KR101756754B1 - Method of binding steel and Cu-alloy by sintering and the product of the same - Google Patents

Method of binding steel and Cu-alloy by sintering and the product of the same Download PDF

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KR101756754B1
KR101756754B1 KR1020150158309A KR20150158309A KR101756754B1 KR 101756754 B1 KR101756754 B1 KR 101756754B1 KR 1020150158309 A KR1020150158309 A KR 1020150158309A KR 20150158309 A KR20150158309 A KR 20150158309A KR 101756754 B1 KR101756754 B1 KR 101756754B1
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South Korea
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copper alloy
layer
bonding
lead
bonding layer
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KR1020150158309A
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Korean (ko)
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KR20170055298A (en
Inventor
김기열
이한희
정일웅
최홍기
주문걸
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주식회사 티엠시
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/008—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression characterised by the composition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
    • C23C10/28—Solid state diffusion of only metal elements or silicon into metallic material surfaces using solids, e.g. powders, pastes

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Powder Metallurgy (AREA)

Abstract

The present invention relates to a method of sintering and bonding a copper alloy powder containing lead to a steel material, and a sintering bonded body thereof.
A sintering bonding method of a steel material and a copper alloy material which prevents a decrease in bonding strength due to the formation of lead precipitate along the bonding interface between the steel material and the copper alloy material in the sintering and bonding of a copper alloy containing lead to a steel material, Thereby providing a junction body.
Forming a first copper alloy powder layer on the steel material;
Forming a first copper alloy bonding layer by sintering and bonding the first copper alloy powder layer to a steel material;
Forming a second copper alloy powder layer on the first copper alloy bonding layer;
And sintering and diffusion-bonding the second copper alloy powder layer to form a second copper alloy bonding layer,
Wherein the first copper alloy powder layer contains no lead powder as a constituent,
Wherein the second copper alloy powder layer contains lead powder as a constituent,
In the process of forming the second copper alloy bonding layer, the lead component contained in the second copper alloy powder layer diffuses into the first copper alloy bonding layer and disperses and precipitates to form the first copper alloy bonding layer, 2 copper alloy bonding layer forms an integral copper alloy bonding layer.
As described above, the copper alloy powder containing lead and the copper alloy powder containing no lead are separated in two steps and sintered and diffusion bonded to form a lead precipitate having an area along the sintered joint interface between the steel and the copper alloy The problem of the prior art is prevented, and as a result, the bonding strength between the steel material and the copper alloy material is greatly improved.

Description

TECHNICAL FIELD The present invention relates to a sintering method for sintering a steel material and a copper alloy,

The present invention relates to a method for sintering and bonding a copper alloy powder onto a steel material, and more particularly to a method for sintering and bonding a copper alloy powder having excellent abrasion resistance and solid lubricity on the surface of a steel sliding member, .

It is generally the case that a copper alloy having excellent abrasion resistance and solid lubricity, for example, a bluish copper alloy or a lead free copper alloy, is bonded to a sliding contact portion between a hydraulic cylinder and a piston or a bearing bush of a construction machine It is a technique used.

In Korean Patent Publication No. 10-1998-0069237 (Oct. 26, 1998), a copper alloy powder composed of a mixture of copper powder, tin powder, lead powder, and nickel powder is sintered once in an iron alloy piston block of a hydraulic pump cylinder Thereby bonding the first and second substrates.

Korean Patent Laid-Open Publication No. 10-1996-0037185 (Apr. 04, 1996) discloses a method of sintering and bonding a Cu-Sn-based alloy material to an iron-based material and a subsequent heat-up heating step to perform heat treatment for densifying the copper- A method is disclosed.

Japanese Unexamined Patent Publication No. 11-217637 (Aug. 10, 1999) discloses a method of sintering and bonding a copper-based slide material containing lead to an iron-based base material in order to prevent lead from dispersing and precipitating on the slide material as a metal component. Discloses a joining method in which magnesium is added to disperse and precipitate in the form of a lead-based intermetallic compound.

All of the above prior arts disclose a sinter bonding method of a copper system including a steel material and a lead. However, a solution to the negative influence that the bond strength is largely lowered due to the distribution of the precipitates along the sintered joint interface I do not propose.

The present invention relates to a method of sintering and bonding a copper-based alloy, particularly a lead-containing copper alloy, to a steel material by preventing the lead precipitate from being distributed in a form having an area along a joint interface between the steel material and the copper alloy material, And a sintered body of a steel material and a copper alloy material produced by the method.

According to an aspect of the present invention, there is provided a sinter bonding method comprising:

Forming a first copper alloy powder layer on the steel material;

Forming a first copper alloy bonding layer by sintering and bonding the first copper alloy powder layer to a steel material;

Forming a second copper alloy powder layer on the first copper alloy bonding layer;

And sintering and diffusion-bonding the second copper alloy powder layer to form a second copper alloy bonding layer,

Wherein the first copper alloy powder layer contains no lead powder as a constituent,

Wherein the second copper alloy powder layer contains lead powder as a constituent,

In the process of forming the second copper alloy bonding layer, the lead component contained in the second copper alloy powder layer diffuses into the first copper alloy bonding layer and is dispersed and precipitated, whereby the first copper alloy bonding layer and the 2 copper alloy bonding layer forms an integral copper alloy bonding layer.

As described above, the copper alloy powder containing lead and the copper alloy powder containing no lead are separated in two steps and sintered and diffusion bonded to each other, whereby lead precipitates are distributed along the sintered joint interface between the steel and the copper alloy The problem of the prior art is prevented, and as a result, the bonding strength between the steel material and the copper alloy material is greatly improved.

FIG. 1 schematically shows a bonded body formed by sintering and bonding a copper alloy powder containing lead to a steel material according to the prior art.
2 schematically shows a cross-sectional structure at a bonding interface of a copper alloy bonding layer formed by a conventional technique.
FIG. 3 is a schematic view of a process for forming a copper alloy bonding layer on a steel through a two-step sintering process according to the present invention.
4 shows a final sintered assembly of a steel material and a copper alloy material produced according to the present invention.
5 schematically shows a cross-sectional structure at a bonding interface of a copper alloy bonding layer formed according to the present invention.
6 is a photograph of a product obtained by sintering and joining a steel material and a copper alloy material according to the present invention.
7 is a photograph showing a bonded cross-section of the sintered and bonded product shown in Fig.

FIG. 1 is a schematic view of a bonded body obtained by sintering and bonding a copper alloy bonding layer 100 including lead on a steel material 10 by a conventional sinter bonding method. FIG. 2 is a cross- Sectional structure at the bonding interface 101 of the layer 100 shown in FIG.

When the copper alloy powder containing lead is sintered and bonded onto the steel material 10 by the conventional sinter bonding method, the particulate lead precipitate 51 is dispersed in the matrix 102 of the copper alloy bonding layer 100 And area-based lead precipitates 51 'formed over a relatively large area along the bonding interface 101 of the steel alloy 10 and the copper alloy bonding layer 100 are formed.

The area type lead precipitate 51 'distributed with an area along the bonding interface 101 is a major cause of remarkably lowering the bonding strength between the steel material 10 and the copper alloy bonding layer 100.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to the accompanying drawings, in which embodiments of a method for joining a steel and a copper alloy according to the present invention are sintered.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The following embodiments are described in detail to facilitate understanding of the present invention and are not intended to limit the scope of the present invention.

FIG. 3 schematically shows a sinter bonding process of a steel material and a copper alloy according to an embodiment of the present invention.

A first copper alloy powder layer 20 made of a Cu-Sn-Ni component not containing a lead component is formed on the steel material 10 serving as a base material for forming the copper alloy bonding layer and then subjected to a conventional sinter bonding method The first copper alloy bonding layer 21 is formed.

The heating time, the heating temperature and the atmosphere for sinter bonding are well known in the art, and a detailed description thereof will be omitted.

A second copper alloy powder layer 30 made of a Cu-Sn-Ni-Pb component containing a lead component is formed on the first copper alloy bonding layer 21 formed in the above step, The second copper alloy bonding layer 31 is formed.

At this time, the lead component contained in the second copper alloy powder layer 30 is dispersed and precipitated in the form of the particulate lead precipitate 51 inside the second copper alloy bonding layer 31, And diffuses into the first copper alloy bonding layer 21 to form dispersed and precipitated particulate lead precipitate 51 in the interior of the first copper alloy bonding layer 21 as well.

The lead component of the second copper alloy powder layer 30 diffuses into the first copper alloy bonding layer 21 and is sintered and bonded so that the first copper alloy bonding layer 21 and the second copper alloy bonding layer 31 The first copper alloy bonding layer 21 and the second copper alloy bonding layer 31 are formed so as to have a substantially uniform distribution in which the concentration of the lead component of the first copper alloy bonding layer 21 and the second copper alloy bonding layer 31 has a continuously varying distribution. The copper alloy bonding layer 200 is formed.

FIG. 6 schematically shows a cross-sectional structure of a bonding interface 201 of a sintered and bonded copper alloy bonding layer 200 according to an embodiment of the present invention. Unlike the bonding interface 101 of the sintered body manufactured by the conventional sinter bonding method, at the bonding interface 201 between the single copper alloy bonding layer 200 and the steel material 10 formed by one embodiment of the present invention, An area type lead precipitate 51 'distributed with an area along the interface is not formed.

That is, the total sum of the cross-sectional areas of all the lead precipitates 51, 51 'existing in the cross-sectional structure of the bonding interface 201 of the copper alloy bonding layer 200,

All of the lead precipitates 51, 51 'present in the I-I cross-sectional structure, which does not include the lead precipitates 51, 51' existing in the cross-sectional structure of the bonding interface 201 and which is an arbitrary section parallel to the bonding interface 201, 51 '). ≪ / RTI >

The first copper alloy powder layer 20 may be composed of 7 to 16% by weight of tin powder, 1 to 5% by weight of nickel powder and the balance copper powder, and the second copper alloy powder layer 30 may be composed of The first copper alloy powder layer 20 may further include 2 to 10 wt% of lead powder.

The components and contents of the first copper alloy powder layer 20 and the second copper alloy powder layer 30 included in the embodiment do not limit the scope of the present invention, In the method of sintering and bonding an alloy and a steel material, the first copper alloy powder layer 20 contains lead powder, and only the second copper alloy powder layer 30 contains lead powder. The composition and content of the alloy powder layer 20 and the second copper alloy powder layer 30 can be configured.

For example, in each of the components except for the lead powder and the copper powder, the content of the first copper alloy powder layer 20 and the content of the second copper alloy powder layer 30 may be the same or different .

The sintered body of the steel material and the copper alloy according to the present invention is formed by sintering the first copper alloy bonding layer 21 and the second copper alloy bonding layer 31 in two stages, Thereby forming a separate copper alloy bonding layer 200 which is not separated. The particulate lead precipitate 51 is dispersed and deposited on both the first copper alloy bonding layer 21 and the second copper alloy bonding layer 31 in the entire copper alloy bonding layer 200,

There is no or almost no area-type lead precipitate 51 'distributed with an area along the joint interface 201 between the entire copper alloy joint layer 200 and the steel material 10, so that the joint strength is greatly improved do.

10: Steel
100, 200: Copper alloy bonding layer
101, 201: bonded interface
20: a first copper alloy powder layer
21: a first copper alloy bonding layer
30: Second copper alloy powder layer
31: second copper alloy bonding layer
51: Particulate lead precipitate
51 ': area type lead precipitate

Claims (7)

Forming a first copper alloy powder layer (20) on the steel (10);
Forming a first copper alloy bonding layer (21) by sintering and bonding the first copper alloy powder layer (20) to the steel material (10);
Forming a second copper alloy powder layer (30) on the first copper alloy bonding layer (21);
And sintering and diffusion bonding the second copper alloy powder layer (30) to form a second copper alloy bonding layer (31)
The first copper alloy powder layer (20)
But not including lead, 7 to 16% by weight of tin powder, 1 to 5% by weight of nickel powder and the balance copper powder,
The second copper alloy powder layer (30)
7 to 16% by weight of tin powder, 1 to 5% by weight of nickel powder, 2 to 10% by weight of lead powder and the balance copper powder,
In the process of forming the second copper alloy bonding layer 31, the lead component contained in the second copper alloy powder layer 30 is dispersed in the inside of the second copper alloy bonding layer 31, ), Dispersed and diffused into the first copper alloy bonding layer (21), and dispersed and precipitated to form a lead component between the first copper bonding layer (21) and the second copper bonding layer (31) The first copper alloy bonding layer 21 and the second copper alloy bonding layer 31 are not separated from each other to form a single copper alloy bonding layer 200,
The third component except for copper and lead among the components constituting the first copper alloy powder layer 20 and the second copper alloy powder layer 30,
The content of the third component constituting the first copper alloy powder layer (20)
And the third component constituting the second copper alloy powder layer (30) is equal to the content of the third component constituting the second copper alloy powder layer (30). delete delete Forming a first copper alloy powder layer (20) on the steel (10);
Forming a first copper alloy bonding layer (21) by sintering and bonding the first copper alloy powder layer (20) to the steel material (10);
Forming a second copper alloy powder layer (30) on the first copper alloy bonding layer (21);
And sintering and diffusion-bonding the second copper alloy powder layer (30) to form a second copper alloy bonding layer (31)
In the process of forming the second copper alloy bonding layer 31, the lead component contained in the second copper alloy powder layer 30 is dispersed in the inside of the second copper alloy bonding layer 31, ), Dispersed and diffused into the first copper alloy bonding layer (21), and dispersed and precipitated to form a lead component between the first copper bonding layer (21) and the second copper bonding layer (31) The first copper alloy bonding layer 21 and the second copper alloy bonding layer 31 are not separated from each other to form a single copper alloy bonding layer 200,
The first copper alloy powder layer (20)
But not including lead, 7 to 16% by weight of tin powder, 1 to 5% by weight of nickel powder and the balance copper powder,
The second copper alloy powder layer (30)
7 to 16% by weight of tin powder, 1 to 5% by weight of nickel powder, 2 to 10% by weight of lead powder and the balance copper powder,
The third component except for copper and lead among the components constituting the first copper alloy powder layer 20 and the second copper alloy powder layer 30,
The content of the third component constituting the first copper alloy powder layer (20)
And the third component constituting the second copper alloy powder layer (30) is the same as the content of the third component constituting the second copper alloy powder layer (30). 5. The method of claim 4,
Sectional area of each of the lead precipitates 51 and 51 'present on the cross-sectional structure of the bonding interface 201 between the integrated copper alloy bonding layer 200 and the steel material 10,
So as not to include all the lead precipitates 51 and 51 'present on the cross-sectional structure of the bonding interface 201,
At an arbitrary position in the thickness direction of the integrated copper alloy bonding layer (200)
Sectional area of each of the lead precipitates (51, 51 ') present in the cross-sectional structure cut parallel to the joint interface (201). delete delete
KR1020150158309A 2015-11-11 2015-11-11 Method of binding steel and Cu-alloy by sintering and the product of the same KR101756754B1 (en)

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KR102352433B1 (en) * 2020-04-16 2022-01-19 김재곤 The Cu Alloy Plate and this Method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008144252A (en) * 2006-12-13 2008-06-26 Daido Metal Co Ltd Method for producing copper based sliding material, and copper based sliding material produced by using the method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008144252A (en) * 2006-12-13 2008-06-26 Daido Metal Co Ltd Method for producing copper based sliding material, and copper based sliding material produced by using the method

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