KR101756082B1 - Method for controlling semiconductor fabrication equipment - Google Patents

Abstract

The present invention relates to a semiconductor device management method for manufacturing a semiconductor chip by cutting a wafer on which a plurality of unit semiconductor chips are patterned on a first surface, the method comprising the steps of: placing the wafer in a bottom jig A resin discharging step of discharging a resin on at least a part of the first surface; and a step of applying the resin on the first surface of the wafer by pressing the resin on the first surface with the use of an overlay, A grinding step of grinding a second surface which is an opposite surface of the first surface of the wafer so that the resin is exposed; A semiconductor facility operation step for operating a semiconductor facility for performing a semiconductor manufacturing process including a dividing step for dividing the semiconductor facility; And managing the semiconductor equipment through a management system.
Accordingly, it is possible to prevent a process accident in the process of manufacturing the semiconductor chip, thereby improving the production yield and quality of the semiconductor chip.

Description

[0001] METHOD FOR CONTROLLING SEMICONDUCTOR FABRICATION EQUIPMENT [0002]

More particularly, the present invention relates to a semiconductor device manufacturing method, a semiconductor device manufacturing method, and a semiconductor device manufacturing method. More particularly, the present invention relates to a semiconductor device manufacturing method, And to a method of managing a semiconductor facility that can prevent unforeseen process accidents in advance.

A semiconductor is manufactured by forming a plurality of semiconductor chips by patterning while layering at least one layer on a wafer, which is a substrate, and forming a plurality of semiconductor dies by dicing the semiconductor chips. The semiconductor chip is manufactured by forming an insulating film or a conductive film on the surface of the wafer and performing lithography and etching using a mask, photo, or the like. The thickness of the semiconductor chip mounted on the wafer is about several micrometers, while the thickness of the wafer is several hundreds of micrometers. By providing a predetermined strength to the wafer, the semiconductor chip is prevented from being damaged during handling of the wafer. It is for this reason. On the other hand, the thickness of such a wafer lowers the efficiency of a method of manufacturing a semiconductor chip and restricts downsizing of the semiconductor equipment. In order to prevent this, it is necessary to ground the backside of the wafer and separate the individual semiconductor chips . Conventionally, a conventional dicing process and a DBG process (dicing before grinding process) are widely known as processes for separating individual semiconductor chips. In a typical dicing process, a background tape is laminated to the surface of the patterned wafer, then the backside of the wafer is ground, then the tape is removed, the wafer is mounted on a dicing tape, And picking up the semiconductor chips. The DBG process involves half-cutting the surface of the patterned wafer, laminating a background tape thereon, then grounding the defecation of the wafer, mounting it on a pick-up tape, and removing the back- It is a way to divide. In the above-described conventional dicing process, there is a problem that chipping occurs in the back surface of the wafer in the process of dividing the semiconductor chip. In the DBG process, in the course of grounding, silicon dust or the like is inserted into the grooves between the side walls of the semiconductor chip, A problem arises such that the semiconductor chip is pushed in the course of grounding the backside of the wafer, which is a problem. There is a problem in that it is difficult to use a wafer having a thinner thickness and to manufacture a semiconductor chip having a smaller size and a thickness by the conventional dicing process and the DBG process. In addition, there is a problem in that there is no effective means for preventing unforeseen process accidents on the equipment in the process of manufacturing such a semiconductor chip.

Korean Patent Publication No. 10-1999-0065483

The present invention relates to a semiconductor device which improves the efficiency of a semiconductor process and prevents contamination occurring during the process, thereby manufacturing a high-quality semiconductor chip, and automatically controlling the state of the semiconductor device, thereby preventing unforeseen process accidents And to provide a method of managing a semiconductor facility.

The present invention relates to a semiconductor device management method for manufacturing a semiconductor chip by cutting a wafer on which a plurality of unit semiconductor chips are patterned on a first surface, the method comprising the steps of: placing the wafer in a bottom jig A resin discharging step of discharging a resin on at least a part of the first surface; and a step of applying the resin on the first surface of the wafer by pressing the resin on the first surface with the use of an overlay, A grinding step of grinding a second surface which is an opposite surface of the first surface of the wafer so that the resin is exposed; A semiconductor facility operation step for operating a semiconductor facility for performing a semiconductor manufacturing process including a dividing step of dividing the semiconductor facility; And managing the semiconductor equipment through a management system.

The method of managing semiconductor equipment according to the present invention has the following effects.

First, it prevents the process accidents in the semiconductor chip manufacturing process, thereby improving the production yield and quality of the semiconductor chip.

Second, it is possible to provide a manufacturing cost and a semiconductor chip manufacturing method for reducing defects of the semiconductor chip.

Thirdly, it is possible to provide a semiconductor chip manufacturing method capable of manufacturing high-quality and thin-type semiconductor chips with high process efficiency.

Fourth, a novel semiconductor chip manufacturing method capable of improving process efficiency and accuracy of a semiconductor chip in a process of cutting a wafer and manufacturing a plurality of unit semiconductor chips can be provided.

1 is a flowchart illustrating a method of managing a semiconductor facility according to an embodiment of the present invention.
2 is a flowchart illustrating a method of manufacturing the semiconductor chip shown in FIG.
Figure 3a is a perspective view of a wafer with a first side patterned.
FIG. 3B is a cross-sectional view taken along line AA of FIG. 3A.
4A is a perspective view of the top and bottom jigs according to FIG.
4B is a perspective view and an exploded perspective view showing another embodiment of the bottom jig according to FIG.
5 is a cross-sectional view schematically showing a wafer mounted in the bottom jig.
6A is a schematic view showing the step of providing a resin on a wafer.
FIG. 6B is a view showing the area of the wafer.
Figs. 7 and 8 schematically show a side cutting step. Fig.
9 is a view schematically showing the grinding step.
10 is a perspective view of the wafer polishing apparatus according to FIG.
11 is an enlarged view of the wafer polishing apparatus of Fig.
12 is an internal configuration diagram of the wafer polishing apparatus of FIG.
13 to 14 are schematic views showing another embodiment of the wafer polishing apparatus according to Fig.
15 is a view schematically showing an example of a buffer module among the configurations according to FIG.
FIG. 16 is a view schematically showing another embodiment of the buffer module among the configurations according to FIG.
Fig. 17 is a view showing another embodiment of the uppermost stiffener, the plurality of stopped stiffeners, and the lowermost stiffener of the structures according to Fig. 13. Fig.
FIG. 18 is a view showing another embodiment of the shock absorber unit among the structures according to FIG.
19 to 18 are views showing still another embodiment of the shock absorber among the structures according to FIG.
FIG. 22 is a view showing another embodiment of the shock absorber unit among the structures according to FIG.
FIG. 23A is a view showing still another embodiment of the shock absorber among the configurations according to FIG.
FIG. 23B is a view showing another embodiment of the shock absorber among the structures according to FIG.
24 is a conceptual diagram schematically showing the management system according to FIG.
25 is a flowchart sequentially showing a facility management method using the management system according to FIG.
26 is a conceptual diagram of a cooling / heating air-conditioning control system according to FIG.
27 is a diagram illustrating parameters of a load control object according to FIG. 26,
FIG. 28 is a block diagram of the portable terminal according to FIG. 26; FIG.
FIG. 29 is a view conceptually showing the air conditioning system according to FIG. 1. FIG.
Fig. 30 is a configuration diagram showing an embodiment of a construction state of the air conditioning system according to Fig. 29;
FIG. 31 and FIG. 32 are a flowchart sequentially showing the control method of the air conditioning system according to FIG.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Referring to FIG. 1, a method of managing a semiconductor facility includes a semiconductor facility operation stage and a semiconductor facility management stage.

≪ Semiconductor facility operation step S110 >

Hereinafter, the operation step (S110) of the semiconductor device 403 will be described with reference to the accompanying drawings.

1 is a flowchart illustrating a method of manufacturing a semiconductor chip according to an embodiment of the present invention. One embodiment is a semiconductor chip manufacturing method for manufacturing a semiconductor chip by cutting a patterned wafer of a plurality of unit semiconductor chips on a first surface, the method comprising: mounting a wafer in the bottom jig such that a first side of the wafer is positioned on the top side Step S111; A resin discharging step (S112) of discharging resin to at least a part of the first surface; (S113) applying the resin on the first surface of the wafer by pressing the resin on top of the first surface using a topping paper; A curing step (S114) of curing the resin coated on the first side; Grinding (S115) grounding a second surface opposite to the first surface of the wafer to expose the resin; And a dividing step (S116) of dividing the unit semiconductor chip. (CVD), physical vapor deposition (PVD), atomic layer deposition (ALD), and atomic layer deposition (ALD) are performed on the first surface of the wafer in the process of manufacturing a semiconductor chip using the wafer. ), Spin coating, etc., and a plurality of films are deposited by lithography or the like according to a circuit design. A plurality of semiconductor chips spaced apart from each other by a predetermined distance are patterned on the first surface of the wafer and cut by a process such as grounding / dicing to be divided into separate unit semiconductor chips. One embodiment of the present invention relates to a semiconductor chip manufacturing method for dividing a plurality of semiconductor chips provided on a first side of a patterned wafer into unit semiconductor chips. According to an embodiment of the present invention, And can be manufactured with high quality.

Figure 2a is a perspective view of a wafer with a first side patterned, and Figure 2b is a cross-sectional view along line A-A of Figure 2a. FIG. 3A is a perspective view of a top jig and a bottom jig according to an embodiment of the present invention, and FIG. 3B is a perspective view and an exploded perspective view of a bottom jig according to another embodiment of the present invention. 4 is a cross-sectional view schematically showing a wafer mounted in the bottom jig.

2A to FIG. 4, in the wafer mounting step S111, the first surface is patterned to form a wafer 10 having a plurality of semiconductor chips 11 in the bottom jig 110 And can be mounted in the space 111. The wafer 10 comprises a patterned first face 10a and a second face 10b which is the back face of the wafer 10 opposite to the first face 10a, 10a may be provided with a plurality of semiconductor chips 11. A plurality of semiconductor chips 11 provided on the first surface 10a of the wafer 10 are provided with spacing portions 12 between adjacent semiconductor chips 11, 11 are divided into individual separate unit semiconductor chips 11. The wafer 10 may be provided inside the jig 100 to perform a subsequent process. The jig 100 may include a bottom jig 110 on which the wafer 10 is placed and a top jig 120 provided to cover the open upper surface of the bottom jig 110. Preferably, the outer diameter c of the top jig 120 is greater than the outer diameter b2 of the bottom jig 110. That is, ) Or greater. The wafer 10 may be mounted on the inner space 111 of the bottom jig 110 such that the first surface 11 is provided on the upper side. The bottom jig 110 is provided in a box shape having an open upper surface and the inner space 111 of the bottom jig 110 is connected to the upper surface of the bottom jig 110, Sectional area of the inner space 111 may be substantially the same. The wafer 10 is mounted in the inner space 1110 of the bottom jig 110 so as to be perpendicular to the upper surface of the bottom jig 110 so that the balance of the wafer 10 can be easily controlled can do. The inner diameter b1 of the bottom jig 110 is equal to or greater than the diameter a of the wafer 10 and the inner height d of the bottom jig 110 is equal to or greater than the thickness a of the wafer 10 t, which is greater than the first height h. In the wafer mounting step S111, the first height h may be 50 to 500 mu m. The wafer 10 is mounted in the bottom jig 110 and thereafter pressed through the top jig 120 in the resin discharging step S112 to press the resin provided on the first surface 10a of the wafer 10 . The first height h controls the space in which the resin provided on the wafer 10 is provided so that the resin can be uniformly coated on the first surface 10a of the wafer 10. [ You can do auxiliary functions. For example, the resin may be applied over the top 10 of the wafer 10 by a first height h through a top jig 120, and when the first height h is less than 50 탆, In the process of dividing the semiconductor chip 11 due to the insufficient fixing force for fixing the semiconductor chip 11 or the semiconductor chip 11 is not sufficiently filled in the spacing portion 12 provided on the first surface 10a of the wafer 10, There arises a problem such as chipping of the chip 11, and it is difficult to manufacture a thin, high-quality semiconductor chip 11. In addition, if the first height (h) is 500 m, if it is more than 500 m, the consumption of unnecessary resin is increased, the raw material cost is increased, and the curing time is increased to lower the process efficiency. Alternatively, in the wafer mounting step S111, the bottom jig 110 'is provided in a box shape having an open top surface, and the bottom jig 110' has a cylindrical first A body part 112 and a second body part 113 which can be separated and combined with the first body part 112 in a complementary manner. The first and second body portions 112 and 113 are provided with fastening holes 112a and 113a and the fastening holes 112a and 113a are fastened by separate fastening members 114, The second body portions 112 and 113 can be connected. The bottom jig 110 'according to the present embodiment may have a first body part 112 as a main body and a second body part 113 including a bottom surface separately from each other. Since the bottom jig 110 'is similar in area to the area of the wafer 10, the wafer 10 may not be easily separated from the bottom jig 110'. In contrast, the bottom jig 110 'according to the present embodiment is provided so as to be able to be coupled and separated, thereby easily providing the resin on the wafer 10, and the wafer 10 provided with the resin, It can be easily removed by separating the portion 113.

The bottom jig 110 'is complementarily formed with a portion where the first body part 112 and the second body part 113 are coupled to each other and the first and second body parts 112 and 113 And fastening holes 112a and 113a may be provided at positions corresponding to each other. The fastening holes 112a and 113a may be spaced a predetermined distance from the first and second body portions 112 and 113. The fastening holes 112a and 113a may be formed in a U- The first and second body parts 112 and 113 can be connected by inserting and fastening the member. The wafer 10 is placed in the bottom jig 110 and then resin can be discharged onto the first surface 10a of the wafer 10 in the resin discharging step S112. The resin is preferably applied uniformly on the wafer 10, so that the wafer 10 mounted in the bottom jig 110 may be provided to maintain a predetermined level of flatness. And aligning the positions of the wafers 10 mounted in the bottom jig 110 before the resin discharging step S112. In the bottom jig 110, at least one level sensor (not shown) is provided to check the flatness of the mounted wafer 10, and the flatness of the wafer 10, measured by the level sensor, Lt; / RTI > The control unit compares the flatness of the transferred wafer 10 with the previously input value and keeps the difference if it is within the range. If the difference is out of the range, the controller 10 adjusts the alignment of the wafer 10 through the pre- The resin discharging step S112 may be performed.

FIG. 5A is a view schematically showing a step of providing a resin on a wafer, and FIG. 5B is a view showing a region of a wafer. 5A and 5B, in the resin discharging step S112, the resin R is discharged through a spray nozzle provided in the top jig 120 and is discharged into the wafer 10 The resin (R) may be at least one selected from the group consisting of phenol resin, urea resin, melamine resin, epoxy resin, polyester resin, polycarbonate resin, polyimide resin, polyamide resin, phenoxy resin, And an ester resin. In the resin discharging step S112, the resin R may be provided in an amount ranging from 1 g to 20 g. When the amount of the resin R is less than 1 g, a portion of the resin R in the spacing portion 12 of the wafer 10 is partially An unfilled region is formed or the resin R is not uniformly applied on the first surface 10a of the wafer 10. [ On the other hand, when the amount of the resin (R) is more than 20 g, a resin is unnecessarily thickly applied on the first surface (10a) of the wafer (10) And a large amount of resin R is overflowed to the outside of the wafer 10, which is a problem. For example, the amount of the resin (R) to be discharged may be controlled in various ranges depending on the size of the wafer (10) and the thickness of the resin (R) provided on the wafer (10). Alternatively, the wafer 10 may include one main center MC and a fourth central portion MC about the center of the first surface 10a, The region can be divided to include the center portion SC. The resin R is provided in the main center portion MC at a ratio of 40% to 60% with respect to a total amount 100% of the resin R provided on the first surface 10a of the wafer 10, And 10% to 15%, respectively. It is preferable that the resin R is uniformly applied on the wafer 10 and filled to have a substantially uniform density so as to have no unfilled region in the minute spacing between the semiconductor chips. At this time, the resin (R) may be provided on the wafer 10 at a predetermined content and position. When the main center portion MC is less than 40%, the main center portion MC of the wafer 10, And the thickness of the non-filled region in the main center portion MC is greater than 60%, the thickness decreases from the main central portion MC of the wafer 10 to the outer periphery thereof There is a problem. Further, when the resin R is provided only in the main central portion MC, a separate member is required to control the thickness uniformity of the resin R provided on the wafer 10, . Therefore, the resin R is divided equally into the sub-center SM as well as the main center MC to improve the filling degree and uniformity of the applied resin R on the wafer 10 Specifically, 10% to 15% of the total amount of the resin (R) provided in the four sub-centers (SM). More specifically, the main center portion MC is provided with 50% of the total amount of the resin R provided on the wafer 10, and the sub-center portion SM is provided with 12.5% each. In the applying step S113, the resin R can be pressed at a pressure of 0.01 kgf / cm 2 to 1 kgf / cm 2. The resin R may be provided in a melting state so as to have a predetermined viscosity so that the resin R provided on the wafer 10 is pressed through the top jig 120, The filling degree and the uniformity of the resin (R) can be controlled to be uniform and the processing time can be shortened. If the pressure to press the resin R is less than 0.01 kgf / cm 2, a region where the inner side edge of the separation portion of the wafer 10 is unfilled can be formed. If the pressure is greater than 1 kgf / cm 2, And the physical properties of the resin (R) are different depending on the positions, which makes it difficult to control the process uniformly. The resin R is filled and replenished in the spacing 12 between the adjacent semiconductor chips 11 on the first side 10a of the wafer 10 and is subjected to a subsequent grinding step S115 and a splitting step The semiconductor chips 11 can be fixed and supported by the semiconductor chips 11 in the course of individualization of the semiconductor chips 11 into the unit semiconductor chips by S116 so that chipping and cracks occurring at the edge portions of the semiconductor chips can be prevented. It is also possible to prevent the silicon dust or the like generated in the process of grinding the wafer 10 from being filled into the spacing portion 12 into the spacing portion 12 to prevent contamination of the semiconductor chip 11, Can be prevented. In the applying step S113, the resin R is pressed by the top jig 120, and the top jig 120 has a diameter equal to or greater than the outer diameter b2 of the open top surface of the bottom jig 110, (c). At least a part of the inside of the top jig 120 and the bottom jig 110 may include a fluorine coating portion. The resin R is applied to the wafer 10 by the complementary coupling between the top jig 120 and the bottom jig 110 and the resin R is transferred to the inside of the top jig 120 and the bottom jig 110 So that the top jig 120 and the bottom jig 110 can be contaminated and this acts as a foreign substance in the coating step S113 for the subsequent separate wafer 10, . The top jig 120 and the bottom jig 110 may have a fluorine coating on at least a part of the interior of the top jig 120 and the bottom jig 110, The contamination of the jig 120 and the bottom jig 110 by the resin R can be prevented. Alternatively, the upper surface of the top jig 120 may be provided with a sensor 121 for measuring a pressure applied to the resin R. The sensor 121 includes first to fourth sensors spaced apart from each other with a predetermined distance from the center of the top jig 120. The pressure of the resin measured by the first to fourth sensors And the controller may control the pressure applied to the resin R in the top jig 120 by comparing the measured pressure of the resin R with a previously inputted reference value.

In another embodiment of the present invention, the resin (R) provided on the wafer measures the pressure applied to the resin (R) by the top jig (120) in the process of being entirely applied to the first side of the wafer can do. As the size (area) of the wafer increases, the pressure applied through the top jig 120 can be differently applied depending on the position of the wafer, which can affect the density of the resin R applied on the wafer have. On the other hand, in the top jig 120 according to the present embodiment, the first to fourth sensors are provided so that the pressure applied to the resin R applied to the wafer through the top jig 120 is controlled to be substantially constant, The density of the resin R can be controlled so as to be uniform as a whole. For example, the first to fourth sensors provided in the top jig 120 may be used to control the pressure applied to a large area to be different from each other. The fixation can be efficiently controlled by controlling the losing pressure to be included in the pre-input pressure range. Alternatively, the bottom jig 110 may further include a bottom sensor for measuring a pressure applied to the wafer 10 provided in the bottom jig 110. The bottom sensor may be provided in at least one or more of the first to fourth sensors, or may be provided alone. The bottom sensor can measure a pressure applied to the wafer 10 by the top jig 120 and can transmit the uniform pressure to the wafer 10 by controlling the pressure. After the resin R is provided on the first side 10a of the wafer 10, the resin R is cured through the curing step S114 to fix the spacing between the semiconductor chips and the upper surface of the semiconductor chip have. The curing pressure applied to the resin R through the top jig 120 in the curing step S114 may be 10 kgf / cm 2 to 100 kgf / cm 2, and the curing temperature may be 50 ° C to 200 ° C. If the curing applied to the resin (R) does not include the pressure and the curing temperature within the above-mentioned range, a part of the resin (R) provided between the spacers may not be cured. The thickness of the resin (R) cured through the curing step (S114) may be 10 to 200 占 퐉 based on the first surface (10a). If the thickness of the hardened resin R provided on the wafer 10 is less than 10 mu m, the upper surface of the semiconductor chip can not be sufficiently fixed by the resin R, If the thickness is more than 200 μm, the unnecessary production cost is increased and the time required to remove the resin (R) is increased to lower the process efficiency.

6 and 7 are views schematically showing a side cutting step. Referring to FIGS. 6 and 7 together with FIG. 1, a side cutting step of removing the hardened resin R by overflowing the notched portion and the flat portion of the wafer 10 after the curing step S114 . The side cutting step is performed using a cutting member such as a knife 30 and the resin R unnecessarily protruded along the outer periphery of the wafer 10 can be cut and separated from the wafer 10. [ Is carried out before the grinding step S115 for grinding the rear surface of the wafer 10 performed after the hardening step S114 and the grinding step S115 is performed by removing an unnecessary portion of the hardened resin R on the wafer 10 It is possible to prevent the proposal of the grinding position of the wafer 10 by the resin R in step S115, thereby improving the accuracy of grinding and improving the grinding efficiency. Alternatively, the wafer 10 provided in the bottom jig may be provided to fit into the space provided by the bottom jig without any tolerance. There is no space between the bottom jig and the wafer 10 to prevent overflow of the resin R, thereby omitting the side cutting step, thereby efficiently operating the process.

8 is a view schematically showing the grinding step. Referring to FIG. 8 together with FIG. 1, the grinding step S115 is performed by grinding the second surface 10b of the wafer 10 using a grinder 40 as a kind of back grinding The cured resin R provided on the spacing portion 12 can be exposed. At this time, the wafer 10 is ground to the lower end of the spacing portion 12 of the wafer 10 so that the resin R filled in the spacing portion 12 is not affected. The grinding machine 40 used in the grinding step S115 may grind the second surface 10b of the wafer 10 to be even with a flat surface, The second surface 10b of the wafer 10 is formed such that the semiconductor chip 11 and the resin R provided in the spacing portion 12 are alternately arranged . In the dividing step S116, the wafer 10 on which the second surface 10b is ground can be divided into the unit semiconductor chips 11. After the grinding step S115 is completed, the semiconductor chip 11 is divided or divided by fixing the wafer by attaching a mount tape to the second surface of the wafer 10 and then expanding the mount tape to both sides Alternatively, the semiconductor chip can be divided by pushing up the semiconductor chip using a pin or the like. According to another embodiment of the present invention, there is provided a method of manufacturing a semiconductor chip by cutting a wafer having a plurality of unit semiconductor chips patterned on a first surface thereof, the method comprising the steps of: A wafer mounting step; A prealigning step of aligning the position of the wafer mounted in the bottom jig; A resin discharging step of discharging resin on at least a part of the first surface; Applying the resin on the first surface of the wafer by pressing the resin on top of the first surface using a topping paper; A curing step of curing the resin coated on the first side; A side cutting step of removing the hardened resin by overflowing the notched portion and the flat portion of the wafer; A grinding step of grinding a second face opposite to the first face of the wafer so that the resin is exposed; And a dividing step of dividing the unit semiconductor chip. In the curing step, a sensor for measuring a pressure applied to the resin is provided on an upper surface of the overlay, Wherein the pressure of the resin measured by the first to fourth sensors is transmitted to the controller, and the controller controls the pressure of the resin to be measured and the previously input reference value To control the pressure applied to the resin in the top jig. As described above, in the method of manufacturing a semiconductor chip according to the embodiments of the present invention, resin is filled in the spacing part between neighboring semiconductor chips, so that in the process of dividing the semiconductor chip, And the like. Further, since it is possible to prevent chipping of the semiconductor chip, it is possible to easily manufacture a thin, high-quality semiconductor chip having a strength two times or more higher than that of the semiconductor chip by a conventional method. In terms of the production cost, the conventional dicing process requires a production cost of half the level, and in comparison with the DBG process, only the cost of 60% to 70% is consumed, thereby reducing the manufacturing cost.

Meanwhile, the step (S110) of operating the semiconductor facility 403 further includes a wafer polishing process for polishing the wafer using the wafer polishing apparatus. Hereinafter, the wafer polishing apparatus will be described in detail.

Wafer Polishing Apparatus 1

10 to 12, a wafer polishing apparatus 2100 according to a preferred embodiment of the present invention includes a body portion B, a polishing portion 2110, a cleaning portion 2120, an enlarged display portion 2130, A holding unit 2140, a transfer unit 2150, and a reciprocating unit 2160 are integrally formed. The polishing section 2110 is formed by including a cylindrical polishing agent 2111 to polish the wafer. The polishing unit 2110 may include a bearing and an electric motor for supporting the polishing compound 2111 and rotating the polishing compound 2111 with respect to the central axis. Since the polishing is performed by the rotating cylindrical abrasive 2111, line contact occurs during polishing, and all the surfaces of the wafer are uniformly polished. The abrasive is mainly composed of solid abrasive grains (abrasive grains) and oxidizing materials. As the solid abrasive grains, alumina abrasive grains or silica abrasive grains having a particle diameter of several tens to several hundreds of nm may be used. As the oxidizing substance, hydrogen peroxide (H2O2), ferric nitrate (Fe (NO3) 3) and potassium oxalate (KIO3) can be used. The cleaning section 2120 cleans and dries the polished wafer from the polishing section 2110. Therefore, the washing section 2120 includes a washing water spraying nozzle 2121 for spraying washing water, and an air spraying nozzle 2122 for supplying gas to dry the wafer with washing water. The enlarged display section 2130 acquires an image of the wafer and enlarges and displays the image. Accordingly, the operator can confirm the polishing state of the wafer through the enlarged display section 2130. [ The enlarged display section 2130 includes an image sensor 2131 such as CCD or CMOS for acquiring an image of the wafer and converting it into an electric signal, a control circuit 2132 for processing the signal received from the image sensor and transmitting the signal to the display device, A display device 2133 such as an LCD, a PDP, an LED, and an OLED for displaying a signal transmitted from the display device 2132 on the screen. 11, the sample holding unit 2140 includes a piezoelectric actuator 2142 coupled to the linear motor 2141 and the linear motor 2141 under the vacuum chuck 2143 coupled to the lower side of the piezoelectric actuator 2142, ). The specimen holding unit 2140 thus configured holds the wafer W by the suction force of the vacuum chuck 2143 and moves the wafer W up and down. Conventionally, molding or adhesive is used to hold a wafer, but this method is robust, but has a disadvantage that it is troublesome and time consuming. The method according to the present invention is advantageous in that it is easy to attach and detach wafers, thereby reducing work time and cost. The vacuum chuck is preferably fabricated using a porous metal. Further, by controlling the force of the wafer contacting the abrasive 2111 by using the piezoelectric actuator 2142 and the linear motor 2141, it is possible to control the accurate polishing amount. The transfer unit 2150 allows the specimen holding part 2140 to be transferred between the polishing part 2110, the cleaning part 2120 and the enlarged display part 2130. The transfer unit 2150 includes a linear module (LM) guide (not shown) for guiding the transfer of the specimen holding part 2140 and a pneumatic cylinder (not shown) for providing a transfer force to the specimen holding part 2140. [ Or a linear motor (not shown) may be used. A linear motor is preferred for precise control. Further, a control device for operating the pneumatic cylinder or the linear motor is further provided, and the wafer is polished. Then, the specimen holding part is transferred through button operation without any manual operation such as detaching the wafer from the specimen holding part, Because it can be confirmed, work efficiency is greatly improved. The reciprocating unit (not shown) causes the sample holder 2140 to reciprocate right and left when the polishing unit 2110 polishes the wafer. As the reciprocating unit, an LM guide and a pneumatic cylinder may be used, or a linear motor may be used. As the wafer is polished while linearly reciprocating, it is possible to precisely adjust the amount of polishing by measuring the amount of polishing performed once in a linear reciprocating motion. On the other hand, such a wafer polishing apparatus is performed in a workplace where an air conditioning system or a cooling / heating air conditioning control system is operated. Hereinafter, the air conditioning system and the cooling / heating air control system will be described, respectively.

Air conditioning system

29 to 32, the air conditioning system includes a plurality of cooling / heating units connected to communicate at least one indoor unit and one outdoor unit for controlling the same, and at least one ventilation unit and one And a central processing unit for controlling an interlocking operation between the cooling / heating unit and the ventilation system is connected to the cooling / heating unit and the ventilation system so that the central processing unit can communicate with the cooling / heating unit and the ventilation system. Here, it is preferable that the outdoor unit and the indoor unit of the cooling / heating unit, or the control means of the ventilation system and the ventilator are connected through a wired or wireless communication line. The central processing unit, the cooling / heating unit, or the central processing unit and the ventilation system are preferably connected through a network communication line so that data transmission / reception by a network protocol is performed. The central processing unit is connected to the cooling / heating unit or the ventilation system through an Ethernet to control the operation of the cooling / heating unit or the ventilation system. The cooling / heating unit or the ventilation system controls the operation of the Ethernet And an Ethernet gateway for accessing the advanced central controller through the Ethernet gateway. The central processing unit is composed of a cooling / heating unit or a simple central controller connected to the ventilation system through a network communication line to control operation of the air conditioning or ventilation system. The central processing unit may further include an integrated power system for controlling the power of each indoor unit or the ventilator by sensing the power consumption of the cooling / heating unit or the ventilation system. The outdoor unit of the cooling / heating unit transmits information on outdoor information and indoor unit connected thereto to the central processing unit, receives operation control signals of the indoor units output from the central processing unit, and controls operation of the indoor unit The control means of the ventilation system transmits the information of the ventilator connected to the ventilator to the central processing unit, receives the operation control signal of each ventilator output from the central processing unit, Respectively. In order to achieve the above object, the present invention provides a control method of an air conditioning system comprising an air conditioning system in which at least one indoor unit is connected to one outdoor unit, and a ventilation system in which at least one ventilation unit is connected to one controller, Setting an interlocking operation condition of an indoor unit and a ventilation unit for each zone through a mutual data communication with the outdoor unit and the controller in a central processing unit connected to the device and the ventilation system and the communication line; And controlling the indoor unit and the ventilation unit to operate in an interlocking manner according to the set operation conditions. The present invention also provides a control method for an air conditioning system including an air conditioning system in which at least one indoor unit is connected to one outdoor unit and a ventilation system in which at least one ventilation unit is connected to one controller, Setting an interlocking operation condition of an indoor unit and a ventilator in each zone through a network communication with the outdoor unit and the controller in a central processing unit connected to a communication network; And controlling the indoor unit and the ventilation unit to operate in an interlocked manner according to the set operation conditions. Therefore, according to the present invention, it is possible to implement an air conditioning system including a plurality of cooling and heating units and a plurality of ventilation systems, and to control the interlocking operation between the air conditioning unit and the ventilation system through the central processing unit. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. 29 and 30 show the construction of the air conditioning system. In the air conditioning system, a plurality of cooling and heating units 60100 and a plurality of ventilation systems 60200 are connected to the central processing unit 60300 through a network communication line , And the central processing unit (60300) controls the interlocking operation between the cooling / heating unit (60100) and the ventilation system (60200). In detail, a plurality of cooling and heating units 60100 connected to communicate with at least one indoor unit 60110 and one outdoor unit 60130 for controlling the indoor unit 60110 are provided, and at least one ventilation unit 60210 and a control unit A plurality of ventilation systems 60200 are connected so that one control means 60230, 250 and 250 'for communicating with the ventilation system 60200 can communicate with the ventilation system 60200, The processing apparatus 60300 is connected to the cooling / heating apparatus 60100 and the ventilation system 60200 so as to be communicable with each other.

In the case of the multi-type and multi-compressor type, the cooling / heating apparatus 60100 is configured such that a plurality of indoor units are connected to one outdoor unit and a package air conditioner (PAC) and a room air conditioner The outdoor unit and the indoor unit are connected by a one-to-one connection. The indoor unit 60110 and the outdoor unit 60130 of the cooling and heating unit 60100 are connected to each other through an oil and wireless communication line 60150 so that data can be exchanged between the indoor unit 60110 and the outdoor unit 60130. According to this configuration, the outdoor unit 60130 shares indoor information of all the indoor units 60110 connected to the outdoor unit 60110, transmits the indoor information to the central processing unit 60300, And controls the corresponding indoor unit 60110 according to the control signal. The ventilation system 60200 includes a group controller 60230 that can group a plurality of ventilation devices 60210 into groups and control them in groups, and a main controller 60250 that performs data transfer with the at least one group controller 60230. [ ). Further, the ventilator 60210 can be constituted by a separate controller 60250 'that can individually control and connect the ventilators 60210 one-to-one. At this time, the ventilator 60210 and the group controller 60230, or the group controller 60230 and the main controller 60250, or the ventilator 60210 and the individual controller 60250 ' (60 group controllers, main controllers, individual controllers) (60230, 60250, 60250 '), which are connected to each other through a bus (not shown). According to this configuration, the group controller 60230, the main controller 60250, and the individual controller 60250 'share the information of all the ventilators 60210 connected thereto and transmit them to the central processing unit 60300 And controls the ventilator 60210 in accordance with the operation control signal output from the central processing unit 60300. The central processing unit 60300 and the cooling and heating unit 60100 or the central processing unit 60300 and the ventilation system 60200 are connected to each other through a network communication line 60500 so as to transmit and receive data by a network protocol . In other words, an outdoor unit 60130 that shares indoor information of the indoor unit 60110; The control means (group controller, main controller, individual controller) 60230, 60250, 60250 'sharing the information of the ventilation device 60210 is connected to the network communication line 60500 so as to be able to exchange data with the central processing unit 60300 Lt; / RTI > That is, the central processing unit 60300 is connected to the outdoor unit 60130 of the cooling / heating unit 60100 and the control unit 60230, 60250, and 60250 'of the ventilation system 60200 via the network communication to the indoor unit 60110 and the ventilator 60210, and can control the interlocking operation of the indoor unit 60110 and the ventilator 60210 based on this information. Since the indoor unit 60110 and the ventilation unit 60210 are installed together in one zone, the indoor units 60110 and 60210 are installed in the same zone in consideration of the indoor information of the corresponding zone by the zones 660A, 660B, and 660C 60110 and the ventilator 60210 are effective for improving indoor air quality. The central processing unit 60300 is connected to the heating / cooling unit 60100 or the ventilation system 60200 through an Ethernet 60311 and is connected to the cooling / heating unit 60100 or the ventilation system 60200 An air conditioner 60100 or ventilation system 60200 is connected to the network communication line 60500 and connected to the advanced central controller 60310 via the Ethernet 60311 And an Ethernet gateway 60313.

The central processing unit 60300 is connected to the air conditioning unit 60100 and the ventilation system 60200 through a network communication line 60500 to control the operation of the air conditioning unit 60100 or the ventilation system 60200 And a simple central controller 60330. For example, in the case of an outdoor unit having 16 indoor units information, 16 indoor units can be controlled by using a simple central controller for controlling 16 rooms. The central processing unit 60300 is connected to all indoor units 60110 or an integrated power system 60350 for controlling the power of each indoor unit 60110 or the ventilator 60210 by monitoring the power consumption of the ventilator 60210. According to such a configuration, the central processing unit 60300 can centrally control the power of all the indoor units 60110 and the ventilator 60210 through network communication between the cooling / heating unit 60100 and the ventilation system 60200. In the air conditioning system according to the present invention configured as described above, an embodiment of the interlocking operation control method of the air conditioner 60100 and the ventilation system 60200 will be described. 31 is a flowchart showing a method of controlling an interlocked operation of an air conditioning system in the case of summer. The central processing unit 60300 of the air conditioning system according to the present invention is connected through a network communication line 60500 so as to transmit and receive data to and from the air conditioner 60100 and the ventilation system 60200. As shown in the figure, the central processing unit 60300 periodically receives the outdoor temperature and the indoor temperature sensed by the indoor unit 60110 from the outdoor unit 60130 sharing information of all the indoor units 60110 (S610). At this time, the central processing unit 60300 outputs an operation control signal for controlling the interlocking operation of the indoor unit 60110 and the ventilator 60210 according to the zone, based on the outdoor temperature and the indoor temperature level of each zone. Subsequently, the operation control signal output from the central processing unit 60300 is transmitted to the outdoor unit 60130 of the cooling / heating unit 60100 and the control unit 60230, 60250, 60250 'of the ventilation system 60200 through the network communication , The outdoor unit 60130 and the control units 60230, 60250, and 60250 'control operations of the indoor unit 60110 and the ventilator 60210 in the respective zones according to the operation control signal transmitted from the central processing unit 60200 do. In detail, the outdoor temperature level received from the outdoor unit 60130 is determined (S612). If the outdoor temperature is higher than the predetermined first outdoor set temperature T1, the indoor temperature level of the indoor unit 60110 (S614). If the current outdoor temperature is higher than the first outdoor preset temperature T1 and the indoor temperature of the specific area is higher than the first indoor set temperature 60C1, the ventilator 60210 is stopped to quickly lower the indoor temperature of the corresponding area And sets the air volume (60 cold air) of the indoor unit 60110 as 'strong wind' (S616). On the other hand, if the outdoor temperature is higher than the first outdoor preset temperature T1 but the indoor temperature is lower than the first indoor set temperature 60C1 and higher than the second indoor set temperature 60C2, And sets the indoor unit 60110 to 'Storm' (S618 and S20). If the current outdoor temperature is higher than the first outdoor preset temperature T1 but the indoor temperature is lower than the second indoor set temperature 60C2, the ventilator 60210 of the corresponding area is set as' To " weak wind " (S622). On the other hand, when the outdoor temperature is lower than the first outdoor set temperature T1 and higher than the second outdoor set temperature T2, the indoor temperature of the specific area is lower than the first indoor set temperature 60C1 and the second indoor set temperature 60C2, the ventilator 60210 of the corresponding area is set as a "weak wind", and the indoor unit 60110 is set as a "blow" (S624 to S28). If the outdoor temperature is lower than the first outdoor preset temperature T1 and higher than the second outdoor preset temperature T2 and the indoor temperature is lower than the second indoor set temperature 60C2, And sets the indoor unit 60110 as 'weak wind' (S630). If the current outdoor temperature is lower than the second outdoor preset temperature T2, the ventilator 60210 is set to 'strong wind' and the indoor unit 60110 is stopped to maintain the indoor temperature of the corresponding area (S632). In order to control the interlocking operation of the ventilation device 60210 and the indoor unit 60110 in this way, the outdoor temperature and the indoor temperature of the indoor unit 60110 are periodically received from the outdoor unit 60130, The operating conditions of the ventilator 60210 and the indoor unit 60110 are reset according to the indoor temperature of the area. 32 is a flowchart showing a control method of an interlocked operation of the air conditioning system in the winter season. As shown in the figure, the central processing unit 60300 periodically receives the outdoor temperature and the indoor temperature sensed by the indoor unit 60110 from the outdoor unit 60130 sharing information of all the indoor units 60110 (S650). At this time, the central processing unit 60300 controls the interlocking operation of the indoor unit 60110 and the ventilator 60210 according to the zone, based on the outdoor temperature and the indoor temperature level of each zone. More specifically, the outdoor temperature level received from the outdoor unit 60130 is determined (S652). If the outdoor temperature is lower than the first outdoor preset temperature T11, the indoor temperature level of the indoor unit 60110 is determined (S654). When the outdoor temperature is lower than the first outdoor preset temperature T11 and the indoor temperature of the specific area is lower than the first indoor set temperature H1, the ventilation device 60210 is stopped to quickly raise the indoor temperature of the corresponding area And sets the air volume (60 warm air) of the indoor unit 60110 to 'strong wind' (S656). On the other hand, if the current outdoor temperature is lower than the first outdoor preset temperature T11 but the indoor temperature is higher than the first indoor set temperature H1 and lower than the second indoor set temperature H2, the ventilator 60210 of the corresponding area And sets the indoor unit 60110 as 'Storm' (S658, S60). If the current outdoor temperature is lower than the first outdoor preset temperature T11 but the indoor temperature is higher than the second indoor set temperature H2, the ventilator 60210 of the corresponding area is set as a 'stall', and the indoor unit 60110 And sets it to "weak wind" (S662). On the other hand, when the current outdoor temperature is higher than the first outdoor preset temperature T11 and lower than the second outdoor preset temperature T22, the indoor temperature of the specific zone is higher than the first indoor set temperature H1 and the second indoor set temperature H2, the ventilator 60210 of the corresponding area is set to 'weak wind', and the indoor unit 60110 is set to 'stern' (S664 to S668). If the outdoor temperature is higher than the first outdoor preset temperature T11 and lower than the second outdoor preset temperature T22 and the indoor temperature is higher than the second indoor indoor temperature H2, the ventilator 60210 And the indoor unit 60110 is set as a 'weak wind' (S670). If the current outdoor temperature is higher than the second outdoor preset temperature T22, the ventilator 60210 is set to 'strong wind' and the indoor unit 60110 is stopped (S672) to maintain the indoor temperature of the corresponding zone. In this air conditioning process, the current outdoor temperature and the indoor temperature of the indoor unit 60110 are periodically received from the outdoor unit 60130, and the operation of the ventilator 60210 and the indoor unit 60110 is performed according to the outdoor temperature and the room temperature of each zone The present invention resides in that a plurality of cooling and heating apparatuses 60100 and a ventilation system 60200 are connected to a central processing unit 60300 via a network communication line 60500 so that a plurality The cooling / heating apparatus 60100 and the ventilation system 60200 can be controlled. Since it is possible to transmit and receive data to and from the outdoor unit 60130 having information on a plurality of indoor units 60110 or the control units 60230, 250 and 250 'having information on a plurality of the ventilating units 60210, Zone control and group control for system 60200 is possible.

HVAC control system

As shown in FIGS. 26 to 28, the cold rolling avalanche air conditioning control system is a control system that performs monitoring and control functions for a plurality of heating and cooling air conditioning apparatuses 5010, and controls the operation of each of the plurality of heating and cooling air conditioning apparatuses 5010 A central processing unit (50150) for receiving operation data, which is information on a state, and providing operation parameters for controlling the heating and cooling air conditioning apparatus according to a predetermined algorithm to the air conditioning and heating air conditioning apparatus; The air conditioner 5050 is connected to the plurality of cooling and heating air conditioners 5010 through respective protocols and is connected to the central processing unit 50150 through a TCP / IP protocol, A protocol converter 50110 for relaying data while converting the protocol converter 50110; And a portable terminal (50130) for displaying the operation data to the user and receiving the operation parameter from the manager and providing the operation parameter to the central processing unit. The protocol converter (50110) Gt; 50112 < / RTI >

More specifically, the cooling / heating air conditioning control system includes a protocol converter 50110, a portable terminal 50130, and a central processing unit 50150. At least one cooling and heating air conditioner 5010 is connected to the protocol converter 50110 and the portable terminal 50130 and the central processing unit 50150 are connected to the cloud 50170 via the Internet. Here, the cloud 50170 denotes various servers providing cloud services, that is, a cloud server. The protocol converter 50110 is provided between the plurality of cooling and heating air conditioners 5010 and the central processing unit 50150 to convert protocols between the cooling and heating air conditioner 5010 and the central processing unit 50150. In this case, the protocol converter 50110 is further configured to include a Modbus protocol (50Modbus) 50111 and a protocol converter 50150 as a 50BACnet protocol converter 50112 as shown in Fig. The load control object 50LCO provides parameters and interfaces for controlling and monitoring the load state. FIG. 27 illustrates the parameters defined in the load control object. As shown in FIG. 27, the load control object provides not only a variable for controlling the state of the load but also an interface necessary for the user to control the load.

Among the parameters of the BACnet LCO shown in FIG. 27, there are the 'Requested Shed Level', the 'Start Time', and the 'Shed Duration' for controlling the state of the load. 'Requested Shed Level' means the power usage level of the desired load, which can be used to control the power energy usage of the load. 'Start Time' and 'Shed Duration' mean the start time and control duration for load control, respectively, through which the operation time of the load can be controlled. For example, the load of the load control object (LCO) can be controlled from a predetermined value (Requested Shed Level) at any time from (Start Time) to (Shed Duration). In this case, it is more preferable that the BACnet protocol converter 50112 is further connected to the BACnet client 50120 as shown in FIG. The BACnet protocol converter 50112 is further connected to the configuration control external terminal 50140 so as to control the configuration in the form of a memory mapping (50memory mapping) as shown in FIG. 26 . On the other hand, the plurality of cooling and heating air conditioners 5010 have conventionally known communication protocols such as RS-485, RS-232C, ASIC / 2-7540 or MODBUS 485 RTU. These protocols allow for their own independent and individual connections. On the other hand, since the protocol converter 50110 and the central control unit 50150 are connected by the TCP / IP protocol, the protocol converter 50110 can transmit the information provided by the air conditioning and heating equipment 5010 through their specific communication protocol TCP / IP, and provides them to the central processing unit 50150. The mobile terminal 50130 corresponds to a mobile terminal capable of accessing the Internet using a mobile communication or a wireless LAN interface. In addition to the functions provided by the present invention, various configurations (phones, . However, among these configurations, configurations that are not essential to the description of the present invention are not shown in the drawings and will not be described.

28, the portable terminal 50130 includes a display unit 50201, an input unit 50203, a network interface unit 50205, and a control unit 50210 to perform the cooling / heating air conditioning control characteristic of the present invention. The display unit 50201 is a device for displaying various information such as the LCD 50LCD and the LED 50OLED so as to be visually recognizable. The input unit 50203 is a device for receiving a user's control command. For example, the display unit 50201 and the input unit 50203 are preferably provided in the form of a single touch screen. The network interface unit 50205 has a wireless interface such as a mobile communication network such as Wideband Code Division Multiple Access (WCDMA) or Long Term Evolution (LTE) or a wireless LAN, And transfers various information between the central processing unit 50150 and the control unit 50210 to each other. Although it is described below that information transfer between the central processing unit 50150 and the control unit 50210 of the portable terminal 50130 is performed without going through the network interface unit 50205, this expression is for simplicity of explanation only In practice, information is always transmitted through the network interface unit 50205. The control unit 50210 controls the overall operation of the portable terminal 50130 and specifically includes a control client 50211 to perform the cooling / heating air conditioning control of the present invention. The control unit 50210 may be interpreted as a configuration specifically installed for the present invention, but it may be a configuration that is generally installed to perform a main or basic function (e.g., telephone, communication, etc.) of the portable terminal 50130. When the control unit 50210 is installed to perform the basic functions of the portable terminal 50130, the control unit 50210 includes a processor chip, which is hardware that is basically possessed by the portable terminal 50130, (OS) that operates on the basis of an operating system (OS). In other words, a conventional terminal in which the present invention is not performed may also include a control unit 50210. [ In this case, the control client 50211 may be an application, which is software operating on the operating system program, and installed in a conventional terminal for the implementation of the present invention. In other words, when the control client 50211 of the present invention is installed in a conventional terminal, it becomes the portable terminal 50130 of the present invention. The application may be a program recorded in a computer-readable storage medium provided in a program distribution server (not shown), and the portable terminal 50130 may access the distribution server (not shown) via the Internet The application can be downloaded and installed. The control client 50211 receives the operation data of the cooling and heating unit 5010 from the central processing unit 50150 or the cloud 50170 and displays it to the manager and provides the control command of the manager to the central processing unit 50150. To this end, the control client 50211 may provide a graphical interface for displaying operation data and for collecting control commands. The central processing unit 50150 is connected to the plurality of heating and cooling air conditioning apparatuses 5010 through the protocol converter 50110. The central processing unit 50150 receives the operation parameters for controlling the respective heating and cooling air conditioning apparatus 5010 from the portable terminal 50130 and provides the operation parameters to the corresponding heating and cooling air conditioning apparatus 5010 and outputs the control results to the protocol converter 50110 And the air conditioner 5010 receives and manages the air conditioner. On the other hand, when the heating / cooling air conditioner 5010 can directly connect to the IP network, it can directly transmit / receive data by being connected to the central processing unit 50150 without going through the protocol converter 50110. The central processing unit 50150 displays various kinds of information including the current state / control result / applied operating parameter of each of the heating and cooling air conditioning apparatuses 5010 on its display device (not shown) to provide. The control client 50211 of the portable terminal 50130 receives the request of the manager from the input unit 50203 and connects to the cloud 50170 to download the corresponding operation data and displays the downloaded operation data through the display unit 50201, Monitoring, and control. The central processing unit 50150 performs a plurality of control algorithms for energy saving. First, the central processing unit 50150 compares the operating parameters applied to the heating and cooling air conditioning apparatus 5010 having excellent energy saving performance (for example, the highest value) among the plurality of heating and cooling air conditioning apparatuses 5010 as an 'exemplary operating parameter' And the energy saving performance of the entire air conditioning and air-conditioning apparatus 5010 is improved by implanting the same in the heating / cooling air conditioner 5010 which is the same or similar (in 50 cases, the energy consumption is equal to or greater than the reference value). Next, when the cooling / heating air-conditioning apparatus 5010 is a refrigerating apparatus, the central processing unit 50150 analyzes the operation data received from the air-conditioning and air-conditioning apparatus 5010 to determine whether the cold water outlet temperature of the refrigerating apparatus is 7 ° So as to have a higher set temperature when hunting is severe. The temperature of the cold water outlet is usually 7 ° in the case of freezing, and the fact that the received operation data is hunting around 7 ° means that the operation of the freezer is frequently turned on / off. Therefore, when the motor is operated at a high set temperature (for example, 8 or 9), the input current (i.e., power consumption) of the compressor is reduced and the optimum operating condition in which energy is saved can be maintained. On the other hand, cooling water temperature control. The cooling water temperature is lowered at the cooling tower installed in the outside, and the cooling water of the standard 32 ° is continuously supplied. If the heat transfer pipe of the condenser through which the cooling water passes is contaminated, the heat transfer performance of the cooling water heat transfer pipe is lowered and the performance is not achieved. Even if the consumption input higher than the rated value is inputted, the standard performance is not obtained. At this time, the central processing unit 50150 can recognize such matters by using the operation data, and display a warning message so that the manager can carry out the customs work of the corresponding heat transfer pipe. Also, in the case where a plurality of freezers are installed in a specific site (e.g., a factory) When the on / off operation of the refrigerator is greater than the reference number of times, control is performed to turn off one of the plurality of refrigerators.

Wafer Polishing Apparatus 2

Referring to Figs. 13 to 14, as another embodiment of the wafer polishing apparatus according to Fig. 10, a buffer module for buffering the bottom portion with the body portion B of the wafer polishing apparatus 100 is provided. (LU) for adjusting the separation distance between the lower unit 3812 and the bottom portion of the body portion B, and the buffer unit 3811 is arranged on the lower unit 3812 within a certain range And a plurality of flow paths are provided. The buffering unit 3811 includes a first mode located on each corner of the lower unit 3812 and a second mode in which the buffer unit 3811 is moved simultaneously or non-dynamically from the respective corner toward the virtual center of the lower unit 3812 And to operate in a second mode of flow. Hereinafter, the buffer module will be described in detail.

Buffer module

FIG. 15 is a view schematically showing a part of the configurations according to FIG. Referring to FIG. 15, the buffer module 381 includes a lower unit 3812 in contact with the bottom portion and a buffer unit 3811 in contact with the body portion from above the lower unit 3812. The buffer unit 3811 includes an upper fixing plate 3811a that faces the bottom of the body portion, a lower fixing plate 3811b that faces the lower unit 3812, and a lower fixing plate 3811b that faces the upper fixing plate 3811a and the lower fixing plate 3811b. And elastic housings 3811c and 3811d provided between the two housings 3811a and 3811b. At this time, the outer side portions of the elastic housings 3811c and 3811d are formed in a zigzag shape. An elastic filler 3811e is filled in the elastic housings 3811c and 3811d so that the elastic fillers 3811e are filled to correspond to the shapes of the elastic housings 3811c and 3811d and the elastic fillers 3811e A plurality of predetermined buffer spaces H1 are formed along the longitudinal direction, and internal reinforcing plates are provided between the respective buffer spaces H1. At this time, it is preferable that the buffer space H1 is formed to have a width equal to or larger than the width of the inner reinforcing plate. The uppermost reinforcing plate 3811f facing the upper fixing plate 3811a among the inner reinforcing plates has a bottom protrusion T1 of a predetermined shape on the lower surface thereof. The uppermost reinforcing plate 3811g of the lower reinforcing plate 3811b facing the lower fixing plate 3811b has a predetermined upper surface protrusion T2 formed on the upper surface of the upper reinforcing plate 3811f and the uppermost reinforcing plate 3811f, 3811g are formed with upper surface protrusions T2 and lower surface protrusions T1 on the upper surface and the lower surface, respectively. Each of the upper end reinforcing plate 3811f, the intermediate reinforcing member 3811h and the lower end reinforcing plate 3811g may be formed such that the upper protrusion T2 and the lower protrusion T1 And are brought into mutual contact via the buffer space H1. Here, the upper surface protruding portion T2 and the lower surface protruding portion T1 may be formed as concave and convex shapes that are mutually combined.

FIG. 16 is a view schematically showing another embodiment of the buffer module among the configurations according to FIG. 16, the upper fixing plate 3811a includes a first fixing plate 3811a1 disposed above and facing the bottom of the body, a second fixing plate 3811a1 coupled to a lower portion of the first fixing plate 3811a1 to be slidable in a horizontal direction, And a second fixing plate 3811a2 facing the elastic housing 3811c and 3811d and the uppermost reinforcing plate 3811b1. The lower fixing plate 3811b is connected to a lower third fixing plate 3811b1 which is in contact with the lower unit 3812 and to an upper portion of the third fixing plate 3811b1 so as to be slidable in the horizontal direction, 3811c and 3811d, and a fourth fixing plate 3811b2 facing the lowermost reinforcing plate 3811g. The elastic filler 3811e is formed with a predetermined hollow region H2 at its central portion and a buffer 3811i for buffering the body portion corresponding to an external impact is provided on the hollow region H2. The buffer 3811i includes an upper plate 3811i1 and a lower plate 3811i2 which are coupled to each other via elastic means and the upper plate 3811i1 and the lower plate 3811i2 are connected to the upper plate 3811a and the lower And is fixed to the fixed plate 3811b so as to be slidable in the horizontal direction.

Fig. 17 is a view showing another embodiment of the uppermost stiffener, the plurality of stopped stiffeners, and the lowermost stiffener of the structures according to Fig. 13. Fig. 17, the uppermost reinforcing plate 3811f includes an uppermost upper plate 3811f1 contacting the upper fixing plate 3811a and an uppermost lower plate 3811f2 coupled to the uppermost plate via the elastic body E2 do. Here, a bottom projection portion T1 is formed on the bottom surface of the uppermost lower plate 3811f2. The suspended reinforcement member 3811h includes an intermediate upper plate 3811h1 facing the uppermost lower plate 3811f with the buffer space H1 interposed therebetween and a lower bottom plate 3811h1 coupled with the intermediate upper plate 3811h1 via an elastic body 3811h2). An upper surface protrusion T2 is formed on the upper surface of the intermediate upper plate 3811h1. The lowermost reinforcing plate 3811g includes a lowermost top plate 3811g1 facing the bottom plate 3811h2 with the buffer space therebetween and a lowermost bottom plate 3811g2 joined with the bottom plate 3811g1 via an elastic body . An upper surface protrusion T2 is formed on the upper surface of the lowermost top plate 3811g1.

FIG. 18 is a view showing another embodiment of the shock absorber unit 3811 among the structures according to FIG. 18, the second fixing plate 3811a2 extends at least outward beyond the area of the first fixing plate 3811a1, and the second fixing plate 3811a2 extends upward at both ends of both sides of the second fixing plate 3811a2 The upper projecting portion UT is formed. The fourth fixing plate 3811b2 extends at least outward beyond the area of the third fixing plate 3811b1 and has a downward protruding portion DT extending upward at each end of the outer sides of the fourth fixing plate 3811b2 Is formed. At least a part of the upper projecting portion UT is positioned to face the first fixing plate 3811a1. The upper projecting portion UT and the first fixing plate 3811a1 are coupled to each other by elastic means E5, Restoring force is given. At least a part of the downward projecting portion DT is positioned to face the fourth fixing plate 3811b2 so that the lower protrusion DT and the fourth fixing plate 3811b2 are bound to each other by the elastic means E6, . On the other hand, the buffer unit 3811 has been described on the assumption that the overall shape is a rectangular parallelepiped or a cuboid. That is, the upper fixing plate 3811a, the lower fixing plate 3811b, and the elastic housing 3811c are formed of a rectangular parallelepiped or hexahedron. Here, the elastic housing 3811c is formed in a zigzag shape as described above, so that the shock absorbing member 3811c can smoothly bend upward and downward more smoothly against external shocks. The shock absorber 3811i also allows the shock absorber 3811i to buffer more easily in response to an external impact with the elastic housing 3811c. The uppermost reinforcing plate 3811f, the lowermost reinforcing plate 3811g and the interrupted reinforcing member 3811h are also connected to the elastic filler 3811e via the buffer space H1, Contact in a buffered manner. At this time, the uppermost reinforcing plate 3811f, the lowermost reinforcing plate 3811g, and the intermediate reinforcing member 3811h serve to suppress the flow in the horizontal direction through the upper surface protruding portion T2 and the lower surface protruding portion T1, Thereby preventing the flow caused by the impact. That is, although not shown in the figure, when the shock absorber 3811 is compared with the shock absorber before and after the impact, the shape after the impact is exerted is constantly pressed between the upper and lower sides.

19 to 21 are views showing still another embodiment of the shock absorber unit among the structures according to FIG. Hereinafter, the description will be focused on the technical features. 19 to 21, the buffer module 381 includes a lower unit in contact with the bottom portion and a buffer unit 3811 in contact with the body portion above the lower unit, A lower fixing plate 3811b facing the lower unit and an elastic housing 3811c provided between the upper fixing plate 3811a and the lower fixing plate 3811b, 3811d, and the outer side portions of the elastic housings 3811c, 3811d are formed in a zigzag shape. An elastic filler 3811e is filled in the elastic housing 3811c and 3811d so that the elastic filler 3811e is filled to correspond to the shape of the elastic housing 3811c and 3811d, A plurality of cushioning spaces H1 are formed in the cushioning space H1 and an inner reinforcing plate is provided between the cushioning spaces H1. The cushioning space H1 is formed to have a width greater than the width of the inner reinforcing plate, The uppermost reinforcing plate facing the upper fixing plate 3811a of the inner reinforcing plates is formed with a bottom protrusion T1 having a predetermined shape on a lower surface thereof, The reinforcing plate has an upper surface protruding portion T2 having a predetermined shape on the upper surface thereof and the intervening reinforcing members 3811h positioned between the uppermost reinforcing plate and the lowest reinforcing plate have projections T3 on the upper and lower surfaces, . A plurality of first pressing force measuring sensors S1 for measuring a first pressing force generated between the upper fixing plate 3811a and the body portion are spaced apart from each other on the upper fixing plate 3811a, And a second pressing force measurement sensor S2 for measuring a second pressing force generated between the lower fixing plate 3811b and the lower unit is spaced apart from the lower fixing plate 3811b. A second cushioning space H3 is formed on the elastic filler 3811e positioned between the buffer spaces H1 and a support unit 3811b having a predetermined shape is provided between the upper and lower fixing plates 3811a and 3811b. (3191). Each stop reinforcement member 3811h is disposed on the support unit 3191 while being positioned on the second cushion space H3 so as to be rotatable. On the support unit 3191, driving means 3190 . Each of the suspended reinforcing members 3811h is operated in conjunction with the driving means 3190. [ Each of the suspended reinforcing members 3811h is provided so as to be able to flow to one side and the other side in the longitudinal direction on the second cushioning space H3 through the driving means 3190. [ The control unit further includes a control unit for controlling the operation of the buffer unit 3811. The control unit controls the operation of the interrupt reinforcement member 3811h based on the measured first pressing force and the second pressing force When the first pressing force and the second pressing force exceed a predetermined value, the stopping reinforcing member 3811h is rotated at a high speed, and when the first pressing force and the second pressing force are less than a predetermined value, . The driving unit 3190 is provided to be able to move up and down within a certain range on the supporting unit 3191 and the control unit adjusts the height of the interrupted reinforcing member 3811h through the driving unit 3190, When the first pressing force exceeds a predetermined value, the driving means (3190) of the upper portion of the driving means (3190) is caused to flow upward, and when the second pressing force exceeds the predetermined value , And a part of the downward driving means (3190) of the driving means (3190) is caused to flow downward.

More specifically, the driving unit 3190 includes a driving unit 3191 mounted on the supporting unit 3191 to generate torque and being able to move up and down on the supporting unit 3191, 3811h and a piston 3194. The cylinder 3193 and the piston 3194 cooperate with each other. The suspended reinforcement member 3811h can flow vertically and horizontally based on the flow of the driving unit 3191 or the flow of the cylinder 3193 and the piston 3194. The suspended reinforcement member 3811h includes an odd column interrupted reinforcement member 3811h provided in an odd column in a height direction and an even column interrupted reinforcement member 3811h provided in an even column, , The odd column interrupted reinforcing members 3811h are located on the center axis, and the even column interrupted reinforcing members 3811h are provided before and after the center axis, respectively.

FIG. 22 is a view showing another embodiment of the shock absorber unit among the structures according to FIG. Hereinafter, the description will be focused on the technical features. 22, an elastic module 200 for generating an elastic force restricting force between the upper fixing plate 3811a and the lower fixing plate 3811b between the upper fixing plate 3811a and the lower fixing plate 3811b, And a clamping module 300 for clamping the respective ends of the upper fixing plate 3811a and the lower fixing plate 3811b. 3, the upper fixing plate 3811a and the lower fixing plate 3811b are clamped so as to be pressed against each other based on the elastic module 200. [ The elastic module 200 includes a first support member 3201 which is in contact with the upper fixing plate 3811a, a second support member 3202 which is in contact with the lower fixing plate 3811b, 3201) and the second support member (3202). The first elastic force detection sensor S3 is provided on the first area of the upper fixing plate 3811a which is in contact with the first supporting plate 3201 and the lower fixing plate 3811b The second elastic force detection sensor S4 is provided on the second area of the second elastic force sensor S4. The control unit controls the clamping operation of FIG. 3 based on the first elastic force detection sensor S3 and the second elastic force detection sensor S4. 3 is a perspective view of the main body 3301. The main body 3301 includes a first main body 3301 and a second main body 3302. The first main body 3301 includes a central body 3301, And a second fluid 3303. The first support member 3201 is coupled to the first fluid member 3302 so that the second support member 3202 can move up and down independently of the first support member 3202. The second support member 3202 is coupled to the second fluid member 3303, And a third support member 3304 is provided on the first fluid 3302 so as to face the first support member 3201 with the upper support plate 3811a interposed therebetween. A fourth support member 3305 is provided on the second fluid 3303 so as to face the second support member 3202 with the lower support plate 3811b interposed therebetween. The third support member 3304 is vertically protruded outward from the longitudinal direction of the first fluid member 3302 and the fourth support member 3305 extends from the longitudinal direction of the second fluid member 3303 And can vertically protrude outward. The control unit sequentially or non-sequentially controls the series of operations of FIG. 3 and the elastic module. A detailed description of the organic operation mode between FIG. 3 and the elastic module will be omitted.

FIG. 23A is a view showing another embodiment of the shock absorber among the configurations according to FIG. 23A, a first cushioning member 3401 is provided between an upper fixing plate 3811a and a lower fixing plate 3811b, and the first cushioning member 3401 is formed so as to be adjacent to the elastic housing 3811c And includes a hard glass material which is shattered by an external impact. The first cushioning member 3401 is provided in a plurality of rows and a second cushioning member 3402 made of a hard glass material is provided between the first cushioning members 3401 having a plurality of rows, The first buffer member 3402 has different strengths. The first cushioning member 3401 and the second cushioning member 3402 each include third cushioning members 34011 and 34021 made of a hard glass material and the third cushioning member 3401 includes a first cushioning member 3401, (3401) and the second buffer member (3402). A predetermined partition plate 308 is provided between the elastic module 200 and the elastic housing 3811c and between the partition plate 308 and the elastic housing 3811c a fourth buffer member 3403 and a second buffer member 3403 are interposed between the partition plate 308 and the elastic housing 3811c. 5 buffer member 3404 is provided. The fourth cushioning member 3403 is formed to be in contact with the elastic housing 3811c and the fifth cushioning member 3404 is provided between the partition plate 308 and the fourth cushioning member 3403.

FIG. 23B is a view showing another embodiment of the shock absorber among the structures according to FIG. Referring to FIG. 23B, the upper fixing plate 3811a includes a first upper fixing plate 381ac and a second upper fixing plate 381c. The first upper fixing plate 3811a includes a plurality of first pressing force measuring sensors S1, And a second upper fixing plate 381ab which faces the bottom surface of the body part B. The first pressing force measuring sensor S1 is provided on the first upper fixing plate 381ac with a predetermined first guide portion 392. The first pressing force measuring sensor S1 is disposed on the first guide portion 392 to the left, Respectively.

And a suction unit 391 for suctioning the bottom of the body part B is provided on the second upper fixing plate 381ab. A predetermined second guide portion 393 is provided on the second upper fixing plate 381ab and the suction portion 391 is provided on the second guide portion 393 so as to flow leftward, do. The suction unit 391 is provided so as to be able to come into contact with the first pressing force measuring sensor S1.

The suction unit 391 includes a suction body B 3911 and a flange portion 3922 above the suction body B so as to correspond to the first pressing force measurement sensor S1 And the control unit causes the first pressing force measuring sensor S1 and the suction unit 391 to flow in correspondence with each other, The first pressing force measuring sensor (S1) measures the first pressing force through the adsorbing part (391). This structural feature is also applicable to the lower fixing plate 3811b.

13 to 14, a lifting unit (LU) for adjusting a separation distance between the lower unit 3812 and the bottom portion of the body portion B is provided And a plurality of the buffer units 3811 are provided so as to be able to flow within a certain range on the lower unit 3812. The buffering unit 3811 includes a first mode located on each corner of the lower unit 3812 and a second mode in which the buffer unit 3811 is moved simultaneously or non-dynamically from the respective corner toward the virtual center of the lower unit 3812 And to operate in a second mode of flow.

The control unit controls the buffer unit 3811 in the first mode or the second mode in a state in which the lower unit 3812 and the bottom portion of the body portion B are spaced apart from each other through the lifting means LU, Mode. The lifting means LU includes a first lifting means LU1 provided between the buffering units 3811 on the basis of the first mode and a second lifting means LU2 provided on the bottom surface of the buffering unit 3811 in the first mode, A second lifting means LU2 protruding upward in the second mode and performing a lifting operation; and a second lifting means LU2 protruding upward in the second mode and having a smaller diameter than the first lifting means LU1 between the buffering unit 3811 on the basis of the first mode And a third lifting means LU3 provided.

The control unit primarily drives the first lifting unit LU1 and the third lifting unit LU3 and secondarily operates the buffering unit 3811 in the first mode, And drives the second lifting means.

≪ Semiconductor facility management step (S120) >

Hereinafter, the semiconductor facility management step will be described with reference to FIGS. The step of managing the semiconductor facility includes the steps of: determining whether online communication between the host and the semiconductor facility has been restored; receiving emergency state data from the semiconductor facility if the online communication is restored; Determining whether the semiconductor facility is in a warning state by searching the emergency state data; Determining whether the warning condition is in a dangerous state if the semiconductor facility is in a warning state; Changing the variable ID key value of the semiconductor facility, loading the variable ID into the semiconductor facility control message, downloading the semiconductor facility control message to the semiconductor facility and turning off the semiconductor facility if the warning condition is in a dangerous state ; If the warning state is not a dangerous state, it is determined whether or not a predetermined lot input signal has been input, and if the lot input signal is input, a warning message is downloaded to the O / I PC. Preferably, the semiconductor facility control message is a stream function message. Preferably, the semiconductor facility control message is S2F21 or S2F41. Preferably, the variable ID is an ECID. Accordingly, in the present invention, the emergency state of the semiconductor equipment after the online communication recovery time is accurately managed. More specifically, as shown in FIG. 24, the host 401 is provided with an emergency state monitoring module 4020 for monitoring emergency state data uploaded from the semiconductor facility 403 after an online communication recovery time. Accordingly, after the online communication recovery point, the emergency state of the semiconductor facility 403 is grasped in real time by the emergency state monitoring module 4020. [ Here, the operator gives the reporting function to the semiconductor equipment 403 corresponding to the emergency state monitoring module 4020, so that the emergency state of the semiconductor facility 403 is reported to the emergency state monitoring module 4020 in real time . The emergency state monitoring module 4020 can promptly transmit the emergency state of the semiconductor facility 403 to the worker or turn off the entire semiconductor facility 403 so that the lot of the semiconductor equipment 403 in the emergency state (4010) can not be inserted. 25, first, the emergency state monitoring module 4020 determines whether online communication between the host 401 and the semiconductor facility 403 has been restored (S411). At this time, if online communication between the host 401 and the semiconductor facility 403 has not been restored, the emergency state monitoring module 4020 ends the flow. On the other hand, if online communication between the host 401 and the semiconductor facility 403 has been restored, the emergency state monitoring module 4020 receives emergency state data uploaded from the semiconductor facility 403 via the semiconductor facility server in real time (S412). Accordingly, the emergency state of the semiconductor facility 403 after the on-line communication recovery point is quickly detected by the emergency state monitoring module 4020. [ Next, the emergency state monitoring module 4020 searches the emergency state data to determine whether the state of the semiconductor facility 403 is a warning state (S420). At this time, if the state of the semiconductor facility 403 is not the warning state and it is determined that the normal state is the run state, the emergency state monitoring module 4020 proceeds to the step S11 to continue the emergency state data reception. On the other hand, if the state of the semiconductor facility 403 is a warning state, the emergency state monitoring module 4020 determines again whether the warning state is in a dangerous state to determine the instability of the semiconductor facility 403 (S430) . At this time, if the warning state of the semiconductor facility 403 is in a dangerous state and it is determined that the semiconductor facility 403 is in a very unstable state, the emergency state monitoring module 4020 transmits the result to the host 401, The semiconductor device 401 immediately turns off the process of the semiconductor device 403 by changing the variable ID key value of the corresponding semiconductor device 403 to the off state at step S441. Here, preferably, the variable ID changed by the host 401 is an ECID (Equipment Constant ID) that can change the status of the semiconductor facility 403 collectively. Subsequently, the emergency state monitoring module 4020 receives the variable ID whose key value is changed from the host 401 through the above-described process, loads it in the semiconductor facility control message, downloads it to the semiconductor facility 403 through the semiconductor facility server (S442). Thus, the semiconductor facility 403 is immediately turned off. In the case of the present invention, the host 401 accurately grasps the emergency state of the semiconductor device 403 after the on-line communication recovery time through the emergency state monitoring module 4020, In particular, in a dangerous state, the semiconductor device 403 is completely turned off to completely block the process progress by the semiconductor device 403, thereby preventing a process accident in advance. According to an aspect of the present invention, the semiconductor facility control message downloaded from the emergency state monitoring module 4020 to the semiconductor facility 403 is a stream function message, which is desired to be communicated. Here, preferably, the stream function form of the semiconductor facility control message is S2F21 or S2F41 appropriate to the standardization standard. For example, if the emergency state monitoring module 4020 detects the emergency state of the semiconductor facility 403 through the above process and desires to turn off the state of the semiconductor facility 403 altogether, the emergency state monitoring module 4020 The ECID having the key value changed to the 'off' state is received through the host 401 and is loaded into the stream function message S2F21 or S2F41 to be downloaded to the semiconductor facility 403 so that the state of the semiconductor facility 403 is changed to the ECID Quickly change to 'off' according to key value. As a result, unpredictable process accidents are prevented in advance. On the other hand, if it is determined that the warning state of the semiconductor facility 403 is not in a dangerous state and the semiconductor facility 403 is in a slightly unstable state, the emergency state monitoring module 4020 sets the lot to the O / It is again determined whether or not a signal is input (S451). At this time, if the lot input signal is not input to the O / I PC 402, the emergency state monitoring module 4020 determines that the process progress by the operator has not yet been completed, and ends the flow. On the other hand, if the lot input signal is input to the O / I PC 402, the emergency state monitoring module 4020 determines that the lot 4010 is inputted to the semiconductor equipment 403 in the emergency state by the operator, To the O / I PC 402 so that the operator can visually confirm the emergency state of the semiconductor facility 403 (S452). For example, the emergency state monitoring module 4020 processes the emergency state of the semiconductor facility 403 as text data, and then, for example, 'the present semiconductor facility is in a warning state. Please stop the track-in process. ' Etc. to the O / I PC 402 so that the operator can grasp the emergency state of the semiconductor facility 403 and can quickly carry out subsequent work in conformity with the emergency state. Accordingly, the problem that the lot 4010 is loaded by the semiconductor equipment 403 in the emergency state due to the operator's mistake is prevented in advance. The host 401 accurately grasps the emergency state of the semiconductor facility 403 through the emergency state monitoring module 4020 and then receives the above warning message when the input signal of the lot 4010 is input to the O / By displaying the operator's attention, it is possible to prevent unforeseen process accidents in advance. Further, in the present invention, the host 401 can automatically manage the emergency state of the semiconductor equipment after the on-line communication recovery time through the emergency state monitoring module 4020, without requiring confirmation by the operator, thereby significantly reducing the workload of the worker . The form of the warning message may be variously selected according to the specifications of the O / I PC 402. Then, the emergency state monitoring module 4020 efficiently manages the emergency state of the semiconductor facility 403 by continuously repeating the above-described steps. As described above, according to the present invention, the emergency state of the semiconductor equipment is automatically managed after the on-line communication recovery time through the emergency state monitoring module, so that unexpected process accidents can be prevented in advance.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

100: wafer polishing apparatus 110: polishing unit
111: abrasive agent 120:
121: wash water spray nozzle 122: air spray nozzle
130: magnification display section 131: image sensor
132: Control device 133: Display device
140: specimen holding unit 150: transfer unit
160: reciprocating unit

Claims (18)

A method of managing a semiconductor device for manufacturing a semiconductor chip by cutting a wafer having a plurality of unit semiconductor chips patterned on a first surface thereof,
Comprising: a wafer mounting step of mounting the wafer in a bottom jig such that a first surface of the wafer is positioned at an upper portion; a resin discharging step of discharging resin at least a part of the first surface; A curing step of curing the resin coated on the first side, and a curing step of curing the resin coated on the first side of the wafer so that the resin is exposed to the opposite side of the first side of the wafer A grinding step of grinding a second surface of the unit semiconductor chip,
A semiconductor facility operation step for operating a semiconductor facility for performing a semiconductor manufacturing process including a dividing step for dividing the semiconductor facility; And a semiconductor facility management step of managing the semiconductor facility through a management system,
In the wafer mounting step,
The bottom jig includes a first body portion having a cylindrical shape and a second body portion provided to be capable of separating and coupling with the first body portion. How to manage. The method according to claim 1,
Wherein the step of managing the semiconductor equipment comprises:
Receiving emergency state data from the semiconductor equipment if online communication between the host and the semiconductor facility is restored and determining whether the online communication is restored, searching the emergency state data to determine whether the semiconductor facility is in a warning state Determining whether the warning state is in a dangerous state if the semiconductor facility is in a warning state; and changing the variable ID key value of the semiconductor facility when the warning state is in a dangerous state, After the semiconductor facility control message is loaded into the semiconductor facility control message, downloading the semiconductor facility control message to the semiconductor facility and turning off the semiconductor facility; and if the warning state is not a dangerous state, determining whether a predetermined lot introduction signal has been input If the lot input signal has been input after this, Method of managing whether a semiconductor equipment comprising a step of downloading to the O / I PC. delete The method according to claim 1,
Wherein the first and second body portions are each provided with a fastening hole and the fastening hole is fastened by a separate fastening member to connect the first and second body portions. The method of claim 4,
In the semiconductor facility operation step,
Further comprising a wafer polishing step of polishing the wafer using a wafer polishing apparatus,
The wafer polishing apparatus comprises:
A predetermined body portion,
A polishing part provided on the body part and having a cylindrical polishing body rotated around a horizontal axis to polish the wafer; a cleaning part formed on a side of the polishing part to clean and dry the wafer; A piezoelectric actuator coupled to a lower side of the linear motor and a vacuum chuck made of a porous metal and coupled to the lower side of the piezoelectric actuator, A transfer unit for horizontally moving the specimen holding part between the polishing part, the cleaning part and the enlarged display part; and a reciprocating unit for reciprocating the specimen holding part, And a buffer module provided on the body portion and buffering the buffer portion with the bottom portion,
Wherein said polishing portion is polished while linearly reciprocating while being placed horizontally on a shaft of a polishing body on a polishing body on which a wafer is rotated during polishing of the wafer so that line contact polishing is performed. The method of claim 5,
The buffer module includes:
And a shock absorbing unit which is in contact with the body part above the lower unit, wherein the shock absorbing unit comprises: an upper fixed plate which is in contact with the bottom surface of the body part; and a lower fixed plate which is in contact with the lower unit, And an elastic housing provided between the upper fixing plate and the lower fixing plate,
Wherein the elastic housing is formed in a zigzag shape on an outer side thereof, the elastic housing is filled with an elastic filler, the elastic filler is filled to correspond to the shape of the elastic housing, and the elastic filler has a plurality of A buffer space is formed in the buffer space, and an inner reinforcing plate is provided between each of the buffer spaces. The buffer space is formed to have a width greater than the width of the inner reinforcing plate, The uppermost reinforcing plate is formed with a bottom protrusion having a predetermined shape on a lower surface thereof. The lowermost reinforcing plate of the inner reinforcing plates facing the lower fixing plate has a top surface protrusion of a predetermined shape on an upper surface thereof, The interrupted reinforcements positioned between the lowermost reinforcing plates are provided with upper and lower protrusions on the upper and lower surfaces, respectively, Additional formed,
A first pressing force measuring sensor for measuring a first pressing force generated between the upper fixing plate and the lower unit is provided on the upper fixing plate so as to be spaced apart from each other and on the lower fixing plate, And a second pressing force measuring sensor for measuring a second pressing force generated in the second pressing force measuring sensor. The method of claim 6,
And a control unit for controlling the operation of the shock absorber unit,
A second buffer space is formed on the elastic filling material located between the buffer spaces, and a supporting unit having a predetermined shape is provided between the upper fixing plate and the lower fixing plate, And a plurality of driving means are provided on the supporting unit, and each of the intermittent reinforcing members is provided on the supporting unit in such a manner as to be removable from the foreign material removing device operated in conjunction with the driving unit unit. Wherein each of the interrupted reinforcing members is provided so as to be able to flow to one side and the other side in the longitudinal direction on the second buffer space through the driving means,
Wherein the control unit controls the operation of the intermittent reinforcement based on the measured first pressing force and the second pressing force, wherein when the first pressing force and the second pressing force exceed a predetermined value, Rotating the intermittent reinforcement member at a high speed, and rotating the intermittent reinforcement member at a low speed when the intermittent reinforcement member is below a predetermined value,
Wherein the driving unit is provided so as to be able to move up and down within a predetermined range on the support unit, and the control unit adjusts the height of the interrupted reinforcing member through the driving unit, wherein the first pressing force exceeds a predetermined value And a control means for controlling the driving means of the lower one of the driving means to flow downward when the second pressing force exceeds the predetermined value, How to manage facilities. The method of claim 7,
Wherein each of the uppermost stiffening plate and the lowermost stiffening plate includes:
When the vibration based on an external impact is generated, the upper surface projection part and the lower surface projection part are in contact with the intermittent reinforcement body via the buffer space,
The upper surface protrusion and the lower surface projection of the uppermost reinforcing plate and the lowermost reinforcing plate are formed in a concavo-convex shape corresponding to the protrusion of the interrupted reinforcing body,
The upper fixing plate includes a first fixing plate which is in contact with the bottom surface of the body portion and a second fixing plate which is coupled to the lower portion of the first fixing plate so as to be slidable in the horizontal direction, / RTI >
The lower fixing plate,
And a fourth fixing plate coupled to an upper portion of the third fixing plate so as to be slidable in a horizontal direction and being in contact with the elastic housing and the lowermost reinforcing plate,
Wherein the second fixing plate extends at least outwardly beyond the area of the first fixing plate and the upper fixing protrusion is formed at each end of the outer sides of the second fixing plate so as to extend upwardly, And a third protruding portion extending upward is formed at each end of the outer sides of both sides of the fourth fixing plate,
Wherein the upper projecting portion and the first fixing plate are coupled with each other by elastic means to impart an elastic restoring force and at least a part of the lower projecting portion is engaged with the fourth fixing plate, Wherein the lower protrusion and the fourth fixing plate are coupled to each other by elastic means to give an elastic restoring force,
Wherein the break-
Numbered column interrupter provided in an odd-numbered column in a height direction and an even-numbered column interrupter provided in an even-numbered column, wherein the odd column interrupter is located on the central axis And the even-numbered row interruption reinforcing members are provided before and after the center axis, respectively. The method of claim 8,
An elastic module for generating an elastic force restoring force between the upper fixing plate and the lower fixing plate between the upper fixing plate and the lower fixing plate and a clamping member for clamping the ends of the upper fixing plate and the lower fixing plate, Further,
Wherein the pressing force adjusting means is provided on both side surfaces of the upper fixing plate and the lower fixing plate,
Wherein the clamping member clamps the upper and lower fixing plates so as to be pressed against each other based on the elastic module,
The elastic module includes:
A first support member which is in contact with the upper fixing plate, a second support member which is in contact with the lower fixing plate, and an elastic member which is coupled between the first support member and the second support member,
A first elastic force detection sensor is provided on a first region of the upper fixed plate which is in contact with the first support member and a second elastic force detection sensor is provided on a second region of the lower fixed plate which is in contact with the second support member, Wherein the clamping operation of the clamping member is controlled based on the first elastic force detection sensor and the second elastic force detection sensor. The method of claim 9,
The clamping member
A first fluid body which is provided so as to be able to move up and down from one side of the central body, and a second fluid body that is movable up and down from the other side of the central body, And the second support member is coupled to the second fluid member so that the second support member can independently move up and down, and the first support member is supported on the first support member by the first support member And a fourth support member opposed to the second support member with the lower support plate interposed therebetween, wherein the third support member is provided on the second fluid member in a longitudinal direction of the first fluid member And the fourth support member is vertically and externally projected from the longitudinal direction of the second fluid, Management method of a semiconductor equipment provided to enable. The method of claim 10,
A first cushioning member is provided between the upper fixing plate and the lower fixing plate, the first cushioning member is made of a hard glass material which is formed to be adjacent to the elastic housing and is formed by fracturing by external impact, Wherein the first buffer member is provided with a plurality of rows and a second buffer member made of a hard glass material is provided between the first buffer members having a plurality of rows, Management method. The method of claim 11,
The first cushioning member and the second cushioning member each include a third cushioning member made of a hard glass material,
The third buffering member has a strength different from that of the first buffering member and the second buffering member,
A predetermined partition plate is provided between the elastic module and the elastic housing,
A fourth buffer member and a fifth buffer member are provided between the partition plate and the elastic housing,
The fourth cushioning member is provided to be in contact with the elastic housing,
And the fifth buffer member is provided between the partition plate and the fourth buffer member. The method of claim 12,
And lifting means for adjusting a distance between the lower unit and the bottom portion of the body portion,
Wherein the buffer unit is provided with a plurality of buffer units capable of flowing within a certain range on the lower unit,
The buffer unit includes:
A first mode being located on each corner of the lower unit, and a second mode of operating in a second mode of simultaneous or asynchronous flow from the respective corner toward the virtual center of the lower unit. Way. 14. The method of claim 13,
Wherein,
Wherein the buffer unit is operated in the first mode or the second mode while the lower unit and the bottom surface portion of the body portion are spaced apart from each other by the lifting means. 15. The method of claim 14,
Said lifting means comprising:
First lifting means provided between the buffer units on the basis of the first mode,
Second lifting means provided on the bottom surface of the shock absorber in the first mode and protruding upward in the second mode to perform lifting,
And third lifting means between the buffering units with a smaller diameter than the first lifting means on the basis of the first mode,
Wherein,
The first lifting means and the third lifting means are primarily driven, the buffering unit is operated in the first mode and the second lifting means is driven in a third order, Way. 16. The method of claim 15,
The upper fixing plate includes:
A first upper fixing plate having a plurality of first pressing force measuring sensors spaced from each other and a second upper fixing plate positioned on an upper portion of the first upper fixing plate and facing the bottom of the body,
A flow unit for flowing the first pressing force measuring sensor from the left side to the right side, the upper side and the lower side is provided on the first upper fixing plate,
And a suction unit for suctioning the bottom of the body portion is provided on the second upper fixing plate. 18. The method of claim 16,
A second flow portion for flowing the adsorption portion leftward, rightward, upward and downward, respectively, is provided on the second upper fixing plate,
Wherein the adsorption unit is provided so as to be able to come into contact with the first pressing force measuring sensor. 18. The method of claim 17,
The adsorption unit
And a flange portion above the adsorption body,
A plurality of second pressing force measuring sensors provided corresponding to the first pressing force measuring sensor,
Wherein the controller controls the first pressing force measurement sensor and the adsorption unit to mutually correspond,
Wherein the first pressing force measuring sensor measures the first pressing force through the adsorption unit.

Images