KR101794834B1 - Ultrasonic Bonding Machine Moving Both Sides - Google Patents

Ultrasonic Bonding Machine Moving Both Sides Download PDF

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KR101794834B1
KR101794834B1 KR1020150164781A KR20150164781A KR101794834B1 KR 101794834 B1 KR101794834 B1 KR 101794834B1 KR 1020150164781 A KR1020150164781 A KR 1020150164781A KR 20150164781 A KR20150164781 A KR 20150164781A KR 101794834 B1 KR101794834 B1 KR 101794834B1
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lead frame
substrate
transducer
bonding
present
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KR1020150164781A
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Korean (ko)
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KR20170060380A (en
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이호승
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현대자동차주식회사
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K2203/18—
    • B23K2203/52—

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  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

Disclosure of Invention Technical Problem [8] The present invention has been made to solve the above-mentioned problems of the prior art, and it is an object of the present invention to provide an ultrasonic bonding apparatus for preventing breakage of a lead frame by bonding between a substrate and a lead frame by using a transducer driven by both sides It has its purpose.
According to an aspect of the present invention, there is provided an ultrasonic bonding apparatus for bonding a substrate and a lead frame disposed on an upper portion of a jig, the ultrasonic bonding apparatus comprising: a first transducer connected to the other side of a surface to be bonded of the lead frame; And a second transducer connected to the other side of the surface to be bonded of the substrate disposed on the jig; The ultrasonic bonding apparatus is driven by both sides.

Description

[0001] Ultrasonic Bonding Machine Moving Both Sides [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an ultrasonic bonding apparatus, and more particularly, to an ultrasonic bonding apparatus having a transducer driven by both sides.

Recently, environmental problems are emerging all over the world, and in order to cope with such problems in the whole industry, a method of saving fuel is being sought. In order to achieve fuel savings, the solution proposed in the field of automobile industry is to improve the efficiency of the automobile engine and reduce the weight of the automobile. If the vehicle is lightened, it can be a good measure to increase the fuel efficiency of the car. Under the eco-friendly trend, the automobile industry is developing a variety of eco-friendly vehicles aimed at reducing CO2 emissions to 95g / km, which is 27% of the present level, In addition, to meet the US Corporate Average Fuel Economy (CAFE) of 54.5 mpg (23.2 km / l) in 2025, automakers are committed to developing downsizing and fuel efficiency technologies.

As one of the ways to improve fuel efficiency, there are electric cars and hybrid cars that have recently come to the fore. In electric vehicles and hybrid vehicles, an electronic component package of power modules is applied, which is increasing interest in electric vehicles and hybrid vehicles as a device for converting DC electric energy of a battery into AC electric energy for application to motor driving. However, in order to reduce the cost of electric vehicles and hybrid vehicles, increase energy efficiency, and improve fuel efficiency, the structure of core parts such as battery and power module becomes complicated, and as high voltage and high voltage are increasingly used, Frame joining technology is becoming a very important research task.

Conventionally, the bonding between the substrate and the lead frame has conventionally been performed using various methods, but mainly using solder bonding or ultrasonic bonding. However, when the solder joint is applied between the substrate and the lead frame, there is a disadvantage in that the temperature must be raised to a high temperature of 200 degrees Celsius or more. In addition, it is difficult to repeat the process, and there is a problem that it is difficult to precisely join the solder joint to the point to be bonded. Further, when ultrasonic bonding is applied between the substrate and the lead frame, if the lead frame is integrated, it is necessary to apply a large vibration energy. However, in this case, there is a problem that the ceramic substrate weak in brittleness tends to be broken.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a joining apparatus capable of joining a large area with a small vibration energy using an ultrasonic joining apparatus driven by both sides.

Disclosure of Invention Technical Problem [8] The present invention has been made to solve the above-mentioned problems of the prior art, and it is an object of the present invention to provide an ultrasonic bonding apparatus for preventing breakage of a lead frame by bonding between a substrate and a lead frame by using a transducer driven by both sides It has its purpose.

The technical objects to be achieved by the present invention are not limited to the technical matters mentioned above, and other technical subjects which are not mentioned can be clearly understood by those skilled in the art from the description of the present invention .

According to an aspect of the present invention, there is provided an ultrasonic bonding apparatus for bonding a substrate and a lead frame disposed on an upper portion of a jig, the ultrasonic bonding apparatus comprising: a first transducer connected to the other side of a surface to be bonded of the lead frame; And a second transducer connected to the other side of the surface to be bonded of the substrate disposed on the jig; The ultrasonic bonding apparatus is driven by both sides.

In the present invention, it is preferable that the first transducer and the second transducer oscillate so as to be orthogonal to each other in parallel with the bonding plane of the lead frame and the substrate.

In the present invention, the metal material of the lead frame and the substrate is preferably an Al, Cu or Sn alloy.

In the present invention, the ceramic material of the lead frame and the substrate is preferably Al 2 O 3 , AlN, or Si 3 N 4 .

In the present invention, the frequency of the first transducer and the second transducer is preferably 10 to 60 kHz.

In the present invention, it is preferable that a starting pressure of the bonding surface between the substrate and the lead frame is 10 to 100 N and a final pressure is 100 to 300 N.

In the present invention, the first transducer and the second transducer preferably have a vibration width of 3 m.

In the present invention, the bonding energy between the substrate and the lead frame is preferably 50 to 300J.

In the present invention, the bonding time between the substrate and the lead frame is preferably 0.1 to 0.5 seconds.

According to the ultrasonic bonding apparatus driven by both sides of the present invention, it is possible to provide an ultrasonic bonding apparatus in which both sides are driven to prevent breakage of the lead frame by bonding between the substrate and the lead frame with a small vibration energy.

1 is a schematic view of a general substrate and a lead frame.
2 is a block diagram of an ultrasonic bonding apparatus in which one side is driven according to the related art.
Fig. 3 is a joint example of a substrate and a lead frame according to an embodiment of the prior art; Fig.
4 is a configuration diagram of an ultrasonic bonding apparatus in which both sides are driven according to an embodiment of the present invention.
Figure 5 is an exemplary view of a substrate and a lead frame bonded together according to one embodiment of the present invention and prior art;

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary terms, and the inventor should appropriately interpret the concepts of the terms appropriately It should be interpreted in accordance with the meaning and concept consistent with the technical idea of the present invention based on the principle that it can be defined. Therefore, the embodiments described in this specification and the configurations shown in the drawings are merely the most preferred embodiments of the present invention and do not represent all the technical ideas of the present invention. Therefore, It is to be understood that equivalents and modifications are possible.

Hereinafter, the present invention will be described in detail. The present invention is effective in preventing breakage of the lead frame 1 or the substrate 3 by joining the substrate 3 and the lead frame 1 with a small vibration energy by an ultrasonic bonding apparatus driven by both sides.

Fig. 1 is a configuration diagram of a general substrate 3 and a lead frame 1. Fig. The present invention is a technique for bonding the substrate (3) and the lead frame (1) using ultrasonic waves.

Generally, the present invention is an apparatus for bonding electronic package parts such as power modules. The materials of the power module to which the ultrasonic bonding is applied are aluminum (Al) alloy, copper (Cu) alloy, tin (Sn) alloy and the like, and ceramic materials are Al 2 O 3 , AlN, Si 3 N 4 and the like . Such ultrasonic bonding is applied to the bonding of homogeneous or heterogeneous materials to each other, and the bonding strength, bonding area, etc. of a certain standard should be ensured.

In the ultrasonic bonding, a pressing force and a vibrating force are simultaneously applied to a part made of two metal materials and a part made of a ceramic material so as to be bonded to one of the parts by applying high frequency vibration in parallel with the contact surface, Is broken and is bonded by local heat generation. In the case of ultrasonic bonding, there is an advantage that a bonding portion is obtained without melting the base material. In particular, heterogeneous bonding between metal and metal, ceramic and metal is possible, and the utilization thereof is very high.

2 is a configuration diagram of an ultrasonic bonding apparatus in which one side is driven according to the prior art. The substrate 3 is positioned on the jig 17 connected to the lower lead 15 and the lead frame 13 to be bonded on the substrate 3 is positioned. Thereafter, the upper lead 13 to which the transformer 11 for applying pressure to the lead frame 1 is connected is placed on the lead frame 1. In the prior art ultrasonic bonding apparatus driven by one side, the substrate 3 is fixed when the lead frame 1 is bonded. And the upper lead 13 which applies high-frequency energy to the lead frame 1 applies pressure. In the case of the conventional ultrasonic bonding apparatus driven by one side as described above, the lead frame 1 becomes larger or more complicated when the packaging is complicated, the injection is required, or other post-processing is required. In this case, since the whole of the lead frame 1 needs to be vibrated, a large amount of high frequency energy is required. However, when the lead frame 1 is large or complicated, energy and pressure higher than normal energy and pressure are required to vibrate the entirety of the lead frame 1, so that a large amount of energy enters locally, Breakage occurred at the junction of the lead frame 1. That is, if the packaging is complex or requires injection, a complex shape of the lead frame 1 is required, and the complex shape of the lead frame 1 is high in rigidity, so that it is necessary to apply higher energy or higher pressure during ultrasonic bonding do. Such high energy or pressure may damage the substrate. More specifically, sufficient energy or pressure must be applied to bond the lead frame 1 having a complicated shape, whereby stress concentration occurs from the tip 19 of the substrate and cracks are generated in the ceramic portion of the lead frame 1 There is a problem that it easily occurs. Fig. 3 is an exemplary view showing a junction of the substrate 3 and the lead frame 1 according to an embodiment of the related art. As shown in FIG. 3, when ultrasonic bonding is performed between the substrate 3 and the lead frame 1 using the ultrasonic bonding apparatus driven by one side of the prior art, it is confirmed that a stress is generated in the complicated lead frame 1 to generate a crack .

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an apparatus is constructed so that ultrasonic oscillation can be performed at two places. The two ultrasonic oscillation directions in the constructed facility are parallel to the joint surfaces, and the two ultrasonic oscillation directions can oscillate in directions perpendicular to each other. The jig 107 is used to attach the lead frame 1 to one oscillation axis and the substrate to the other oscillation axis to apply ultrasonic energy to the junction. In the case of oscillating only in one place, when the local bonding is strengthened or when the size of the lead frame 1 junction is large, a large oscillation energy must be applied to the oscillation, so that the substrate 3 is cracked locally In the present invention, since the substrate 3 itself generates ultrasonic vibration, it can be bonded even if only a small ultrasonic energy is applied to the lead frame 1.

4 is a configuration diagram of an ultrasonic bonding apparatus driven by both sides according to an embodiment of the present invention. The ultrasonic bonding apparatus driven by both sides of the present invention is an ultrasonic bonding apparatus in which the substrate 3 disposed on the top of the jig 107 and the lead frame 1 are bonded to each other, A first transducer (101) connected to the other side; And a second transducer 111 connected to the other side of the surface to be bonded of the substrate 3 disposed on the jig 107; . The first transducer 101 and the second transducer 111 are oscillated so as to be orthogonal to each other in parallel with the bonding surface between the lead frame 1 and the substrate 3, Wherein the ceramic material of the lead frame 1 and the substrate 3 is Al 2 O 3 , AlN, or Si 3 N 4 . The frequency of the first transducer 101 and the second transducer 111 is 10 to 60 kHz and the starting pressure of the joint surface between the substrate 3 and the lead frame 3 is 10 To 100N and a final pressure of 100 to 300N. The oscillation width of the first transducer 101 and the second transducer 111 is 3 μm and the bonding energy between the substrate 3 and the lead frame 1 is 50-300 J , And the bonding time of the substrate (3) and the lead frame (1) is 0.1 to 0.5 seconds.

More specifically, in the prior art, one transducer 11 is applied as shown in FIG. 2 to add ultrasonic vibration in one direction. However, according to the present invention, two transducers are placed as shown in Fig. 4, so that the vibration direction is oscillated so as to be orthogonal to each other in parallel with the bonding plane of the lead frame 1 and the substrate 3. [ Therefore, since the present invention vibrates in two directions with the first transducer 101 and the second transducer 111, even with energy of half the energy applied to the transducer 11 of the prior art, And the energy of the other transducer 111 plays an additional role in the joining.

Further, the ultrasonic bonding apparatus driven by both sides of the present invention can adjust the vibration timings of the first transducer 101 and the second transducer 111, respectively, in order to increase the bonding force between the components or increase the precision. The first transducer 101 can vibrate the second transducer 111 simultaneously while the first transducer 101 is vibrating and the second transducer 101 can be vibrated in the lead frame 1 while the first transducer 101 vibrates, It is possible to adjust the second transducer 111 to oscillate together after the load is applied.

The ultrasonic bonding apparatus driven by both sides according to the present invention adds one more transducer 111 compared to the prior art and is parallel to the bonding surface, but the vibration direction of the first transducer 101 and the vibration of the second transducer 111 So that the jig 107 located at the lower side is made to vibrate, making it possible to make the same energy addition even at a smaller amplitude.

In addition, in the present invention, it is preferable to apply ultrasonic waves of 10 to 60 kHz for sufficient ultrasonic energy application due to local friction between metal and metal or between metal and ceramic. More preferably 35 kHz. If the ultrasonic wave is less than 10 kHz, the vibration energy is small and only the friction occurs, but the bonding does not occur. If the ultrasonic wave is more than 60 kHz, the vibration energy becomes large. If the energy is excessively generated, the transducer or substrate microstructure There is a possibility that a change occurs in the component or the component is damaged.

Further, it is preferable that the pressure applied to the lead frame 1 and the substrate 3 of the present invention is 10 to 100 N at the start pressure and 100 to 300 N at the final pressure, more preferably 35 N, . On the other hand, when the initial pressure is 10N and the final pressure is less than 100N, sufficient pressure can not be applied between the lead frame 1 and the substrate 3 and sufficient bonding can not be obtained. If the initial pressure is 100N and the final pressure is 300N or more, There is a problem that cracks are generated in the lead frame 1 and the substrate 3.

In addition, it is preferable that the vibration width of the first transducer 101 and the second transducer 111 of the present invention has a vibration width corresponding to half of the prior art. Since the two transducers are vibrated in the present invention, there is an advantage that the same effect can be obtained even when the amplitude of the conventional technique is half the vibration. Therefore, it is preferable that the width is 3 [micro] m which corresponds to half of 6 [micro] m, which is the vibration width of the prior art.

In addition, the bonding energy of the present invention is preferably 50 to 300 J, more preferably 125 J. In order to obtain the same bonding force as in the prior art, the total amount of energy should be the same regardless of the number of transducers.

[Equation 1]

Figure 112015114630881-pat00001

(W = bonding power, mu = friction force, p = pressing force, v = oscillation speed)

In Equation (1), the bonding power is proportional to the frictional force, the pressing force, and the vibration speed. The frictional force depends on the state of the joint surface, and the pressing force can be obtained by substituting the values as described above.

&Quot; (2) "

Figure 112015114630881-pat00002

Equation (2) is an equation for obtaining the bonding energy by integrating the bonding power obtained according to Equation (1) over time. Therefore, it can be seen that the junction energy increases as the time increases. Using the above equations, the required bonding energy can be obtained in consideration of the surface state of the lead frame 1 and the substrate 3, the pressing force to be applied, the bonding time, and the vibration speed. Accordingly, the bonding time of the present invention is preferably 0.1 to 0.5 seconds. If the bonding time is less than 0.1 second, the bonding may not occur completely, only the oxide layer may be removed on the surface, and the bonding may not occur. If the bonding time exceeds 0.5 seconds, the ultrasonic energy is excessively added, . The first transducer 101 performs ultrasonic vibration from the beginning and the second transducer 111 vibrates together when the pressing force between the substrate 3 and the lead frame 1 reaches the start pressure .

In the case where the substrate 3 and the lead frame 1 are bonded to each other using the ultrasonic bonding apparatus driven by both sides of the present invention, the cracks of the lead frame 1 and the substrate 3, which are generated in the ultrasonic bonding apparatus, There is an advantage of not occurring.

The occurrence of cracks in the substrate 3 and the lead frame 1 can be confirmed by a nondestructive testing device, that is, a CT (Computer Tomography) or a SAM (Scanning Acoustic Microscopy). FIG. 5 is an exemplary view showing a state in which the substrate 3 and the lead frame 1 according to an embodiment of the present invention and the related art are bonded. A crack is generated as shown in FIG. 5B when the lead frame 3 and the substrate 1 are bonded to each other by applying the ultrasonic bonding apparatus driven by one side of the prior art. On the other hand, an ultrasonic bonding apparatus driven by both sides As a result, it can be seen that when the lead frame 3 and the substrate 1 are bonded to each other, cracks do not occur as shown in FIG. 5A.

The present invention has the same components as the transducers mounted on both sides, so that the substrate and the lead frame can be bonded with a small amount of ultrasonic energy, and the lead frame and the substrate can be prevented from cracking.

Although the present invention has been described in connection with the specific embodiments of the present invention, it is to be understood that the present invention is not limited thereto. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims and their equivalents. Various modifications and variations are possible.

1: Lead frame
3: substrate
11: Prior art transducer
13: Prior art upper lead
15: Prior art lower lead
17: Prior art jig
101: 1st transducer
103: Upper lead
105: lower lead
107: Jig
109: Tips
111: Second transducer

Claims (9)

1. An ultrasonic bonding apparatus for bonding a lead frame and a substrate disposed on an upper portion of a jig,
A first transducer connected to the other side of the surface to be bonded of the lead frame; And
A second transducer connected to the other side of the surface to be bonded of the substrate disposed on the jig; / RTI >
The first transducer and the second transducer oscillate so as to be orthogonal to each other in parallel with the bonding plane of the lead frame and the substrate,
Wherein a starting pressure of the bonding surface between the substrate and the lead frame is 10 to 100 N and a final pressure is 100 to 300 N. The ultrasonic bonding apparatus according to claim 1,
delete The method according to claim 1,
Wherein the metal material of the lead frame and the substrate is an Al, Cu, or Sn alloy.
The method according to claim 1,
Wherein the ceramic material of the lead frame and the substrate is Al 2 O 3 , AlN, or Si 3 N 4 .
The method according to claim 1,
Wherein the frequencies of the first transducer and the second transducer are 10 to 60 kHz.
delete The method according to claim 1,
Wherein an oscillation width of the first transducer and the second transducer is 3 m.
The method according to claim 1,
Wherein the bonding energy between the substrate and the lead frame is 50 to 300J.
The method according to claim 1,
Wherein the bonding time of the substrate and the lead frame is 0.1 to 0.5 seconds.
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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007301600A (en) * 2006-05-11 2007-11-22 Matsushita Electric Ind Co Ltd Joining method and its device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007301600A (en) * 2006-05-11 2007-11-22 Matsushita Electric Ind Co Ltd Joining method and its device

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