KR101828394B1 - 전기도금된 기재들을 제조하는 방법 - Google Patents

전기도금된 기재들을 제조하는 방법 Download PDF

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Publication number
KR101828394B1
KR101828394B1 KR1020177021079A KR20177021079A KR101828394B1 KR 101828394 B1 KR101828394 B1 KR 101828394B1 KR 1020177021079 A KR1020177021079 A KR 1020177021079A KR 20177021079 A KR20177021079 A KR 20177021079A KR 101828394 B1 KR101828394 B1 KR 101828394B1
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KR
South Korea
Prior art keywords
carrier
clip
plates
bus bar
substrate
Prior art date
Application number
KR1020177021079A
Other languages
English (en)
Korean (ko)
Other versions
KR20170091755A (ko
Inventor
엠마누엘 추아 아바스
첸-안 첸
다이아나 샤오빙 마
칼리아나 바르가바 간티
에드문도 아니다 디비노
제이크 랜들 지 에르미타
호세 프란시스코 에스 카푸롱
아놀드 빌라모어 카스틸로
Original Assignee
선파워 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/889,228 external-priority patent/US8221600B2/en
Priority claimed from US12/889,232 external-priority patent/US8221601B2/en
Priority claimed from US12/889,219 external-priority patent/US8317987B2/en
Application filed by 선파워 코포레이션 filed Critical 선파워 코포레이션
Publication of KR20170091755A publication Critical patent/KR20170091755A/ko
Application granted granted Critical
Publication of KR101828394B1 publication Critical patent/KR101828394B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020177021079A 2010-09-23 2011-07-11 전기도금된 기재들을 제조하는 방법 KR101828394B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US12/889,228 US8221600B2 (en) 2010-09-23 2010-09-23 Sealed substrate carrier for electroplating
US12/889,232 US8221601B2 (en) 2010-09-23 2010-09-23 Maintainable substrate carrier for electroplating
US12/889,219 2010-09-23
US12/889,232 2010-09-23
US12/889,228 2010-09-23
US12/889,219 US8317987B2 (en) 2010-09-23 2010-09-23 Non-permeable substrate carrier for electroplating
PCT/US2011/043571 WO2012039816A1 (en) 2010-09-23 2011-07-11 Non-permeable substrate carrier for electroplating

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020127034368A Division KR101764275B1 (ko) 2010-09-23 2011-07-11 전기도금용 불침투성 기재 캐리어

Publications (2)

Publication Number Publication Date
KR20170091755A KR20170091755A (ko) 2017-08-09
KR101828394B1 true KR101828394B1 (ko) 2018-02-12

Family

ID=45874099

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020127034368A KR101764275B1 (ko) 2010-09-23 2011-07-11 전기도금용 불침투성 기재 캐리어
KR1020177021079A KR101828394B1 (ko) 2010-09-23 2011-07-11 전기도금된 기재들을 제조하는 방법

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1020127034368A KR101764275B1 (ko) 2010-09-23 2011-07-11 전기도금용 불침투성 기재 캐리어

Country Status (6)

Country Link
EP (2) EP2619349B1 (ja)
JP (2) JP5792820B2 (ja)
KR (2) KR101764275B1 (ja)
CN (2) CN203307439U (ja)
ES (1) ES2605805T3 (ja)
WO (3) WO2012039817A2 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050061665A1 (en) 2003-08-06 2005-03-24 Sunpower Corporation Substrate carrier for electroplating solar cells

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4297197A (en) * 1980-11-13 1981-10-27 International Telephone And Telegraph Corp. Electroplating rack
US4796157A (en) * 1988-01-04 1989-01-03 Motorola, Inc. Substrate mounting assembly
US5078852A (en) * 1990-10-12 1992-01-07 Microelectronics And Computer Technology Corporation Plating rack
DE69929967T2 (de) * 1998-04-21 2007-05-24 Applied Materials, Inc., Santa Clara Elektroplattierungssystem und verfahren zur elektroplattierung auf substraten
JP2001234397A (ja) 2000-02-24 2001-08-31 Matsushita Electric Works Ltd 電気メッキ用冶具
JP3413185B2 (ja) 2000-11-15 2003-06-03 古河電気工業株式会社 めっき用治具
US7930006B2 (en) * 2004-09-08 2011-04-19 Belkin International, Inc. Holder, electrical supply, and RF transmitter unit for electronic devices
US20080248596A1 (en) * 2007-04-04 2008-10-09 Endicott Interconnect Technologies, Inc. Method of making a circuitized substrate having at least one capacitor therein
EP1717351A1 (de) * 2005-04-27 2006-11-02 Enthone Inc. Galvanikbad
DE102005039100A1 (de) * 2005-08-09 2007-02-15 Gebr. Schmid Gmbh & Co. Einrichtung zur Aufnahme bzw. Halterung mehrerer Substrate und Galvanisiereinrichtung
US7718888B2 (en) * 2005-12-30 2010-05-18 Sunpower Corporation Solar cell having polymer heterojunction contacts
US7767030B2 (en) * 2007-09-24 2010-08-03 Chemical Specialties Manufacturing Corp. Cleaning device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050061665A1 (en) 2003-08-06 2005-03-24 Sunpower Corporation Substrate carrier for electroplating solar cells

Also Published As

Publication number Publication date
JP5792820B2 (ja) 2015-10-14
ES2605805T3 (es) 2017-03-16
WO2012039817A2 (en) 2012-03-29
EP2619349B1 (en) 2016-11-09
WO2012039817A3 (en) 2014-03-20
WO2012039816A1 (en) 2012-03-29
EP2619349A4 (en) 2016-01-27
KR20170091755A (ko) 2017-08-09
JP2016014192A (ja) 2016-01-28
EP2619349A1 (en) 2013-07-31
WO2012039818A1 (en) 2012-03-29
KR20130121704A (ko) 2013-11-06
JP6080320B2 (ja) 2017-02-15
EP3150748A1 (en) 2017-04-05
CN203307439U (zh) 2013-11-27
CN203795007U (zh) 2014-08-27
KR101764275B1 (ko) 2017-08-03
JP2013537941A (ja) 2013-10-07
EP3150748B1 (en) 2018-05-09

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