KR101788161B1 - Solar cell module - Google Patents

Abstract

The present invention relates to a solar cell module.
A solar cell module according to an exemplary embodiment of the present invention includes: a plurality of cell strings in which a plurality of solar cells are connected in a long direction in a first direction; An inter connecter disposed between first and second solar cells adjacent to each other of the plurality of solar cells, the first and second solar cells being connected in series; A bushing bar connected to the last solar cell of each of the first and second cell strings adjacent to each other and connecting the first and second cell strings in the second direction; A first shield which is located in a second direction on the front surface of the interconnector and visually blocks the interconnector; And a second shield which is located long in the second direction on the front of the bushing bar to visually block the bushing bar.

Description

Solar cell module {SOLAR CELL MODULE}

The present invention relates to a solar cell module.

Recently, as energy resources such as oil and coal are expected to be depleted, interest in alternative energy to replace them is increasing, and solar cells that produce electric energy from solar energy are attracting attention.

Typical solar cells have a semiconductor portion that forms a p-n junction by different conductive types, such as p-type and n-type, and electrodes connected to semiconductor portions of different conductivity types, respectively.

When light is incident on such a solar cell, a plurality of electron-hole pairs are generated in the semiconductor portion, and the generated electron-hole pairs are separated into electrons and holes, respectively, so that the electrons move toward the n- Type semiconductor portion. The transferred electrons and holes are collected by different electrodes connected to the n-type semiconductor portion and the p-type semiconductor portion, respectively, and electric power is obtained by connecting these electrodes with electric wires.

A plurality of such solar cells may be formed as modules by being connected to each other by inter connecters.

On the other hand, the conventional solar cell module has a disadvantage in that a plurality of interconnectors are visible from the outside of the module, making the appearance of the solar cell module neat and invisible.

In addition, a cell string having a plurality of solar cells connected to each other through an interconnect is also connected to each other by a bushing bar. Such a bushing bar is also seen from the outside of the module, which disadvantageously makes the appearance of the solar cell module neat and invisible.

An object of the present invention is to provide a solar cell module having a more excellent appearance.

A solar cell module according to an exemplary embodiment of the present invention includes a semiconductor substrate, a plurality of solar cells having a first electrode and a second electrode on a surface of the semiconductor substrate are connected in a long direction in a first direction, A plurality of cell strings arranged in a matrix; An interconnector disposed in a second direction between the first and second solar cells adjacent to each other among the plurality of solar cells included in each of the plurality of cell strings and serially connecting the first and second solar cells; A bushing bar connected to the last solar cell of each of the first and second cell strings adjacent to each other among the plurality of cell strings and connecting the first and second cell strings in the second direction; A first shield which is located in a second direction on the front surface of the interconnector and visually blocks the interconnector; And a second shield which is located long in the second direction on the front of the bushing bar to visually block the bushing bar.

Here, the line width of the second shield at both ends in the second direction is larger than the center line width of the second shield, and the second shield may be asymmetric with respect to the second direction center line.

Here, the inner portion adjacent to the last solar cell of the first and second cell strings in the second shield projects from the edge portion of the last solar cell toward the last solar cell, and the outer portion located on the opposite side of the inner portion in the second shield May be formed in a straight line.

Here, the portion protruding from the inner portion of the second shield may protrude in the diagonal direction intersecting with the first and second directions.

Further, the inner portion of the second shield may be spaced apart from the semiconductor substrate of the last solar cell, or may overlap with the front edge of the semiconductor substrate of the last solar cell.

In addition, the second shield may be spaced apart in the second direction between the first and second cell strings.

Alternatively, however, the second shield may be further provided between the first and second cell strings, and the width of the second shield located between the first and second cell strings may be equal to the center line width of the second shield.

The first shield may be spaced apart from the semiconductor substrate of the first and second solar cells or may be overlapped with the front edge of at least one of the semiconductor substrates of the first and second solar cells.

For example, the first shield may be superimposed on the front edge of one of the semiconductor substrates of the first and second solar cells, and may be spaced apart from the other one of the semiconductor substrates.

Here, the width at which the front edges of the first shield and the semiconductor substrate overlap may be between 0.1 mm and 2 mm.

In addition, the minimum separation distance between the semiconductor substrate of the first solar cell and the semiconductor substrate of the second solar cell may be between 3.8 mm and 4.2 mm.

The width of both ends of the first shield in the second direction may be larger than the center width of the first shield.

Here, the widths of both ends of the first shield in the second direction gradually increase toward both ends of the first shield, and the first shield may be symmetrical with respect to the second direction centerline.

In addition, each of the first and second shields may be divided into a plurality of portions, and each of the divided portions may be overlapped.

Here, the first and second shields may include a substrate made of an insulating material, and a cohesion layer positioned on the rear surface of the substrate and adhering to the interconnector or the bushing bar.

For example, the substrate may include PET (polyethylene terephthalate), and the adhesive layer may include at least one material selected from the group consisting of Epoxy, Acryl, and silicone.

Further, the thickness of the substrate may be between 50 um and 70 um, and the thickness of the adhesive layer may be between 10 um and 30 um.

Also, the first and second shields may have a thermal strain of 10% or less at 180 캜 or lower.

In addition, a plurality of projections and depressions may be formed on the front surface, which is the light receiving surface of the substrate, or a light reflecting layer containing light reflecting particles or a metal material may be positioned on the front surface, which is the light receiving surface of the substrate, with the same plane shape as the plane shape of the substrate.

In addition, the light receiving surface hues of the first and second shields may be the same or the same color as the color of the rear sheet positioned on the rear surface of the solar cell.

The solar cell module further includes a first conductive wiring connected to the rear surface of the first electrode provided in each of the plurality of solar cells in the first direction and a second conductive wiring connected to the rear surface of the second electrode in the first direction, .

Here, the first and second electrodes are arranged long in the second direction intersecting the longitudinal direction of the first and second conductive wirings, and the first conductive wiring is connected to the first electrode by a conductive adhesive at a portion intersecting the first electrode And the second conductive wiring is connected to the second electrode by a conductive adhesive at a portion where the second conductive wiring intersects with the second electrode, And can be insulated from the first electrode by an insulating layer which is crossed.

The end portions of the plurality of first conductive wirings connected to the first solar cell among the plurality of solar cells and the end portions of the plurality of second conductive wirings connected to the second solar cell adjacent to the first solar cell, And can be commonly connected to the rear surface of the interconnector.

The interconnector may be spaced apart from the semiconductor substrates of the first and second solar cells.

The end portions of the plurality of first conductive wirings connected to the last solar cell of the first cell string and the end portions of the plurality of second conductive wirings connected to the last solar cell of the second cell string are connected to the projection region And can be commonly connected to the rear surface of the bushing bar.

Here, the bushing bar may be spaced apart from the semiconductor substrate provided in the last solar cell of each of the first and second cell strings.

The solar cell module according to an exemplary embodiment of the present invention includes a first shield for visually shielding the interconnector and a second shield for visually shielding the bus bar, thereby further enhancing the appearance of the solar cell module.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram for explaining an overall plan view of a solar cell module in which first and second shields are omitted in a solar cell module according to an example of the present invention; FIG.
FIG. 2 is a view for explaining an overall plan view of the solar cell module having the first and second shields in FIG.
3 is a cross-sectional view of a solar cell module according to an exemplary embodiment of the present invention.
FIGS. 4 to 10 are views for specifically describing the connection structure between the solar cells in each cell string, the solar cell structure, and an example of the first shield 400a.
11 is an example for more specifically illustrating a cross section of the first shield 400a applied in accordance with an example of the present invention.
FIG. 12 is a view for explaining the light reflection structure of the first shield 400a applied in accordance with an example of the present invention.
FIG. 13 is a diagram for explaining the comparison of planar shapes of the first shield 400a and the interconnector 300 applied according to an example of the present invention.
FIG. 14 is an example for more specifically illustrating a cross section in which the first shield 400a applied in accordance with an exemplary embodiment of the present invention is adhered onto the interconnect 300. FIG.
15 is a view for explaining a second example of the first shield 400a according to an example of the present invention.
16 is a view for explaining a third example of the first shield 400a according to an example of the present invention.
17 is a view for explaining an example in which a plurality of first shields 400a are provided and overlapped with each other.
FIGS. 18 and 19 are views for explaining an example of the second shield 400b in the solar cell module shown in FIG. 2. FIG.
20 is a view for explaining a modification of the second shield 400b 'in the solar cell module shown in FIG.
FIG. 21 is a view for explaining an example in which a plurality of the second shields 400b are formed to overlap with each other.
22 is a view for explaining an example in which a light reflection structure is formed on the second shield 400b.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.

In the drawings, the thickness is enlarged to clearly represent the layers and regions. When a layer, film, region, plate, or the like is referred to as being "on" another portion, it includes not only the case directly above another portion but also the case where there is another portion in between. Conversely, when a part is "directly over" another part, it means that there is no other part in the middle. Further, when a certain portion is formed as "whole" on another portion, it means not only that it is formed on the entire surface of the other portion but also that it is not formed on the edge portion.

Hereinafter, the front surface may be one surface of the semiconductor substrate to which the direct light is incident, and the rear surface may be the opposite surface of the semiconductor substrate in which direct light is not incident, or reflected light other than direct light may be incident.

In addition, the same width and length mean the same within 10% considering process errors.

Hereinafter, the cell string refers to a structure or a form in which a plurality of solar cells are connected in series to each other.

FIG. 1 is a view for explaining an overall plan view of a solar cell module in which first and second shields are omitted in a solar cell module according to an exemplary embodiment of the present invention. FIG. 2 is a cross- FIG. 3 is a view for explaining a cross-sectional view of a solar cell module according to an example of the present invention. FIG.

1 to 3, the solar cell module according to the present invention includes a plurality of cell strings to which a plurality of solar cells are connected, an interconnector 300 for serially connecting a plurality of solar cells, a plurality of cell strings A first shield 400a and a second shield 400b which are connected to the first and second conductive wires 310 and 320. The first and second conductive wires 210 and 220 A front transparent substrate 10 that encapsulates a cell string, fillers 20 and 30, a back sheet 40, and a frame 50.

Here, in each cell string, a plurality of solar cells may be connected in a long length in the first direction (x) by the interconnector 300 in a state in which a plurality of solar cells are arranged long in the first direction (x).

Here, each of the plurality of solar cells may include a first electrode 141 and a second electrode 142 on the surface of the semiconductor substrate 110 and the surface of each semiconductor substrate 110, for example, on the rear surface thereof.

Such a plurality of solar cells will be described in more detail with reference to FIG.

The plurality of first and second conductive wirings 210 and 220 may be connected to the rear surface of each of the plurality of solar cells, as shown in Figs. Here, the plurality of first conductive wirings 210 may be connected to each of the plurality of first electrodes 141 formed in each solar cell, and the plurality of second conductive wirings 220 may be connected to a plurality of Two electrodes 142 may be connected.

In addition, a plurality of first and second conductive wirings 210 and 220 connected to each solar cell may be commonly connected to the interconnector 300. For example, as shown in Figs. 1 and 3, a plurality of first conductive wirings 210 connected to a first solar cell C1 and a plurality of second conductive wirings 210 connected to a second solar cell C2 The solar cell 220 may be connected in common to the interconnector 300 located between the first and second solar cells C1 and C2.

1 and 3, the plurality of solar cells to which the plurality of first and second conductive wirings 210 and 220 are connected is connected in series in the first direction x by the interconnector 300, Can be connected.

1, the interconnector 300 connecting the first and second solar cells C1 and C2 in series connects the first and second solar cells C1 and C2 adjacent to each other among the plurality of solar cells included in each of the plurality of cell strings, And may be arranged long in the second direction (y) between the solar cells C1 and C2.

1 and 3, a plurality of first conductive wires 210 connected to the first solar cell C1 and a plurality of second conductive wires 210 connected to the second solar cell C2, The front surface of the wiring 220 can be connected to the rear surface of the interconnector 300, so that a cell string in which a plurality of solar cells are connected in series can be formed.

In this way, each of the plurality of cell strings formed in the first direction (x) can be arranged in the second direction (y).

The bushing bar 310 may connect the first and second cell strings ST1 and ST2 adjacent to each other among the plurality of cell strings spaced in the second direction y in the second direction y.

1, an end portion of a plurality of first conductive wirings 210 connected to the last solar cell EC of the first cell string ST1 and a second end portion of the second cell string ST2, Each of the ends of the plurality of second conductive wirings 220 connected to the last solar cell EC of the semiconductor substrate 110 may protrude out of the projection area of the semiconductor substrate 110.

As described above, the entire end surfaces of the first and second conductive wirings 210 and 220 connected to the last solar cell EC of the first and second cell strings ST1 and ST2 are connected to the rear surface of the bushing bar 310 They can be connected in common.

The bending bar 310 is connected to the last conductive line 210 connected to the last solar cell EC of the first cell string ST1 adjacent to the first cell string ST1 adjacent to the last cell string ST1, The first and second cell strings ST1 and ST2 may be connected to the second conductive wiring 220 connected to the battery EC so as to connect the first and second cell strings ST1 and ST2 in the second direction y.

As shown in FIG. 3, the cell string may be thermally pressed and laminated while being disposed between the front transparent substrate 10 and the back sheet 40.

For example, a plurality of solar cells are disposed between the front transparent substrate 10 and the rear sheet 40, and transparent fillers 20 and 30, such as an EVA sheet, are disposed on the front and back surfaces of a plurality of solar cells as a whole , It can be integrated and encapsulated by a lamination process in which heat and pressure are simultaneously applied.

1, the front transparent substrate 10, the back sheet 40, and the fillers 20 and 30 encapsulated by the lamination process can be protected by fixing the edges by the frame 50 .

1, the front transparent substrate 10 and the fillers 20 and 30 are transmitted through the front surface of the solar cell module to form a plurality of solar cells and a plurality of first and second conductive wires 210 and 220 The inter connecter 300, the back sheet 40 and the frame 50 can be seen.

In addition, each of the cell strings may be arranged long in the first direction (x) and spaced apart in the second direction (y), and such plurality of cell strings may be arranged in a bushing bar 310 in a second direction (y).

Here, the front transparent substrate 10 may be formed of tempered glass having a high transmittance and excellent breakage-preventing function.

The back sheet 40 can prevent the moisture from penetrating from the rear surface of the solar cells C1 and C2 to protect the solar cell from the external environment. Such a backsheet 40 may have a multi-layer structure, such as a layer preventing moisture and oxygen penetration, a layer preventing chemical corrosion.

Such a backsheet 40 is made of a thin sheet made of an insulating material such as FP (fluoropolymer) / PE (polyeaster) / FP (fluoropolymer), but may be an insulating sheet made of another insulating material.

Such a lamination process may be performed in the state where the planar fillers 20 and 30 are disposed between the front transparent substrate 10 and the solar cell and between the solar cell and the rear substrate.

The materials of the fillers 20 and 30 may be formed of materials different from those of the insulating layer 252 to prevent corrosion due to moisture penetration and to protect the solar cells C1 and C2 from impact. And may be formed of a material such as ethylene vinyl acetate (EVA) capable of absorbing shock.

Accordingly, the sheet-like fillers 20 and 30 disposed between the front transparent substrate 10 and the solar cell and between the solar cell and the rear substrate can be softened and cured by heat and pressure during the lamination process.

In order to visually block at least the inter connecter 300 and the bushing bar 310 shown in FIG. 1 and to enhance the appearance of the module, the solar cell module according to the present invention includes a first shield 400a and a second shield 400b, And a shield 400b.

The first shield 400a is located on the front surface of the interconnector 300 in the second direction y so that the interconnector 300 is visually shielded so that the appearance of the solar cell module can be much improved have.

More specifically, the first shield 400a may be positioned on the interconnect 300 located between the solar cell and the solar cell to form a cell string, as shown in FIG. 2, y may be symmetrical with respect to the center line of the center line.

At this time, the color of the light receiving surface of the first shield 400a may be the same as or the same as the color of the rear sheet 40 (BS) shown between the cell strings, thereby further enhancing the appearance of the solar cell module .

The first shield 400a will be described in more detail with reference to FIG.

The second shield 400b is positioned on the front surface of the bushing bar 310 in the second direction y so as to visually block the bushing bar 310 to further enhance the appearance of the solar cell module.

2, the second shield 400b may be positioned above the bushing bar 310 to which the last solar cell EC of each cell string is connected, and the center line of the second direction y Can have a shape that is not symmetrical with respect to the reference.

Here, the second shield 400b may be located at the upper and lower ends of the solar cell module in the first direction (x), as shown in FIG.

In addition, an inner portion adjacent to each solar cell located at the end of the cell string in the second shield 400b may protrude toward the last solar cell EC toward both ends in the second direction y, The outer portion of the shield 400b may be formed in a straight line.

The solar cell module according to the exemplary embodiment of the present invention further includes the second shield 400b, thereby further enhancing the appearance of the solar cell module.

Such a second shield 400b will be described in more detail later with reference to FIG.

FIGS. 4 to 10 are views for specifically describing the connection structure between the solar cells in each cell string, the solar cell structure, and an example of the first shield 400a.

Here, FIG. 4 shows an example of a front surface of first and second solar cells C1 and C2 adjacent to each other among a plurality of solar cells included in each cell string, and FIG. 5 shows an example of the rear surface.

4 and 5, the first and second solar cells C1 and C2 adjacent to each other among the plurality of solar cells may be arranged in the first direction x, Each of the first and second electrodes C1 and C2 includes a plurality of first electrodes X1 and X2 extending in a second direction y that is spaced apart from each other at least on the rear surface of the semiconductor substrate 110 and the semiconductor substrate 110, A first electrode 141 and a plurality of second electrodes 142.

The plurality of first and second conductive wirings 210 and 220 are extended in a first direction x in the arrangement direction of the first and second solar cells C1 and C2, .

The plurality of first and second conductive wirings 210 and 220 may be formed of a plurality of first electrodes 141 and a plurality of second electrodes 142, 1 conductive wirings 210 and a plurality of second conductive wirings 220 crossing and overlapping the plurality of second electrodes 142. [

5, the first conductive wiring 210 includes a first conductive adhesive 251 made of a conductive material and electrically connected to the first electrode 141 provided in each of the plurality of solar cells C1 and C2, And may be insulated from the second electrode 142 by an insulating layer 252 made of an insulating material.

The second conductive wiring 220 is connected to the second electrode 142 provided in each of the plurality of solar cells C1 and C2 through the first conductive adhesive 251 and the insulating layer 252 One electrode 141 can be insulated.

The first and second conductive wirings 210 and 220 are made of a conductive metal and include a conductive core containing any one of gold (Au), silver (Ag), copper (Cu), and aluminum (Al) And a conductive coating layer including an alloy containing tin (Sn) or tin (Sn) and coating the surface of the core (CR).

The ends of the first conductive interconnects 210 connected to the interconnectors 300 may protrude out of the projection area of the semiconductor substrate 110 and may be connected to the interconnectors 300 may protrude out of the projection area of the semiconductor substrate 110. [0064]

The ends of the first and second conductive wires 210 and 220 are connected to the interconnector 300 so that a plurality of solar cells can be connected in series to each other.

More specifically, the interconnect 300 is located between the first solar cell C1 and the second solar cell C2 and may extend in the second direction y. Here, the interconnector 300 may be disposed apart from the projection region of the semiconductor substrate 110 of the first solar cell C1 and the projection region of the semiconductor substrate 110 of the second solar cell C2.

The end portion of the first conductive wiring 210 connected to the first electrode 141 of the first solar cell C1 and the second electrode of the second solar cell C2 The end portions of the second conductive wirings 220 connected to the first and second solar cells C1 and C2 are connected in common so that the first and second solar cells C1 and C2 can be connected in series in the first direction x.

4 and 5, the first shield 400a overlaps the front surface of the interconnector 300 and is long in the second direction y. (1) The first and second solar cells C1 (2) the semiconductor substrate 110 may be overlapped and adhered to the entire edge area of at least one of the semiconductor substrates 110 of the semiconductor substrates 110 and C2.

The edge of the semiconductor substrate 110 may be adjacent to the interconnector 300 and may be a side surface of the semiconductor substrate 110 in parallel with the second direction y.

In addition, the edge face may be a front face region adjacent to the side of the semiconductor substrate 110 described above. That is, the edge face may be a front face region adjacent to the side surface of the semiconductor substrate 110 in parallel with the second direction (y).

4 and 5, when a crystalline silicon wafer is used as the semiconductor substrate 110, a portion of the semiconductor substrate 110 where the side face in the first direction x intersects the side face in the second direction y includes a crystalline silicon As shown in Fig. 4, in the case where the edge portion of the edge region is located in the oblique direction, the edge portion of the edge portion of the first shield (x, y) (400a) can be overlapped and adhered.

The first shield 400a may be provided in the solar cell module in various forms as follows.

One first shield 400a is formed on the front surface of the interconnect 300 located between the first and second solar cells C1 and C2 so that the first and second solar cells C1 and C2 are connected to each other, The first shield 400a overlaps the front edge of each semiconductor substrate 110 or the second shield 400a overlaps one of the solar cells 110 of the first and second solar cells C1 and C2, And may be spaced apart from the semiconductor substrate 110 of the other solar cell.

Alternatively, as a third example, it may be spaced apart from the semiconductor substrate 110 of each of the first and second solar cells C1 and C2.

Here, an example of the first shield 400a formed in the first example will be described first with reference to FIG. 4 to FIG. 14, and the second example will be described with reference to FIG. 15, and the third example will be described with reference to FIG.

The first shield 400a may be opaque or translucent so that the interconnect 300 and the first and second conductive wirings 210 and 220 located between the first and second solar cells C1 and C2 may be visually Or the outline of the interconnector 300 and the first and second conductive wirings 210 and 220 is made to be clear so that the appearance of the module can be made cleaner and more beautiful.

4 and 5, when the first shield 400a is formed on the front surface of the interconnector 300 located between the first and second solar cells C1 and C2, The first shield 400a may be overlapped and adhered to both the front edge of the semiconductor substrate 110 of the first solar cell C1 and the front edge of the semiconductor substrate 110 of the second solar cell C2 .

The first shield 400a overlaps and adheres to the front edge region of at least one of the semiconductor substrates 110 of the first and second solar cells C1 and C2, This can prevent generation and diffusion of cracks that may occur at the edge of the semiconductor substrate 110 of the solar cell module during the manufacturing process.

In addition, the first shield 400a can visually block the first and second conductive wirings 210 and 220 connected to the rear surface of each solar cell as well as to visually block the interconnector 300, have.

The structure of a solar cell to which such a solar cell module is applied will be described in more detail as follows.

Fig. 6 is a partial perspective view showing an example of a solar cell applied to Fig. 1, and Fig. 7 is a sectional view in the first direction (x) of the solar cell shown in Fig.

6 and 7, an example of a solar cell according to the present invention includes an antireflection film 130, a semiconductor substrate 110, a tunnel layer 180, a first semiconductor section 121, The passivation layer 190, the plurality of the first electrodes 141, and the plurality of the second electrodes 142. The first electrode 141, the second electrode 142,

Here, the antireflection film 130, the tunnel layer 180, and the passivation layer 190 may be omitted. However, since the efficiency of the solar cell is improved, the following description will be made by way of example.

The semiconductor substrate 110 may be formed of at least one of monocrystalline silicon and polycrystalline silicon doped with impurities of the first conductivity type or the second conductivity type. In one example, the semiconductor substrate 110 may be formed of a single crystal silicon wafer.

Here, the impurity of the first conductive type contained in the semiconductor substrate 110 or the impurity of the second conductive type may be any of n-type and p-type conductive types.

When the semiconductor substrate 110 has a p-type conductivity type, impurity of a trivalent element such as boron (B), gallium, indium, or the like is doped in the semiconductor substrate 110. However, when the semiconductor substrate 110 has an n-type conductivity type, impurities of pentavalent elements such as phosphorus (P), arsenic (As), and antimony (Sb) may be doped into the semiconductor substrate 110.

Hereinafter, the case where the impurity contained in the semiconductor substrate 110 is an impurity of the second conductivity type and is n-type will be described as an example. However, the present invention is not limited thereto.

The semiconductor substrate 110 may have a plurality of uneven surfaces on the entire surface thereof. Accordingly, the first semiconductor part 121 located on the front surface of the semiconductor substrate 110 may also have an uneven surface.

Accordingly, the amount of light reflected from the front surface of the semiconductor substrate 110 decreases, and the amount of light incident into the semiconductor substrate 110 increases.

The antireflection film 130 is formed on the front surface of the semiconductor substrate 110 to minimize the reflection of light incident from the outside to the front surface of the semiconductor substrate 110. The antireflection film 130 is formed of an aluminum oxide film (AlOx), a silicon nitride film (SiNx) An oxide film (SiOx), and a silicon oxynitride film (SiOxNy).

The tunnel layer 180 is disposed in direct contact with the entire rear surface of the semiconductor substrate 110, and may include a dielectric material. Accordingly, the tunnel layer 180 can pass carriers generated in the semiconductor substrate 110, as shown in FIGS.

The tunnel layer 180 may pass carriers generated in the semiconductor substrate 110 and passivate the back surface of the semiconductor substrate 110.

In addition, the tunnel layer 180 may be formed of a dielectric material formed of SiCx or SiOx having high durability even at a high temperature process of 600 DEG C or more.

6 and 7, the first semiconductor section 121 may be disposed on the rear surface of the semiconductor substrate 110, for example, in direct contact with a part of the rear surface of the tunnel layer 180 .

The first semiconductor part 121 may be formed of a polycrystalline silicon material having a first conductivity type opposite to the second conductivity type and disposed in the second direction y on the rear surface of the semiconductor substrate 110 have.

Here, the first semiconductor section 121 may be doped with an impurity of the first conductivity type, and when the impurity contained in the semiconductor substrate 110 is an impurity of the second conductivity type, The pn junction with the semiconductor substrate 110 can be formed with the layer 180 therebetween.

The first semiconductor section 121 may have a p-type conductivity type and the plurality of first semiconductor sections 121 may be formed of p Impurity of the trivalent element can be doped in the first semiconductor portion 121. [0157]

The second semiconductor section 172 is extended on the rear surface of the semiconductor substrate 110 in a second direction y parallel to the first semiconductor section 121. The second semiconductor section 172 may be formed on the rear surface of the tunnel layer 180, 1 semiconductor region 121. In this case,

The second semiconductor section 172 may be formed of a polycrystalline silicon material doped with impurities of the second conductivity type at a higher concentration than the semiconductor substrate 110. Therefore, for example, when the semiconductor substrate 110 is doped with an n-type impurity which is an impurity of the second conductivity type, the plurality of second semiconductor regions 172 may be an n + impurity region.

The second semiconductor section 172 prevents the hole movement toward the second semiconductor section 172, which is the direction of electron movement, by the potential barrier due to the difference in impurity concentration between the semiconductor substrate 110 and the second semiconductor section 172 (E. G., Electrons) to the second semiconductor portion 172 can be facilitated.

Therefore, the amount of charges lost by recombination of electrons and holes in the second semiconductor section 172 and the vicinity thereof or the first and second electrodes 141 and 142 is reduced and the electron movement is accelerated, Can be increased.

6 to 7 illustrate a case where the semiconductor substrate 110 is an impurity of the second conductivity type and the first semiconductor section 121 serves as an emitter section and the second semiconductor section 172 ) Serves as a rear electric field portion.

Alternatively, when the semiconductor substrate 110 contains impurities of the first conductivity type, the first semiconductor portion 121 serves as a rear electric field portion and the second semiconductor portion 172 serves as an emitter portion .

6 and 7 illustrate the case where the first semiconductor section 121 and the second semiconductor section 172 are formed of a polycrystalline silicon material on the rear surface of the tunnel layer 180. Alternatively, If the layer 180 is omitted, the first semiconductor portion 121 and the second semiconductor portion 172 may be doped with impurities diffused in the rear surface of the semiconductor substrate 110. [ In this case, the first semiconductor section 121 and the second semiconductor section 172 may be formed of the same single-crystal silicon material as the semiconductor substrate 110.

6 to 7, the intrinsic semiconductor part 150 may be formed on the rear surface of the tunnel layer 180 exposed between the first semiconductor part 121 and the second semiconductor part 172, Unlike the first semiconductor part 121 and the second semiconductor part 172, the intrinsic semiconductor part 150 is formed of an intrinsic polycrystalline silicon layer in which impurity of the first conductivity type or impurity of the second conductivity type is not doped .

6 and 7, each of both side surfaces of the intrinsic semiconductor part 150 may have a structure in which the side surfaces of the first semiconductor part 121 and the side surfaces of the second semiconductor part 172 are in direct contact with each other have.

The passivation layer 190 is formed on the back surface of the polycrystalline silicon layer formed on the first semiconductor section 121, the second semiconductor section 172, and the intrinsic semiconductor section 150 by a dangling bond defect So that carriers generated from the semiconductor substrate 110 can be prevented from being recombined by the dangling bonds and disappearing.

The plurality of first electrodes 141 may be connected to the first semiconductor section 121 and extend in a second direction y. The first electrode 141 may collect carriers, for example, holes, which have migrated toward the first semiconductor section 121.

The plurality of second electrodes 142 may be connected to the second semiconductor portion 172 and extend in the second direction y in parallel with the first electrode 141. As such, the second electrode 142 can collect carriers, for example, electrons, which have migrated toward the second semiconductor section 172.

1, the first electrode 141 and the second electrode 142 may be alternately arranged in the first direction x.

The holes collected through the first electrode 141 and the electrons collected through the second electrode 142 in the solar cell according to the present invention are used as electric power of the external device through the external circuit device .

The solar cell applied to the solar cell module according to the present invention is not necessarily limited to those shown in FIGS. 6 and 7, and the first and second electrodes 141 and 142 provided in the solar cell are formed only on the rear surface of the semiconductor substrate 110 Other components can be changed at any time.

For example, in the solar cell module of the present invention, a part of the first electrode 141 and the first semiconductor part 121 are located on the front surface of the semiconductor substrate 110, and a part of the first electrode 141 is disposed on the semiconductor substrate 110 The MWT type solar cell may be connected to the remaining part of the first electrode 141 formed on the rear surface of the semiconductor substrate 110 through the hole formed in the semiconductor substrate 110. [

1, a cross-sectional structure in which the solar cell is connected in series using the first and second conductive wirings 210 and 220 and the interconnector 300 is shown in FIG.

Fig. 8 is a cross-sectional view taken along the line X1-X1 in Figs. 4 and 5. Fig.

As shown in FIG. 8, a plurality of solar cells including the first solar cell C1 and the second solar cell C2 can be arranged in the first direction (x).

At this time, the longitudinal direction of the first and second electrodes 141 and 142 provided in the first and second solar cells C1 and C2 is arranged to be oriented in the second direction y as shown in Figs. 5 and 6 .

The first and second solar cells C1 and C2 are connected to the first and second conductive wirings 210 and 220 while the first and second solar cells C1 and C2 are arranged in the first direction x, And one interconnection (300) extending in the first direction (x) to form one string connected in series.

In addition, the plurality of first and second conductive wirings 210 and 220 may have a conductive wire shape having a circular section or a ribbon shape having a width larger than the thickness.

Here, the line widths of the first and second conductive wirings 210 and 220 shown in Figs. 5 and 8 are set to 0.5 mm to 2.5 mm, respectively, while keeping the line resistance of the conductive wiring sufficiently low, And the gap between the first conductive wiring 210 and the second conductive wiring 220 may be formed in consideration of the total number of the first and second conductive wirings 210 and 220 so that the short- It may be formed to be between 4 mm and 6.5 mm so as not to be damaged.

Thus, the number of the first and second conductive wirings 210 and 220 connected to one solar cell can be 10 to 20, respectively. Accordingly, the sum of the total number of the first and second conductive wirings 210 and 220 connected to one solar cell may be 20 to 40. [

1, the first and second conductive wirings 210 and 220 are electrically connected to the first and second electrodes 141 and 142 formed on the rear surface of the semiconductor substrate 110 of each solar cell, May be connected via the insulating layer 251 or may be insulated by the insulating layer 252.

Here, the first conductive adhesive 251 may be formed of a metal material including an alloy containing tin (Sn) or tin (Sn). The first conductive adhesive 251 may be formed in the form of a solder paste containing an alloy containing tin (Sn) or tin (Sn), or may be formed of tin (Sn) or tin (Sn ) May be formed in the form of an epoxy solder paste or a conductive paste including an alloy containing a metal (e.g.

The insulating layer 252 may be any insulating material. For example, an insulating material such as epoxy, polyimide, polyethylene, acrylic, or silicone may be used.

8, the end portions of the first and second conductive wirings 210 and 220 connected to the rear surfaces of the first and second solar cells C1 and C2 are connected to each other through the inter- And may be connected to the connector 300 in common.

To this end, the ends of the plurality of first conductive interconnects 210 connected to the first solar cell C1 and the ends of the plurality of second conductive interconnects 220 connected to the second solar cell C2 are connected to the inter- The first and second solar cells C1 and C2 may protrude out of the semiconductor substrate 110 so as to overlap the connector 300. [

8, an end of each of the first and second conductive wirings 210 and 220 is overlapped with the inter connecter 300 to be connected to the inter connecter 300 through the second conductive adhesive agent 350. In this case, 300).

The second conductive adhesive agent 350 for bonding the first and second conductive wires 210 and 220 and the interconnector 300 to each other is made of a metal material containing an alloy containing tin (Sn) or tin (Sn) .

More specifically, the second conductive adhesive 350 may be formed of (1) a solder paste comprising an alloy containing tin (Sn) or tin (Sn), or (2) Sn or tin (Sn), or may be formed in the form of an electrically conductive paste (conductive paste).

The second conductive adhesive agent 350 for bonding the first and second conductive wires 210 and 220 and the interconnector 300 to each other may be formed of the same material as that of the first conductive adhesive agent 251, have.

That is, when the second conductive adhesive agent 350 is formed of different materials, for example, the second conductive adhesive agent 350 may be formed in the form of a solder paste containing tin (Sn) And may be formed in the form of an epoxy solder paste or a conductive paste including an alloy containing tin (Sn) or tin (Sn).

In addition, when the second conductive adhesive agent 350 is formed of different materials, the melting point of the second conductive adhesive agent 350 may be higher than that of the first conductive adhesive agent 251.

Since the solar cell module having such a structure has a separate interconnector 300, it is possible to connect the first and second conductive wirings 210 and 220 among the plurality of solar cells and the first and second electrodes 141 and 142 The connection between the interconnector 300 and the first and second conductive wirings 210 and 220 is released so that the solar cell can be replaced more easily.

8, one first shield 400a is formed on the front edge of the semiconductor substrate 110 of the first solar cell C1 and the second shield 400b on the front edge of the semiconductor substrate 110 of the first solar cell C1, 2 solar cell C2 can be overlapped and adhered to the front edge of the semiconductor substrate 110. [

This will be described in more detail as follows.

FIG. 9 shows a part of the front surface of the module in which the first shield 400a is enlarged in FIG. 4, and FIG. 10 is a rear part of the module in which the first shield 400a is enlarged in FIG.

9 and 10, the first shield 400a is formed as one unit between the first solar cell C1 and the second solar cell C2, and the first shield 400a is connected to the semiconductor substrate (not shown) of the first solar cell C1 110 and the front edge of the semiconductor substrate 110 of the second solar cell C2.

9, the first shield 400a is arranged on the semiconductor substrate 110 of the first solar cell C1 in parallel with the second direction y, as shown in FIG. 9 The front edge and the front edge of the semiconductor substrate 110 of the second solar cell C2 may be covered with the front edge.

Here, the first shield 400a has a structure in which the central axis of the first shield 400a is located between the first and second solar cells C1 and C2 and the first shield 400a is connected to the first and second solar cells C1 and C2 (Y) that intersects the first direction (x) which is the first direction (x). The first shield 400a can visually block the inter connecter 300 located between the first direction x and the first direction that is the series connection direction of the first and second solar cells C1 and C2, It is possible to visually block the first and second conductive wirings 210 and 220 exposed in the first direction x that is the series connection direction of the two solar cells C1 and C2.

4 and 9, when the semiconductor substrate 110 is formed of a single crystal silicon wafer, the first shield 400a in the second direction (the first direction) the width Wb400a of both ends may be larger than the center width Wa400a of the first shield 400a.

The width Wb400a of both ends of the first shield 400a in the second direction y may be gradually increased toward both ends of the first shield 400a in consideration of the shape of the edge region of the semiconductor substrate 110. [ . ≪ / RTI >

In addition, the plane shape of the first shield 400a may be formed symmetrically with respect to the center line in the second direction (y), as shown in Figs.

9, the second direction length L400a of the first shield 400a is longer than the second direction length L110y of the semiconductor substrate 110. Alternatively, the first shield 400a May be substantially the same as the second direction length L110y of the semiconductor substrate 110. The second direction length L400a may be substantially the same as the second direction length L110y.

The maximum width Wb400a of both ends of the first shield 400a is the minimum width Wa400a of the center of the first shield 400a or the minimum spacing DB110a between the first and second solar cells C1 and C2 And the maximum spacing distance of the corner regions of the first and second solar cells C1 and C2.

However, if the semiconductor substrate 110 is formed of a polycrystalline silicon wafer, the edge regions of the semiconductor substrate 110 do not exist in the semiconductor substrate 110, as shown in FIGS. 4 and 9, The width Wb400a of both ends of the first shield 400a in the second direction y may be equal to the center width Wa400a of the first shield 400a.

9 and 10, the minimum distance DB110 between the semiconductor substrates 110 of the first and second solar cells C1 and C2 may be between 3.8 mm and 4.2 mm, for example.

Unlike the first shield 400a, the line width W300 of the interconnect 300 may be the same along the second direction y and may be less than the minimum width Wa400a of the first shield 400a have. For example, the line width W300 of the interconnect 300 may be, for example, between 1 mm and 2 mm.

The minimum spacing between the semiconductor substrate 110 and the interconnector 300 of the first and second solar cells C1 and C2 may be between 1 mm and 2 mm, The minimum spacing distance between the substrate 110 and the interconnector 300 and the minimum spacing distance between the semiconductor substrate 110 and the interconnector 300 of the second solar cell C2 may be between 2 mm and 3 mm have.

The minimum width Wa400a of the first shield 400a may be greater than the line width W300 of the interconnect 300 and the minimum spacing DB110 between the first and second solar cells C1 and C2 . For example, the minimum width Wa400a of the first shield 400a may be between 4 mm and 6 mm.

9, the first shield 400a can cover the front edge of the semiconductor substrate 110 of the first and second solar cells C1 and C2, Is completely overlapped on the rear surface of the first shield 400a so that the interconnector 300 can be completely covered by the first shield 400a when viewed from the front side of the solar cell module.

The widths OL1 and OL2 of the first shield 400a overlapping the front edges of the semiconductor substrate 110 provided in the first and second solar cells C1 and C2 are 0.1 mm to 2 mm And the sum OL1 + OL2 of the overlapping widths OL1 and OL2 may be between 0.2 mm and 3 mm.

The first shield 400a is superimposed on and adhered to the front edges of the semiconductor substrate 110 provided in the first and second solar cells C1 and C2, It is possible to prevent a crack (A) that may occur at the edge of the substrate 110 from being generated or diffused.

More specifically, in the solar cell module according to the present invention, the first and second conductive wirings 210 and 220 may be connected to the rear surface of the semiconductor substrate 110. Here, for example, the first conductive wiring 210 connected to the semiconductor substrate 110 of the first solar cell C1 protrudes outside the semiconductor substrate 110 and is connected to the interconnector 300. However, The ends of the second conductive wirings 220 of the capacitor C1 are located at the edge of the semiconductor substrate 110. [

In the case where the end of the conductive wiring is positioned at the edge of the semiconductor substrate 110, if a slight impact is applied to the solar cell during the manufacturing process of the module or after the module is completed, There is a possibility that a crack is generated at the edge of the substrate 110 and a crack generated once is cracked due to the continuous diffusion of the generated crack, so that the corresponding solar cell is likely to fail to perform its function.

However, when the first shield 400a located on the front surface of the interconnect 300 is adhered to the edge of the front surface of the semiconductor substrate 110 of the first and second solar cells C1 and C2 as in the present invention, The first shield 400a mitigates the impact even when the impact is applied during the manufacturing process or module after the module is completed, so that the possibility of occurrence of the crack A as shown in FIG. 10 can be remarkably reduced, A can be effectively prevented from spreading due to the first shield 400a adhering to the front edge of the semiconductor substrate 110. [

Hereinafter, the cross section of the first shield 400a will be described in more detail.

11 is an example for more specifically illustrating a cross section of the first shield 400a applied in accordance with an example of the present invention.

As shown in FIG. 11, the first shield 400a may be cohesively attached to the front surface of the interconnector 300. FIG.

The first shield 400a includes a base material 410 made of an insulating material and an adhesive layer 420 disposed on the back surface of the insulating base material 410 facing the interconnector 300 and adhered to the interconnector 300, cohesion layer).

Herein, the substrate 410 functions as a body of the first shield 400a, and the adhesive layer 420 functions to cohesion the substrate 410 to the front surface of the interconnector 300 have.

Here, the term " sticking " means an adhesive force at which the two layers can be attached or separated from each other by physical force at room temperature.

Thus, adhesion is different from adhesion in which one layer is damaged when two layers are attached to each other through heat treatment and the two layers are separated.

The first shield 400a of the present invention is provided with the adhesive layer 420 so that when the position of the first shield 400a in the manufacturing process is not attached to a desired position of the inter connector 300, There is an advantage that the shield 400a can be detached from the interconnector 300 and reattached.

Here, the substrate 410 may be made of an insulating material, and may be formed of, for example, PET (polyethylene terephthalate).

In addition, the adhesive layer 420 may include at least one material selected from the group consisting of epoxy, acryl, and silicone.

The thickness 410T of the base material 410 may be between 50um and 70um in consideration of the thickness of the semiconductor substrate 110 and the interconnector 300 and the thickness 420T of the adhesive layer 420 may be between 50um and 70um, The thickness of the base material 410 may be in the range of 10um to 30um.

The first shield 400a may have a thermal strain of 10% or less at 180 DEG C or less.

This is because the lamination process can be performed in a state where the first shield 400a is adhered between the first and second solar cells C1 and C2. Since the lamination process is usually performed between 160 ° C and 170 ° C, So as to minimize deformation of the first shield 400a during the process.

Since the first shield 400a is located between the first and second solar cells C1 and C2 in order to maximize the optical gain of the solar cell module, .

FIG. 12 is a view for explaining the light reflection structure of the first shield 400a applied in accordance with an example of the present invention.

12 (a) is a view of the first shield 400a viewed from the front, and FIG. 12 (b) is a view of the first shield 400a as viewed from the front to illustrate an example of the light reflection structure of the first shield 400a. FIG. 12C is a cross-sectional view of the shield 400a, and FIG. 12C is a cross-sectional view of the first shield 400a for explaining another example of the light reflection structure.

As shown in FIG. 12, in order to maximize the optical gain of the solar cell module, the first shield 400a according to the present invention may have a light reflecting structure on the front surface thereof.

For example, as shown in FIGS. 12A and 12B, a plurality of protrusions P400a may be formed on the front surface of the light receiving surface of the substrate 410 included in the first shield 400a.

Here, as shown in FIG. 12 (a), a plurality of protrusions P400a formed on the front surface of the first shield 400a may be formed such that the protrusions and depressions of the protrusions and protrusions extend in the second direction y, The inclined surfaces formed between the depressions can be formed to be oriented toward the first and second solar cells C1 and C2.

Therefore, when light is incident on the front surface of the first shield 400a, light is emitted toward the first and second solar cells C1 and C2 adjacent to each other in the first direction x, as shown in FIG. 12 (b) So that the light receiving efficiency of the first and second solar cells C1 and C2 can be further improved.

A light reflecting layer 430 (see FIG. 12C) including light reflecting particles (for example, TiO 2) or a metal material (for example, aluminum) is formed on the front surface of the light receiving surface of the substrate 410 ) Can be located. The planar shape of the light reflection layer 430 may be the same as the planar shape of the base material 410.

In addition, the first shield 400a may have a planar shape different from that of the interconnector 300, as shown in FIG. Hereinafter, differences in shape between the first shield 400a and the interconnector 300 will be described.

FIG. 13 is a diagram for explaining the comparison of planar shapes of the first shield 400a and the interconnector 300 applied according to an example of the present invention.

13, the interconnector 300 is completely overlapped with the first shield 400a, and the planar shape of the first shield 400a may be formed differently from the planar shape of the interconnector 300. [

More specifically, as shown in Figs. 13A and 13B, the first shield 400a has a planar shape in which both sides are mutually symmetrical with respect to the direction central axis AX in the second direction (y) The interconnects 300 may be formed in a planar shape in which the both sides are asymmetrical with respect to each other with respect to the central core AX, unlike the first shield 400a, in order to alleviate the thermal expansion of the first and second conductive wires 210, A shape such as a zigzag shape as shown in Fig. 13 (a) or a shape in which a side surface of the interconnector 300 is piled up at different positions in the second direction y as shown in Fig. 13 (b) .

The first shield 400a according to the present invention has a minimum width Wa400a sufficient to completely cover the interconnector 300 even if the plane shape of the interconnector 300 is different from the plane shape of the first shield 400a And the interconnector 300 is visually interrupted, so that the appearance of the solar cell module can be made cleaner and more refined.

The cross-sectional structure of the first shield 400a adhered to the interconnect 300 is as follows.

FIG. 14 is an example for more specifically illustrating a cross section in which the first shield 400a applied in accordance with an exemplary embodiment of the present invention is adhered onto the interconnect 300. FIG.

The first and second electrodes 141 and 142 and the first and second conductive adhesives 251 and 350 and the insulating layer 252 of the first and second solar cells C1 and C2 Although the illustration is omitted, it has the same structure as that shown in FIG. 8, and the premise thereof will be described.

14A, the first shield 400a is adhered to the front edge of the semiconductor substrate 110 of the first and second solar cells C1 and C2 and the front surface of the interconnect 300, The adhesive layer 420 is adhered to the front edge of the semiconductor substrate 110 of the interconnector 300 and the first and second solar cells C1 and C2 Structure.

Here, the base 410 of the first shield 400a and the adhesive layer 420 may be provided flat in the first direction x, as shown in Fig. 14 (a) The semiconductor substrate 110 of the interconnector 300 and the first and second solar cells C1 and C2 and the first and second photovoltaic cells C1 and C2 are electrically connected to each other as shown in FIG. A portion of the first shield 400a that is not overlapped may be recessed toward the back side of the module.

15 is a view for explaining a second example of the first shield 400a according to an example of the present invention.

15A is a front view of the first shield 400a to illustrate a second example of the first shield 400a, and FIG. 15B is a sectional view of the first shield 400a.

The first shield 400a overlaps the front edge of the semiconductor substrate 110 of any one of the semiconductor substrates 110 of the first and second solar cells C1 and C2, And may be spaced apart from the substrate 110.

15A and 15B, the first shield 400a is located on the front surface of the interconnector 300 located between the first and second solar cells C1 and C2 And may be overlapped OL1 and adhered to the front edge of the semiconductor substrate 110 of the first solar cell C1 and may be separated from the semiconductor substrate 110 of the second solar cell C2 have.

In this case, the first shield 400a is adhered to the front edge of the semiconductor substrate 110 of the first solar cell C1, It is possible to reduce the possibility of occurrence of cracks at the edge of the semiconductor substrate 110 of the first solar cell C1 and the possibility of diffusion.

In addition, the first shield 400a completely covers the interconnector 300 located between the first and second solar cells C1 and C2, thereby further enhancing the appearance of the module.

The end portion of the second solar cell C2 spaced apart from the semiconductor substrate 110 in the first shield 400a shown in FIG. 15 (b) is subjected to the diffusion pressure of the upper filler EC1 during the lamination process, And may be bent in the direction of the interconnector 300, which is the rear direction of the module.

16 is a view for explaining a third example of the first shield 400a according to an example of the present invention.

16A, the first shield 400a is not overlapped with the projection area of each semiconductor substrate 110 of the first and second solar cells C1 and C2, have.

16, when the first shield 400a is separated from the semiconductor substrates 110 of the first and second solar cells C1 and C2 by the lamination process, Both ends of the first shield 400a in the first direction x may be bent in the direction of the inter connector 300 which is the rear direction of the module.

Although the first shield 400a provided between two adjacent solar cells has been described as an example, the first shield 400a may be provided so that a plurality of the divided first shields 400a are overlapped with each other.

17 is a view for explaining an example in which a plurality of first shields 400a are provided and overlapped with each other.

The first shield 400a positioned between two adjacent solar cells C1 and C2 may be divided into a plurality of solar cells C1a and C2b, and the plurality of divided solar cells C1a and C2b may be overlapped with each other.

17, the first shield 400a may be divided into first, second, and third subshields 401a, 402a, and 403a, and first, second, and third subshields 401a, 402a, and 403a may be overlapped with each other.

More specifically, each of the first, second, and third sub-shields 401a, 402a, and 403a is superimposed on the front edge of the semiconductor substrate 110 of each of the solar cells C1 and C2, The three sub shields 401a, 402a, and 403a may overlap each other in the second direction y.

Here, the first subshield 401a may be formed so as to extend in a second direction y with a constant line width.

The second and third sub shields 402a and 403a may be positioned at one end and the other end of the first sub shield 401a in the second direction y and may overlap with the first sub shield 401a.

The maximum width of the second and third sub shields 402a and 403a is larger than the spacing distance between the two solar cells C1 and C2 and may be larger than the line width of the first sub shield 200a. The minimum width of the second and third subshields 402a and 403a may be smaller than the line width of the first subshield 200a and the width of the second and third subshields 402a and 403a may be less than the width of the first subshield 200a. And the width gradually becomes narrower toward the shield 401a.

Hereinafter, the second shield 400b shown in FIG. 2 will be described in more detail.

Figs. 18 and 19 are diagrams for explaining an example of the second shield 400b in the solar cell module shown in Fig. 2. Fig. 18 (a) is a plan view of the second shield 400b, Fig. FIG. 18B is a sectional view of the second shield 400b, FIG. 18C is a view for explaining the position and function of the second shield 400b, and FIG. 19 is a cross- And a cross-sectional structure in which a bending bar 310 is connected to the last solar cell EC.

19, when the solar cell module is viewed from the plane, the bushing bar 310 is positioned on the semiconductor substrate 110 provided in the last solar cell EC of each of the first and second cell strings ST1 and ST2, As shown in FIG.

In addition, the end portion of the first conductive wiring 210 connected to the last solar cell EC in the solar cell module according to the present invention may protrude outside the projection area of the semiconductor substrate 110 of the last solar cell EC The rear surface of the bushing bar 310 may be connected to the entire surface of the end portion of the protruding first conductive wiring 210.

In addition, the buffering bar 310 may be connected to the front surface of the second conductive wiring 220 connected to the last solar cell EC of the adjacent cell string.

The bushing bar 310 may be connected to the first and second conductive wirings 210 and 220 through a third conductive adhesive 370.

The third conductive adhesive 370 may be formed of the same or different material as the first conductive adhesive 251 described above. Therefore, the melting point of the third conductive adhesive 370 may be substantially the same as or different from the melting point of the first conductive adhesive 251.

If the third conductive adhesive 370 and the first conductive adhesive 251 are made of different materials, the melting point of the third conductive adhesive 370 may be higher than that of the first conductive adhesive 251.

The second shield 400b is disposed on the front surface of the bushing bar 310 connected to the last solar cell EC of each cell string in the second direction y as shown in Figs. So that the bus bar 310 can be visually interrupted.

19, the inner portion S2 of the second shield 400b overlaps with the front edge of the semiconductor substrate 110 of the last solar cell EC, as shown in FIG. 19, .

At this time, the width OL3 of the second shield 400b overlapping the front edge of the semiconductor substrate 110 of the last solar cell EC may be between 0.1 mm and 2 mm.

However, as shown in Fig. 19, it is also possible that the second shield 400b is spaced apart from the semiconductor substrate 110 of the last solar cell EC. However, even if the second shield 400b is spaced apart from the semiconductor substrate 110 of the last solar cell EC, the width of the last solar cell EC, which is spaced apart from the semiconductor substrate 110, May be narrower than an interval between the substrate 110 and the bushing bar 310.

The planar shape of the second shield 400b may be asymmetric with respect to the center line of the second direction y when the solar cell module is viewed in a plane, as shown in Figs. 18A and 18C .

More specifically, the line width Wb400b at both ends in the second direction of the second shield 400b is greater than the center line width Wa400b of the second shield 400b, as shown in Figs. 18A and 18C, And the inner portion S2 adjacent to the last solar cell EC of the first and second cell strings ST1 and ST2 in the second shield 400b is larger than the last solar cell EC in the corner portion of the last solar cell EC. The outer portion S1 protruding in the first direction x which is the direction of the battery EC and located on the opposite side of the inner portion S2 in the second shield 400b may be formed in a straight line.

Here, the inner portion S2 of the second shield 400b may protrude in the diagonal direction intersecting the first and second directions at the corner portion of the last solar cell EC.

Accordingly, the inner portion S2 of the second shield 400b can be formed to correspond to the edge shape of the last solar cell EC.

The width Wc400b protruding in the oblique direction from the inner portion S2 of the second shield 400b may be equal to or less than 1.5 times the center line width Wa400ab of the second shield 400b.

Accordingly, the ratio of the center line width Wa400ab of the second shield 400b to the end line width Wb400ab may be between 1: 2 and 2.5.

The center line width of the second shield 400b may be between 10 mm and 12 mm and the end line width of the second shield 400b may be between 23 mm and 26 mm.

The length L400b of the second shield 400b in the second direction y may be substantially equal to the length L110y of the last solar cell EC in the second direction y.

The length of the second shield 400b in the second direction y may be between 160 mm and 165 mm.

18 (b), the second shield 400b includes a base 410 made of an insulating material, an adhesive layer (not shown) disposed on the back surface of the base 410 and adhered to the bushing bar 310 420, cohesion layer).

The materials of the base 410 and the adhesive layer 420 of the second shield 400b may be the same as the materials of the base 410 and the adhesive layer 420 of the first shield 400a described above .

In addition, the hue of the second shield 400b may be the same as the hue of the first shield 400a described above. Accordingly, the color of the light receiving surface of the second shield 400b may be the same or the same as the color of the rear sheet 40 positioned on the rear surface of the solar cell.

18 (c), the second shield 400b is sandwiched between the first and second cell strings ST1 and ST2 in the second direction y, as shown in FIG. 18 (c) Can be spaced apart.

In this case, as shown in FIG. 18 (c), a part of the bushing bar 310 may be exposed through the second shields 400b spaced in the second direction y.

Hereinafter, a modification of the second shield 400b modified to prevent a portion of the bushing bar 310 from being exposed will be described.

FIG. 20 is a view for explaining a modification of the second shield 400b 'in the solar cell module shown in FIG. 2. FIG. 20 (a) is a plan view of the second shield 400b' 20 (b) shows a front view of the solar cell module to which the second shield 400b 'according to the modification is applied, and FIG. 20 (c) shows the shape of the second shield 400b' (Y) are superimposed on each other.

20B, the second shield 400b 'according to the modified example has a structure in which when the solar cell module is viewed in a plan view, the second shield 400b' is formed in a spaced space between the first and second cell strings ST1 and ST2 .

Thus, in FIG. 18C, the bushing bar 310 exposed to the space between the first and second cell strings ST1 and ST2 can be completely cut off visually.

20 (a), the second shield 400b 'according to the modification may further include a second shield 400b' in the second direction y at the end of the portion derived in the first direction x, Can be extended.

Accordingly, the length La400b 'of the second shield 400b' in the second direction y according to the modified example is greater than the length (in the direction y) of the semiconductor substrate 110 provided in the solar cell in the second direction y L110y).

The extension length Lb400b 'of the portion extending further in the second direction y from the second shield 400b' according to the modification is smaller than the interval DS between the adjacent two cell strings and the distance between two cell strings DS). ≪ / RTI >

For example, the length Lb400b 'of the portion of the second shield 400b' that extends further in the second direction y may be between 2 mm and 3 mm.

The line width Wa400b 'of the portion extending further in the second direction y from the second shield 400b' according to the modification is the line width Wa400b 'of the center portion of the second shield 400b' May be equal to the minimum line width of the second shield 400b '.

Here, the center portion of the second shield 400b 'according to the modified example and the line width Wa400b' of the extended portion may be formed between 10 mm and 12 mm.

Accordingly, the line width of the second shield 400b 'positioned between the first and second cell strings ST1 and ST2 may be equal to the center line width of the second shield 400b'.

20 (c), the portion of the second shield 400b1 further extending in the second direction y according to the modified example is connected to the second shield 400b2 of the adjacent second shield 400b2 in the second direction lt; RTI ID = 0.0 > y). < / RTI >

Here, the width OLS of the two second shields 400b1 and 400b2 adjacent to each other may be between 0.1 mm and 3 mm.

FIG. 21 is a view for explaining an example in which a plurality of the second shields 400b are formed to overlap with each other.

As shown in FIG. 21, the second shield 400b according to the present invention may be divided into a plurality of portions, and each of the divided portions may be overlapped.

For example, the second shield 400b may be divided into first, second, and third subshields 401b, 402b, 403b, and first, second, and third subshields 401b, 402b, .

The first and second sub shields 401b and 403b may overlap the first sub shield 401b and the second sub shield 401b may form a body of the second shield 400b. (X) in the first direction (400b).

Although the second shield according to the modification example is described as an example in Fig. 21, the second shield shown in Fig. 18 (a) may also be divided into a plurality of sub shields as described above.

In this way, by forming the second shield 400b into a plurality of sub shields, it is possible to further reduce the manufacturing cost of the second shield 400b.

22 (a) is a plan view of a second shield 400b having a light reflection structure, and FIG. 22 (b) is a plan view of the second shield 400b, (B) shows a cross section of the second shield 400b on which the light reflecting structure is formed.

As shown in Figs. 22A and 22B, in order to further increase the light-receiving efficiency of the solar cell, the second shield 400b, like the first shield 400a, A plurality of unevenness P400b can be formed.

At this time, as shown in Figs. 22 (a) and 22 (b), the protrusions P400b are formed such that protrusions and depressions of the protrusions P400b are elongated in the second direction y, The light receiving efficiency of the last solar cell EC can be further increased by reflecting the light in the first direction x.

In order to allow reflected light reflected by the second shield 400b to be reflected more toward the last solar cell EC, as shown in FIG. 22 (b), the end portion of the inclined surface formed between the protruding portion and the depressed portion The inclined surface facing toward the solar cell EC is longer than the inclined surface facing the opposite direction of the last solar cell EC and the inclination angle can be formed gently.

As described above, the solar cell module according to the present invention includes the first shield 400a and the second shield 400b so as to enhance the appearance of the solar cell module, and the first and second shields 400a and 400b ), The light receiving efficiency of the solar cell module can be further improved.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, Of the right.

Claims (27)

1. A solar cell comprising: a semiconductor substrate; a plurality of cell strings each having a first electrode and a second electrode on a surface of the semiconductor substrate, the plurality of solar cells being elongated in a first direction and arranged in a second direction intersecting the first direction;
An interconnector disposed in a second direction between the first and second solar cells adjacent to each other among the plurality of solar cells included in each of the plurality of cell strings and serially connecting the first and second solar cells;
A bushing bar connected to the last solar cell of each of the first and second cell strings adjacent to each other of the plurality of cell strings and connecting the first and second cell strings in the second direction;
A first shield which is located on the front surface of the interconnector in the second direction and blocks the interconnector visually; And
And a second shield which is located on the front surface of the boding bar and is long in the second direction and blocks the bushing bar visually,
Wherein the second shield is overlapped and adhered to the front edge of the semiconductor substrate provided in the last solar cell of each of the plurality of cell strings. The method according to claim 1,
Wherein a line width of both ends of the second shield in the second direction is larger than a center line width of the second shield,
And the second shield is asymmetric with respect to the second direction centerline. The method according to claim 1,
An inner portion adjacent to the last solar cell of the first and second cell strings in the second shield protrudes from the edge portion of the last solar cell toward the last solar cell,
And an outer portion located on an opposite side of the inner portion of the second shield is formed as a straight line. The method of claim 3,
And a portion protruding from an inner portion of the second shield protrudes in a diagonal direction intersecting with the first and second directions. delete The method according to claim 1,
And the second shield is spaced apart in the second direction between the first and second cell strings. The method according to claim 1,
The second shield is further provided between the first and second cell strings,
Wherein a width of the second shield located between the first and second cell strings is equal to a center line width of the second shield. The method according to claim 1,
Wherein the first shield is spaced apart from the semiconductor substrate of the first and second solar cells or overlapped with the front edge of at least one of the semiconductor substrates of the first and second solar cells. 9. The method of claim 8,
Wherein the first shield is superimposed on a front edge of a semiconductor substrate of any one of the semiconductor substrates of the first and second solar cells and is spaced apart from the other semiconductor substrate. 10. The method of claim 9,
Wherein a width at which the front edge of the first shield and the front edge of the semiconductor substrate overlap is 0.1 mm to 2 mm. The method according to claim 1,
Wherein the minimum distance between the semiconductor substrate of the first solar cell and the semiconductor substrate of the second solar cell is between 3.8 mm and 4.2 mm. The method according to claim 1,
Wherein a width of both ends of the first shield in the second direction is larger than a center width of the first shield. 13. The method of claim 12,
The widths of both ends of the first shield in the second direction increase toward both ends of the first shield,
Wherein the first shield is symmetrical with respect to the second direction centerline. The method according to claim 1,
Wherein each of the first and second shields is divided into a plurality of portions, and each of the divided portions is overlapped. The method according to claim 1,
The first and second shields
A substrate made of an insulating material,
And a cohesion layer located on a rear surface of the substrate and adhering to the interconnector or the bushing bar. 16. The method of claim 15,
The substrate comprises PET (polyethylene terephthalate)
Wherein the adhesive layer comprises at least one material selected from the group consisting of Epoxy, Acryl, and Silicone. 16. The method of claim 15,
Wherein the thickness of the substrate is between 50um and 70um, and the thickness of the adhesive layer is between 10um and 30um. The method according to claim 1,
Wherein the first and second shields have a thermal strain of 10% or less at 180 DEG C or lower. 16. The method of claim 15,
Wherein a plurality of projections and depressions are formed on a front surface, which is a light receiving surface of the substrate. 16. The method of claim 15,
Wherein a light reflecting layer containing light reflecting particles or a metal material is positioned on the front surface of the base material, which is a light receiving surface, having the same planar shape as the plane shape of the base material. The method according to claim 1,
Wherein the color of the light receiving surface of the first and second shields is the same as or the same as the color of the rear sheet positioned on the rear surface of the solar cell. The method according to claim 1,
The solar cell module
A first conductive wiring that is connected to the rear surface of the first electrode provided in each of the plurality of solar cells in the first direction and a second conductive wiring that is connected to the rear surface of the second electrode by a long length in the first direction, Including a solar cell module. 23. The method of claim 22,
Wherein each of the first and second electrodes is elongated in the second direction intersecting the longitudinal direction of the first and second conductive wirings,
Wherein the first conductive wiring is connected to the first electrode by a conductive adhesive at a portion intersecting with the first electrode and is insulated from the second electrode by an insulating layer at a portion intersecting the second electrode,
Wherein the second conductive wiring is connected to the second electrode by the conductive adhesive at a portion intersecting with the second electrode and is insulated from the first electrode by the insulating layer intersecting with the first electrode, . 23. The method of claim 22,
The end portions of the plurality of first conductive wirings connected to the first solar cell and the end portions of the plurality of second conductive wirings connected to the second solar cell each project out of the projection region of the semiconductor substrate, The solar cell module comprising: a solar cell module; 25. The method of claim 24,
Wherein the interconnector is spaced apart from each semiconductor substrate of the first and second solar cells. The method according to claim 1,
The ends of the plurality of first conductive wirings connected to the last solar cell of the first cell string and the ends of the plurality of second conductive wirings connected to the last solar cell of the second cell string are projected And is commonly connected to the rear surface of the bending bar. 17. The method of claim 16,
Wherein the bending bar is spaced apart from the semiconductor substrate of the last solar cell of each of the first and second cell strings.

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