KR101818468B1 - Manufacturing method of display device - Google Patents

Abstract

The present invention relates to a method of manufacturing a display device capable of preventing scratches or damage to an etchant caused in a subsequent process, and a method of manufacturing a display device according to the present invention includes the steps of: Forming a shielding film on the touch array; forming a color filter array on the back surface of the upper substrate; bonding the upper substrate and the lower substrate on which the thin film transistor array is formed; Removing the shielding film attached on the touch array, and attaching the cover glass and the liquid crystal panel to each other. The method of manufacturing the touch screen of the present invention includes the steps of: .

Description

TECHNICAL FIELD [0001] The present invention relates to a manufacturing method of a display device,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a display device, and more particularly, to a method of manufacturing a display device capable of preventing scratches or damage to an etchant generated during a subsequent process.

A display device for displaying an image includes a cathode ray tube, a liquid crystal display (LCD), a plasma display panel (PDP), an electroluminescence display device (ELD) And an electroluminescence field display device.

Here, the liquid crystal display device displays an image by adjusting the light transmittance of the liquid crystal using an electric field. To this end, the liquid crystal display device includes a liquid crystal panel having a liquid crystal cell, a backlight unit for emitting light to the liquid crystal panel, and a driving circuit for driving the backlight unit and the liquid crystal cell.

When a surface of a liquid crystal panel is pressed by a pointer (user's finger), a demand for a display device using a touch panel for inputting information corresponding to the position is increasing. The touch panel integrated display device is divided into a resistance method, a capacitance method, and an infrared sensing method according to a touch sensing method. Recently, a capacitance method has been attracting attention in consideration of ease of manufacturing method and sensing power. Such a touch panel integrated type display device has an add-on type display device in which a touch array sensed by an electrostatic capacity type is formed on the back surface of a cover glass, and an on-cell type display device or the like in which a touch array is formed on a liquid crystal panel have.

The touch array includes a first sensor electrode pattern portion for sensing the capacitance in the X-axis direction and a second sensor electrode pattern portion for sensing the capacitance in the Y-axis direction.

The first sensor electrode pattern portion includes a plurality of first sensor electrodes formed in the X-axis direction and a bridge connecting the first sensor electrodes adjacent to each other through the contact holes. The second sensor electrode pattern portion includes a plurality And a connection unit connecting the second sensor electrodes and the second sensor electrodes adjacent to each other.

On the other hand, the step of forming the on-cell type display device includes a step of forming a touch array on the front surface of the upper substrate, a step of forming a color filter array on the back surface of the upper substrate, Forming a liquid crystal panel by cementing, a cleaning step, an FPC attaching step, and a cover glass and liquid crystal panel laminating step.

As described above, after the touch array is formed, the touch array is damaged by scratches, etchants, or the like by subsequent processes. In other words, when the color filter array is formed on the back surface of the upper substrate on which the touch array is formed, the touch array may be damaged by an etchant or the like and may be cleaned with a polishing cloth or a brush, or the touch array may be damaged .

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and it is an object of the present invention to provide a method of manufacturing a display device capable of preventing damage to a scratch or etchant generated during a subsequent process.

Forming a touch array on the front surface of the upper substrate; forming a shielding film on the touch array; forming a color filter array on the back surface of the upper substrate; Attaching an FPC to a front surface of the upper substrate, removing the shielding film attached on the touch array, and removing the shielding film from the upper substrate. And attaching the cover glass and the liquid crystal panel to each other.

The step of forming a touch array on the front surface of the upper substrate includes first sensor electrodes formed in parallel on a front surface of the upper substrate in a first direction to sense a position in a first direction, A second sensor electrode pattern part including a bridge for connecting the electrodes through the sensor contact hole and a second sensor electrode pattern part for sensing a position in a second direction formed in parallel to the first direction, A second sensor electrode pattern part connecting the adjacent second sensor electrodes and having a connection part formed on the same layer as the second sensor electrodes, a second sensor electrode pattern part connected to the first sensor electrodes, And a second routing line connected to the second sensor electrodes, first pad electrodes connected to the first routing line, second routing electrodes connected to the second routing line, It characterized in that it forms a touch array including a pad comprising a de electrode.

The first sensor electrodes, the second sensor electrodes, the bridge, the connection part, the first routing line, the second routing line, the first pad electrodes, and the second pad electrodes included in the touch array are formed of the soluble transparent electrodes, Solubel is characterized by being formed of a Soluble Ag Nano Wire and a Solube Carbon Nano Tube.

The forming of the shielding film on the touch array may include coating a shielding liquid on the touch array by a bar coating or a silk screen coating method, coating the shielding liquid and drying the shielding liquid, And forming the shielding film by drying the chemical solution.

The shielding agent solution is formed of a binder using Vinyl Resin derivatives and Epozy ether resin, and the binder is formed in an amount of 20 wt% to 40 wt% based on the liquid composition.

Also, the shielding agent solution is formed of at least one solvent selected from the group consisting of xylene, ethyl acetate, and methylethylketone (MEK), and the solvent is formed in an amount of 50 wt% to 70 wt% based on the liquid composition.

The shielding chemical liquid is characterized by using a pigment or a dye.

In addition, in the step of attaching the FPC to the entire surface of the upper substrate, the shielding film is removed only in a region to which the FPC is to be attached.

A method of manufacturing a display device according to the present invention includes the steps of attaching a reflective film on a front surface of a cover glass, forming a shielding film on the reflective film, forming a touch array on the back surface of the cover glass, A step of forming a shielding film on the touch array, a step of cleaning the back surface or the entire surface of the cover glass with a brush or a polishing cloth, a step of attaching an FPC to the back surface of the cover glass, Attaching the cover glass and the liquid crystal panel to each other, and removing the shielding film adhered on the reflective film.

The step of forming a shielding film on the reflective film and the step of forming a shielding film on the touch array may include coating the shielding agent solution by a bar coating or a silk screen coating method, And drying the shielding solution to form the shielding film.

The shielding agent solution is formed of a binder using Vinyl Resin derivatives and Epozy ether resin, and the binder is formed in an amount of 20 wt% to 40 wt% based on the liquid composition.

Also, the shielding agent solution is formed of at least one solvent selected from the group consisting of xylene, ethyl acetate, and methylethylketone (MEK), and the solvent is formed in an amount of 50 wt% to 70 wt% based on the liquid composition.

The shielding chemical liquid is characterized by using a pigment or a dye.

In addition, the step of attaching the FPC to the back surface of the cover glass may include peeling the shielding film only in the area to which the FPC is attached.

As described above, the manufacturing method of the display device according to the present invention can improve the sensing ability by preventing the scratch or etchant damage caused during the touch array subsequent process by attaching the shielding film on the touch array.

Further, in the FPC attaching step, there is no need to open the pad area by attaching the FPC to the upper substrate after removing the shielding film only to the pad area. That is, only necessary portions can be removed and the remaining sensor electrodes can be protected.

1 is an exploded perspective view showing a display device according to a first embodiment of the present invention.
Figure 2 shows a top view of the touch array shown in Figure 1;
FIG. 3 is a plan view showing an enlarged view of the area A shown in FIG. 2, and is an enlarged plan view of a routing part and an FPC pad part.
4 shows a cross-sectional view of the touch array shown in Fig.
5 is a flowchart illustrating a manufacturing process for manufacturing the display device according to the first embodiment of the present invention.
6A to 6D are cross-sectional views illustrating the touch array forming process shown in FIG.
7 is a cross-sectional view showing a shielding film forming process.
8 is a cross-sectional view for explaining an FPC attaching step.
9 is a sectional view showing a shielding film removing process.
FIG. 10 shows a screen for forming the actual shielding film 200 and removing it.
11 (a) shows damage to a soluble transparent electrode according to the case where a conventional shielding film is not used, and FIG. 11 (b) shows damage to a soluble transparent electrode according to the present invention using a shielding film ITO).
12 is an exploded perspective view showing a display device according to a second embodiment of the present invention.
13 is a flowchart showing a manufacturing process for manufacturing the display device according to the second embodiment of the present invention.
14 is a sectional view showing a cover glass in which a shielding film is formed.
Figs. 15 (a) and 15 (b) are screens showing a conventional cover glass and a cover glass according to the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The configuration of the present invention and the operation and effect thereof will be clearly understood through the following detailed description. Before describing the present invention in detail, the same components are denoted by the same reference symbols as possible even if they are displayed on different drawings. In the case where it is judged that the gist of the present invention may be blurred to a known configuration, do.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to FIGS. 1 to 10B.

1 is an exploded perspective view showing a display device according to a first embodiment of the present invention. FIG. 2 is a plan view of the touch array shown in FIG. 1. FIG. 3 is a plan view showing an enlarged view of the area A shown in FIG. 2. FIG. 3 is an enlarged plan view of the routing part and the FPC pad part. 4 is a cross-sectional view of the touch array shown in Fig.

The display device according to the first embodiment shown in FIG. 1 includes a liquid crystal panel 110, a touch array formed on the front surface of the liquid crystal panel 110 to sense touches, a cover glass 132 formed facing the touch array, And a reflection film 134 adhered on the cover glass 132. Thus, the display device according to the first embodiment of the present invention is an on-cell type display device in which a touch array is formed on the front surface of the liquid crystal panel 110.

The liquid crystal panel 110 includes an upper substrate 101 on which a color filter array is formed and a lower substrate 114 on which a thin film transistor array is formed.

The color filter array includes a black matrix, a color filter, and a common electrode. At this time, the upper substrate may be formed of plastic or glass.

Color filters include red, green, and blue color filters to implement color. The color filter is divided into red (R), green (G), and blue (B) in a pixel region divided by a black matrix to transmit red, green, and blue light, respectively.

The black matrix divides the pixel region on which the color filter is to be formed on the back surface of the upper substrate. The black matrix blocks the transmitted light caused by the undesired liquid crystal array to improve the contrast of the display device and blocks the direct light irradiation by the thin film transistor to prevent the light leakage current of each thin film transistor.

The common electrode is a transparent conductive layer and supplies a common voltage that is a standard for liquid crystal driving. For this purpose, the common electrode is formed of a material such as ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide) which is transparent and conductive. As such, the common electrode may be formed on the upper substrate to form a vertical electric field with the pixel electrode, or may be formed on the lower substrate to form a horizontal electric field with the pixel electrode.

The thin film transistor array includes a thin film transistor connected to each of a gate line and a data line, and a pixel electrode formed in a pixel region provided in the crossing structure.

The thin film transistor is formed on the lower substrate 114 and selectively supplies the data signal from the data line to the pixel electrode in response to the gate signal from the gate line. To this end, the thin film transistor has a gate electrode connected to the gate line, a source electrode connected to the data line, a drain electrode connected to the pixel electrode, a channel between the gate electrode and the gate insulating film, And an ohmic contact layer for ohmic contact with the active layer and the source and drain electrodes.

The pixel electrode is connected to the drain electrode of the thin film transistor through the pixel contact hole. Thus, the pixel electrode is supplied with the pixel signal from the data line through the thin film transistor.

As described above, in the liquid crystal panel, a twisted-nematic (TN) system in which electrodes are provided on two substrates, a liquid crystal director is arranged so as to be twisted by 90 ° and then a voltage is applied to the electrodes to drive liquid crystal directors, (In-Plane Swiching) mode in which two electrodes are formed on a substrate and a director of the liquid crystal is controlled by a horizontal electric field generated between the two electrodes. The two electrodes are formed as transparent conductors, And a Fringe Field Swiching (FFS) mode method in which liquid crystal molecules are operated by a fringe field formed between two electrodes. However, the present invention is not limited thereto.

The touch array includes first and second electrode pattern units 156 and 166 serving as position sensing electrodes, routing units 158 and 168, and a pad unit 170.

As shown in FIGS. 2 to 4, a plurality of first sensor electrode pattern units 156 are formed in parallel in the first direction to sense a change in capacitance in the first direction. Here, the first direction may be, for example, the X-axis direction. The first sensor electrode pattern unit 156 includes first and second sensor electrodes 150 and 154 having rhombic or diamond shapes and bridges connecting the adjacent first sensor electrodes 150 and 154 through the sensor contact holes 150a and 154a. (Not shown). In addition, the first sensor electrodes 150 and 154 are electrically connected to the first routing 158 to receive a driving voltage. The first sensor electrodes 150 and 154 and the bridge 152 are formed of transparent electrodes, which are formed of a transparent transparent electrode that can be used for a solution process (souble process). Soluble transparent electrode material can be formed of a material such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), ITZO (Indium Tin Zinc Oxide), ATO (Antimony Tin Oxide)

A plurality of second sensor electrode pattern units 166 are formed in parallel in the second direction so as to intersect with the first sensor electrode pattern unit 156 to detect a change in capacitance in the second direction. Here, the second direction may be Y-axis direction, for example. The second sensor electrode pattern unit 166 includes second sensor electrodes 160 and 164 formed in rhombic or diamond shape and second sensor electrodes 160 and 164 formed in the same layer as the second sensor electrodes 160 and 164 in the second direction, And a connection part 162 for connecting the first and second connection parts 160 and 164 to each other. The second sensor electrodes 160 and 164 are electrically connected to the second routing line 168 to supply the second pad electrodes 170 with a voltage or current that changes depending on whether the touch panel 160 or 164 is touched. The connection part 162 and the second sensor electrodes 160 and 164 are formed as a transparent electrode on the passivation layer 180 and the transparent electrode is formed of a transparent transparent electrode that can be used for a solution process. Soluble transparent electrode material can be formed of a material such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), ITZO (Indium Tin Zinc Oxide), ATO (Antimony Tin Oxide)

The routing units 158 and 168 include a first routing line 158 connected to the first pad electrodes 210 to apply a driving voltage supplied to the first pad electrodes 210 to the first sensor electrodes 150 and 154, And a second routing line 168 electrically connected to the second sensor electrodes 160 and 164 to supply a voltage or current to the second pad electrodes 170 depending on the touch.

The pad portion 272 includes a first pad electrode 210 connected to the first routing line 158 and a second pad electrode 170 connected to the second routing line 168. The first pad electrode 210 210 and the second pad electrode 170 are connected to a flexible printed circuit (FPC) 270. The first pad electrode 210 includes an upper electrode 216 connected to the FPC 172, an intermediate electrode 214 connected to the upper electrode 216 through the first pad hole 218, And a lower electrode 212 connected to the lower electrode of the first routing line 158. The second pad electrode 170 includes an upper electrode 176 connected to the FPC 170, an intermediate electrode 174 connected to the upper electrode 176 through the second pad hole 178, And a lower electrode 172 connected to the lower electrode 266 of the routing line 168. In this case, the lower electrodes 172 and 212 of the first and second pad electrodes 170 and 210 may be formed of Ag Nano Wire (AgNW) or Soluble carbon nanotube The upper and intermediate electrodes 174, 176, 214 and 216 of the first and second pad electrodes 170 and 210 are formed of a transparent transparent electrode usable for a solution process.

FIG. 5 is a flowchart illustrating a manufacturing process for manufacturing the display device according to the first embodiment of the present invention, and FIGS. 6A to 6D are cross-sectional views illustrating the touch array forming process shown in FIG. 7 is a cross-sectional view illustrating a shielding film forming process, FIG. 8 is a cross-sectional view illustrating an FPC attaching process, and FIG. 9 is a cross-sectional view illustrating a shielding film removing process.

Referring to FIG. 5, the manufacturing process for manufacturing the display device according to the first embodiment of the present invention includes a step of forming a touch array on the front surface of the upper substrate (step S10), a step of forming a shielding film (step S12) (Step S14) of attaching a lower substrate and an upper substrate on which a thin film transistor array is formed (step S16), a cleaning step (step S18), a step of attaching an FPC (step S20 A step of removing the shielding film (step S22), and a step of attaching the cover glass and the liquid crystal panel (step S24).

In the step of forming the touch array (step S10), the touch array including the first and second electrode pattern parts 156 and 166, the routing parts 158 and 168, and the pad part 170 is formed on the front surface of the upper substrate.

6A, the lower electrode (not shown) of the first routing line 158, the lower electrode 266 of the second routing line 168, the first pad electrode (not shown) of the second routing line 168, And a lower electrode of the second pad electrode are formed on the first conductive pattern group.

Specifically, a first conductive layer is formed on the entire surface of the upper substrate 101 through a solution process. As the first conductive layer, Soluble which can be formed by a solution process is formed of Ag Nano Wire (AgNW) or Soluble Carbon Nano Tube (CNT). Subsequently, the first conductive layer is patterned by the photolithography process and the etching process to form the lower electrode (not shown) of the first routing line 158, the lower electrode 266 of the second routing line 168, The lower electrode 212 of the first pad electrode 210 and the lower electrode 172 of the second pad electrode 170 are formed. The solution process is any one of Ink Jet, Nozzle Coating, Spray Coating, Roll Printing, and Spin Coating. When the upper substrate 101 is formed of a material such as plastic, it is necessary to perform the process at a temperature of 140 ° C or lower, which can be performed at a temperature of 140 ° C or lower through a solution process.

6B, the bridge 152, the intermediate electrode 214 of the first pad electrode, and the intermediate electrode 174 of the second pad electrode are formed on the front surface of the upper substrate 101 on which the first conductive pattern group is formed, A second conductive pattern group is formed.

Specifically, a second conductive layer is formed on the entire surface of the upper substrate 101 on which the first conductive pattern group is formed through a solution process. The second conductive layer is formed of a transparent transparent electrode material that can be formed by a solution process. Soluble transparent electrode material can be formed of ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), ITZO (Indium Tin Zinc Oxide), ATO (Antimony Tin Oxide) or the like. Next, the second conductive layer is patterned by a photolithography process and an etching process to form a second conductive pattern group including the bridge 152, the intermediate electrode 214 of the first pad electrode, and the intermediate electrode 174 of the second pad electrode .

Referring to FIG. 6C, a protection layer 180 including sensor contact holes 150a and 154a and first and second pad holes 178 and 218 is formed on the entire surface of the upper substrate 101 on which the second conductive pattern group is formed .

Specifically, an organic insulating material is formed on the entire surface of the upper substrate 101 on which the second conductive pattern group is formed through a solution process. Then, the organic insulating material is patterned by the photolithography process and the etching process, thereby forming the protective film 180 including the sensor contact holes 150a and 154a and the first and second pad holes 178 and 218. The sensor contact holes 150a and 154a expose the bridge 152 and the first pad contact hole 218 exposes the intermediate electrode 214 of the first pad electrode and the second pad contact hole 178 exposes the intermediate electrode 214 of the first pad electrode. Thereby exposing the intermediate electrode 174 of the second pad electrode.

6D, the first and second sensor electrodes 150, 154, 160 and 164, the connection part 162, the upper electrodes 176 and 216 of the first and second pad electrodes, respectively, are formed on the front surface of the upper substrate 101 on which the protective film 180 is formed. ), And a third conductive pattern group including the upper electrode 266 of the first and second routing lines are formed.

Specifically, a third conductive layer is formed on the entire surface of the upper substrate 101 on which the passivation layer 180 is formed through a solution process. The third conductive layer is formed of a solubilized transparent electrode material that can be formed by a solution process. Soluble transparent electrode material can be formed of ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), ITZO (Indium Tin Zinc Oxide), ATO (Antimony Tin Oxide) or the like. Next, the third conductive layer is patterned by the photolithography process and the etching process to form the first and second sensor electrodes 150, 154, 160, and 164, the connecting portion 162, the upper electrodes 176 and 216 of the first and second pad electrodes, And the upper electrode 266 of the second routing line are formed.

In this manner, the entire surface of the upper substrate 101 is cleaned by spraying or immersing the cleaning liquid on the entire surface of the upper substrate 101 on which the touch array is formed.

In the shielding film forming process (S12), the shielding liquid is coated on the entire surface of the upper substrate 101 on which the touch array is formed by a method such as bar coating or silk screen coating to a thickness of 34 to 40 탆. At this time, the shielding chemical solution does not have adhesion to the coated surface and can be removed easily after the protection. Vinyl resin derivatives and Epozy ether resin are used as binders. The binder is formed in an amount of 20 wt% to 40 wt% based on the liquid composition. The solvent may be formed of at least one of Xylene, Ethyl acetate, and Methylethylketone (MEK), which is easily applicable in a low-temperature process, and the solvent is formed in an amount of 50 wt% to 70 wt% based on the liquid composition. In order to ensure visibility, pigments or dyes are used rather than transparent binders, and pigments or dyes are formed to 10 wt% or less based on the liquid composition. The color of the pigment or dye can be changed according to the user's need, but the present invention exemplifies the case of mixing the blue dye.

When the shielding agent is coated on the touch array and then dried at a temperature of 130 ° C for 10 minutes to 15 minutes, the shielding agent solution is in the form of a film. Accordingly, the shielding film 200 is formed on the touch array as shown in FIG. FIG. 10 shows a screen for forming the actual shielding film 200 and removing it. 10 (b) is a view showing an upper substrate on which a shielding film 200 is formed, FIG. 10 (c) is a view showing a shielding film 200, Is removed.

The step of forming the color filter array on the back surface of the upper substrate 101 (step S14) includes a black matrix for separating the pixel region in which the color filter is to be formed on the back surface of the upper substrate 101, , A B color filter, and a common electrode are formed. At this time, the shielding film 200 is formed on the front surface of the upper substrate 101 on which the touch array is formed, so that the touch array can be protected by an etchant or a stripper used for forming the color filter array. In other words, the film hardness of the AgNW, CNT, or transparent electrode material used in the solution process is low and can be easily damaged. However, by protecting the touch array with the shielding film 200 of the present invention, it is possible to protect the touch array from scratches, etchants, and the like generated in the subsequent process (color filter array forming process). 11 (a) shows damage to a soluble transparent electrode according to the case where a conventional shielding film is not used, and FIG. 11 (b) shows damage to a soluble transparent electrode according to the present invention using a shielding film ITO). As shown in FIGS. 11 (a) and 11 (b), when a subsequent process is performed without using a conventional shielding film, a soluble transparent electrode (Soluble ITO) is damaged by scratches or an etching solution. However, When a shielding film is used, the soluble transparent electrode (Soluble ITO) is free from scratches or damage by the etching solution.

Then, in the laminating step (S16), the upper substrate 101 on which the color filter array and the touch array are formed and the lower substrate 114 on which the thin film transistor array is formed are attached. At this time, the shielding film 200 is formed on the front surface of the upper substrate 101 on which the touch array is formed, so that the touch array can be protected against scratches and foreign substances generated during the adhesion process.

Next, in the cleaning step (S18), the entire surface of the upper substrate 101 is cleaned by using a brush or a polishing cloth to remove foreign substances and particles generated during the process. When a cleaning process using a blush or a polishing cloth is performed, a scratch may be generated in the touch array due to a brush or a polishing cloth. However, the shielding film 200 may be attached to the touch array to protect the touch array.

In the step of attaching the FPC (step S20), as shown in FIG. 8, the shielding film 200 is removed only in the pad region, and the FPC 270 is attached to the pad region. Accordingly, the touch array electrodes in the remaining regions except the pad region can be protected from scratches or the like generated during the process.

9, the shielding film 200 attached to the touch array is entirely removed and removed, and then the cover glass 132 and the liquid crystal panel 110 are bonded together (FIG. 9) S24) to form a display device.

By forming the shielding film 200 on the touch array in this manner, it is possible to protect it from scratches and foreign substances generated in the subsequent steps after the touch array forming step, etchant, and the like.

12 is an exploded perspective view showing a display device according to a second embodiment of the present invention.

The display device according to the second embodiment shown in Fig. 12 includes a cover glass 132 on which a touch array is formed on the rear surface, a reflection film on the front surface, and a touch array formed on the cover glass 132 And a liquid crystal panel 110 formed thereon. Thus, the display device according to the second embodiment of the present invention is an add-on type display device in which a touch array is formed on the back surface of the cover glass 132.

As described above, in the display device according to the second embodiment of the present invention, the touch array is formed on the back surface of the cover glass 132, and the display device according to the first embodiment of the present invention has the touch array, The components of the touch array and the components of the liquid crystal panel are the same, so that they are omitted.

FIG. 13 is a flowchart illustrating a manufacturing process for manufacturing a display device according to a second embodiment of the present invention, and FIG. 14 is a cross-sectional view illustrating a cover glass having a shielding film formed thereon.

Referring to FIG. 13, the manufacturing process for manufacturing the display device according to the second embodiment of the present invention includes a process of attaching a reflective film on a front surface of a cover glass (S30), a process of forming a shielding film on a reflective film (Step S32), a step of forming a touch array on the back surface of the cover glass (step S34), a step of forming a shielding film on the touch array (step S36), a step of cleaning the back glass or the entire surface of the cover glass with a polishing cloth or brush A step of attaching the FPC to the back surface of the cover glass in step S40; a step of removing the shielding film attached on the touch array in step S42; a step of attaching the cover glass and the liquid crystal panel in step S44; , And removing the shielding film attached on the reflective film (step S46).

After attaching a reflective film on the front surface of the cover glass (S30), a shielding film is formed on the reflective film (S32)

The shielding film forming step (S32) on the reflective film is performed by coating the entire surface of the reflective film 134 with a shielding chemical solution to a thickness of 34 to 40 탆 by a method such as bar coating or silk screen coating. At this time, the shielding chemical solution does not have adhesion to the coated surface and can be removed easily after the protection. Vinyl resin derivatives and Epozy ether resin are used as binders. The binder is formed in an amount of 20 wt% to 40 wt% based on the liquid composition. The solvent may be formed of at least one of Xylene, Ethyl acetate, and Methylethylketone (MEK), which is easily applicable in a low-temperature process, and the solvent is formed in an amount of 50 wt% to 70 wt% based on the liquid composition. In order to ensure visibility, pigments or dyes are used rather than transparent binders, and pigments or dyes are formed to 10 wt% or less based on the liquid composition. The color of the pigment or dye can be changed according to the user's need, but the present invention exemplifies the case of mixing the blue dye.

When the shielding agent is coated on the touch array and then dried at a temperature of 130 ° C for 10 minutes to 15 minutes, the shielding agent solution is in the form of a film. Accordingly, the shielding film 200 is formed on the reflection film 134 as shown in FIG.

Thus, by forming the shielding film on the reflecting film, no foreign matter or scratch is generated in the reflecting film or the cover glass. 15 (a) shows a scratch-like damage on a cover glass when a subsequent process is performed without a conventional shielding film on the reflection film. Fig. 15 (b) As a result of the subsequent process in the state of being attached to the film, there is no scratch-like damage on the cover glass.

The step of forming the touch array on the back surface of the cover glass (step S34) is the same as the touch array process according to the first embodiment except for forming the touch array on the back surface of the cover glass, , The step of forming a shielding film on the touch array (step S36) is also the same as the first embodiment of the present invention.

Thereafter, the step of cleaning the back cover or the entire surface of the remaining cover glass with the polishing cloth or brush (step S38) and the step of attaching the FPC (step S40) are also the same as those of the first embodiment of the present invention.

After the step of attaching the FPC (step S40), the shielding film attached on the touch array is removed (step S42), and the cover glass and the liquid crystal panel are attached together (step S44). Finally, The shielding film 200 is removed (step S46)

The foregoing description is merely illustrative of the present invention, and various modifications may be made by those skilled in the art without departing from the spirit of the present invention. Accordingly, the embodiments disclosed in the specification of the present invention are not intended to limit the present invention. The scope of the present invention should be construed according to the following claims, and all the techniques within the scope of equivalents should be construed as being included in the scope of the present invention.

101: upper substrate 110: liquid crystal panel
114: lower substrate 132: cover glass
134: reflective film 150, 154: first sensor electrode
152: bridge 156: first sensor electrode pattern portion
158: first routing line 160, 164: second sensor electrode
162: connection part 166: second sensor electrode pattern part
168: second routing line 200: shielding film

Claims (14)

Forming a touch array on the front surface of the upper substrate;
Forming a shielding film on the touch array;
Forming a color filter array on the back surface of the upper substrate;
Bonding the upper substrate and the lower substrate on which the thin film transistor array is formed;
Cleaning the entire surface of the upper substrate with a brush or a polishing cloth;
Attaching an FPC to the entire surface of the upper substrate;
Removing the shielding film attached on the touch array;
And attaching the cover glass and the liquid crystal panel to each other. The method according to claim 1,
The step of forming a touch array on the front surface of the upper substrate
A plurality of first sensor electrodes formed on a front surface of the upper substrate in a first direction and sensing a position in a first direction and a bridge connecting adjacent first sensor electrodes through a sensor contact hole, A first sensor electrode pattern portion,
A second sensor electrode for sensing a position in a second direction formed parallel to the first direction so as to intersect with the first direction and a second sensor electrode for connecting the adjacent second sensor electrodes, A second sensor electrode pattern portion having a connection portion formed on the second sensor electrode pattern portion,
A routing unit including a first routing line connected to the first sensor electrodes and a second routing line connected to the second sensor electrodes,
Wherein the touch array includes a first pad electrode connected to the first routing line, and a pad portion including second pad electrodes connected to the second routing line. 3. The method of claim 2,
The first sensor electrodes, the second sensor electrodes, the bridge, the connection portion, the first routing line, the second routing line, the first pad electrodes, and the second pad electrodes included in the touch array are formed of a soluble transparent electrode, Is formed of a nano wire (Soluble Ag Nano Wire) or a Solube Carbon Nano Tube (Nano Tube). The method of claim 3,
The step of forming a shielding film on the touch array
Coating a shielding agent solution on the touch array by a bar coating or a silk screen coating method;
Coating and drying the shielding chemical solution;
And drying the shielding chemical solution to form the shielding film. 5. The method of claim 4,
Wherein the shielding agent solution is formed of a binder using Vinyl Resin derivatives and Epozy ether resin, and the binder is formed in an amount of 20 wt% to 40 wt% based on the liquid composition. 5. The method of claim 4,
Wherein the shielding agent solution is formed of a solvent composed of at least one of Xylene, Ethyl acetate, and methylethylketone (MEK), and the solvent is formed in an amount of 50 wt% to 70 wt% based on the liquid composition. 5. The method of claim 4,
Wherein the shielding chemical liquid is a pigment or a dye. The method according to claim 1,
The step of attaching the FPC to the entire surface of the upper substrate
Wherein the shielding film is removed only in an area to which the FPC is to be attached. Attaching a reflective film on the front surface of the cover glass;
Forming a shielding film on the reflective film;
Forming a touch array on the back surface of the cover glass;
Forming a shielding film on the touch array;
Cleaning the back surface or front surface of the cover glass with a brush or a polishing cloth;
Attaching an FPC to the back surface of the cover glass;
Removing a shielding film attached on the touch array;
Attaching the cover glass and the liquid crystal panel;
And removing the shielding film attached on the reflective film. 10. The method of claim 9,
The step of forming a shielding film on the reflective film and the step of forming a shielding film on the touch array
Coating the shielding agent solution by a bar coating or a silk screen coating method,
Coating and drying the shielding chemical solution;
And drying the shielding chemical solution to form the shielding film. 11. The method of claim 10,
Wherein the shielding agent solution is formed of a binder using Vinyl Resin derivatives and Epozy ether resin, and the binder is formed in an amount of 20 wt% to 40 wt% based on the liquid composition. 11. The method of claim 10,
Wherein the shielding agent solution is formed of a solvent composed of at least one of Xylene, Ethyl acetate, and methylethylketone (MEK), and the solvent is formed in an amount of 50 wt% to 70 wt% based on the liquid composition. 11. The method of claim 10,
Wherein the shielding chemical liquid is a pigment or a dye. 10. The method of claim 9,
The step of attaching the FPC to the backside of the cover glass
Wherein the shielding film is removed only in an area to which the FPC is to be attached.

Images