KR101822482B1 - Insulated Packaging type Thermoelectric Module - Google Patents

Abstract

An insulation packaging-type thermoelectric module according to the present invention comprises: an insulation packaging box (40) which is provided with a sealed-type box space (40A) for accommodating a thermoelectric element (10) converting a temperature difference into electric energy; an insulation wall (50) which is formed in the insulation packaging box (40) to expand the box space (40A) to an insulation space (50A) not filled with the thermoelectric element (10); an insulation substrate (20) which includes a high-temperature upper insulation substrate (20-1) and a low-temperature lower insulation substrate (20-2), and is accommodated in the box space (40A) together with the thermoelectric element (10); and an electrode which withdraws electricity generated from the thermoelectric element (10). Accordingly, the insulation effect by the insulation wall (50) can resolve the difficulty in maintaining a temperature difference between both ends of the existing packaging-type thermoelectric element (10). Particularly, a vacuum space is formed in the insulation wall (50), thereby maintaining a high insulation effect even in a high-temperature outside environment.

Description

[0001] The present invention relates to an insulated packaging type thermoelectric module,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermoelectric module, and more particularly, to a thermoelectric module to which a heat insulating structure is applied to a hermetically sealed package.

Generally, a thermoelectric element that converts a temperature difference into an electrical energy and an electrical energy into a temperature difference is classified into a p-type thermoelectric element (thermal energy transfer by hole transfer) and an n-type thermoelectric element (thermal energy transfer by electron transfer) It is processed into a bulk material having a size of several mm to 500 μm and made into a thermoelectric module.

For example, the thermoelectric module can be manufactured by bonding a bulk type thermoelectric element to an electrode and a substrate by using a pn thermoelectric element, an upper / lower insulating substrate and an electrode as constituent elements, or by directly forming a paste type thermoelectric element on an electrode and a substrate Or by coating a sputtering type thermoelectric element on an electrode and a substrate.

In particular, the thermoelectric module is further provided with a molding method or a packaging method, thereby preventing the device characteristics from disappearing or breaking due to oxidation due to high temperature exposure. Here, the molding method is a structure in which the side surface of the thermoelectric module is molded using silicon or the like in order to block the contact of the thermoelectric element with oxygen, and the packaging method is a structure in which the thermoelectric module is packaged in a sealed structure using metal or the like. Therefore, the packaging method is applied to the thermoelectric module for high temperature.

Therefore, the thermoelectric module is a sealed structure of a molding method and a packaging method, and electric power generation is performed by using the temperature difference of the thermoelectric elements integrated with the electrodes while avoiding high temperature exposure which makes device characteristics disappear.

Domestic Registration Utility Model Bulletin 20-0447536 (Jan. 25, 2010)

However, the molding method has a fundamental limitation that can not be applied to a high temperature by molding the side surface of the thermoelectric module using silicon or the like.

In addition, the packaging method has a high temperature applicability by packaging in a sealed structure using metal or the like, but the thermoelectric module is entirely heated by the packaging, and as a result, it is difficult to maintain the temperature difference between the both ends of the thermoelectric device, so that the electromotive force can not be weakened.

The present invention has been made in view of the above problems and it is an object of the present invention to provide a sealing structure using a metal having a heat insulating layer to prevent contact with oxygen and to solve difficulties in maintaining a temperature difference between both ends of a thermoelectric element, It is an object of the present invention to provide an adiabatic packaging type thermoelectric module which is also simplified.

In order to accomplish the above object, the present invention provides a thermoelectric packaging type thermoelectric module, including: an insulating packaging box having a closed box space in which a thermoelectric element for converting a temperature difference into electric energy is accommodated; A round type heat insulating wall formed in the heat insulating packaging box and extending the box space into a heat insulating space not filled with the thermoelectric element; An insulating substrate, which is divided into a high-temperature upper insulating substrate and a low-temperature lower insulating substrate, which is coupled to the thermoelectric element and is accommodated in the box space; An electrode for drawing electricity generated from the thermoelectric element; .

In a preferred embodiment, the round type heat insulating wall is formed integrally with the heat insulating packaging box so as to protrude from the side of the heat insulating packaging box to form the heat insulating space.

In a preferred embodiment, the round-shaped heat insulating wall has a thickness to form an arc-shaped insulating layer of a vacuum space. Each of the round type heat insulating wall and the arcuate heat insulating layer has a semicircular shape.

According to another aspect of the present invention, there is provided an adiabatic packaging-type thermoelectric module including: a heat-insulating packaging box having a closed box space for accommodating thermoelectric elements for converting a temperature difference into electric energy; A rectangular heat insulating wall formed in the heat insulating packaging box and extending the box space into a heat insulating space not filled with the thermoelectric element; An insulating substrate, which is divided into a high-temperature upper insulating substrate and a low-temperature lower insulating substrate, which is coupled to the thermoelectric element and is accommodated in the box space; An electrode for drawing electricity generated from the thermoelectric element; .

In a preferred embodiment, the rectangular heat insulating wall is formed integrally with the heat insulating packaging box so as to protrude from the side of the heat insulating packaging box to form the heat insulating space.

In a preferred embodiment, the rectangular wall has a thickness to form a linear heat insulating layer in the vacuum space. The rectangular heat insulating wall has a rectangular shape, and the linear heat insulating layer has a straight shape.

The thermoelectric module of the present invention realizes the following advantages and effects by applying the heat insulation packaging method.

First, the sealing structure is diversified by applying the vacuum packaging method to maintain the temperature difference between the thermoelectric elements and to block the contact with oxygen. Second, although it is suitable for high temperature, it can solve all the disadvantages of the packaging method using the metal material which has difficulty in maintaining the temperature difference by heating the thermoelectric module. Third, by applying a thermal insulation layer to the metal material, it is possible to prevent the electromotive force of the thermoelectric module from weakening without substantially changing the conventional packaging method. Fourth, it is possible to simplify the structure by forming a heat insulating layer of a metal material in a vacuum to prevent heat transfer. Fifth, by changing the vacuum insulating layer to various shapes, the appearance design of the thermoelectric module is diversified, and the product variety is improved by the design variety.

1 is a block diagram of an adiabatic packaging type thermoelectric module according to the present invention. FIG. 2 is a cross-sectional view of an adiabatic packaging box according to the present invention, FIG. 3 is a heat insulating operation state of the adiabatic packaging box applied to the thermoelectric module according to the present invention, and FIG. 4 is a modification of the adiabatic packaging thermoelectric module according to the present invention .

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, which illustrate exemplary embodiments of the present invention. The present invention is not limited to these embodiments.

1 to 3 show a round thermoelectric module 1 according to a first embodiment of the present invention.

1, the heat-insulating packaging thermoelectric module includes a thermoelectric element 10, an insulating substrate 20, an electrode 30, an insulating packaging box 40, and a heat insulating wall 50 as constituent elements, Type thermoelectric module 1 by forming the wall 50 into a round shape. Therefore, the round thermoelectric module 1 includes the thermoelectric elements 10, the insulating substrate 20, the electrodes 30, the heat insulating packaging box 40, and the first and second round heat insulating walls 50-1 and 50-2 ).

Specifically, the thermoelectric element 10 converts the temperature difference to electrical energy and the electrical energy to a temperature difference. For example, the thermoelectric element 10 is processed into a bulk material having a size of several mm to 500 m, and the p-type thermoelectric element (thermal energy transfer due to hole movement) and the n-type thermoelectric element Lt; RTI ID = 0.0 > thermoelectric < / RTI >

Specifically, the insulating substrate 20 is composed of an upper insulating substrate 20-1 and a lower insulating substrate 20-2. The upper insulating substrate 20-1 is sandwiched between upper portions of the thermoelectric elements 10, And the lower insulating substrate 20-2 is bonded to the lower portion of the thermoelectric element 10 to form a relatively low temperature. Therefore, the space between the upper insulating substrate 20-1 and the lower insulating substrate 20-2 is filled with the thermoelectric element 10. For example, the integration of the upper and lower insulating substrates 20-1 and 20-2 and the thermoelectric element 10 can be performed either directly with the electrode 30 or coated with the electrode 30, Or by vacuum mounting using electrostatic bonding.

Specifically, the electrode 30 is composed of a terminal 30-1 and a positive terminal 30-2 and is connected to the coal crystal element 20 to lead to a power terminal (not shown) of the heat insulating packaging box 40 , The electric energy generated by the temperature difference of the thermoelectric element (10) is taken out.

Specifically, the adiabatic packaging box 40 includes a box space 40A (see FIG. 2) in an enclosed rectangular box shape, and an insulating substrate (not shown) integrated with the thermoelectric element 10 20 are accommodated.

Specifically, the first and second round type heat insulating walls 50-1 and 50-2 are provided in the box space 40A of the heat insulating packaging box 40 with a heat insulating space 50A (not shown) filled with the thermoelectric elements 10 2). For this, the first and second round heat insulating walls 50-1 and 50-2 are formed integrally with the heat insulating packaging box 40 by being formed by side deformation of the heat insulating packaging box 40. Particularly, the first and second round type heat insulating walls 50-1 and 50-2 are formed on two sides of the side surface of the heat insulating packaging box 40 so as to face each other, have.

2, the first round heat insulating wall 50-1 has a semi-circular structure protruding from the heat insulating packaging box 40, so that the heat insulating layer 50-1 is formed in the box space 40A occupied by the thermoelectric element 10, (50A) is further formed. Particularly, the first round type heat insulating wall 50-1 has a semi-circular structure in which an arc-shaped insulating layer 51 is formed as a hollow space in a semicircular shape, and the arc-shaped insulating layer 51 is formed in a heat- 50A). ≪ / RTI > If desired, the arc-shaped insulating layer 51 may be filled with a heat insulating material instead of a vacuum. The second round type heat insulating wall 50-2 is formed in the same structure and has the same structure as the first round heat insulating wall 50-1 to form the heat insulating space 50A and the arcuate heat insulating layer 51 .

Therefore, each of the first and second round heat insulating walls 50-1 and 50-2 extends the box space 40A of the heat insulating packaging box 40 through the heat insulating space 50A, ) To form an external heat blocking effect by vacuum.

The first and second round type heat insulating walls 50-1 and 50-2 may be manufactured in various ways but are manufactured together using the thickness of the heat insulating packaging box 40. [ For example, the arc-shaped insulation layer 51 is formed in vacuum at two positions in the process of forming the insulation packaging box 40 with a predetermined thickness by a rectangular plate, and then the arc-shaped insulation layer 51 is formed on the left and right sides The heat insulating packaging box 40 is folded into a rectangular box shape so that the first and second round heat insulating walls 50-1 and 50-2 are formed. And the lower insulating substrates 20-1 and 20-2 are enclosed in the box space 40A.

In particular, the first and second round heat insulating walls 50-1 and 50-2 may be made of various materials, but SUS-based metal materials which are not easily oxidized while maintaining a high thermal conductivity are applied.

3, the box space 40A of the heat insulating packaging box 40 and the heat insulating space 50A of the first and second round heat insulating walls 50-1, Lt; RTI ID = 0.0 > temperature. At the same time, the arc-shaped heat insulating layer 51 of the first and second round heat insulating walls 50-1 and 50-2 blocks the heat transfer phenomenon between the internal temperature and the external temperature by the heat insulating action by the vacuum, Temperature thermoelectric module 1 is prevented from rising in temperature.

As a result, the internal temperature of the box space 40A and the heat insulating space 50A is maintained at a temperature difference at which the thermoelectric conversion element 10 is not raised to a high temperature causing the oxidation of the thermoelectric conversion element 10. Therefore, the round thermoelectric module 1 can perform normal power generation without deteriorating the electromotive force even in an extreme temperature environment.

Meanwhile, FIG. 4 shows a rectangular thermoelectric module 1-1 according to a second embodiment of the present invention.

As shown in the figure, the heat insulating packaging type thermoelectric module includes the thermoelectric element 10, the insulating substrate 20, the electrode 30, the heat insulating packaging box 40 and the heat insulating wall 50 as constituent elements, The thermoelectric module 50 is formed into a quadrangle to be a rectangular thermoelectric module 1-1. Therefore, the rectangular thermoelectric module 1-1 includes the thermoelectric element 10, the insulating substrate 20, the electrode 30, the heat insulating packaging box 40, and the first and second rectangular heat insulating walls 50-3 and 50- 4).

Specifically, the thermoelectric transducer 10, the insulating substrate 20, the electrode 30, and the heat-insulating packaging box 40 are the same as the components of the round thermoelectric module 1 described with reference to FIGS. same.

Specifically, the first and second rectangular heat insulating walls 50-3 and 50-4 are formed in the insulating space 50A extending the box space 40A of the heat insulating packaging box 40, 50-1 and 50-2 described in the first and second embodiments. However, the first and second rectangular heat insulating walls 50-3 and 50-4 are different from the semicircular arch-shaped heat insulating layer 51 by forming a vacuum space with the linear heat insulating layer 51-1. In particular, the linear heat insulating layer 51-1 is formed in a " C "shape to form a heat insulating effect on the entire heat insulating space 50A.

Therefore, the square thermoelectric module 1-1 also realizes the temperature difference maintenance, the oxidation prevention, and the prevention of the electromotive force reduction of the round thermoelectric module 1 described with reference to FIGS.

As described above, the heat-insulating packaging type thermoelectric module according to the present embodiment includes the heat-insulating packaging box 40 in which the sealed box space 40A accommodating the thermoelectric element 10 for converting the temperature difference into electric energy is formed, The heat insulating wall 50 formed in the heat insulating packaging box 40, the high temperature upper insulating substrate 20-1 and the low temperature lower insulating substrate 20A are formed so as to extend the box space 40A into the heat insulating space 50A not filled with the heat insulating film 50A, An insulating substrate 20 made of a thermoelectric element 20-2 and accommodated in a box space 40A together with the thermoelectric element 10 and an electrode 30 for drawing out electricity generated in the thermoelectric element 10, 50, the difficulty in maintaining the temperature difference between the opposite ends of the thermoelectric element 10 of the conventional packaging method is solved. In particular, a high-temperature insulating effect is maintained even in an external high temperature environment by forming a vacuum space in the heat insulating wall 50.

1: Round type thermoelectric module 1-1: Rectangular thermoelectric module
10: thermoelectric element 20: insulating substrate
20-1, 20-2: upper and lower insulating substrates
30: electrode 30-1: - terminal
30-2: + Terminal 40: Insulation packaging box
40A: box space 50: insulating wall
50-1, 50-2: 1st and 2nd round type heat insulating walls
50-3, 50-4: 1st and 2nd rectangular wall
50A: Insulating space 51: Arched insulating layer
51-1: Straight insulation layer

Claims (11)

An insulating packaging box in which a sealed box space is formed in which a thermoelectric element for converting a temperature difference to electric energy is accommodated;
And a heat insulating wall formed in the heat insulating packaging box and extending the box space into a heat insulating space not filled with the thermoelectric element,
Wherein the heat insulating wall has a thickness that forms a heat insulating layer as an empty space.
The heat insulating packaging type thermoelectric module according to claim 1, wherein the heat insulating wall is formed integrally with the heat insulating packaging box.
The heat insulating packaging type thermoelectric module according to claim 2, wherein the heat insulating wall protrudes from a side surface of the heat insulating packaging box to form the heat insulating space.
The heat insulating packaging type thermoelectric module according to claim 1, wherein the heat insulating wall is made of a metal.
delete The heat insulating packaging type thermoelectric module according to claim 1, wherein the heat insulating layer is a vacuum space.
The heat-insulating packaging type thermoelectric module according to claim 1, wherein the heat insulating wall and the heat insulating layer are each semicircular.
The heat insulating packaging type thermoelectric module according to claim 1, wherein the heat insulating wall has a rectangular shape, and the heat insulating layer has a straight shape.
The heat-insulating packaging type thermoelectric module according to claim 8, wherein the linear shape is a "C" shape.
The thermoelectric module according to claim 1, wherein the thermoelectric element is coupled to an insulating substrate accommodated in the box space and connected to an electrode for drawing out the generated electricity.
[Claim 11] The thermoelectric module of claim 10, wherein the insulating substrate is composed of an upper insulating substrate forming a high temperature and a lower insulating substrate forming a relatively low temperature.

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