KR101800757B1

KR101800757B1 - Apparatus and method for manufacturing chip mat using tow prepreg

Info

Publication number: KR101800757B1
Application number: KR1020150178870A
Authority: KR
Inventors: 김소영; 박용민; 정연중
Original assignee: 주식회사 이지컴퍼지트
Priority date: 2015-12-15
Filing date: 2015-12-15
Publication date: 2017-12-21
Also published as: KR20170071629A

Abstract

The present invention relates to an apparatus for manufacturing a chip mat using a tow prepreg, which comprises a first bobbin on which a tow prepreg is installed, a first conveyor for horizontally conveying the tow prepreg, a first conveying roller for conveying the first conveyor, A first power transmitting portion for rotating the conveying roller, a pumping portion for cutting the conveyed tow prepreg, a first discharging portion for discharging the tow prepreg mat cut off by passing through the hopping portion, a second discharging portion for discharging the second preprinting mat, A bobbin, a second conveyor which is formed below the first conveyor and transports the first release film in the horizontal direction, and a tow prepreg mat is stacked on the first release film, a second conveyance roller for conveying the second conveyor, A second bobbin provided with a second release film laminated on the upper side of the tow prepreg mat, a first release film, and a tow prepreg sheet A first release film that has passed through a heating section, a compression prepress mat which compresses the tow prepreg mat and a second release film, and a chip mat using a tow prepreg which is manufactured through a compression roller, And a second discharging unit for discharging the tow prepreg.
The present invention also provides a method of manufacturing a tow prepreg, comprising the steps of: impregnating a tow in a one-component type resin in a semi-solid state; impregnating the tow in a resin to produce a tow prepreg; installing the tow prepreg on the first bobbin; A first conveying step of conveying the to-be-loaded prepreg in one direction through a first conveyor, a cutting step of cutting the to-be-loaded prepreg using a hopper, a step of discharging the cut tow prepreg mat to an upper side of a second conveyor located below the first conveyor A first release step, a step of installing the first release film on the second bobbin, a step of transferring the tow prepreg mat laminated on the first release film and the first release film provided on the second bobbin to the other direction using the second conveyor A second transfer step for transferring the first release film to the third bobbin, a step for installing the second release film on the third bobbin, a laminating step for laminating the second release film on the top of the tow prepreg mat, A heating step of heating the release film, the tow prepreg mat and the second release film through a heating section, a compression step of passing the heated first release film, the tow prepreg mat and the second release film through a compression roller; And a second discharging step of discharging the chip mat using the tow prepreg manufactured through the pressing step.
Further, a chip mat manufacturing apparatus using a tow prepreg and a chip mat manufactured using the manufacturing method can be provided.

Description

APPARATUS AND METHOD FOR MANUFACTURING CHIP MAT USING TOW PREPREG METHOD AND APPARATUS AND METHOD FOR MANUFACTURING CHIP MAT,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and a method for manufacturing a chip mat using a tow prepreg, and a chip mat manufactured thereby. More particularly, the present invention relates to a chip matt The present invention relates to an apparatus and a method for manufacturing a chip mat using a tow prepreg, and a chip mat manufactured thereby.

Recently, as energy saving and environmental regulations are strengthened due to depletion of resources, there is a need for environmentally friendly materials.

The fiber reinforced composite material is produced by impregnating a reinforcing material such as carbon fiber or aramid fiber with a resin such as epoxy, which is a known material. Fiber reinforced composites have high nose strength and inelasticity. For this reason, it is used as an industrial structural material for aircraft and automobiles. It is also used as a material for everyday products such as sports goods such as tennis rackets, golf shafts and fishing rods.

As the reinforcing fiber used for the composite material, carbon fiber, aramid fiber and glass fiber are commonly used.

As a method for producing a fiber reinforced composite material, there is a method of directly molding a fiber reinforcing material by impregnating the resin, or a method of impregnating a fiber reinforcing material and a resin into an intermediate material before molding.

In the case of producing a molded product by impregnating a resin with a resin, cost can be reduced economically because no intermediate material is required. However, this method has a problem in that the physical properties of the molded product may not be uniform because the ratio of the fiber and the resin is not easily controlled.

The use of intermediate materials allows precise control of resin to fiber ratios. As a result, it is possible to produce a composite material of high quality, and there is an advantage that it can be cut and used as needed.

Typical examples of the fiber-reinforced composite material intermediate material are PREPREG and a molding compound.

The prepreg can be applied not only to a sheet shape but also to a tape shape and a chip shape, and can be easily processed into various shapes. In addition, it can be applied to a wide variety of fields because it can be applied variously to reinforced fibers and resins according to purposes. For this reason, demand for prepregs is increasing recently.

Prefere is an intermediate material made by impregnating continuous fibers or fabrics arranged in one direction with resin, and it has an advantage that the fiber content is high (about 50% or more) and the physical properties are excellent when the molding is formed.

However, when prepregs are about 0.05-0.3 mm thick and thin, so that a thick molded product is produced, a large amount of prepreg is required.

In addition, in the case of a unidirectional prepreg, since the direction of lamination must be considered in order to impart isotropy to a molded product, there is a limit in forming complicated structures.

TOW PREPREG is an intermediate material made by impregnating TOW with resin at a constant volume ratio and is mainly used for manufacturing high pressure pressure vessel.

In a conventional method for producing a pressure vessel using fibers, a wet-type winding method was used. The wet winding method is a method in which the tow passes through the resin tray and then winds on the mold. Such a method uses a liquid resin for impregnation, so there is a limitation in realizing physical properties and there is a high possibility that a fiber slip occurs during winding.

The molding compound is an intermediate material that is randomly dispersed by hopping the fibers to a certain length. Depending on the application, it is manufactured in the form of a sheet molding compound or a bulk molding compound.

Molding compounds are relatively simple to manufacture compared to prepregs, enabling high-speed production and mass production. In addition, the molding compound has a thicker thickness than the prepreg, has quasi-isotrope due to the random arrangement, and facilitates molding of complex structures by facilitating the movement of the fibers during molding.

However, the molding compound has a low fiber content (about 30% or less) as compared with the prepreg, and has a disadvantage that physical properties are poor after molding.

In order to solve this problem, a technique for a molding compound using a prepreg has been sought.

An invention such as that disclosed in Korean Patent Laid-Open Publication No. 10-2015-0042581 (title of the invention: composite bar using prepreg and its manufacturing method) has been proposed by the prior art.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems and it is an object of the present invention to provide an apparatus and a method for manufacturing a chip mat using a tow prepreg in the form of a sheet in which tow prepregs are randomly arranged by CHOPPING, And to provide a chip mat manufactured thereby.

In order to solve the above problems, the present invention provides an apparatus for manufacturing a chip mat using a tow prepreg, comprising: a first bobbin on which a tow prepreg is installed; A first conveyor for horizontally conveying the tow prepreg; A first conveying roller for conveying the first conveyor; A first power transmitting part for rotating the first conveying roller; A tipping section for cutting the transferred tow prepreg; A first discharging portion for discharging the tow prepreg mat cut through the hopping portion; A second bobbin on which the first release film is installed; A second conveyor which is formed below the first conveyor and transports the first release film in a horizontal direction and the tow prepreg mat is laminated on the first release film; A second conveying roller for conveying the second conveyor; A second power transmitting part for rotating the second conveying roller; A third bobbin provided with a second release film laminated on the top of the tow prepreg mat; A heater for heating the first release film, the tow prepreg mat, and the second release film; A pressing roller for pressing the first release film, the tow prepreg mat and the second release film that have passed through the heating section; And a second discharging portion for discharging the chip mat using the tow prepreg manufactured through the pressing roller. The present invention also provides an apparatus for manufacturing a chip mat using the tow prepreg.

The hopping unit includes: a rotating part formed in a cylindrical shape; A cutter disposed at regular intervals on the outer circumferential surface of the rotary part; And a ramping power transmission portion for rotating the rotation portion.

Wherein the hopper punch comprises: a vertical cutter formed in a direction perpendicular to a horizontal direction in which the tow prepreg is fed; And a cylinder connected to the upper side of the vertical cutter and vertically moving the position of the vertical cutter in a vertical direction.

And a brush unit configured to remove the cut tow prepreg which adheres to the first conveyor or the dipping unit.

And a cooling unit formed in a section in which the heating unit is located to maintain a temperature condition of 0 ° C to -20 ° C so as to prevent the cutter of the heating unit from being contaminated with resin.

The tow prepreg chip cut by the punching unit may have a width of 10 to 100 mm and a length of 10 to 100 mm.

In addition, it is possible to provide a chip mat using a chip mat production apparatus using a tow prepreg.

Impregnating the tow in a one-part resin of semi-solid phase, and then impregnating the tow with the resin to prepare a tow prepreg; Installing the tow prepreg in a first bobbin; A first transfer step of transferring the tow prepreg provided in the first bobbin through the first conveyor in one direction; A cutting step of cutting the tow prepreg to be transported by using a hopper; A first discharging step of discharging the cut tow prepreg mat to an upper side of a second conveyor located below the first conveyor; Installing a first release film on a second bobbin; A second conveying step of conveying the tow prepreg mat stacked on the first release film provided on the second bobbin and the first release film in the other direction using the second conveyor; Installing a second release film on a third bobbin; Laminating the second release film on the top of the tow prepreg mat; A heating step of heating the first release film, the tow prepreg mat and the second release film through a heating unit; Pressing the heated first release film, the tow prepreg mat and the second release film through a compression roller; And a second discharging step of discharging the chip mat using the tow prepreg manufactured through the compression step.

The resin may include a resin mixed with a solid resin and a liquid resin, the solid resin may be 20 to 40 parts by weight, and the liquid resin may be 60 to 80 parts by weight.

The cutting step may further include a cooling step of cooling the tow prepreg at 0 ° C to -20 ° C so as to prevent the resin from sticking to the first conveyor or the dipping portion.

The cutting step may further include a foreign matter removing step of removing the cut tow prepreg attached to the first conveyor or the puffing unit using a brush.

Further, it is possible to provide a chip mat using a tow prepreg manufactured by a method of manufacturing a chip mat using a tow prepreg.

INDUSTRIAL APPLICABILITY The present invention can provide quasi-isotropic properties with a high fiber content, and can provide a molded article having excellent physical properties.

In addition, the present invention can perform prepping with only a hopping process without a separate slitting process.

In addition, the present invention can provide a simplified chip mat process system, thereby reducing manufacturing cost.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing an apparatus for manufacturing a chip mat using a tow prepreg according to an embodiment of the present invention. Fig.
2 is a view showing an apparatus for manufacturing a chip mat using a tow prepreg according to a second embodiment of the present invention.
3 is a flowchart illustrating a method of manufacturing a chip mat using a tow prepreg according to an embodiment of the present invention.
4 is a view showing a result of comparing tensile strengths of a chip mat (Example 2) and a reference according to an embodiment of the present invention.

Hereinafter, the description of the present invention with reference to the drawings is not limited to a specific embodiment, and various transformations can be applied and various embodiments can be made. It is to be understood that the following description covers all changes, equivalents, and alternatives falling within the spirit and scope of the present invention.

In the following description, the terms first, second, and the like are used to describe various components and are not limited to their own meaning, and are used only for the purpose of distinguishing one component from another component.

Like reference numerals used throughout the specification denote like elements.

As used herein, the singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise. It is also to be understood that the terms " comprising, "" comprising, "or" having ", and the like are intended to designate the presence of stated features, integers, And should not be construed to preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. 1 to 4 attached hereto.

The present invention describes a method of manufacturing a prepreg molding compound (hereinafter referred to as a " chip mat ") using a tow prepreg and a manufacturing apparatus thereof.

1 is a view showing an apparatus for manufacturing a chip mat using a tow prepreg according to an embodiment of the present invention.

1, an apparatus for manufacturing a chip mat using a tow prepreg according to an embodiment of the present invention includes a first bobbin 10, a second bobbin 20, a third bobbin 30, a first conveyor 40, The first conveying roller 60, the second conveying roller 70, the heating unit 80, the pressing roller 90, the pumping unit 100, the first feeding member 101, A first discharge unit 110, a cutter 111, a brush unit 130, a cooling unit 200, a first discharge unit, a second discharge unit, and a control unit.

The first bobbin 10 may be provided with a tow prepreg. Further, the first bobbin 10 can be wound with the tow prepreg. The first bobbin 10 may be formed into a hollow cylindrical shape. Also, the first bobbin 10 can hang 1 to 100 tow prepreg bobbins according to the thickness of the desired chip mat.

For reference, TOW PRE PREFECT means intermediate material made by impregnating TOW with resin at a constant volume ratio.

Tow produces a continuous fiber bundle of 2000 to 6000 denier when man-made fibers are made of staple fibers (long fibers are cut into arbitrary lengths and mainly made of yarn). This is called a toe. The tow may be cut at a certain length, or it may be continuously cut between two rollers (in this case, cut into various lengths). Some tows are made using nozzles with a lot of fine holes (especially in the case of viscose rayon). They also collect yarn from several nozzles to make a tow.

The second bobbin 20 may be provided with a first release film. In addition, the first bobbin 20 may be wound on the first release film F1. The second bobbin 20 may be formed into a hollow cylindrical shape.

The first conveyor 40 can transport the tow prepreg in the horizontal direction. The first conveyor 40 may be formed above the second conveyor 50.

The first conveying roller 60 can convey the first conveyor 40. By rotating the first conveying roller 60, the tow prepreg placed on the first conveyor 40 can be conveyed in the hopping section direction.

The first conveying roller 60 can be conveyed while maintaining a constant width without damaging the fibers of the tow prepreg. The first conveying roller 60 may be a metal or rubber roller.

The first power transmission portion (not shown) can rotate the first conveying roller 60. A motor or the like may be used as the first power transmission portion. The first power transmission unit may be connected to the control unit.

The tow prepreg mats cut by the paping unit 100 may have a width of 10 to 100 mm and a length of 10 to 100 mm.

When the width or length of the tow prepreg mat is less than 10 mm, the workability may not be easy. Further, when the width or the length of the tow prepreg mat is more than 100 mm, it is difficult to manufacture the chip mat C having a constant size.

The shrinking portion 100 can cut the transferred tow prepreg. The pumping unit 100 may include a first and second buffing members 101 and 102. The second fallingping member 102 will be described with reference to FIG. 2 which will be described later.

The first shifting member 101 may include a rotation unit 110, a cutter 111, and a power transmission unit. The first shifting member 101 may be formed in the form of a toothed wheel.

The rotation part 110 may be formed in a cylindrical shape, a disc shape, or a disc shape. The rotating part 110 may be formed of a rotating structure.

The cutter 111 may be formed on the outer circumferential surface of the rotary part 110 at regular intervals. The cutter 111 can cut the tow prepreg.

The ramping force transmission portion (not shown) can rotate the rotation portion 110. [ The power transmission unit may be connected to the control unit.

The cooling unit 200 may be formed in a section where the capping unit 100 is located. The cooling unit 200 can prevent the cutter 111 of the punching unit 100 from being contaminated with resin.

In addition, the cooling portion 200 can cut the tow prepreg in the vertical direction of the tow prepreg while maintaining a constant gap.

For this, the cooling unit 200 can maintain a temperature condition of 0 degrees to -20 degrees. When the section temperature of the cooling part 200 is more than 0 degree, the viscosity of the resin is high and it may stick to a place such as the cutter 111 or the blade. Also, when the section temperature of the cooling section 200 is less than minus 20 degrees, the physical property of the resin composition may be lowered. Accordingly, the temperature of the cooling section 200 is preferably 0 to 20 degrees.

The brush part 130 may remove the tow prepreg which adheres to the first conveyor 40. The brush part 130 is cut by the punching part 100 to remove the tow prepreg or the tow prepreg mat adhering to the punching part 100. [ The brush part 130 may be formed in a section where the punching part 100 is located. The brush unit 130 may be formed on the side surface or the lower side of the pumping unit 100, the first and second buffing members 101 and 102. The brush portion 130 may be formed on the upper surface, the side surface, or the lower surface of the first conveying roller 60.

For reference, a tow prepreg mat is a material formed in a mat shape when cutting a tow prepreg.

The first discharging portion (not shown) can discharge the tow prepreg mat T having passed through the punching portion 100.

The cut tow prepreg mat (T) is dropped randomly on the first release film while falling onto the second conveyor (50) covered with the first release film to prevent contamination and damage of the finished product and the processing apparatus .

The second conveyor 50 may be formed below the first conveyor 40. The second conveyor 50 can transport the first release film in the horizontal direction. The second conveyor 50 may be laminated with a tow prepreg mat (T) randomly dispersed over the first release film.

The second conveying roller 70 can convey the second conveyor 50. By rotating the second conveying roller (70), the first release film placed on the second conveyor (50) can be conveyed in the heating section direction.

Further, the second conveying roller 70 can be conveyed while maintaining a constant width without damaging the fibers of the tow prepreg mat. The second conveying roller 70 may be a metal or rubber roller.

And the second power transmission portion (not shown) can rotate the second conveying roller 70. [ A motor or the like may be used for the second power transmission portion. And the second power transmission portion may be connected to the control portion.

The third bobbin 30 may be provided with a second release film F2. Also, the third bobbin 30 may be wound with the second release film. The third bobbin 30 may be formed as a hollow cylindrical shape. The third bobbin 30 is a part on which the second release film laminated on the tow prepreg mat T is wound. The third bobbin 30 may be formed between the second bobbin 20 and the heating portion 80.

The tow prepreg mat (T), which is randomly dispersed on the first release film, is transported through the second conveyor (50), and the second release film can be laminated on the upper side.

The heating section 80 can heat the first release film, the tow prepreg mat T and the second release film.

The viscosity of the resin impregnated in the tow through the heating portion 80 can be increased. As a result, the toe prepregs become sticky between them, and the tow prepreg mat (T), the first release film and the second release film can be brought into close contact with each other.

The heating section 80 can generate heat of 60 to 100 degrees. If it is less than 60 degrees, the viscosity of the resin is not changed and the prepreg mat (T) and the first release film and the second release film may not be in close contact with each other. On the other hand, when it is more than 100 degrees, there is a problem that the resin is hardened and can not be processed later. Therefore, the heating portion 80 is preferably 60 degrees to 100 degrees, which is a temperature at which the resin does not harden the tow prepreg.

The pressing roller 90 can press the first release film F1, the tow prepreg mat T and the second release film F2 which have passed through the heating section 80. [

The tow prepreg mat (T) can be manufactured as a chip mat (C) in the form of a sheet through the pressing roller (90).

The third power transmitting portion (not shown) can rotate the pressing roller 90. [ A motor or the like may be used for the third power transmission portion. And the third power transmission portion may be connected to the control portion.

The second discharging portion (not shown) may discharge the chip mat C using the tow prepreg produced through the pressing roller 90.

The control unit (not shown) may be connected to the first power transmission unit, the second power transmission unit, the third power transmission unit, the heating unit 80, the pumping unit 100, the cooling unit 200, have. In addition, the control unit may include a wireless communication module. The control unit can control on / off, rotation direction, and rotation speed of the first power transmission unit, the second power transmission unit, the third power transmission unit, and the powering unit.

The control unit can control the cutting length of the tow prepreg by adjusting the number of revolutions (RPM) of the first appinging member 101.

The control section controls the first power transmission section, the second power transmission section, the third power transmission section, the heating section 80, the pumping section 100, the cooling section 200 and the power transmission section, Can be adjusted.

In the case of manufacturing a chipmat C having a large thickness, the working speed at the upper portion of the processing apparatus can be set relatively faster than the working speed at the lower portion of the processing apparatus.

In this case, the amount of the tow prepreg mat (T) discharged to the lower portion of the processing apparatus from the upper portion of the processing apparatus increases, so that the amount of the tow prepreg mat (T) stacked on the first release film, Is increased by the same area as the case of the same operation speed. Accordingly, the thickness of the chip mat C using the finally prepared prepreg can be increased.

Further, in the case of manufacturing the chip mat C having a thin thickness, the working speed at the upper portion of the processing apparatus can be set to be relatively slower than the working speed at the lower portion of the processing apparatus.

In this case, the amount of the tow prepreg mat (T) discharged to the lower portion of the processing apparatus from the upper portion of the processing apparatus is reduced, so that the amount of the tow prepreg mat (T) Is reduced by the same area as in the case of the same operation speed. Accordingly, the thickness of the chip mat C using the finally manufactured tow prepreg can be made thin.

Further, in order to obtain the chip mat C having a constant width, a separate guide line frame (not shown) may be formed on the first conveyor 40 and the second conveyor 50.

The guide line frame may have a size corresponding to the width of the first conveyor 40 and the second conveyor 50. The width of the guideline frame may be 0.3 to 1 m.

2 is a view showing an apparatus for manufacturing a chip mat using a tow prepreg according to a second embodiment of the present invention.

2, an apparatus for manufacturing a chip mat using a tow prepreg according to a second embodiment according to the second embodiment of the present invention includes the same components as those of FIG. 1 except that the shampoo portion is formed in another structure . Therefore, the same reference numerals are given to the same constituent elements, and redundant description of the same constituent elements is omitted, and the modified constituent elements will be mainly described.

2, the apparatus for manufacturing a chip mat using a tow prepreg according to a second embodiment of the present invention includes a first bobbin 10, a second bobbin 20, a third bobbin 30, a first conveyor 40 The second conveying roller 60, the second conveying roller 70, the heating unit 80, the pressing roller 90, the pumping unit 100, the second buffing member 102, A vertical cutter 120, a cylinder 121, a brush part 130, a cooling part 200, a first discharge part, a second discharge part, and a control part.

The shrinking portion 100 can cut the transferred tow prepreg. The pumping unit 100 may include a second sleeping member 102.

The second buffing member 102 may include a vertical cutter 120 and a cylinder 121.

The vertical cutter 120 may cut the tow prepreg. The vertical cutter 120 may be formed in a direction perpendicular to the horizontal direction in which the tow prepreg is fed.

The cylinder 121 may be connected to the vertical cutter 120. The cylinder 121 may be connected to the upper side of the vertical cutter 120. The cylinder 121 can vertically move the position of the vertical cutter 120 in the vertical direction. In addition, the cylinder 121 may be connected to the control unit.

As shown in Fig. 2, the tow prepreg can be cut using a vertical cutter 120 formed in a direction perpendicular to the tow prepreg conveying direction. The cut length of the tow prepreg can be controlled by adjusting the vertical speed of the vertical cutter 120 which is vertically moved.

3 is a flowchart illustrating a method of manufacturing a chip mat using a tow prepreg according to an embodiment of the present invention.

Referring to FIG. 3, a method of manufacturing a chip mat using a tow prepreg according to an embodiment of the present invention includes a step (S10) of preparing a tow prepreg, a step (S20) of installing a tow prepreg on the first bobbin, A first conveying step (S30) of conveying the tow prepreg provided on the bobbin in one direction, a cutting step (S40) of cutting the tow prepreg to be conveyed by using a hopper, a step of cutting the tow prepreg (S50) of discharging the first release film to the upper side of the second conveyor, a step (S60) of installing the first release film on the second bobbin, a first release film provided on the second bobbin, A second transfer step S70 for transferring the prepreg mat in the other direction, a step (S80) for installing the second release film on the third bobbin, a step (S90) for laminating the second release film on the top of the tow prepreg mat ), A first release (S100) heating the film, the tow prepreg mat and the second release film through a heating unit, pressing the heated first release film, the tow prepreg mat and the second release film through a compression roller (S110 And a second discharging step S120 for discharging the chip mat using the pressed prepregs.

In addition, in the method of manufacturing a chip mat using a tow prepreg, the tow that has soaked in the resin so that the resin content (Resin Content, RC) can be controlled while thoroughly impregnating the tow and the resin must pass through the roller.

The rollers can be used in combination of rubber or metal rollers. The roller may be a first conveying roller, a second conveying roller, a pressing roller, or the like.

Step (S10) of manufacturing the tow prepreg can be performed by impregnating the tow in a one-part type resin having a half height and then impregnating the tow with a resin to prepare a tow prepreg.

By way of comparison, when comparing a prepreg to a tow prepreg, the prepreg generally has a resin content of about 30-40%, and the tow prepreg typically has a resin content of about 20-60%. As described above, since the toe prepreg has a wider selection range of tow than the prepreg, it is possible to realize a wider range of physical properties.

In particular, the one-part type resin of the present invention may be a resin in which the base material and the curing agent are mixed. Further, the one-component resin may be a resin in which the solid-phase resin and the liquid resin are mixed.

It is preferable that the resin for the tow prepreg has proper tack so that the tow prepreg can separate the tow prepreg from the bobbin while maintaining good shape at the time of manufacturing the chip mats. Therefore, the resin for tow prepreg can be compounded by suitably combining the ratio of the solid resin and the liquid resin during the production of the resin.

The solid phase resin may be 20 to 40 parts by weight.

This is because, when the solid-state resin is less than 20 parts by weight, the viscosity of the one-component type resin becomes too low and workability may be deteriorated. When the solid resin is more than 40 parts by weight, the viscosity may become too high and the workability may be deteriorated.

The liquid resin may be formed in an amount of 60 to 80 parts by weight.

This is because if the liquid resin is less than 60 parts by weight, the viscosity of the one-component type resin becomes too high and the workability may be deteriorated. If the amount of the liquid resin exceeds 80 parts by weight, the viscosity may be lowered and the workability may be deteriorated.

In the step S20 of installing the tow prepreg on the first bobbin, the tow prepreg may be provided on the first bobbin 10. [

The first transfer step (S30) for transferring the tow prepreg provided on the first bobbin in one direction can transfer the tow prepreg provided on the first bobbin (10) through the first conveyor (40) in one direction.

In the cutting step S40 of cutting the tow prepreg to be transported by using the hopper, the tow prepreg conveyed through the first conveyor 40 can be cut by using the punching part 100. [

In the first discharging step (S50) in which the cut tow prepreg mat is discharged to the upper side of the second conveyor located below the first conveyor, the toe prepreg mat cut by the punching part (100) The second conveyor 50 is located at the upper side of the second conveyor 50.

In the step S60 of installing the first release film on the second bobbin, the first release film may be provided on the second bobbin 20.

For reference, the step (S60) of installing the first release film on the second bobbin may proceed directly after the step (S20) of installing the tow prepreg on the first bobbin.

The second transfer step S70 for transferring the tow prepreg mat stacked on the first release film to the second bobbin and the second transfer step S70 for transferring the tow prepreg mats to the other direction is performed by the first release film F1 provided on the second bobbin 20, And the tow prepreg mat (T) stacked on the first release film (F1) can be transported in the other direction by using the second conveyor (50).

In the step S80 of installing the second release film on the third bobbin, the second release film may be provided on the third bobbin 30.

For reference, the step (S80) of installing the second release film on the third bobbin can be directly advanced after the step (S60) of installing the first release film on the second bobbin.

In the laminating step S90 in which the second release film is laminated on the top of the tow prepreg mat, the second release film F2 may be laminated on the top of the tow prepreg mat T. [

The heating step (S100) of heating the first release film, the tow prepreg mat and the second release film through the heating section is performed by heating the first release film, the tow prepreg mat and the second release film through the heating section .

The viscosity of the resin impregnated in the tow can be increased by the heating step (S100) of heating the first release film, the tow prepreg mat and the second release film through the heating section. As a result, the toe prepregs become tacky, and the tow prepreg mat (T), the first release film (F1) and the second release film (F2) can be brought into close contact with each other. In addition, the temperature at the time of heating may be 60 to 100 degrees. If it is less than 60 degrees, the viscosity of the resin is not changed and the prepreg mat (T) and the first release film and the second release film may not be in close contact with each other. On the other hand, when it is more than 100 degrees, there is a problem that the resin is hardened and can not be processed later. Therefore, the temperature condition at the time of heating is preferably 60 to 100 degrees, which is a temperature at which the resin does not harden the tow prepreg.

The step S110 of pressing the heated first release film, the tow prepreg mat, and the second release film through the compression rollers (S110) includes a first release film, a tow prepreg mat, and a second release film The film can be squeezed by passing through the pressing roller 90.

For reference, the step S110 of pressing the heated first release film, the tow prepreg mat, and the second release film through the compression roller (S110) may be performed at a temperature of 70 to 100 degrees.

In a second discharging step (S120) in which the chip mat using the compressed prepreg is discharged, the chip mat using the compressed prepreg can be discharged.

The cutting step S40 of cutting the tow prepreg to be transported by using the hopper is performed to prevent the resin from adhering to the first conveyor 40 or the punching part 100 at the time of cutting the tow prepreg, And a cooling step (S41) of cooling down to minus 20 degrees.

Concretely, the cooling step S41 for cooling from 0 deg. To -20 deg. May serve to prevent the cutter 111 of the punching section 100 from being contaminated with resin.

For reference, the cooling unit 200 may be formed in a section where the shaping unit 100 is located.

To this end, the cooling step (S41) for cooling from 0 deg. To -20 deg. Can maintain the temperature condition of 0 deg. To -20 deg. When the section temperature of the cooling part 200 is more than 0 degree, the viscosity of the resin is high and it may stick to a place such as the cutter 111 or the blade. If the temperature of the cooling part 200 is less than -20 ° C, the tow prepreg mats become hard due to the low viscosity of the resin, so that the mat shape is not constant and can be broken during the cutting step. Accordingly, the temperature of the cooling section 200 is preferably 0 to 20 degrees.

The cutting step S40 of cutting the tow prepreg to be transported by using the hopper is performed by using the brush part 130 to remove the cut tow prepreg that sticks to the first conveyor 40 or the padding part 100 (S42) for removing the foreign substance.

Specifically, the foreign substance removal step S42, which is performed using the brush 130, may remove the tow prepreg attached to the first conveyor 40. FIG. The foreign matter removing step S42 to be removed by using the brush part 130 is cut by the punching part 100 to remove the tow prepreg or the tow prepreg mat adhering to the punching part 100 .

Further, when the width or length of the tow prepreg mat is less than 10 mm, the workability may not be easy. Further, when the width or the length of the tow prepreg mat is more than 100 mm, it is difficult to manufacture the chip mat C having a constant size.

Therefore, it is preferable that the tow prepreg mat has a width or length of 10 to 100 mm.

As described above, a chip mat can be manufactured by a method of manufacturing a chip mat using a tow prepreg.

As the tow prepreg composition, aramid fiber, glass fiber or carbon fiber may be used depending on the use of the fiber.

Tow towers can use Large Tow (36 ~ 60K) in Small Tow (1 ~ 24K) depending on usage.

That is, fibers having a fiber bundle count of 1 to 60 K can be selected.

The resin may be a thermosetting resin such as epoxy, vinyl ester, phenol, or polyimide.

In addition, a curing agent is essentially included, and if necessary, may contain additives such as additives, antifoaming agents, pigments, curing accelerators and the like.

The composition of the chip mat may essentially include a chopped tow prepreg and a release film of a certain length. As the release film, a first release film and a second release film may be used.

The present invention can include an epoxy resin composition.

The epoxy resin composition may include an epoxy resin [A], a TPAE [B], and a curing agent [C]. The epoxy resin [A] contained in the epoxy resin composition of the present invention may contain two or more glycidyl groups in the molecule. By containing at least two glycidyl groups in the epoxy resin, the content of the inorganic fine particles in the resin composition as a whole can be greatly improved when the compounds are mixed. The specific properties attributable to the inorganic fine particles can be sufficiently exhibited, and the thermal expansion rate can be significantly lowered. Therefore, the insulating property and thermal shock resistance can be improved.

100 parts by weight of the epoxy resin [A] in the epoxy resin composition may be used.

An epoxy resin is a thermosetting resin produced by polymerization of a dendritic substance having two or more epoxy groups in a molecule and an epoxy group. The epoxy resin is excellent in mechanical properties such as bending strength and hardness, and does not cause generation of volatile substances and shrinkage in volume during curing, and has a large adhesive force in terms of material. Based on these properties, it is used to adhere almost everything such as ceramics, glass and metal plate adhesion. It is also excellent in chemical resistance and used for paints and the like.

Epoxy resins are synthesized by condensation polymerization of bisphenol A and epichlorohydrin. By controlling the ratio of bisphenol A to epichlorohydrin, epoxy resins having various molecular weights can be prepared. Epoxy resins have epoxy groups in the molecule. This epoxy group reacts with the curing agent to form a three-dimensional polymer structure crosslinked.

The epoxy resin [A] used in the present invention is not particularly limited as long as it is a compound having two or more epoxy groups in the compound. Examples of the epoxy resin include bisphenol-A type epoxy resin, bisphenol-F type epoxy resin, bisphenol S type epoxy resin, brominated epoxy resin, hydrogenated bisphenol-A type epoxy resin A novolac type epoxy resin, a phenol epoxy resin, an epoxy modified polyol, a dimer acid modified epoxy resin, a rubber modified epoxy resin, a urethane modified epoxy resin , Naphthalene type epoxy resin, epoxy resin having fluorene skeleton, epoxy resin made of a copolymer of phenolic compound and dicyclopentadiene, diglycidylglycerinol, tetrakis (glycidyloxyphenyl) ethane, Glycidyl ether type epoxy resin compositions such as tris (glycidyloxyphenyl) methane, tetraglycidyldiaminodiphenylmethane, triglycidylaminophenol, triglycidylaminok It may be a sol, tetraglycidyl xylene diamine and a glycidyl amine type, such as an epoxy resin, a biphenyl type epoxy resin, an isocyanate modified epoxy resin, mixtures thereof and the epoxy resin having in the 2 or more epoxy groups such molecules.

The epoxy resin [A] used in the present invention can be used alone or in combination with the above-mentioned kinds of resins. Particularly, when it is applied to a composite material having excellent heat resistance and mechanical properties, a polyfunctional epoxy resin and a bifunctional epoxy resin can be used in combination. For example, a polyfunctional epoxy resin is used in combination with a phenol novolak type epoxy resin, a bifunctional epoxy resin A bisphenol A type epoxy resin or a bisphenol F type epoxy resin can be used in combination.

Further, an epoxy resin and a thermosetting resin can be copolymerized and used. Examples of the thermosetting resin that can be used in this case include an unsaturated polyester resin, a vinyl ester resin, an epoxy resin, a benzoxazine resin, a phenol resin, a urea resin, a melamine resin and a polyimide resin.

For reference, co-polymerization means co-polymerization of two or more monomers (monomers). Structures according to the type of copolymerization include alternating copolymers, random (random) copolymers, block copolymers and branched copolymers. Through this copolymerization, completely different thermal and mechanical properties can be imparted.

An epoxy resin having a defect-free nanostructure can be used by a self-assembly control of a block copolymer by a copolymer method of an epoxy resin which can be used in the present invention. In this case, the heat treatment time for crosslinking can be shortened.

Also, a polymer blend method in which different polymers are physically mixed can be used as a method of modifying physical properties of the polymer. This method can realize much more various properties than copolymerization.

In addition, the solid bisphenol A type epoxy resin provides a structure with a low cross-linking density as compared with the liquid bisphenol A type epoxy resin. Therefore, although the heat resistance is low, a structure having high toughness can be obtained. For this reason, the glycidylamine type epoxy resin or the liquid bisphenol A type epoxy resin is preferably used in combination with the bisphenol F type epoxy resin.

In addition, the epoxy resin having a naphthalene skeleton has characteristics of low water absorption and high heat resistance.

In addition, biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, phenol aralkyl type epoxy resin and diphenyl fluorene type epoxy resin have a low water absorption property.

The urethane-modified epoxy resin and the isocyanate-modified epoxy resin also have high fracture toughness and elongation.

The TPAE [B] used in the present invention is a polyamide thermoplastic elastomer. The blending amount of TPAE [B] is preferably 1 to 30 parts by weight based on 100 parts by weight of the epoxy resin [A]. If the blending amount of TPAE [B] is less than 1 part by weight, the adhesiveness of the aramid fiber-reinforced composite material may be little. When the blending amount of TPAE [B] is more than 30 parts by weight, compatibility with epoxy resin may be poor and phase separation may occur, and viscosity may be increased, which may make it difficult to prepare prepreg.

In the epoxy resin composition for a fiber-reinforced composite material of the present invention, the components (components) other than the curing agent [C] are uniformly heated and kneaded at a temperature of about 150 to 170 캜 and then cooled to a temperature of about 60 캜 , Followed by kneading by adding a curing agent [C]. The mixing method of each component is not particularly limited to this method.

In the present invention, thermoplastic resin particles can be blended into the epoxy resin composition. When the aramid fiber-reinforced composite material is produced by blending the thermoplastic resin particles, the toughness of the matrix resin can be improved and the impact resistance can be improved.

For this reason, a thermoplastic resin can be mixed or dissolved in the epoxy resin composition of the present invention.

Such a thermoplastic resin is generally selected from the group consisting of a carbon-carbon bond, an amide bond, an imide bond, an ester bond, an ether bond, a carbonate bond, a urethane bond, a thioether bond, a sulfone bond and a carbonyl bond to a main chain May be a thermoplastic resin having a selected bond.

Further, the thermoplastic resin may have a partially crosslinked structure. It may also be crystalline or amorphous.

Particularly, a polyimide having a polyimide, polycarbonate, polyacetal, polyphenylene oxide, polyphenylene sulfide, polyarylate, polyester, polyamide imide, polyimide, polyetherimide, At least one resin selected from the group consisting of polyether sulfone, polysulfone, polyether sulfone, polyether ketone, polyether ether ketone, polyaramid, polyether nitrile and polybenzimidazole may be mixed or dissolved in the epoxy resin composition.

In order to obtain excellent heat resistance of the epoxy resin composition, a thermoplastic resin having a glass transition temperature (Tg) of at least 150 캜 and at least 170 캜 of a thermoplastic resin is preferable. If the glass transition temperature of the thermoplastic resin to be blended is less than 150 캜, it may be easily deformed by heat when used as a molded article.

As the terminal functional group of the thermoplastic resin, a hydroxyl group, a carboxyl group, a thiol group, an acid anhydride and the like can be reacted with the cationic polymerizable compound and used.

The thermoplastic resin can compensate for the weakness of the epoxy resin. In addition, the instability of the thermoplastic resin in molding can be stabilized by the epoxy resin. Therefore, a mixture of an epoxy resin and a thermoplastic resin can obtain better physical properties than those obtained by using them alone.

As the material of the thermoplastic resin particles used in the present invention, a thermoplastic resin that can be used by mixing or dissolving in the epoxy resin composition can be used.

Among them, polyamide can be used. Of the polyamides, nylon 12, nylon 11 and nylon 6/12 copolymers have excellent thermosetting properties and can improve the bonding strength with resins.

The shape of the thermoplastic resin particles may be spherical particles, non-spherical particles, or porous particles. However, spherical particles do not deteriorate the flow characteristics of the resin, so they are excellent in viscoelasticity and have no origin of stress concentration , And can provide high impact resistance.

The epoxy resin composition for a fiber-reinforced composite material of the present invention can be used by blending a curing agent [C]. The curing agent [C] used in the present invention is a compound having an active group capable of reacting with an epoxy group.

The blending amount of the curing agent [C] is preferably 3 to 10 parts by weight based on 100 parts by weight of the epoxy resin [A]. If the blending amount of the curing agent [C] is less than 3 parts by weight, the epoxy resin composition may not be cured properly. If the blending amount of the curing agent [C] is more than 10 parts by weight, the unreacted dicyandiamide curing agent may remain and the heat resistance and mechanical properties of the epoxy resin composition may be deteriorated.

The curing agent [C] used in the present invention contains at least two amine hydroxyl groups per molecule, and includes dicyandiamide, 4-4'-Diaminodiphenylsulfone, 3-3'-Diaminodiphenylsulfone, 4-4'- Methylenedianiline, and mixtures thereof.

The curing agent [C] may be at least one selected from the group consisting of aromatic polyamines, aminobenzoic acid esters, various acid anhydrides, phenol novolak resins, cresol novolak resins, polyphenol compounds, imidazole derivatives, aliphatic amines, tetramethylguanidine, Carboxylic acid anhydrides such as hexahydrophthalic anhydride, Lewis acid complexes such as carboxylic acid hydrazide, carboxylic acid amide, polymercaptan and boron trifluoride ethylamine complex, and the like can be used.

Also included is at least one of a polyamide resin, amide amine resin, polyamide Adduct resin, modified aliphatic amine curing resin, modified alicyclic amine curing resin, modified aromatic amine curing resin, water soluble curing resin and acid anhydride curing resin Can be used.

As examples of dicyandiamide and urea compounds, a combination of 3,4-dichlorophenyl-1,1-dimethylurea or imidazoles can be used as a curing agent. As a result, a high heat resistance water resistance can be obtained while curing at a relatively low temperature.

When the epoxy resin is cured using an acid anhydride, a cured product having a lower water absorption rate than the amine compound curing can be used.

By using the curing agent as described, an epoxy resin composition having excellent heat resistance can be obtained. The optimum value of the amount of the curing agent added may vary depending on the type of the epoxy resin and the curing agent.

The epoxy resin composition for a fiber-reinforced composite material of the present invention can be used by blending a curing accelerator [D]. The curing accelerator [D] curing activity used in the present invention can be enhanced.

The blending amount of the curing accelerator [D] is preferably 0.1 to 10 parts by weight based on 100 parts by weight of the epoxy resin [A]. If the blending amount of the curing accelerator [D] is less than 0.1 part by weight, the curing acceleration reaction rate of the curing agent may be slowed down. When the blending amount of the curing accelerator [D] is more than 10 parts by weight, the viscosity of the epoxy resin composition may increase and the mechanical properties of the cured product may be deteriorated.

Examples of the curing accelerator [D] used in the present invention include 3-phenyl-1,1-dimethyl urea, 3- (3,4-dichlorophenyl) -1,1-dimethyl urea (DCMU) , Urea derivatives such as 3- (3-chloro-4-methylphenyl) -1,1-dimethyl urea and 2,4-bis (3,3-dimethylureido) toluene or imidazole derivatives as a curing accelerator .

When dicyandiamide alone is used, a temperature of about 170 to 180 DEG C is required for curing. However, the resin composition using such a combination can be cured at about 80 to 150 ° C.

In particular, a combination of dicyandiamide and a compound having two or more urea bonds per molecule may be used. As the compound having two or more urea bonds in one molecule, 1,1'-4 (methyl-m-phenylene) bis (3,3-dimethylurea) or 4,4'-methylene bis (phenyldimethylurea) is used . When these compounds are used, curing may be possible at a temperature of 150 to 160 ° C for 2 to 10 minutes.

In addition, when applied to a thin plate, the flame retardancy of the epoxy resin composition is improved and can be used for electric / electronic materials applications.

Further, the boron trifluoride ethylamine complex may be combined with the aromatic amine as a curing accelerator.

In a field requiring low-temperature curability, a latent curing agent may be used so that the curing agent can be activated at a reaction initiation temperature of 70 to 125 캜.

Such reaction initiation temperature (hereinafter referred to as activation temperature) can be obtained by differential scanning calorimetry (DSC). Specifically, the epoxy resin composition to which 10 parts by weight of the curing agent to be evaluated is added to 100 parts by weight of a bisphenol A type epoxy resin having an epoxy equivalent of about 184 to 194 is subjected to differential scanning calorimetry Can be obtained from the tangent line intersection. If the activation temperature is lower than 70 deg. C, the stability may not be sufficient. If the activation temperature is higher than 125 deg. C, sufficient curability may not be obtained.

Examples of the latent curing agent that activates at 70 to 125 占 폚 include a curing agent such as an amine curing type latent curing agent, a microcapsulated latent curing agent, an amine imide, a block isocyanate, and a carbamic acid ester in an epoxy group to form an oxazolidinone ring A vinyl ether block carboxylic acid, a salt of an imidazole and a carboxylic acid, a carbamine salt of an amine, an onium salt and the like can be used.

For reference, the amide duct type latent curing agent means a compound having primary, secondary and tertiary amino groups, and various imidazole compounds reacted with these compounds to have a high molecular weight and insolubilization at a storage temperature .

In addition, a microcapsulated latent curing agent may be used. For reference, the microcapsule type latent curing agent is prepared by coating a high molecular material such as an epoxy resin, a polyurethane resin, a polystyrene type, a polyimide, and a cyclodextrin as a shell with a curing agent as a nucleus to make contact between the epoxy resin and the curing agent Respectively.

Further, when a specific curing agent is combined with a latent curing agent which is activated at 70 to 125 ° C by a curing agent, rapid curing can be performed at a low temperature. For example, a curing agent system in which a latent curing agent such as "Amicure" PN-23 is combined with an organic acid dihydrazide such as valine dihydrazide, or a curing agent system in which a latent curing agent is combined with a curing accelerator such as DCMU can be used. By using the epoxy resin composition, the epoxy resin composition can be cured at about 110 DEG C for about 10 minutes.

The epoxy resin composition for a fiber-reinforced composite material of the present invention can be used by mixing an inorganic filler [E]. The inorganic filler [E] used in the present invention can improve heat resistance, durability and strength. The inorganic filler [E] improves the thermal stability of the epoxy resin composition by lowering the thermal expansion coefficient.

The blending amount of the inorganic filler [E] is preferably 0.1 to 5 parts by weight based on 100 parts by weight of the epoxy resin [A]. When the amount of the inorganic filler [E] is less than 0.1, the heat resistance of the epoxy resin composition may be deteriorated. When the blend amount of the inorganic filler [E] is more than 5 parts by weight, the resin is less denaturalized and the adhesion with the aramid fiber can be remarkably lowered.

Examples of the inorganic filler [E] include aluminum nitride, silicon carbide, talc, calcium carbonate, diatomaceous earth, vermiculite, boron nitride, fumed silica, silicon oxide, aluminum oxide, titanium oxide, magnesium oxide, . &Lt; / RTI >

The epoxy resin composition for a fiber-reinforced composite material of the present invention can be used by mixing a coupling agent [F]. The coupling agent [F] used in the present invention is intended to increase the adhesion between an organic epoxy resin and an inorganic material.

The mixing amount of the coupling agent [F] is preferably 1 to 10 parts by weight based on 100 parts by weight of the epoxy resin [A]. When the amount of the coupling agent [F] is less than 1 part by weight, the effect of improving the adhesion between the organic resin and the inorganic filler, which are components of the epoxy resin composition, may be insignificant. When the amount of the coupling agent [F] is more than 10 parts by weight, there is a problem that the glass transition temperature (Tg) is lowered.

Examples of the coupling agent [F] include 3-glycidoxypropyl trimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane (2- (3, Siloxane coupling agents such as 4-epoxycyclohexyl ethyl trimethoxysilane and 3-glycidyloxypropyl methyldiethoxysilane, and di (dioctylphosphato) ethylene titanate Titanate-based coupling agents such as di (cumyl) phenyl oxoethylene titanate, isopropyltri (dioctyl pyrophosphate) titanate, and the like can be used have.

The epoxy resin composition for a fiber-reinforced composite material of the present invention can be used by blending a nanotube structure [G] containing at least one of titanium oxide (TiO 2), tungsten oxide (WO 3), and Graphene Oxide. The nanotube structure [G] used in the present invention can greatly improve heat resistance, abrasion resistance and mechanical strength. The nanotube structure [G] can lower the coefficient of thermal expansion and improve the physical properties of the epoxy resin composition.

The blending amount of the nanotube structure [G] is 0.1 to 10 parts by weight per 100 parts by weight of the epoxy resin [A]. When the blending amount of the nanotube structure [G] is less than 0.1 part by weight, the effect of improving the physical properties of the epoxy resin composition may be insignificant. In addition, when the blending amount of the nanotube structure [G] is more than 10 parts by weight, there is a possibility that the resin has low water resistance and adhesion to the aramid fiber is lowered.

The epoxy resin composition for a fiber-reinforced composite material of the present invention can be used by blending a diluent [H]. The diluent [H] used in the present invention can be used for controlling the solubility, viscosity and specific gravity of the epoxy resin composition.

The diluent [H] is for lowering the viscosity of the epoxy resin composition.

The blending amount of the diluent [H] is 50 to 200 parts by weight per 100 parts by weight of the epoxy resin [A]. When the blending amount of the diluent [H] is less than 50 parts by weight, the effect of lowering the viscosity of the epoxy resin composition may be insignificant. If the amount of the diluent [H] is more than 200 parts by weight, the glass transition temperature (Tg) and mechanical properties of the cured product may be deteriorated.

Examples of the diluent [H] include alkyl monoglycidyl ethers containing at least one glycidyl group per molecule, phenol monoglycidyl ether, alkylphenol monoglycidyl ether, polyglycol diglycidyl ether , Alkyl diglycidyl ether, and the like.

Specific examples of the reactive diluent include a coenzyme type reactive diluent having one epoxy group, a bifunctional reactive diluent having two epoxy groups, and a multifunctional reactive diluent having three or more epoxy groups.

The epoxy resin composition for a fiber-reinforced composite material of the present invention may contain a latent curing accelerator, an antioxidant, a defoaming agent, a defoaming agent, a dispersing agent, a pigment, a dye and other components, if necessary, in addition to the above essential components.

Further, the components and additives may be dispersively mixed and vacuum-mixed using an universal mixer or the like.

Examples of the reinforcing fiber used in the prepreg of the present invention include aramid fiber, carbon fiber, carbon nanotube fiber, glass fiber, poly-phenylene benzobisoxazole (PBO) fiber, spectra fiber, high tensile polyethylene fiber, alumina fiber and silicon carbide fiber , Metal fibers, silicon carbide inorganic fibers, silicon nitride inorganic fibers, and the like. In addition, two or more of these fibers may be used in combination. The shape and arrangement of the reinforcing fibers are not limited. Thus, the shape and arrangement of the reinforcing fibers can be made in various forms, such as one-sided or cross-over.

Regarding the shape and arrangement of the aramid fibers, they can be selected from long fibers and fabrics aligned in one direction according to the needs of the user.

Particularly, in applications where light weight or high strength of the material is required, it is preferable to use aramid fibers having excellent non-elasticity and non-elasticity.

The aramid fiber used in the present invention may be an aramid fiber having a tensile modulus of at least 450 Gpa in terms of impact resistance. Further, in order to obtain a composite material having high rigidity and mechanical strength, aramid fibers having a tensile strength of 4.5 to 7 Gpa may be used. It is also preferable that the tensile elongation is 1.5 to 3% high strength, high elongation aramid fiber.

Further, in order to obtain a composite material having high rigidity and mechanical strength, an aramid having a tensile strength of 20 cN / dtex or more can be used.

It is also preferred that the fiber has an elastic modulus of from 350 to 700 cN / dtex.

Further, the elongation at break is preferably an aramid fiber having a high strength of 2.5 to 5%.

Hereinafter, the apparatus and method for manufacturing a chip mat using the tow prepreg of the present invention and the chip mat manufactured thereby will be described in more detail with reference to Examples 1 and 2 and Reference.

The manufacturing method of the tow prepreg and the chip mat and the physical property evaluation method used in the examples are shown below. However, the present invention is not limited to the embodiments described below.

Example 1: Tow Prepreg Produce

35 parts by weight of a liquid epoxy resin (YD128, BPA type, Kukdo Chemical Co., Ltd., Korea), 65 parts by weight of a solid epoxy resin (YD011, BPA type, Kukdo Chemical Co., Ltd., Korea), 10 parts by weight of dicyandiamide (DICY, Air Product) and 3 parts by weight of a curing accelerator (DCMU, Air Product) were charged and mixed in a semi-solid one-part type resin using a stirrer. The blended resin was used after being stored in a drying oven at 70 for about 30 minutes in order to lower the viscosity of the resin. The tow prepared carbon fiber (T800, Toray, Japan). The tow prepregs were soaked in the resin, and then they were passed through rollers for impregnation of fibers and resin to prepare tow prepregs. The prepared tow prepreg had a width of 8 mm and a resin content of 33%. The resin content was measured by weighing the toe prepreg cut to a length of 1 m and the weight after the solvent was volatilized by washing twice with acetone and storing at 80 for 10 minutes. )

[Formula 1]

Example 2: Chipmat Manufacturing and molding

The tow prepreg of Example 1 was prepared by hopping by the method of the chipmat manufacturing process, and the length of the hopped prepreg was 50 mm. The doped tow prepregs were randomly dispersed and made into chip mats in sheet form having a size of 300 x 300 mm and a weight of 600 g. The chip mats were manufactured by compression molding (compression molding) process with 150 to 100 ton pressure for 20 minutes.

For comparison of the physical properties of the chip mat of Example 2, a commercialized prepreg molding compound (HexMC, Hexcel, USA) was cut into 300 x 300 mm of the same size as a reference and the same conditions (temperature: 150, 20 minutes) by compression molding process.

The two composite materials were subjected to a tensile test using an universal testing machine (Instron 3382, Instron, USA) according to ASTM D3039, and the measured tensile strengths are shown in Table 1 and FIG. 4 (Table 1 . Comparison of Tensile Strength between Prepreg Molding Compound and Chip Mat (Example 2)

The measured tensile strengths were 260.1 MPa for Reference (HexMC) and 266.6 MPa for the chip mat of Example 2.

The chip mat of Example 2 showed a tensile strength of about 4% higher than the Reference. Thus, it can be seen that, by using the tow prepreg, it is possible to manufacture a composite material having properties similar to those of a molding compound using a conventional prepreg with a simplified process.

[Table 1]

INDUSTRIAL APPLICABILITY As described above, the apparatus and method for manufacturing a chip mat using the tow prepreg according to the present invention and the chip mat manufactured thereby can solve the problems of the prepreg and the molding compound.

Particularly, when a tow prepreg is used, a prepreg slitting process is omitted, and a chipmat can be manufactured by a simplified process than a molding compound process using a conventional prepreg, and the process cost can be reduced .

The chip mat according to the present invention has high fiber content and quasi-isotropic properties, so that it is possible to produce a molded article having excellent physical properties.

Further, the chip mat according to the present invention can realize physical properties of aluminum or more, and can be widely used in various industrial fields such as automobile and military parts.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be clear to the person.

In addition, since the components shown in the drawings can be enlarged or reduced for convenience of description, the present invention is not limited to the size and the shape of the components shown in the drawings, Those skilled in the art will appreciate that various modifications and equivalent embodiments are possible. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

10: 1st bobbin
20: second bobbin
30: Third bobbin
40: 1st conveyor
50: second conveyor
60: First conveying roller
70: Second conveying roller
80:
90: Compression roller
100:
101: first falling pin member
102: second buffing member
110:
111: Cutter
120: Vertical cutter
121: Cylinder
130: Brush part
200:
T: Tow prepreg mat
F1: First release film
F2: Second release film
C: chipmat

Claims

A chip mattress manufacturing apparatus using a tow prepreg (TOW PREPREG)
A first bobbin on which a tow prepreg is installed;
A first conveyor for horizontally conveying the tow prepreg;
A first conveying roller for conveying the first conveyor;
A first power transmitting part for rotating the first conveying roller;
A tipping section for cutting the transferred tow prepreg;
A first discharging portion for discharging the tow prepreg mat cut through the hopping portion;
A second bobbin on which the first release film is installed;
A second conveyor which is formed below the first conveyor and transports the first release film in a horizontal direction and the tow prepreg mat is laminated on the first release film;
A second conveying roller for conveying the second conveyor;
A second power transmitting part for rotating the second conveying roller;
A third bobbin provided with a second release film laminated on the top of the tow prepreg mat;
A heater for heating the first release film, the tow prepreg mat, and the second release film;
A pressing roller for pressing the first release film, the tow prepreg mat and the second release film that have passed through the heating section; And
And a second discharging portion for discharging the chip mat using the tow prepreg manufactured through the pressing roller,
A brush part formed on an upper surface, a side surface, or a lower side of the first conveying roller, the brush part being formed on a side surface or a lower side of the shampoo part to remove a cut tow prepreg stuck to the first conveyor or the shampoo part; Further,
Further comprising a cooling unit formed in a section in which the heating unit is located to maintain a temperature condition of 0 to -20 degrees so as to prevent the cutter of the heating unit from being contaminated with resin,
The cooling unit includes:
And the temperature of the tow prepreg is controlled so that the viscosity of the tow prepreg is controlled.

The method according to claim 1,
Wherein the hopping unit comprises:
A rotation part formed in a cylindrical shape;
A cutter disposed at regular intervals on the outer circumferential surface of the rotary part; And
And a shafting power transmission part for rotating the rotary part.

The method according to claim 1,
Wherein the hopping unit comprises:
A vertical cutter formed in a direction perpendicular to the horizontal direction in which the tow prepreg is fed; And
And a cylinder connected to the upper side of the vertical cutter and vertically moving the position of the vertical cutter vertically.

delete

Impregnating the tow in a one-part resin of semi-solid phase, and then impregnating the tow with the resin to prepare a tow prepreg;
Installing the tow prepreg in a first bobbin;
A first transfer step of transferring the tow prepreg provided in the first bobbin through the first conveyor in one direction;
A cutting step of cutting the tow prepreg to be transported by using a hopper;
A first discharging step of discharging the cut tow prepreg mat to an upper side of a second conveyor located below the first conveyor;
Installing a first release film on a second bobbin;
A second conveying step of conveying the tow prepreg mat stacked on the first release film provided on the second bobbin and the first release film in the other direction using the second conveyor;
Installing a second release film on a third bobbin;
Laminating the second release film on the top of the tow prepreg mat;
A heating step of heating the first release film, the tow prepreg mat and the second release film through a heating unit;
Pressing the heated first release film, the tow prepreg mat and the second release film through a compression roller; And
And a second discharging step of discharging the chip mat using the tow prepreg manufactured through the compression step,
The cutting step comprises:
A cooling step of cooling the whole section in which the hopping section is located to cool the tow prepreg so that the resin does not adhere to the first conveyor or the capping section; And
And removing the foreign matter using a brush so as to remove the cut tow prepreg sticking to the first conveyor or the shuffling portion.

The method according to claim 6,
The resin may be,
A resin mixed with a solid resin and a liquid resin,
The solid resin is composed of 20 to 40 parts by weight,
Wherein the liquid resin comprises 60 to 80 parts by weight of the liquid prepreg.

delete

A chip mat using a tow prepreg produced by a method of manufacturing a chip mat using the tow prepreg according to any one of claims 6 to 7.