KR101775416B1 - Shoe insole flexible board - Google Patents

Abstract

The present invention provides a shoe insole substrate having a structure which does not generate a crack in inner film layers and does not cut inner wire patterns even if a pressure is continuously applied in a shoe insole as a person walks. The shoe insole substrate comprises: a base film layer including switch regions, a signal output region, and wire regions connecting the switch regions and the signal output region; a reinforcement film layer located at a lower part of the base film layer, and overlapping the base film in the same shape as the base film layer; a copper foil pattern layer located at an upper part of the base film layer, and including switch patterns formed in the switch regions, a signal output pattern formed in the signal output region, and wire patterns formed in the wire regions; and a protective film layer located at an upper part of the copper foil pattern layer. Each of the wire regions includes a curved wire region, and the curved wire region includes at least one hole for crack prevention in at least one curved inner region.

Description

Shoe Insole Board {SHOE INSOLE FLEXIBLE BOARD}

The present invention relates to a shoe insole for gait diagnosis. More particularly, the present invention relates to a shoe insoles substrate for generating pressure sensing signals in a manner that contacts a shoe insole sensor by a pressure applied by a person (i.e., a pedestrian) will be.

A person's pose includes a lot of data related to the person's health. Accordingly, when walking data capable of analyzing a person's walking posture is obtained, a personalized service related to health can be provided to the person. Recently, efforts have been made to extract walking data by combining a pressure sensing device with a shoe insole in order to analyze a person's walking posture. Particularly, the pressure sensing device composed of the shoe insole sensor disclosed in Korean Patent No. 1,283,434 of the present applicant and the shoe insoles substrate in contact with it can operate at low power, and can be manufactured at low cost and small size, It is possible to efficiently provide the walking data in combination with the insole. In general, a shoe insoles substrate is manufactured by a flexible printed circuit board (FPCB), which is provided on a shoe insole, and can be gradually deteriorated by continuous pressure applied by a person walking in a shoe insole . In other words, the shoe insole substrate is pressed and stretched by the above-mentioned pressure, thereby causing a crack in the shoe insole substrate or breaking the wiring patterns in the shoe insole substrate.

It is an object of the present invention to provide a shoe insoles substrate having a structure in which inner film layers are not cracked and internal wiring patterns are not broken even when pressure is continuously applied by a person walking in a shoe insole. It should be understood, however, that the present invention is not limited to the above-described embodiments, and may be variously modified without departing from the spirit and scope of the present invention.

In order to accomplish one object of the present invention, a shoe insole substrate according to embodiments of the present invention includes a base film layer including switch regions, a signal output region, and wiring regions connecting the switch regions and the signal output region, A reinforcing film layer disposed under the base film layer and overlapping the base film layer in the same shape as the base film layer, a switch disposed in the upper portion of the base film layer, A signal output pattern formed in the signal output region, and a wiring pattern formed in the wiring regions, and a protective film layer disposed on the top of the copper foil pattern layer. In this case, each of the wiring regions includes a curved wiring region, and the curved wiring region may include at least one crack preventing hole in at least one curved inner region.

According to one embodiment, the at least one crack preventing hole may have a circular shape.

According to one embodiment, the at least one crack preventing hole may have a shape of a part of a circular shape.

According to one embodiment, the base film layer, the reinforcing film layer, the copper foil pattern layer, and the protective film layer may be bonded to each other via the first adhesive layer.

According to one embodiment, the protective film layer may be attached to the shoe insole body via the second adhesive layer.

According to one embodiment, the base film layer may be a polyimide film (PI) film.

According to one embodiment, the reinforcing film layer may be a polyester (PET) film.

According to one embodiment, the reinforcing film layer may be manufactured by thermally processing at least 100 ° C for at least one hour.

According to an embodiment, the sensor contact patterns included in each of the switch patterns may be exposed to the outside through the sensor contact holes included in the protective film layer.

According to one embodiment, the sensor contact patterns may be electroless gold plated through the sensor contact holes.

The shoe insole substrate according to the embodiments of the present invention is characterized in that the shoe insole substrate has a wiring region connecting the switch region (that is, the region where the switch pattern is formed) and the signal output region (that is, Wherein each of the wiring areas includes a curved (or spring-like) wiring area, that is, a curved wiring area, and the curved wiring area includes at least one crack prevention hole in at least one inner area The inner film layers are not cracked and the inner wiring patterns may not be broken even if the pressure is continuously applied by the person walking in the shoe insole. However, the effects of the present invention are not limited to the above-described effects, and may be variously extended without departing from the spirit and scope of the present invention.

1 is a plan view of a shoe insoles substrate according to embodiments of the present invention.
Fig. 2 is a cross-sectional view showing the shoe insoles substrate of Fig. 1;
FIGS. 3A and 3B are views for explaining how the shoe insoles substrate of FIG. 1 prevents internal cracks and breakage of internal wiring patterns. FIG.
4 is a view of a shoe insole according to embodiments of the present invention.
5 is a plan view showing an example of a switch region of a shoe insole substrate included in the shoe insole of Fig.
6 is a plan view showing an example of a shoe insole sensor included in the shoe insole of Fig.

For the embodiments of the invention disclosed herein, specific structural and functional descriptions are set forth for the purpose of describing an embodiment of the invention only, and it is to be understood that the embodiments of the invention may be practiced in various forms, The present invention should not be construed as limited to the embodiments described in Figs.

The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It is to be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but on the contrary, is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms may be used for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

It is to be understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, . On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between. Other expressions that describe the relationship between components, such as "between" and "between" or "neighboring to" and "directly adjacent to" should be interpreted as well.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprise", "having", and the like are intended to specify the presence of stated features, integers, steps, operations, elements, components, or combinations thereof, , Steps, operations, components, parts, or combinations thereof, as a matter of principle.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries should be construed as meaning consistent with meaning in the context of the relevant art and are not to be construed as ideal or overly formal in meaning unless expressly defined in the present application .

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The same reference numerals are used for the same constituent elements in the drawings and redundant explanations for the same constituent elements are omitted.

FIG. 1 is a plan view of a shoe insoles substrate according to embodiments of the present invention, FIG. 2 is a cross-sectional view of the shoe insoles substrate of FIG. 1, Are diagrams for explaining the prevention of disconnection of the wiring pattern.

Referring to FIGS. 1 to 3B, the shoe insoles substrate 100 may be manufactured as a flexible printed circuit board (FPCB) due to the characteristics of the shoe insoles. Specifically, the shoe insoles substrate 100 may include a base film layer 150, a reinforcing film layer 160, a copper foil pattern layer 170, and a protective film layer 180. At this time, the shoe insoles substrate 100 is attached to the shoe insole body 200, and the shoe insole sensors are placed on the switch areas of the shoe insoles substrate 100 through the holes formed in the shoe insole body 200. Accordingly, the switch regions of the shoe insoles substrate 100 can generate the pressure sensing signals by contacting the shoe insole sensors by the pressure applied by the person walking.

The base film layer 150 may include switch regions 110, a signal output region 120, and a wiring region 130. In one embodiment, the base film layer 150 may be a polyimide film. The wiring regions 130 connect the signal output region 120 and the switch region 110. That is, the pressure sensing signals generated in the switch region 110 may be transmitted to the signal output region 120 through the wiring region 130. Thus, the signal output region 120 can collect and transmit the pressure sensing signals output from each of the switch regions 110 to the processing module. For this purpose, a switch pattern 115 may be formed in each of the switch regions 110. At this time, the switch pattern 115 may include sensor contact patterns 117 at positions corresponding to the substrate contact protrusions of the shoe insole sensor. A signal output pattern 125 may be formed in the signal output area 120. [ A wiring pattern 135 may be formed in each of the wiring regions 130. Although the wiring baton 135 is shown as three wirings in Fig. 1, the number of wirings in the wiring pattern 135 is not limited thereto. The inner film layers (i.e., the base film layer 150, the reinforcing film layer 160, the copper foil pattern layer 170, and the protective film layer (not shown) are formed on the shoe insole substrate 100, In order to prevent a situation where cracks are generated in the inner wiring patterns 180 (or 180), or the inner wiring patterns (that is, the wiring patterns 135 formed on the copper foil pattern layer 170) Each of the regions 130 may include a curved (or spring-like) wiring region, that is, a curved wiring region. As a result, since the curved wiring region included in the wiring region 130 functions as a buffer (i.e., acts as a spring) when the shoe insoles substrate 100 is pressed and stretched by the pressure applied by the person walking, The wiring pattern 130 in the wiring region 130 can be prevented from being torn or the wiring pattern 135 in the wiring region 130 can be prevented from being broken. That is, in the case of the wiring region including only the linear wiring region, the tensile force of the shoe insoles substrate 100 can not be buffered, and the wiring region may be torn or the wiring pattern in the wiring region may be cut off.

Particularly, the curved wiring region included in the wiring region 130 includes at least one crack preventing hole 140 in at least one curved inner region, so that the force FOR (or the like) externally applied to the wiring region 130 , Tensile force) can be effectively dispersed. In one embodiment, as shown in FIG. 1, the crack preventing holes 140 formed in the curved inner side region of the curved wiring region included in the wiring region 130 may have a circular shape. In another embodiment, the crack preventing holes 140 formed in the curved inner side region of the curved wiring region included in the wiring region 130 may have a part of a circular shape. For example, as shown in FIG. 3A, in the case of a wiring region including only a linear wiring region, when a force FOR is applied from the outside to the wiring region, the force FOR can be collected at a specific point in the wiring region have. Thus, the externally applied force (FOR) is maximized at a specific point and the wiring region is torn, and accordingly, the wiring pattern in the wiring region can be broken. 3B, when the force FOR is applied from the outside to the wiring region 130 in the case of the wiring region 130 including the curved wiring region, the force FOR is applied to the wiring region 130 (Or a part of the circular shape) without gathering at a specific point of the crack prevention hole 130, as shown in FIG. Since the externally applied force FOR is dispersed along the crack preventing hole 140 having a circular shape (or a part of a circular shape), the wiring region 130 is torn, The breakage of the pattern 135 can be effectively prevented.

The reinforcing film layer 160 is disposed under the base film layer 150 and may overlap the base film layer 150 in the same shape as the base film layer 150. [ That is, the reinforcing film layer 160 may include the switch regions 110, the signal output region 120, and the wiring regions 130 in the same manner as the base film layer 150. In one embodiment, the reinforcing film layer 160 may be a polyester film. According to an embodiment, to enhance the tensile strength of the reinforcing film layer 160, the reinforcing film layer 160 may be manufactured by thermally processing at least one hour at 100 degrees Celsius or more. The copper foil pattern layer 170 is disposed on the base film layer 150 and includes switch patterns 115 formed in the switch regions 110, a signal output pattern 125 formed in the signal output region 120, And the wiring patterns 135 formed in the regions 130. In one embodiment, the copper foil pattern layer 170 includes switch patterns 115 formed in the switch regions 110 in a copper plate, a signal output pattern 125 formed in the signal output region 120, May be manufactured by removing portions except for the wiring patterns 135 formed in the regions 130. The protective film layer 180 (i.e., coverlay) may be disposed on top of the copper foil pattern layer 170. The protective film layer 180 may be made of an insulating material to insulate the copper foil pattern layer 170. At this time, the protective film layer 180 may include holes for sensor contact. The sensor contact patterns 117 included in the switch pattern 115 formed on the copper foil pattern layer 170 can be exposed to the outside through the sensor contact holes included in the protective film layer 180. [ The sensor contact patterns 117 included in the switch pattern 115 formed on the copper foil pattern layer 170 may be electroless gold plated through the sensor contact holes formed in the protective film layer 180. [

2, the base film layer 150, the reinforcing film layer 160, the copper foil pattern layer 170, and the protective film layer 180 are adhered to each other via the first adhesive layer 190 . That is, the first adhesive layer 190 is disposed on the upper side of the reinforcing film layer 160 and the base film layer 150 is disposed on the upper side of the first adhesive layer 190, (150) may be adhered to each other via the first adhesive layer (190). The first adhesive layer 190 is disposed on the upper portion of the base film layer 150 and the copper foil pattern layer 170 is disposed on the upper portion of the first adhesive layer 190, (170) can be adhered to each other via the first adhesive layer (190). The first adhesive layer 190 is disposed on the upper portion of the copper foil pattern layer 170 and the protective film layer 180 is disposed on the upper portion of the first adhesive layer 190, (180) can be adhered to each other via the first adhesive layer (190). 2 shows a first adhesive layer 190 as adhesive layers for bonding the base film layer 150, the reinforcing film layer 160, the copper foil pattern layer 170 and the protective film layer 180 to each other, The adhesive layers for bonding the film layer 150, the reinforcing film layer 160, the copper foil pattern layer 170, and the protective film layer 180 to each other may be different from each other. As described above, the shoe insoles substrate 100 may be attached to the shoe insoles body 200. The second adhesive layer 195 is disposed on the upper portion of the protective film layer 180 and the shoe insol body 200 is disposed on the upper portion of the second adhesive layer 195, The body 200 can be attached to each other via the second adhesive layer 195. [ For example, the second adhesive layer 195 may be an adhesive layer which may be composed of a release paper. However, this is an exemplary one, and the second adhesive layer 195 is not limited thereto.

As described above, the shoe insoles substrate 100 connects the switch region 110 (that is, the region where the switch pattern 115 is formed) and the signal output region 120 (that is, the region where the signal output pattern 125 is formed) And the wiring region 130 includes a curved (or spring-like) wiring region, that is, a curved wiring region, The curved wiring region has at least one crack preventing hole 140 in at least one inner region so that even if pressure is continuously applied as a person walk in the shoe insole, Cracks are not generated in the wiring layer 150 (the film layer 150, the reinforcing film layer 160, the copper foil pattern layer 170, and the protective film layer 180) (135) may not be disconnected. As a result, the shoe insoles substrate 100 is not easily deteriorated and can have high durability, so that the shoe insoles including the shoe insoles substrate 100 can greatly increase the life expectancy.

FIG. 4 is a view showing a shoe insole according to an embodiment of the present invention, FIG. 5 is a plan view showing an example of a switch area of a shoe insole substrate included in the shoe insole of FIG. 4, Fig. 3 is a plan view showing an example of a shoe insole sensor included in an insole. Fig.

4 to 6, the shoe insole 300 may include a shoe insole body 200, a shoe insole board 400, a shoe insole sensor 500, and a processing module 600. Depending on the embodiment, the shoe insole 300 may further include additional sensors such as a gyroscope sensor, an acceleration sensor, a temperature sensor, a humidity sensor, a GPS, a geomagnetic sensor, and the like. As shown in FIG. 4, the shoe insole sensors 500 may be disposed on top of the switch regions of the shoe insoles substrate 400. 4, shoe insole substrate 400 includes four switch regions, so that four shoe insole sensors 500 are shown disposed on top of shoe insoles substrate 400, The number of the switch regions included in the shoe insoles substrate 400 and the number of the shoe insole sensors 500 disposed on the shoe insoles substrate 400 may be variously determined (for example, Which may be eight, as in U.S. Patent No. 1,283,434). 5, a switch pattern 410 is formed on each of the switch regions of the shoe insoles substrate 400 and the switch pattern 410 is formed on the substrate contact protrusions 520 of the shoe insole sensor 500 -1, 520-2) of the sensor contact patterns 420-1 and 420-2. 6, the shoe insole sensor 500 includes a substrate contact portion 420-1, 420-2 that can contact the sensor contact patterns 420-1, 420-2 based on the pressure applied at the upper portion as a person walked, And may include protrusions 520-1 and 520-2. For example, the first substrate contact protrusion 520-1 of the shoe insole sensor 500 may be positioned on the first sensor contact pattern 420-1 formed in each of the switch regions of the shoe insoles substrate 400 And the second substrate contact protrusion 520-2 of the shoe insole sensor 500 may be located on the second sensor contact pattern 420-2 formed on each of the switch regions of the shoe insoles substrate 400. [ At this time, the height of the first substrate contact projection 520-1 and the height of the second substrate contact projection 520-2 are different in the shoe insole sensor 500, The first substrate contact protrusion 520-1 and the second substrate contact protrusion 520-2 are connected to the first sensor contact pattern 420-1 and the second sensor contact pattern 420-1 formed on the switch regions of the shoe insoles substrate 400, Since there is a difference in the pressure that can be contacted with the pattern 420-2, the shoe insole 300 has three levels of data resolution (i.e., data indicating that no pressure has been applied, data indicating that a weak pressure has been applied, Data indicating that strong pressure has been applied). However, this is described in Korean Patent No. 1,283,434 of the present applicant, the contents of which are incorporated herein by reference in their entirety.

To this end, a wiring pattern 135 composed of three wirings may be formed in the wiring region connecting the signal output region and the switch regions in the shoe insoles substrate 400. 5, the wiring pattern 135 includes a wiring VIN for transmitting a reference voltage, a wiring SIG1 for transmitting a first pressure sensing signal, and a wiring (not shown) for transmitting a second pressure sensing signal. (SIG2). For example, when no pressure is applied to a specific switch region of the shoe insole 300, the first pressure sensing signal is not transmitted through the wiring SIG1, and the second pressure sensing signal is also transmitted through the wiring SIG2 . Further, when a weak pressure is applied to the specific switch region of the shoe insole 300, the first pressure sensing signal is not transmitted through the wiring SIG1, but the second pressure sensing signal can be transmitted through the wiring SIG2 . Furthermore, when a strong pressure is applied to the specific switch region of the shoe insole 300, the first pressure sensing signal may be transmitted through the wiring SIG1, and the second pressure sensing signal may be transmitted through the wiring SIG2. At this time, as described above, the wiring region connecting the signal output region and the switch regions in the shoe insoles substrate 400 includes a curved (or spring-shaped) wiring region, that is, a curved wiring region, Since the curved wiring region includes at least one crack preventing hole in at least one curved inner region, even if pressure is constantly applied to the shoe insoles substrate 400 as a person walked, cracks occur in the inner film layers Or the state in which the shoe insoles substrate 400 does not function due to break of the internal wiring patterns can be prevented. The processing module 600 may determine the position and size of the pressure applied to the shoe insole 300 by collecting the pressure sensing signals output from the switch regions of the shoe insoles substrate 400. [ For this purpose, a signal output pattern may be formed in the signal output area in the shoe insoles substrate 400. As described above, the shoe insole substrate and the shoe insole including the shoe insole substrate according to the embodiments of the present invention have been described with reference to Figs. 1 to 6. However, the shoe insole substrate according to the embodiments of the present invention, And shoe insole including the shoe sole may be variously modified and changed without departing from the spirit and scope of the present invention.

The present invention can be applied to a shoe insole for gait diagnosis. Therefore, the present invention can be applied to a gait diagnostic system that extracts human gait data by mounting a shoe insole for gait diagnosis in a shoe worn by a person, and performs gait diagnosis based on the gait data.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the following claims. It can be understood that it is possible.

100: shoe insole substrate 110: switch area
115: Switch pattern 117: Sensor contact pattern
120: signal output area 125: signal output pattern
130: wiring area 135: wiring pattern
140: crack prevention hole 150: base film layer
160: reinforcing film layer 170: copper foil pattern layer
180: protective film layer 190: first adhesive layer
195: second adhesive layer 200: shoe insole body
300: shoe insole 400: shoe insole substrate
410: Switch pattern 420: Sensor contact pattern
500: shoe insole sensor 520: substrate contact projection
600: Processing module

Claims (10)

A base film layer including switch regions, a signal output region, and wiring regions connecting the switch regions and the signal output region;
A reinforcing film layer disposed under the base film layer and overlapping the base film layer in the same shape as the base film layer;
A copper foil pattern layer disposed on the base film layer and including switch patterns formed in the switch regions, a signal output pattern formed in the signal output region, and wiring patterns formed in the wiring regions; And
And a protective film layer disposed on the top of the copper foil pattern layer,
Wherein each of the wiring regions includes a curved wiring region and the curved wiring region includes at least one crack preventing hole in at least one curved inner region. The shoe insole substrate according to claim 1, wherein the at least one crack preventing hole has a circular shape. The shoe insole substrate according to claim 1, wherein the at least one crack preventing hole has a part of a circular shape. The shoe insole substrate according to claim 1, wherein the base film layer, the reinforcing film layer, the copper foil pattern layer, and the protective film layer are bonded to each other via a first adhesive layer. The shoe insole substrate of claim 1, wherein the protective film layer is attached to the shoe insole body via a second adhesive layer. The shoe insole substrate according to claim 1, wherein the base film layer is a polyimide film (PI) film. The shoe insole substrate of claim 1, wherein the reinforcing film layer is a polyester (PET) film. The shoe insole substrate of claim 7, wherein the reinforcing film layer is manufactured by thermally processing at least 100 ° C for at least one hour. The shoe insoles substrate according to claim 1, wherein the sensor contact patterns included in each of the switch patterns are exposed to the outside through sensor contact holes included in the protective film layer. 10. The shoe insole substrate of claim 9, wherein the sensor contact patterns are electroless gold plated through the sensor contact holes.

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