KR101749609B1 - Resin composition for display substrates - Google Patents
Resin composition for display substrates Download PDFInfo
- Publication number
- KR101749609B1 KR101749609B1 KR1020147017255A KR20147017255A KR101749609B1 KR 101749609 B1 KR101749609 B1 KR 101749609B1 KR 1020147017255 A KR1020147017255 A KR 1020147017255A KR 20147017255 A KR20147017255 A KR 20147017255A KR 101749609 B1 KR101749609 B1 KR 101749609B1
- Authority
- KR
- South Korea
- Prior art keywords
- group
- carbon atoms
- formula
- substituted
- structural unit
- Prior art date
Links
- 0 C*NC(*(*)(C(NC)=O)C(O)=O)=O Chemical compound C*NC(*(*)(C(NC)=O)C(O)=O)=O 0.000 description 5
- CXISKMDTEFIGTG-UHFFFAOYSA-N O=C(c(cc1)cc(C(O2)=O)c1C2=O)Oc(cc1)ccc1OC(c(cc1)cc(C(O2)=O)c1C2=O)=O Chemical compound O=C(c(cc1)cc(C(O2)=O)c1C2=O)Oc(cc1)ccc1OC(c(cc1)cc(C(O2)=O)c1C2=O)=O CXISKMDTEFIGTG-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/16—Polyester-imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/14—Polyamide-imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133305—Flexible substrates, e.g. plastics, organic film
Abstract
[PROBLEMS] To provide a resin composition for a display substrate capable of forming a useful polyimide film having an appropriate linear expansion coefficient and appropriate flexibility.
[MEANS FOR SOLVING PROBLEMS] A polyamic acid comprising a structural unit represented by the following formula (1) and a structural unit represented by the formula (3) or a structural unit represented by the following formula (2) and a structural unit represented by the formula (4) And a polyimide resin.
[In the formulas (1) to (4), X 1 represents a tetravalent organic group having an aromatic group and at least two carbonyl groups, Y 1 represents a divalent organic group, Y 2 represents a divalent organic group having an alkali- , n and m represent a natural number.]
Description
The present invention relates to a resin composition for a display substrate, and more particularly to a resin composition for a display substrate capable of forming a useful polyimide film having an appropriate linear expansion coefficient and appropriate flexibility.
Polyimide resins are widely used in the fields of electric and electronic materials because of their high heat resistance, flame retardancy and excellent electrical insulation properties. Specifically, the film is used as a substrate of a flexible printed circuit board or a heat-resistant adhesive tape, an insulating film of a semiconductor as a resin varnish, a protective film, or the like.
On the other hand, display devices such as organic EL (electroluminescence) displays and liquid crystal displays are required to have only a high definition, but they are rapidly expanding their applications to information devices and the like. For example, a flexible display using a plastic film as a substrate has been attracting attention in order to satisfy the requirement of ultra-thin and lightweight.
BACKGROUND ART [0002] Conventionally, in a fixed-sized display, an active-matrix driven panel is used. In order to form an active matrix layer including a thin film active element in addition to a matrix-shaped pixel electrode, a high-temperature treatment of 200 DEG C or higher is required in the manufacturing process, and furthermore, a very precise position adjustment is required. However, in order to make it flexible, it is very difficult to directly form an active element thereon because the heat resistance and the dimensional stability are lowered by changing from a glass substrate to a plastic material.
Therefore, in order to avoid such a problem, a polyimide film is formed on a glass substrate and the amorphous silicon TFT element, the color filter, or the like is formed by adjusting the fixed vertical position so as to form a transfer layer, Transferring and transferring the transfer layer onto a plastic film to manufacture a display device has been proposed (Patent Documents 1 and 2).
As a characteristic of the polyimide which is required in the above process, the coefficient of linear expansion can be mentioned. However, in most polyimide systems, the coefficient of linear expansion of the film is in the range of 60 to 80 ppm / K and does not have a low linear expansion property. Among these, a polyimide film having a low coefficient of linear expansion has been developed. However, an acid anhydride (acid dicarboxylic anhydride) lacking versatility is used as a raw material, resulting in an expensive product (Patent Document 3).
The object of the present invention is to provide a resin composition for a display substrate capable of forming a useful cured film having an appropriate linear expansion coefficient and appropriate flexibility even when an acid anhydride having insufficient versatility is not used as a raw material. . The proper flexibility referred to herein is a degree of flexibility that is self-supporting and does not break even when bent at 90 degrees.
The inventors of the present invention have conducted intensive studies in order to achieve the above object. As a result, they have found that an acid anhydride having a biphenyl (biphenyl) skeleton as an acid anhydride component and a biphenyldiamine having a hydroxyl group or a carboxyl group as a diamine component A useful cured film having an appropriate linear expansion coefficient and appropriate flexibility can be obtained from a resin composition for a display substrate comprising the acid anhydride component and a polyamic acid or polyimide derived from the diamine component.
Specifically, the present invention provides, as a first aspect, a polyamic acid comprising a structural unit represented by the following formula (1) and a structural unit represented by the formula (3) or a structural unit represented by the following formula (2) 4). ≪ / RTI > The present invention also relates to a resin composition for a display substrate containing a polyimide.
[Chemical Formula 1]
[In the formulas (1) to (4)
X 1 represents a tetravalent organic group having an aromatic group and at least two carbonyl groups,
Y 1 represents a divalent organic group,
Y 2 represents a divalent organic group having an alkali-soluble group,
n and m represent a natural number.]
As a second aspect, the present invention relates to a resin composition for a display substrate according to the first aspect, wherein Y 2 is a structure represented by the following formula (5).
(2)
(Wherein,
R 1 to R 3 each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a haloalkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a halogen atom, a nitro group, , a cyano group, W 1 a represents a group which may be substituted with furyl or thienyl group which may be substituted with W 1-naphthyl group, W 1, which may be substituted with a phenyl group, W 1, which may be substituted,
W 1 represents an alkyl group having 1 to 10 carbon atoms, a haloalkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a hydroxyl group, a halogen atom, a nitro group, a cyano group or a carboxyl group Lt; / RTI >
V 1 represents an alkali-soluble group,
k represents an integer of 1 to 3; Represents the number of bonds (bonds).
As a third aspect, the present invention relates to a resin composition for a display substrate according to the second aspect, wherein V 1 represents a hydroxyl group or a carboxyl group.
In a fourth aspect, it is preferable that V 1 represents a hydroxy group, and each of R 1 to R 3 independently represents a hydrogen atom, a halogen atom, an alkyl group having 1 to 3 carbon atoms, Alkoxy group, and the like.
As a fifth aspect, the present invention relates to a resin composition for a display substrate according to the fourth aspect, wherein R 1 to R 3 represent a hydrogen atom and k represents 2.
As a sixth aspect, the present invention relates to a resin composition for a display substrate according to the first aspect, wherein Y 2 is a structure represented by the following formula (6).
(3)
(Wherein,
R 4 to R 9 each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a haloalkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a halogen atom, a nitro group, , a cyano group, W 1 a represents a group which may be substituted with furyl or thienyl group which may be substituted with W 1-naphthyl group, W 1, which may be substituted with a phenyl group, W 1, which may be substituted,
W 1 represents an alkyl group having 1 to 10 carbon atoms, a haloalkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a hydroxyl group, a halogen atom, a nitro group, a cyano group or a carboxyl group Lt; / RTI >
Z 1 represents an alkylene group having 1 to 10 carbon atoms, a haloalkylene group having 1 to 10 carbon atoms, a sulfonyl group, a carbonyl group, an amide group or an oxygen atom,
V 2 and V 3 represent an alkali-soluble group. Represents the number of bonds).
As a seventh aspect, the present invention relates to a resin composition for a display substrate according to the sixth aspect, wherein V 2 and V 3 each independently represent a hydroxyl group or a carboxyl group.
As an eighth aspect, the present invention relates to a resin composition for a display substrate according to the seventh aspect wherein R 4 to R 9 represent hydrogen atoms.
As a ninth aspect, the present invention relates to a resin composition for a display substrate according to any one of the first to eighth aspects, wherein Y 1 is a structure represented by the following formula (7).
[Chemical Formula 4]
(Wherein,
R 10 to R 13 each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a haloalkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a halogen atom, a nitro group, , a cyano group, W 1 a represents a group which may be substituted with furyl or thienyl group which may be substituted with W 1-naphthyl group, W 1, which may be substituted with a phenyl group, W 1, which may be substituted,
W 1 represents an alkyl group having 1 to 10 carbon atoms, a haloalkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a hydroxyl group, a halogen atom, a nitro group, a cyano group or a carboxyl group Lt; / RTI >
l represents an integer of 1 to 3; Represents the number of bonds).
In a tenth aspect, the display substrate according to the ninth aspect, wherein each of R 10 to R 13 independently represents a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, or an alkoxy group having 1 to 10 carbon atoms, The present invention relates to a resin composition comprising
As an eleventh aspect, the R 10 to R 13 are, each independently represents a hydrogen atom, a halogen atom, an alkyl group of carbon atoms from 1 to 3, or a group of from 1 to 3 alkoxy carbon atoms, and the l is 1 or 2 To a resin composition for a display substrate according to the tenth aspect.
As a twelfth aspect, the present invention relates to a resin composition for a display substrate according to the eleventh aspect, wherein R 10 to R 13 represent hydrogen atoms.
A thirteenth aspect relates to the resin composition for a display substrate according to any one of the first to twelfth aspects, wherein X 1 is a structure represented by the following formula (8).
[Chemical Formula 5]
(Wherein,
R 14 to R 23 each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a haloalkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a hydroxyl group, a halogen atom, group, a formyl group, a cyano group, a carboxyl group, W 1 represents an optionally substituted furyl a thienyl group, or W 1, which may be substituted with a naphthyl group, W 1, which may be substituted with a phenyl group, W 1, which may be substituted with,
W 1 represents an alkyl group having 1 to 10 carbon atoms, a haloalkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a hydroxyl group, a halogen atom, a nitro group, a cyano group or a carboxyl group Lt; / RTI >
Z 2 and Z 3 each independently represent -NH-, -NZ 4 - or an oxygen atom,
Z 4 represents an alkyl group having 1 to 10 carbon atoms,
p represents an integer of 1 or 2; Represents the number of bonds).
In a fourteenth aspect, the present invention relates to a resin composition for a display substrate according to the thirteenth aspect, wherein R 14 to R 23 represent hydrogen atoms.
In a fifteenth aspect, the resin for a display substrate according to any one of the first to fourteenth aspects, wherein n in the formula (1) and m in the formula (3) are n / m = 70/30 to 99/1 ≪ / RTI >
As a sixteenth aspect, the resin for a display substrate according to any one of the first to fourteenth aspects, wherein n in the formula (2) and m in the formula (4) are n / m = 70/30 to 99/1 ≪ / RTI >
As a seventeenth aspect, the present invention relates to a resin composition for a display substrate according to any one of the first to sixteenth aspects, further comprising a crosslinking agent.
As an eighteenth aspect, the present invention relates to a resin composition for a display substrate according to the seventeenth aspect, wherein the crosslinking agent is a compound having two or more epoxy groups and at least one aromatic group.
As a nineteenth aspect, there is provided a resin composition for a display substrate according to the 18th aspect, wherein the crosslinking agent has 6 or fewer epoxy groups, and the compound further has an alkylene group having 1 to 10 carbon atoms for bonding an epoxy group and an aromatic group .
As a twentieth aspect, the present invention relates to a resin composition for a display substrate according to any one of the seventeenth to nineteenth aspects, wherein the amount of the crosslinking agent is 20 parts by mass or less based on 100 parts by mass of the polyamic acid or polyimide.
As a twenty-first aspect, the present invention relates to a varnish characterized in that the resin composition for a display substrate according to any one of the first to twentieth aspects is dissolved in at least one solvent.
As a twenty-second aspect, the present invention relates to a cured film obtained by firing at 230 DEG C or higher using the varnish described in the twenty-first aspect.
As a 23rd aspect, the present invention relates to a structure having at least one layer comprising a cured film according to the 22nd aspect on a substrate.
As a twenty-fourth aspect, the present invention relates to a polyamic acid comprising a structural unit represented by the following formula (1) and a structural unit represented by the following formula (3).
[Chemical Formula 6]
[In the formulas (1) and (3)
X 1 represents a tetravalent organic group having an aromatic group and at least two carbonyl groups,
Y 1 represents a divalent organic group,
Y 2 represents a divalent organic group having an alkali-soluble group,
n and m represent a natural number.]
As a twenty-fifth aspect, the present invention relates to a polyimide comprising a structural unit represented by the following formula (2) and a structural unit represented by the following formula (4).
(7)
[In the formulas (2) and (4)
X 1 represents a tetravalent organic group having an aromatic group and at least two carbonyl groups,
Y 1 represents a divalent organic group,
Y 2 represents a divalent organic group having an alkali-soluble group,
n and m represent a natural number.]
As a twenty-sixth aspect, the present invention relates to a display substrate made of polyimide described in the twenty-fifth aspect.
The resin composition for a display substrate of the present invention can form a useful cured film having an appropriate linear expansion coefficient and appropriate flexibility. Therefore, this cured film can be used for a base film for a flexible display or the like.
[Resin composition for display substrate]
The present invention relates to a polyamic acid comprising a structural unit represented by the following formula (1) and a structural unit represented by the formula (3) or a structural unit represented by the following formula (2) and a structural unit represented by the formula (4) To a resin composition for a display substrate containing a polyimide.
[Chemical Formula 8]
[In the formulas (1) to (4)
X 1 represents a tetravalent organic group having an aromatic group and at least two carbonyl groups,
Y 1 represents a divalent organic group,
Y 2 represents a divalent organic group having an alkali-soluble group,
n and m represent a natural number.]
Here, the polyamic acid containing the structural unit represented by the formula (1) and the structural unit represented by the formula (3) is a structural unit represented by n structural units represented by the following formula (a) and m structural units represented by the following formula (b) (N + m) structural units are bonded in any order, and the structural unit represented by the formula (2) and the structural unit represented by the formula (4) The polyimide included includes n structural units represented by the following formula (c) and m structural units represented by the following formula (d), and these (n + m) structural units are bonded in any order ≪ / RTI >
The polyamic acid comprising the structural unit represented by the formula (1) and the structural unit represented by the formula (3) is preferably a structural unit represented by the following formula (c) and a structural unit represented by the formula (d) The polyimide including the structural unit represented by the formula (2) and the structural unit represented by the formula (4) may have either one or both of the structural unit represented by the formula (a) and the structural unit represented by the formula and either or both of the structural units represented by the general formula (b) may be contained in the molecule.
[Chemical Formula 9]
Wherein X 1 , Y 1 and Y 2 have the same meanings as defined in the above formulas (1) to (4), respectively, in the formulas (a) to (d)
The content of the polyamic acid or polyimide (polyamic acid and polyimide when both the polyamic acid and the polyimide are included) in the resin composition for a display substrate of the present invention is preferably 8 to 99.9% by mass, By mass is 40 to 99.9% by mass, and more preferably 80 to 99.9% by mass.
Here, the solid content is the remaining component after removing the solvent from all components of the resin composition for a display substrate.
The resin composition for a display substrate of the present invention includes a polyamic acid or a polyimide.
<Polyamic acid>
The polyamic acid contained in the resin composition for a display substrate of the present invention is obtained by polymerizing an acid anhydride component and a diamine component in a solvent.
The polyamic acid can be obtained by a known method, for example, in an inert gas atmosphere such as nitrogen,
[Chemical formula 10]
(Wherein X < 1 > represents a tetravalent organic group having an aromatic group and at least two carbonyl groups) and at least one acid dianhydride represented by the following formula (10):
H 2 NY 1 -NH 2 (10)
(Wherein Y 1 represents a divalent organic group) and at least one diamine represented by the following formula (11):
H 2 NY 2 -NH 2 (11)
(Wherein Y 2 represents a divalent organic group having an alkali-soluble group) in a solvent, followed by reaction.
The reaction temperature at this time is -20 to 100 占 폚, preferably 20 to 60 占 폚. The reaction time is 1 to 72 hours.
In the present invention, the polyamic acid obtained by recovering the reaction solution of the polyamic acid as it is, or by diluting or concentrating it, or by reprecipitation from the reaction solution can be used as a resin composition for a display substrate by redissolving or dispersing the polyamic acid in an appropriate solvent . The solvent used for diluting, redissolving or dispersing is not particularly limited as long as it dissolves or disperses the obtained polyamic acid. Examples of the solvent include 2-pyrrolidone, N-methyl-2-pyrrolidone, N-dimethylacetamide, N, N-dimethylformamide, 3-methoxy-N, N-dimethylpropylamide, 3-ethoxy-N- , N-dimethylpropylamide, 3-propoxy-N, N-dimethylpropylamide, 3-isopropoxy-N, -Butoxy-N, N-dimethylpropylamide, 3-tert-butoxy-N, N-dimethylpropylamide and? -Butyrolactone. These solvents may be used alone or in combination of two or more.
The acid dianhydride represented by the formula (9) is preferably an acid dianhydride in which X 1 is a structure represented by the following formula (8), and X 1 is an acid dianhydride having a structure represented by the following formula (8-1) desirable.
(11)
(Wherein,
R 14 to R 23 each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a haloalkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a hydroxyl group, a halogen atom, group, a formyl group, a cyano group, a carboxyl group, W 1 represents an optionally substituted furyl a thienyl group, or W 1, which may be substituted with a naphthyl group, W 1, which may be substituted with a phenyl group, W 1, which may be substituted with,
W 1 represents an alkyl group having 1 to 10 carbon atoms, a haloalkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a hydroxyl group, a halogen atom, a nitro group, a cyano group or a carboxyl group Lt; / RTI >
Z 2 and Z 3 each independently represent -NH-, -NZ 4 - or an oxygen atom,
Z 4 represents an alkyl group having 1 to 10 carbon atoms,
p represents an integer of 1 or 2; Represents the number of bonds).
Examples of the acid dianhydride represented by the formula (9) include p-phenylenebis (trimellitic acid monoester anhydride), 2-methyl-1,4-phenylenebis (trimellitic acid monoester anhydride) (Trimellitic acid monoester anhydride), 2,3,5,6-tetramethyl-1,4-phenylenebis (trimellitic acid monoester anhydride), 2, (Trimellitic acid monoester anhydride), 2,5-ditrifluoromethyl-1,4-phenylenebis (trimellitic acid monoester anhydride), 2- Chloro-1,4-phenylenebis (trimellitic acid monoester anhydride), 2,5-dichloro-1,4-phenylenebis (trimellitic acid monoester anhydride), 2-fluoro- (Trimellitic acid monoester anhydride), 2,5-difluoro-1,4-phenylenebis (trimellitic acid monoester anhydride), and N, N '- (1,4-phenylene) bis (1,3-dioxo-1,3-dihydrobenzopure Carboxamide) and N, N '- (1,4-phenylene) bis (N-methyl-1,3-dioxo-1,3-dihydrobenzofuran- .
Among these acid anhydrides, from the viewpoint that the cured film obtained from the resin composition of the present invention has a sufficiently low linear expansion coefficient, R 14 to R 23 in the formula (8) represent a hydrogen atom, and Z 2 and Z 3 represent an oxygen atom And p is 1 or 2, and from the viewpoint that the cured film obtained from the resin composition of the present invention has a sufficiently high strength, it is preferable that R 14 to R 23 in the formula (8) 4,4'-biphenylbis (trimellitic acid monoester acid anhydride) (represented by the following formula (12)), which is a compound in which Z 2 and Z 3 represent an oxygen atom and p represents 2, .
[Chemical Formula 12]
From the viewpoint that the cured film obtained from the resin composition of the present invention has a sufficiently low linear expansion coefficient, the diamine represented by the formula (10) is preferably a diamine having a rigid linear molecular structure. Among them, as the diamine represented by the formula 10, a structure in which a diamine is preferable, and a diamine are particularly preferred structure is represented by the formula Y 1 (7-1) represented by the formula Y 1 (7) Do.
[Chemical Formula 13]
(Wherein,
R 10 to R 13 each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a haloalkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a halogen atom, a nitro group, , a cyano group, W 1 a represents a group which may be substituted with furyl or thienyl group which may be substituted with W 1-naphthyl group, W 1, which may be substituted with a phenyl group, W 1, which may be substituted,
W 1 represents an alkyl group having 1 to 10 carbon atoms, a haloalkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a hydroxyl group, a halogen atom, a nitro group, a cyano group or a carboxyl group Lt; / RTI >
l represents an integer of 1 to 3; Represents the number of bonds).
In the formula (7), R 10 to R 13 are each independently preferably a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, or an alkoxy group having 1 to 10 carbon atoms, It is preferable that R 10 to R 13 each independently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 3 carbon atoms, or an alkoxy group having 1 to 3 carbon atoms, from the viewpoint that the cured film obtained from the resin composition has sufficiently high strength. And 1 is preferably 1 or 2, and it is preferable that all of R 10 to R 13 are hydrogen atoms from the viewpoint that the cured film obtained from the resin composition of the present invention has a sufficiently low linear expansion coefficient.
Examples of the diamine represented by the formula (10) include p-phenylenediamine, m-phenylenediamine, 2-methyl-1,4-phenylenediamine, 2-trifluoromethyl- Phenylenediamine, 2-methoxy-1,4-phenylenediamine, 2,5-dimethyl-1,4-phenylenediamine, 2,5-bis (trifluoromethyl) , 4,4'-diaminobenzanilide, 4-aminophenyl-4'-aminobenzoate, benzidine, 3,3'-dimethoxybenzidine, 3,3'-dichlorobenzidine, o- (Trifluoromethyl) benzidine, 3,3'-bis (trifluoromethyl) benzidine, 3,3'-bis (trifluoromethyl) benzidine, octafluorobenzidine, 3,3'5,5'-tetramethylbenzidine, 2 , 2 ', 5,5'-tetrachlorobenzidine, etc. Among them, from the viewpoint that the cured film obtained from the resin composition of the present invention has a sufficiently high strength and a sufficiently low linear expansion coefficient, p-phenylenediamine And m-phenylenediamine are particularly preferable.
These diamines may be used in combination of two or more.
From the viewpoint that the cured film obtained from the resin composition of the present invention has a sufficiently low linear expansion coefficient, the diamine represented by the formula (11) is preferably a diamine having a rigid linear molecular structure. Among them, as the diamine represented by the formula (11), a diamine in which Y 2 is a structure represented by the following formula (5) is preferable, and a diamine in which Y 2 is a structure represented by the following formula (5-1) Do.
[Chemical Formula 14]
(Wherein,
R 1 to R 3 each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a haloalkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a halogen atom, a nitro group, , a cyano group, W 1 a represents a group which may be substituted with furyl or thienyl group which may be substituted with W 1-naphthyl group, W 1, which may be substituted with a phenyl group, W 1, which may be substituted,
W 1 represents an alkyl group having 1 to 10 carbon atoms, a haloalkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a hydroxyl group, a halogen atom, a nitro group, a cyano group or a carboxyl group Lt; / RTI >
V 1 represents an alkali-soluble group,
k represents an integer of 1 to 3; Represents the number of bonds).
In the above formula (5), it is preferable that V 1 is a hydroxyl group or a carboxyl group.
In the formula (5), V 1 represents a hydroxy group, and each of R 1 to R 3 independently represents a hydrogen atom, a halogen atom, an alkyl group having 1 to 3 carbon atoms, Preferably an alkoxy group having 1 to 3 carbon atoms.
From the viewpoint that the cured film obtained from the resin composition of the present invention has a sufficiently high strength, it is preferable that k in the formula (5) is 2, and the cured film obtained from the resin composition of the present invention has a sufficiently low linear expansion From the viewpoint of having a coefficient, it is preferable that all of R 1 to R 3 are hydrogen atoms.
Examples of the diamine represented by the formula (11) include 4,4'-diamino-3,3'-dihydroxybiphenyl, 3,3'-diamino-4,4'-dihydroxy And the like.
As the diamine represented by the formula (11), a diamine in which Y 2 is a structure represented by the following formula (6) may also be used.
[Chemical Formula 15]
(Wherein,
R 4 to R 9 each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a haloalkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a halogen atom, a nitro group, , a cyano group, W 1 a represents a group which may be substituted with furyl or thienyl group which may be substituted with W 1-naphthyl group, W 1, which may be substituted with a phenyl group, W 1, which may be substituted,
W 1 represents an alkyl group having 1 to 10 carbon atoms, a haloalkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a hydroxyl group, a halogen atom, a nitro group, a cyano group or a carboxyl group Lt; / RTI >
Z 1 represents an alkylene group having 1 to 10 carbon atoms, a haloalkylene group having 1 to 10 carbon atoms, a sulfonyl group, a carbonyl group, an amide group or an oxygen atom,
V 2 and V 3 represent an alkali-soluble group. Represents the number of bonds).
In the above formula (6), it is preferable that V 2 and V 3 are each independently a hydroxyl group or a carboxyl group.
Examples of the diamine represented by the formula (11) in which Y 2 is a structure represented by the formula (6) include bis (3-amino-4-hydroxyphenyl) sulfide (BSDA), bis (3-amino-4-hydroxyphenyl) propane (BAPA), 3,3'-diamino-4,4'-dihydroxy (3-amino-4-hydroxyphenyl) anilide (AHPA), 2,2'-bis (3-amino-4-hydroxyphenyl) hexa Dihydroxybiphenyl (2BP), and bis (3-amino-4-hydroxyphenyl) ether (AHPE) have.
The solvent used in the reaction for the production of the polyamic acid is not particularly limited, and examples thereof include N, N-dimethylacetamide, N, N-diethylacetamide, N, N, N-dimethyl-N, N-dimethylpyrrolidone, hexamethylphosphoramide, dimethylsulfoxide, 3-methoxy- Propylamide, 3-isopropoxy-N, N-dimethylpropylamide, 3-butoxy-N, N-dimethylpropylamide, 3- Dimethoxyethane-bis (2-methoxyethyl) ether, tetrahydrofuran (1, 2-dimethylaminopropyl) (Nonprotonic) solvents such as 1,4-dioxane, picoline, pyridine, acetone, chloroform, toluene and xylene, and organic solvents such as phenol, o-cresol, Phenol, m-chlorophenol, and protonic solvents such as p-chlorophenol. These solvents may be used alone or in combination of two or more.
In the above reaction, the molar ratio of the diamine represented by the formula (10) to the diamine represented by the formula (11) is preferably 70/30 to 99/1, and the ratio of the diamine represented by the formula It is more preferably from 75/25 to 95/5 from the viewpoint that the cured film obtained from the composition has a sufficiently low coefficient of linear expansion and sufficiently high strength.
In the above reaction, it is preferable that the ratio of the acid dianhydride component to the diamine component is from 0.8 to 1.2 as acid anhydride component / diamine component in a molar ratio. As in the case of the usual polycondensation reaction, the closer the molar ratio is to 1, the larger the degree of polymerization of the resulting polymer. If the degree of polymerization is too small, the strength of the polyimide cured film becomes insufficient, and if the degree of polymerization is too large, the workability in forming the polyimide cured film may be deteriorated.
The weight average molecular weight of the polyamic acid to be produced is preferably 3,000 to 200,000 in terms of polystyrene in order to maintain the strength of the cured film obtained from the resin composition for a display substrate containing a polyamic acid. If the weight average molecular weight is less than 3,000, there is a possibility that the finished film will become loose. On the other hand, if the weight average molecular weight exceeds 200,000, the viscosity of the polyamic acid varnish may become excessively high.
The relationship between the number (n) of the structural units represented by the formula (1) and the number (m) of the structural units represented by the formula (3) in the produced polyamic acid is preferably n / m = 70 / / 1, more preferably 75/25 to 95/5.
Particularly, from the viewpoint that the obtained cured film has sufficiently low coefficient of linear expansion and sufficiently high strength, it is preferable that X 1 is a group represented by the formula (8) wherein R 14 to R 23 are hydrogen atoms and Z 2 and Z 3 are oxygen atoms the structure represented, Y 1 a, R 10 to R 13 is (a structural unit represented by the following formula (1-1)), a hydrogen atom in formula (7) in equation (1) structural unit represented by the structure represented by And X 1 is a structure represented by the formula (8) wherein R 14 to R 23 are hydrogen atoms, Z 2 and Z 3 are oxygen atoms, Y 2 is a hydrogen atom, R 1 to R 3 are each a hydrogen atom, and V 1 The proportion of the structural unit represented by the formula (3) (the structural unit represented by the following formula (3-1)), which is the hydroxy group, represented by the formula (5) Is preferably 70 mol% or more, more preferably 80 mol% or more, and even more preferably 85 mol% or more in the repeating units.
[Chemical Formula 16]
Wherein k, l and p have the same meanings as defined in the formulas (5), (7) and (8), respectively)
When a resin composition for a display substrate is prepared, in particular, dissolved or dispersed in a solvent by using the polyamic acid obtained by the above-described method to prepare the resin composition in the form of a varnish, X 1 is represented by the following formula (8-2) , Wherein Y 1 is a structure represented by the formula (7-2) and X 1 is a structure represented by the following formula (8-2), and Y 2 Is a polyamic acid containing a structural unit represented by the formula (3), which is a structure represented by the following formula (5-2), (hereinafter referred to as a structure A), and X 1 is represented by the following formula (8-3) , Wherein Y 1 is a structure represented by the formula (7-3) and X 1 is a structure represented by the following formula (8-3), and Y 2 Is more preferably a polyamic acid containing a structural unit represented by the formula (3) which is a structure represented by the following formula (5-3) (hereinafter referred to as composition B), X 1 is a structure represented by the following formula (8-3) wherein p is 2 and Y 1 is a structural unit represented by the formula (1) wherein l is 1 and the structure represented by the following formula (7-3) (3) wherein X 1 is a structure represented by the following formula (8-3) wherein p is 2 and Y 2 is a structure represented by the following formula (5-3) wherein k is 2, (Hereinafter referred to as composition C).
[Chemical Formula 17]
Wherein k, l and p have the same meanings as defined in the formulas (5), (7) and (8), respectively. Represents the number of bonds. ]
The number (n) of the structural units represented by the formula (1) and the number (m) of the structural units represented by the formula (3) in each of these preferable constitutions (constitution A, m / mol = 70/30 to 99/1, preferably n / m = 75/25 to 95/5, and the structural unit represented by the formula (1-1) -1) is 70% by mole or more, preferably 80% by mole or more, and more preferably 85% by mole or more, of the repeating units of the polyamic acid as a total of both, The weight average molecular weight of the mixed acid is preferably 3,000 to 200,000 (in terms of polystyrene).
The polyamic acid including the structural unit represented by the formula (1) and the structural unit represented by the formula (3) described above is also an object of the present invention.
<Polyimide>
The polyimide contained in the resin composition for a display substrate of the present invention can be obtained by subjecting a polyamic acid synthesized as described above to dehydration cyclization (thermal imidization) by heating. In this case, it is also possible to convert the polyamic acid into an imide in a solvent and use it as a solvent-soluble polyimide. In addition, a method of chemically ringing using a known dehydration ring-closing catalyst may be employed. The heating method can be carried out at any temperature of 100 to 300 占 폚, preferably 120 to 250 占 폚. The method of chemically cycling can be carried out, for example, in the presence of pyridine, triethylamine or the like, acetic anhydride or the like, and the temperature at this time can be selected arbitrarily from -20 to 200 ° C.
In the present invention, the reaction solution of polyimide can be used as a resin composition for a display substrate by directly or after diluting or concentrating, or by re-dissolving or dispersing polyimide recovered by re-precipitation from a reaction solution in an appropriate solvent . The solvent used for dilution, redissolution or dispersion is not particularly limited as long as it dissolves or disperses the obtained polyimide. Examples thereof include m-cresol, 2-pyrrolidone, N-methyl- Pyrrolidone, N, N-dimethylacetamide, N, N-dimethylformamide, 3-methoxy-N, N-dimethylpropylamide, 3- N-dimethylformamide, 3-propoxy-N, N-dimethylpropylamide, 3-isopropoxy-N, , 3-sec-butoxy-N, N-dimethylpropylamide, 3-tert-butoxy-N, N-dimethylpropylamide and? -Butyrolactone. These solvents may be used alone or in combination of two or more.
The weight average molecular weight of the resulting polyimide is preferably 3,000 to 200,000 in terms of polystyrene in order to maintain the strength of the cured film obtained from the resin composition for display substrate containing polyimide. When the weight average molecular weight is less than 3,000, there is a possibility that the finished film may become loose. On the other hand, when the weight average molecular weight exceeds 200,000, the viscosity of the varnish of the polyimide may become excessively high.
The relationship between the number (n) of the structural units represented by the formula (2) and the number (m) of the structural units represented by the formula (4) in the resulting polyimide is preferably n / m = 70 / / 1, more preferably 75/25 to 95/5.
Particularly, from the viewpoint that the obtained cured film has sufficiently low coefficient of linear expansion and sufficiently high strength, it is preferable that X 1 is a group represented by the formula (8) wherein R 14 to R 23 are hydrogen atoms and Z 2 and Z 3 are oxygen atoms the structure represented, Y 1 a, R 10 to R 13 is (a structural unit represented by the following formula (2-1)), a hydrogen atom in formula (7) structural unit represented by the formula (2) represented by the structure And X 1 is a structure represented by the formula (8) wherein R 14 to R 23 are hydrogen atoms, Z 2 and Z 3 are oxygen atoms, Y 2 is a hydrogen atom, R 1 to R 3 are each a hydrogen atom, and V 1 The proportion of the structural unit represented by the formula (4) (the structural unit represented by the following formula (4-1)), which is the hydroxy group, represented by the formula (5) Is preferably 70 mol% or more, more preferably 80 mol% or more, and even more preferably 85 mol% or more in the repeating units.
[Chemical Formula 18]
Wherein k, l and p have the same meanings as defined in the formulas (5), (7) and (8), respectively)
When the resin composition for a display substrate is produced using the polyimide obtained by the above-described method, particularly when the resin composition is produced in the form of a varnish by dissolving or dispersing the resin composition in a solvent, X 1 satisfies the formula (8-2) And Y 1 is a structure represented by the formula (7-2), and X 1 is a structure represented by the formula (8-2), and Y 2 Is preferably a polyimide comprising a structural unit represented by the formula (4), which is a structure represented by the formula (5-2) (hereinafter referred to as composition D), and X 1 is a polyimide represented by the formula (8-3) And Y 1 is a structure represented by the formula (7-3) and a structural unit represented by the formula (2) and X 1 is a structure represented by the formula (8-3), and Y 2 this is, the formula (5-3) are more preferred, and polyimide (hereinafter referred to as configuration E) containing the structural unit represented by the formula (4) represented by the structure, X 1, p is 2, a structure represented by the formula (8-3), Y is 1, l is 1 and the structural unit represented by X 1 in formula (2), the structure represented by the formula (7-3) is , a structure represented by the formula (8-3) wherein p is 2 and Y 2 is a structure represented by the formula (5-3) wherein k is 2 and a structural unit represented by the formula (4) Polyimide is still more preferable (hereinafter, composition F).
The number (n) of the structural units represented by the formula (2) and the number (m) of the structural units represented by the formula (4) are preferably n (2-1) and the formula (4) satisfy the relationship of / m = 70/30 to 99/1, preferably n / m = 75/25 to 95/5. -1) is 70 mol% or more, preferably 80 mol% or more, and more preferably 85 mol% or more, of the repeating units of the polyimide as a total of both the polyimide Meade preferably has a weight average molecular weight of 3,000 to 200,000 (in terms of polystyrene).
The polyimide including the structural unit represented by the formula (2) and the structural unit represented by the formula (4) described above is also an object of the present invention.
The resin composition for a display substrate of the present invention contains a structural unit represented by the formula (1) and a structural unit represented by the formula (3), a structural unit represented by the formula (2) ). ≪ / RTI >
It is preferable that the resin composition for a display substrate of the present invention contains a solvent and the polyamic acid or polyimide is dissolved or uniformly dispersed, and it is more preferable that the polyamic acid or polyimide is dissolved in a solvent. Examples of such a solvent include the solvents described in the paragraph [0114].
In addition, the resin composition for a display substrate of the present invention may contain a crosslinking agent (hereinafter also referred to as a crosslinking compound).
<Cross-linking agent>
The crosslinkable compound is particularly limited as long as it is a compound having a group capable of reacting with an organic group contained in at least one of polyamic acid and polyimide in the step of converting a coating film obtained by using the resin composition for a display substrate into a cured film It does not. Examples of such a compound include a compound containing two or more epoxy groups, a melamine derivative, a benzoguanamine derivative, glycoluril or the like having a hydrogen atom of the amino group, a methylol group, an alkoxymethyl group, . The melamine derivative and the benzoguanamine derivative may be a dimer or a trimer, or may be a mixture optionally selected from a monomer, a dimer and a trimer. These melamine derivatives and benzoguanamine derivatives preferably have an average of 3 or more and 6 or less methylol groups or alkoxymethyl groups per triazine ring.
The crosslinking agent used in the present invention may be used alone or in combination of two or more.
Specific examples of the crosslinkable compound are shown below, but the present invention is not limited thereto.
Examples of compounds containing two or more epoxy groups include epoxies having a cyclohexene structure such as EPOLEAD GT-401, EPOLEAD GT-403, EPOLEAD GT-301, EPOLEAD GT-302, CELOXIDE 2021 and CELOXIDE 3000 (manufactured by Daicel Corporation) compound; Bisphenol A type epoxy compounds such as EPIKOTE 1001, EPIKOTE 1002, EPIKOTE 1003, EPIKOTE 1004, EPIKOTE 1007, EPIKOTE 1009, EPIKOTE 1010, EPIKOTE 828 (above, JAPAN EPOXYRESINE (JER)); Bisphenol F type epoxy compounds such as EPIKOTE 807 (manufactured by JER); Phenolic novolak type epoxy compounds such as EPIKOTE 152, EPIKOTE 154 (manufactured by JER), EPPN201 and EPPN202 (manufactured by Nippon Kayaku Co., Ltd.); Cresol novolak epoxy compounds such as ECON-102, ECON-103S, ECON-104S, ECON-1020, ECON-1025 and ECON-1027 (manufactured by Nippon Kayaku Co., Ltd.) and EPIKOTE 180S75 ; Naphthalene type epoxy compounds such as V8000-C7 (manufactured by DIC Corporation); Araldite CY-192, Araldite CY-184 (manufactured by BASF), EPICLON 200, EPICLON 400 (manufactured by Nagase ChemteX Corporation), CY175, CY177, CY179, Araldite CY-182, Araldite CY- Alicyclic epoxy compounds such as EPIKOTE 871, EPIKOTE 872 (manufactured by JER), ED-5661 and ED-5662 (manufactured by Celanese coating, Ltd.); DENACOL EX-314, DENACOL EX-314, DENACOL EX-314, DENACOL EX-316, DENACOL EX-316, DENACOL EX- And aliphatic polyglycidyl ether compounds such as DENACOL EX-312 (manufactured by Nagase ChemteX Corporation).
As the melamine derivatives, benzoguanamine derivatives or glycolurils, in which the hydrogen atom of the amino group has a methylol group, an alkoxymethyl group or both of them, there may be mentioned MX-750 in which an average of 3.7 methoxymethyl groups per triazine ring is substituted, MW-30 (manufactured by Sanwa Chemical Industrial Co., Ltd.) having an average of 5.8 substitution of methoxymethyl groups per 1 ginseng; Methoxymethylated melamines such as CYMEL 300, CYMEL 301, CYMEL 303, CYMEL 350, CYMEL 370, CYMEL 771, CYMEL 325, CYMEL 327, CYMEL 703, CYMEL 712; Methoxymethylated butoxymethylated melamines such as CYMEL 235, CYMEL 236, CYMEL 238, CYMEL 212, CYMEL 253, and CYMEL 254; Butoxymethylated melamines such as CYMEL 506 and CYMEL 508; Methoxymethylated isobutoxymethylated melamine containing carboxyl groups such as CYMEL 1141; Methoxymethylated ethoxymethylated benzoguanamine, such as CYMEL 1123; Methoxymethylated butoxymethylated benzoguanamine such as CYMEL 1123-10; Butoxymethylated benzoguanamine, such as CYMEL 1128; Carboxyl-containing methoxymethylated ethoxymethylated benzoguanamine, such as CYMEL 1125-80; Butoxymethylated glycoluril such as CYMEL 1170; (Manufactured by Mitsui Cyanamid Co., Ltd.), such as CYMEL 1172, and the like.
The content of the crosslinking agent in the resin composition for a display substrate of the present invention is preferably in the range of from 0.1 to 10 parts by mass, more preferably from 0.1 to 50 parts by mass, per 100 parts by mass of the polyamic acid or polyimide (when both are contained, polyamic acid and polyimide) 20 parts by mass or less, and more preferably 15 parts by mass or less from the viewpoint that the cured film obtained from the resin composition of the present invention has a sufficiently low linear expansion coefficient.
[Varnish and curing membrane]
A specific method of forming the cured film using the resin composition for a display substrate of the present invention is as follows.
First, a polyamic acid containing the structural unit represented by the formula (1) and the structural unit represented by the formula (3) or the structural unit represented by the formula (2) and the structural unit represented by the formula (4) Is dissolved or dispersed in a solvent to prepare a resin composition in the form of a varnish (film forming material). Alternatively, the resin composition in the form of a varnish is prepared by directly using the reaction solution of the polyamic acid or polyimide described above, or by diluting or concentrating it.
The varnish may be coated on a substrate by a cast coating method, a spin coating method, a blade coating method, a dipping coating method, a roll coating method, a bar coating method, a die coating method, an ink jet method, Etc.) to obtain a coated film. The obtained coating film is fired in a hot plate, an oven or the like to form a cured film.
The baking temperature for forming the cured film is usually 100 to 400 ° C, preferably 100 to 350 ° C. By this baking treatment, the solvent evaporates and the polyamic acid becomes dehydrated and cyclized (imidized) to become polyimide. At this time, a temperature change of two or more stages may be given for the purpose of exposing a higher uniform film-forming property (film-forming property) or promoting the reaction on the substrate.
Examples of the substrate to be used include plastic (polycarbonate, polymethacrylate, polystyrene, polyester, polyolefin, epoxy, melamine, triacetylcellulose, ABS, AS and norbornene resins) , Glass, slate, and the like.
The solvent used in the form of the varnish is not particularly limited as long as it dissolves or disperses the polyamic acid or the polyimide. Examples of the solvent include a solvent used in the reaction for producing the polyamic acid. These solvents may be used alone or in combination of two or more.
The concentration at which the polyamic acid or the polyimide (both polyamic acid and polyimide when they are contained, hereinafter the same) is dissolved or dispersed in the solvent is generally the total mass of the polyamic acid or the polyimide and the solvent And 5 to 20 mass% from the viewpoint of improving the storage stability of the resin composition, and more preferably 5 to 15 mass% from the viewpoint of improving the varnish applicability.
The thickness of the cured film formed from the resin composition for a display substrate is not particularly limited, but is usually 1 to 50 占 퐉, preferably 5 to 40 占 퐉.
Example
Hereinafter, the present invention will be described more specifically by way of examples, but the present invention is not limited to the following examples.
[Abbreviation used in the examples]
The meanings of the weak symbols used in the following examples are as follows.
<Acid dianhydride>
BP-TME: 4,4'-biphenylbis (trimellitic acid monoester acid anhydride) (manufactured by Honshu Chemical Industry Co., Ltd.) (the following formula (12)):
[Chemical Formula 19]
TAHQ: p-phenylenebis (trimellitic acid monoester acid anhydride) (manufactured by Manac Incorporated) (the following formula (13)):
[Chemical Formula 20]
<Diamine>
PDA: p-phenylenediamine (manufactured by Tokyo Chemical Industry Co., Ltd.)
HAB: 4,4'-diamino-3,3'-dihydroxybiphenyl (manufactured by Wakayama Seika Kogyo Co., Ltd.)
4BP: 3,3'-diamino-4,4'-dihydroxybiphenyl (manufactured by Wakayama Seika Kogyo Co., Ltd.)
<Cross-linking agent>
V8000-C7: Naphthalene type epoxy compound (manufactured by DIC Corporation)
<Solvent>
NMP: N-methyl-2-pyrrolidone
[Measurement of number-average molecular weight and weight-average molecular weight]
The weight average molecular weight (hereinafter abbreviated as Mw) and the molecular weight distribution of the polymer were measured using a GPC apparatus (Shodex [registered trademark] columns KF803L and KF805L) manufactured by JASCO Corporation, Amide was measured under the conditions of a flow rate of 1 mL / min and a column temperature of 50 캜. Mw was a polystyrene conversion value.
≪ Synthesis Example P1: Synthesis of polyamic acid (P1) >
(0.189 mol) of BP-TME was added, and then 74 g of NMP was added again. After the addition of 16 g (0.154 mol) of PDA and 8.34 g (0.039 mol) of HAB, Lt; / RTI > The polymer thus obtained had Mw of 129,000 and a molecular weight distribution of 2.5.
≪ Synthesis Example P2: Synthesis of polyamic acid (P2) >
(0.192 mole) of PDA and 4.24 g (0.039 mole) of 4BP were dissolved in 700 g of NMP, and 102 g (0.192 mole) of BP-TME was added. 74 g of NMP was added again, Lt; / RTI > The polymer thus obtained had Mw of 136,300 and a molecular weight distribution of 2.4.
≪ Synthesis Example P3: Synthesis of polyamic acid (P3) >
(0.306 mol) of TAHQ was added, and 20 g of NMP was added again. The reaction solution was reacted at 23 占 폚 for 24 hours under a nitrogen atmosphere, . The Mw of the obtained polymer was 119,600 and the molecular weight distribution was 3.5.
≪ Comparative Example HP1: Synthesis of polyamic acid (HP1) >
(0.210 mol) of PDA was dissolved in 700 g of NMP, 94.3 g (0.205 mol) of TAHQ was added, 83 g of NMP was added again, and the mixture was reacted at 23 DEG C for 24 hours under a nitrogen atmosphere. The polymer thus obtained had Mw of 103,300 and a molecular weight distribution of 3.8.
≪ Comparative Example HP2: Synthesis of polyamic acid (HP2) >
After adding 84.9 g (0.158 mol) of BP-TME, 80 g of NMP was added again, and the reaction was allowed to proceed at 23 占 폚 for 24 hours under a nitrogen atmosphere. The polymer thus obtained had Mw of 148,400 and a molecular weight distribution of 2.5.
≪ Comparative Example HP3: Synthesis of polyamic acid (HP3) >
(0.180 mol) of HAB was dissolved in 800 g of NMP, 81.0 g (0.176 mol) of TAHQ was added, 80 g of NMP was added again, and the reaction was allowed to proceed at 23 캜 for 24 hours under a nitrogen atmosphere. The Mw of the obtained polymer was 127,600 and the molecular weight distribution was 2.8.
≪ Comparative Example HP4: Synthesis of polyamic acid (HP4) >
(0.180 mol) of 4BP was dissolved in 800 g of NMP, 81.0 g (0.176 mol) of TAHQ was added, and then 80 g of NMP was added again, followed by reaction at 23 deg. C for 24 hours under a nitrogen atmosphere. The Mw of the obtained polymer was 127,600 and the molecular weight distribution was 2.8.
<Sample production: varnish>
NMP was mixed as a polymer solution, a crosslinking agent and a solvent in accordance with the composition shown in Table 1 and stirred at room temperature (about 23 ° C) for 6 hours or more to prepare a uniform solution to prepare a resin composition for display substrate (varnish).
[Table 1]
≪ Evaluation of coating film and coefficient of linear expansion >
The resin composition (varnish) for the display substrate prepared above was evaluated by the following method. The evaluation results are shown in Table 2.
[Curing film thickness and peeling method]
Each of the resin compositions (varnishes) for a display substrate shown in Table 1 was coated on a 100 mm x 100 mm glass substrate using a bar coater (step difference 250 탆), heated at a temperature of 110 캜 for 10 minutes, at a temperature of 250 캜 for 30 minutes, Lt; / RTI > for 30 minutes. The film thickness of the obtained coating film was measured using a contact type film thickness meter (Dektak 3ST, ULVAC Co., Ltd.). Thereafter, the glass substrate was left in 70 ° C pure water in a 1 L beaker, and the film was peeled off.
[Linear Expansion Coefficient]
A rectangular piece of 20 mm x 5 mm in shape was prepared from the film obtained above and heated from 50 DEG C to 400 DEG C at a rate of 5 DEG C / minute using TMA-4000SA (manufactured by BrukerAXS Co., Ltd.) The coefficient of linear expansion was measured up to 400 degrees.
[Table 2]
As shown in Table 2, it was found that the thin film obtained from the resin composition for a display substrate of the present invention had an appropriate linear expansion coefficient and appropriate flexibility.
Claims (26)
[In the formulas (1) to (4)
X < 1 >
(Wherein,
R 14 to R 23 each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a haloalkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a hydroxyl group, a halogen atom, group, a formyl group, a cyano group, a carboxyl group, W 1 represents an optionally substituted furyl a thienyl group, or W 1, which may be substituted with a naphthyl group, W 1, which may be substituted with a phenyl group, W 1, which may be substituted with,
W 1 represents an alkyl group having 1 to 10 carbon atoms, a haloalkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a hydroxyl group, a halogen atom, a nitro group, a cyano group or a carboxyl group Lt; / RTI >
Z 2 and Z 3 each independently represent -NH-, -NZ 4 - or an oxygen atom,
Z 4 represents an alkyl group having 1 to 10 carbon atoms,
p represents an integer of 1 or 2; In addition, "?&Quot; represents the number of bonds (bonding hands)
Y 1 is a group represented by the following formula (7)
(Wherein,
R 10 to R 13 independently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, or an alkoxy group having 1 to 10 carbon atoms,
l represents an integer of 1 to 3; In addition, "?&Quot; represents the number of bonds (bonding hands)
Y 2 is a group represented by the following formula (5)
(Wherein,
R 1 to R 3 each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a haloalkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a halogen atom, a nitro group, , a cyano group, W 1 a represents a group which may be substituted with furyl or thienyl group which may be substituted with W 1-naphthyl group, W 1, which may be substituted with a phenyl group, W 1, which may be substituted,
W 1 represents an alkyl group having 1 to 10 carbon atoms, a haloalkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a hydroxyl group, a halogen atom, a nitro group, a cyano group or a carboxyl group Lt; / RTI >
V 1 represents an alkali-soluble group,
k represents an integer of 1 to 3; (O) represents a bond number (bond)), or a structure represented by the following formula (6)
(Wherein,
R 4 to R 9 each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a haloalkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a halogen atom, a nitro group, , a cyano group, W 1 a represents a group which may be substituted with furyl or thienyl group which may be substituted with W 1-naphthyl group, W 1, which may be substituted with a phenyl group, W 1, which may be substituted,
W 1 represents an alkyl group having 1 to 10 carbon atoms, a haloalkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a hydroxyl group, a halogen atom, a nitro group, a cyano group or a carboxyl group Lt; / RTI >
Z 1 represents an alkylene group having 1 to 10 carbon atoms, a haloalkylene group having 1 to 10 carbon atoms, a sulfonyl group, a carbonyl group, an amide group or an oxygen atom,
V 2 and V 3 represent an alkali-soluble group. In addition, " o " represents a bonded number (bonding hand)),
n and m represent a natural number.]
Wherein V 1 represents a hydroxyl group or a carboxyl group.
Wherein each of R 1 to R 3 independently represents a hydrogen atom, a halogen atom, an alkyl group having 1 to 3 carbon atoms, or an alkoxy group having 1 to 3 carbon atoms, wherein V 1 represents a hydroxy group, / RTI >
Wherein R 1 to R 3 represent a hydrogen atom, and k represents 2.
And V 2 and V 3 each independently represent a hydroxyl group or a carboxyl group.
And R 4 to R 9 represent hydrogen atoms.
And R 10 to R 13 each independently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 3 carbon atoms, or an alkoxy group having 1 to 3 carbon atoms, and l is 1 or 2 Composition.
Wherein R 10 to R 13 represent hydrogen atoms.
And R < 14 > to R < 23 > represent hydrogen atoms.
Wherein n in the formula (1) and m in the formula (3) are n / m = 70/30 to 99/1.
Wherein n in the formula (2) and m in the formula (4) are n / m = 70/30 to 99/1.
Further comprising a crosslinking agent.
Wherein the crosslinking agent is a compound having at least two epoxy groups and at least one aromatic group.
Wherein the crosslinking agent has 6 or less epoxy groups and the compound further has an alkylene group having 1 to 10 carbon atoms for bonding an epoxy group and an aromatic group.
Wherein the crosslinking agent is 20 parts by mass or less based on 100 parts by mass of the polyamic acid or polyimide.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011258128 | 2011-11-25 | ||
| JPJP-P-2011-258128 | 2011-11-25 | ||
| PCT/JP2012/080203 WO2013077364A1 (en) | 2011-11-25 | 2012-11-21 | Resin composition for display substrates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20140098184A KR20140098184A (en) | 2014-08-07 |
| KR101749609B1 true KR101749609B1 (en) | 2017-06-21 |
Family
ID=48469806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020147017255A KR101749609B1 (en) | 2011-11-25 | 2012-11-21 | Resin composition for display substrates |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6115727B2 (en) |
| KR (1) | KR101749609B1 (en) |
| CN (1) | CN104066769B (en) |
| TW (1) | TWI624495B (en) |
| WO (1) | WO2013077364A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015110684A (en) * | 2012-03-22 | 2015-06-18 | 日産化学工業株式会社 | Polyamic acid and polyimide |
| KR102602473B1 (en) * | 2015-02-10 | 2023-11-16 | 닛산 가가쿠 가부시키가이샤 | Composition for forming release layer |
| JP6938837B2 (en) | 2017-09-04 | 2021-09-22 | エルジー・ケム・リミテッド | Polyimide film for flexible display element substrate |
| JP7435110B2 (en) | 2020-03-19 | 2024-02-21 | 住友ベークライト株式会社 | Polyhydroxyimide, polymer solution, photosensitive resin composition and its uses |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008184558A (en) * | 2007-01-30 | 2008-08-14 | Asahi Kasei Corp | Polyimide precursor and polyimide having ester group and oxazole structure and process for producing the same |
| JP2010083951A (en) * | 2008-09-30 | 2010-04-15 | Sony Chemical & Information Device Corp | Photosensitive siloxane polyimide resin composition |
| JP2010174195A (en) | 2009-01-30 | 2010-08-12 | Asahi Kasei Corp | Polyimide polyamide copolymer and photosensitive resin composition |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW574620B (en) * | 2001-02-26 | 2004-02-01 | Toray Industries | Precursor composition of positive photosensitive resin and display device using it |
| JP4082041B2 (en) * | 2001-02-26 | 2008-04-30 | 東レ株式会社 | Positive photosensitive resin precursor composition, electronic component using the same, and display device |
| JP2004198678A (en) * | 2002-12-18 | 2004-07-15 | Toray Ind Inc | Positive photosensitive resin precursor composition |
| JP2007169585A (en) * | 2005-09-20 | 2007-07-05 | Manac Inc | Polyesterimide having low liner thermal expansion coefficient and precursor thereof, and method for producing them |
| JP4961726B2 (en) * | 2005-11-24 | 2012-06-27 | 新日本理化株式会社 | Polyimide precursor and polyimide, and polyimide-based plastic substrate and method for producing the same. |
| JP2007231224A (en) * | 2006-03-03 | 2007-09-13 | Sumitomo Chemical Co Ltd | Polyimide film for display |
| JP2008101187A (en) * | 2006-09-19 | 2008-05-01 | Asahi Kasei Corp | Polyesterimide and method for producing the same |
| JP5491735B2 (en) * | 2007-01-26 | 2014-05-14 | 本州化学工業株式会社 | Novel ester group-containing tetracarboxylic dianhydrides, novel polyesterimide precursors and polyesterimides derived therefrom |
| JP2008297362A (en) * | 2007-05-29 | 2008-12-11 | Mitsubishi Chemicals Corp | Ester group-containing tetracarboxylic acid dianhydride, polyimide having high toughness, and its precursor |
| JP5121393B2 (en) * | 2007-10-26 | 2013-01-16 | 旭化成イーマテリアルズ株式会社 | Negative photosensitive resin composition |
| JP2011133615A (en) * | 2009-12-24 | 2011-07-07 | Toray Ind Inc | Positive photosensitive resin composition |
-
2012
- 2012-11-21 JP JP2013545949A patent/JP6115727B2/en active Active
- 2012-11-21 KR KR1020147017255A patent/KR101749609B1/en active IP Right Grant
- 2012-11-21 WO PCT/JP2012/080203 patent/WO2013077364A1/en active Application Filing
- 2012-11-21 CN CN201280067830.5A patent/CN104066769B/en active Active
- 2012-11-23 TW TW101143974A patent/TWI624495B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008184558A (en) * | 2007-01-30 | 2008-08-14 | Asahi Kasei Corp | Polyimide precursor and polyimide having ester group and oxazole structure and process for producing the same |
| JP2010083951A (en) * | 2008-09-30 | 2010-04-15 | Sony Chemical & Information Device Corp | Photosensitive siloxane polyimide resin composition |
| JP2010174195A (en) | 2009-01-30 | 2010-08-12 | Asahi Kasei Corp | Polyimide polyamide copolymer and photosensitive resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20140098184A (en) | 2014-08-07 |
| JPWO2013077364A1 (en) | 2015-04-27 |
| TW201335234A (en) | 2013-09-01 |
| TWI624495B (en) | 2018-05-21 |
| JP6115727B2 (en) | 2017-04-19 |
| CN104066769A (en) | 2014-09-24 |
| WO2013077364A1 (en) | 2013-05-30 |
| CN104066769B (en) | 2019-01-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10526451B2 (en) | Polyamide-imide precursor, polyamide-imide film, and display device comprising same | |
| KR101749626B1 (en) | Resin composition for display substrates | |
| KR20130029129A (en) | Poly(amide-imide) block copolymer, article including same, and display device including the article | |
| KR102212979B1 (en) | Resin composition for display substrate, thin resin film for display substrate, and process for producing thin resin film for display substrate | |
| KR20140133585A (en) | Polyamic acid and polyimide | |
| JP2010513591A (en) | Polyimide resin, liquid crystal alignment film and polyimide film using the same | |
| CN111971327B (en) | Polyamic acid, polyamic acid solution, polyimide film, laminate, flexible device, and method for producing same | |
| CN111533909B (en) | Polyamide imide, polyamide imide film and display device | |
| KR20130003358A (en) | Polyamic acid and polyamic acid solution, polyimide protecive layer, polyimide film | |
| KR101749609B1 (en) | Resin composition for display substrates | |
| KR101230418B1 (en) | Cross-linked Polyimide film and Preparation method for the same | |
| CN112204086B (en) | Polyimide-based polymer film, substrate for display device using same, and optical device | |
| JP6075562B2 (en) | Resin composition for display substrate | |
| JP2013040249A (en) | Resin composition for display substrate | |
| KR20150107765A (en) | Method for producing resin thin film for display substrates and composition for forming resin thin film for display substrates | |
| JP2015101710A (en) | Polyimide precursor composition, method of producing polyimide, polyimide, polyimide film, and substrate | |
| KR102040355B1 (en) | High strength transparent polyamide-imide and process for preparing same | |
| US7858734B2 (en) | Polyimide material and preparation method thereof | |
| KR20160099411A (en) | Composition of preparing poly(imide-benzoxasole)copolymer, poly(imide-benzoxasole)copolymer, article contatining poly(imide-benzoxasole)copolymer, and display device including same | |
| WO2013180059A1 (en) | Resin composition | |
| WO2013141239A1 (en) | Polyamic acid and polyimide | |
| JP2018080344A (en) | Polyimide precursor composition, method for producing polyimide, polyimide, polyimide film, and substrate | |
| JP2011074177A (en) | Polyimide material, polyimide resin composition, film, and method of producing the same | |
| KR102040357B1 (en) | High strength transparent polyamide-imide and process for preparing same | |
| KR100414206B1 (en) | Polyimide resin |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E701 | Decision to grant or registration of patent right |