KR101774219B1 - Non-Contact Type Peeling Apparatus and Method of Chemical Liquid Film, and Apparatus and Method of Bonding Substrates Having the Same - Google Patents

Non-Contact Type Peeling Apparatus and Method of Chemical Liquid Film, and Apparatus and Method of Bonding Substrates Having the Same Download PDF

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KR101774219B1
KR101774219B1 KR1020150170022A KR20150170022A KR101774219B1 KR 101774219 B1 KR101774219 B1 KR 101774219B1 KR 1020150170022 A KR1020150170022 A KR 1020150170022A KR 20150170022 A KR20150170022 A KR 20150170022A KR 101774219 B1 KR101774219 B1 KR 101774219B1
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carrier film
roll
substrate
upper substrate
chemical liquid
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KR1020150170022A
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Korean (ko)
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KR20170064616A (en
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이수용
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주식회사 나래나노텍
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02054—Cleaning before device manufacture, i.e. Begin-Of-Line process combining dry and wet cleaning steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/951—Supplying the plurality of semiconductor or solid-state bodies
    • H01L2224/95115—Supplying the plurality of semiconductor or solid-state bodies using a roll-to-roll transfer technique
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3512—Cracking
    • H01L2924/35121—Peeling or delaminating

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

The present invention discloses a non-contact type chemical liquid film peeling apparatus and method, and a substrate laminating apparatus and method therefor.
A non-contact type chemical liquid film peeling apparatus according to the present invention comprises: a supply roll for supplying a carrier film; A coating device provided on the carrier film and applying a chemical solution on the carrier film; A hardening device provided behind the applying device for hardening the chemical solution; The upper surface of the upper substrate provided on the rear side of the hardening device and being movable in a horizontal direction in contact with the lower surface of the carrier film to adhere the hardened liquid to the upper substrate, ; A pair of front tension rolls and a pair of rear tension rolls respectively provided to maintain the carrier film in an inclined state in front of and behind the upper substrate; A recovery roll for recovering the carrier film from which the hardened chemical solution has been separated; And a cleaning and drying device provided between the recovery roll and the supply roll for cleaning and drying the carrier film fed back from the recovery roll to the supply roll.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact type chemical liquid film peeling apparatus and method,

The present invention relates to an apparatus and method for removing a noncontact chemical film, and an apparatus and a method for attaching a substrate to the apparatus.

More specifically, the present invention relates to a method for pre-curing a chemical liquid applied on a carrier film when applying a chemical liquid such as an optical clear resin (OCR) to an upper substrate, The carrier film and the chemical liquid are peeled off using an attaching roll located at the bottom of the carrier film to attach the chemically cured chemical liquid to the upper substrate and the hardened chemical liquid adheres the upper substrate to the lower substrate, It is possible to perform non-contact peeling of the chemical liquid, thereby preventing curling or damage / breakage of the carrier film since the cutting process is not used, minimizing or eliminating the possibility of remaining of the chemical liquid on the carrier film, reusing the carrier film , The structure of the contact type chemical liquid film peeling apparatus is simplified, and the chemical liquid peeling time and thus the total processing time (tact time) and cost can be remarkably reduced The present invention relates to a non-contact type chemical liquid film peeling apparatus and method, in which the possibility of occurrence of a defect in a final product is greatly reduced, and the quality is remarkably improved, and a substrate laminating apparatus and method having the same.

2. Description of the Related Art [0002] With the development of an information society, demands for a display device for outputting image information have been diversified, and plasma display panels (PDPs), liquid crystal displays (LCDs), and the like, which replace conventional cathode ray tubes (CRTs) (FPD) devices such as a liquid crystal display (LCD), a field emission display (FED), an organic light emitting diode (OLED), a monitor for a PC, and a monitor for a tablet PC, Flat Panel Display).

Of the various FPDs described above, PDPs or LCDs, which are widely used from a mobile phone screen to a large-sized TV screen, are used as the most typical flat panel display (FPD). Also. Along with the introduction of smartphones, demand for small displays such as touch screen panels (TSP) is also increasing.

For example, in order to manufacture a display such as an FPD or a TSP, a step of preparing a display is generally performed by preparing a first substrate (lower substrate) such as a thin film transistor array substrate having a thin film transistor; Preparing a second substrate (upper substrate) such as a color filter array substrate having a color filter layer; And bonding the first and second substrates together. In this case, the step of attaching the first substrate and the second substrate is performed by the substrate adhering apparatus.

Recently, in accordance with the introduction of a flexible display and the like, an upper film (first film) and a lower film (second film) made of PET (polyethylene terephthalate), which is a flexible flexible film in place of the upper substrate and the lower substrate, do.

As described above, the upper substrate / upper film (hereinafter collectively referred to as "upper substrate") and the lower substrate / lower film (hereinafter collectively referred to as "lower substrate") are used for manufacturing a conventional display or flexible display composed of a glass panel. ) Should be applied by OCR (hereinafter collectively referred to as "chemical solution").

FIG. 1A is a view showing a conventional contact type chemical liquid film peeling apparatus for attaching an upper substrate and a lower substrate according to the related art, and FIG. 1B is a view illustrating a substrate sticking apparatus according to the related art.

1A and 1B, a contact type chemical liquid film peeling apparatus 100 for attaching an upper substrate and a lower substrate according to the related art includes a supply roll 110 for supplying a carrier film 112; An applicator 120 provided on the carrier film 112 for applying the drug solution 122 on the carrier film 112; And is horizontally moved in contact with the lower surface of the carrier film 112 to move the chemical solution 122 to the lower side of the upper substrate 130, An attachment roll 140 attached to the upper substrate 130; A pair of front tension rolls 142 and a pair of rear tension rolls 144 that are provided so as to be able to move up and down respectively on the carrier film 112 at the front and rear of the upper substrate 130; A cutting member 150 provided at the rear of the upper substrate 130 to separate the carrier film 112 from the chemical solution 122; And a recovery roll 160 for recovering the carrier film 112 from which the chemical solution 122 has been separated.

Thereafter, the upper substrate 130 to which the chemical liquid 122 is attached is transferred to the prior art substrate bonding apparatus 101 shown in FIG. 1B by a pick-up device 170 such as a robot arm. The prior art substrate sticking apparatus 101 includes a contact type chemical liquid film peeling apparatus 100 for attaching the upper substrate 130 and the lower substrate 190 together; A stage 180 on which the lower substrate 190 is mounted; A pick-up device 170 for transporting and lowering the upper substrate 130 on the lower substrate 190; And a hardening device 195 provided movably on the upper substrate 130 and attaching the upper substrate 130 and the lower substrate 190 together.

The concrete structure and operation of the contact type chemical liquid film peeling apparatus 100 and the substrate lacing apparatus 101 for laminating the upper substrate and the lower substrate according to the above-described prior art will be described.

In the contact type chemical liquid film peeling apparatus 100 according to the related art, the carrier film 112 is supplied from the supply roll 110 to the recovery roll 160, The drug solution 122 is applied onto the carrier film 112 by the doctor blade 120.

Thereafter, the carrier film 112 coated with the chemical liquid 122 is supplied to the lower portion of the upper substrate 130.

Thereafter, a pair of front tension rolls 142 and a pair of rear presentation rolls 144 provided on the front and rear of the upper substrate 130 are lowered and lifted to come in contact with the carrier film 112, respectively, The adhesive roll 140 positioned below the upper substrate 130 moves in the horizontal direction while being in contact with the lower surface of the carrier film 112. In this state, As a result, the chemical liquid 122 applied on the carrier film 112 is adhered onto the upper substrate 130. [

The cutting member 150 provided on the rear side of the upper substrate 130 contacts the upper surface of the carrier film 112 and moves in the horizontal direction or the carrier film 112 itself moves in the direction of the recovery roll 160 And separates the chemical liquid 122 on the carrier film 112. Then, Here, the cutting member 150 is arranged, for example, in the width direction of the carrier film 112 (that is, in a direction perpendicular to the traveling direction of the carrier film 112) A cutting knife or a cutting roll provided may be used.

Thereafter, the carrier film 112 from which the chemical solution 122 has been separated is recovered in the recovery roll 160, and the upper substrate 130 with the chemical solution 122 attached thereto is picked up by the pick-up device 170, The lower substrate 190 of the prior art substrate cementing apparatus 101 shown in the drawing is transferred onto the mounted stage 180. The upper substrate 130 is then lowered onto the lower substrate 190 and positioned in alignment with the lower substrate 190. Thereafter, the pick-up device 170 is transported to its original position for picking up the subsequent upper substrate of the contact type chemical liquid film peeling apparatus 100.

Thereafter, the curing device 195 moves on the upper substrate 130 to irradiate light on the upper substrate 130 to cure the chemical solution 122 between the upper substrate 130 and the lower substrate 190, (130) and the lower substrate (190) are bonded together.

The chemical solution 122 such as OCR used in the substrate bonding apparatus 101 according to the related art is first attached to the upper substrate 130 using the carrier film 112 and then bonded to the lower substrate 190 It is possible to form a carrier on the lower substrate 190 positioned on the stage 180 first, for example, as in the case of the above-described prior art substrate cementing apparatus 101 or the above- It is impossible to adhere the chemical liquid 122 using the film 112. [

Therefore, the use of the contact type chemical liquid film peeling apparatus 100 for bonding the upper and lower substrates as described above is indispensably required, and the following problems arise.

1. First, in the contact type chemical liquid film peeling apparatus 100 according to the related art, the chemical liquid 122 is separated by using the cutting member 150. In this case, the degree of adhesion of the chemical solution 122 adhering to the surface of the upper substrate 130 is not uniform, so that the carrier film 150 is not separated from the chemical solution 122, or a part of the chemical solution 122 is separated from the carrier film 112, or a part of the film may be curled. In addition, since the cutting member 150 comes into contact with the upper surface of the carrier film 112, damage may occur to the carrier film 112 itself or severe damage may occur. Accordingly, the carrier film 112 can not be reused, problems that frequently must be changed, loss of material cost due to the amount of the chemical liquid 122 lost by the cutting process, The process of attaching the chemical liquid 122 on the surface of the wafer W is defective.

2. Even when the separation process of the chemical liquid 122 adhered to the upper substrate 130 is successfully performed, it is difficult for the surface of the separated chemical liquid 122 to maintain a uniform surface state. As a result, a bubble layer is formed between the upper substrate 130 and the lower substrate 190 as a result of a process of bonding with the lower substrate 190, which is a subsequent process, so that there is a high possibility that defects of the final product occur.

3. The structure and the process of the contact type chemical liquid film peeling apparatus 100 according to the use of the cutting member 150 become complicated.

4. Due to the above-described problems, the time taken for the chemical liquid detachment and thus the total processing time (tact time) and cost are greatly increased.

Therefore, there is a need for a new method for solving the problems of the above-described conventional techniques.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the problems of the prior art described above, and it is an object of the present invention to provide a method of pre- curing a drug solution applied on a carrier film, The carrier film and the chemical liquid are peeled off using an attaching roll located under the carrier film by moving to the lower part of the substrate, and the chemically induced chemical liquid is adhered to the upper substrate, The non-contact peeling of the carrier film and the chemical liquid can be performed, and the cutting process is not used, thereby preventing the carrier film from being curled or damaged / damaged, eliminating the possibility of remaining of the chemical liquid on the carrier film and reusing the carrier film And the structure of the contact type chemical liquid film peeling apparatus is simplified, so that the chemical liquid peeling time and thus the total processing time (tact time) and cost can be remarkably reduced The present invention is to provide a non-contact type chemical liquid film peeling apparatus and method, in which the possibility of occurrence of defective products is greatly reduced, and the quality is remarkably improved, and a substrate laminating apparatus and method comprising the same.

A non-contact type chemical liquid film peeling apparatus according to a first aspect of the present invention comprises: a supply roll for supplying a carrier film; A coating device provided on the carrier film and applying a chemical solution on the carrier film; A hardening device provided behind the applying device for hardening the chemical solution; The upper surface of the upper substrate provided on the rear side of the hardening device and being movable in a horizontal direction in contact with the lower surface of the carrier film to adhere the hardened liquid to the upper substrate, ; A pair of front tension rolls and a pair of rear tension rolls respectively provided to maintain the carrier film in an inclined state in front of and behind the upper substrate; A recovery roll for recovering the carrier film from which the hardened chemical solution has been separated; And a cleaning and drying device provided between the recovery roll and the supply roll for cleaning and drying the carrier film fed back from the recovery roll to the supply roll.

According to a second aspect of the present invention, there is provided a substrate cementing apparatus comprising: a noncontact chemical film peeling apparatus for cementing an upper substrate and a lower substrate; A stage on which the lower substrate is mounted; Up device for transferring and lowering the upper substrate onto the lower substrate; And a hardening device provided movably on the upper substrate, wherein the upper substrate and the lower substrate are attached to each other.

A third aspect of the present invention provides a non-contact type chemical liquid film peeling method comprising the steps of: a) applying a chemical liquid onto a carrier film supplied from a supply roll to a recovery roll; b) curing the drug solution applied on the carrier film; c) supplying the carrier film coated with the hardened chemical solution to a lower portion of the upper substrate; d) a pair of front tension rolls provided on the front and rear sides of the upper substrate, respectively, while raising the adhering roll located at the lower portion of the upper substrate to come in contact with the lower surface near one edge of the adhering liquid, Maintaining the carrier film in an inclined state using a pair of rear tension rolls; e) peeling the carrier film from the hardened chemical solution while moving the adhering roll near the one edge to the other edge to adhere the hardened drug solution onto the upper substrate; And f) moving the carrier film from which the hardened chemical solution has been peeled to the recovery roll and recovering the recovered carrier film.

According to a fourth aspect of the present invention, there is provided a method for attaching a substrate to a substrate, the method comprising the steps of: a) attaching a hardened liquid to an upper substrate using a noncontact liquid film peeling apparatus; b) lowering the upper substrate on which the hardened chemical liquid is adhered onto a lower substrate provided on a stage using a pickup device, and positioning the upper substrate in alignment with the lower substrate; And c) curing the hardened chemical liquid between the upper substrate and the lower substrate by irradiating light on the upper substrate using the curing apparatus to adhere the upper substrate and the lower substrate together .

The following effects can be achieved by using the apparatus and method for peeling non-contact type chemical liquid film according to the present invention and the apparatus and method for laminating a substrate having the same.

1. Non-contact peeling of a carrier film and a chemical solution is possible.

2. Since the cutting process is not used, curling or damage / breakage of the carrier film is prevented, and the possibility of remaining of the chemical liquid on the carrier film is minimized or eliminated.

3. The carrier film can be reused, and the structure of the contact type chemical liquid film peeling apparatus is simplified.

4. Drug release time and thus total process time and cost are significantly reduced.

5. Significantly improves the quality of the final product, greatly reducing the possibility of failure.

Further advantages of the present invention can be clearly understood from the following description with reference to the accompanying drawings, in which like or similar reference numerals denote like elements.

1A is a view showing a contact type chemical liquid film peeling apparatus for attaching an upper substrate and a lower substrate according to a related art.
FIG. 1B is a view showing a conventional substrate sticking apparatus. FIG.
2A is a schematic view of a non-contact type chemical liquid film peeling apparatus according to an embodiment of the present invention.
FIGS. 2B through 2D are views illustrating a method for peeling the noncontact type chemical liquid film according to an embodiment of the present invention, which is performed using the noncontact chemical film peeling apparatus according to an embodiment of the present invention.
FIG. 2E is a view schematically showing a non-contact type chemical liquid film peeling apparatus according to an alternative first embodiment of the present invention.
FIG. 2F is a view schematically showing a non-contact type chemical liquid film peeling apparatus according to an alternative second embodiment of the present invention.
FIG. 2F is a view schematically showing a substrate adhering apparatus according to an embodiment of the present invention.
FIG. 2G is a view schematically showing a method of attaching a substrate according to an embodiment of the present invention.
3A is a view showing a flowchart of a non-contact type chemical liquid film peeling method according to an embodiment of the present invention.
FIG. 3B is a view showing a flowchart of a substrate bonding method according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to embodiments and drawings of the present invention.

2A is a schematic view of a non-contact type chemical liquid film peeling apparatus according to an embodiment of the present invention, and FIGS. 2B to 2D are views showing a state in which a non-contact chemical liquid film peeling apparatus according to an embodiment of the present invention is used 2A is a view for explaining a non-contact type chemical liquid film peeling method according to an embodiment of the present invention.

Referring to FIGS. 2A to 2D, a non-contact type chemical liquid film peeling apparatus 200 according to an embodiment of the present invention includes a supply roll 210 for supplying a carrier film 212; A coating device 220 provided on the carrier film 212 and applying a chemical solution 222 on the carrier film 212; A hardening device 225 provided behind the applying device 220 for hardening the chemical solution 222; Is provided so as to be able to move up and down from the lower part of the upper substrate 230 provided on the rear side of the hardening device 225 and moves horizontally in contact with the lower surface of the carrier film 212, (240) for attaching the upper substrate (230) to the upper substrate (230); A pair of front tension rolls 242 and a pair of rear tension rolls 244 respectively provided to keep the carrier film 212 in an inclined state in front of and behind the upper substrate 230; A recovery roll 260 for recovering the carrier film 212 from which the hardened chemical solution 223 has been separated; And a cleaning and drying device provided between the recovery roll (260) and the supply roll (210) for cleaning and drying the carrier film (212) fed back from the recovery roll (260) (265).

Hereinafter, the specific configuration and operation of the non-contact type chemical liquid film peeling apparatus 200 and the substrate lacing apparatus 201 according to one embodiment of the present invention will be described below.

2A to 2D, in the non-contact type chemical liquid film peeling apparatus 200 according to the embodiment of the present invention, while the carrier film 212 is supplied from the supply roll 210 to the recovery roll 260 The chemical liquid 222 is applied onto the carrier film 212 by the application device 220 provided on the top of the carrier film 212. [

Thereafter, the carrier film 212 coated with the chemical liquid 222 is supplied to the lower portion of the upper substrate 230. In this case, the chemical liquid 222 applied on the carrier film 212 is hardened by the temporary hardening device 225 provided on the rear side of the application device 220. As a result, a hardened chemical liquid 223 is supplied to the lower portion of the upper substrate 230 on the carrier film 212.

Thereafter, the adhesive roll 240 located at the lower portion of the upper substrate 230 rises and contacts the lower surface of the carrier film 212 near the right edge of the hardened chemical liquid 223. At the same time, the upper front tension roll 242u of the pair of front tension rolls 242 provided on the front side of the upper substrate 230 is lowered to come into contact with the upper portion of the carrier film 212, The lower rear tension roll 244d of the pair of rear tension rolls 244 provided on the carrier film 212 comes into contact with the lower portion of the carrier film 212 and rises. 2B and 2C, the lower front tension roll 242d of the pair of front tension rolls 242 maintains the fixed state, and the upper front tension roll 242u moves so as to be able to move up and down. On the other hand, The upper rear tension roll 244u of the pair of rear tension rolls 244 maintains the fixed state and the lower rear tension roll 244d moves up and down. As a result, the carrier film 212 maintains a tilted state between the pair of front tension rolls 242 and the pair of rear tension rolls 244 in a state where the right side is high (see Fig. 2C).

Thereafter, the adhering roll 240 moves in the vicinity of the edge on the right side in the vicinity of the right edge of the adhered liquid medicament 223, and the adhered liquid medicine 223 is adhered on the upper substrate 230. In this case, by the cooperation operation of the pair of front tension rolls 242 and the pair of rear tension rolls 244 which maintain the adhered liquid medicine 223 and the carrier film 212 in an inclined state, The carrier film 212 is peeled off from the hardened chemical liquid 223 while attaching the carrier film 223 to the upper substrate 230.

Thereafter, the carrier film 212 on which the adhered chemical liquid 223 has been peeled is moved to the recovery roll 260 and recovered (see Fig. 2D).

In the non-contact type chemical liquid film peeling apparatus 200 according to an embodiment of the present invention, one chemical liquid 222 is applied and one hardened chemical liquid 223 according to the hardening process is formed on one upper substrate 230 It is described that the carrier film 212 is peeled off from the adhered liquid medicine 223 after the adhered liquid medicine 223 is adhered to the liquid medicine 222. However, It is apparent that the process of peeling the carrier film 212 from the subsequent hardened drug solution 223 is continuously performed after being adhered onto the subsequent upper substrate 230. [

Thereafter, the recovered carrier film 212 in the recovery roll 260 is fed back to the feed roll 210. In this case, the fed-back carrier film 212 is cleaned and dried while passing through the cleaning and drying device 265 provided between the recovery roll 260 and the supply roll 210, so that the carrier film 212 can be reused.

In the embodiment shown in FIG. 2C, the carrier film 212 is illustratively shown as being maintained in a tilted state with the right side being high. However, those skilled in the art will appreciate that the carrier film 212 may be tilted It can be understood that it can be maintained. More specifically, the mounting roll 240 located at the lower portion of the upper substrate 230 shown in FIG. 2B is lifted up to the lower surface of the carrier film 212 near the left edge of the hardened chemical liquid 223 The lower front tension roll 242d of the pair of front tension rolls 242 provided on the front side of the upper substrate 230 comes in contact with the lower portion of the carrier film 212 and rises, The upper rear tension roll 244u of the pair of rear tension rolls 244 provided on the rear side of the carrier film 230 is lowered and brought into contact with the upper portion of the carrier film 212. [ In this case, the upper front tension roll 242u of the pair of front tension rolls 242 remains fixed and the lower front tension roll 242d moves so as to be able to ascend and descend, while the pair of rear tension rolls 244 The lower rear tension roll 244d remains fixed and the upper rear tension roll 244u moves to be able to move up and down. As a result, it will be appreciated that the carrier film 212 may maintain a tilted state with the left side being high.

FIG. 2E is a view schematically showing a non-contact type chemical liquid film peeling apparatus according to an alternative first embodiment of the present invention.

2E, in the non-contact type chemical liquid film peeling apparatus 200 according to the first alternative embodiment of the present invention, the cleaning and drying device 265 is disposed between the pair of rear tension rolls 244 and the recovery rolls 260 except that the non-contact type chemical liquid film peeling apparatus 200 according to the embodiment of the present invention shown in FIG. 2A is provided. Therefore, detailed description of the specific configuration and operation of the non-contact type chemical liquid film peeling apparatus 200 according to the alternative first embodiment of the present invention shown in FIG. 2E will be omitted.

FIG. 2F is a view schematically showing a non-contact type chemical liquid film peeling apparatus according to an alternative second embodiment of the present invention.

Referring to FIG. 2F, in the non-contact type chemical liquid film peeling apparatus 200 according to the second alternative embodiment of the present invention, the cleaning and drying apparatus 265 is separately provided, Contact type chemical liquid film peeling apparatus 200 according to an embodiment of the present invention. In the non-contact type chemical liquid film peeling apparatus 200 according to the second alternative embodiment of the present invention shown in FIG. 2F, the used carrier film 212 is fed back from the recovery roll 260 to the supply roll 210 And is washed and dried while passing through a cleaning and drying device 265 which is separately provided in the middle of the drying process, thereby being reusable. The non-contact type chemical liquid film peeling apparatus 200 according to the second alternative embodiment of the present invention shown in FIG. 2F can be usefully used when two or more non-contact chemical film peeling apparatuses 200 are used. Therefore, detailed description of the specific configuration and operation of the non-contact type chemical liquid film peeling apparatus 200 according to the alternative second embodiment of the present invention shown in FIG. 2F will be omitted.

As described above, in the non-contact type chemical liquid film peeling apparatus 200 according to the embodiment of the present invention shown in FIG. 2A to FIG. 2F, the hardened chemical liquid 223 is adhered on the upper substrate 230, The upper substrate 230 is picked up by the pick-up device 270 and transferred to the substrate sticking apparatus 201 of the present invention to be described later.

FIG. 2F is a schematic view of a substrate cementing apparatus according to one embodiment of the present invention, and FIG. 2G is a view schematically showing a method of cementing a substrate according to an embodiment of the present invention.

Referring to FIG. 2F, the substrate sticking apparatus 201 according to an embodiment of the present invention includes a non-contact type chemical liquid film peeling apparatus for attaching the upper substrate 230 and the lower substrate 290 together (200); A stage 280 on which the lower substrate 290 is mounted; A pick-up device 270 for transporting and lowering the upper substrate 230 on the lower substrate 290; And a hardening device 295 provided movably on the upper substrate 230 and attaching the upper substrate 230 and the lower substrate 290 together. The non-contact type chemical liquid film peeling apparatus 200 for attaching the upper substrate 230 and the lower substrate 290 used in the substrate sticking apparatus 201 according to an embodiment of the present invention includes the above- Non-contact type chemical liquid film peeling apparatus 200 according to an embodiment of the present invention shown in FIG.

Referring again to FIGS. 2F and 2G, with reference to FIGS. 2A to 2F, in the substrate sticking apparatus 201 according to the embodiment of the present invention, the contactless method according to the embodiment of the present invention shown in FIGS. The upper substrate 230 on which the chemical liquid 223 adhered by the chemical film stripping apparatus 200 is attached is picked up by the pick-up apparatus 270 and transferred to the substrate cementing apparatus 201.

The upper substrate 230 is then lowered onto the lower substrate 290 by the pick-up device 270 and positioned in alignment with the lower substrate 290. Thereafter, the pick-up device 270 is transferred to its original position to pick up the subsequent upper substrate of the non-contact liquid film dispenser 200.

Thereafter, the curing device 295 moves onto the upper substrate 230 and irradiates light on the upper substrate 230 to irradiate the hardened chemical solution 223 between the upper substrate 230 and the lower substrate 290 The upper substrate 230 and the lower substrate 290 are cured.

The hardening device 225 and the hardening device 295 used in the above-described embodiments of the present invention can be implemented as ultraviolet (UV) hardening devices, respectively.

3A is a view showing a flowchart of a non-contact type chemical liquid film peeling method according to an embodiment of the present invention.

Referring to FIG. 3A, with reference to FIGS. 2A through 2F, a method 300 for removing a noncontact film of a chemical liquid film according to an embodiment of the present invention includes the steps of: a) removing a carrier film 212 Applying (310) a chemical liquid (222) on the substrate; b) hardening (320) the drug solution (222) applied onto the carrier film (212); c) supplying (330) the carrier film (212) coated with the hardened chemical solution (223) to a lower portion of the upper substrate (230); d) While raising the adhering roll 240 located at the lower portion of the upper substrate 230 to come in contact with the lower surface in the vicinity of one side edge of the hardened liquid medicament 223, (340) maintaining the carrier film (212) in an inclined state by using a pair of front tension rolls (242) and a pair of rear tension rolls (244) e) moving the adhesive roll 240 to the vicinity of the edge of the one side edge and attaching the hardened drug solution 223 to the upper substrate 230 while moving the carrier film 212 to the hardened A step 350 of peeling off the chemical liquid 223; And f) moving and recovering the carrier film (212) with the peeled chemical solution (223) to the recovery roll (260).

The method 300 for removing a non-contact type chemical liquid film according to an embodiment of the present invention includes: g1) feeding back the recovered carrier film 212 to the supply roll 210; And h1) passing the fed-back carrier film (212) through a cleaning and drying device (265) provided between the collection roll (260) and the supply roll (210) to clean and dry.

The non-contact type chemical liquid film peeling method 300 according to an embodiment of the present invention may further include the steps of g2) separating the carrier film 212 from which the hardened chemical liquid 223 has been peeled off from the pair of rear tension rollers 244 ) And the recovery roll (260) through a cleaning and drying device (265); And h2) feeding the recovered carrier film (212) back to the supply roll (210).

The non-contact type chemical liquid film peeling method 300 according to an embodiment of the present invention may further include the steps of g3) removing the carrier film 212 from which the hardened chemical liquid 223 has been peeled off from the cleaning and drying apparatus 265 Feeding the recovered carrier film 212 from the collecting roll 260 to the supplying roll 210 while washing and drying the recovered carrier film 212. [

In the non-contact chemical film stripping method 300 according to an embodiment of the present invention, the inclined state of step d) may include d1) an upper front tension roll 242u of the pair of front tension rolls 242 The lower rear tension roll 244d of the pair of rear tension rolls 244 rises and contacts the lower portion of the carrier film 212, D2) the lower front tension roll 242d of the pair of front tension rolls 242 is raised so as to come into contact with the lower portion of the carrier film 212 , The upper rear tension roll 244u of the pair of rear tension rolls 244 is lowered and contacts the upper portion of the carrier film 212 so that the left side of the carrier film 212 can be maintained in a high inclined state have.

FIG. 3B is a view showing a flowchart of a substrate bonding method according to an embodiment of the present invention.

Referring to FIG. 3B, with reference to FIGS. 2A through 2H, a substrate bonding method 301 according to an embodiment of the present invention includes the steps of: a) forming a top surface of the upper substrate 230 by using a non-contact type chemical liquid film peeling apparatus 200 Attaching the chemical liquid 223 (step 311); b) Lowering the upper substrate 230 on which the hardened chemical solution 223 is attached onto a lower substrate 290 provided on the stage 280 by using a pick-up device 270 to form the lower substrate 290 (321) < / RTI > And c) curing the hardened chemical solution 223 between the upper substrate 230 and the lower substrate 290 by irradiating light on the upper substrate 230 using the hardening device 295, (Step 331) of attaching the upper substrate 230 and the lower substrate 290 to each other.

The method 301 for attaching a substrate according to an embodiment of the present invention may further comprise the steps of: b1) b1) between the step b) and the step c) (270) to its original position.

In addition, the step a) used in the substrate bonding method 301 according to an embodiment of the present invention may include: a1) a step of applying a1) a heat treatment to the carrier film 212 supplied from the supply roll 210 to the recovery roll 260 Applying a chemical liquid (222); a2) curing the drug solution (222) applied on the carrier film (212); a3) supplying the carrier film 212 coated with the hardened chemical solution 223 to a lower portion of the upper substrate 230; a4) While raising the adhering rolls 240 located at the lower portion of the upper substrate 230 to come in contact with the lower surface near one side edge of the hardened liquid medicament 223, Maintaining the carrier film 212 in an inclined state by using a pair of front tension rolls 242 and a pair of rear tension rolls 244, a5) The carrier roll film 240 is moved from the vicinity of the one edge to the edge of the other edge to attach the carrier liquid film 223 on the upper substrate 230, Peeling off the chemical liquid 223; And a6) transferring the carrier film (212) from which the hardened chemical liquid (223) has been peeled to the recovery roll (260) and recovering the recovered carrier film.

In addition, the substrate bonding method 301 according to an embodiment of the present invention may include: a7-1) feeding back the recovered carrier film 212 to the supply roll 210; And a8-1) further comprising the step of washing and drying the fed carrier film (212) through a cleaning and drying device (265) provided between the recovery roll (260) and the supply roll (210) do.

The method of attaching a substrate 301 according to an embodiment of the present invention as described above includes: a7-2) attaching the carrier film 212 on which the hardened chemical liquid 223 has been peeled to the pair of rear tension rollers 244 ) And the recovery roll (260) through a cleaning and drying device (265); And a8-2) feeding the recovered carrier film 212 back to the supply roll 210. [

The substrate bonding method 301 according to an embodiment of the present invention may include a7-3) feeding back the recovered carrier film 212 from the collecting roll 260 to the supplying roll 210, And washing and drying the carrier film 212 through the cleaning and drying device 265 provided separately from the carrier film 212 with the separated chemical liquid 223 separated therefrom.

In addition, in the substrate bonding method 301 according to an embodiment of the present invention, the inclined state of step a4) may be a4-1) the upper front tension roll 242u of the pair of front tension rolls 242 The lower rear tension roll 244d of the pair of rear tension rolls 244 rises and contacts the lower portion of the carrier film 212, Or the lower front tension roll 242d of the pair of front tension rolls 242 is brought into contact with the lower portion of the carrier film 212 The upper rear tension roll 244u of the pair of rear tension rolls 244 is lowered to come into contact with the upper portion of the carrier film 212 so that the left side of the carrier film 212 is in a high inclined state .

Various modifications may be made by those skilled in the art without departing from the spirit and scope of the invention as defined by the following claims. It is not. Accordingly, the scope of the present invention should not be limited by the above-described exemplary embodiments, but should be determined only in accordance with the following claims and their equivalents.

100: contact type chemical liquid film peeling apparatus 101,201: substrate laminating apparatus
110, 210: supply rolls 112, 212: carrier film 112, 212:
120, 220: application device 130, 230: upper substrate 140, 240:
142, 242: front tension rolls 144, 244: rear tension roll 150:
160, 260: recovery rolls 170, 270: pick-up member 180, 280:
190, 290: Lower substrate 195, 295: Curing device 223:
225: a hardening device 242u: an upper front tension roll 242d: a lower front tension roll
243u: upper rear tension roll 244d: lower rear tension roll 265: cleaning and drying device

Claims (21)

A non-contact type chemical liquid film peeling apparatus comprising:
A supply roll for supplying a carrier film;
A coating device provided on the carrier film and applying a chemical solution on the carrier film;
A hardening device provided behind the applying device for hardening the chemical solution;
The upper surface of the upper substrate provided on the rear side of the hardening device and being movable in a horizontal direction in contact with the lower surface of the carrier film to adhere the hardened liquid to the upper substrate, ;
A pair of front tension rolls and a pair of rear tension rolls respectively provided to maintain the carrier film in an inclined state in front of and behind the upper substrate;
A recovery roll for recovering the carrier film from which the hardened chemical solution has been separated; And
A cleaning and drying device provided between the collection roll and the supply roll for cleaning and drying the carrier film fed back from the collection roll to the supply roll,
Wherein the non-contact type chemical liquid film peeling apparatus comprises: The method according to claim 1,
Wherein the adhering roll is in contact with a lower surface in the vicinity of a right edge of the hardened drug solution,
An upper front tension roll of the pair of front tension rolls is lowered to be in contact with an upper portion of the carrier film and a lower rear tension roll of the pair of rear tension rolls contacts and contacts with a lower portion of the carrier film,
The carrier film maintains the inclined state in a state where the contact position of the lower rear tension roll is higher than the contact position of the upper front tension roll
Noncontact chemical film stripping device. The method according to claim 1,
The adhesion roll is in contact with the lower surface in the vicinity of the left edge of the hardened chemical solution,
Wherein a lower front tension roll of the pair of front tension rolls is raised in contact with a lower portion of the carrier film and an upper rear tension roll of the pair of rear tension rolls is lowered to contact an upper portion of the carrier film,
Wherein the carrier film maintains the inclined state with the contact position of the lower front tension roll being higher than the contact position of the upper rear tension roll
Noncontact chemical film stripping device. 4. The method according to any one of claims 1 to 3,
Wherein the cleaning and drying apparatus is provided between the pair of rear tension rolls and the collection roll. 4. The method according to any one of claims 1 to 3,
Wherein the cleaning and drying device is provided separately and is cleaned and dried while passing through the separately provided cleaning and drying device while the carrier film is being fed back from the recovery roll to the supply roll. In the laminating apparatus,
A non-contact type chemical liquid film peeling device for attaching the upper substrate and the lower substrate to each other;
A stage on which the lower substrate is mounted;
Up device for transferring and lowering the upper substrate onto the lower substrate; And
A curing device provided movably on the upper substrate, the curing device comprising:
And a substrate holder. The method according to claim 6,
The non-contact type chemical liquid film peeling apparatus
A supply roll for supplying a carrier film;
A coating device provided on the carrier film and applying a chemical solution on the carrier film;
A hardening device provided behind the applying device for hardening the chemical solution;
And an upper plate provided on a lower portion of the upper substrate provided at a rear side of the temporary hardening device and movable in a horizontal direction in contact with a lower surface of the carrier film to attach the hardened liquid to the upper substrate, role;
A pair of front tension rolls and a pair of rear tension rolls respectively provided to maintain the carrier film in an inclined state in front of and behind the upper substrate;
A recovery roll for recovering the carrier film from which the hardened chemical solution has been separated; And
A cleaning and drying device provided between the collection roll and the supply roll for cleaning and drying the carrier film fed back from the collection roll to the supply roll,
And a substrate holder. 8. The method of claim 7,
Wherein the adhering roll is in contact with a lower surface in the vicinity of a right edge of the hardened drug solution,
An upper front tension roll of the pair of front tension rolls is lowered to be in contact with an upper portion of the carrier film and a lower rear tension roll of the pair of rear tension rolls contacts and contacts with a lower portion of the carrier film,
The carrier film maintains the inclined state in a state where the contact position of the lower rear tension roll is higher than the contact position of the upper front tension roll
/ RTI > 8. The method of claim 7,
The adhesion roll is in contact with the lower surface in the vicinity of the left edge of the hardened chemical solution,
Wherein a lower front tension roll of the pair of front tension rolls is raised in contact with a lower portion of the carrier film and an upper rear tension roll of the pair of rear tension rolls is lowered to contact an upper portion of the carrier film,
Wherein the carrier film maintains the inclined state with the contact position of the lower front tension roll being higher than the contact position of the upper rear tension roll
/ RTI > 10. The method according to any one of claims 7 to 9,
Wherein the cleaning and drying device is provided between the pair of rear tension rolls and the recovery roll. 10. The method according to any one of claims 7 to 9,
Wherein the cleaning and drying device is provided separately and is cleaned and dried while passing through the separately provided cleaning and drying device while the carrier film is being fed back from the recovery roll to the supply roll. In the noncontact chemical film stripping method,
a) applying a chemical liquid onto a carrier film fed from a supply roll to a recovery roll;
b) curing the drug solution applied on the carrier film;
c) supplying the carrier film coated with the hardened chemical solution to a lower portion of the upper substrate;
d) a pair of front tension rolls provided on the front and rear sides of the upper substrate, respectively, while raising the adhering roll located at the lower portion of the upper substrate to come in contact with the lower surface near one edge of the adhering liquid, Maintaining the carrier film in an inclined state using a pair of rear tension rolls;
e) peeling the carrier film from the hardened chemical solution while moving the adhering roll near the one edge to the other edge to adhere the hardened drug solution onto the upper substrate; And
f) moving the carrier film from which the hardened chemical solution has been peeled to the recovery roll to recover
Wherein the non-contact type chemical liquid film is peeled off. 13. The method of claim 12,
The non-contact type chemical liquid film peeling method
g1) feeding the recovered carrier film to the supply roll; And
h1) washing and drying the carrier film fed through the cleaning and drying device provided between the recovery roll and the supply roll
Wherein the non-contact type chemical liquid film peeling method further comprises: 13. The method of claim 12,
The non-contact type chemical liquid film peeling method
g2) washing and drying the carrier film through which the hardened chemical solution has been peeled through a pair of rear tension rolls and a cleaning and drying device provided between the recovery rolls; And
h2) feeding back the recovered carrier film to the supply roll
Wherein the non-contact type chemical liquid film peeling method further comprises: 13. The method of claim 12,
The non-contact type chemical liquid film peeling method comprises the steps of: g3) feeding the recovered carrier film from the recovery roll to the supply roll while washing and drying the separated carrier film by passing the separated carrier film through a separately provided cleaning and drying device Further comprising the step of removing the non-contact type chemical liquid film. In the method for bonding a substrate,
a) attaching a hardened chemical liquid to an upper substrate using a non-contact type chemical liquid film peeling apparatus;
b) lowering the upper substrate on which the hardened chemical liquid is adhered onto a lower substrate provided on a stage using a pickup device, and positioning the upper substrate in alignment with the lower substrate; And
c) curing the hardened chemical solution between the upper substrate and the lower substrate by irradiating light on the upper substrate using a hardening device to adhere the upper substrate and the lower substrate
≪ / RTI > 17. The method of claim 16,
The method of substrate bonding further comprises b1) transferring the pick-up apparatus to its original position for picking up a subsequent upper substrate of the non-contact chemical film peeling apparatus between steps b) and c) . 17. The method of claim 16,
The step a)
a1) applying a chemical liquid onto a carrier film fed from a supply roll to a recovery roll;
a2) curing the drug solution applied on the carrier film;
a3) supplying the carrier film coated with the hardened chemical solution to a lower portion of the upper substrate;
a4) a pair of front tension rolls provided on the front and rear sides of the upper substrate, respectively, while raising the adhering roll located at the lower portion of the upper substrate to come in contact with the lower surface in the vicinity of one edge of the adhered chemical solution; Maintaining the carrier film in an inclined state using a pair of rear tension rolls;
a5) removing the carrier film from the hardened chemical solution while moving the adhering roll near the one edge and the other edge to attach the hardened drug solution onto the upper substrate; And
a6) moving the carrier film from which the hardened chemical solution has been peeled to the recovery roll and recovering
≪ / RTI > 19. The method of claim 18,
The substrate bonding method
a7-1) feeding the recovered carrier film to the supply roll; And
a8-1) washing and drying the carrier film fed back through a washing and drying device provided between the collection roll and the supply roll
≪ / RTI > 19. The method of claim 18,
The substrate bonding method
a7-2) cleaning and drying the carrier film by passing the carrier film on which the hardened chemical solution has been peeled, through a cleaning and drying apparatus provided between the pair of rear tension rolls and the recovery roll; And
a8-2) feeding back the recovered carrier film to the supply roll
≪ / RTI > 19. The method of claim 18,
The method of the present invention is characterized in that the method comprises the steps of: a7-3) feeding the recovered carrier film from the recovery roll to the supply roll while washing and drying the separated carrier film through the separately provided cleaning and drying device ≪ / RTI >
KR1020150170022A 2015-12-01 2015-12-01 Non-Contact Type Peeling Apparatus and Method of Chemical Liquid Film, and Apparatus and Method of Bonding Substrates Having the Same KR101774219B1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001338442A (en) 2000-05-25 2001-12-07 Sony Corp Method and device for manufacturing optical recording medium
JP2012088623A (en) 2010-10-21 2012-05-10 Nitto Denko Corp System and method for continuously manufacturing liquid crystal display element
KR101539287B1 (en) 2015-04-08 2015-07-24 세광테크 주식회사 Substrate Attaching Apparatus for Touch Pannel
KR101547899B1 (en) * 2015-04-10 2015-08-27 세광테크 주식회사 System and Method of Laminating Substrate for Touch Pannel

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001338442A (en) 2000-05-25 2001-12-07 Sony Corp Method and device for manufacturing optical recording medium
JP2012088623A (en) 2010-10-21 2012-05-10 Nitto Denko Corp System and method for continuously manufacturing liquid crystal display element
KR101539287B1 (en) 2015-04-08 2015-07-24 세광테크 주식회사 Substrate Attaching Apparatus for Touch Pannel
KR101547899B1 (en) * 2015-04-10 2015-08-27 세광테크 주식회사 System and Method of Laminating Substrate for Touch Pannel

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