KR101755033B1 - Evaporator for forming Hard Coating - Google Patents

Evaporator for forming Hard Coating Download PDF

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Publication number
KR101755033B1
KR101755033B1 KR1020150055096A KR20150055096A KR101755033B1 KR 101755033 B1 KR101755033 B1 KR 101755033B1 KR 1020150055096 A KR1020150055096 A KR 1020150055096A KR 20150055096 A KR20150055096 A KR 20150055096A KR 101755033 B1 KR101755033 B1 KR 101755033B1
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KR
South Korea
Prior art keywords
blocking wall
receiving tank
carrier gas
source
pipe
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KR1020150055096A
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Korean (ko)
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KR20160124954A (en
Inventor
최균
서진원
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한국세라믹기술원
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Priority to KR1020150055096A priority Critical patent/KR101755033B1/en
Publication of KR20160124954A publication Critical patent/KR20160124954A/en
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

The present invention relates to a washing machine comprising a receiving tank body having a bottom plate and side walls and formed into a tubular shape with an open top, a central blocking wall extending from the side wall to the center of the receiving tank body and having a distal end spaced from the inner surface of the side wall An inlet hole formed at a position corresponding to one side of the central blocking wall and an outlet hole formed at a position corresponding to the other side of the central blocking wall, An inlet pipe penetrating through the inlet hole to be introduced into the receiving vessel and introducing the carrier gas into the receiving vessel; and an inlet pipe penetrating the outlet hole to be introduced into the receiving vessel, A gas source formed by evaporation from the solid source, and an outlet pipe for discharging the carrier gas to the outside of the receiving vessel, A steel plate formed in a shape corresponding to a plane shape of a region filled with the solid source of the receiving tank and lowered by its own weight and a heating means for surrounding the outside of the receiving tank and heating the solid source, And an evaporator.

Description

[0001] Evaporator for forming Hard Coating [

The present invention relates to an evaporator for a hard coating forming apparatus which evaporates a source material in a solid state to a hard coating forming apparatus such as a tantalum carbide coating film and supplies the source material to a source material in a gaseous state.

In recent years, research on a complex carbide-based super-heat resistant oxidation-resistant coating film such as TaC, HfC or ZrC as an ultra-high temperature heat resistant material has been conducted.

A tantalum carbide (TaC) coating is formed by reacting a source material of tantalum such as tantalum chloride (TaCl 4 ) and a source material of carbon such as ethylene through a chemical vapor deposition process in a vacuum chamber. Tantalum chloride (TaCl 4 ), which is a source material of tantalum, is in a solid state and is evaporated into a vapor state together with an inert gas, which is a carrier gas supplied after being filled in an evaporator, and is supplied to a vacuum chamber. The tantalum chloride (TaCl 4 ) needs to be uniformly supplied during the coating process. When the tantalum chloride (TaCl 4 ) is supplied in excess or in a small amount in the coating process, Ta or C precipitates as an impurity in the coating film, thereby deteriorating the properties of the hard coating.

On the other hand, the evaporator is filled with the tantalum chloride (TaCl 4) of the solid phase inside, it is formed so as to feed with a carrier gas that is evaporated tantalum chloride (TaCl 4) gas supplied from the top. However, as the evaporated solid state tantalum chloride (TaCl 4 ) is evaporated, the vaporizer increases the void space in the upper part of the evaporator, and the carrier gas flows upward to decrease the contact time between the carrier gas and the tantalum chloride (TaCl 4 ) And the amount of gaseous tantalum chloride (TaCl 4 ) supplied by the carrier gas fluctuates.

Korean Unexamined Patent Publication No. 2002-0010617 (published Feb. 4, 2002)

The present invention provides an evaporator for a hard-coating-forming apparatus in which a carrier gas uniformly supplies a gaseous source material evaporated from a source material in a solid state.

In order to achieve the above object, an evaporator for a hard coating forming apparatus according to the present invention comprises: a receiving container body having a bottom plate and side walls and formed into a cylindrical shape having an open top; And a central blocking wall spaced apart from an inner surface of the side wall, the solid blocking wall having an inlet hole formed at a position corresponding to one side of the central blocking wall and a position corresponding to the other side of the central blocking wall An inlet pipe through which the carrier gas flows into the receiving vessel and which is introduced into the receiving vessel through the inlet hole; A gas source which is formed by flowing through the outflow hole and flowing into the interior of the receiving tank and formed by evaporation from the solid source, A drain pipe formed in a shape corresponding to a planar shape of a region filled with the solid source of the receiving tank and descending by its own weight and surrounding the outside of the receiving tank, And a heating means for heating the solid source.

The receptacle further comprises a middle blocking wall extending from opposite sides of the central blocking wall to the central blocking wall and the side walls in a direction opposite to the extending direction of the central blocking wall from the side walls and spaced apart from the side walls .

In addition, the intermediate blocking wall may extend parallel to the central blocking wall. The intermediate blocking wall may extend through a straight line connecting the inflow pipe and the outflow pipe.

The intermediate blocking wall is formed with a trench-like inflow groove and an outflow groove extending in the height direction of the receiving tank in the extending direction of the intermediate blocking wall between the intermediate blocking wall and the surface facing the inner surface of the side wall, And may be formed to provide a path through which the outflow pipe is introduced. At this time, the inflow groove causes the carrier gas flowing from the inflow pipe to flow in the extending direction of the stop blocking wall, and the outflow groove is formed by the carrier gas and the gas source flowing out to the outflow pipe, And may be formed to flow in a direction opposite to the extending direction.

The upper cover may further include an upper groove formed in a groove shape at a position corresponding to the side wall of the receiving tank main body, the central blocking wall, and the intermediate blocking wall.

In addition, the central blocking wall may be formed such that the thickness of a portion connected to the side wall is gradually increased to connect the side wall to a curved surface.

The lifting plate may include a lifting plate inlet hole formed at a position corresponding to the inlet hole and a lifting plate outlet hole formed at a position corresponding to the outlet hole. At this time, the inflow pipe passes through the rising steel plate inflow hole and flows into the receiving tank, and the inflow pipe may be formed to flow into the receiving tank through the rising steel plate outflow hole.

The steel sheet may be formed by coating Teflon on the surface of stainless steel or stainless steel.

In addition, the receiving vessel may be formed of Teflon.

In addition, the heating means may be configured to heat the solid source filled in the receiving tank body at a heating temperature of 100 to 200 ° C.

The evaporator for the hard coating forming apparatus of the present invention prevents the upper surface of the lifting plate from descending while evaporating the solid state source material, thereby preventing the space from being formed on the upper surface of the solid state source material, So that the amount of the source material in the gaseous state contained in the carrier gas is made constant.

In addition, the evaporator for the hard coating forming apparatus of the present invention is provided with a blocking wall between the inlet and the outlet of the carrier gas to prevent the flow path of the carrier gas from being straight, thereby increasing the contact time between the carrier gas and the source material in the solid state There is an effect that the amount of the gaseous source material contained in the carrier gas is made constant.

1 is a vertical sectional view of an evaporator for a hard coating forming apparatus according to an embodiment of the present invention.
2 is an exploded vertical cross-sectional view of the evaporator for the hard coating forming apparatus of FIG.
3 is a horizontal cross-sectional view of AA of FIG.
4 is a horizontal cross-sectional view of BB of Fig.
Figure 5 is a horizontal cross-sectional view of CC of Figure 2;
FIG. 6 is a schematic structural view illustrating a combination of an evaporator and a coating apparatus for a hard-coating-forming apparatus according to an embodiment of the present invention.

Hereinafter, an evaporator for a hard coating forming apparatus according to an embodiment of the present invention will be described with reference to the accompanying drawings.

First, an evaporator for a hard coating forming apparatus according to an embodiment of the present invention will be described.

1 is a vertical sectional view of an evaporator for a hard coating forming apparatus according to an embodiment of the present invention. 2 is an exploded vertical cross-sectional view of the evaporator for the hard coating forming apparatus of FIG. 3 is a horizontal cross-sectional view of AA of FIG. 4 is a horizontal cross-sectional view of BB of Fig. Figure 5 is a horizontal cross-sectional view of CC of Figure 2;

1 to 5, an evaporator for a hard coating forming apparatus according to an embodiment of the present invention includes a housing 100, an upper cover 200, an inlet pipe 300, an outlet pipe 400, (500) and a heating means (600). The evaporator for the hard coating forming apparatus may further include a separate outer housing (not shown) that surrounds the outside of the heating means 600.

 A solid state source material (hereinafter referred to as a "solid source") is filled in the receiving tank 100 of the evaporator for the hard coating forming apparatus. Is inserted into the interior of the receiving chamber 100 to be in contact with the upper surface of the solid source (a). Even when the solid source a evaporates to a gaseous source material (hereinafter referred to as a 'gaseous source') and the solid source a is consumed, the lifting plate 500 descends due to its own weight, As shown in FIG. The upper cover 200 hermetically seals the upper part of the receiving tank 100 and has an inlet pipe 300 through which the carrier gas flows and an outlet pipe 400 through which the carrier gas and the source gas are discharged, As shown in FIG. The receiving tank 100 is formed so that the carrier gas flowing from the inlet pipe 300 does not flow straight to the outlet pipe 400 to increase the contact time between the carrier gas and the solid source a.

The evaporator for the hard coating forming apparatus may be applied to a hard coating forming apparatus which forms various hard coatings formed by a gas source evaporated from a solid source. For example, in order to form a hard coating such as a tantalum carbide (TaC) coating film, the evaporator for the hard coating forming apparatus may be formed by supplying a carrier gas such as argon gas to a solid source of tantalum chloride (TaCl 4 ) (TaCl 4 ) as a gaseous source.

The receiving tank 100 is formed to include a receiving tank main body 110, a central blocking wall 120, and an intermediate blocking wall 130. The intermediate blocking wall 130 may be omitted when the amount of the gas source included in the carrier gas is constant in the state where the central blocking wall 120 is formed. The central blocking wall 120 and the intermediate blocking wall 130 may be formed in plural numbers.

The receiving tank main body 110 is formed in a cylindrical shape with an open top. For example, the receiving tank main body 110 is formed to include a bottom plate 111 and a side wall 113 extending upward from an upper surface of the bottom plate 111. The receiving tank main body 110 may be formed to have a polygonal shape such as a cylindrical shape, a square shape, or a pentagonal shape in a horizontal section. The receiving tank main body 110 is made of a Teflon material which is not reactive with a solid source a such as tantalum chloride (TaCl 4 ) and has a high heat resistance at a temperature of about 200 ° C, . The receiving tank main body 110 may be formed of a metal material such as stainless steel having corrosion resistance. The receiving tank main body 110 may be formed by coating Teflon on the surface of stainless steel.

The central blocking wall 120 is formed to extend from the side wall 113 of the receiving tank main body 110 toward the center of the receiving tank main body 110. The central blocking wall 120 is preferably formed such that its distal end extends beyond the center of the receiving vessel body 110. The central blocking wall 120 is formed such that the distal end thereof is spaced apart from the inner surface of the side wall 113. In addition, the central blocking wall 120 is formed to extend upward from the bottom plate 111. A passage through which the carrier gas flows between the distal end of the central blocking wall 120 and the inner surface of the side wall 113 is formed. The central blocking wall 120 is positioned between the inlet pipe 300 and the outlet pipe 400 so that the carrier gas does not flow along the linear direction X connecting the inlet pipe 300 and the outlet pipe 400 . That is, the central blocking wall 120 allows the carrier gas to flow along the curved direction Y together with the intermediate blocking wall 130.

The central blocking wall 120 is formed to have a predetermined thickness. In addition, the central blocking wall 120 is formed such that a portion of the central blocking wall 120, which is connected to the side wall 113, gradually increases in thickness and is connected to the side wall 113 to form a curved surface. Therefore, the carrier gas flows smoothly without stagnation at the portion where the central blocking wall 120 and the side wall 113 meet. The central blocking wall 120 is preferably formed to have the same height as the height of the side wall 113 or a lower height.

The central blocking wall 120 may be formed of the same material as that of the receiving vessel main body 110 or a different material. In addition, the central blocking wall 120 may be integrally formed with the receiving tank main body 110.

The intermediate blocking wall 130 is disposed between the central blocking wall 120 and the side wall 113 from the side wall 113 of the receiving vessel main body 110 at both sides of the central blocking wall 120 in the extending direction of the central blocking wall 120 As shown in Fig. That is, the distal end of the intermediate blocking wall 130 extends in a direction opposite to the central blocking wall 120. The intermediate blocking walls 130 are formed on both sides of the central blocking wall 120, respectively. In addition, the intermediate blocking wall 130 is preferably formed to extend in parallel with the central blocking wall 120. The intermediate blocking wall 130 is coupled to the inner surface of the side wall 113 at an angle. That is, when the side wall 113 is formed in a cylindrical shape, the intermediate blocking wall 130 is inclined with respect to the tangential direction of the inner surface.

The intermediate blocking wall 130 preferably extends past a straight line X connecting the inlet pipe 300 and the outlet pipe 400 at the distal end. In addition, the intermediate blocking wall 130 is formed such that the distal end thereof is spaced apart from the inner surface of the side wall 113. A passage through which the carrier gas flows between the distal end of the intermediate blocking wall 130 and the inner surface of the side wall 113 is formed. In addition, the intermediate blocking wall 130 forms a passage through which the gas source and the carrier gas flow, opposite to the central blocking wall 120. The intermediate blocking wall 130 is positioned between the inlet pipe 300 and the outlet pipe 400 so that the carrier gas flows along the linear direction X connecting the inlet pipe 300 and the outlet pipe 400 . That is, the intermediate blocking wall 130 allows the carrier gas to flow along the curved direction Y together with the central blocking wall 120.

The intermediate blocking wall 130 is formed to have a predetermined thickness. The intermediate blocking wall 130 defines an inflow groove 131 and an outflow groove 133 which are opened in the extending direction of the intermediate blocking wall 130 between the inner wall of the side wall 113 and the opposite wall . The inflow grooves 131 and the outflow grooves 133 are formed in a trench shape extending in the vertical direction of the height direction of the receiving tank 100. The inflow groove 131 and the inflow groove 133 provide a path extending from the inlet pipe 300 and the outlet pipe 400 to a position where the outlet pipe 400 is spaced apart from the upper surface of the bottom plate 111 of the receiving tank main body 110. The inflow groove 131 allows the carrier gas flowing from the inflow pipe 300 to flow in the extending direction of the intermediate blocking wall 130 and the inflow groove 133 to flow the carrier gas And the gas source flows in a direction opposite to the extending direction of the intermediate blocking wall 130. Further, the inflow groove 131 and the outflow groove 133 form a path such that the gas source and the carrier gas flow more smoothly along the curved direction Y. The intermediate blocking wall 130 is preferably formed to have the same height as the height of the side wall 113 or a lower height.

The intermediate blocking wall 130 may be formed of the same material as that of the receiving vessel main body 110 or a different material. In addition, the intermediate blocking wall 130 may be integrally formed with the receiving tank main body 110.

The upper cover 200 includes an inlet hole 210, an outlet hole 220, and an upper groove 230. The upper cover 200 is formed in a shape corresponding to the horizontal end surface of the receiving tank main body 110. For example, when the receiving tank main body 110 is formed in a cylindrical shape, the upper cover 200 is formed in a disk shape having a predetermined thickness. The upper cover 200 is coupled to an upper portion of the receiving tank 100 to seal the upper portion of the receiving tank 100.

The inlet hole 210 is formed at a position corresponding to one side of the central blocking wall 120. When the intermediate blocking wall 130 is formed, the inlet hole 210 is formed between the intermediate blocking wall 130 located at one side of the central blocking wall 120 and the side wall 113 of the receiving vessel body 110 As shown in Fig. The inflow hole 210 is formed to penetrate from the upper surface to the lower surface at a position corresponding to the inflow groove 131 of the receiving tank 100. The inflow hole 210 provides a path through which the inflow pipe 300 is introduced from the upper cover 200 to the inside of the receiving tank 100.

The outlet hole 220 is formed at a position corresponding to the other side of the central blocking wall 120. When the intermediate blocking wall 130 is formed, the outlet hole 220 is formed between the intermediate blocking wall 130 located on the other side of the central blocking wall 120 and the side wall 113 of the receiving vessel body 110, As shown in Fig. The outlet hole 220 is located on the side opposite to the inlet hole 210 with respect to the central blocking wall 120. The inflow hole 210 is formed to penetrate from the upper surface to the lower surface at a position corresponding to the outflow groove 133 of the receiving tank 100. The outflow groove 133 provides a path through which the outflow pipe 400 flows into the receiving tank main body 110 from the top cover 200.

The upper groove 230 is formed in a groove shape on the lower surface of the upper cover 200. The upper groove 230 is formed in a shape corresponding to the upper shape of the receiving tank 100. That is, the upper groove 230 is formed in a groove shape at a position corresponding to the side wall 113 of the receiving tank main body 110, the central blocking wall 120, and the intermediate blocking wall 130. When the upper cover 200 is coupled to the upper portion of the receiving tank main body 110, the side walls 113 of the receiving tank main body 110, the central blocking wall 120 and the intermediate blocking wall 130 Is inserted and coupled. Accordingly, the upper cover 200 closes the upper portion of the receiving tank 100 more efficiently.

The inflow pipe 300 is formed as a pipe and is inserted into the inflow groove 131 of the receiving tank 100 through the inflow hole 210 of the upper cover 200. The inflow pipe 300 is formed such that the lower end thereof is spaced apart from the upper surface of the bottom plate 111 of the receiving tank main body 110. The inlet pipe 300 introduces the carrier gas into the receiving vessel 100.

The outlet pipe 400 is inserted into the outlet groove 133 of the receiving tank 100 through the outlet hole 220 of the upper cover 200. The outlet pipe 400 is formed so that the lower end thereof is spaced apart from the upper surface of the bottom plate 111 of the receiving tank main body 110. The outflow pipe (400) allows the gas source and the carrier gas to flow out of the container (100).

The lifting plate 500 is formed in a plate or block shape having a predetermined thickness and is formed with a lifting plate inlet hole 510 and a lifting plate outlet hole 520. The lifting plate 500 is formed in a shape corresponding to the planar shape of the portion where the solid source (a) is filled in the receiving tank main body 110. That is, the lifting plate 500 is formed in a shape corresponding to a portion of the receiving tank main body 110 excluding the side wall 113, the central blocking wall 120, and the intermediate blocking wall 130. The lifting plate 500 is formed in such a size that its outer surface contacts the inner surface of the side wall 113 of the receiving tank body 110 and the central blocking wall 120 and the intermediate blocking wall 130 and can be lowered by its own weight. Therefore, the lifting plate 500 is inserted into the receiving tank 100 and kept in contact with the upper surface of the solid source a filled in the receiving tank 100. Further, when the upper surface of the solid source (a) is lowered while the solid source (a) is consumed, the lifting plate 500 descends together and maintains contact with the upper surface of the solid source (a) a space through which the carrier gas flows is not formed between the lower surface of the steel plate a and the lower surface of the steel plate 500.

The steel plate 500 is made of a metal material such as stainless steel, which is highly resistant to corrosion and has a relatively high density. The elevated steel plate 500 may be formed by coating Teflon on the surface of stainless steel.

The lift plate inlet hole 510 is formed at a position corresponding to the inlet hole 210 of the upper cover 200. The steel plate inlet hole 510 provides a path through which the inlet pipe 300 is inserted.

The steel plate outlet holes 520 are formed at positions corresponding to the outlet holes 220 of the upper cover 200. The steel plate outlet hole 520 provides a path through which the outlet pipe 400 is inserted.

The heating means 600 includes a heating means such as a heating wire. The heating means 600 is formed to surround the outside of the receiving tank main body 110. The heating means 600 heats the solid source (a) filled in the container main body 110 to a heating temperature of 100 to 200 ° C.

Next, the operation of the evaporator for a hard coating forming apparatus according to an embodiment of the present invention will be described.

FIG. 6 is a schematic structural view illustrating a combination of an evaporator and a coating apparatus for a hard-coating-forming apparatus according to an embodiment of the present invention.

The evaporator for a hard coating forming apparatus according to an embodiment of the present invention is connected to a hard coating forming apparatus such as a chemical vapor deposition apparatus to supply a source material of a hard coating formed on the substrate b in a gaseous state Is used. The hard coating forming apparatus generally includes a process chamber 10 into which a substrate b is inserted to perform a hard coating forming process, a chamber heating means 20 that heats the process chamber 10 to a process temperature, And a base 30 on which the base 30 is seated. The hard coating forming apparatus further includes a vacuum pump (not shown) for discharging the gas of the process chamber 10 to the outside and a scrubber (not shown) for removing harmful substances and particles contained in the gas .

The solid source (a), which is a source material of the hard coating, is filled in the interior of the container main body 110 at a predetermined height. The lifting plate 500 is inserted into the receiving tank main body 110 filled with the solid source (a), and the lower surface of the lifting plate 500 is seated in contact with the upper surface of the solid source (a). At this time, the lifting plate 500 is lowered to the bottom due to its own weight in the receiving tank main body 110, while the lower surface maintains contact with the upper surface of the solid source a. The upper cover 200 is coupled to an upper portion of the receiving tank 100 to seal the upper portion of the receiving tank 100. At this time, the inflow pipe 300 and the outflow pipe 400 are connected to the inflow hole 210 and the inflow hole 220 of the upper cover 200, respectively, and are then introduced into the receiving chamber 100. The inlet pipe 300 and the outlet pipe 400 are coupled to each other at a predetermined height from the upper surface of the bottom plate 111 of the receiving tank main body 110. The inlet pipe 300 and the outlet pipe 400 are coupled to each other through the lifting plate inlet hole 510 and the lifting plate outlet hole 520 of the lifting plate 500. The solid filler filled in the receptacle 100 is heated to a temperature of about 130 to 150 ° C by the heating means 600. The inlet pipe 300 supplies argon gas, which is a carrier gas, to the interior of the receiving vessel body 110, and the carrier gas flows into the upper portion of the bottom plate 111 of the receiving vessel body 110. The carrier gas flows along the upper part of the bottom plate 111 to evaporate the solid source a to the gas source and move toward the outlet pipe 400. In this case, since the central blocking wall 120 and the intermediate blocking wall 130 are formed in the receiving tank main body 110, the carrier gas does not flow straight in the direction of the outflow pipe 400, The blocking wall 130 contacts the solid source a along the passage forming the side wall 113 of the receiving tank body 110 along the curved direction Y. [ Thus, the time for which the carrier gas comes into contact with the solid source (a) is increased and the solid source (a) is sufficiently evaporated to contain. Further, the carrier gas may include a gas source which is evaporated from the solid source (a) up to a saturated state. When the solid source (a) evaporates into the gas source and the upper surface of the solid source (a) is lowered in the receiving tank main body 110, the lifting plate 500 also descends together with its own weight, (a). When there is a space between the solid source (a) and the steel plate 500, the carrier gas may flow first to the upper space, not to the outlet pipe 400. However, since the lifting plate 500 is kept in contact with the solid source a while descending due to its own weight, no space is formed between the lifting plate 500 and the upper surface of the solid source a. Therefore, the carrier gas does not flow toward the upper surface of the solid source (a) even when the solid source (a) is evaporated and consumed. In addition, since the carrier gas flows along the constant path from the inflow pipe 300 to the outflow pipe 400 while the contact time with the solid source a is increased, the amount of the gas source included in the carrier gas can be kept constant . The outflow pipe 400 discharges the gas source together with the carrier gas to the outside of the container 100 and supplies it to the hard coating forming apparatus.

The evaporator for the hard coating forming apparatus increases the contact time between the carrier gas and the solid source (a), blocks the formation of a space through which the carrier gas can flow on the upper surface of the solid source (a) Gas source. Thus, the evaporator for the hard coating forming apparatus supplies a gas source constantly to the process chamber, and minimizes the deposition of impurities into the hard coating. For example, in the case where the hard coating is tantalum carbide, deposition of a Ta phase or a C phase on the hard coating, which may be formed according to an uneven supply of gas source, can be minimized .

100: Receiving tank
110: receiver body 120: central blocking wall
130: intermediate blocking wall
200: upper cover
210: inlet hole 220: outlet hole
300: inlet pipe 400: outlet pipe
500: Wrought steel plate
510: a steel plate inlet hole 520: a steel plate outlet hole
600: heating means

Claims (13)

A receiving vessel main body having a bottom plate and side walls and formed in a cylindrical shape with an open upper portion; a receiving vessel main body extending upward from the bottom plate and extending from the side wall through the center of the receiving vessel body, A solid containment vessel having a central blocking wall and filled with a solid source at a predetermined height,
An upper cover having an inlet hole formed at a position corresponding to one side of the central blocking wall and an outlet hole formed at a position corresponding to the other side of the central blocking wall,
An inlet pipe formed to flow into the receiving vessel through the inlet hole and to introduce the carrier gas into the receiving vessel;
A gas source which is formed by flowing through the outflow hole into the inside of the receiving tank and formed by evaporation from the solid source and an outflow pipe for discharging the carrier gas to the outside of the receiving tank;
The solid source is formed in a plate shape corresponding to the plane shape of the area filled with the solid source and coated with Teflon on the surface of stainless steel or stainless steel. A steel plate maintained in a state of being in contact with the upper surface of the source so as not to form a space through which the carrier gas flows between the solid source and the lower surface of the steel plate;
And a heating means for surrounding the outside of the receptacle and for heating the solid source,
Wherein the lifting plate includes a lifting plate inlet hole formed at a position corresponding to the inlet hole and a lifting plate outlet hole formed at a position corresponding to the outlet hole,
The inflow pipe is formed to extend from the upper surface of the bottom plate to a predetermined height so that the inflow pipe passes through the lifting plate inflow hole and flows into the receiving tank,
Wherein the outlet pipe is formed to extend from the upper surface of the bottom plate to a predetermined height so that the outlet pipe is inserted into the receiving tank through the lifting plate outlet hole and the end portion is always immersed in the solid source. Evaporator. The method according to claim 1,
The receptacle
Extending from both sides of the central blocking wall to a line connecting the inlet pipe and the outlet pipe between the central blocking wall and the side wall in a direction opposite to the extending direction of the central blocking wall from the side wall, ≪ / RTI > further comprising an intermediate blocking wall disposed between the first and second walls. 3. The method of claim 2,
Wherein the intermediate blocking wall is formed to extend in parallel with the central blocking wall. 3. The method of claim 2,
Wherein the intermediate blocking wall is formed with a trench-like inflow groove and an outflow groove extending in the height direction of the receiving tank in the extending direction of the intermediate blocking wall between the intermediate blocking wall and the surface facing the inner surface of the side wall, Wherein the flow path provides a path through which the hard coating is formed. 5. The method of claim 4,
Wherein the intermediate blocking wall is formed to extend through a straight line connecting the inlet pipe and the outlet pipe. 6. The method of claim 5,
Wherein the inflow groove causes the carrier gas flowing from the inflow pipe to flow in the extending direction of the intermediate blocking wall, and the inflow groove is formed by the carrier gas and the gas source flowing out to the outflow pipe, So as to flow in the opposite direction to the evaporator. 3. The method of claim 2,
Wherein the upper cover further comprises an upper groove formed in a groove shape at a position corresponding to a side wall of the receiving tank main body, the central blocking wall and the intermediate blocking wall. The method according to claim 1,
The central blocking wall
Wherein a thickness of the portion connected to the side wall is gradually increased to form a curved portion connected to the side wall. delete delete delete The method according to claim 1,
Wherein the receiving vessel is formed of Teflon material. The method of claim 1, wherein
Wherein the heating means heats the solid source filled in the inside of the receiving tank body to a heating temperature of 100 to 200 占 폚.
KR1020150055096A 2015-04-20 2015-04-20 Evaporator for forming Hard Coating KR101755033B1 (en)

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WO2023278129A1 (en) * 2021-06-28 2023-01-05 Applied Materials, Inc. Ampoule for a semiconductor manufacturing precursor

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US11578406B2 (en) 2020-12-08 2023-02-14 Applied Materials, Inc. Ampoule for a semiconductor manufacturing precursor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023278129A1 (en) * 2021-06-28 2023-01-05 Applied Materials, Inc. Ampoule for a semiconductor manufacturing precursor

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