KR101771527B1 - Ultrasonic cleaning apparatus and ultrasonic cleaning method using the ultrasonic cleaning apparatus - Google Patents

Ultrasonic cleaning apparatus and ultrasonic cleaning method using the ultrasonic cleaning apparatus Download PDF

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Publication number
KR101771527B1
KR101771527B1 KR1020160017767A KR20160017767A KR101771527B1 KR 101771527 B1 KR101771527 B1 KR 101771527B1 KR 1020160017767 A KR1020160017767 A KR 1020160017767A KR 20160017767 A KR20160017767 A KR 20160017767A KR 101771527 B1 KR101771527 B1 KR 101771527B1
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KR
South Korea
Prior art keywords
cleaning unit
processing material
cleaning
ultrasonic generator
ultrasonic
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Application number
KR1020160017767A
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Korean (ko)
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KR20170096419A (en
Inventor
지우진
서기홍
Original Assignee
주식회사 이오테크닉스
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Priority to KR1020160017767A priority Critical patent/KR101771527B1/en
Priority to CN201680081755.6A priority patent/CN109070151A/en
Priority to PCT/KR2016/009759 priority patent/WO2017142147A1/en
Priority to TW105130089A priority patent/TW201729913A/en
Publication of KR20170096419A publication Critical patent/KR20170096419A/en
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Publication of KR101771527B1 publication Critical patent/KR101771527B1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/02—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by distortion, beating, or vibration of the surface to be cleaned
    • B08B7/026—Using sound waves
    • B08B7/028—Using ultrasounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/02—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by distortion, beating, or vibration of the surface to be cleaned
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/60—Preliminary treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment

Abstract

Disclosed is an ultrasonic cleaning apparatus for cleaning a surface of a processing material by using ultrasonic waves, and an ultrasonic cleaning method using the same. The disclosed ultrasonic cleaning apparatus includes a first cleaning unit movably provided in a vertical direction and a horizontal direction and including an upper ultrasonic generator for emitting ultrasonic waves toward the upper surface of the processing material, And a second cleaning unit including a lower ultrasonic generator that emits ultrasonic waves toward the lower surface of the processing material.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an ultrasonic cleaning apparatus and an ultrasonic cleaning method using the same,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultrasonic cleaning apparatus for cleaning a surface of a processing material using ultrasonic waves and an ultrasonic cleaning method using the same.

The laser machining apparatus is used for marking, etching, punching, scribing, and dicing by irradiating a laser beam emitted from a laser light source to a processing material using a predetermined optical system. And the like. On the other hand, after the laser machining process is performed, contaminants generated due to laser machining may be adhered to the surface of the processing material. In order to remove such contaminants, a method of cleaning the surface of a processing material by using an ultrasonic cleaning apparatus including an ultrasonic generator has been used. However, in the conventional ultrasonic cleaning apparatus, when the contaminated surface of the processing material is located on the opposite side of the ultrasonic generator, it is troublesome to rotate the processing material. As a result, the size of the cleaning apparatus becomes large, There is a problem in that the manufacturing cost of the semiconductor device increases.

An embodiment of the present invention provides an ultrasonic cleaning apparatus for cleaning a surface of a processing material using ultrasonic waves and an ultrasonic cleaning method using the same.

In one aspect of the present invention,

 1. An ultrasonic cleaning apparatus for cleaning a surface of a processing material by using ultrasonic waves,

A first cleaning unit movably movable in the vertical and horizontal directions and including an upper ultrasonic generator for emitting ultrasonic waves toward the upper surface of the processing material; And

And a second cleaning unit including a lower ultrasonic generator that is provided inside the processing object during a cleaning process and emits ultrasonic waves toward a lower surface of the processing material.

The first cleaning unit may further include a lateral ultrasonic generator that emits ultrasonic waves toward opposite sides of the processing material.

Wherein the first cleaning unit includes a first side ultrasonic generator for emitting ultrasound waves toward the opposite first side surfaces of the processing material and a second side ultrasonic generator for emitting ultrasonic waves toward the opposite second side surfaces of the processing material .

The second cleaning unit may further include a container and a cleaning liquid filled in the container to fill the processing material. The cleaning liquid may include, for example, deionized water (DI water).

The lower ultrasonic generator may be provided on the bottom of the container, and the processing material may be provided on the lower ultrasonic generator. Here, the processing material may be spaced apart from the upper surface of the lower ultrasonic generator by a support. The processing material may be mounted on a jig and provided inside the container.

In the cleaning process, the upper ultrasonic generator may be provided in contact with the cleaning liquid.

In another aspect of the present invention,

A first cleaning unit movably disposed in the vertical direction and the horizontal direction and including an upper ultrasonic generator; And a second cleaning unit including a lower ultrasonic generator, the ultrasonic cleaning method comprising the steps of:

The upper ultrasonic generator discharging ultrasonic waves to the upper surface of the processing material to clean the upper surface of the processing material; And

And the lower ultrasonic generator discharging ultrasonic waves to the lower side of the processing material to clean the lower surface of the processing material.

The upper and lower surfaces of the processing material can be cleaned simultaneously or sequentially.

The second cleaning unit may further include a container and a cleaning liquid filled in the container.

The ultrasonic cleaning method comprising: moving the first cleaning unit away from the second cleaning unit; Providing the processing material inside the cleaning liquid of the container; And moving the first cleaning unit toward the second cleaning unit.

The processing material may be spaced apart from the upper surface of the lower ultrasonic generator. The processing material may be mounted on a jig and provided inside the container.

By moving the first cleaning unit to the second cleaning unit, the upper ultrasonic generator can be brought into contact with the cleaning liquid.

The first cleaning unit may further include a lateral ultrasonic generator, and the side ultrasonic generator may further include a step of cleaning both sides of the processing material by emitting ultrasonic waves toward opposite sides of the processing material.

Wherein the first cleaning unit further comprises first and second side ultrasonic generators, wherein the first side ultrasonic generator emits ultrasonic waves toward the first opposite side surfaces of the processing materials opposite to each other to clean the first both side surfaces, And the second side ultrasonic generator may further include the step of cleansing the second opposite side surfaces by emitting ultrasonic waves toward the opposite second side surfaces of the processing materials.

According to this embodiment, the upper ultrasonic generator of the first cleaning unit can clean the upper surface of the processing material, and the lower ultrasonic generator of the second cleaning unit can clean the lower surface of the processing material. Further, the side surfaces of the processing material can be further cleaned by using the side ultrasonic generator of the first cleaning unit. Therefore, in order to clean the contaminated surface in the ultrasonic cleaning process, the upper and lower surfaces and the first both sides of the processing material can be cleaned simultaneously or sequentially without the need to rotate or move the processing material. In addition, since all the surfaces of the processing material can be cleaned without adding a separate device, the cleaning device can be made smaller and its manufacturing cost can be reduced.

1 is a perspective view illustrating an ultrasonic cleaning apparatus according to an exemplary embodiment of the present invention.
FIG. 2 is a perspective view showing the upper and lower ultrasonic generators of the first cleaning unit and the lower ultrasonic generator of the second cleaning unit of FIG. 1. FIG.
3 is a cross-sectional view taken along the line A-A 'in Fig.
Fig. 4 is a perspective view showing the second cleaning unit of Fig. 1. Fig.
Fig. 5A shows a processing material that is mounted on a jig.
Fig. 5B is an enlarged view of the processing material shown in Fig. 5A.
6A to 6D are views for explaining a method of cleaning a processing material using the ultrasonic cleaning apparatus shown in FIG.
7 is a perspective view illustrating an ultrasonic cleaning apparatus according to another exemplary embodiment of the present invention.
8 is a perspective view showing the upper ultrasonic generator of the first cleaning unit and the lower ultrasonic generator of the second cleaning unit of FIG.
9 is a sectional view taken along the line B-B 'in Fig.
10 is a perspective view showing the second cleaning unit of FIG.
11 is a perspective view illustrating an ultrasonic cleaning apparatus according to another exemplary embodiment of the present invention.
FIG. 12 is a perspective view showing an upper part, a first side, and a lower side ultrasonic generator of the second side ultrasonic generator and the second cleaning unit of the first cleaning unit of FIG. 7;
13A is a cross-sectional view taken along the line C-C 'in FIG.
13B is a cross-sectional view taken along the line D-D 'in FIG.
14 is a perspective view showing the second cleaning unit of Fig.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments illustrated below are not intended to limit the scope of the invention, but rather are provided to illustrate the invention to those skilled in the art. In the drawings, like reference numerals refer to like elements, and the size and thickness of each element may be exaggerated for clarity of explanation. Further, when it is described that a certain material layer is present on a substrate or another layer, the material layer may be present directly on the substrate or another layer, and there may be another third layer in between. In addition, the materials constituting each layer in the following embodiments are illustrative, and other materials may be used.

1 is a perspective view illustrating an ultrasonic cleaning apparatus according to an exemplary embodiment of the present invention. FIG. 2 is a perspective view showing the upper and lower ultrasonic generators of the first cleaning unit of FIG. 1 and the lower ultrasonic generator of the second cleaning unit, and FIG. 3 is a sectional view taken along line A-A 'of FIG. 4 is a perspective view showing the second cleaning unit of Fig. 1. Fig.

1 to 4, the ultrasonic cleaning apparatus 100 includes a first cleaning unit 110 and a second cleaning unit 120 provided below the first cleaning unit 110. The first cleaning unit 110 cleans the upper surface and both side surfaces of the workpiece W. FIG. 5A shows a workpiece W that is mounted on a jig S, and FIG. 5B is an enlarged view of the workpiece W shown in FIG. 5A. 5A and 5B, the workpiece W mounted on the jig S includes upper and lower surfaces S1 and S2 opposite to each other along the z direction, first and second opposite side surfaces (S3) and second opposite side surfaces (S4) opposite to each other along the x direction.

The first cleaning unit 110 is provided on the upper portion of the second cleaning unit 120 and includes an upper surface S1 along the z direction and a first opposite side surface S3 along the y direction in FIG. ). ≪ / RTI > To this end, the first cleaning unit 110 may include an upper ultrasonic generator 111 and a lateral ultrasonic generator 112.

The upper ultrasonic generator 111 may serve to clean the upper surface S1 of the workpiece W by emitting ultrasonic waves to the upper surface S1 of the workpiece W (the upper surface in the z direction in Fig. 5B). The lateral ultrasonic wave generator 112 generates ultrasonic waves on the first opposite side surfaces S3 of the processing material W opposite to each other in the y direction and the first side surfaces of the processing material W in the y direction, And may serve to clean both side surfaces S3. The side ultrasonic wave generators 112 may be provided on both sides of the upper ultrasonic wave generator 111 along the y direction.

The first cleaning unit 110 including the upper and side ultrasonic generators 111 and 112 can be vertically and horizontally moved with respect to the second cleaning unit 120. Specifically, the first cleaning unit 110 can be raised or lowered in the z direction with respect to the second cleaning unit 120, and can be provided to move forward or backward along the x direction.

The second cleaning unit 120 is provided under the first cleaning unit 110 and cleans the lower surface S2 of the workpiece W (the lower surface along the z direction in FIG. 5B). The second cleaning unit 120 may include a container 150, a lower ultrasonic generator 121 provided at the bottom of the container 150, and a cleaning liquid 160 filled in the container 150 have. The processing material W may be provided on the lower ultrasonic generator 121. Specifically, the processing material W is separated from the upper surface of the lower ultrasonic generator 121 by the support table 155 at a predetermined interval The processing material W may be mounted on the jig S and provided on the lower ultrasonic generator 121. [

The cleaning liquid 160 may be filled into the container 150 so that the processing material W is locked. Such a rinse may include, but is not limited to, deionized water (DI water) 160, for example. In the meantime, during the ultrasonic cleaning, the first cleaning unit 110 may be lowered so that the upper ultrasonic generator 111 and the lateral ultrasonic generator 112 are brought into contact with the cleaning liquid 160. The lower ultrasonic wave generator 121 may serve to clean the lower surface S2 of the workpiece W by emitting ultrasonic waves to the lower surface S2 of the workpiece W in the z direction.

In the ultrasonic cleaning apparatus 100 having the above structure, the first and second cleaning units 110 and 120 are disposed as shown in FIG. 3 in the ultrasonic cleaning, The upper ultrasonic generator 111 and the lateral ultrasonic generator 112 respectively emit ultrasonic waves to the upper surface S1 and the first both-side surfaces S3 of the workpiece W and the lower ultrasonic generator 112 of the second cleaning unit 120, (121) emits ultrasonic waves to the lower surface (S2) side of the workpiece (W). Thus, the workpiece W can simultaneously or sequentially clean the upper surface S1 and the lower surface S2, and the first opposite side surfaces S3 opposite to each other in the y direction.

Hereinafter, the process of cleaning the surface of the workpiece W using the ultrasonic cleaning apparatus 100 shown in FIGS. 1 to 4 will be described in detail. 6A to 6D are views illustrating a method of cleaning a contaminated surface of a workpiece W using the ultrasonic cleaning apparatus 100 shown in FIG. 6A, 6B and 6D show cross sections along the x-z plane, and Fig. 6C show cross sections along the y-z plane.

Referring to FIG. 6A, the first cleaning unit 110 moves upward along the z direction, and then horizontally along the -x direction. The second cleaning unit 120 is opened so that the jig S on which the processing material W is loaded in the state in which the second cleaning unit 120 is opened is moved to the lower ultrasonic wave of the second cleaning unit 120 Is provided on the generator 121. Here, the processing material W may be provided so as to be submerged in the cleaning liquid 160.

Referring to FIG. 6B, a workpiece W to be cleaned is provided on the lower ultrasonic generator 121, and then the first cleaning unit 110 moves to the inside of the second cleaning unit 120. Specifically, the first cleaning unit 110 moves horizontally along the x direction and then descends in the -z direction. Here, the upper portion of the first cleaning unit 110 and the lateral ultrasonic generators 111 and 112 are in contact with the cleaning liquid 160.

6C, ultrasonic waves are emitted from the upper and lower side ultrasonic wave generators 111 and 112 of the first cleaning unit 110 and the lower ultrasonic wave generators 121 of the second cleaning unit 120 in the state shown in FIG. 6B. 6C is a cross-sectional view along the y-z plane for the sake of more clearly illustrating the manner in which the upper ultrasonic generator 111, the lateral ultrasonic generator 112, and the lower ultrasonic generator 121 emit ultrasonic waves.

In this ultrasonic cleaning process, the upper ultrasonic generator 111, the lateral ultrasonic generator 112, and the lower ultrasonic generator 121 can simultaneously emit ultrasonic waves. However, the present invention is not limited thereto, and the ultrasonic generator 111, the lateral ultrasonic generator 112, and the lower ultrasonic generator 121 may sequentially emit ultrasonic waves.

The upper ultrasonic generator 111 can clean the upper surface S1 of the workpiece W by emitting ultrasonic waves to the upper surface S1 side of the workpiece W and the side ultrasonic generator 112 can clean the upper surface S1 of the workpiece W, The first both side surfaces S3 of the work W can be cleaned by emitting ultrasonic waves toward the first both side surfaces S3 of the work W. The lower ultrasonic wave generator 121 can clean the lower surface S2 of the workpiece W by emitting ultrasonic waves to the lower surface S2 of the workpiece W. [

Referring to FIG. 6D, after cleaning the surface of the workpiece W, the first cleaning unit 110 moves upward along the z direction and then horizontally along the -x direction. Accordingly, the second cleaning unit 120 is opened, and the processed material W loaded on the jig S can be taken out to the outside while the second cleaning unit 120 is opened.

As described above, according to the present embodiment, the upper portion of the first cleaning unit 110 and the lateral ultrasonic generators 111 and 112 clean the upper surface S1 and the first opposite side surfaces S3 of the workpiece W, The lower ultrasonic generator 121 of the second cleaning unit 120 can clean the lower surface S2 of the workpiece W. [ The upper surface S1 and the lower surface S2 of the workpiece W and the first opposite side surfaces S3 of the workpiece W can be removed without rotating or moving the workpiece W to clean the contaminated surface in the ultrasonic cleaning process It can be washed simultaneously or sequentially. In addition, since the surface of the processed material W can be cleaned without a separate apparatus, the cleaning apparatus can be made small and the manufacturing cost can be reduced.

7 is a perspective view illustrating an ultrasonic cleaning apparatus according to another exemplary embodiment of the present invention. FIG. 8 is a perspective view showing the upper ultrasonic generator of the first cleaning unit and the lower ultrasonic generator of the second cleaning unit of FIG. 7, and FIG. 9 is a sectional view taken along line B-B 'of FIG. 10 is a perspective view showing the second cleaning unit of FIG.

7 to 10, the ultrasonic cleaning apparatus 200 includes a first cleaning unit 210 and a second cleaning unit 220 provided below the first cleaning unit 210. The first cleaning unit 210 is provided on the upper portion of the second cleaning unit 220 by cleaning the upper surface (S1, upper surface along the z direction in FIG. 5B) of the processing material W. The first cleaning unit 210 may include an upper ultrasonic generator 211.

The upper ultrasonic generator 211 may serve to clean the upper surface S1 of the workpiece W by emitting ultrasonic waves to the upper surface S1 of the workpiece W (the upper surface along the z direction in Fig. 5B). The first cleaning unit 210 including the upper ultrasonic generator 211 can be vertically and horizontally moved with respect to the second cleaning unit 220.

The second cleaning unit 220 is provided under the first cleaning unit 210 and cleans the lower surface S2 of the processing material W (the lower surface in the z direction in FIG. 5B). The second cleaning unit 220 may include a container 250, a lower ultrasonic generator 221 provided at the bottom of the container 250, and a cleaning liquid 260 filled in the container 250 . The workpiece W may be spaced apart from the upper surface of the lower ultrasonic generator 221 by a support 255. The processing material W may be mounted on the jig S and provided on the lower ultrasonic generator 221.

The cleaning liquid 260 may be filled in the container 250 so that the processing material W is locked. During the ultrasonic cleaning, the first cleaning unit 210 may be lowered so that the upper ultrasonic generator 211 may contact the cleaning liquid 260. The lower ultrasonic wave generator 221 may serve to clean the lower surface S2 of the workpiece W by emitting ultrasonic waves to the lower surface S2 of the workpiece W. [

In the ultrasonic cleaning apparatus 200 having the above structure, the first and second cleaning units 210 and 220 are disposed as shown in FIG. 9 during the ultrasonic cleaning, and the first and second cleaning units 210 and 220, The upper ultrasonic generator 211 emits ultrasound to the upper surface S1 side of the workpiece W and the lower ultrasonic generator 221 of the second cleaning unit 220 is positioned on the lower surface S2 of the workpiece W And ultrasound waves are emitted. As a result, the workpiece W can simultaneously or sequentially clean the upper surface S1 and the lower surface S2.

The process of cleaning the surface of the processing material W using the ultrasonic cleaning apparatus 200 shown in Figs. 7 to 10 is performed in the same manner as the first embodiment except that only the upper surface S1 and the lower surface S2 of the processing material W are cleaned 6A to 6D, except that the cleaning process is the same as that shown in FIGS. Therefore, detailed description thereof will be omitted.

As described above, according to the present embodiment, the upper ultrasonic generator 211 of the first cleaning unit 210 cleans the upper surface S1 of the workpiece W, and the lower ultrasonic generator 211 of the second cleaning unit 220 221) can clean the lower surface (S2) of the workpiece (W). Accordingly, the upper surface S1 and the lower surface S2 of the workpiece W can be cleaned simultaneously or sequentially without having to rotate or move the workpiece W in order to clean the contaminated surface in the ultrasonic cleaning process.

11 is a perspective view illustrating an ultrasonic cleaning apparatus according to another exemplary embodiment of the present invention. 12 is a perspective view showing the upper, first and second side ultrasonic generators of the first cleaning unit of FIG. 11 and the lower ultrasonic generator of the second cleaning unit, and FIG. 13A is a cross- And Fig. 13B is a cross-sectional view taken along the line D-D 'in Fig. 14 is a perspective view showing the second cleaning unit of Fig.

7 to 14, the ultrasonic cleaning apparatus 300 includes a first cleaning unit 310 and a second cleaning unit 320 provided under the first cleaning unit 310. The first cleaning unit 310 includes an upper surface S1 (upper surface along the z direction in FIG. 5B), first both side surfaces S3 (both surfaces along the y direction in FIG. 5B) and second upper surfaces S4 and both side surfaces along the x direction in Fig. 5B), and is provided on the upper portion of the second cleaning unit 320. [

The first cleaning unit 310 may include an upper ultrasonic generator 311, a first side ultrasonic generator 312, and a second side ultrasonic generator 313. The upper ultrasonic generator 311 may serve to clean the upper surface S1 of the workpiece W by emitting ultrasonic waves to the upper surface S1 side of the workpiece W. [

The first side ultrasonic generator 312 may serve to clean the first both side surfaces S3 of the workpiece W by emitting ultrasonic waves toward the first both side surfaces S3 of the workpiece W. [ The first side ultrasonic generator 312 may be provided on both sides of the upper ultrasonic generator 311 along the y direction. The second side ultrasonic generator 313 may radiate ultrasonic waves toward the second both side surfaces S4 of the processing material W to clean the second both side surfaces S4 of the processing material W . The second side ultrasonic generator 313 may be provided on both sides of the upper ultrasonic generator 311 along the x direction. The first cleaning unit 310 including the upper ultrasonic wave generator 311, the first side ultrasonic wave generator 312 and the second ultrasonic wave generator 313 is moved up and down and horizontally with respect to the second cleaning unit 320 So that it can be moved.

The second cleaning unit 320 is provided under the first cleaning unit 310 and cleans the lower surface S2 of the processing material W (the lower surface along the z direction in FIG. 5B). The second cleaning unit 320 may include a container 350, a lower ultrasonic generator 321 provided at the bottom of the container 350, and a cleaning liquid 360 filled in the container 350 have. The workpiece W may be spaced from the upper surface of the lower ultrasonic generator 321 by a support 355 at a predetermined interval. Further, the processing material W may be mounted on the jig S and provided on the lower ultrasonic generator 321.

The cleaning liquid 360 may be filled in the container 350 such that the processing material W is locked. The first cleaning unit 310 may be lowered so that the upper ultrasonic generator 311, the first lateral ultrasonic generator 312 and the second lateral ultrasonic generator 313 are brought into contact with the cleaning liquid 360 . The lower ultrasonic wave generator 321 may serve to clean the lower surface S2 of the workpiece W by emitting ultrasonic waves to the lower surface S2 of the workpiece W. [

In the ultrasonic cleaning apparatus 300 having the above structure, the first and second cleaning units 310 and 320 are disposed as shown in FIGS. 13A and 13B in the ultrasonic cleaning, and the first and second cleaning units 310 and 320, The upper ultrasonic generator 311 of the first ultrasonic generator 310 emits ultrasonic waves to the upper surface S1 side of the workpiece W and the first ultrasonic generator 312 applies ultrasonic waves to the first both side surfaces S3 of the workpiece W And the second side ultrasonic generator 313 emits ultrasonic waves toward the second opposite side surfaces S4 of the processing material W. [ The lower ultrasonic wave generator 321 of the second cleaning unit 320 emits ultrasonic waves to the lower surface S2 of the workpiece W. [ Thus, all surfaces of the workpiece W can be cleaned. Specifically, the processing material W can simultaneously or sequentially clean the upper surface S1, the first opposite side surfaces S3, the second both side surfaces S4, and the lower surface S2.

The process of cleaning the surface of the workpiece W using the ultrasonic cleaning apparatus 300 shown in Figs. 11 to 14 is performed in the same manner as in the first embodiment except that the upper surface S1 of the workpiece W, the first opposite side surfaces S3 6A to 6D except that the first and second side surfaces S4, S4 and the bottom surface S2 are cleaned. Therefore, detailed description thereof will be omitted.

As described above, according to the present embodiment, the upper ultrasonic generator 311 of the first cleaning unit 310 cleans the upper surface S1 of the processing material W, and the first side ultrasonic generator 312 rotates the processing material W and the second side ultrasonic generator 313 can clean the second both side surfaces S4 of the workpiece W. [ The lower ultrasonic generator 321 of the second cleaning unit 320 can clean the lower surface S2 of the processing material W. [ Thereby, all surfaces of the workpiece W can be cleaned simultaneously or sequentially without the need to rotate or move the workpiece W to clean the contaminated surface in the ultrasonic cleaning process. In addition, since the surface of the processing material W can be cleaned without adding a separate device, the cleaning device can be made smaller and the manufacturing cost can be reduced.

While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the scope of the invention as defined by the appended claims.

100, 200, 300 .. Ultrasonic Cleaning Device
110, 210, 310. The first cleaning unit
111, 211, 311. Upper ultrasonic generator
112 .. Side ultrasonic generator
312 .. First side ultrasonic generator
313 .. Second side ultrasonic generator
120, 220, 320. The second cleaning unit
121, 221, 321. Lower ultrasonic generator
150, 250, 350 .. Container
155,255,355.
160,260,360 .. Cleaning solution
S .. Stage
W .. processing material
S1 .. Upper surface of the workpiece
S2 .. The bottom of the processing material
S3. First side faces of the workpiece
S4. The second both sides of the processing material

Claims (20)

1. An ultrasonic cleaning apparatus for cleaning a surface of a processing material by using ultrasonic waves,
A first cleaning unit including an upper ultrasonic generator that emits ultrasonic waves toward the upper surface of the processing material and a first side ultrasonic generator that emits ultrasonic waves toward the first opposite side surfaces of the processing material; And
And a second cleaning unit including a lower ultrasonic generator that is disposed inside the processing material and emits ultrasonic waves toward a lower surface of the processing material,
The first cleaning unit is provided so as to be movable up and down and horizontally with respect to the second cleaning unit so that the processing material to be cleaned by the movement of the first cleaning unit is provided inside the second cleaning unit So that the processed workpiece can be taken out to the outside of the second cleaning unit. delete The method according to claim 1,
Wherein the first cleaning unit further comprises a second side ultrasonic generator that emits ultrasonic waves toward opposite side surfaces of the processing material opposite to each other. The method according to claim 1 or 3,
Wherein the second cleaning unit further comprises a container and a cleaning liquid filled inside the container to lock the processing material. 5. The method of claim 4,
Wherein the cleaning liquid comprises deionized water (DI water). 5. The method of claim 4,
Wherein the lower ultrasonic generator is provided at the bottom of the container, and the processing material is provided on the lower ultrasonic generator. The method according to claim 6,
Wherein the processing material is spaced apart from the upper surface of the lower ultrasonic generator by a support. The method according to claim 6,
Wherein the processing material is mounted in a jig and provided inside the container. 5. The method of claim 4,
Wherein the upper ultrasonic generator is provided in contact with the cleaning liquid during a cleaning process. [Claim 10 is abandoned upon payment of the registration fee.] A first cleaning unit including an upper ultrasonic generator and a first lateral ultrasonic generator; And a second cleaning unit including a lower ultrasonic generator, the ultrasonic cleaning method comprising the steps of:
Providing the processing material to be cleaned inside the second cleaning unit;
Wherein the upper ultrasonic generator of the first cleaning unit emits ultrasonic waves to the upper surface side of the processing material to clean the upper surface of the processing material and the first side ultrasonic generator of the first cleaning unit Cleaning the first both side surfaces of the processing material by emitting ultrasonic waves toward the first both side surfaces;
The lower ultrasonic generator of the second cleaning unit discharging ultrasonic waves to the lower side of the processing material to clean the lower surface of the processing material; And
And taking out the processed work material out of the second cleaning unit,
The first cleaning unit is provided so as to be movable up and down and horizontally with respect to the second cleaning unit so that the processing material to be cleaned by the movement of the first cleaning unit is provided inside the second cleaning unit And the processed material to be cleaned can be taken out to the outside of the second cleaning unit. [Claim 11 is abandoned upon payment of the registration fee.] 11. The method of claim 10,
Wherein the upper surface, the first opposite side surface, and the lower surface of the processing material are simultaneously or sequentially cleaned. [12] has been abandoned due to the registration fee. 11. The method of claim 10,
Wherein the second cleaning unit further comprises a container and a cleaning liquid filled in the container. [13] has been abandoned due to the registration fee. 13. The method of claim 12,
Moving the first cleaning unit away from the second cleaning unit;
Providing the processing material inside the cleaning liquid of the container; And
And moving the first cleaning unit toward the second cleaning unit. [14] has been abandoned due to the registration fee. 14. The method of claim 13,
Wherein the processing material is spaced apart from an upper surface of the lower ultrasonic generator. [Claim 15 is abandoned upon payment of registration fee] 14. The method of claim 13,
Wherein the processing material is mounted on a jig and is provided inside the container. [Claim 16 is abandoned upon payment of registration fee.] 14. The method of claim 13,
Wherein the upper ultrasonic generator is arranged to contact the cleaning liquid by moving the first cleaning unit toward the second cleaning unit. delete [Claim 18 is abandoned upon payment of registration fee.] 11. The method of claim 10,
Wherein the first cleaning unit further comprises a second side ultrasonic generator,
And the second side ultrasonic generator emits ultrasound waves toward the opposite second side surfaces of the processing material to clean the second both side surfaces. The method according to claim 1,
Wherein the first cleaning unit moves to the inside of the second cleaning unit during a cleaning process. [Claim 20 is abandoned upon payment of the registration fee.] 11. The method of claim 10,
Wherein the first cleaning unit moves to the inside of the second cleaning unit during a cleaning process.
KR1020160017767A 2016-02-16 2016-02-16 Ultrasonic cleaning apparatus and ultrasonic cleaning method using the ultrasonic cleaning apparatus KR101771527B1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020160017767A KR101771527B1 (en) 2016-02-16 2016-02-16 Ultrasonic cleaning apparatus and ultrasonic cleaning method using the ultrasonic cleaning apparatus
CN201680081755.6A CN109070151A (en) 2016-02-16 2016-09-01 Ultrasonic cleaning apparatus and the method for suppersonic cleaning for utilizing it
PCT/KR2016/009759 WO2017142147A1 (en) 2016-02-16 2016-09-01 Ultrasonic cleaning device and ultrasonic cleaning method using same
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