KR101771806B1

KR101771806B1 - Wireless power charging device

Info

Publication number: KR101771806B1
Application number: KR1020150142029A
Authority: KR
Inventors: 장재혁; 이현정; 송영환
Original assignee: 삼성전기주식회사
Priority date: 2015-08-06
Filing date: 2015-10-12
Publication date: 2017-08-25
Also published as: KR20170017674A

Abstract

An embodiment of the present invention provides an electromagnetic wave shielding sheet and a coil portion, wherein the coil portion has a radiating layer disposed on the electromagnetic shielding sheet side.

Description

A wireless power charging device

The present invention relates to a wireless charging device.

2. Description of the Related Art A non-contact type, that is, a wireless charging method that charges a battery using magnetic coupling without electrical contact has been attracting attention as electronic appliances become light in weight due to miniaturization and weight reduction of electronic appliances.

The wireless charging method is a method of charging by using electromagnetic induction. In this method, a primary coil (transmitting portion coil) is provided in a charger (wireless power transmitting device) and a secondary coil (receiving portion coil) is provided in a charging target (wireless power receiving device) And the current generated by inductive coupling between the primary coil and the secondary coil is converted into energy to charge the battery.

At this time, an electromagnetic wave shielding sheet is disposed between the receiver coil and the battery. The shielding sheet shields the magnetic field generated from the receiving coil from reaching the battery and efficiently transmits the electromagnetic wave generated from the wireless power transmission device to the wireless power receiving device.

When such an electromagnetic shielding sheet is used for wireless charging, power of several to several tens of watts may be continuously transmitted, resulting in loss of materials and circuits, resulting in a large amount of heat. Therefore, in the related art, researches on a method of efficiently discharging heat generated from the electromagnetic wave shielding sheet or its surroundings have been actively studied.

An object of the present invention is to provide a wireless charging device which is excellent in heat radiation performance and is advantageous in miniaturization.

In order to solve the above-mentioned problems, the present invention proposes a novel structure of a wireless charging device that has excellent heat dissipation performance and size efficiency through an embodiment. More specifically, the present invention proposes a novel structure of a wireless charging device including an electromagnetic wave shielding sheet and a coil portion, The coil portion is in the form of a heat dissipation layer disposed on the electromagnetic wave shielding sheet side.

In this case, the heat dissipation layer may include graphene having a high thermal conductivity, and the heat dissipation efficiency may be improved by being formed directly on the surface of a coil pattern or the like, not by an adhesive or the like.

In the case of the wireless charging apparatus proposed in one embodiment of the present invention, the heat dissipation characteristics can be remarkably improved by applying the heat dissipation layer between the coil portion and the electromagnetic shielding sheet, which is advantageous for improving the reliability of the electronic apparatus using the same. Further, by directly coating such a heat-radiating layer with a cover, a coil pattern, an electromagnetic wave shielding sheet, etc., heat radiation performance can be further improved and the size of the wireless charging device can be reduced.

1 is an external perspective view of a typical wireless charging system.
FIG. 2 is a cross-sectional view of the main internal structure of FIG. 1; FIG.
3 is a cross-sectional view schematically showing a configuration of a coil portion and an electromagnetic wave shielding sheet which can be employed in an embodiment of the present invention.
Fig. 4 is a modification of Fig.
5 and 6 are cross-sectional views schematically showing configurations of a coil portion and an electromagnetic wave shielding sheet which can be employed in another embodiment of the present invention.
7 is a cross-sectional view schematically showing a part of a manufacturing process of a wireless charging device that can be employed in an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Further, the embodiments of the present invention are provided for a more complete description of the present invention to the ordinary artisan. Accordingly, the shapes and sizes of the elements in the drawings may be exaggerated for clarity of description, and the elements denoted by the same reference numerals in the drawings are the same elements.

It is to be understood that, although the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, Will be described using the symbols. Further, throughout the specification, when an element is referred to as "including" an element, it means that the element may include other elements as well, without departing from the other elements unless specifically stated otherwise.

FIG. 1 is an external perspective view schematically showing a general wireless charging system, and FIG. 2 is a cross-sectional view explaining a main internal configuration of FIG.

1 and 2, a typical wireless charging system may include an electronic device wireless power transmission device 10 and a wireless power receiving device 20, and the wireless power receiving device 20 may be a cellular phone, a notebook, And may be included in the electronic device 30 such as a PC.

In the inside of the wireless power transmission apparatus 10, a transmission coil 11 is formed on a substrate 12, and a magnetic field is formed around the wireless power transmission apparatus 10 when an AC voltage is applied thereto. Accordingly, the battery 22 can be charged by the electromotive force induced from the transmitter coil 11 in the receiver coil 21 built in the wireless power receiving apparatus 20. [

The battery 22 may be a nickel-metal hydride battery or a lithium ion battery capable of charging and discharging, but is not limited thereto. The battery 22 may be configured separately from the wireless power receiving apparatus 20 and may be configured to be detachable to or from the wireless power receiving apparatus 20 or the battery 22 and the wireless power receiving apparatus 20 Or may be integrally formed as one body.

The transmitter coil 11 and the receiver coil 21 are electromagnetically coupled and can be formed by winding a metal wire such as copper. In this case, the winding shape can be circular, elliptical, quadrangular, rhombic, etc., and the overall size, number of turns, etc. can be appropriately controlled and set according to required characteristics.

An electromagnetic wave shielding sheet 100 is disposed between the receiver coil 21 and the battery 22 and the electromagnetic wave shielding sheet 100 is positioned between the receiver coil 21 and the battery 22 to efficiently focus the magnetic flux, So that it can be received by the coil 21 side. At the same time, the electromagnetic shielding sheet 100 functions to prevent at least a part of the magnetic flux from reaching the battery 22.

The electromagnetic wave shielding sheet 100 may be combined with a coil part and applied to a receiver of the wireless charging device. In addition to the wireless charging device, the coil portion may be used for magnetic security transmission (MST), short-range wireless communication (NFC), and the like. Further, the electromagnetic wave shielding sheet 100 may be applied to a transmitting section other than the receiving section of the wireless charging apparatus. Hereinafter, both the transmitting section and the receiving section coil will be referred to as a coil section.

The configuration of the coil portion and the electromagnetic wave shielding sheet included in the receiver will be described in detail with reference to FIG. 3. As described above, such a configuration may also be employed in the transmitter. 3, the wireless charging device includes an electromagnetic wave shielding sheet 100 and a coil portion 21, wherein the coil portion 21 is formed of a heat dissipation layer 101 disposed on the electromagnetic wave shielding sheet 100 side ).

The electromagnetic wave shielding sheet 100 that functions as a focusing and shielding electromagnetic wave may use a thin metal ribbon made of an amorphous alloy, a nano-crystal alloy, or the like. In this case, an Fe-based or Co-based magnetic alloy can be used as the amorphous alloy. The Fe-based magnetic alloy may use a material including Si, for example, an Fe-Si-B alloy. The higher the content of Fe and other metals, the higher the saturation magnetic flux density. However, if the Fe content is excessive Since it is difficult to form amorphous material, the content of Fe may be 70-90 atomic%, and in terms of amorphous formability, the sum of Si and B is most preferably in the range of 10-30 atomic%. In order to prevent corrosion in such a basic composition, corrosion resistance elements such as Cr and Co may be added in an amount of 20 atomic% or less, and a small amount of other metal elements may be added as needed to impart different properties.

Next, when using a nanocrystalline alloy, for example, an Fe-based nano-crystal magnetic alloy can be used. The Fe-based nano-crystal alloy can be Fe-Si-B-Cu-Nb alloy.

On the other hand, the electromagnetic wave shielding sheet 100 may be provided in an integrated form, but it may have a structure that is broken into a plurality of pieces. Since such a breaking structure can provide electrical insulation between a plurality of pieces, 100, which can occur in the case where the voltage is applied to the electrodes.

Further, the electromagnetic wave shielding sheet 100 may be provided in a laminated form of a plurality of magnetic layers according to required shielding performance, size and design of an employed electronic device, and a plurality of magnetic layers may be bonded by an adhesive layer such as a double- .

Next, the configuration of the coil portion 21 will be described. The coil portion 21 includes an upper cover 106 and a lower cover 104, and a coil pattern 105 is disposed therebetween. In this embodiment, the upper cover 106 and the lower cover 104 may be made of a material such as polyimide or the like, and may form a flexible circuit board (FPCB) structure together with the coil pattern 105. However, the upper cover 106 and the lower cover 104 are not essential elements in the present invention, and any suitable element may be employed as long as it is an element that can protect the coil pattern 105. The upper cover 106 and the lower cover 104 may be integrally formed.

The heat dissipation layer 101 is provided to efficiently radiate heat generated in the coil pattern 105, the electromagnetic wave shielding sheet 100, and the like during driving of the wireless charging device, and the lower cover 104 ), And an electromagnetic shielding sheet (100). For example, since a large amount of heat is generated due to the DC resistance component of the coil pattern 105 among the heat generated by power transmission to the coil pattern 105, it is possible to effectively dissipate heat by the heat dissipation layer 101, Can be lowered. In this case, the heat dissipation layer 101 can be bonded to the lower cover 104 by the adhesive 103, and various materials that can be used in the related art such as a double-sided tape and an adhesive layer can be used as the adhesive 103 It will be possible. Likewise, the heat dissipation layer 101 can be bonded to the electromagnetic shielding sheet 100 by an adhesive 102.

In the present embodiment, the heat dissipation layer 101 is made of a material which is suitable for being applied together with the coil portion 21 and the electromagnetic shielding sheet 100, but also has excellent thermal conductivity, and graphene is used as such material. That is, the heat-radiating layer 101 may be provided in the form of a film containing graphene and may be bonded to the electromagnetic shielding sheet 100 and the lower cover 104 through the adhesives 102 and 103.

In the case of the graphene included in the heat dissipation layer 101 in the present embodiment, carbon atoms are a new material having a two-dimensional structure composed of one layer forming a honeycomb of sp2 hybrid bonds. Graphene is structurally and chemically very stable and is known to be an excellent conductor capable of transporting electrons 100 times faster than silicon and 100 times more current than copper. It also has mechanical strength and flexibility of about 200 times that of steel, and has optical properties that transmit 97.7% of incident light while having a thermal conductivity of about 5,300 W / m · K. Also, since graphene is composed only of carbon, it has a high specific surface area of 2,600 m ² / g.

4, the heat dissipation layer 101 may be formed to be directly coupled to the lower cover 104. More specifically, the heat dissipation layer 101 may be formed to cover the lower cover 104, Can be coated directly on the surface of the substrate. That is, the heat dissipation layer 101 can be formed directly on the surface of the lower cover 104 without being affected by an adhesive layer or the like, and an excellent heat dissipation effect can be obtained by the direct coating structure. Furthermore, since the adhesive is removed, the size of the entire receiving unit can be reduced.

Although not shown in FIG. 4, a structure in which the lower cover 104 is removed may be employed in order to more efficiently discharge heat generated in the coil pattern 105. In this case, the heat- 105). &Lt; / RTI > The adhesive material 102 between the heat dissipation layer 101 and the electromagnetic shielding sheet 100 is also removed so that the heat generated from the electromagnetic interference shielding sheet 100 can be directly transferred to the heat dissipation layer 101, The heat radiation performance is further improved and a compact device can be realized.

The step of forming a coating layer on the surfaces of the electromagnetic wave shielding sheet 100, the lower cover 104 and the coil pattern 105 using graphene powder may be carried out by spin coating, spray coating, vacuum filtration, Langmuir- Various methods such as LBL assembly, dipping, roll coating, and comma coating can be used. When these processes are used, they can be coated on the surfaces of the electromagnetic wave shielding sheet 100, the lower cover 104, the coil pattern 105 and the like with a structure in which graphene powder is mixed with an organic or inorganic binder. Hereinafter, some of the processes described above will be described.

The spin coating is a method of dropping a predetermined amount of graphene oxide solution on a substrate and coating the substrate with a centrifugal force applied to the solution by rotating the substrate, that is, the coating object (the magnetic layer in this embodiment) at high speed.

The spray coating method is a coating method for spraying a graphene oxide solution onto a substrate. It is easy to coat a large area substrate, and the process itself is quick and simple. However, before the solution is sprayed from the nozzle to reach the substrate, So that the total area of the film may not be uniform.

Vacuum filtration is a coating method in which a graphene oxide solution is filtered using a microfilter to form a film of graphene oxide fragments that are filtered on the microfilter paper to obtain a uniformly coated film and to control the thickness of the film It is easy. However, the consumption of the graphene oxide solution used is high, and the time required may take a relatively long time.

The Langmuir-Blagget assembly method is a coating method in which graphene oxide pieces are self-assembled onto a substrate by vertically immersing the substrate in a solution in which graphene oxides are arranged on the surface, and slowly lifting the substrate at a constant speed. Although the Langmuir-Blagget method can obtain a relatively uniform film, the process takes a long time, and it may be difficult to coat a large-area substrate.

Layer-by-layer assembly (LBL) is a coating method in which a film is assembled using electrostatic attraction by applying different surface charges to graphene pieces. In the case of the LBL assembly method, a graphene oxide solution having a positive charge and a graphene oxide solution having a negative charge are each prepared by attaching a functional group to a graphene piece, and the graphene oxide pieces are stacked one by one by immersing the substrate in the two solutions alternately . The LBL assembly method is good in operability but requires a pretreatment step of attaching a functional group to graphene pieces, and the amount of graphene oxide solution required for the process and the time required may be large.

Another embodiment of the present invention will be described with reference to Figs. 5 includes an electromagnetic wave shielding sheet 100 and a coil portion 21 in the same manner as in the previous embodiment, wherein the coil portion 21 has a heat dissipation layer (not shown) disposed on the electromagnetic wave shielding sheet 100 side 201). The shape of the heat dissipation layer 201 and the detailed structure of the coil portion 21 are different from each other, but the structure employed in the present embodiment is also employed in the structures of FIGS. 3 and 4, And in the opposite case.

5, the heat dissipation layer 201 has a shape corresponding to the coil pattern 205. In this embodiment, That is, the coil pattern 205 has the heat dissipation layer 201 formed only in the region corresponding to the lower portion. The heat radiation layer 201 made of graphene or the like is formed only in a region corresponding to the coil pattern 205 rather than the entire region of the coil portion 21, Can be minimized. In this case, the heat dissipation layer 201 can be bonded to the coil pattern 205 by the adhesive 204. The coil pattern 205 and the heat dissipation layer 201 can be electrically connected to each other and the higher the electric conductivity of the heat dissipation layer 201 is, the more preferable. For this purpose, it is possible to increase the percentage of griffin in the heat dissipation layer 201 or use an adhesive material having excellent electrical conductivity as the adhesive 204.

6, the heat dissipation layer 201 may be directly bonded to the coil pattern 205. Specifically, the heat dissipation layer 201 may be formed of a material having a high thermal conductivity, It can be directly coated on the surface to further improve the heat dissipation efficiency and be advantageous in downsizing the device. The method of forming the heat-radiating layer 201 directly on the surface of the coil pattern 205 may refer to the process examples described in detail above.

5 and 6, the heat dissipation layer 201 and the coil pattern 205 are disposed between the first and second adhesive layers 202 and 203 and are fixed therebetween For example, a double-sided tape may be used as the first and second adhesive layers 202 and 203. [ With this structure, the electromagnetic wave shielding sheet 100 can be combined with the first adhesive layer 202. The cover layer 206 may be formed on the upper portion of the second adhesive layer 203 and the cover layer 206 may be formed of a material such as PET or the like.

An example of a method of making the structures shown in Figs. 5 and 6 will be described with reference to Fig. First, in the case of the structure of Fig. 6, a carrier 207 on which a conductive thin film (for example, copper foil) is formed is provided. Here, the conductive thin film is for forming the coil pattern 205 by a punching process. Then, a heat dissipation layer 201 is directly coated on the surface of the conductive thin film. Coating of the heat radiating layer directly on the copper foil can produce a more precise and firmly punched coil than when using an adhesive or an adhesive. In addition, since there is no adhesive layer which greatly decreases the thermal conductivity and electrical conductivity, a great improvement can be expected in terms of electrical and magnetic properties. Thereafter, the copper foil and the heat-radiating layer 201 are simultaneously pressed to obtain a bonding structure of the coil pattern 205 and the heat-radiating layer 201. 7, the coil pattern 205 and the heat dissipation layer 201 are transferred onto the electromagnetic shielding sheet 100 to which the adhesive 202 is applied, and then the cover layer made of PET or the like The structure shown in Fig. 6 can be obtained.

As another method, a method of forming the coil pattern 205 directly on the cover layer 206 will be described. First, an electrically conductive thin film (for example, copper foil) is bonded to the cover layer 206 made of PET or the like using an adhesive layer 203 such as a double-sided tape or the like. Then, a heat dissipation layer 201 such as a graphene sheet is bonded to the conductive thin film. Then, the coil pattern (simultaneously with the NFC and the MST coil, if necessary) and the heat-radiating layer 201 are simultaneously formed by using the punching process. At this time, since the line width of the coil and the line distance are as small as several tens to several hundreds of um, the bonding using the adhesive is more preferable than the adhesive such as the double-sided tape. Thereafter, the coil pattern 205 and the heat dissipation layer 201 can be properly combined with the electromagnetic wave shield 100 as described above.

On the other hand, in the above-described example, the electromagnetic wave shielding sheet is applied to the receiving portion of the wireless charging device, but the electromagnetic wave shielding sheet may also be applied to the transmitting portion of the wireless charging device.

The present invention is not limited to the above-described embodiments and the accompanying drawings, but is intended to be limited only by the appended claims. It will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. something to do.

10: Wireless power transmission device
11: Transmission coil
20: Wireless power receiving device
21: Receiver coil (coil part)
22: Battery
30: Electronic device
100: electromagnetic wave shielding sheet
101, 201: heat radiating layer
102, 103, 201, 202, 203, 204:
104: Lower cover
105, 205: coil pattern
106: upper cover
206: Cover layer
207: Carrier

Claims

An electromagnetic wave shielding sheet, and a coil portion,
Wherein the coil portion includes a coil pattern and a heat radiation layer disposed on the electromagnetic wave shielding sheet side,
The heat dissipation layer and the coil pattern are disposed between and supported by the first and second adhesive layers,
Wherein the heat dissipation layer and the coil pattern are embedded in the first and second adhesive layers.

The method according to claim 1,
Wherein the coil portion includes upper and lower covers, and the coil pattern is disposed between the upper and lower covers.

3. The method of claim 2,
Wherein the heat dissipation layer is bonded to the lower cover by an adhesive.

delete

3. The method of claim 2,
Wherein the upper cover, the lower cover, and the coil pattern form a flexible circuit board structure.

The method according to claim 1,
Wherein the heat dissipation layer has a shape corresponding to the coil pattern.

The method according to claim 1,
Wherein the heat dissipation layer is bonded to the coil pattern by an adhesive.

The method according to claim 1,
Wherein the heat dissipation layer is directly coupled to the coil pattern.

10. The method of claim 9,
Wherein the heat dissipation layer is coated directly on the surface of the coil pattern.

delete

The method according to claim 1,
Wherein the electromagnetic shielding sheet is bonded to the first adhesive layer.

The method according to claim 1,
And a cover layer coupled to the second adhesive layer.

The method according to claim 1,
Wherein the heat dissipation layer is bonded to the electromagnetic wave shielding sheet by an adhesive.