KR101770186B1 - Apparatus for determining component mounting and method for controlling the same - Google Patents

Apparatus for determining component mounting and method for controlling the same Download PDF

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KR101770186B1
KR101770186B1 KR1020150182999A KR20150182999A KR101770186B1 KR 101770186 B1 KR101770186 B1 KR 101770186B1 KR 1020150182999 A KR1020150182999 A KR 1020150182999A KR 20150182999 A KR20150182999 A KR 20150182999A KR 101770186 B1 KR101770186 B1 KR 101770186B1
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height
pixel
inspection
image data
interest
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KR1020150182999A
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Korean (ko)
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KR20170074028A (en
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안명호
안광호
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주식회사 파미
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/046—
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

The present invention relates to a component mounting detection apparatus, and more particularly, to a component mounting detection apparatus, which includes a three-dimensional image storage unit in which a height value of a pixel of a component to be inspected is stored, A reference height is determined after determining a test area for a test part based on a theoretical area connected to the three-dimensional image storage part and the part location and height storage part, , Binarizing a height value of a pixel existing in a region of interest for the inspection object using the reference height to generate current height binary image data for pixels of the inspection region for the inspection object, Determines the current contour pixel located on the contour of the inspection part by using If the quasi-contour pixel and the current pixel of the contour matching rate set value more than the inspection part and comprising a location determination for determining to be present in the search range for the test component.

Description

TECHNICAL FIELD [0001] The present invention relates to an apparatus for detecting whether a component is mounted,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0002] The present invention relates to a component mounting detection device and a control method thereof.

In general, when a product is manufactured using Surface Mount Technology (SMT), a solder cream is applied on a printed circuit board (PCB), and then a resistor, a capacitor, and an IC Integrated Chip), and then passes through a reflow to produce a product.

When manufacturing such products, the correct parts must be mounted on the printed circuit board in the correct position. Various inspection items are inspected to confirm this.

In order to inspect various inspection items, first, it is necessary to check whether or not the parts exist in the corresponding positions.

If the part does not exist at the corresponding position, it is judged that the part is not mounted normally, so that it can be judged to be defective without performing any additional inspection of the part.

Accordingly, in order to check whether a component is mounted, conventionally, a two-dimensional image data for a plurality of pixels is acquired using an image data acquisition unit such as a CCD camera (charge coupled device camera) .

However, in the conventional case, since the two-dimensional image data has only the gradation value which is the image data according to the color of the photographed part, the presence or absence of the component is judged using only the gradation value. Therefore, There is no problem.

That is, when a component having the same or similar color as the surface color of the printed circuit board is mounted, the component can be recognized as the surface of the printed circuit board, and it is determined that the component does not exist at the corresponding position. It is not possible to mount the semiconductor device.

Korean Registered Patent Publication No. 10-1420312 (Registered Date: July 10, 2014, entitled "Printed Circuit Board Inspection Device, Applicant: Sungwoo Semitech Co., Ltd.)

SUMMARY OF THE INVENTION Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art.

According to an aspect of the present invention, there is provided an apparatus for detecting whether a component is mounted, the apparatus including: a three-dimensional image storage unit storing a height value of a pixel of a tested component; a component position / height storage unit, A reference height is set after determining the inspection area for the inspection part on the basis of the theoretical area where the inspection part is to be positioned and connected to the three-dimensional image storage part and the parts position and height storage part, Wherein the controller is configured to binarize a height value of a pixel existing in a region of interest for the inspection object to generate current height binary image data for a pixel of the inspection region for the inspection object, Determining a current contour pixel positioned on the contour line, and comparing the pixel of the reference contour line and the current contour pixel If the matching rate of the line scan pixel equal to or greater than the preset value, the part is determined to include a location that is determined to be present on the test area for the test component.

The position determining unit may determine a pixel whose value of the current height binarized image data changes from '0' to '1' or from '1' to '0' as the current contour pixel.

The apparatus may further include a two-dimensional image storage unit in which image data of different colors are stored and connected to the position determination unit, And generating a short height image by partially mapping the short channel image data to the current height height image data to generate a height height binary image, It is preferable to determine a pixel whose difference in gray level value between adjacent two pixels is equal to or greater than a set value in the height-binarized mapped image as a current outline pixel.

Wherein the position determination unit reads the information on the region of interest of the inspected component to determine a pure base region of interest that does not overlap with another region of interest in the base region of interest for determining the reference position, The reference height of the inspection part can be set to a middle height value of the height value of the pixel existing in the pure base interest area if the height value of the pixel existing in the pure base interest area exists using the height value .

According to another aspect of the present invention, there is provided a method for controlling a component mounting apparatus, the method comprising: determining a test area for a test component based on a theoretical area where the test component is to be positioned; Binarizing a height value of a pixel existing in a region of interest for the inspection object using the reference height to generate current height binary image data for a pixel of the inspection region for the inspection object; Determining a current contour pixel located on an outline of the inspection part using the image data and determining whether the matching ratio between the reference contour pixel and the current contour pixel is equal to or greater than a preset value, And judging that it exists.

The current contour pixel determination step may determine that the current contour pixel is a pixel whose value of the current height binarized image data changes from '0' to '1' or from '1' to '0'.

Wherein the current contour pixel determination step includes the steps of generating short channel image data by extracting image data of a set color from image data of different colors stored in the two-dimensional image storage unit, And partially mapping the short channel image data to generate a height binary mapping image.

The step of setting the reference height includes the steps of determining a pure base interest region that does not overlap with another interest region in a base interest region for determining a reference position by reading information about a region of interest of the inspected component, Determining whether there is a height value of a pixel existing in the pure base interest region using a height value stored in the pure base interest region, and if a height value of a pixel existing in the pure base interest region exists, And setting a reference height of the inspection part as a middle height value of a height value of the pixel existing in the inspection area.

According to this aspect, when the presence or absence of the inspection component is determined, the reference position, that is, the bottom position of the substrate on which the inspection component is positioned is accurately detected by using the height value of the pixels belonging to the pure base region of interest, Is more accurately determined.

In addition, in the effective pixels of the Height Thresholded Binary Image or Height Thresholded Binary Image obtained from the 3D image data based on a specific height, The position of the component to be inspected is determined using the pattern information or the outline information of the height-binarized image obtained by mapping one of the components.

1 is a block diagram of a component mounting detection apparatus according to an embodiment of the present invention.
2 is a flowchart illustrating an operation of the method for detecting whether a component is mounted according to an embodiment of the present invention.
FIG. 3 is a flow chart of the operation of the reference height setting step in FIG. 2
Fig. 4 is an operation flowchart of an example of the step of determining whether the inspection part exists in the inspection area for the inspection part in Fig.
5 is a view showing an example of the structure of image data photographed in the photographing operation of the image obtaining unit according to an embodiment of the present invention.
Fig. 6 is a view for explaining an operation for determining an inspection area for inspection parts based on the inspection parts in Fig. 4; Fig.
FIG. 7 is a view illustrating an example of a screen in which a region of interest is displayed in an inspection area for a component to be inspected in the component mounting apparatus according to an embodiment of the present invention. FIG.
Fig. 8 is an operational flowchart of another example of the step of determining whether the inspection part exists in the inspection area for the inspection part in Fig. 2;
9 is a view showing an example of a height binary image in the component mounting detection apparatus according to an embodiment of the present invention.
10 is a diagram illustrating an example of a height binary mapping image in the component mounting detection apparatus according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other features and advantages of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings in which: FIG. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.

It is to be understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, but it should be understood that there may be other elements in between do.

Hereinafter, a component sensing apparatus and a control method thereof according to an embodiment of the present invention will be described with reference to the accompanying drawings.

In the following, a component sensing apparatus and a control method thereof for detecting whether or not a component is present at a corresponding position of a printed circuit board are described as one embodiment. However, the present invention is not limited thereto, But it is also applicable to detect the presence of a component at a corresponding position of another device or a substrate.

1, a part sensing apparatus according to an embodiment of the present invention includes a two-dimensional image storage unit 11 storing two-dimensional image data of a test part, three-dimensional image data of a test part The three-dimensional image storage unit 12 stores the position information of each part to be mounted on the printed circuit board to be inspected (this part is referred to as a 'mounting part'), A position judging unit 20 connected to these storage units 11-13 and a storage unit 21 connected to the position judging unit 20 and a position judging unit 20 And an output unit 30.

The two-dimensional image data is a two-dimensional image data composed of red image data, green image data, and red image data obtained by the operation of the image data acquisition unit such as a camera when one of red light, green light, 2D) color image data.

When a light of a corresponding color (e.g., red light, green light, or blue light) is irradiated to a corresponding region of the printed circuit board to be inspected, the image data obtaining unit photographs the corresponding region and obtains red image data, Or blue image data, and stores the acquired color image data in the storage unit 11 as two-dimensional image data.

Accordingly, the two-dimensional image storage unit 11 stores image data (i.e., tone values) for a plurality of pixels PXn, m arranged in a matrix structure obtained by the operation of the image data obtaining unit.

Here, n and m are positive natural numbers, (PXn, m) are pixels located in the nth row and mth column, and the image data are image data of different colors, for example, red image data, Image data and blue image data, and each pixel PXn, m may be a pixel having image data of different colors, for example, a red pixel having red image data, a green pixel having green image data, And may be one of blue pixels having blue image data.

The three-dimensional image data is obtained by extracting image data of each pixel (PXnm) obtained from the corresponding region by photographed operation of the image data acquiring unit when the laser light or the like is irradiated to the corresponding region of the printed circuit board, Is a height value for the corresponding area (i.e., each pixel PXn, m existing in the corresponding area).

Accordingly, the three-dimensional image storage unit 12 stores height values corresponding to the respective pixels PXn, m corresponding to the corresponding printed circuit board.

Since the pixel position of all the parts to be mounted at each position of the PCB and the height value which is the height information of each pixel are stored in the component position and size storage unit 13, The position of the theoretical region, which is the area where the inspection component is to be mounted on the printed circuit board, and the height information that the inspection component should have, can be known using the stored data of the size storage unit 13. [

The position judging section 20 judges whether or not there is a desired part, that is, a test part, in the corresponding area of the printed circuit board by using the data stored in these storage parts 11-13.

To this end, the position determining unit 20 determines an inspection area (i.e., inspection area for inspection parts) for the inspection part based on the theoretical area where the inspection part should be located, To determine the pure base region of interest excluding the overlap region overlapping the region of interest.

The region of interest includes a base region of interest for determining the reference position, a region of interest for the component to inspect the mounting state, a pad region of interest for testing the pad's attachment state, a solder region of interest for testing the soldering condition, A lift region of interest for determining the lifting degree of the component, and the like, and the ROI is determined according to the inspection items of the inspection component.

At this time, since the mounting position, the pad position, the mounting method, and the like are different for each inspection part, the types and the number of the ROIs determined according to the types of the inspection parts are different.

Then, the position determining unit 20 calculates the height value of the pixel existing in the pure base interest region, that is, the pixel value of the pixel in the pure base interest region using the height value of each pixel stored in the three- It is determined whether a height value exists.

If there is a height value for the pure base interest region, the position determining unit 20 aligns the height values of at least one pixel existing in the pure base interest region, arranges them in a line, (Hereinafter, referred to as a "middle height value") is determined, and this intermediate height value is set as a reference height for determining the bottom position which is the reference position of the inspection part.

Then, a height threshold is set with reference to the reference height and the height of the inspection component, and the three-dimensional image data of the inspection region of the component is binarized on the basis of the height threshold, (Hereinafter referred to as " current height binarized image data ") for the pixels of the current frame TRG.

For example, the current height may be binarized so that the value of the three-dimensional image data has a pixel value of 255 for a pixel higher than the height threshold value and the pixel value of the pixel having the value of the three- (See Fig. 9), and this current height-binarized image data is made up of 8 bits.

Then, the position determining unit 20 extracts a contour pixel (hereinafter, referred to as a 'current contour pixel'), which is contour information of the inspection part, using the current height-binarized image data, The reference contour pixel and the current contour pixel are compared to determine whether or not the inspection component is currently mounted in the inspection area for the inspection component.

The storage unit 21 is a storage medium for storing data necessary for the operation of the parts sensing apparatus or data generated during operation and includes a region of interest corresponding to the inspection component, a position information of the reference contour pixel, a current height binarized image data, Various information such as position information of a pixel, position information of a pixel with respect to various image data such as short channel image data, and the like are stored.

The output unit 30 is a display output device for outputting an image corresponding to the image data output from the position judging unit 20 under the control of the position judging unit 20. [

The output unit 30 may be a liquid crystal display (LCD), an organic light emitting diode (OLED) display, or the like.

Next, the operation of the position determination section 20 will be described with reference to Figs. 2 to 7. Fig.

First, when the power source necessary for the operation of the parts sensing apparatus is supplied and the operation of the parts sensing apparatus is started, the operation of the position determining unit 20 is also started (S10).

As shown in FIG. 4, the two-dimensional image storage unit 11 and the three-dimensional image storage unit 12 are connected to a pixel PXn, m corresponding to a corresponding printed circuit board It is assumed that two-dimensional image data and three-dimensional image data are stored.

In Fig. 5, hatched portions represent pixels corresponding to the portions on which the components are mounted, and blank space portions represent pixels corresponding to portions on which the components are not mounted.

The position determination section 20 first determines the position of the inspection component 100 using the data stored in the component position and height storage section 13 to determine the position of the printed circuit board on which the inspection component 100 should be positioned, The positional information of the theoretical area THRG to be positioned (that is, the position value of the pixel where the inspection part 100 should be located) is read and the theoretical area THRG of the inspection part 100 is determined (S11) .

Information on the inspection part 100 is input to the position determination part 20 by the user through an input part (not shown), and the position determination part 20 determines the inspection part 100 among the plurality of inspection parts .

At this time, the theoretical area THRG for the inspection part 100 is the area to which the inspection part 100 should be positioned, as described above, and the leftmost upper pixel located at the upper left leftmost, the uppermost leftmost pixel located at the lower left The left upper pixel located at the upper left corner, the upper left pixel located at the upper left corner, the upper right pixel located at the upper right corner, and the lower right pixel positioned at the lower right corner.

For example, in FIG. 5, when the part located on the upper part of the printed circuit board is the inspection part 100, the upper left pixel for the inspection part 100 is (PX 10 , 7 ) The pixels are (PX 10 , 12 ), the rightmost top pixel is (PX 12 , 7 ) and the rightmost bottom pixel is (PX 12 , 12 ).

Therefore, the rectangular region formed by vertices of these pixels [(PX 10 , 7 ), (PX 10 , 12 ), (PX 12 , 7 ), (PX 12 , 12 )] becomes the theoretical region THRG.

When the theoretical area THRG for the inspection part 100 is determined, the position determining part 20 extends the range of the set value (for example, 1 mm or the set number of pixels) around the theoretical area THRG, (S12).

As an example for determining the inspection region for inspection parts TRG, the position determining section 20 determines the position of the inspection region TRG from the leftmost row and the rightmost row of the theoretical region THRG to the set value (or, And extends the range from the uppermost row and the lowermost row of the theoretical area THRG to the set value (or from the upper side to the lower side by the set number of pixels).

Then, the position determining unit 20 determines the four pixels located at the vertex in the area extended around the theoretical area THRG, and sets the area of the rectangle formed by using these four pixels as the vertices as the inspection part inspection Region (TRG).

6, after the theoretical region THRG for the inspected component 100 is determined, the pixel values of the pixels P0, ..., P3 from the leftmost pixel, the rightmost pixel, the topmost pixel, and the bottommost pixel of the theoretical region THRG, by the number as many as six pixels expand the area in that direction, the four pixels located at each vertex [(PX 4, 1), (PX 4, 18), (PX 18,1), (PX 18,18 )] and the set of these four pixels [(PX 4, 1), (PX 4, 18), (PX 18,1), (PX 18,18)] the area of the rectangle formed by the examination part ( 100) for the inspection parts.

When the inspection region TRG for the inspection component 100 is determined as described above, the position determination section 20 determines the pure base region of interest for the inspection region TRG for the inspection component, (S13). The reference height is set for determining whether or not there is a < / RTI >

This reference height setting operation will be described below with reference to Fig.

When the operation of the position determining unit 20 is passed to the reference height setting step S13, the position determining unit 20 determines, from the information on the region of interest (ROI) stored in the storage unit 31, The position of the region of interest with respect to the inspected component 100 is determined by reading information about the region of interest for the inspected component 100 in step S131, (S132).

In the example shown in Fig. 7, the region of interest displayed in the inspection region for inspection parts TRG through the output unit 30 is a total of five regions of interest, and includes one material ROI 11, (ROI 121, ROI 122) and two base interest regions (ROI 131, ROI 132).

Next, the position judging section 20 judges whether or not the position of the ROI11, ROI121, ROI122, ROI131, ROI132, ROI11, ROI121, ROI122, (ROI132, ROI132)] to determine an overlap area overlapping another ROI11, ROI121, ROI1222 among the base ROI131 and ROI132 (S133).

Then, the position determining unit 20 extracts the base interest region IBRG of the pure base interest region excluding the overlap region in the base interest region (ROI 131, ROI 132), that is, the base interest region that does not overlap with the other interest region, The position information on the pure base interest area IBRG is stored in the storage unit 21 (S134).

The position determining unit 20 then calculates a height value corresponding to the pure base interest region IBRG using the height value of each pixel stored in the three-dimensional image storage unit 12, that is, It is determined whether there is a height value for a pixel existing in the IBRG (S135).

If there is no height value corresponding to the pure base interest area IBRG (S135), the position judging section 20 ends the operation (S300).

However, if the height value corresponding to the pure base interest region IBRG exists in the three-dimensional image storage unit 12 (S135), the position determination unit 20 determines that at least one After arranging the height values of the pixels in a line and arranging them, the middle height value, which is the height value of the pixel located in the middle portion, is determined (S136).

For example, assuming that there are seven pixels existing in the pure base interest area IBRG and that a height value exists for each pixel, the operation of the position determining section 20 for determining the intermediate height value is as follows: same.

The position determining unit 20 arranges the height values of the pure base interest region IBRG in a line with reference to the positions of the corresponding pixels.

For example, seven height values (z1, z2, z3, z4, z5, z6, z7) is present and the position of the pixel having these height values, respectively (PX 1,2), (PX 1 , 3), (PX 1, 4), ( PX 2, 1), (PX 2, 2), when the (PX 3,1) and (PX 3, 3), arranged in a line of seven height values (z1-z7) Z2-z3-z4-z5-z6-z7, the height value z4 of the middle pixel [(PX 2 , 1 )] is the middle height value.

When the intermediate height value in the pure base attention area IBRG is determined as described above, the position judging section 20 sets the determined intermediate height value to the reference height of the inspection part 100 (S137).

2, when the reference height is determined by using the height value of the pixel located in the pure base interest area IBRG, the position determining unit 20 determines the inspection area for the inspection component (I.e., the three-dimensional image data for the pixel) existing in the current height TRG of the inspection object TRG, And stores the generated image data in the storage unit 21 (S14).

For the height binarization processing of the three-dimensional image data of the pixels existing in the inspection region for inspection parts TRG, the position judging section 20 first determines whether or not the height corresponding to the setting ratio (for example, 80% The height is calculated and the calculated height is added to the reference height to calculate a height threshold. When the height of each pixel existing in the inspection region for inspection parts TRG is higher than the height threshold value, the height binary image data sets the brightness value (i.e., gray level value) of the corresponding pixel to 1 (= 255) , The brightness value of the corresponding pixel is set to '0 (= 0)' to generate the current height binary image data.

By this height binarization operation, the binarization value for the pixel where the inspection part 100 is located becomes '1 (= 255)', and the binarization value for the pixel where the inspection part 100 is not positioned is '0' do.

Next, the position determining unit 20 determines the position of the contour of the inspection part 100 using the current height-binarized image data, and determines whether the inspection part 100 is positioned within the inspection area for the inspection part (S15).

Next, referring to Fig. 4, an example of an operation of determining whether the inspection component 100 is present using the current height-binarized image data will be described.

As shown in FIG. 4, the position determining unit 20 determines whether the pixel indicating the outline information of the inspected component 100 (that is, the difference between the pixels in the two-dimensional image data (I.e., a pixel whose value is greater than the set value), and stores the positional information on the determined contour pixel in the storage unit 21 (S151).

In this example, the position determining unit 20 determines a pixel whose binarized brightness value changes from '0' to '1' or from '1' to '0' as the current outline pixel.

Then, the position determining unit 20 determines whether or not the position of the reference contour pixel for the target component already stored in the storage unit 21 and the position of the current contour pixel determined using the current height binarized image data for the inspected component 100 And calculates the position matching rate of the pixel of the reference contour line and the pixel of the current contour line (S152).

The position judging section 20 judges whether the calculated position judging ratio is equal to or higher than a preset ratio (S153).

In this example, the reference contour pixel is a contour pixel calculated through the operation up to step S151 in Figs. 2 to 4 when the same part , And is used as a reference pixel for determining whether the inspection part 100 exists in the corresponding area.

If the position matching rate of the two contour pixels is equal to or larger than the set ratio (S153), the position determining section 20 determines that the mounting position of the inspected component 100 is mounted at the substantially same position as the mounting position of the target component, It is determined that the inspection component 100 is currently mounted on the component inspection region TRG (S154).

However, if the position matching rate of the two contour pixels is less than the set ratio, the position judging section 20 judges that the inspection component 100 is not currently mounted on the inspection part for inspection component TRG (S155).

According to this embodiment, when determining whether or not the inspection part 100 is present, since the reference position, that is, the bottom position of the printed circuit board is accurately detected using the height value of the pixels belonging to the pure base interest area, The presence or absence of the component 100 is confirmed.

In the case of using only two-dimensional (2D) image data having no height value for each pixel and having only a tone value for each pixel, when there exists a part having the same color as the bottom color, A problem has occurred.

However, in the case of this embodiment, as described above, after determining the bottom position, the presence or absence of the inspection part is determined according to whether or not the height value is equal to or higher than the set ratio with reference to the bottom position. Thus, in this example, the presence of the inspection part is determined more accurately regardless of the bottom color and the color of the inspection part.

Next, referring to FIG. 8, after the height binary processing for the height value of the pixel existing in the inspection region for inspection parts TRG is completed and the current height binary image data is generated, 100) will now be described.

In this example, the position determining unit 20 determines the current contour pixel by using the current height-binarized image data. However, unlike the case described with reference to FIG. 4, the present example is a pixel for red, (That is, the image data of the set color extracted from the image data of different colors) for one pixel out of the pixels for blue color is converted into the effective area of the current height binarized image data (i.e., "1" The calculated contour pixel is extracted by using a height-binarized image obtained by mapping only the contour pixel area (i.e., the calculated pixel area).

The height binary mapping image is an image created by replacing a pixel having a pixel value of a height binarized image of 255 with a pixel value of one of the three channel data of a color image. FIG. 10 shows an example of this height binary mapping image / RTI >

As described above, since the two-dimensional image data is for displaying a color image, each pixel is one of a red pixel having red image data, a green pixel having green image data, and a blue pixel having blue image data, Pixels having these different colors (red, green, and blue) are positioned adjacent to each other.

Accordingly, the colors determined by the respective tone values of the red pixel, the green pixel, and the blue pixel, which are a plurality of pixels located adjacent to each other with different colors, are displayed. In this example, a plurality of pixels (for example, red pixels, green pixels, and blue pixels) having different colors and located adjacent to each other are referred to as one pixel group.

After generating the current height binarized image data, the position determining unit 20 extracts only one pixel (for example, red pixel) having a predetermined color (e.g., red) in each pixel group, (Red pixel) are stored in the storage unit 21 in step S1521.

Then, the position determining unit 20 maps the selected short channel image data to the effective pixel region of the current height-binarized image data to generate a height-heightened binary image (S1522).

At this time, in order to partially map the short channel image data to the height binary image data, the position decision unit 20 ignores the pixels (for example, black pixels) whose value of the height binarized image data is' 0 (= 0) And the value of the pixel is changed only for a pixel (for example, a white pixel) whose data value of the height-binarized image is '1 (= 255)'. That is, the value of the pixel having the data value of '1' in the height binarized image is replaced with the value of the short channel image data (that is, the tone value) for the pixel in the same position, ) Is generated.

Therefore, the position determining unit 20 determines the current contour pixel of the inspection part using the thus obtained height-binarized image (Textured height thresholded binary image) (S1523).

To this end, the position determining unit 20 can determine the current outline pixel of the pixel whose difference in gray level value between adjacent two pixels is equal to or larger than the set value in the height-binarized image (Textured height thresholded binary image).

Then, the position judging section 20 compares the position of the pixel of the reference contour line with respect to the target part already stored in the storage section 21 and the position of the pixel of the current contour line with respect to the inspection part 100, The position matching rate of the contour pixel is calculated (S1524).

The position judging section 20 judges whether the calculated position judging ratio is equal to or higher than a preset ratio (S1525).

In this example, the reference contour pixel is calculated using the height-thresholded binary image in the same manner as described above when the target part, which is the same part as the inspection part 100, is normally located in the theoretical area It is a contour pixel corresponding to the target part.

If the matching rate of the two contour pixels is not less than the set ratio (S1525), the position judging section 20 judges that the inspection component 100 is mounted on the inspection component for inspection component TRG (S1526).

However, if the position matching rate of the two contour pixels is less than the set ratio, the position judging section 20 judges that the inspection part 100 is not currently mounted on the inspection part for inspection part TRG (S1527).

In this case, since the outline position of the inspection part 100 is determined by using the height-binarized image, the data lower than the height threshold value that can be ambiguous to the determination in the inspection area can be ignored, The accurate position is determined, and the position of the inspection part 100 is more accurately confirmed.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It belongs to the scope of right.

11: two-dimensional image storage unit 12: three-dimensional image storage unit
13: part position and height storage unit 20: position determination unit
21: Storage part THRG: Theoretical area
TRG: Inspection area for inspection parts IBRG: Base area of interest
ROI11, RO121, ROG122, ROG311, ROG312: ROI

Claims (8)

A two-dimensional image storage unit storing image data of different colors for the inspection part;
A three-dimensional image storage unit for storing height values of pixels of the inspection part;
A component position and height storage unit for storing positional information and height values of the mounted component;
A reference height is set after determining the inspection area for the inspection part based on the theoretical area to which the inspection part is to be positioned and connected to the three-dimensional image storage part and the part location and height storage part, The control unit generates a current height binarized image data for a pixel in the inspection region for the inspection object by binarizing a height value of a pixel existing in the interest region for the inspection object, And judges that the inspection component exists in the inspection component inspection area if the matching rate of the reference contour pixel and the current contour pixel is equal to or larger than a set value; And
And an output unit for outputting an image corresponding to the image data output from the position determining unit,
Wherein the position determining unit extracts image data of a predetermined color from the image data of different colors to generate short channel image data, and partially maps the short channel image data to the current height binarized image data to generate a height binary mapping image And a pixel having a difference in gray level value between adjacent two pixels in a textured height thresholded binary image is determined as a current contour pixel. Sensing device. The method of claim 1,
Wherein the position determining unit determines a pixel whose value of the current height binarized image data changes from '0' to '1' or from '1' to '0' as the current contour pixel. delete The method of claim 1,
Wherein the position determination unit reads the information on the region of interest of the inspected component to determine a pure base region of interest that does not overlap with another region of interest in the base region of interest for determining the reference position, And setting a reference height of the inspection part as a middle height value of a height value of a pixel existing in the pure base interest area if a height value of the pixel existing in the pure base interest area exists using the height value Features of component mounting detection. Determining an inspection area for the inspection part based on a theoretical area where the inspection part should be located;
Setting a reference height for the inspection area for the inspection part;
Binarizing a height value of a pixel existing in a region of interest for the inspection object using the reference height to generate a current height of the pixel of the inspection region for the inspection object;
Determining a current contour pixel located on an outline of the inspection part using the current height binarized image data; And
And determining that the inspection component exists in the inspection component inspection area if the matching rate of the reference contour pixel and the current contour pixel is equal to or greater than a set value,
Wherein the determining of the current contour pixel comprises:
Generating short channel image data by extracting image data of a set color from image data of different colors stored in the two-dimensional image storage unit; And
And generating a height-binarized image by partially mapping the short-channel image data to the current height-binarized image data to generate a height-binarized image. The method of claim 5,
Wherein the current contour pixel determination step determines a pixel whose value of the current height binarized image data changes from '0' to '1' or from '1' to '0' as the current contour pixel. Whether the control method of the sensing device. delete The method of claim 5,
Wherein the setting of the reference height comprises:
Determining a pure base region of interest that does not overlap with another region of interest in a base region of interest for reading information about a region of interest of the inspected component to determine a reference position;
Determining whether a height value of a pixel existing in the pure base interest region exists using a height value stored in the three-dimensional image storage unit; And
And setting a reference height of the inspection part as a middle height value of a height value of a pixel existing in the pure base interest area if a height value of the pixel existing in the pure base interest area is present A control method of the component mounting detection device.
KR1020150182999A 2015-12-21 2015-12-21 Apparatus for determining component mounting and method for controlling the same KR101770186B1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002303590A (en) * 2001-04-05 2002-10-18 Matsushita Electric Ind Co Ltd Inspection method and inspection device for mounted component
JP2010230421A (en) * 2009-03-26 2010-10-14 Nakanihon Highway Engineering Nagoya Kk Method of dividing region of concrete image

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002303590A (en) * 2001-04-05 2002-10-18 Matsushita Electric Ind Co Ltd Inspection method and inspection device for mounted component
JP2010230421A (en) * 2009-03-26 2010-10-14 Nakanihon Highway Engineering Nagoya Kk Method of dividing region of concrete image

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