll-to-roll method; Forming the reinforcing layer on one side or both sides of the whole glass substrate; And cutting the whole glass substrate on which the reinforcing layer is formed to separate the first and second substrates. Ha

The step of forming the reinforcing layer on one or both surfaces of each of the first and second substrates may include attaching the first substrate and the second substrate to an auxiliary substrate; Depositing diamond-like carbon (DLC) on the first and second substrates, respectively, with the auxiliary substrate attached thereto, or coating a glass fiber reinforced material to form a reinforcing layer having a second thickness; And separating the auxiliary substrate from the first substrate and the second substrate on which the reinforcing layer is formed.

The deposition of the DLC proceeds in a temperature atmosphere of 300 ° C to 500 ° C, and after the DLC deposition, the first and second substrates are quenched.

The glass fiber reinforced material is polyvinyl butyral.

According to another embodiment of the present invention, there is provided a method of manufacturing a liquid crystal display device, comprising: forming a first type of adhesion pattern on first and second auxiliary substrates each having a first thickness; Forming first and second process panels by positioning first and second glass substrates of a first thickness and a second thickness thinner than the first thickness, respectively, and then joining them; Forming a gate wiring and a data wiring, a thin film transistor and a pixel electrode crossing each other on the first process substrate of the first process panel; Forming a color filter layer on the second process substrate of the second process panel; Forming a seal pattern along an edge of the first and second process panels in a state in which the pixel electrode and the color filter layer face each other, and bonding the seal pattern through the liquid crystal layer; And separating the first and second auxiliary substrates from the substrates for the first and second processes, respectively.

Wherein the adhesive pattern comprises a Phenyl silsesquioxane or PDMS, which is an adhesive material having a property of being cured by a thermal curing property or a laser beam irradiation, and applying the adhesive material onto the substrates for the first and second processes through a syringe Thereby forming an adhesive pattern having the first shape and curing the adhesive pattern by applying heat or irradiating a laser beam.

Wherein the adhesive pattern is made of frit having a property of being cured by laser beam irradiation and the frit paste is applied on the first and second process substrates through a syringe or printed by a printing screen method, Forming the adhesive pattern, and irradiating the adhesive pattern of the frit material with a laser beam to cure the adhesive pattern.

The step of separating the first and second auxiliary substrates from the substrates for the first and second process, respectively, may be performed by progressing a laser ablation process corresponding to a portion where the adhesive pattern is formed or by exposing the adhesive pattern to an etching liquid, And weakening the adhesive force. The step of separating the first and second auxiliary substrates from the substrates for the first and second processes by proceeding with the laser ablation process may be performed by replacing the sacrificial layer with the first auxiliary substrate and the first auxiliary substrate, A separate sacrificial layer for laser ablation progress is not formed between the process substrate and between the second auxiliary substrate and the second process substrate.

The first thickness is 0.5t to 1.0t, the second thickness is 0.1t to 0.5t, and the first and second auxiliary substrates are glass.

The first and second adhesive patterns may be in the form of a single pattern of a quadrangular shape along the edges of the first and second auxiliary substrates or may be in the form of a rectangular double pattern or spaced apart rectangular pattern, .

After the first and second auxiliary substrates are separated from the substrates for the first and second processes, they are adhered to new substrates for the first and second processes and recycled to form the panels for the first and second processes .

And forming a transparent common electrode on the color filter layer.

The pixel electrode has a plurality of bar shapes spaced apart from each other in the pixel region and forms a common line in parallel with the gate line in the step of forming the gate line, A plurality of bar-shaped common electrodes alternating with the plurality of bar-shaped pixel electrodes and contacting the common lines are formed.

The present invention can provide a lightweight and thin liquid crystal display device without a separate panel etching process, and has an effect of suppressing breakage due to weakening of substrate rigidity due to an increase in roughness or the like of the surface of the panel by panel etching.

Further, since the manufacturing cost can be reduced by using a glass substrate having a relatively small thickness and a relatively small thickness, the present invention has an effect of improving the cost competitiveness of the product.

1 is an exploded perspective view of a liquid crystal display device using a glass substrate having a general thickness of 0.7t.
2 is a view showing a unit process of etching a surface of a liquid crystal panel for making a conventional liquid crystal display thin and light.
FIGS. 3A to 3I are cross-sectional views illustrating steps of manufacturing a lightweight thin-type liquid crystal display device according to a first embodiment of the present invention;
4A to 4D are views showing various forms of the first adhesive pattern in the manufacture of the liquid crystal display device according to the first embodiment of the present invention.
5A to 5F are cross-sectional views illustrating steps of manufacturing a lightweight thin-type liquid crystal display device according to a second embodiment of the present invention;
FIG. 6 is a diagram illustrating a bending state and a rigidity of a glass substrate having a thickness of 0.2t and having a reinforcing layer of a thickness of 0.5 탆 made of a DLC material according to a second embodiment of the present invention.
Fig. 7 is a graph showing the measurement of the bending state and rigidity of a glass substrate having a thickness of 0.2t without a reinforcing layer as a comparative example; Fig.

The most characteristic feature of the liquid crystal display device according to the embodiment of the present invention is that glass substrates having a smooth surface and having a thickness of about 0.1 to 0.5t, An array substrate and a color filter substrate are fabricated by minimizing the influence of warpage of the substrate by using a substrate and without damage during movement, and these two substrates are bonded together to complete a liquid crystal display device.

The glass substrate having a thickness of about 0.1 t to 0.5 t has a problem in that it is bent when the glass substrate is put into a manufacturing line of a general liquid crystal display device and the substrate is severely deflected to move using a moving means such as a cassette. The deflection occurs rapidly due to a small impact at the time of loading and unloading. As a result, a positional error is frequently generated, so that failure failure increases due to collision or the like, and the process progress is practically impossible.

Therefore, in the embodiment of the present invention, before such a glass substrate of 0.1 t to 0.5 t is introduced into the production line, the warpage is made to be the level of the glass substrate having a thickness of about 0.7 t used in a general liquid crystal display, The thickness of the glass substrate is less than the thickness of the glass substrate. In order to prevent breakage caused by movement of the substrate or deflection of the substrate during the unit process, And a protective film made of a specific material is formed.

At this time, the auxiliary substrate can easily detach and attach the glass substrate having a thickness of 0.1 t to 0.5 t, and can proceed even at the manufacturing process temperature of the liquid crystal display device, and the expansion rate according to the temperature change is similar to that of the glass substrate to be.

Hereinafter, a method of manufacturing a liquid crystal display device according to an embodiment of the present invention will be described in detail with reference to the drawings.

3A to 3I are cross-sectional views illustrating a manufacturing process of a liquid crystal display device according to a first embodiment of the present invention.

First, as shown in Fig. 3A, a glass substrate having a thickness of 0.1 t to 0.5 t (hereinafter referred to as a substrate for a first process (referred to as 110 in Fig. 3B)) is deflected during each unit process for manufacturing a liquid crystal display And an adhesive material having a property of being cured by thermosetting property or laser beam irradiation on the first auxiliary substrate 101 attached to the substrate for the first process (110 of FIG. 3B) to suppress breakage, for example, A first adhesive pattern 105 is formed by applying a Phenyl silsesquioxane or Phenyl PDMS as an adhesive material in a linear form using a device such as a syringe or by curing it by applying heat or by irradiating it with a laser beam do.

At this time, the form of the first adhesive pattern 105 may be varied as shown in Figs. 4A to 4D (various forms of the first adhesive pattern in manufacturing the liquid crystal display device according to the first embodiment of the present invention) .

That is, as shown in FIG. 4A, the first auxiliary substrate 101 may be formed in a rectangular pattern having a single pattern along the edge of the first auxiliary substrate 101, Likewise, it may be a square shape that is spaced apart by a double pattern. As shown in FIG. 4C, the first adhesive pattern 105 may have a plurality of rectangular multi-pattern shapes spaced apart from each other by a predetermined distance on the first auxiliary substrate 101, As shown in FIG.

The first adhesive pattern 105 for holding the first process substrate 110 and the first auxiliary substrate 101 in a bonded state may be a frit material other than a thermosetting or laser- Or may be made of a material. When the first adhesive pattern 105 is formed of a frit material, the frit paste may be formed to have a pattern shape as shown in Figs. 4A to 4D by applying a syringe or performing screen printing.

In FIG. 3B, the first adhesive pattern 105 is formed as a rectangular single pattern as shown in FIG. 4A.

Meanwhile, the first auxiliary substrate 101 is made of the same glass as the substrate for the first process (110 of FIG. 3B), and its thickness is 0.5 t or more and more accurately 0.5 t to 1.0 t. The reason why the first auxiliary substrate 101 is made of the same glass as the first substrate for the first process (110 in FIG. 3B) is that the temperature of the substrate for the first process (110 in FIG. 3B) So as to minimize the error caused by the expansion contraction which occurs when the unit process is performed, thereby suppressing defective alignment.

Further, in the case of the first auxiliary substrate 101 made of glass, since the array substrate of the conventional general liquid crystal display device and the glass substrate constituting the color filter substrate have the same material and the same thickness, the cassette stage or the unit process It is not necessary to adjust the pitch of the buffer stage or the like located between the devices.

Therefore, it is not necessary to adjust the vertical movement width of the robot or the like, and thus it can be used in a general manufacturing line for a liquid crystal display device.

Next, as shown in FIG. 3B, the first auxiliary substrate 101 having the first adhesive pattern 105 having the above-described characteristics is subjected to a first process for a glass material having a thickness of 0.1 t to 0.5 t The first auxiliary substrate 101 and the first auxiliary substrate 101 are cured by placing the substrate 110 on the first auxiliary substrate 101 and cementing the first adhesive pattern 105 provided on the first auxiliary substrate 101, So that the substrate 110 is in a state in which the substrate 110 is bonded. At this time, the first auxiliary substrate 101 and the first process substrate 110 are referred to as a first process panel (210 in FIG. 3C).

In this case, when the first adhesive pattern 105 is made of an adhesive material having a property of being cured by a thermal curing property or a laser beam irradiation, the first auxiliary substrate 101 is cured by applying heat or irradiating a laser beam, The first adhesive pattern 105 may be heated by applying heat to the first adhesive pattern 105. When the first adhesive pattern 105 is formed of frit, The first auxiliary substrate 101 and the first processing substrate 110 can be brought into a cemented state by completely curing them by irradiating a laser beam again after they are cured.

 The first process panel 210 having the first process substrate 110 and the first auxiliary substrate 101, which have a thickness of 0.1 t to 0.5 t, is attached to the first process substrate 110 And the first auxiliary substrate 101 are made of the same glass material, the expansion ratio is the same according to the temperature change. Therefore, there is no problem such as the warpage due to the different expansion ratio when the unit process is performed.

In addition, although the first substrate 110 has a thickness of about 0.1 t to 0.5 t itself, the first substrate 100 is bonded to the first auxiliary substrate 101 to form the first panel 210, And the glass substrate having a thickness of 0.7t has a deflection level of about or less than that of a glass substrate, so that there is no problem in advancing the unit process for a liquid crystal display device.

Next, as shown in FIG. 3C, an array process for fabricating a general array substrate is performed on the first process panel 210 to define pixel regions crossing each other on the first process substrate 110 (Not shown) and a gate wiring (not shown) which intersect with each other via the gate insulating film 156 are formed.

In each pixel region, a thin film transistor Tr as a switching element is formed at a position where the gate wiring (not shown) meets a data wiring (not shown). The thin film transistor Tr includes a gate electrode 115, a gate insulating layer 117, an active layer 120a of pure amorphous silicon, and an ohmic contact layer 120b of impurity amorphous silicon. The gate electrode 115 is connected to the gate wiring (not shown), and the source electrode 133 is connected to the drain electrode 133 And is connected to the data line (not shown).

A protective layer 140 is formed on the thin film transistor Tr to expose the drain electrode 136 of the thin film transistor Tr and a transparent conductive material is formed on the protective layer 140, The pixel electrode 148 is formed in contact with the drain electrode 136.

Next, as shown in FIG. 3D, on the second auxiliary substrate 180 having the same material and configuration as the first auxiliary substrate 101 (see FIG. 3C), the first adhesive pattern A second adhesive pattern 185 made of a material and having the same shape is formed. At this time, the second adhesive pattern 185 is also formed as a single pattern of a square as shown in FIG. 4A.

Next, a glass substrate 150 for a second process having a thickness of 0.1 t to 0.5 t is placed on the second auxiliary substrate 180 on which the second adhesive pattern 185 is formed, The pattern 185 is thermally cured or irradiated with a laser beam to be cured so that the second auxiliary substrate 180 and the second process substrate 150 are bonded together as shown in FIG. Thereby completing the use panel 220.

Next, a general color filter forming process is performed on the second process substrate 150 of the second process panel 220 to form black mattresses 153 at the boundaries of the pixel regions, Green, and blue color filter patterns are sequentially and repeatedly formed on the regions surrounded by the black matrix 153 and the black matrices 153, as shown in FIG.

Next, a common electrode 158 is formed by depositing a transparent conductive material on the color filter layer 156.

Then, a patterned spacer 170 having a constant height in the form of a column corresponding to the boundary of each pixel region is formed on the common electrode 158.

The black matrix 153 and the color filter layer 156 and the common electrode 158 and the patterned spacers 170 are formed by the color filter process. It is possible to stably proceed without defects or breakage of the unit process due to occurrence of large warpage.

Next, as shown in FIG. 3F, a seal pattern 177 is formed along the edge of any one of the first and second process panels 210 and 220.

The first process panel 210 having the pixel electrode 148 formed thereon and the second process panel 220 having the common electrode 158 are formed on the pixel electrode 148 and the common electrode 158 Respectively.

The patterned spacers 170 are disposed on the uppermost layer of the second process panel 220 with the liquid crystal layer 175 interposed therebetween in the seal pattern 177, And then the first and second process panels 210 and 220 are joined together by performing a laminating process.

  Next, as shown in FIG. 3G, the first and second process panels 210 and 220 corresponding to the portions where the first and second adhesive patterns 105 and 185 are formed on the outer side surfaces of the first and second process panels 210 and 220, The adhesive strength of the first and second adhesive patterns 105 and 185 is weakened.

For example, the laser ablation process of irradiating the laser beam LB using the laser irradiator 200 is performed to weaken the adhesive force of the first and second adhesive patterns 105 and 185. The laser beam used for such laser ablation is different in power and wavelength band from the source of the laser beam used for curing the first and second adhesive patterns 105 and 185, And weakens the adhesive strength of the patterns 105 and 185.

At this time, in the first embodiment of the present invention, the laser ablation process is performed to separate the first and second auxiliary substrates 101 and 180 from the first and second substrates 110 and 150, respectively May be performed between the first auxiliary substrate 101 and the first process substrate 110 and between the second auxiliary substrate 180 and the second auxiliary substrate 180 by replacing the sacrificial layer by the first and second adhesive patterns 105, A separate sacrificial layer for progressing the laser ablation is not required between the substrate 150 for the second process.

3H, the first auxiliary substrate 101 attached to the outer surface of the first process substrate 110 and the second auxiliary substrate 101 attached to the outer surface of the second process substrate 150 The second auxiliary substrate 180 is detached to form the liquid crystal panel 230 composed of the first and second substrates 110 and 150 having a thickness of 0.1 t to 0.5 t.

In the drawing, the first and second auxiliary substrates 101 and 180 are detached after the laser ablation is performed. However, as a modified example, a portion where the first and second adhesive patterns 105 and 185 are formed The first and second adhesive patterns 105 and 185 are exposed to an etchant for etching the first and second adhesive patterns 105 and 185 in place of the laser ablation process for irradiating the laser beam LB correspondingly to the first and second adhesive patterns 105 and 185, The auxiliary substrates 101 and 180 may be detached.

The first and second auxiliary substrates 101 and 180 detached from the liquid crystal panel 230 may be recycled after the first and second adhesive patterns 105 and 185 are removed.

That is, after completely removing the first and second adhesive patterns 105 and 185 in a state where the adhesive force is lost by laser ablation or etching, new first and second adhesive patterns (not shown) having an adhesive force are formed (Not shown) for the first and second process steps, and is continuously recycled.

Although the substrate 110 for the first process with the array elements formed thereon and the substrate 150 for the second process with the color filter layer both have the thickness of 0.1 t to 0.5 t in the completed liquid crystal panel 230, Even if the liquid crystal panel 230 is attached to the liquid crystal panel 230, the liquid crystal panel 230 is in a state in which the liquid crystal panel 230 is formed therebetween. Therefore, the deflection is scarcely generated and the degree of deflection is smaller than that of the single- Considering the bonding force, the glass substrate is smaller than the warp of the single-plate glass substrate having a thickness of 0.7t, so that the problem caused by the warpage does not occur in the subsequent unit process.

Next, as shown in FIG. 3I, by attaching the first and second polarizing plates 187 and 188 to both outer sides of the liquid crystal panel 230 manufactured as described above, the first embodiment of the present invention The liquid crystal display device 109 can be completed.

As described above, in the liquid crystal display device 109 manufactured according to the first embodiment of the present invention, the thicknesses of the substrate 110 for the first process and the substrate 150 for the second process are 0.1 to 0.5 t so that the liquid crystal display device 109 can display a liquid crystal display device using a conventional glass substrate having a thickness of 0.7t under the assumption that the thicknesses of the first and second polarizing plates 187 and 188 and the liquid crystal layer 175 are the same, It can be seen that the thickness is reduced to 0.4 mm to 1.0 mm, and the weight is also reduced by 1/7 to 5/7.

Therefore, a lightweight / thin liquid crystal display device which is a trend of display devices in recent years can be realized.

Meanwhile, in the method of manufacturing the liquid crystal display device 109 according to the first embodiment of the present invention, the process of etching the outer surface of the liquid crystal panel 230 is eliminated, thereby improving the productivity per unit time , And further, by using a glass substrate having a thickness of 0.1 t to 0.5 t, which is relatively inexpensive compared to a glass substrate having a thickness of 0.7 t, the manufacturing cost can be reduced.

5A to 5F are cross-sectional views illustrating steps of manufacturing a lightweight thin-type liquid crystal display device according to a second embodiment of the present invention.

First, as shown in FIG. 5A, a glass substrate 301 having a thickness of 0.1 t to 0.5 t is manufactured in the process of manufacturing a glass substrate which is performed in a roll-to-roll (400) Like carbon (DLC) (hereinafter, referred to as DLC) in a temperature atmosphere of 300 ° C. to 500 ° C. before cutting the unit glass substrate (310 of FIG. 5B) having a predetermined size Is deposited on one side or both sides of the whole glass substrate 301 to a thickness of about 0.5 μm to 5 μm and quenched to reduce the flexural characteristics of the glass substrate 301 having a thickness of 0.1 t to 0.5 t, Or a transparent glass fiber reinforced material such as polyvinyl butyral is coated on one side or both sides of the glassy substrate 301 so as to have a thickness of about 0.5 to 5 m in a room temperature atmosphere Bo It forms a layer 305.

Although the reinforcing layer 305 is formed only on one side surface of the glass pane substrate 301 in the figure, the evaporation or coating may be simultaneously performed on the upper and lower surfaces of the glass pane substrate 301, (305) may be formed on both side surfaces of the whole-glass substrate (301).

Next, as shown in FIG. 5B, a glass-ceramic substrate 301 having a thickness of 0.1 t to 0.5 t and equipped with a reinforcing layer 305 formed as diamond-like carbon (DLC) The unit substrate 310 for manufacturing a liquid crystal display device is formed by cutting the substrate 410 to a predetermined size.

A unit substrate 310 having a thickness of 0.1 t to 0.5 t and provided with a reinforcing layer 305 having a thickness of about 0.5 to 5 탆 as a DLC or glass fiber reinforcing material on one surface or both surfaces of the reinforcing layer 305 ), The degree of warping becomes a level of the glass substrate having a thickness of 0.7t, and the rigidity thereof is also increased to have the level of the glass substrate having the thickness of 0.7t, whereby a large number of devices It is characterized by being able to proceed without any process.

FIG. 6 is a view showing a measurement of a bending state and a rigidity of a glass substrate having a thickness of 0.2t, which is made of a DLC material and has a reinforcing layer having a thickness of 0.5 μm, according to a second embodiment of the present invention. As an example, Fig. 2 shows a measurement of the bending state and rigidity of a glass substrate having a thickness of 0.2t without a reinforcing layer.

Referring to FIG. 6, it can be seen that the glass substrate having a thickness of 0.2t formed with the reinforcing layer of the DLC material according to the second embodiment of the present invention has a relatively small warp, and the average And the rigidity is about 700 kgf / cm 2.

On the other hand, referring to FIG. 7, it can be seen that, in the case of a glass substrate having a thickness of 0.2t without a reinforcing layer according to the comparative example, the degree of warpage thereof is remarkably generated compared to the second embodiment, and the average rigidity is 700kgf / It can be seen that it is smaller than the second embodiment of the present invention.

Therefore, when the reinforcing layer made of the DLC material or the glass fiber reinforced material is formed to have a thickness of 0.5 탆 or more due to the bending and stiffness measurement results, the degree of warping of the glass substrate is remarkably reduced and the degree of warpage of the organic substrate It is possible to suppress the problems such as breakage during conveyance caused by warping in the process of manufacturing the liquid crystal display device proceeding with respect to the glass substrate of 0.7t.

In addition, when the reinforcing layer is formed also in the stiffness, the stiffness is increased as the thickness of the reinforcing layer is increased, so that breakage due to stiffness weakening can also be suppressed.

Next, as shown in FIG. 5C, an array process for fabricating a general array substrate is performed on the first substrate 310, which is cut in an area unit having a predetermined size and on which the reinforcing layer 305 is formed, 310 and gate lines (not shown) which intersect with each other with a gate insulating film 356 interposed therebetween.

In each pixel region, a thin film transistor Tr as a switching element is formed at a position where the gate wiring (not shown) meets a data wiring (not shown). The thin film transistor Tr includes a gate electrode 315, a gate insulating layer 317, an active layer 320a of pure amorphous silicon, and an ohmic contact layer 320b of impurity amorphous silicon. The gate electrode 315 may be connected to the gate wiring (not shown), and the source electrode 333 may be connected to the source electrode 333 and the drain electrode 333, And is connected to the data line (not shown).

A protective layer 340 is formed on the thin film transistor Tr so as to expose the drain electrode 336 of the thin film transistor Tr and a transparent conductive material is formed on the protective layer 340, The pixel electrode 348 contacting the drain electrode 336 is formed.

Next, as shown in FIG. 5D, a general color filter forming process is performed on the second substrate 305, which is cut in an area unit having a predetermined size and provided with the reinforcing layer 305, A mattress 353 is formed and a color filter layer 356 in which red, green and blue color filter patterns are sequentially and repeatedly formed in the region surrounded by the black matrix 353 and the black matrix 353 is formed.

Next, a common electrode 158 is formed by depositing a transparent conductive material on the color filter layer 356.

Thereafter, a patterned spacer 370 having a constant height in a column shape corresponding to the boundary of each pixel region is formed on the common electrode 358.

Even when the color filter process for forming the black matrix 353 and the color filter layer 356 and the common electrode 358 and the patterned spacers 370 is performed, The second substrate 350 having a thickness may have a degree of warp similar to that of a glass substrate having a thickness of about 0.7t, so that the second substrate 350 can stably proceed without defects or breakage of a unit process due to occurrence of large warpage.

Next, as shown in FIG. 5E, the first substrate 310 on which the pixel electrode 348 is formed or the second substrate 350 on which the common electrode 358 is formed has a seal pattern 377 ).

The first substrate 310 on which the pixel electrode 348 is formed and the second substrate 350 on which the common electrode 358 is formed are positioned so that the pixel electrode 348 and the common electrode 358 face each other .

The end of the patterned spacer 370 is brought into contact with the protective layer 340 formed on the uppermost layer of the first substrate 310 with the liquid crystal layer 375 interposed inside the seal pattern 377 And the first and second substrates 310 and 350 having a thickness of 0.1 t to 0.5 t by making the first and second substrates 310 and 350 coalesce by proceeding with a laminating process So that the liquid crystal panel 380 is formed.

Next, as shown in FIG. 5F, the first and second polarizing plates 387 and 388 are attached to both outer sides of the liquid crystal panel 380 manufactured as described above to form the liquid crystal display device 309) can be completed.

In the second embodiment of the present invention, the reinforcing layer is formed in the state of a glass substrate before cutting the glass substrate so as to have a predetermined unit area in the manufacturing step of the glass substrate. However, as a modified example, As shown, the reinforcing layer has a thickness of 0.1 to 0.5t on the auxiliary substrate using an auxiliary substrate having a warp smaller than the degree of warping of the glass substrate having a thickness of about 0.7t in a state of being cut to a unit area size And then the reinforcing layer is formed through deposition of DLC or coating of a glass fiber reinforcing material and then the auxiliary substrate is removed to form a unit substrate having a reinforcing layer.

As described above, the liquid crystal display device 309 manufactured by the manufacturing method according to the second embodiment of the present invention includes the first substrate 310 having the thin film transistor Tr and the color filter layer 356 The thickness of the second substrate 350 itself is 0.1 t to 0.5 t so that the thickness of the liquid crystal panel 380 is 0.5 Except for the thickness of the reinforcing layer 305 having a thickness of 5 mu m to 5 mu m, the thickness of the conventional glass substrate is 0.4 to 1.0 mm thinner than that of the conventional liquid crystal display device having a thickness of 0.7 t, / 7 is light.

Accordingly, the liquid crystal display device 309 manufactured according to the second embodiment of the present invention can also realize a light / thin type which is a trend of recent display devices.

In addition, the manufacturing method of the liquid crystal display device according to the second embodiment of the present invention as described above can also improve the productivity per unit time by eliminating the step of etching the outer surface of the liquid crystal panel 380 as in the first embodiment And it is further characterized in that manufacturing cost can be reduced by using a glass substrate having a thickness of 0.1 t to 0.5 t which is relatively inexpensive compared with a glass substrate having a thickness of 0.7 t.

On the other hand, in the first and second embodiments of the present invention, plate-shaped pixel electrodes are formed on the first (process) substrate for each pixel region, and a pixel electrode corresponding to the display region is formed on the second A method of manufacturing a lightweight thin-type liquid crystal display device in which a common electrode is formed is described. However, as a modification thereof, a method of manufacturing a thin And a plurality of pixel electrodes are formed in each pixel region in the form of a bar. The pixel electrodes are spaced apart from the bar-shaped pixel electrodes, And the second (process) substrate is formed with an overcoat layer covering the black matrix, the color filter layer, and the color filter layer, The same first formed on the first (Process for) the substrate being may form a lightweight, thin liquid crystal display device of expressing the transverse electric field.

The present invention is not limited to the above-described embodiments, and various modifications may be made without departing from the spirit of the present invention.

301: Whole glass substrate
305: reinforced layer
310: unit substrate
410: Cutting device

Claims (11)

A method of manufacturing a liquid crystal display device comprising a first laser beam and a peeling machine system for irradiating a second laser beam having a different source, power and wavelength band than the first laser beam,
Forming an adhesive pattern on first and second auxiliary substrates each having a first thickness and for forming first and second auxiliary substrates on first and second auxiliary substrates each having a second thickness thinner than the first thickness, Positioning a substrate;
Irradiating the first laser beam with the adhesive pattern to cure the adhesive pattern so that the first and second auxiliary substrates and the first and second process substrates are adhered to each other, ; ≪ / RTI >
Forming a gate wiring, a data wiring, a thin film transistor, and a pixel electrode on the first process substrate of the first process panel;
Forming a color filter layer on the second process substrate of the second process panel;
Bonding the first and second process panels to each other through a liquid crystal layer;
Separating the first and second auxiliary substrates from the substrates for the first and second processes, respectively, by irradiating the second laser beam with the adhesive pattern to weaken the adhesive force of the adhesive pattern;
And a liquid crystal layer.
The method according to claim 1,
Wherein the adhesive pattern comprises a Phenyl silsesquioxane or PDMS which is an adhesive material having a property of being cured by the first laser beam irradiation,
Wherein the adhesive pattern is formed by applying the adhesive material onto the substrates for the first and second processes through a syringe.
The method according to claim 1,
Wherein the adhesive pattern is made of a frit having a property of being cured by the first laser beam irradiation,
Forming a frit material on the first and second process substrates through a syringe or by printing with a printing screen method to form the frit material bonding pattern; And curing the adhesive pattern. ≪ Desc / Clms Page number 20 >
delete delete The method according to claim 1,
Wherein the first thickness is 0.5t to 1.0t and the second thickness is 0.1t to 0.5t.
The method according to claim 1,
Wherein the first and second auxiliary substrates are made of glass.
The method according to claim 1,
Wherein the adhesive pattern is in the form of a quadrangular single pattern formed along the edges of the first and second auxiliary substrates, a pattern of a double pattern spaced apart, a pattern of multiple patterns spaced apart, or a lattice pattern.
The method according to claim 1,
After the first and second auxiliary substrates are separated from the substrates for the first and second processes,
After removing the weakened adhesion pattern on the first and second auxiliary substrates,
And attaching new substrates for the first and second processes to the first and second auxiliary substrates through a new bonding pattern to be recycled to form the first and second process panels.
The method according to claim 1,
And forming a transparent common electrode on the color filter layer.
The method according to claim 1,
The pixel electrode has a plurality of bar shapes spaced apart from each other in the pixel region,
Forming a common wiring in parallel with the gate wiring in the step of forming the gate wiring,
And forming a plurality of bar-shaped common electrodes alternating with the plurality of bar-shaped pixel electrodes and contacting the common lines in the step of forming the bar-shaped pixel electrodes, Gt;

Images