KR101777918B1 - Printed circuit board using cover of potable electronic equipment and method for manufacturing the same - Google Patents

Printed circuit board using cover of potable electronic equipment and method for manufacturing the same Download PDF

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Publication number
KR101777918B1
KR101777918B1 KR1020150124019A KR20150124019A KR101777918B1 KR 101777918 B1 KR101777918 B1 KR 101777918B1 KR 1020150124019 A KR1020150124019 A KR 1020150124019A KR 20150124019 A KR20150124019 A KR 20150124019A KR 101777918 B1 KR101777918 B1 KR 101777918B1
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KR
South Korea
Prior art keywords
cover
electronic device
portable electronic
printed circuit
circuit board
Prior art date
Application number
KR1020150124019A
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Korean (ko)
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KR20170027431A (en
Inventor
최승남
최광석
안강모
Original Assignee
최승남
최광석
안강모
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Priority to KR1020150124019A priority Critical patent/KR101777918B1/en
Publication of KR20170027431A publication Critical patent/KR20170027431A/en
Application granted granted Critical
Publication of KR101777918B1 publication Critical patent/KR101777918B1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20427—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing having radiation enhancing surface treatment, e.g. black coating

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

The present invention relates to a heat dissipation coating layer coated on an inner surface of a cover of a portable electronic device so as to emit heat; An adhesive layer coated on the heat radiating coating layer; And a circuit pattern layer formed on the adhesive layer for operating the portable electronic device, and a method of manufacturing the same.
According to the present invention, a printed circuit board is formed on a cover of a portable electronic device, so that the portable electronic device can be made compact and slim to be portable.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board using a cover of a portable electronic device,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a printed circuit board using a cover of a portable electronic device and a method of manufacturing the same, and more particularly to a printed circuit board using a cover of a portable electronic device, And more particularly, to a printed circuit board using a cover of a portable electronic device and a method of manufacturing the same.

In recent years, miniaturization of a printed circuit board (PCB) has been progressing as a portable electronic device such as a mobile phone, MP3, PMP, UMPC, etc. is downsized, densified, thinned, and packaged. In order to reflect such a trend, a structure of a printed circuit board differentiated from the conventional one and a manufacturing method thereof are required.

In order to cope with thinning, which is a necessary condition of a next generation flip-chip BGA, it is necessary to reduce the thickness of the printed circuit board (PCB) and the substrate having high stiffness, Researches on materials have been actively conducted, and metal core printed circuit boards using a metal substrate as a core member of a printed circuit board are emerging as one of them.

An aluminum (Al) substrate is mainly used for a metal substrate used for a metal core printed circuit board. Such a metal substrate is disclosed in Korean Patent No. 10-0643320 as a conventional technology using an aluminum substrate as a core member. As a conventional method for forming an inner layer circuit on the surface of a metal substrate, an oxide layer is formed using an anodizing process to form an insulating layer on the surface of the metal core layer, Copper plating process. The oxide layer is subjected to a degreasing-desmut process in a pre-process step for a copper plating process, followed by an oxide film formation through anodizing in a sulfuric acid bath. Conditioning - Acid - Pre dip - Pd catalyzing - Reduction - Electroless Cu plating - Electro Cu plating The subsequent process is carried out in this order.

When a portable electronic device is manufactured using such a conventional metal core printed circuit board, a separate metal core printed circuit board is incorporated, and then a cover of the portable electronic device is assembled. Compact, but it has a limitation in slimming portable electronic devices.

In order to solve the problems of the prior art as described above, the present invention forms a printed circuit board (PCB) on a cover of a portable electronic device when manufacturing a portable electronic device, thereby reducing the thickness of the portable electronic device, The purpose is to make sure. Other objects of the present invention will become readily apparent from the following description of the embodiments.

According to an aspect of the present invention, there is provided a portable electronic device including: a heat radiating coating layer coated on an inner surface of a cover of a portable electronic device so as to emit heat; An adhesive layer provided on the heat radiating coating layer; And a circuit pattern layer provided on the adhesive layer for operating the portable electronic device. The printed circuit board includes a cover for a portable electronic device.

According to another aspect of the present invention, there is provided a portable electronic device including first and second radiating paint layers coated on inner and outer surfaces of a cover of a portable electronic device, respectively, so as to emit heat; An adhesive layer provided on the first heat dissipative coating layer; And a circuit pattern layer provided on the adhesive layer for operating the portable electronic device. The printed circuit board includes a cover for a portable electronic device.

In a printed circuit board using a cover of a portable electronic device according to one or more aspects of the present invention, the cover may be an engineering plastic or an aluminum plate.

In a printed circuit board using a cover of a portable electronic device according to one or more aspects of the present invention, a carbon nanotube of Class III company can be applied as a heat radiating paint constituting the heat radiating coating layer.

The printed circuit board using the cover of the portable electronic device according to an aspect of the present invention may further include an outer coating layer formed on the outer surface of the cover.

The printed circuit board using the cover of the portable electronic device according to another aspect of the present invention may further include an appearance coating layer formed on the second radiation coating layer.

The printed circuit board using the cover of the portable electronic device according to one or more aspects of the present invention may further include an electronic component assembled to the circuit pattern layer.

According to another aspect of the present invention, there is provided a method of manufacturing a portable electronic device, the method including: forming a heat radiating coating layer by coating on an inner surface of a cover of a portable electronic device, Forming a circuit pattern for operating the portable electronic device; A step of coating an adhesive on the circuit pattern; and a step of attaching the circuit pattern on the heat radiating coating layer using the adhesive. .

According to another aspect of the present invention, there is provided a method of manufacturing a printed circuit board using a cover of a portable electronic device, the method further comprising forming an outer coating layer on the outer surface of the cover by coating.

In the method of manufacturing a printed circuit board using the cover of a portable electronic device according to another aspect of the present invention, the step of forming the heat radiating coating layer may include forming the heat radiating coating layer on the outer surface And forming an outer coating layer by coating on the heat radiating coating layer formed on the outer surface of the cover.

In the method of manufacturing a printed circuit board using a cover of a portable electronic device according to another aspect of the present invention, the cover may be an engineering plastic or an aluminum plate.

In a method of manufacturing a printed circuit board using a cover of a portable electronic device according to another aspect of the present invention, a carbon nanotube of Class 3 company can be applied as a heat radiating paint constituting the heat radiating coating layer.

According to another aspect of the present invention, there is provided a method of manufacturing a printed circuit board using a cover of a portable electronic device, the method further comprising the step of assembling the electronic component in the circuit pattern.

According to the printed circuit board using the cover of the portable electronic device and the method of manufacturing the same according to the present invention, the printed circuit board can be formed on the cover of the portable electronic device to make the portable electronic device compact and slim to make it portable.

1 is a sectional view showing a printed circuit board using a cover of a portable electronic device according to a first embodiment of the present invention.
2 is an exploded perspective view of a printed circuit board using a cover of a portable electronic device according to a first embodiment of the present invention, before the circuit pattern is adhered to the cover.
3 is a sectional view showing a printed circuit board using a cover of a portable electronic device according to a second embodiment of the present invention.
4 is a flowchart illustrating a method of manufacturing a printed circuit board using a cover of a portable electronic device according to an embodiment of the present invention.

The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated and described in detail in the drawings. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but is to be understood to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention, And the scope of the present invention is not limited to the following examples.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the accompanying drawings, wherein like or corresponding elements are denoted by the same reference numerals, and redundant explanations thereof will be omitted.

Fig. 1 is a sectional view showing a printed circuit board using a cover of a portable electronic device according to a first embodiment of the present invention, Fig. 2 is a sectional view showing a printed circuit board using a cover of a portable electronic device according to the first embodiment of the present invention, In which the circuit pattern is adhered to the cover.

1 and 2, the printed circuit board using the cover of the portable electronic device according to the first embodiment of the present invention is formed of a heat dissipation member (not shown) coated on the inner surface of the cover 10 of the portable electronic device A coating layer 12 and an adhesive layer 14 provided on the heat radiating coating layer 12 and a circuit pattern layer 16 provided on the adhesive layer 14 for operating the portable electronic device .

Portable electronic devices can be a variety of products such as mobile phones, digital cameras, MP3, PMP, UMPC, portable TV, navigation, and voice recorder. Such a portable electronic device has a tendency to be compact and easy to carry, and has a tendency to reduce weight and slimness. Conventionally, a portable electronic device has a built-in printed circuit board (PCB) formed of a separate plastic inside a housing (main body) of a portable electronic device and has a limitation in miniaturizing and slimming the portable electronic device. A cover 10, which is a part of the housing of the portable electronic device, for example, a printed circuit board (PCB) is formed on the back cover, thereby miniaturizing and slimming the portable electronic device.

The cover 10 may be a variety of covers required depending on the structure and characteristics of the portable electronic device, including the front cover as well as the rear cover of various portable electronic devices as described above. Also, the inner surface of the cover 10 may be a side surface facing the portable electronic device when the cover 10 is attached to the portable electronic device. On the other hand, the outer surface to be described later in the cover 10 may be a surface facing the outside when the cover 10 is attached to the portable electronic device. The cover 10 may be an engineering plastic or an aluminum plate.

As the heat radiating paint constituting the heat radiating paint layer 12, Carbon Nano Tube of Class III company can be applied. Further, the outer surface of the cover 10 may be formed with an appearance coating layer 18 to make the appearance beautify or protect the cover 10 from scratches or the like.

At least one or more electronic components 20 necessary for the circuit pattern layer 16 may be assembled by soldering or the like.

3 is a sectional view showing a printed circuit board using a cover of a portable electronic device according to a second embodiment of the present invention.

Referring to FIG. 3, the printed circuit board using the cover of the portable electronic device according to the second embodiment of the present invention includes a first heat radiation paint coated on a portion of the inner surface of the cover 10 of the portable electronic device, A second heat dissipating coating layer 12b coated on the outer surface of the cover 10 so as to be opposed to the first heat dissipating coating layer 12a at a portion corresponding to a plane, An adhesive layer 14 provided so as to be laminated on the adhesive layer 12a and a circuit pattern layer 16 provided so as to be stacked on the adhesive layer 14 and to operate the portable electronic device. Further, like the printed circuit board using the cover of the portable electronic device according to the first embodiment of the present invention, the cover 10 can be an engineering plastic or an aluminum plate, and the heat radiating paint constituting the heat radiating coating layers 12a, A carbon nanotube of a third party can be applied, and the electronic component 20 can be assembled to the circuit pattern layer 16 by soldering or the like.

In this embodiment, as shown in FIG. 3, on the second heat dissipative coating layer 12b coated on the outer surface of the cover 10, a second heat dissipating coating layer The outer coating layer 18 which is laminated in conformity with the coating layer 12b can be formed by coating.

A method of manufacturing a printed circuit board using a cover of a portable electronic device according to an embodiment of the present invention will be described with reference to a printed circuit board using a cover of a portable electronic device according to the first and second embodiments of the present invention This will be described in detail.

4 is a flowchart illustrating a method of manufacturing a printed circuit board using a cover of a portable electronic device according to an embodiment of the present invention.

Referring to FIG. 4, a method of manufacturing a printed circuit board using a cover of a portable electronic device according to an embodiment of the present invention includes: a first step of forming a printed circuit board using the cover of the portable electronic device according to the first embodiment of the present invention; The printed circuit board using the cover of the portable electronic device according to the second embodiment of the present invention will be described. To this end, first, as shown in FIG. 1, a cover 10 mounted on a portable electronic device is formed by forming a heat radiating coating layer 12 by coating a heat radiating coating on the inner surface of a rear cover (S11). Here, the cover 10 may be an engineering plastic or an aluminum plate. In addition, carbon nanotubes of Class 3 company can be applied for heat dissipation paint.

In addition, the circuit pattern layer 16 for attachment to the cover 10 is prepared by forming a circuit pattern for operating the portable electronic device (S12). At this time, the circuit pattern can be formed as a copper plate. Then, the adhesive layer 14 is formed by coating an adhesive on the circuit pattern forming the circuit pattern layer 16 (S14). On the other hand, step (S13) of assembling the electronic component 20 by soldering or the like to the circuit pattern formed before coating the adhesive can be performed.

When the adhesive is applied to the circuit pattern layer 16 corresponding to the circuit pattern (S14), a circuit pattern layer (corresponding to the circuit pattern) is formed on the heat radiating coating layer 12 by using an adhesive, 16 are attached (S15). Here, the adhesive layer 14 may have a heat-insulating property together with an adhesive property. In addition, the heat radiating coating layer 12 uses a CNT heat radiating coating material so as to have excellent heat conductivity and heat radiation characteristics, and thus can exhibit a cooling effect of 200% or more as compared with conventional black radiating surface treatment.

Then, it is possible to maintain the beauty or durability of the appearance by forming the outer coating layer 18 on the outer surface of the cover 10 by coating.

In the method of manufacturing a printed circuit board using a cover of a portable electronic device according to an embodiment of the present invention, in order to manufacture a printed circuit board using the cover of the portable electronic device according to the second embodiment of the present invention, The step of forming the coating layer S12 may be carried out in such a manner that the heat dissipation coating layer, that is, the first and second heat dissipation layers 12a and 12b, together with the inner surface of the cover 10, So that an angle can be formed on the side surface. The step of forming the outer coating layer (S16) may include forming an outer coating layer 18 on the heat dissipation coating layer formed on the outer surface of the cover 10, that is, the second heat dissipation coating layer 12b by coating can do.

According to the printed circuit board using the cover of the portable electronic device and the method of manufacturing the same according to the present invention, the printed circuit board is formed on the cover of the portable electronic device to make the portable electronic device compact and slim, have.

Although the present invention has been described with reference to the accompanying drawings, it is to be understood that various changes and modifications may be made without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined by the scope of the appended claims and equivalents thereof.

10: cover
12, 12a, 12b: heat radiating paint layer
14: adhesive layer
16: Circuit pattern layer
18: Appearance paint layer
20: Electronic parts

Claims (13)

delete A first radiating paint layer coated on a portion of the inner surface of the cover of the portable electronic device corresponding to a plane;
A second radiating paint layer coated on the outer surface of the cover so as to be opposed to the first radiating coating layer in a portion corresponding to a plane;
An adhesive layer provided so as to be laminated on the first heat dissipative coating layer;
A circuit pattern layer provided so as to be stacked on the adhesive layer, the circuit pattern layer for operating the portable electronic device; And
And an electronic component assembled to the circuit pattern layer,
The cover
Engineering plastics,
The heat radiating coating material constituting the heat radiating coating layer is,
Applying Carbon Nano Tube from Kras Co.,
Further comprising an outer coating layer formed on the second heat dissipation coating layer so as to be laminated on the second heat dissipation coating layer. delete delete delete delete delete delete delete delete delete delete delete
KR1020150124019A 2015-09-02 2015-09-02 Printed circuit board using cover of potable electronic equipment and method for manufacturing the same KR101777918B1 (en)

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Application Number Priority Date Filing Date Title
KR1020150124019A KR101777918B1 (en) 2015-09-02 2015-09-02 Printed circuit board using cover of potable electronic equipment and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150124019A KR101777918B1 (en) 2015-09-02 2015-09-02 Printed circuit board using cover of potable electronic equipment and method for manufacturing the same

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KR20170027431A KR20170027431A (en) 2017-03-10
KR101777918B1 true KR101777918B1 (en) 2017-09-12

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102015170B1 (en) * 2017-05-16 2019-08-27 주식회사 아네시스 테크놀러지 Side protector of burn in board

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100826392B1 (en) * 2007-08-08 2008-05-02 삼성전기주식회사 Mobile apparatus and method of manufacturing the same
KR101151823B1 (en) * 2012-03-30 2012-06-01 한라아이엠에스 주식회사 Flat type light fixtures using led
KR101399327B1 (en) * 2013-10-07 2014-05-27 홍형복 Manufaturing method for sub-case of movable terminal and molde therefor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100826392B1 (en) * 2007-08-08 2008-05-02 삼성전기주식회사 Mobile apparatus and method of manufacturing the same
KR101151823B1 (en) * 2012-03-30 2012-06-01 한라아이엠에스 주식회사 Flat type light fixtures using led
KR101399327B1 (en) * 2013-10-07 2014-05-27 홍형복 Manufaturing method for sub-case of movable terminal and molde therefor

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