KR101772445B1 - Method of cutting substrate - Google Patents

Abstract

A method of cutting a substrate capable of efficiently cutting a part of an upper substrate of a liquid crystal display panel and capable of automating the process. A cutting groove is formed in the boundary line dividing the first region and the second region in the upper substrate of the display panel in which the upper substrate and the lower substrate are coupled. Adhering means having adhesive force is attached to the upper portion of the second region of the upper substrate. Then, the second region of the upper substrate may be removed from the display panel together with the adhesive means to cut a part of the upper substrate.

Description

[0001] METHOD OF CUTTING SUBSTRATE [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of cutting a substrate, and more particularly, to a method of cutting a part of an upper substrate of a display panel.

In general, a liquid crystal display device includes a liquid crystal display panel for displaying an image and a backlight assembly for supplying light to the liquid crystal display panel. The liquid crystal display panel includes a thin film transistor substrate, a counter substrate, and a liquid crystal layer interposed therebetween. The display substrate may be divided into a display region including a pixel electrode and a non-display region where a driver for driving the liquid crystal display panel is formed.

The driving unit formed in the non-display area is connected to a driving IC for driving the liquid crystal display panel or an FPCB for supplying a driving signal to an IC formed directly on the substrate. Therefore, in the non-display area, a part of the counter substrate is cut off to expose the pad of the driver. Generally, techniques for cutting a substrate include scribing using a diamond wheel, cutting using a laser, or manual cutting using a bamboo rod.

BACKGROUND ART [0002] In recent years, a display device such as a notebook computer or a mobile phone has been required to be lightweight and miniaturized, so that a plastic substrate is used as a substrate of a liquid crystal display panel. However, in the case of a plastic substrate, scribing with a diamond wheel causes whitening of the substrate, and when cutting with a laser, the cutting thickness is adjusted Uneasy. In addition, manual cutting using bamboo rods is inefficient and manpower is consumed and automation is difficult.

Accordingly, it is an object of the present invention to provide a method of cutting a substrate, which can efficiently cut a part of an upper substrate of a liquid crystal display panel, and can automate the process.

According to an embodiment of the present invention, a cut groove is formed in a boundary line dividing a first region and a second region in the upper substrate of a display panel in which an upper substrate and a lower substrate are coupled. Adhering means having adhesive force is attached to the upper portion of the second region of the upper substrate. Then, the second region of the upper substrate is removed from the display panel together with the adhesive means, and a part of the upper substrate is cut.

In an embodiment of the present invention, the upper substrate may include at least one selected from the group consisting of fiber reinforced plastic, acrylic, and polycarbonate.

In one embodiment of the present invention, the adhesive means may comprise an adhesive tape.

In one embodiment of the present invention, the adhesive tape may have an adhesive strength of 700 g / 25 mm or more.

In one embodiment of the present invention, the adhesive means may have the shape of a roller.

In an embodiment of the present invention, the second region of the upper substrate may be removed by moving the adhesive means from one side of the upper substrate to the other side.

In an embodiment of the present invention, the second region of the upper substrate may be moved by removing the adhesive in a direction forming a predetermined angle inclined to the direction of extension of the cut groove.

In one embodiment of the present invention, the cut groove of the upper substrate may be formed using a cutter.

In one embodiment of the present invention, in the step of forming the cut grooves in the upper substrate, heat may be provided to a region adjacent to the boundary line.

In an embodiment of the present invention, the cutting groove of the upper substrate may be formed by irradiating the boundary line with a laser.

According to another aspect of the present invention, the upper substrate of the display panel having the upper substrate and the lower substrate coupled to each other has a boundary line dividing the first region and the second region. And adhering means having adhesion is attached to the upper portion of the second region of the upper substrate. The second region is bent upward in the upper substrate together with the adhesive means so that the lower substrate below the second region of the upper substrate is exposed. A cut protection layer is formed in a region between the upper substrate and the lower substrate overlapping the boundary line of the upper substrate. Then, a boundary line of the upper substrate is cut to cut a part of the upper substrate.

In one embodiment of the present invention, the upper substrate may be formed of any one selected from the group consisting of plastic, acrylic, and polycarbonate.

In one embodiment of the present invention, the adhesive means may comprise an adhesive tape.

In one embodiment of the present invention, the adhesive tape may have an adhesive strength of 700 g / 25 mm or more.

In one embodiment of the present invention, the adhesive means may have the shape of a roller.

In one embodiment of the present invention, the boundary line of the upper substrate may be cut by irradiating the boundary line with a laser.

In one embodiment of the present invention, the cut protection layer may be an insulating material including at least one selected from the group consisting of a metal film, fiber reinforced plastics, and polyimide.

In one embodiment of the present invention, the thickness of the cut protection layer may be 100 micrometers or less.

According to the present invention described above, a part of the upper substrate of the display panel can be efficiently cut by cutting a part of the upper substrate of the display panel using the adhesive means having adhesive force.

In addition, only a part of the upper substrate can be efficiently cut without damaging the lower substrate by inserting the cut protective layer by lifting only a part of the upper substrate by using the adhesive means having adhesive force.

1 is an exploded perspective view schematically illustrating a display panel to explain a method of cutting a substrate according to an embodiment of the present invention.
2 is a flowchart illustrating a method of cutting a substrate according to an embodiment of the present invention.
Figs. 3A to 3E are perspective views sequentially illustrating the method of cutting the substrate of Fig.
4A to 4C are perspective views illustrating a method of cutting a substrate according to another embodiment of the present invention.
5 is a flowchart illustrating a method of cutting a substrate according to another embodiment of the present invention.
Figs. 6A to 6E are perspective views sequentially illustrating the method of cutting the substrate of Fig. 5; Fig.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in more detail with reference to the accompanying drawings.

1 is an exploded perspective view schematically illustrating a display panel to explain a method of cutting a substrate according to an embodiment of the present invention.

Referring to FIG. 1, the display panel 100 includes an upper substrate 200 and a lower substrate 300 facing each other, and a liquid crystal layer (not shown) interposed therebetween. The lower substrate 300 is divided into a display region 310 in which a liquid crystal layer is formed to display an image and non-display regions 320 and 330 corresponding to a peripheral region of the display region. A seal liner 340 is formed around the liquid crystal layer formed in the display area 310 to seal the liquid crystal layer, and stably attach and fix the upper substrate and the lower substrate. For example, a data pad 320 for providing a data signal and a power supply voltage for displaying an image is formed on one side of the non-display area, and a gate signal And a gate pad portion 330 for providing a common voltage are formed. A driving integrated circuit is formed on the data pad portion and / or the gate pad portion, and a flexible printed circuit is attached to the driving integrated circuit and connected to an external driving portion (not shown). In this embodiment, a portion corresponding to the non-display region in the display panel is exemplified as two sides of the display panel. However, in a general display panel, the non-display region may be formed in a peripheral region of the display region.

In order to mount the driving integrated circuit in the data pad portion and the gate pad portion as described above, the region where the upper substrate overlaps with the data pad portion 320 and the gate pad portion 330 should be opened. Accordingly, a part of the upper substrate overlapping the data pad unit 320 and the gate pad unit 330 must be cut. Hereinafter, a method of cutting a substrate for cutting a part of an upper substrate according to the present embodiment will be described.

In this embodiment, a cutting method will be described with reference to a region formed on one side of the display panel for convenience. Accordingly, the method of cutting the substrate according to the present embodiment can be similarly applied to the region formed on the other side of the display panel.

2 is a flowchart illustrating a method of cutting a substrate according to an embodiment of the present invention. Figs. 3A to 3E are perspective views sequentially illustrating the method of cutting the substrate of Fig.

Referring to FIGS. 1, 2, and 3B, a cut groove 230 is formed in a boundary line dividing the first region 210 and the second region 220 from the upper substrate 200 of the display panel 100 (S100). The first area 210 corresponds to the display area, and the second area 220 corresponds to the area to be removed. In order for the drive integrated circuit to be mounted on the lower substrate 300 that overlaps the second region, the second region 220 of the upper substrate must be removed.

The upper substrate 200 and the lower substrate 300 of the display panel 100 are formed of a plastic material. Preferably, it may be formed of fiber reinforced plastic (FRP), acrylic or polycarbonate.

The cutting groove 230 is formed by using a cutter 400. The cutting groove 230 having a predetermined depth extending in one direction can be formed by moving the cutter while applying a constant force from one side to the other along a boundary line dividing the first region and the second region. When a force is applied to the second region 220, the shear stress concentrates to the left and right of the cutting groove, thereby causing the cutting groove to crack in the vertical direction of the upper substrate. As a result, The second region is separated from the display panel. In the present embodiment, the cutter 400 is described as an example, but the present invention is not limited thereto. For example, the cutting groove 230 may be formed by irradiating a laser beam.

When the cutter 400 is used to form the cutting groove 230, the cutter or the boundary line area may be additionally provided with heat. When the heat is provided, the activity of molecules in the boundary line region of the upper substrate made of plastic can be activated, making it easier to cut and make the cut surface smoother.

Referring to FIGS. 2 and 3B, the adhesive means 500 having an adhesive force is adhered to the upper portion of the second region 220 of the upper substrate (S110). The adhesive means may be attached to or detached from the upper substrate with a predetermined adhesive strength, and may include, for example, an adhesive tape.

The adhesive means 500 may have the shape of a roller. When the sticking means has the shape of a roller, it is easily moved in a state of being attached to the upper substrate, and the sticking and detaching can be facilitated. In addition, the operation of replacing the adhesive tape for maintenance of adhesive strength can be easily performed. As a result, the adhering means has the shape of the roller, so that it can be adhered to and detached from the upper substrate with a constant adhering force, and removal of a part of the upper substrate can be effective and facilitated. In the present embodiment, the adhesive means has the shape of a roller, but the shape of the adhesive means is not limited thereto. The shape of the adhesive means may be appropriately changed so as to easily adhere to the upper substrate of the display panel. For example, the shape of the adhesive means may be a rectangular plate shape.

One or more adhesive units 500 may be provided. This can be selected in an appropriate range so that the necessary adhesion force to the substrate can act depending on the size and material of the substrate.

The adhesive tape must have a certain adhesion strength to remove a portion of the upper substrate of the display panel. For example, in order to cut a part of a substrate made of a general plastic material, it should have an adhesive force of about 700 g / 25 mm or more.

Referring to FIGS. 2, 3C and 3D, the second region 220 of the upper substrate is lifted by the adhesive means (S120). Accordingly, the second region is refracted so as to form a predetermined angle with the display panel, and is cut along the cut groove (230). In general, when the angle formed by the second area and the display panel is 50 degrees or more, cutting can be easily performed.

The step of removing the second region 220 of the upper substrate may be performed by moving the adhesive means from one side of the upper substrate to the other side along the cut groove. This is because when the upper substrate is formed of a fiber-reinforced plastic material, the second region is not easily cut off due to a certain angle with the display panel, so that the separation of the second region is performed more efficiently . That is, by continuously refracting the second region from one side of the upper substrate to the other side, the shear stress can be concentrated in the cut groove 230 and cut continuously. Alternatively, the entire second region of the upper substrate may be refracted and cut together according to the material properties of the upper substrate.

2 and 3E, the second region of the upper substrate is separated from the display panel by the cutting process. Therefore, the driving pad region of the lower substrate overlapping the second region is opened, and the driving integrated circuit can be mounted on the pad region in the subsequent process. Methods for mounting the driving integrated circuit on a display panel include TAB (Tape Automated Bonding), COB (Chip On Board), and COG (Chip On Glass). And then connected to a driving module (not shown) by attaching a PCB (Printed Circuit Board).

In the past, in the process of cutting only a part of the plastic upper substrate in the display panel, after cutting grooves are formed in the upper substrate, a tool such as a bamboo rod is inserted between the upper substrate and the lower substrate, . However, according to the present embodiment, after cutting grooves 230 are formed in the boundary line of the upper substrate, the second region 220 is easily cut by using the adhesive means 500 having adhesive force, Some can be removed. In addition, automation is possible and can be replaced by mass production process.

4A to 4C are perspective views illustrating a method of cutting a substrate according to another embodiment of the present invention. In this embodiment, in the step of removing the second area of the upper substrate, the adhesive is moved in a direction forming a predetermined angle inclined to the direction of extension of the cut groove. In this case, And therefore, the same reference numerals are used, and redundant descriptions are omitted.

Referring to FIGS. 1, 2 and 4A to 4C, the adhesive means 500 having adhesive force is adhered to the upper portion of the second region 220 of the upper substrate. The second region 220 of the upper substrate is lifted by the adhesive means and the second region is refracted so as to form a certain angle with the display panel so as to be cut along the cut groove 230.

The step of removing the second region 220 of the upper substrate may be performed by moving the adhesive means 500 from one side of the upper substrate to the other side along the cut groove 230. At this time, the adhesive means moves toward the first region 210 in a direction forming a constant angle, not parallel to the extending direction of the cut groove. As described above, when the adhesive means moves at a predetermined angle with the cutting groove, the shearing stress formed in the cutting groove can be maximized.

Generally, when a substrate is formed of a fiber-reinforced plastic, it is split around the cut groove in the cutting process. Therefore, it is necessary to maximize the shearing stress formed in the cut groove. As in the present embodiment, by moving the adhesive means at a predetermined angle with the direction of extension of the cutting grooves, the shearing stress formed in the cutting grooves can be maximized and the substrate can be efficiently cut.

5 is a flowchart illustrating a method of cutting a substrate according to another embodiment of the present invention. Figs. 6A to 6E are perspective views sequentially illustrating the method of cutting the substrate of Fig. 5; Fig. The display panel according to the present embodiment is the same as the display panel described with reference to Fig. 1, and thus the same reference numerals are used, and redundant explanations thereof are omitted.

Referring to FIGS. 1, 5 and 6A, the adhesive means 500 having an adhesive force is adhered to the upper portion of the second region 220 of the upper substrate 200 of the display panel 100 (S200). The adhesive means according to the present embodiment is the same as the adhesive means described with reference to Figs. 2 to 3E, and therefore the same reference numerals are used, and redundant description thereof is omitted.

One or more adhesive units 500 may be provided. In this embodiment, a plurality of the second regions 220 of the upper substrate 220 are required to be lifted and bent at a time.

Referring to FIGS. 5 and 6B, the second region together with the adhesive means 500 is lifted upward in the upper substrate (S210). In this case, since the cutout groove is not formed in the boundary line dividing the first region and the second region of the upper substrate, the second region of the upper substrate is bent not only in the upward direction but also in the upper direction.

The second region of the upper substrate is lifted and bent such that a region between the upper substrate and the lower substrate is completely exposed to the side so that the distance between the second region and the lower substrate is increased, .

Referring to FIGS. 5 and 6C, a cut protection layer 600 is formed between the upper substrate and the lower substrate overlapping the boundary line of the upper substrate (S220). The cut protection layer 600 is formed of an insulating material and may be formed of, for example, a metal film, fiber reinforced plastics, or polyimide.

The cut protection layer 600 is formed on the lower end of the upper substrate in a state in which the second region of the upper substrate is lifted. The cut protection layer may be formed directly on the lower end of the upper substrate, or may be separately formed and inserted.

The thickness of the cut protection layer 600 should be smaller than the width between the upper substrate and the lower substrate of the display panel. Since the circuit patterns are formed on the lower substrate, they may be affected by the cut protection layer. Therefore, the cut protection layer must have a thickness that does not affect the peripheral circuit layer, and preferably should be 100 micrometers or less.

In order to form a cut protection layer between the upper substrate and the lower substrate, only the second region of the upper substrate has to be lifted. According to this embodiment, the second region is lifted up and bent by using an adhesive means having adhesive force , It is possible to easily perform the formation work of such a cut protective layer without damaging the substrate.

Referring to FIGS. 5 and 6D, after the cut protection layer 600 is formed, the boundary line of the upper substrate is cut off (S230). The boundary line of the upper substrate is irradiated with laser from the laser irradiating unit 700 to cut it.

A laser is irradiated from one side to the other side along the boundary line of the upper substrate to cut the entire upper substrate. In order to cut the entire upper substrate, it is necessary to precisely adjust the laser so that the laser cuts only the upper substrate and does not affect the lower substrate, which is practically very difficult. Therefore, the cut protection layer 600 is formed at the lower end of the boundary line so that the laser does not reach the lower substrate 300. Since the cut protection layer is formed of an insulating material, circuits formed on the lower substrate and the lower substrate can be protected from the laser within a certain level.

When the irradiation of the laser is completed, the second region of the upper substrate is cut off naturally from the display panel and separated.

5 and 6E, the second region of the upper substrate is separated from the display panel by the cutting process. Therefore, the driving pad region of the lower substrate overlapping the second region is opened, and the driving integrated circuit can be mounted on the pad region in the subsequent process. And then connected to a driving module (not shown) by attaching a PCB (Printed Circuit Board).

In order to cut the second region of the upper substrate using a laser as described above, it is necessary to form a cut protection layer between the upper substrate and the lower substrate. In order to form the cut-off protective layer, the second region of the upper substrate must be lifted up to an upper portion without damaging or otherwise affecting the substrate. According to this embodiment, by forming the second region upwards by bending by using the adhesive means having adhesive force, it is possible to easily perform the formation work of the cut protective layer without damaging the substrate. Further, the cutting operation of the substrate can be easily performed, and the entire process can be automated.

As described above, according to the embodiment of the present invention, a cutting groove is formed on the upper substrate, and the cutting is performed using the adhesive means having adhesive force, so that a part of the upper substrate can be cut more efficiently and easily , It becomes possible to automate the cutting process.

In addition, only the upper substrate can be efficiently cut by lifting only a part of the upper substrate and inserting the cut protective layer using the adhesive means having adhesive force, without damaging the lower substrate.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. You will understand.

100: display panel 200: upper substrate
210: first region 220: second region
230: Cutting groove 300: Lower substrate
310: display area 320: data pad part
330: gate pad portion 340: seal line
400: cutter 500: adhesive means
600: cutting protection layer 700: laser irradiation part

Claims (18)

delete delete delete delete delete delete delete delete delete delete The upper substrate of the display panel having the upper substrate and the lower substrate coupled to each other has a boundary line dividing the first region and the second region and attaching adhesive means to an upper portion of the second region of the upper substrate;
Bending the second region upwardly of the upper substrate together with the adhering means such that the lower substrate below the second region of the upper substrate is exposed;
Forming a cut protection layer in a region between the upper substrate and the lower substrate overlapping the boundary line of the upper substrate; And
And cutting the boundary line of the upper substrate. The method of claim 11, wherein the upper substrate comprises at least one selected from the group consisting of fiber-reinforced plastic, acrylic, and polycarbonate. The method of cutting a substrate according to claim 11, wherein the adhesive means comprises an adhesive tape. The method of cutting a substrate according to claim 13, wherein the adhesive tape has an adhesive force of 700 g / 25 mm or more. The method of cutting a substrate according to claim 11, wherein the adhesive means has a shape of a roller. The method of cutting a substrate according to claim 11, wherein the boundary line of the upper substrate is cut by irradiating the boundary line with a laser. 17. The method of claim 16, wherein the cut protection layer is an insulating material comprising at least one selected from the group consisting of a metal film, fiber reinforced plastics, and polyimide. Cutting method. The method of cutting a substrate according to claim 11, wherein the cut protection layer has a thickness of 100 micrometers or less.

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