KR101761389B1 - 얇은 패드들 내의 몰딩 윈도우들 - Google Patents

얇은 패드들 내의 몰딩 윈도우들 Download PDF

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Publication number
KR101761389B1
KR101761389B1 KR1020127030038A KR20127030038A KR101761389B1 KR 101761389 B1 KR101761389 B1 KR 101761389B1 KR 1020127030038 A KR1020127030038 A KR 1020127030038A KR 20127030038 A KR20127030038 A KR 20127030038A KR 101761389 B1 KR101761389 B1 KR 101761389B1
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KR
South Korea
Prior art keywords
polishing
layer
polishing pad
window
recess
Prior art date
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KR1020127030038A
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English (en)
Korean (ko)
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KR20130088744A (ko
Inventor
보거스로우 에이. 스웨데크
도일 이. 베넷
도미니크 제이. 벤베그누
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
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Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20130088744A publication Critical patent/KR20130088744A/ko
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Publication of KR101761389B1 publication Critical patent/KR101761389B1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020127030038A 2010-04-16 2011-03-22 얇은 패드들 내의 몰딩 윈도우들 Active KR101761389B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/762,175 US8393940B2 (en) 2010-04-16 2010-04-16 Molding windows in thin pads
US12/762,175 2010-04-16
PCT/US2011/029468 WO2011129959A2 (en) 2010-04-16 2011-03-22 Molding windows in thin pads

Publications (2)

Publication Number Publication Date
KR20130088744A KR20130088744A (ko) 2013-08-08
KR101761389B1 true KR101761389B1 (ko) 2017-07-25

Family

ID=44788545

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127030038A Active KR101761389B1 (ko) 2010-04-16 2011-03-22 얇은 패드들 내의 몰딩 윈도우들

Country Status (5)

Country Link
US (1) US8393940B2 (https=)
JP (1) JP5657775B2 (https=)
KR (1) KR101761389B1 (https=)
TW (1) TWI461255B (https=)
WO (1) WO2011129959A2 (https=)

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WO2008154185A2 (en) * 2007-06-08 2008-12-18 Applied Materials, Inc. Thin polishing pad with window and molding process
KR101602544B1 (ko) * 2010-11-18 2016-03-10 캐보트 마이크로일렉트로닉스 코포레이션 투과성 영역을 포함하는 연마 패드
US8535115B2 (en) * 2011-01-28 2013-09-17 Applied Materials, Inc. Gathering spectra from multiple optical heads
JP5893479B2 (ja) * 2011-04-21 2016-03-23 東洋ゴム工業株式会社 積層研磨パッド
US9597769B2 (en) * 2012-06-04 2017-03-21 Nexplanar Corporation Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
ITTV20120147A1 (it) * 2012-07-30 2014-01-31 Hausbrandt Trieste 1892 Spa Capsula per la preparazione di bevande
US8961266B2 (en) * 2013-03-15 2015-02-24 Applied Materials, Inc. Polishing pad with secondary window seal
CN106376234B (zh) * 2014-05-02 2019-11-05 3M创新有限公司 间断的结构化磨料制品以及抛光工件的方法
US9868185B2 (en) * 2015-11-03 2018-01-16 Cabot Microelectronics Corporation Polishing pad with foundation layer and window attached thereto
US10213894B2 (en) * 2016-02-26 2019-02-26 Applied Materials, Inc. Method of placing window in thin polishing pad
EP3478447A4 (en) * 2016-06-29 2020-03-11 Saint-Gobain Abrasives, Inc. ABRASIVE TOOLS AND TRAINING METHODS
TWI629297B (zh) * 2016-07-05 2018-07-11 智勝科技股份有限公司 研磨層及其製造方法以及研磨方法
US10259099B2 (en) * 2016-08-04 2019-04-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Tapering method for poromeric polishing pad
WO2018045039A1 (en) * 2016-08-31 2018-03-08 Applied Materials, Inc. Polishing system with annular platen or polishing pad
KR101947877B1 (ko) * 2016-11-24 2019-02-13 두산중공업 주식회사 병렬 복열 방식의 초임계 이산화탄소 발전 시스템
KR101904322B1 (ko) * 2017-01-23 2018-10-04 에스케이씨 주식회사 연마패드 및 이의 제조방법
TWI650202B (zh) 2017-08-22 2019-02-11 智勝科技股份有限公司 研磨墊、研磨墊的製造方法及研磨方法
US10569383B2 (en) 2017-09-15 2020-02-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Flanged optical endpoint detection windows and CMP polishing pads containing them
US11325221B2 (en) * 2017-11-16 2022-05-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with multipurpose composite window
JP7134005B2 (ja) * 2018-07-26 2022-09-09 富士紡ホールディングス株式会社 研磨パッド
US20250303515A1 (en) * 2024-03-29 2025-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multifunctional endpoint detection window

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003273046A (ja) * 2002-03-13 2003-09-26 Nihon Micro Coating Co Ltd 研磨装置及びテープ並びに方法
JP2004343090A (ja) * 2003-04-22 2004-12-02 Jsr Corp 研磨パッドおよび半導体ウェハの研磨方法
WO2008154185A2 (en) * 2007-06-08 2008-12-18 Applied Materials, Inc. Thin polishing pad with window and molding process

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JPH08197434A (ja) * 1995-01-23 1996-08-06 Sony Corp 研磨用パッド
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
DE69635816T2 (de) * 1995-03-28 2006-10-12 Applied Materials, Inc., Santa Clara Verfahren zum Herstellen einer Vorrichtung zur In-Situ-Kontrolle und Bestimmung des Endes von chemisch-mechanischen Planiervorgängen
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US6994607B2 (en) * 2001-12-28 2006-02-07 Applied Materials, Inc. Polishing pad with window
EP1224060B1 (en) * 1999-09-29 2004-06-23 Rodel Holdings, Inc. Polishing pad
US6685537B1 (en) 2000-06-05 2004-02-03 Speedfam-Ipec Corporation Polishing pad window for a chemical mechanical polishing tool
KR100858392B1 (ko) 2001-04-25 2008-09-11 제이에스알 가부시끼가이샤 반도체 웨이퍼용 연마 패드와, 이를 구비한 반도체웨이퍼용 연마 적층체와, 반도체 웨이퍼의 연마 방법
US6875077B2 (en) * 2002-03-18 2005-04-05 Raytech Innovative Solutions, Inc. Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making
JP2008044103A (ja) * 2003-04-09 2008-02-28 Jsr Corp 研磨複層体および半導体ウエハの研磨方法
KR20040093402A (ko) * 2003-04-22 2004-11-05 제이에스알 가부시끼가이샤 연마 패드 및 반도체 웨이퍼의 연마 방법
US6986705B2 (en) * 2004-04-05 2006-01-17 Rimpad Tech Ltd. Polishing pad and method of making same
EP1739729B1 (en) * 2004-04-23 2012-03-28 JSR Corporation Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer
JP4904027B2 (ja) 2005-08-10 2012-03-28 ニッタ・ハース株式会社 研磨パッド
US7179151B1 (en) * 2006-03-27 2007-02-20 Freescale Semiconductor, Inc. Polishing pad, a polishing apparatus, and a process for using the polishing pad

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003273046A (ja) * 2002-03-13 2003-09-26 Nihon Micro Coating Co Ltd 研磨装置及びテープ並びに方法
JP2004343090A (ja) * 2003-04-22 2004-12-02 Jsr Corp 研磨パッドおよび半導体ウェハの研磨方法
WO2008154185A2 (en) * 2007-06-08 2008-12-18 Applied Materials, Inc. Thin polishing pad with window and molding process

Also Published As

Publication number Publication date
TW201143969A (en) 2011-12-16
WO2011129959A2 (en) 2011-10-20
US20110256818A1 (en) 2011-10-20
JP5657775B2 (ja) 2015-01-21
KR20130088744A (ko) 2013-08-08
JP2013525124A (ja) 2013-06-20
US8393940B2 (en) 2013-03-12
WO2011129959A3 (en) 2012-04-19
TWI461255B (zh) 2014-11-21

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