KR101823062B1 - AP chip test device, AP chip test system and AP chip test method - Google Patents

Abstract

The present invention relates to an apparatus, a system, and a method for inspecting an AP chip. The apparatus of the present invention comprises: an inspection terminal for displaying a driving image in accordance with the driving of functions included in the AP chip which is an object for performance inspection; an inspection member separated and disposed at an upper side of the inspection terminal, and photographing the driving image displayed on the inspection terminal; a blocking member for surrounding outer portions of the inspection member and the inspection terminal to block external light; and a control unit for obtaining the driving image of functions included in the AP chip, which is an object for inspection, through the inspection member, and determining performance of the functions included in the AP chip, which is the object for inspection, through the obtained driving image. In the control unit, good quality information on the functions included in the AP chip is preset. The driving image and the preset good quality information of the functions included in the AP chip, which is an object for inspection, obtained by the inspection member are compared with each other to determine bad and good quality of the AP chip, which is the object for inspection.

Description

AP chip testing apparatus, AP chip testing system, and AP chip testing method,

The present invention relates to an AP chip inspection apparatus, an AP chip inspection system, and an AP chip inspection method.

Generally, an application processor chip (AP chip) that functions as a central processing unit (CPU) of a general computer is built in a smart phone or a digital TV. The AP chip is a mobile memory chip and is a key semiconductor for various application operations and graphics processing. The AP chip is a System on Chip (SoC) that includes all the functions of a computer's central processing unit (CPU) and a chipset that controls the connection of memory, hard disk, graphics card, and other devices.

The AP chip allows general functions used in smartphones to be executed. In particular, functions such as telephone connection, music playback, movie playback, camera, file deletion, etc., can be performed by the AP chip.

These AP chips are manufactured and tested for performance, and after they are determined to be defective or good products through AP chip performance test, they are mounted on machines and released as products.

Specifically, the performance test of the AP chip is performed in the following order.

First, an AP chip is inserted into an inspection terminal and then an AP chip is driven. Then, an image corresponding to the AP chip function operation is reproduced on the inspection terminal.

At this time, the operator visually confirms the image reproduced on the inspection terminal and determines the AP chip performance as defective or good. Here, the time during which the image for AP chip inspection is reproduced through the inspection terminal proceeds as fast as about 10 minutes.

At this time, during AP chip performance inspection work, an AP chip which is not found by the naked eye but is judged to be a good product is generated.

The AP chip which is not confirmed by the operator's naked eye is mounted on a product to be released and released on the market, and there is a problem that the user finds an AP chip defect when the user uses the product.

An embodiment of the present invention is to provide an AP chip inspecting apparatus, an AP chip inspecting system and an AP chip inspecting method which can accurately and easily check the performance of an AP chip built in a terminal.

According to an aspect of the present invention, there is provided an inspection terminal for displaying a driving image according to driving of functions included in an AP chip as a performance inspection target; An inspection member which is spaced apart from the upper side of the inspection terminal and photographs the driving image displayed on the inspection terminal; A blocking member surrounding the test member and the outer side of the inspection terminal for blocking external light; And a controller for acquiring a driving image of the functions included in the AP chip to be inspected through the inspection member and determining performance of functions included in the AP chip to be inspected through the obtained driving image, The control unit compares favorable information on the functions included in the AP chip with the driving image of the functions included in the AP chip to be inspected acquired by the inspection member and the predetermined good quality information, There is provided an AP chip inspection apparatus formed to discriminate defective and good products of AP chips.

Further, an input member to which the AP chip is seated and inserted into an opening formed at one side of the inspection terminal; And a pressing member for pressing the insertion member such that the insertion member on which the AP chip is mounted is inserted into the opening of the examination terminal.

The pressing member may include a pressure plate for pushing the input member; And a drive cylinder for moving the pressure plate toward the input member.

The control unit may include an acquiring unit for acquiring and storing the driving image through the inspection member; And a determination unit for determining good and bad goods of the AP chip by comparing the driving image and the good product information.

In addition, the good product information may include an allowable range for determining the good and defective of each function included in the AP chip to be inspected.

Also, the allowable range is a range in which a failure of the functions included in the AP chip to be inspected can be determined. The allowable range includes a time to reproduce after the driving video is stopped, a residual amount of the residual image, . ≪ / RTI >

Also, the inspection terminal may include a case having an opening formed at one side thereof for the entrance and exit of the AP chip; A driving unit for driving the AP chip; And a display unit for displaying an image reproduced by the operation of the AP chip driven by the driving unit.

According to another aspect of the present invention, there is provided a dispenser comprising: a supply part for supplying a tray on which a plurality of AP chips are placed; A plurality of AP chip inspection devices for checking the performance of a plurality of AP chips mounted on the tray; A discharger for discharging the plurality of AP chips that have been inspected from the plurality of AP chip inspection devices to the outside; And a transfer unit for transferring the AP chip from the supply unit to the AP chip inspection apparatus and transferring the AP chip from the AP chip inspection apparatus to the discharge unit.

The supply unit may include a supply member to which a plurality of trays on which the plurality of AP chips are mounted are supplied, A workpiece spaced from the supply member and supplied with one of the plurality of trays; A first moving member connecting the supplying member and the working member to move the tray loaded on the supplying member to the working member; And a discharge member for discharging the empty tray after a plurality of AP chips disposed on the tray supplied to the working member are transferred to the AP chip inspection apparatus.

In addition, the discharging unit may include a defective working member in which a defective AP chip is disposed among the AP chips that have been inspected in the AP chip inspection apparatus; A good quality workpiece on which the good AP chip is disposed among the AP chips tested by the AP chip inspection apparatus; A defective discharge member for discharging the AP chip disposed in the defective working member; A good product discharge member for discharging the AP chip disposed in the good work member; And a second moving member for moving the AP chip supplied to the defective work member and the good work member to the defective discharge member and the good discharge member.

The plurality of AP chip inspection devices may be arranged in a matrix.

The transfer unit may include: a grip unit for gripping the AP chip; A first direction transfer member for moving the grip portion in a first direction; And a second direction feeding member for moving the grip portion in a second direction perpendicular to the first direction.

The apparatus may further include a position correction monitoring member disposed between the transfer unit and the AP chip inspection apparatus to confirm a grip position of the AP chip gripped by the grip unit.

The gripping portion may include a housing that moves along the first direction transfer member; A vertically movable member coupled to one side of the housing; A rotatable member moving in the up / down direction along the up / down moving member and rotatable in the horizontal direction in the up / down movement direction; And an adsorption member coupled to one end of the rotary member to adsorb the AP chip, wherein the rotation member rotates the adsorption member to correct the adsorption position of the AP chip adsorbed on the adsorption member have.

The plurality of AP chip inspection apparatuses are connected to a central control unit, and the central control unit can confirm the inspection progress of the AP chips to be inspected in progress in the plurality of AP chip inspection apparatuses.

According to another aspect of the present invention, there is provided a method of controlling an AP chip, comprising: reproducing a driving image according to driving of functions included in an AP chip to be inspected on a display unit of an inspection terminal; Photographing the driving image reproduced on the display unit of the inspection terminal by an inspection member; Storing the driving image photographed by the inspection member in an acquisition unit of the control unit; And comparing the driving image with predetermined good information set in the determining unit to discriminate the AP chip to be inspected as good and defective.

Further, in the step of discriminating the good and bad of the AP chip, the good quality information set in the discrimination unit includes an allowable range for discriminating the good and defective of each function included in the AP chip to be inspected .

Also, the allowable range is a range in which a failure of the functions included in the AP chip to be inspected can be determined. The allowable range includes a time to reproduce after the driving video is stopped, a residual amount of the residual image, . ≪ / RTI >

According to the present invention, an inspection member for inspecting an image to be reproduced in an inspection terminal is disposed on the upper side of an inspection terminal for driving an AP chip to reproduce an image, and a control unit connected to the inspection member reads an image, And good products can be accurately and easily distinguished.

Further, information on each of the functions included in the AP chip is preliminarily set in the control unit, and the defective and good products are discriminated for each function, so that it is possible to check which function of the AP chip to be inspected has failed .

Further, in order to check the performance of the AP chip, the AP chip inspection is continuously automated by configuring a supply unit for supplying the AP chip, an inspection apparatus for inspecting the AP chip, and a discharge unit for discharging the inspected AP chip The working efficiency can be improved.

1 is a perspective view schematically illustrating an AP chip inspection system including an AP chip inspection apparatus according to an embodiment of the present invention.
2 is a front view of an AP chip inspection system according to an embodiment of the present invention.
3 is a perspective view illustrating an AP chip inspection apparatus according to an embodiment of the present invention.
4 is a diagram illustrating an inspection terminal and an input member of an AP chip inspection apparatus according to an embodiment of the present invention.
5 is a block diagram of a control unit connected to an AP chip testing apparatus according to an embodiment of the present invention.
6 is a view schematically showing a connection between a plurality of AP chip inspection apparatuses and a plurality of control units according to an embodiment of the present invention.
7 is a flowchart illustrating an AP chip inspection method according to an embodiment of the present invention.
FIG. 8 is a view showing a gripping part of the AP chip inspection system according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art to which the present invention pertains. The present invention may be embodied in many different forms and is not limited to the embodiments described herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and the same or similar components are denoted by the same reference numerals throughout the specification.

FIG. 1 is a perspective view schematically showing an AP chip inspection system including an AP chip inspection apparatus according to an embodiment of the present invention, FIG. 2 is a front view of an AP chip inspection system according to an embodiment of the present invention, 3 is a perspective view showing an AP chip inspection apparatus according to an embodiment of the present invention, FIG. 4 is a view showing an inspection terminal and an input member of the AP chip inspection apparatus according to an embodiment of the present invention, 6 is a block diagram of a control unit connected to an AP chip inspection apparatus according to an embodiment of the present invention. FIG. 6 is a schematic view illustrating a connection between a plurality of AP chip inspection apparatuses and a plurality of control units according to an embodiment of the present invention. FIG. 7 is a flowchart illustrating a method of inspecting an AP chip according to an embodiment of the present invention, and FIG. 8 is a view illustrating a grip unit of the AP chip inspection system according to an embodiment of the present invention.

First, an AP (application processor) chip is a non-memory semiconductor used for a smart phone, a digital TV, and the like, and functions as a central processing unit (CPU) of a general computer.

The performance of the AP chip (C) is inspected after the manufacturing, and the performance test of the AP chip is performed in the AP chip inspection system combined with the AP chip inspection apparatus.

1 and 2, the AP chip inspection system 100 may include a supply unit 110, an AP chip inspection apparatus 120, a discharge unit 130, and a transfer unit 140.

The supplying unit 110 includes a supplying member 111, a working member 112, a first moving member 113, and a discharging member 114, where AP chips to be inspected are supplied from the AP chip inspection system 100 can do.

The supply member 111 may be provided with a tray T on which a plurality of AP chips C are mounted. At this time, a plurality of trays are stacked on the supply member 111.

The working member 112 is disposed on one of a plurality of trays disposed on the supplying member 111. [ At this time, the work member 112 is spaced apart from the supply member 111 by a predetermined distance, and is arranged close to the AP chip inspection apparatus 120.

At this time, one of the plurality of trays loaded on the supply member 111 can be moved to the work member 112 by the first moving member 113.

The first moving member 113 includes a pair of first moving rails 113a spaced apart at regular intervals and a first moving plate 113b reciprocating along the first moving rail 113a along the first direction, .

A working member 112 is disposed on one side of the pair of first moving rails 113a and a feeding member 111 and a discharging member 114 are disposed on the other side of the pair of first moving rails 113a .

After the plurality of AP chips C mounted on the tray disposed on the work member 112 are moved to the AP chip inspection apparatus 120, the empty tray is again moved by the first moving plate 113b to the discharge member 114 .

That is, the discharge member 114 is loaded with empty trays T whose AP chips have been moved to the AP chip inspection apparatus.

Then, the first moving plate 113b moves another tray disposed on the supplying member 111 to the working member 112. [

On the other hand, the AP chip testing apparatus 120 is for testing the performance of the AP chip. The AP chip testing apparatus 120 checks whether functions such as music, video, camera, data deletion, 121 to drive the AP chip and inspect it through the inspection member 122.

For this, the AP chip testing apparatus 120 may include an inspection terminal 121, an inspection member 122, and a blocking member 123 as shown in FIG.

The inspection terminal 121 can drive the AP chip for performance inspection and the inspection terminal 121 may include a case 121a, a driving unit (not shown) and a display unit 121b.

As shown in FIG. 4, the case 121a may have a square shape and an opening 121c through which the AP chip can be inserted and removed. An input member 124 into which the AP chip is inserted is coupled to the opening 121c of the case 121a. The AP chip put in the insertion member 124 can be pressurized by the pressing member 125 and flow into the case 121a.

More specifically, the pressing member 125 is coupled to one surface of the insertion member 124. When the AP chip is seated with the insertion member 124, the pressing member 125 is pressed toward the opening 121c of the case 121a , So that the insertion member 124 is inserted into the opening 121c of the case 121a.

The pressure member 125 may include a pressure plate 125a that pushes the input member 124 and a driving cylinder 125b that moves the pressure plate 125a toward the input member 124. [

In an embodiment of the present invention, the driving cylinder 125b may be an air cylinder.

Also, the driving unit (not shown) may be incorporated in the case 121a, and recognizes that the AP chip is embedded in the case 121a, thereby driving the AP chip. Further, as the AP chip is driven by the driving unit (not shown), functions of the AP chip may be activated and displayed as a driving image on the display unit 121b.

That is, when the AP chip is driven by the driving unit, various functions included in the AP chip are activated and reproduced on the display unit 121b of the inspection terminal 121 as a driving image. At this time, the functional operation of the AP chip reproduced on the display unit 121b of the inspection terminal 121 proceeds as fast as about 10 minutes.

The driving image corresponding to the operation of the functions included in the AP chip thus rapidly proceeding is inspected by the inspection member 122.

More specifically, the inspection member 122 may be disposed on the upper side of the inspection terminal 121 so as to face the inspection terminal 121.

Meanwhile, according to one embodiment of the present invention, the inspection terminal 121 uses a smartphone, and the present invention is not limited thereto. That is, electronic products to which the AP chip is applied can be used as an inspection terminal.

Also, according to an embodiment of the present invention, an HDMI camera can be used as the inspection member 122 to capture images reproduced by the display unit 121b of the inspection terminal 121.

When the inspection member 122 inspects a driving image displayed on the display unit 121b of the inspection terminal 121, external light is projected to the display unit 121b side of the inspection terminal 121, A shadow may be formed on the display portion 121b of the display unit 121. [

Therefore, according to one embodiment of the present invention, in order to prevent shadow formation on the display portion 121b of the inspection terminal 121, the blocking member 123 surrounds the outside of the inspection terminal 121 and the inspection member 122 .

At this time, the blocking member 123 may be formed of a material having a dark effect so as to prevent the external light from being projected on the display unit of the inspection terminal 121.

When the inspection member 122 captures a driving image reproduced from the display unit 121b of the inspection terminal 121, the control unit 150 connected to the inspection member 122 reads the driving image to determine the defective and good products of the AP chip. Can be distinguished.

The control unit 150 may be connected to the inspection terminal 122 to determine whether the AP chip is installed in the inspection terminal 121. In this case, It also recognizes.

5, the control unit 150 may include a recognition unit 151, an acquisition unit 152, and a determination unit 153. [

The recognition unit 151 is connected to the inspection terminal 121 and recognizes that the AP chip is embedded in the inspection terminal 121. The recognition unit 151 drives the driving unit (not shown) of the inspection terminal 121 to display the driving image corresponding to the driving of the functions included in the AP chip as the display unit 121b.

The acquiring unit 152 acquires and stores the driving image of the inspection terminal 121 that is connected to the inspection member 122 and is photographed by the inspection member 122.

The determining unit 153 is for determining whether the inspection object is good or bad based on the driving image stored in the obtaining unit 152. The determining unit 153 may determine whether the inspection object is good or not, Information is pre-set.

Accordingly, the determining unit 153 can compare the information extracted from the obtained driving image with the predetermined good-quality information to determine whether the functions included in the AP chip are good or bad. The information extracted from the driving image may correspond to the good information and may be a phenomenon generated when the driving image is reproduced.

In particular, the good quality information preset in the determining unit 153 may be information on the functions included in the AP chip. For example, the AP chip includes functions such as initial setting (screen lock, Wi-Fi, GPS, Bluetooth, etc.), camera, music, moving picture, calculator and the like. Respectively.

Here, the good information for each function is an example, and the initial setting can be set as to whether there is no screen pattern touch or screen movement pause, and the camera is set as to whether the front camera mode, the rear camera mode, The music can be set for the sound quality of the sound, and the moving picture can be set for the stop of the picture.

Further, the AP chip good product information further includes a phenomenon in which the reproduction of the driving image is stopped due to the driving of the functions included in the AP chip to be inspected, the phenomenon in which the reproduction of the driving image is stopped and is reproduced again, Whether or not the driving of the function is properly driven, and so on.

In addition, the good product information may include an allowable range that can be released as a product for each function. Here, the allowable range is a range in which a defect can be determined for each function, and may include a time for which a driving image is stopped and then reproduced, a degree of residual image, and a reaction time depending on driving of the driving image. This permissible range can not be determined by human eyes.

For example, when a moving image is reproduced, the moving image is stopped and then reproduced again. If the moving time is within a permissible range, it is determined to be defective.

Thus, if the driving images of the AP chip to be inspected are within the allowable range of predetermined good-quality information, it is determined to be good, and if it is out of the allowable range, it is determined to be bad.

On the other hand, the allowable range according to one embodiment of the present invention is an example, and is not limited thereto. In addition, predetermined good quality information can be changed appropriately according to the AP chip specification desired by the operator. Accordingly, the operator can change and set the information in the control unit according to the AP chip specification, and then perform the AP chip inspection in the AP chip inspection apparatus.

A plurality of AP chip inspection apparatuses 120 having such a configuration may be provided on one side of the AP chip inspection system 100. At this time, the plurality of AP chip inspection apparatuses 120 are arranged in a matrix. In one embodiment of the present invention, the AP chip inspection apparatuses 120 are arranged in four rows in the first direction and in three rows in the second direction .

The AP chips C placed on the tray T disposed on the work member 112 of the supply unit 110 are sequentially arranged in the plurality of AP chip inspection apparatuses 120 and the plurality of AP chip inspection apparatuses 120 ) Of the AP chips in the order in which the AP chips are placed.

As shown in FIG. 6, when a plurality of AP chip inspection apparatuses 120 are provided, a plurality of control units 150 for acquiring and discriminating images captured by the AP chip inspection apparatus 120 are provided. That is, a plurality of control units 150 are provided corresponding to the number of AP chip inspection apparatuses 120 installed, and a plurality of AP chip inspection apparatuses 120 and a plurality of control units 150 are matched and connected one to another.

The plurality of control units 150 are connected to one central control unit 160 and the operator can visually confirm AP chip performance of a plurality of AP chip inspection apparatuses 120 provided in the central control unit 160. [

The controller and the central controller according to an embodiment of the present invention may use a computer including a monitor to store and identify information and to visually confirm the information.

A method of inspecting the AP chip inspection apparatus 120 having the above-described configuration will be briefly described. According to the AP chip drive being the inspection target in the inspection terminal 121, a driving image according to the operation of the functions included in the AP chip is reproduced And the discriminating unit 153 compares the good image information stored for each function with the driving image to discriminate good products or defects.

More specifically, as shown in FIG. 7, as the AP chip to be inspected is driven in the inspection terminal 121, a driving image corresponding to the driving of the functions included in the AP chip to be inspected is reproduced on the display unit 121b (S110 ).

Then, the inspection member 122 captures a driving image reproduced on the display unit 121b of the inspection terminal 121 (S120). At this time, the driving image photographed by the inspection member 122 is stored in the acquisition unit 152 of the control unit 150 (S130).

The acquiring unit 152 stores the driving image of the AP chip to be inspected acquired through the inspection member 122 and transmits the driving image to the determining unit 153. [

Then, the determining unit 153 compares the driving image of the functions received from the obtaining unit 152 with predetermined good quality information set in the determining unit 153 (S140).

For example, when the moving image is stopped for a predetermined time (T1) or longer and then regenerated again in the video performance test of the moving image among the AP chip functions to be inspected, the determining unit 153 determines whether the moving image stored in the obtaining unit And compares the information extracted from the image or the driving image.

At this time, if the driving of the moving image received from the obtaining unit is out of the allowable range of the good quality information set in the determining unit 153, it is determined that the AP chip to be inspected is defective (S160). That is, if the predetermined time T1 in which the moving image is stopped falls within the allowable range of the good information, it is determined that the product is good (S170), and if it is out of the acceptable range of the good information (S160).

In addition, the control unit 150 determines that the AP chip to be inspected is defective even if one function of the AP chip functions to be inspected is judged to be defective and the other functions are judged to be defective.

All of the information is transmitted to the central control unit 160. The central control unit 160 can display the inspection progress of a plurality of AP chips being inspected by the plurality of AP chip inspection apparatuses 120 so that they can be visually confirmed.

More specifically, the information determined by the determination unit 153 is displayed on the monitor of the central control unit 160. [ On the monitor of the central control unit 160, each of the AP chips to be inspected is indicated as inspection pass or failure. Through this display, the operator can separate the AP chip into good or defective AP chips.

Accordingly, it is possible to determine which of the plurality of AP chip inspection apparatuses 120 of the worker is defective in the AP chip inspection apparatus 120 which is being driven, and furthermore, Can be confirmed.

According to the present invention, an inspection member for inspecting an image to be reproduced in the inspection terminal is disposed on an upper side of an inspection terminal for driving an AP chip to reproduce an image, and a control unit connected to the inspection member reads an image, It is possible to accurately and easily identify good products.

When the AP chip performance test is completed, the AP chips are moved to the discharge unit 130 through the transfer unit 140 in the order of completion of the performance check.

The discharging unit 130 determines whether the AP chip is good or defective according to the performance of the tested AP chip, and separates and discharges the AP chip determined to be good or defective.

For this purpose, the discharge portion 130 may include a defective work member 132, a good work member 131, a defective discharge member 135, a good discharge member 134, and a second movable member 137.

The defective work member 132 is collected by the AP chip inspection apparatus 120 and the AP chips C determined to be defective. The vacant tray T is disposed in the poor workpiece 132 and the AP chips C determined to be defective in the empty tray T are seated.

When collection of the AP chips C is completed in the empty tray T, the second moving member 137 moves to the defective discharging member 135 and is discarded.

In addition, the AP chips determined to be good in the AP chip inspection apparatus 120 are collected in the good work member 131. An empty tray (T) is disposed on the good work member (131), and AP chips judged to be good are placed on the empty tray (T). When the collection of the AP chips in the empty tray T is completed, the second moving member 137 moves to the good product discharging member 134. [

The second moving member 137 moves the empty tray to the defective working member 132 and the good working member 131 or moves the AP chip to the tray disposed in the defective working member 132 and the good working member 131 The defective discharging member 135 and the good discharging member 134 can be moved.

The second moving member 137 includes a pair of second moving rails 137a spaced apart at regular intervals and a second moving plate 137b reciprocating along the first moving direction along the second moving rail 137a ).

The defective working member 132 and the good working member 131 are disposed on one side of the pair of second moving rails 137a and the defective discharging member 135 is disposed on the other side of the pair of second moving rails 137a. And a good discharge member 134 are located.

A tray supply member 111 for supplying an empty tray T may be disposed between the defective discharge member 135 and the good discharge member 134.

The transfer unit 140 may transfer the AP chip from the supply unit 110 to the AP chip inspection apparatus 120 or may transfer the AP chip inspected by the AP chip inspection apparatus 120 to the discharge unit 130.

At this time, the transfer unit 140 transfers the grip unit 141 for gripping the AP chip, the first direction transfer member 142 for transferring the grip unit 141 in the first direction, and the grip unit 141 in the second direction And a second direction feeding member 143 for feeding the second direction.

The grip portion 141 is for gripping the AP chip and is coupled to the first direction transfer member 142 and moves in the first direction along the first direction transfer member 142.

8, the grip portion 141 includes a housing 144 that moves along the first direction transfer member 142, a vertical moving member 145 coupled to one end of the housing 144, And an adsorption member 146 that moves up and down along the adsorption member 145 to adsorb the AP chip.

At this time, an adsorption sensor 149 for sensing the adsorption pressure for adsorbing the AP is installed on the upper side of the housing 144, and an adsorption member 146 is disposed on one side of the housing 144, And a position confirmation monitoring member 148 for monitoring the position of the suction member 146 to be adsorbed is provided.

When the adsorption member 146 adsorbs the AP chip, the position confirmation monitoring member 148 confirms the position of the input member 124 to which the AP chip is to be inserted, and the adsorption detection sensor 149 detects the position of the adsorption member 146 The adsorption pressure is sensed.

A rotating member 147 for moving the adsorption member 146 up and down along the vertical moving member 145 and correcting the position of the AP chip may be coupled to the upper portion of the adsorption member 146.

More specifically, a suction member 146 capable of suctioning the AP chip can be coupled to the lower end of the rotary member 147. [ The rotary member 147 is slidably coupled in the up / down direction along the vertical moving member 145, and the suction member 146 can be moved in the up / down direction.

Further, the rotary member 147 can be rotated in the horizontal direction in the upward / downward movement by the rotation shaft. That is, as the rotary member 147 rotates in the horizontal direction, the suction member 146 can be rotated in the horizontal direction.

This is to correct the position of the AP chip adsorbed on the adsorption member 146. [ That is, when the AP chip is adsorbed in the twisted state without being adsorbed at the correct position on the adsorption member 146, the AP chip is unstably injected into the input member 124. In order to prevent this, the position of the AP chip to be adsorbed to the adsorption member 146 can be corrected by rotating the rotary member 147.

The position correction monitoring member 170 for confirming whether the AP chip is sucked to the correct position on the sucking member 146 may be positioned between the working member 112 of the supplying unit 110 and the AP chip inspecting apparatus 120 have.

The operation method of the rotation member 147 and the position correction monitoring member 170 will be briefly described. The operator confirms whether the AP chip is adsorbed at the correct position of the adsorption member 146 through the position correction monitoring member 170 .

At this time, when it is confirmed that the AP chip is adsorbed in the twisted state without being adsorbed at the correct position of the adsorption member 146 in the position correction monitoring member 170, the AP chip is inserted into the input member 124, The position of the AP chip can be corrected by rotating the adsorption member 146 by the adsorption member 147.

On the other hand, the first direction feeding member 142 extends in the first direction with the guide rail, and the second direction feeding member 143 extends in the second direction perpendicular to the first direction with the guide rails. At this time, the second direction feeding members 143 are vertically arranged at both ends of the first direction feeding member 142 in pairs.

The feeding operation according to this configuration will be briefly described as an example in which the AP chip of the supply unit 110 is transferred to the AP chip inspection apparatus 120. [

First, the gripper 141 moves along the first direction transfer member 142 to the work member 112 of the supply unit 110. [ The rotary member 147 of the grip portion 141 moves downward along the upper and lower movable members 145 and the suction member 146 coupled to the lower portion of the rotary member 147 is placed on the tray T AP chip is adsorbed. Thereafter, the rotary member 147 moves upward along the upper and lower movable members 145 in a state in which the AP chip is attracted by the suction member 146.

The first direction transfer member 142 is configured to transfer a pair of the AP chip inspection devices 120 arranged in a matrix in a second direction in which arbitrary AP chip inspection devices 120 into which the adsorbed AP chips are to be inserted, And moves along the second direction transfer member 143 of the second direction.

Thereafter, the gripper 141 moves on the AP chip inspection apparatus 120 along the first direction transfer member 142. The rotating member 147 descends along the vertical moving member 145 toward the input member 124 of the AP chip inspection apparatus 120 and the AP chip sucked by the suction member 146 is seated on the input member 124 And then rise again.

Therefore, in order to inspect the performance of the AP chip, the AP chip inspection is continuously automated by configuring a supply unit for supplying the AP chip, an inspection apparatus for inspecting the AP chip, and a discharge unit for discharging the inspected AP chip The working efficiency can be improved.

In addition, the performance test of the AP chip can accurately distinguish the good and bad of the AP chip by the control part and the control part in which the program is stored.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

100: AP chip inspection system 110:
111: supply member 112: work member
113: first moving member 114: exhaust member
120: AP chip inspection device 121: inspection terminal
122: inspection member 123: blocking member
124: input member 125: pressing member
130: discharge part 131: good work piece
132: poor working member 134: good output member
135: defective discharge member 136: tray supply member
137: second moving member 140:
141: grip part 142: first direction conveying member
143: second direction conveying member 144: housing
145: Shanghai easel material 146:
147: Rotating member 148: Positioning monitoring member
149: Adsorption detection sensor 150:
160: central control unit 170: position correction monitoring member

Claims (18)

An inspection terminal for displaying a driving image according to driving of functions included in an AP chip as a performance inspection target;
An inspection member which is spaced apart from the upper side of the inspection terminal and photographs the driving image displayed on the inspection terminal;
A blocking member surrounding the test member and the outer side of the inspection terminal for blocking external light; And
And a controller for acquiring a driving image of functions included in the AP chip to be inspected through the inspection member and discriminating performance of functions included in the AP chip to be inspected through the obtained driving image,
Wherein the control unit compares favorable information on the functions included in the AP chip with the driving image of the functions included in the AP chip to be inspected acquired by the inspection member, An AP chip inspection apparatus formed to discriminate defective and good products of an AP chip as a target. The method according to claim 1,
An insertion member in which the AP chip is seated and inserted into an opening formed in one side of the inspection terminal; And
And a pressing member for pressing the input member such that the input member on which the AP chip is mounted is inserted into the opening of the inspection terminal. 3. The method of claim 2,
The pressing member
A pressing plate for pushing the input member; And
And a drive cylinder for moving the pressure plate toward the input member. The method according to claim 1,
The control unit
An acquiring unit acquiring and storing the driving image through the inspection member; And
And a discrimination unit for comparing good quality information with the AP chip and comparing the driving image with the good quality information to discriminate defective and good products of the AP chip. The method according to claim 1,
Wherein the good quality information includes an allowable range for determining good products and defects of functions included in the AP chip to be inspected. 6. The method of claim 5,
The permissible range includes a range in which the failure of the functions included in the AP chip to be inspected can be determined and includes a time for which the driving video is stopped and then replayed, a remaining amount of the residual image, and a reaction time for driving the driving video AP chip inspection device. The method according to claim 1,
The inspection terminal
A case in which an opening through which the AP chip is input and output is formed on one side;
A driving unit for driving the AP chip; And
And a display unit for displaying an image reproduced by the operation of the AP chip driven by the driving unit. A supply unit for supplying a tray on which a plurality of AP chips are placed;
A plurality of AP chip inspection devices according to any one of claims 1 to 7 for checking the performance of a plurality of AP chips mounted on the tray;
A discharger for discharging the plurality of AP chips that have been inspected from the plurality of AP chip inspection devices to the outside; And
And a transfer unit for transferring the AP chip from the supply unit to the AP chip inspection apparatus and transferring the AP chip from the AP chip inspection apparatus to the discharge unit. 9. The method of claim 8,
The supply part
A supply member to which a plurality of trays on which the plurality of AP chips are mounted are supplied;
A workpiece spaced from the supply member and supplied with one of the plurality of trays;
A first moving member connecting the supplying member and the working member to move the tray loaded on the supplying member to the working member; And
And a discharge member for discharging the empty tray after a plurality of AP chips disposed on the tray supplied to the workpiece are transferred to the AP chip inspection apparatus. 9. The method of claim 8,
The outlet
A defective work member in which a defective AP chip is disposed among the AP chips tested by the AP chip inspection apparatus;
A good quality workpiece on which the good AP chip is disposed among the AP chips tested by the AP chip inspection apparatus;
A defective discharge member for discharging the AP chip disposed in the defective working member;
A good product discharge member for discharging the AP chip disposed in the good work member; And
And a second moving member for moving the AP chip supplied to the defective work member and the good work member to the defective discharge member and the good discharge member. 9. The method of claim 8,
Wherein the plurality of AP chip inspection devices are arranged in a matrix. 9. The method of claim 8,
The conveying portion
A gripper for gripping the AP chip;
A first direction transfer member for moving the grip portion in a first direction; And
And a second direction feeding member for moving the grip portion in a second direction perpendicular to the first direction. 13. The method of claim 12,
And a position correction monitoring member disposed between the transfer unit and the AP chip inspection apparatus to confirm a grip position of the AP chip held by the grip unit. 13. The method of claim 12,
The gripping portion
A housing moving along the first direction transfer member;
A vertically movable member coupled to one side of the housing;
A rotatable member moving in the up / down direction along the up / down moving member and rotatable in the horizontal direction in the up / down movement direction; And
And an adsorption member coupled to one end of the rotary member to adsorb the AP chip,
Wherein the rotating member is configured to rotate the adsorption member to correct an adsorption position of the AP chip adsorbed on the adsorption member. 9. The method of claim 8,
The plurality of AP chip inspection apparatuses are connected to a central control unit,
Wherein the central control unit confirms the progress of the inspection of AP chips being inspected in progress in the plurality of AP chip inspection devices. Reproducing a driving image according to driving of functions included in an AP chip to be inspected on a display unit of an inspection terminal;
Photographing the driving image reproduced on the display unit of the inspection terminal by an inspection member;
Storing the driving image photographed by the inspection member in an acquisition unit of the control unit; And
And comparing the driving image with predetermined good information set in the determination unit to discriminate the AP chip to be inspected as good and defective. 17. The method of claim 16,
Wherein the good quality information preset in the determining unit includes an AP chip including a permissible range for determining good and defective of each function contained in the AP chip to be inspected, method of inspection. 18. The method of claim 17,
The permissible range includes a range in which the failure of the functions included in the AP chip to be inspected can be determined and includes a time for which the driving video is stopped and then replayed, a remaining amount of the residual image, and a reaction time for driving the driving video AP chip inspection method.

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