KR101794178B1 - Hybrid semiconductor package controlling radius of curvature by adjusting rigidity of mold - Google Patents

Hybrid semiconductor package controlling radius of curvature by adjusting rigidity of mold Download PDF

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Publication number
KR101794178B1
KR101794178B1 KR1020150127100A KR20150127100A KR101794178B1 KR 101794178 B1 KR101794178 B1 KR 101794178B1 KR 1020150127100 A KR1020150127100 A KR 1020150127100A KR 20150127100 A KR20150127100 A KR 20150127100A KR 101794178 B1 KR101794178 B1 KR 101794178B1
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South Korea
Prior art keywords
package
flexible
hardness
strip substrate
curvature
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KR1020150127100A
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Korean (ko)
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KR20170029923A (en
Inventor
이혁
정준희
류민구
김태원
송기홍
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(주)플렉스컴
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Priority to KR1020150127100A priority Critical patent/KR101794178B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5387—Flexible insulating substrates

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The hybrid package of the present invention includes: a flexible strip substrate which is bent upward and downward; a flexible strip substrate which is mounted on the flexible strip substrate at a first height (h1) and which has a first hardness (r1) And a second hardness r2 smaller than the first hardness r1, the second hardness being smaller than the first hardness r1, the second hardness being smaller than the first hardness. And a first flexible package. According to the structure of the present invention as described above, the radius of curvature can be kept constant even if the environment of the mounted component is different.

Description

[0001] The present invention relates to a hybrid package for controlling a radius of curvature of a mold,

The present invention relates to a hybrid package in which semiconductor components of various properties are mounted in a wearable band and yet maintains a constant radius of curvature of the entire band. More specifically, a plurality of molds of different properties are mounted on one strip substrate A hybrid package (e.g., a rigid package and a flexible package) may be packaged into two or more molds on one strip substrate, or a plurality of flexible packages having different flexibility may be mounted on one strip substrate A wearable package that is packaged in two or more molds on a substrate, wherein the strips control the radius of curvature of the entire package by adjusting the spacing between neighboring molds, adjusting the hardness of neighboring molds, Type bidirectional hybrid package .

Currently, the semiconductor industry is broadening its application range. Accordingly, packaging technology for integrated circuit devices such as semiconductor memories is increasingly demanded for high capacity, thinning, miniaturization and the like, and various solutions for solving the problems are being developed.

In particular, in recent years, flexible integrated circuit devices capable of bending are developed, and flexible integrated circuit packages capable of flexing with the above-mentioned integrated circuit devices are being developed.

However, conventional flexible integrated circuit packages have the following two problems.

Conventional substrates are designed such that one substrate is molded with a rigid material as a whole, so that they can not be bent. However, in a portable device such as a wearable device, a plurality of molds exist in one substrate in order to mount many parts on a small area , Warped and even bent, which has the advantage that many semiconductor components are mounted.

However, the flexible substrate used here is not capable of controlling the radius of curvature of the same specific part, and when stress is concentrated on the part repeatedly bending, cracks are generated in the contact area between the substrate and the mounting chip .

KR publication number 10-2015-0010209

SUMMARY OF THE INVENTION The present invention has been made in order to solve the problems of the prior art as described above, and it is therefore an object of the present invention to provide a method of manufacturing a flexible mold, Type bidirectional hybrid package in which the radius of curvature of the entire package is kept constant.

Another object of the present invention is to provide a strip type bidirectional hybrid package in which the flexibility of the mold is adjusted differently according to the use environment of the semiconductor component mounted inside the mold or the shape of the mold is changed in different ways, .

According to an aspect of the present invention, there is provided a hybrid package including: a flexible strip substrate which is bent upward and downward; a flexible strip substrate which is mounted on the flexible strip substrate at a first height (h1) A rigid package of a first hardness r1 maintaining a first spacing d1 and a rigid package of a second rigidity rigid substrate mounted on the flexible strip substrate at the first height h1 and maintaining a second spacing d2 to one or both sides And a second hardness (r2) smaller than the first hardness (r1).

According to another aspect of the present invention, there is provided a hybrid package comprising: a bidirectional flexible strip substrate; a flexible strip substrate mounted on the flexible strip substrate at a first height h1 and having a second gap d2 on one side or both sides, A first flexible package of a second hardness r2 and a second height h2 smaller than the first height h1 on the flexible strip substrate and having a first height h1 and a second height h2, And a second flexible package that maintains a narrow third spacing d3 and is substantially identical to the second hardness r1.

According to another aspect of the present invention, there is provided a hybrid package comprising: a bi-directional flexible strip substrate; a flexible strip substrate mounted on the flexible strip substrate at a first height (h1) and having a second gap (d2) And a third gap d3 which is narrower than the second gap d2 on one side or both sides of the first gap G1 and the second gap G2 on the flexible strip substrate, And a third softness package of a third hardness r3 less than the second hardness r2.

As described above, according to the configuration of the present invention, the following effects can be expected.

First, when the substrate is warped, the semiconductor component in which the problem occurs such that the function of the device mounted thereon is remarkably lowered, and the semiconductor component which has no trouble in the function of the device even if the substrate is bent is packaged on one flexible substrate And various components can be mounted on one wearable band.

Second, even when the flexible package is mounted on the same substrate, the hardness of the mold can be adjusted or the shape of the mold can be changed and the radius of curvature of the flexible package can be maintained constant over the entire area by reflecting the required flexibility. There is an effect of ensuring uniformity.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A and FIG. 1B are side views respectively showing the configuration of a hybrid package of a rigid package and a flexible package according to the present invention.
FIGS. 2A and 2B are side views respectively showing the configuration of a hybrid package having different mold shapes according to the present invention. FIG.
FIGS. 3A and 3B are side views respectively showing the configurations of a hybrid package having different mold hardnesses according to the present invention. FIG.

Brief Description of the Drawings The advantages and features of the present invention, and how to achieve them, will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. The dimensions and relative sizes of layers and regions in the figures may be exaggerated for clarity of illustration. Like reference numerals refer to like elements throughout the specification.

Embodiments described herein will be described with reference to plan views and cross-sectional views, which are ideal schematics of the present invention. Thus, the shape of the illustrations may be modified by manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention are not limited to the specific forms shown, but also include changes in the shapes that are produced according to the manufacturing process. Thus, the regions illustrated in the figures have schematic attributes, and the shapes of the regions illustrated in the figures are intended to illustrate specific forms of semiconductor devices or areas of semiconductor packages and are not intended to limit the scope of the invention.

Hereinafter, a preferred embodiment of the strip type bidirectional hybrid package according to the present invention having the above-described structure will be described in detail with reference to the accompanying drawings.

1A and 1B show a hybrid package structure of a hard package and a soft package according to the present invention, respectively.

1A and 1B, a hybrid package 100 includes a flexible strip substrate 110 bent upward and downward, a flexible strip substrate 110 mounted on a flexible strip substrate 110 at a first height h1, a rigid package 120 having a first hardness r1 maintaining a first distance d1 and a second hardness r1 mounted on the flexible strip substrate 110 at a first height h1 and having a second gap d2 And a first flexible package 130 having a second hardness r2.

The second hardness r2 is smaller in hardness than the first hardness r1 under the condition that the hard package 120 and the first flexible package 130 have the same height and the first gap d1 is smaller than the second gap r1, the radius of curvature of the rigid package 120 and the radius of curvature of the first flexible package 130 can be kept constant.

If the gap between the rigid packages 120 is wider than the gap between the first flexible packages 130, the radius of curvature, which is lowered due to rigidity of the rigid package 120, can be compensated.

Here, since the hard semiconductor package 120 is mounted with the semiconductor component which is troubled when it is bent inside, the mold for protecting the semiconductor component as well as the semiconductor component has a certain strength. Thus, such a rigid package 120 includes conventional semiconductor components and conventional molds.

The first flexible package 120 is mounted with a semiconductor component which does not cause a problem even if the first flexible package 120 is bent inward, and the semiconductor component and the mold protecting the same have flexibility. Thus, the first flexible package 130 includes a soft semiconductor part and a soft mold.

Therefore, although the standard is not necessarily defined, it is defined that a semiconductor component having a property that a constant electrical performance is degraded when a rigid package is bent, and a semiconductor component that does not hinder the performance of a flexible package when it is bent are defined.

In the case of a flexible package, its hardness is different and its use is different. Therefore, the following describes controlling the radius of curvature between hybrid packages that are different in hardness but different in hardness.

FIGS. 2A and 2B each show a configuration of a hybrid package in which mold shapes according to the present invention are different from each other.

Referring to FIGS. 2A and 2B, the hybrid package 100 of the present invention includes a bidirectional flexible strip substrate 110 which is bent or bent up and down, a flexible strip substrate 110 mounted on the flexible strip substrate 110 at a first height h1, A first flexible package 130 having a second gap d2 on one side or both sides and having a second hardness r2 and a second flexible package 130 having a second height h1 smaller than the first height h1 on the flexible strip substrate 110. [ (d2), and the hardness includes a second soft package (140) substantially identical to the second hardness (r2), the first hardness (r2) do.

As a result, the first and second flexible packages 130 and 140 are formed such that the third gap d3 is smaller than the second gap d2 but the second height h2 is greater than the first height d2 the radius of curvature of the first flexible package 130 and the second flexible package 140 can be kept constant.

In this way, the mold height of the third flexible package 140 is reduced to lower the neutral plane of the stress, and the radius of curvature can be constantly compensated even if the interval between the packages is narrower than that of the second flexible package 130.

3A and 3B show configurations of a hybrid package having different mold hardnesses according to the present invention.

3A and 3B, the hybrid package 100 of the present invention includes a bidirectional flexible strip substrate 110 which is bent or bent up and down, a flexible strip substrate 110 mounted on the flexible strip substrate 110 at a first height h1 A first flexible package 130 having a second gap d2 on one side or both sides and having a second hardness r2 and a second flexible package 130 mounted on the flexible strip substrate 110 at a first height h1, And a third flexible package 150 having a third gap d3 that is narrower than the second gap d2 to one or both sides and a third hardness r3 that is smaller than the second hardness r2.

The third gap d3 is smaller than the second gap d2 and the third gap hardness r3 is smaller than the second gap d2 under the condition that the height of the first flexible package 130 and the third flexible package 150 are equal to each other. the radius of curvature of the first flexible package 130 and the third flexible package 140 can be kept constant.

As described above, according to the present invention, it is understood that, in the case where the mold hardnesses are different from each other or the mold shapes are different from each other, the gap between the molds is controlled in order to keep the radius of curvature constant . Many other modifications will be possible to those skilled in the art, within the scope of the basic technical idea of the present invention.

100: Hybrid package 110: Flexible strip substrate
120: Hard package 130: First flexible package
140: second flexible package 150: third flexible package

Claims (6)

A flexible strip substrate bent upward and downward;
A rigid package of a first hardness r1 mounted on the flexible strip substrate at a first height h1 and maintaining a first spacing d1 at one or both sides; And
And a second softness r2 of a second hardness r2 smaller than the first hardness r1, the first softness r1 being greater than the first hardness r1, And a package. The method according to claim 1,
Wherein the first gap d1 is formed to be wider than the second gap d2 so that the radius of curvature of the hard package and the radius of curvature of the first soft package are equal to each other. 3. The method of claim 2,
A second flexible package mounted on the flexible strip substrate at a second height h2 and having a third gap d3 on one side or both sides and equal to the second hardness r2,
The first height h1 is higher than the second height h2 so that the radius of curvature of the first flexible package and the radius of curvature of the second flexible package are equal to each other and the second spacing d2 is greater than the third spacing d2, (d3). < / RTI > The method of claim 3,
A third flexible package having a third hardness r3 which is smaller than the second hardness r2 and which is mounted on the flexible strip substrate at a first height h1 and which maintains a third gap d3 to one side or both sides, And,
Wherein the second spacing d2 is formed to be wider than the third spacing d3 so that a radius of curvature of the first flexible package is equal to a radius of curvature of the third flexible package. A bidirectional flexible strip substrate;
A first flexible package of a second hardness r2 mounted on the flexible strip substrate at a first height h1 and maintaining a second spacing d2 to one or both sides; And
The flexible strip substrate being mounted on the flexible strip substrate at a second height h2 smaller than the first height h1 and having a third gap d3 narrower than the second gap d2 on one side or both sides thereof, By including the second flexible package identical to the second hardness r2,
Wherein a radius of curvature of the first and second flexible packages is kept constant. A bidirectional flexible strip substrate;
A first flexible package of a second hardness r2 mounted on the flexible strip substrate at a first height h1 and maintaining a second spacing d2 to one or both sides; And
And a third gap d3 which is smaller than the second gap d2 and which is smaller than the second gap d2 and which is mounted on the flexible strip substrate at a first height h1 and which is narrower than the second gap d2 to one side or both sides, By including the third soft package of hardness r3,
Wherein a radius of curvature of the first and third flexible packages is kept constant.
KR1020150127100A 2015-09-08 2015-09-08 Hybrid semiconductor package controlling radius of curvature by adjusting rigidity of mold KR101794178B1 (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003086760A (en) 2001-09-12 2003-03-20 Hitachi Ltd Semiconductor device and manufacturing method therefor

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150010209A (en) 2013-07-18 2015-01-28 하나 마이크론(주) Method of manufacturing flexible integrated circuit device package

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003086760A (en) 2001-09-12 2003-03-20 Hitachi Ltd Semiconductor device and manufacturing method therefor

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