KR101766358B1 - A Semiconductor Element Type of a Lighting Module Having a Structure of a Lighting Regulating Lens and a Radiating Hole - Google Patents

Abstract

The present invention relates to an illumination module in the form of a semiconductor element of a dimming adjusting lens and a heat dissipating hole structure and more specifically to a lighting module in the form of a light emitting module, To an illumination module in the form of a semiconductor element having a dimming adjusting lens and a heat dissipating hole structure with improved efficiency. The illumination module in the form of a semiconductor element of the dimming control lens and the heat dissipating hole structure includes the base substrate 11a, 11b, and 11c having extended surfaces at different angles with respect to the dimming plane; A plurality of light emitting modules (LM1, LM2, LM3) arranged to emit light in a direction perpendicular to the arrangement plane of the base substrates (11a, 11a, 11c); An adjusting lens 12 for transmitting the element light emitted from each of the light emitting modules LM1, LM2 and LM3 in a predetermined direction; A heat dissipation module 14 coupled to the base substrates 11a, 11b, and 11b; And at least one heat radiation holes 161 and 162 formed in the base boards 11a, 11b and 11c.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an illumination module in the form of a semiconductor device having a dimming adjusting lens and a heat dissipating hole structure,

The present invention relates to an illumination module in the form of a semiconductor element of a dimming adjusting lens and a heat dissipating hole structure and more specifically to a lighting module in the form of a light emitting module, To an illumination module in the form of a semiconductor element having a dimming adjusting lens and a heat dissipating hole structure with improved efficiency.

BACKGROUND ART Light emitting devices in the form of various types of semiconductor elements including an LED element have been applied to various industrial fields. For example, due to various advantages including low voltage driving characteristics or small power consumption, an LED device corresponding to a semiconductor device emitting light has been increasingly applied in the field of illumination. The LED illumination is generally made through a chip process for forming a light emitting layer, a package forming process for placing a chip on a printed circuit board, and a module process for connecting a package to a driving circuit. In addition, LED package can be made by SMD (Surface Mounted Devices) method and COB (Chip on Board) method, and it is known that COB method is advantageous for heat radiation function and outdoor lighting requiring high power over a long period of time. Various technologies for improving the heat dissipation characteristics and the light condensing efficiency in relation to the LED light module are known.

Patent Registration No. 10-1408824 discloses a plurality of heat-dissipating fins and an LED light-emitting device in which a heat-insulating adhesive is applied to the upper surface of the base and the heat-dissipating fin is attached and fixed to the base by a thermal adhesive. Patent Publication No. 10-2012-0011690 discloses an LED light source in which a coupling portion of a lens is coupled to a fixing portion through a defect groove formed in a substrate and a heat sink, and a lens, a substrate, and a heat sink are integrally combined. Patent No. 10-1256348 discloses an LED straight tube lamp in which the contact area between the heat dissipating body and the outside air is increased while maintaining the size of the heat dissipating body.

The prior art discloses a method for improving the contact area with respect to the air for improving the heat dissipation efficiency while the lens is being applied in order to increase the light condensing efficiency of the LED lighting module. However, the efficiency with which the irradiation direction of the light emitting module is adjusted with the lens can be improved. Also, although the heat dissipation can be improved when the heat of the heat source is quickly released to the outside, the prior art does not disclose an LED lighting module having such a structure.

The present invention has been made to solve the problems of the prior art and has the following purpose.

Prior Art 1: Patent Registration No. 10-1408824 (published on June 19, 2014, True Wide Co., Ltd.) LED light and its manufacturing method Prior Art 2: Patent Publication No. 10-2012-0011690 (published by JW Wiley Bioscience Co., Ltd., February 08, 2012) LED light-emitting diode Prior Art 3: Patent Registration No. 10-1256348 (Lee Min-soo, Announcement on April 25, 2013) LED straight tube lamp with lens-type cover and semi-open heat dissipation structure

SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor light emitting device having a plurality of semiconductor light emitting elements such as a plurality of LED elements irradiated in different directions and having a dimming region controlled by an adjusting lens, Type lighting module.

According to a preferred embodiment of the present invention, there is provided a liquid crystal display comprising: a base substrate having extending surfaces at different angles with respect to a light modulation plane; A plurality of light emitting modules arranged to emit light in a direction perpendicular to an arrangement plane of the base substrate; An adjusting lens for transmitting the element light emitted from each light emitting module in a predetermined direction; A heat dissipation module coupled to the base substrate; And at least one heat dissipating hole formed in the base substrate.

According to another preferred embodiment of the present invention, the base substrate is a flexible substrate or a plurality of sub-bases capable of adjusting the angle.

According to another preferred embodiment of the present invention, there is further provided a transfer substrate for fixing a heat dissipation module coupled to a base substrate, wherein the transfer substrate is formed of a heat deformable material.

According to another preferred embodiment of the present invention, the conditioning lens has a different transmission angle for each light emitting module.

The light emitting module according to the present invention has a light emitting module in the form of a semiconductor element arranged in a circular shape with respect to the light modulation plane so that the light transmission direction is adjusted in the adjustment lens according to the irradiation direction of the light emitting module. The illuminating module according to the present invention adjusts the illuminating direction according to the arrangement position of the light emitting module, so that light dimming suitable for the use can be performed. Further, in the lighting module according to the present invention, a heat dissipating hole is formed in the base substrate or the element disposition substrate to allow the cooling air to flow, thereby increasing the heat dissipation efficiency.

1 shows an embodiment of an arrangement structure of a plurality of light emitting modules in an illumination module in the form of a semiconductor element according to the present invention.
Fig. 2 shows an embodiment of a heat dissipation hole arranged in a base substrate in a lighting module according to the present invention.
3 shows an embodiment of a heat dissipation structure applied to a lighting module according to the present invention.
FIG. 4 illustrates an embodiment in which the light emitting module having different illumination directions in the illumination module according to the present invention adjusts the light condensation in the adjustment lens.
Figure 5 shows an embodiment of the structural characteristics of a lighting module according to the invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the embodiments shown in the accompanying drawings, but the present invention is not limited thereto. In the following description, components having the same reference numerals in different drawings have similar functions, so that they will not be described repeatedly unless necessary for an understanding of the invention, and the known components will be briefly described or omitted. However, It should not be understood as being excluded from the embodiment of Fig.

1 shows an embodiment of an arrangement structure of a plurality of light emitting modules in an illumination module in the form of a semiconductor element according to the present invention.

1, a lighting module in the form of a semiconductor element of a dimming adjusting lens and a heat dissipating hole structure includes a base substrate 11a, 11b, and 11c having extending surfaces at different angles with respect to a light modulation plane IA; A plurality of light emitting modules (LM1, LM2, LM3) arranged to emit light in a direction perpendicular to the arrangement plane of the base substrates (11a, 11a, 11c); An adjusting lens 12 for transmitting the element light emitted from each of the light emitting modules LM1, LM2 and LM3 in a predetermined direction; A heat dissipation module 14 coupled to the base substrates 11a, 11b, and 11b; And at least one heat radiation holes 161 and 162 formed in the base boards 11a, 11b and 11c.

The base boards 11a, 11b, and 11c may include printed circuit boards or similar circuit boards, and may include various electrical elements, electrical components, or circuit patterns that electrically connect them, . Further, a control unit for operating the light emitting module may be disposed on the base substrates 11a, 11b, and 11c.

The base substrates 11a, 11b and 11c may have angular extension surfaces with respect to the light modulation plane IA, and the light modulation plane IA may be a planar area illuminated by a semiconductor element such as an LED element it means. Extension surfaces at different angles can be formed by a plurality of base substrates 11a, 11b, and 11c made of a flexible material or bonded at different angles. When a substrate is made of a flexible material, the flexible material may be formed into a curved shape as a whole, or may be formed in a bent structure at different points. When the base boards 11a, 11b, and 11c are formed by a plurality of sub-base boards, the base boards 11a, 11b, and 11c may be connected at different angles as shown in FIG. Specifically, one base substrate 11a extends parallel to the light modulation plane IA and two base substrates 11b are coupled to one base substrate 11a so as to extend at a different angle from the one base substrate 11a . The three base substrates 11c may be coupled to one base substrate 11a so as to extend at the same or different angles as the two base substrates 11b. The light emitting modules LM1, LM2, and LM3 may be disposed on the base substrates 11a, 11b, and 11c having portions extending at different angles with respect to at least one light control plane IA.

Each of the light emitting modules LM1, LM2 and LM3 may include at least one LED element and the element light emitted from each of the light emitting modules LM1, LM2 and LM3 may be perpendicular to the plane . Thus, the respective light emitting modules LM1, LM2, LM3 irradiate the element light in different directions.

Each of the light emitting modules LM1, LM2, LM3 may include at least one semiconductor element, and the semiconductor elements may be disposed in the lead frame or independently arranged. In this specification, a semiconductor device may include various types of semiconductor light emitting devices for converting power energy into light, for example, an LED light emitting device. The light emitting modules LM1, LM2, and LM3 refer to a unit including at least one semiconductor light emitting element and formed in a package form. For example, each of the light emitting modules LM1, LM2, and LM3 may be formed in a form integrated with a substrate in a COB (Chip-On-Board) structure. In addition, the light emitting modules (LM1, LM2, LM3) can have various uses such as a reflector illumination (MR), a downlight illumination, a security illumination, a streetlight illumination, a tunnel illumination, an industrial illumination, an indoor illumination, The LED illumination module according to the present invention can be used for various purposes.

Element light irradiated from each of the light emitting modules LM1, LM2 and LM3 can be incident on different positions of the adjusting lens 12. [ The conditioning lens 12 may be made of glass or similar material, but is not limited thereto. For example, the adjustable lens 12 may be made of a material such as transparent plastic for ease of assembly. The adjustment lens 12 may have different thicknesses at different portions, have different focal lengths, or have different curvature radii. The adjustment lens 12 may have different foci corresponding to the number of light emitting modules LM1, LM2, and LM3, for example. But may have a different number of focuses depending on the use of the LED lighting module or the characteristics of the light modulation plane IA.

The base boards 11a, 11b and 11c can be fixed to the appropriate arrangement frame 13 and the protection case 15 can be coupled to the arrangement frame 13. [ The placement frame 13 may be formed in various structures that structurally connect the base boards 11a, 11b, and 11c to the heat dissipation module 14 while fixing the base boards 11a, 11b, and 11c. The protective case 15 can be constructed in such a structure that the base substrates 11a, 11b and 11c, the light emitting modules LM1, LM2 and LM3 and the adjusting lens 12 can be accommodated therein. The inner surface of the protective case 15 may also be a reflective coating or a diffusion coating. The outer surface of the protective case 15 may be made into a structure that can prevent the inflow of rainwater into the antifouling coating.

The heat dissipation module 14 can be coupled to the upper side of the protection case 15 or the upper side of the arrangement frame 13. [ The heat dissipation module 14 can be disposed regardless of whether or not there is a heat sinker installed in each of the light emitting modules LM1, LM2, and LM3. However, if a heater sink is provided in each of the light emitting modules LM1, LM2, and LM3, it may have a structure in which the heat sink is interlocked with the heat sink. For example, the heat dissipation module 14 may be formed in a structure in which hot air derived from a heater sink is led to the heat dissipation module 14. [ The structure of the heat dissipation module 14 is described below again.

1, two base substrates 11b and three base substrates 11c are provided on both sides of one base substrate 11a by connection control units 111 and 112, respectively, Can be combined. 2 and 3 base boards 11b and 11c may be coupled to one base board 11a so as to be adjustable by one or two connection adjustment units 111 and 112, respectively. The light emitting modules LM1, LM2 and LM3 fixed to the respective base substrates 11a, 11b and 11c are arranged in a direction perpendicular to the plane of the base substrates 11a, 11b and 11c, ). ≪ / RTI > The adjusting lens 12 disposed below the base substrates 11a, 11b and 11c may have a function of guiding the illumination lights R1, R2 and R3 emitted in different directions in a predetermined direction. For example, the adjustment lens 12 can be made such that the center portion is relatively thick and has a small radius of curvature, with both portions having a relatively small thickness and a large radius of curvature. If the adjustment lens 12 has a circular shape as a whole, the center portion may be formed as a concave spherical surface and formed to have a larger radius of curvature as it moves away from the center.

The heat dissipating holes 161 and 162 may be formed in the base substrates 11a and 11b and the heat dissipating holes 162 may be formed in the base substrates 11a and 11b have. Further, the heat dissipating holes 161 and 162 may be formed in an inclined structure with respect to the plane of the base substrates 11a, 11b, and 11c. These inclined heat dissipating holes 161 and 162 are formed by the hot air of the upper portion in the space formed by the adjusting lens 12 and the base substrates 11a and 11b and 11c slowly along the heat dissipating holes 161 and 162 So that the gas layer in the lower portion is stably maintained.

1, the two base substrates 11b and the three base substrates 11c can be coupled to be inclined upward by the connection adjusting units 111 and 112, The illumination lights R1, R2 and R3 from the modules LM1, LM2 and LM3 can be emitted in a direction perpendicular to the plane of the respective base substrates 11a, 11b and 11c. The heat dissipating holes 161 and 162 may be formed in an inclined direction with respect to the plane of the base substrates 11a, 11b, and 11c, and the inclination may be various angles or various directions. In the case where the illumination lights R1, R2 and R3 are emitted in such a manner that the illumination lights R1, R2 and R3 are diverged, when both ends of the adjustment lens 12 or the adjustment lens 12 are circular, And emission restriction portions 17a and 17c may be formed at the circular edge portions. As described above, the adjusting lens 12 may have different thicknesses depending on the direction of the illuminating light R1, R2, R3 to be reached, have different radius of curvature, or have different focal lengths.

The base substrate 11a, 11b, 11c or the adjustment lens 12 can be made into various structures according to the light modulation plane IA, and the present invention is not limited to the embodiments shown.

Fig. 2 shows an embodiment of a heat dissipation hole disposed in a base substrate in an LED lighting module according to the present invention.

2, the transfer substrate 21 may be disposed above the base substrate 11, and the heat dissipation module 14 may be coupled to the transfer substrate 21. Further, a light emitting module (LM) may be disposed on the base substrate (11). The plurality of heat dissipating holes 231 to 23N may be arranged to penetrate the base substrate 11 and the transfer substrate 21. [ Each of the heat dissipating holes 231 to 23N may be formed in the same or different structure. Each of the heat dissipating holes 231 to 23N may have a conical shape or the like and may have a structure in which the sectional area decreases from the lower side of the base substrate 11 toward the upper side of the transfer substrate 21. [ And an induction path 22 may be formed along the circumferential surfaces of the base substrate 11 and the transfer substrate 21. The induction path 22 may be formed so that air is guided vertically along the circumferential surface of the base substrate 11 from below the circumferential surface of the base substrate 11 and guided to the heat dissipation structure along the horizontal direction.

The transfer substrate 21 can be made of a thermal expansion material and heat is generated by the operation of the light emitting module LM so that the thermal expansion material is expanded when the temperature of the base substrate 11 or the transfer substrate 21 is raised So that the upper portions of the heat dissipating holes 231 to 23N can be opened and air can flow.

2, the connection regulating unit 111 includes a regulating member 111a extending in a plate shape and capable of being bent at an arbitrary angle, a cylindrical member 111b formed on both edges of the regulating member 111a, And fixed jigs 111b and 111c extending to the opposite side. The fixing jigs 111b and 111c may be formed with insertion fixing grooves on the circumferential surface along the longitudinal direction of the cylinder shape. One edge portion of the base substrate 11a or 11b can be inserted and fixed to each of the insertion fixing grooves. By bending the adjusting member 111a at an arbitrary angle, the two base boards 11b can be joined to one base board 11a at an arbitrary angle. The three base substrates described above can also be coupled to one base substrate 11a at any angle by a connection control unit having the same or similar structure.

According to one embodiment of the present invention, the inlet holes 251 and 252 may be formed in the upper portion of the base substrate 11a or 11b or in the lower portion of the transfer substrate 21b or 24a. The heat dissipation holes 231 to 23N or 241 to 24K may be formed as a cone having a narrow width from the inlet holes 251 and 252 to the upper portions of the transfer substrates 21b and 24a or a similar shape. The transfer substrates 21b and 24a can be made of a thermal expansion material and when the temperature of the base substrates 21b and 24a is raised by the operation of the light emitting module LM, the transfer substrates 21b and 24a made of a thermal expansion material Thereby expanding. The external cold air can be introduced from the outside along the inlet holes 251 and 252 to cool the base substrates 11a and 11b or the transfer substrates 21b and 24a and be discharged to the heat dissipation module 14. [

The connection regulating unit 111 can be formed in various structures, and the inlet holes 251 and 252 can be formed in a plurality of directions in various directions in which air can be introduced from outside, and the present invention is not limited to the illustrated embodiment .

FIG. 3 shows an embodiment of a heat dissipation structure applied to an LED lighting module according to the present invention.

3, the heat dissipation module 14 may be disposed above the transfer substrate 21, and a fixing member 31 may be coupled to the upper portion of the heat dissipation module 14 to be fixed to the structure do. Specifically, the fixing member 31 is engaged with the fastening bracket 33, and the fastening means 34 is fastened to the fastening bracket 33, so that the lighting module can be coupled to the ceiling or the mounting post. If the fixing module is installed outdoors, protection means (32) for preventing rainwater or other foreign matter from entering the interior of the lighting module can be formed. The protection means 32 may be in the form of a roof as a whole, but is not limited thereto. Alternatively, the fixing member 31 may function as the protection means 32. [

The heat dissipation module 14 may include a plurality of heat dissipation boards 141 to 14N disposed in parallel with each other and each of the heat dissipation boards 141 to 14N may have a structure in which the area of the lower portion is large and the area of the upper portion is small Can be made. Specifically, the heat dissipation boards 141 to 14N may have a rectangular plate-shaped induction portion 141a having a constant width and a discharge portion 141b extending from one end of the induction portion 141a while being reduced in width. Due to the structure of the heat dissipation boards 141 to 14N, the hot air at the lower portion can be rapidly guided upward and discharged to the outside.

An inflow hole 251 may be formed below the transfer substrate 21 and a plurality of heat dissipation holes 231 to 23K may be formed through the transfer substrate 21 as described above. Each of the heat dissipating holes 231 to 23K may be located between the two heat dissipating substrates 141 to 14N.

The heat dissipation module 14 may have various structures and the present invention is not limited to the embodiments shown.

FIG. 4 illustrates an embodiment in which the light emitting module having different illumination directions in the illumination module according to the present invention adjusts the light condensation in the adjustment lens.

4, the element lights R11, R21, and R31 emitted in different directions by the light emitting modules LM1, LM2, and LM3 pass through the adjustment lens 12, , R32).

The adjustment lens 12 may be divided into regions where the element lights R11, R21, and R31 emitted from the respective light emitting modules LM1, LM2, and LM3 reach. However, the element light R11, R21, and R31 emitted from the respective light emitting modules LM1, LM2, and LM3 may reach all areas of the adjustment lens 12. [ Therefore, the division of the area can be classified into, for example, an area where 50 to 70% is reached based on light energy or roughness.

The adjusting lens 12 can be formed into a curved shape as a whole, and can be made to have different focal distances in the division areas D1, D2, and D3. Alternatively, the first division region D1 may be formed into a convex lens shape, and the second and third division regions D2 and D3 may be formed into a concave lens shape. With this structure, the adjustment lights R12, R22, and R23 transmitted through the respective division regions D1, D2, and D3 can be made to be parallel lights as a whole. The adjusting lens 12 may have various shapes, for example, when the entirety is a circular structure, the two and three division regions D2 and D3 may be the same region at the same distance from the center. However, they may be different regions when the inclination of the base substrate is different. In contrast, when the adjusting lens 12 has a polygonal structure as a whole, the second and third segment regions D2 and D3 may be different regions.

The inclination of the light emitting modules LM1, LM2, LM3 or the curved shape of the adjusting lens 12 can be set in various ways depending on the use of the illumination module or the setting of the light modulation area, and the present invention is not limited to the illustrated embodiment .

Figure 5 shows an embodiment of the structural characteristics of a lighting module according to the invention.

Referring to FIG. 5, a heat dissipation module 14 may be disposed above the base substrate 11. The base substrate 11, the light emitting module and the heat dissipation module 14 can be made into one independent subframe. And two subframes in which one subframe is received and coupled to the inside can be independently manufactured. 2 subframe includes, for example, an adjusting lens 12; A protective cover 52 to which the adjustment lens 12 is coupled; A housing 51 to which the protective cover 52 is coupled; And a fixing member 31 coupled to the upper portion of the housing 51.

One subframe including the semiconductor element light emitting package or the heat dissipation module 14 can be made by an independent manufacturing process. For example, a housing 51, a protective cover 52, which form two subframes; And the fixing member 31 are made of a synthetic resin material and joined to each other. One subframe is accommodated in the housing 51 and the adjustment lens 12 made of a synthetic resin is coupled to the protective cover 52 to complete the illumination module. Since the two subframes are made of a synthetic resin material, the appearance of the lighting module becomes beautiful, and the lighting module can be formed in various structures. Also, as described above, the heat radiation efficiency can be improved by forcibly introducing cooling air from outside or allowing air to flow through the heat dissipation holes.

The lighting module according to the present invention can be manufactured in various assembling methods by various materials and is not limited to the illustrated embodiment.

The light emitting module according to the present invention is arranged in a circular shape with respect to the light modulation plane so that the transmission direction is adjusted in the adjustment lens according to the irradiation direction of the light emitting module so that the light condensing efficiency is improved. The illuminating module according to the present invention adjusts the illuminating direction according to the arrangement position of the light emitting module, so that light dimming suitable for the use can be performed. Further, in the lighting module according to the present invention, a heat dissipating hole is formed in the base substrate or the LED disposition substrate to allow the cooling air to flow, thereby enhancing the heat dissipation efficiency. In addition, the lighting module according to the present invention may be made of a material such as an outer frame or a controllable lens, for example, plastic, so that the assembly convenience can be improved while having various appearance.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention . The invention is not limited by these variations and modifications, but is limited only by the claims appended hereto.

11: base substrate 11a, 11b, 11c: 1, 2, 3 base substrate
12: Adjustable lens 13: Batch frame
14: Heat dissipation module 15: Protective case
17a, 17c: emission restriction portion 21: transmission substrate
21b, 24a: transfer substrate 22: guide path
31: fixing member 32: protection means
33: fastening bracket 34: fastening means
51: housing 52: protective cover
111, 112: connection adjusting unit 111a: adjusting member
111b, 111c: Fixing jigs 141 to 14N:
141a: guide portion 141b: discharge portion
161, 162: heat dissipating holes 231 to 23N: heat dissipating holes
241 to 24K: heat dissipation holes 251, 252:
D1, D2, D3: 1, 2, 3 separation area IA: dimming plane
LM: Light emitting module LM1, LM2, LM3: Light emitting module
R1, R2, R3: illumination light R11, R21, R31: element light
R12, R22, R32: Adjusting light

Claims (4)

Base substrates 11a, 11b, and 11c having extending surfaces at different angles with respect to the light modulation plane;
A plurality of light emitting modules (LM1, LM2, LM3) arranged to emit light in a direction perpendicular to the arrangement plane of the base substrates (11a, 11a, 11c);
An adjusting lens 12 for transmitting the element light emitted from each of the light emitting modules LM1, LM2 and LM3 in a predetermined direction;
A heat dissipation module 14 coupled to the base substrates 11a, 11b, and 11b; And
And at least one heat radiation hole (161, 162) formed in the base substrate (11a, 11b, 11c)
And a transfer substrate 21 for fixing the heat dissipation module 14 coupled to the base substrates 11a, 11b and 11b. The transfer substrate 21 is made of a thermal expansion material, And a plurality of heat dissipating holes (231 to 23N) having a structure in which the cross sectional area decreases toward the upper surface. The lighting module according to claim 1, wherein the base substrates (11a, 11b, 11b) are flexible substrates or a plurality of sub-bases capable of adjusting the angle. delete The illumination module of claim 1, wherein the adjustment lens (12) has a different transmission angle for each light emitting module (LM1, LM2, LM3).

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