KR101778597B1 - Film forming apparatus for large area substrate - Google Patents

Film forming apparatus for large area substrate Download PDF

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Publication number
KR101778597B1
KR101778597B1 KR1020160031683A KR20160031683A KR101778597B1 KR 101778597 B1 KR101778597 B1 KR 101778597B1 KR 1020160031683 A KR1020160031683 A KR 1020160031683A KR 20160031683 A KR20160031683 A KR 20160031683A KR 101778597 B1 KR101778597 B1 KR 101778597B1
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South Korea
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vacuum chamber
guide
opening
beam guide
film forming
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KR1020160031683A
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Korean (ko)
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KR20160115730A (en
Inventor
안경준
정성훈
김상진
김성대
김일수
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(주)에스엔텍
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The present invention relates to a film forming apparatus, and more particularly, to a film forming apparatus capable of forming a large-sized substrate with a high quality, easily performing maintenance, and precisely controlling the scattering direction of the film forming material.

Description

[0001] The present invention relates to a film forming apparatus for forming a large area substrate,

The present invention relates to a film forming apparatus, and more particularly, to a film forming apparatus capable of forming a large-sized substrate with a high quality, easily performing maintenance, and precisely controlling the scattering direction of the film forming material.

Physical vapor deposition (PVD) exists as a method of forming a predetermined film on the surface of an object (hereinafter referred to as "substrate") such as a substrate. In this physical vapor deposition method, a deposition material is scattered in a vacuum chamber using a method such as heating, plasma irradiation, or ion irradiation to form a film in which a film forming material scattered on the substrate surface is deposited.

One of the conventional PVD film forming apparatuses is shown in Fig. As shown in this figure, a conventional film forming apparatus 101 includes a vacuum chamber 110 in which a substrate S is horizontally positioned in an upper portion thereof while forming a vacuum space, a vacuum chamber 110 in which a substrate S is opposed to the substrate S, And a plasma beam generating means 130 for irradiating the plasma beam P toward the film forming material M of the material holding portion 120 .

Among them, the material holding portion 120 has a hearth 121 for accommodating a solid film forming material M on the inside thereof. In order to pull the plasma beam P from the plasma beam generating means 130 to the haul 121, the haul 121 is connected to a power source (not shown) As shown in FIG.

The film forming material M housed in the hearth 121 is scattered toward the base material S in the form of a particle while the tip portion of the film material M toward the base material S is evaporated by the irradiation of the plasma beam P, And is deposited in the form of being deposited on the surface of the substrate S by being ionized by the plasma.

The material holding portion 120 is provided with a beam guide 123 provided as a secondary anode in the peripheral region of the main anode 121. [ The beam guide 123 is for guiding and directing a high-density plasma beam formed from the plasma beam generating means toward the haul 121, and includes a coil and a permanent magnet in a circumferential direction inside the housing of the beam guide 123. The permanent magnet precisely controls the direction of the plasma incident on the haul 121 in the current flow of the coil.

On the other hand, a film forming apparatus (hereinafter referred to as a horizontal film forming apparatus) for forming a film by horizontally placing the substrate S on the upper portion of the vacuum chamber 110 has a problem However, when a substrate having a large area is formed, there is a problem that a film having a constant thickness can not be formed due to warping of the center of the substrate due to gravity due to gravity, and there is a risk that stress may be concentrated at the center of the substrate, .

1. Japanese Unexamined Patent Application Publication No. 2006-283152, 'Film Thickness Correction Mechanism, Film Deposition Device, and Film Deposition Method (October 19, 2006)

SUMMARY OF THE INVENTION It is an object of the present invention to provide a film forming apparatus capable of forming a high-quality film having a uniform thickness on the surface of a large-area substrate without risk of breakage.

It is another object of the present invention to provide a film forming apparatus which can enter and exit into a vacuum chamber to facilitate maintenance.

It is another object of the present invention to provide a film forming apparatus capable of precisely focusing plasma incident on a film forming material.

It is another object of the present invention to provide a film forming apparatus capable of precisely controlling the scattering direction of a film forming material scattered on a substrate and the internal temperature of the vacuum chamber to improve the film forming quality.

According to an aspect of the present invention, there is provided a vacuum chamber comprising: a vacuum chamber forming a vacuum space, A material holding portion that is provided on the other inner side surface of the vacuum chamber so as to face the substrate and accommodates a film forming material for forming the film on the substrate, the film holding material accommodating the film forming material in a lateral direction so as to face the substrate; And a plasma beam generating means for irradiating a plasma beam toward the film forming material to cause the film forming material to scatter toward the substrate to thereby form the substrate.

In another preferred embodiment of the present invention, the other side surface of the vacuum chamber is formed of a vertical base cover which can be opened and closed, and when the vertical base cover is opened, a cover opening capable of entering into and out of the vacuum chamber is formed, And is disposed on the inner surface of the vertical base cover.

In a preferred embodiment, the apparatus further includes opening / closing means for supporting opening and closing of the vertical base cover with respect to the cover opening.

In a preferred embodiment, the opening / closing support means comprises: a plurality of open / close guide rods extending from the cover openings of the vacuum chamber to the other sides of the corresponding vertical base cover surrounding regions; And an opening / closing guide block provided on the other side of the cover opening peripheral region of the vacuum chamber and the corresponding vertical base cover peripheral region, and having an opening / closing guide hole coupled to the opening / closing guide rod so as to be relatively movable.

In a preferred embodiment, the opening / closing support means comprises: a pair of side walls of the cover opening and a corresponding one of the side walls of the vertical base cover so as to be relatively rotatable relative to each other; And a plurality of pivoting hinges.

In a preferred embodiment, the open / close support means includes: a guide rail extending outward from at least one side of the cover opening; and a guide rail provided on a side of the vertical base cover corresponding to the guide rail, And a guide roller.

In a preferred embodiment, the vacuum chamber further comprises cover locking means for locking and unlocking the closed state of the vertical base cover.

In a preferred embodiment, at least one of the periphery of the cover opening of the vacuum chamber and the periphery of the vertical base cover corresponding thereto is provided with a sealing member along the circumferential direction.

In a preferred embodiment, the material holding portion comprises: a casing accommodating the film forming material; A beam guide spaced apart from the haul and disposed to surround the haul, the beam guide guiding the plasma beam to the haul side; And a beam guide installing means for adjusting a relative position of the beam guide with respect to the haul by adjusting a position of the beam guide disposed on the other inner side surface of the vacuum chamber.

In a preferred embodiment, the beam guide installing means includes: a vertical supporting portion for supporting the beam guide so that the back surface of the beam guide is in close contact with the other inner surface of the vacuum chamber; And a position setting unit for adjusting a plane mounting position of the beam guide.

In a preferred embodiment, the vertical support comprises: a support flange formed at a lower end of a vertical direction of the beam guide; And a fastening member for coupling the support flange and the other side of the vacuum chamber to each other, wherein a horizontal slot is formed on one side of the other side of the support flange and the vacuum chamber, and a vertical slot is formed on the other side.

In a preferred embodiment, the position setting unit includes: a bar supporting block which is provided on at least one pair of mutually spaced apart peripheral regions of the beam guide and is supported on the other side of the vacuum chamber; And a position adjusting bar which is supported by the bar supporting block so as to be reciprocatable in a direction toward the center of the beam guide and contacts and separates from the beam guide.

In a preferred embodiment, the bar support block is provided with a guide hole having a female screw portion through which the position adjusting bar is inserted, and a male screw portion corresponding to the female screw portion is formed on an outer circumferential surface of the position adjusting bar.

In a preferred embodiment, the end of the position adjustment bar facing the beam guide is provided with a contact portion that contacts and separates from the beam guide.

In a preferred embodiment, at least one inner side surface of the vacuum chamber is provided with cooling means for adjusting the temperature inside the vacuum chamber.

The present invention further provides a display panel, a touch panel, an LED device, or a solar cell panel having a film formation layer formed by the film formation apparatus.

According to the film forming apparatus of the present invention, it is possible to form a high-quality film layer having a uniform thickness on the surface of a base material without risk of breakage of the base material due to warpage since a large-

Further, according to the film forming apparatus of the present invention, since the operator can enter and exit the inside of the vacuum chamber through the cover opening, maintenance of the material holding portion is advantageous.

In addition, since the film forming apparatus of the present invention can precisely adjust the relative position of the beam guide with respect to the haas, it is possible to concentrate the plasma incident on the material, so that the deposition efficiency can be greatly improved.

Further, according to the film forming apparatus of the present invention, since the angle of the haze can be controlled, the film forming quality can be improved and the internal temperature of the vacuum chamber can be maintained at a low temperature through the cooling means. There is a merit that can be formed.

1 is a side sectional view of a conventional film forming apparatus,
2 and 3 are side cross-sectional views of a film forming apparatus according to an embodiment of the present invention,
4 to 6 are views for explaining a beam guide installing means of a film forming apparatus according to an embodiment of the present invention,
7 is a view for explaining a cooling means of a film forming apparatus according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in detail with reference to the accompanying drawings. In this case, the film forming apparatus according to the present invention will be described by taking an ion plating type as an example, but it goes without saying that the technical idea of the present invention can be applied to various types of film forming apparatus using PVD method.

2 and 3, a film forming apparatus 1 according to an embodiment of the present invention is a film forming apparatus in which a substrate S is placed in a longitudinal direction (preferably, vertical direction) And a vacuum chamber 10 which is provided on the other side of the vacuum chamber 10 so as to face the substrate S and accommodates the film forming material M in a lateral direction so as to face the substrate S, The film forming material M is scattered toward the base material S by irradiating the holding part 20 and the film forming material M with a plasma beam P to cause the film forming material M to scatter toward the base material S, And a plasma beam generating means (30) for causing a film to be formed.

In addition, the present invention can further provide a substrate on which a film formation layer is formed by the film formation apparatus 1 of the present invention, separately from the above-described film formation apparatus (1).

The substrate may be, for example, a display panel, a touch panel, an LED device (panel), or a solar cell panel, and the film formation layer may be an electrode layer, an antireflection layer, a protective layer, or the like.

The vacuum chamber 10 is a device for accommodating the substrate S to provide a space in which a film can be formed.

The vacuum chamber 10 may be provided with a base material transfer path 11 for transferring the base material S vertically continuously to the film formation space 10 in the inline manner .

The deposition process performed inside the vacuum chamber 10 may be a process of forming a SiO2 or ITO film on the surface of the substrate S or a process of forming a film deposition layer of various materials on the surface of the substrate S Lt; / RTI >

The vacuum chamber 10 is provided with a beam passage opening 15 so that the plasma beam P generated by the plasma beam generating means 30 is irradiated toward the film forming material M of the material holding portion 20.

In addition, an atmosphere gas suitable for the film forming process can be supplied from a gas supply unit (not shown) in the vacuum chamber 10, and can be maintained at a proper degree of vacuum by a vacuum controller. In addition, the vacuum chamber 10 may be made of a conductive material and grounded.

That is, the film forming apparatus (1) of the present invention has a merit that the film formation can be performed even when a substrate having a large area is not warped, and there is no risk of breakage due to stress concentration or the like.

The other side of the vacuum chamber 10 may be a vertical base cover 60 that can be opened and closed.

In addition, when the vertical base cover 60 is opened, a cover opening 19 is formed to be able to enter and exit the inside of the vacuum chamber 10. The cover opening 19 is opened and closed by the vertical base cover 60 as described above. To this end, the opening / closing means 61 is provided around the periphery of the cover opening 19 and the corresponding vertical base cover 60. The opening / closing support means 61 will be described later.

In addition, the vertical base cover 60 has an area that can airtightly block the cover opening 19 of the vacuum chamber, and the material holding portion 20 is provided on the inner and outer plate surfaces. At this time, at least one of the periphery of the cover opening 19 of the vacuum chamber and the vertical base cover 60 corresponding thereto is provided with a sealing member such as a gasket or a packing along the circumferential direction.

The material holding portion 20 is provided on the other inner side surface of the vacuum chamber 10 so as to face the substrate S and scatter the film forming material M with the base material S so as to form a film.

The material holding portion 20 has a hash 21 for holding a film forming material M and the haul 21 is installed inside the vertical base cover 60 and the plasma beam generating means 30 to attract the plasma beam (P).

Further, although not shown, a power supply unit for maintaining the ground potential of the vacuum chamber 10 at a constant potential may further be provided.

A solid-state film material M in the form of a solid is mounted on the inside of the haul 21, and the solid-phase film material M may be individually mounted on the haul 21 or on the outer side of the vertical base cover 60 And can be continuously supplied to the haul 21 by the material supply device.

When the solid-phase film material M is heated by irradiation with the plasma beam (P), the tip portion of the solid film-forming material M toward the substrate S is evaporated and scattered toward the base material S side And is mounted in the transverse direction inside.

Further, the film forming material particles to be scattered are ionized by the plasma, moved to the film forming space 13, and attached to the surface of the substrate S.

In addition, the solid-phase film material M mounted on the haul 21 is heated and evaporated by the plasma beam P while being continuously pushed in the direction toward the base S side.

Further, although not shown, the film forming apparatus 1 of the present invention may further include an angle adjusting means for adjusting the angle of the haul 21 so that the angle of the haul 21 can be adjusted, Taking into consideration that the film forming material M falls due to gravity, the film forming material M can be appropriately scattered toward the substrate.

For example, the angle adjusting means may be a ball joint, an angle adjusting bracket, a gonio stage rotatable along a curved rail, or the like.

The material holding portion 20 may be provided with an annular beam guide 23 as a secondary anode arranged vertically around the haul 21 with the harness 21 as a main anode 21. [

In addition, the beam guide 23 is for guiding plasma, and a coil and a permanent magnet are provided in the circumference of the housing 23a of the beam guide 23.

The permanent magnet varies the magnetic field around the haul 21 according to the current flow of the coil and precisely controls the direction of the plasma incident on the haul 21.

The material holding portion 20 adjusts the relative position of the beam guide 23 with respect to the haul 21 by adjusting the position where the beam guide 23 is attached to the other side of the inside of the vacuum chamber 10 And a beam guide installation means (40) for adjusting the position.

4 to 6, the beam guide installation means 40 includes a base plate 50 of a vertically disposed vacuum chamber 10, A vertical support portion 41 for supporting the beam guide 23 on the base plate 50 so that the beam guide 23 can be closely contacted with the beam guide 23; And a position setting unit 46 for adjusting the installation position of the beam guide 23.

However, the base plate 50 is not separately provided, and the housing 23a can be directly attached to the other inner surface of the vacuum chamber 10. [

The vertical support portion 41 includes a support flange 42 formed at a lower end of the housing 23a of the vertically installed beam guide 23 and a fastening member 42 for fastening the support flange 42 to the base plate 50 45). At this time, a horizontally elongated hole 43 is formed horizontally in the two support flanges 42, and a vertical elongated hole 53 is formed in the corresponding base plate 50. The fastening member 45 is horizontally extended 43 and the vertical elongated hole 53 while coupling the support flange 42 and the base plate 50 to each other. Here, the formation positions of the horizontal long hole 43 and the vertical long hole 53 may be reversed.

The position setting unit 46 may be provided in plural around the housing 23a of the beam guide 23 and includes a bar supporting block 47 supported by the base plate 50, And a position adjusting bar 48 supported on the bar supporting block 47 so as to reciprocate in a direction toward the center of the bar.

A guide hole (not shown) having a female threaded portion (not shown) through which the position adjusting bar 48 is inserted is formed in the bar support block 47. A female threaded portion And a male screw portion 48a corresponding to the male screw portion 48a. A contact portion 48b is formed at the end of the position adjusting bar 48 facing the beam guide 23 to contact and release the beam guide 23.

The film forming apparatus according to the present invention having such a structure can be constructed such that the beam guide 23 is vertically placed in the vacuum chamber 10 by using the vertical support portion 41 in the process of installing the beam guide 23, To the base plate (50).

At this time, the beam guide 23 can be moved to correspond to a preset focusing position in a state where the fastening member 45 is assembled with the horizontal slot 43 and the vertical slot 53, The beam guide 23 can be moved in the horizontal direction and the vertical slot 53 can move the beam guide 23 in the vertical direction so that the installation position of the beam guide 23 can be set easily and primarily.

Then, the installation position of the beam guide 23 can be precisely set using the position setting unit 46. [ The beam guide 23 whose primary position is set by the vertical support portion 41 can be slightly moved by the external force and the position adjustment portion 48 of the position setting portion 46 can be adjusted The position of the beam guide 23 can be precisely set by applying an external force while the contact portion 48b of the bar 48 contacts the beam guide 23. [

Then, when the fastening member 45 of the vertical support portion 41 is completely tightened, the beam guide 23 is vertically installed inside the vacuum chamber while being completely in contact with the base plate 50.

Thus, even if the beam guide 23 is installed vertically, there is no possibility of sagging due to its own weight, and no flare is caused between the beam guide 23 and the base plate 50. Therefore, the gap in which the particles are deposited is not formed and the insulated state of the beam guide 23 can be maintained, thereby preventing the shot.

The position of the beam guide 23 can be precisely adjusted by using the position setting unit 46 while the beam guide 23 is vertically arranged using the vertical support unit 41 in the process of installing the beam guide 23 So that the focusing of the plasma beam can be accurately performed.

Thus, the film forming apparatus according to the present invention provides a beam guide installation structure optimized for a vertical film forming apparatus that performs a film forming process on a vertical substrate.

The plasma beam generating means 30 may be in the form of a pressure gradient, and a main body portion thereof is provided in the region of the beam passage opening 15 of the vacuum chamber 10. The plasma generated in the plasma beam generating means 30 is directed to the inside of the vacuum chamber 10 and the haul 21 through the beam passage opening 15.

The open / close support means 61 includes a plurality of open / close guide rods 63 extending from one side of the circumference of the cover opening 19 of the vacuum chamber and the corresponding vertical base cover 60, Closing guide hole 67 provided on the other side of the peripheral area of the cover opening 19 of the vacuum chamber and the corresponding peripheral area of the vertical base cover 60 so as to be movable relative to the opening and closing guide rod 63, Block 65 as shown in FIG.

2 and 3, which show a preferred embodiment of the present invention, a plurality of open / close guide rods 63 are arranged at regular intervals in a peripheral region of the cover opening 19 of the vacuum chamber, And an opening / closing guide block 65 is provided in the area.

Of course, although not shown, the opening / closing support means may be provided in various forms other than the above-described examples.

For example, the opening / closing support means supports one side of the cover opening 19 and one side of the corresponding vertical base cover 60 so as to be rotatable relative to each other, and a plurality of rotations And may be provided with a hinge (not shown). Alternatively, the opening / closing support means may be provided on the side of the vertical base cover 60 corresponding to the guide rail (not shown) and the guide rail (not shown) extending outward from at least one side of the cover opening 19, And a guide roller (not shown) that moves in a rolling manner. In addition, the opening / closing means may be configured in various forms.

In addition, the film forming apparatus according to the present invention may have various forms of cover locking means 68 for firmly maintaining the closed state of the vertical base cover 60 during the film forming process. For example, the cover locking means 68 can be configured in various forms including a clamping type which locks the closed state while tightly fitting the vertical opening / closing cover to the vacuum chamber side by a lever action while being easy to operate.

The film forming apparatus according to the present invention having such a constitution can be easily operated by the operator by opening the vertical base cover 60 when maintenance such as repairing or replacing the components inside the vacuum chamber is required including the configurations of the material holding portion It is possible to perform the maintenance work by entering the inside of the vacuum chamber. At this time, since the cover opening 19 is completely opened inside the vacuum chamber, it is easy to check the safety of the operator from the outside.

Therefore, according to the film forming apparatus of the present invention, it is very convenient to perform maintenance such as repairing or replacing the components inside the vacuum chamber including the configurations of the material holding part, and at the same time, safety of the operator can be assured.

Referring to FIG. 7, the film forming apparatus 1 may further include a cooling unit 70 for adjusting the internal temperature of the vacuum chamber 10 according to an embodiment of the present invention.

The cooling means 70 may include at least one heat exchanger 71 attached to the inner surface of the vacuum chamber 10 and a cooling fluid supplying unit 70 for supplying a cooling fluid to the heat exchanger 71 from the outside of the vacuum chamber 10. [ And a cooling fluid supply pump 72.

However, the cooling fluid supply pump 72 may be a heat pump system including a compressor, a condenser, and an expansion valve.

Further, although not shown, the cooling unit 70 further includes a temperature sensor in the vacuum chamber 10 and a controller for receiving temperature information from the temperature sensor and controlling the cooling fluid supply pump 72 .

Therefore, according to the film forming apparatus of the present invention, since the temperature inside the vacuum chamber can be appropriately adjusted, there is an advantage that high-quality film formation can be performed.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of limitation, Various changes and modifications will be possible.

10: Vacuum chamber 19: Cover opening
20: Material holding section 21: Haas
23: beam guide 30: plasma beam generating means
40: beam guide installation means 41: vertical support
46: Position setting section 50: Base plate
60: vertical base cover 61: opening / closing support means
68: cover locking means 70: cooling means

Claims (14)

A vacuum chamber forming a vacuum space and having a substrate to be deposited on the one side thereof standing upright in the vertical direction;
A material holding portion which is provided on the other inner side surface of the vacuum chamber so as to face the substrate and accommodates a film forming material for forming a film on the substrate, the material holding portion for holding the film forming material in a lateral direction so as to face the substrate; And
And a plasma beam generating means for irradiating a plasma beam toward the film forming material to cause the film forming material to scatter toward the substrate to form the substrate,
The material holding portion:
A hearth accommodating the film forming material;
A beam guide spaced apart from the haul and disposed to surround the haul, the beam guide guiding the plasma beam to the haul side; And
And a beam guide installing means for adjusting a relative position of the beam guide with respect to the haul by adjusting a position at which the beam guide is disposed on the other inner side surface of the vacuum chamber,
The beam guide installing means includes:
A vertical support for supporting the beam guide such that the back surface of the beam guide is in close contact with the other inner surface of the vacuum chamber; And
And a position setting unit for adjusting a plane mounting position of the beam guide.
The method according to claim 1,
Wherein the other side surface of the vacuum chamber is formed of a vertical base cover which can be opened and closed, and a cover opening is formed which can enter and exit into the vacuum chamber when the vertical base cover is opened,
And the material holding portion is disposed on the inner surface of the vertical base cover.
3. The method of claim 2,
And opening / closing means for supporting opening and closing of the vertical base cover with respect to the cover opening.
The method of claim 3,
The opening / closing support means includes:
A plurality of open / close guide rods extending from one side of the cover opening peripheral region of the vacuum chamber and the corresponding vertical base cover peripheral region to the other side; And
And an opening / closing guide block provided on the other side of the cover opening circumferential region of the vacuum chamber and the corresponding vertical base cover peripheral region, and having an opening / closing guide hole coupled to the opening / closing guide rod so as to be relatively movable. Film deposition apparatus.
The method of claim 3,
The opening / closing support means includes:
And a plurality of turning hinges supporting one side of the cover opening and one side of the vertical base cover corresponding to the one side of the cover opening so as to be rotatable relative to each other and spaced apart from each other along the longitudinal direction of the one side, Film deposition apparatus.
The method of claim 3,
The opening / closing support means includes:
A guide rail extending outwardly from at least one side of the cover opening: and
And a guide roller provided on a side of the vertical base cover corresponding to the guide rail and rolling along the guide rail.
7. The method according to any one of claims 2 to 6,
Wherein the vacuum chamber further comprises cover locking means for locking and unlocking the closed state of the vertical base cover.
8. The method of claim 7,
Wherein a sealing member is provided along at least one of a circumference of the cover opening of the vacuum chamber and a circumference of the vertical base cover corresponding thereto.
delete The method according to claim 1,
The vertical support portion includes:
A support flange formed at a lower end of the beam guide in the vertical direction; And
And a coupling member for coupling the support flange and the other side of the vacuum chamber to each other,
Wherein a horizontal slot is formed on one side of the support flange and the other side of the vacuum chamber, and a vertical slot is formed on the other side.
The method according to claim 1,
Wherein the position setting unit:
A bar support block provided on at least one pair of mutually spaced apart peripheral regions of the beam guide and supported on the other side of the vacuum chamber; And
And a position adjusting bar supported by the bar supporting block so as to be reciprocatable in a direction toward the center of the beam guide and contacted with and spaced from the beam guide.
12. The method of claim 11,
Wherein the bar support block is formed with a guide hole having a female screw portion through which the position adjusting bar is inserted,
And a male screw portion corresponding to the female screw portion is formed on an outer circumferential surface of the position adjusting bar.
12. The method of claim 11,
Wherein an end portion of the position adjusting bar facing the beam guide is provided with a contact portion contacting and spaced from the beam guide.
7. The method according to any one of claims 1 to 6,
Wherein at least one inner side surface of the vacuum chamber is provided with cooling means for controlling the temperature inside the vacuum chamber.
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