KR101748908B1 - Transfer film with excellent thermal stability property - Google Patents

Abstract

The present invention relates to a substrate layer; A hard coat layer formed under the substrate layer; A first printing layer formed under the hard coating layer; A deposition layer formed under the first printing layer; A second printing layer formed under the deposition layer; And an adhesive layer formed under the second printing layer, which is excellent in thermal stability.

Description

[0001] TRANSFER FILM WITH EXCELLENT THERMAL STABILITY PROPERTY [0002]

The present invention relates to a transfer film excellent in thermal stability, and more particularly, to a transfer film excellent in thermal stability capable of preventing deformation of a deposition layer without separately applying a high-value deposition primer layer to a lower portion of the deposition layer .

Called in-mold injection is widely used in manufacturing front windows for washing machines and air conditioners, LCD windows for computers and mobile phones, and the like. Inmold injection refers to a method in which a transfer film printed with a pattern is mounted between a fixed mold and a moving mold of an injection mold, and a molten resin is injected so that the pattern printed on the transfer film is transferred to the injection mold simultaneously with injection. By using such an in-mold injection method, injection and transfer including injection, vacuum deposition, adhesion, and the like can be shortened to one-step process, and the production cost of the injection-molded product can be reduced and the defect rate can be considerably reduced.

In this in-mold injection, the transfer film has a great influence on the quality of the injection-molded article. The transfer film usually has a base film having a releasability, a protective layer laminated on the base film, a printing layer laminated on the protective layer and printed with a predetermined pattern, a vapor deposition layer deposited on the printing layer, An adhesive layer or the like. When the injection process is completed, the protective layer, the print layer, and the deposition layer are transferred to the injection mold by the adhesive layer, and the base film is separated and removed. The protective layer is adhered only onto the injection-molded part, and the remaining part is removed together with the base film, covering the printing layer.

In the case of the conventional transfer film as described above, there is a problem that the thermal stability is inferior. Therefore, there is a need for efforts to improve it.

The present invention relates to a substrate layer; A hard coat layer formed under the substrate layer; A first printing layer formed under the hard coating layer; A deposition layer formed under the first printing layer; A second printing layer formed under the deposition layer; And an adhesive layer formed under the second printing layer, which are excellent in thermal stability.

However, the technical problem to be solved by the present invention is not limited to the above-mentioned problems, and other matters not mentioned can be clearly understood by those skilled in the art from the following description.

The present invention relates to a substrate layer; A hard coat layer formed under the substrate layer; A first printing layer formed under the hard coating layer; A deposition layer formed under the first printing layer; A second printing layer formed under the deposition layer; And an adhesive layer formed on a lower portion of the second printed layer.

A first deposition primer layer formed between the hard coating layer and the first printing layer; And a second deposition primer layer formed between the second print layer and the adhesive layer.

The first print layer may include at least one selected from the group consisting of an acrylic resin, a melamine resin, and a polyamide resin.

The thickness of the first print layer or the second print layer may be 0.5 탆 to 3 탆.

At least one of the second printing layer and the second deposition primer layer may include a urethane-based resin.

The urethane-based resin may be one produced by the reaction of a urethane-based prepolymer and a chain extender.

The chain extender may have 2 to 12 carbon atoms.

The adhesive layer may include a block type resin.

The block type curing agent may be an isocyanate-based resin.

The adhesive layer may be formed by one or more methods selected from the group consisting of gravure printing, flexographic printing, microgravure coating, comma coating and roll coating.

The thickness of the adhesive layer may be from 3 탆 to 5 탆.

The deposition layer may include at least one of tin (Sn) and indium (In).

The deposition layer may be formed in an island shape.

The deposition layer may be formed by a sputtering method.

The thickness of the deposition layer may be from 30 탆 to 80 탆.

And a third deposition primer layer formed between the first printing layer and the deposition layer.

And a release layer formed between the substrate layer and the hard coat layer.

The releasing layer is composed of an epoxy resin, an epoxy-melamine resin, an aminoalkyd resin, an acrylic resin, a melamine resin, a silicone resin, a fluorine resin, a cellulose resin, a urea resin, a polyolefin resin and a paraffin resin And the like.

The thickness of the release layer may be from 2 탆 to 7 탆.

The hard coating layer may have a thickness of 4 탆 to 8 탆.

The transfer film having excellent thermal stability according to the present invention has an excellent thermal stability to prevent the deformation of the deposition layer without separately applying an expensive deposition primer layer to the lower part of the deposition layer.

Including the block type curing agent in the adhesive layer also has the effect of improving moisture resistance of the adhesive layer and preventing discoloration.

1 schematically shows a transfer film according to a first embodiment of the present invention.
2 schematically shows a transfer film according to a second embodiment of the present invention.
3 schematically shows a transfer film according to a third embodiment of the present invention.

The inventors of the present invention confirmed that it is possible to prevent the deformation of the deposition layer without applying an expensive deposition primer layer to the lower part of the deposition layer while studying the transfer film having excellent thermal stability.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art to which the present invention pertains. The present invention may be embodied in many different forms and is not limited to the embodiments described herein.

In order to clearly illustrate the present invention, parts not related to the description are omitted, and the same or similar components are denoted by the same reference numerals throughout the specification.

In the drawings, the thickness is enlarged to clearly represent the layers and regions. In the drawings, for the convenience of explanation, the thicknesses of some layers and regions are exaggerated.

Hereinafter, formation of an arbitrary structure in the "upper (or lower)" of the description means not only that an arbitrary structure is formed in contact with the upper surface (or lower surface) of the substrate, It is to be understood that the invention is not to be limited to the specific embodiments thereof.

The present invention relates to a substrate layer; A hard coat layer formed under the substrate layer; A first printing layer formed under the hard coating layer; A deposition layer formed under the first printing layer; A second printing layer formed under the deposition layer; And an adhesive layer formed on a lower portion of the second printed layer.

1 schematically shows a transfer film according to a first embodiment of the present invention.

1, the transfer film 100b according to the first embodiment of the present invention includes a base layer 110, a hard coat layer 130, a first print layer 150a, a deposition layer 160, 2 printing layer 150b and an adhesive layer 170. [

2 schematically shows a transfer film according to a second embodiment of the present invention.

2, in the case of the transfer film 100c according to the second embodiment of the present invention, the substrate layer 110, the hard coat layer 130, the first printed layer 150a, the deposition layer 160, The second printing layer 150b and the adhesive layer 170 are the same as those shown in FIG. 1 except that the first deposition primer layer 140a, the second deposition primer layer 140b and the third deposition primer layer 140c .

3 schematically shows a transfer film according to a third embodiment of the present invention.

3, in the case of the transfer film 100d according to the third embodiment of the present invention, the base layer 110, the hard coat layer 130, the first primer layer 140a, the first print layer 150a The deposition primer layer 140c, the deposition layer 160, the second printing layer 150b, the second primer layer 140b and the adhesive layer 170 are the same as those shown in FIG. 2, Is formed.

The transfer films 100b, 100c, and 100d,

The transfer film 100 is applied to a transfer method by an in-mold injection process or an injection process, and can be applied as a decorative material for various home appliances or electronic products such as a mobile phone or a notebook computer, or as an exterior material for various interior construction materials.

The substrate layer (110)

The base layer 110 may be formed of a resin such as a polypropylene resin, a polyethylene resin, a polyamide resin, a polyester resin, a polyacrylic resin, a polyvinyl chloride resin, an acrylic resin, a polycarbonate resin, Resin, or the like, but is not limited thereto.

Hard coating layer (130)

The hard coat layer 130 is formed under the base layer 110 for the purpose of preventing scratches on the first print layer 150a. That is, the hard coat layer 130 is a material used as a surface layer of an injection molded article, and can be used without any restriction so as to have excellent durability, abrasion resistance, scratch resistance, and appropriate hardness so as not to be deformed during the manufacturing process.

The hard coat layer 130 may be formed using an acrylic resin, a urethane resin, an epoxy resin, a siloxane resin, or the like, or may be formed using an ultraviolet curable resin such as an oligomer. In addition, the hard coating layer 130 may further include a silica-based filler to improve the strength.

The thickness of the hard coat layer 130 is preferably 4 탆 to 8 탆, but is not limited thereto. When the thickness of the hard coat layer 130 is less than 4 mu m, the effect of preventing scratches may be insufficient. When the thickness of the hard coat layer 130 is more than 8 mu m, cracks and cracks The occurrence of brittle flour can cause problems with injection failure.

The first printing layer (150a) and The second printing layer (150b)

The first print layer 150a has the same or different patterns and is used for imparting a decoration effect to a photo pattern, a pattern, various colors, various patterns, etc. in a desired form freely. The hard coat layer 130 As shown in Fig.

The first printed layer 150a may include at least one selected from the group consisting of an acrylic resin, a melamine resin, and a polyamide resin, and may further include various dyes and pigments. The first printed layer 150a may be formed by printing a pattern on the upper surface by a method such as transfer printing, gravure printing, screen printing, offset printing, rotary printing, flexo printing, inkjet printing, etc., It plays a role.

The second printed layer 150b is formed on the lower part of the deposition layer 160, so that various patterns and colors can be realized.

The second printed layer 150b may include a urethane resin, and may further include various dyes and pigments. In particular, the urethane-based resin may be produced by the reaction of a urethane-based prepolymer and a chain extender. The chain extender has an effect of increasing the molecular weight of the urethane-based resin, thereby improving the elongation and adhesion of the second printed layer 150b. The chain extender preferably has 2 to 12 carbon atoms, but is not limited thereto. At this time, when the carbon number of the chain extender is 13 or more, entanglement occurs and softness is remarkably reduced.

Accordingly, the second printed layer 150b can solve the problem of breaking the existing transfer film 100 during molding, and can improve the heat resistance performance.

That is, the second printing layer 150b has an excellent thermal stability to prevent deformation of the deposition layer 160 without separately applying an expensive deposition primer layer to the lower portion of the deposition layer 160 .

The second printed layer 150b is formed by printing a pattern on the upper surface by a method such as transfer printing, gravure printing, screen printing, offset printing, rotary printing, flexo printing, inkjet printing, etc., It plays a role.

The thickness of the first print layer 150a or the second print layer 150b is preferably 0.5 탆 to 3 탆, but is not limited thereto. If the thickness of the first print layer 150a or the second print layer 150b is less than 0.5 占 퐉, printing may be difficult. If the thickness of the first print layer 150a or the second print layer 150b is less than 3 If it exceeds 탆, the cost of sheet production is increased.

Deposition layer (160)

The deposition layer 160 includes a metal material for luminescing metal, and is formed under the first print layer 150a.

Aluminum, nickel, copper, gold, platinum, silver, chromium, iron, titanium and the like were used as the metal material used in the conventional deposition layer.

However, in the present invention, since the deposition layer 160 must have a nonconductive property in addition to the metal luster, the deposition layer 160 may include at least one of tin (Sn) and indium (In).

The deposition layer 160 may be formed by a sputtering method or may be an island.

When depositing tin (Sn) or indium (In) by a sputtering method, unlike other metals, the deposited particles can be formed in the form of islands on the surface. At this time, when the deposition layer 160 is deposited in the form of a surface island, a gap is formed between the islands and the island. As a result, the deposition layer 160 becomes nonconductive and can transmit radio waves.

At this time, the deposition layer 160 is preferably formed to a thickness of 30 탆 to 80 탆. If the thickness of the deposition layer 160 is less than 30 탆, the sheet resistance may decrease. If the thickness of the deposition layer 160 exceeds 80 탆, the surface island structure may decrease, have.

The adhesive layer 170,

The adhesive layer 170 serves to adhere the transfer film 100 to the molded article and is formed below the second printed layer 150b.

The adhesive layer 170 is preferably formed using an adhesive resin such as a urethane resin, an ester resin, an amide resin, an acrylic resin, and an epoxy resin, but is not limited thereto.

The adhesive layer 170 may be formed by coating an adhesive resin composition containing 15 to 50 parts by weight of the adhesive resin (solid content) and 50 to 85 parts by weight of the organic solvent with respect to 100 parts by weight of the adhesive resin composition as a whole. Here, the organic solvent may include, but is not limited to, methyl ethyl ketone, methyl butyl ketone, toluene, xylene, isopropyl alcohol, ethyl acetate, and the like.

In addition, the adhesive layer 170 may include a block type curing agent. The adhesive layer 170 includes a block type curing agent, thereby improving moisture resistance of the vapor deposition layer 160 and preventing discoloration. In this case, the block type curing agent is melted and surrounded by the adhesive resin. The block type curing agent is decomposed and disassociated at a temperature of about 140 to 180 ° C, and the dissociated block type curing agent Reacts with the -OH group to increase the bonding strength and brings about the liquid-type effect, thereby improving the moisture resistance and heat resistance.

The block type curing agent may be an isocyanate-based resin. As the isocyanate resin, for example, hexamethylene diisocyanate (HMDI), toluene diisocyanate (TDI), diphenylmethane diisocyanate (MDI) and isophorone diisocyanate (IPDI) can be used. At this time, the isocyanate-based resin may be included in an amount of 0 to 5 parts by weight, more specifically 0.1 to 2 parts by weight, based on 100 parts by weight of the total adhesive resin composition.

The adhesive layer 170 may be formed by one or more methods selected from the group consisting of gravure printing, flexographic printing, microgravure coating, comma coating and roll coating. And then curing it at a predetermined temperature.

The thickness of the adhesive layer 170 is preferably 3 탆 to 5 탆, but is not limited thereto. At this time, if the thickness of the adhesive layer 170 is less than 3 mu m, the adhesive performance may be insufficient. Further, when the thickness of the adhesive layer 170 is more than 5 mu m, there is no further adherence effect, and the amount of the adhesive can be increased only.

First deposition Primer layer (140a), a second deposition Primer layer (140b) and third deposition Primer layer (140c)

A first deposition primer layer 140a formed between the hard coating layer 130 and the first printed layer 150a; And a second deposition primer layer 140b formed between the second printing layer 150b and the adhesive layer 170. [

And a third deposition primer layer 140c formed between the first printing layer 150a and the deposition layer 160. [

The first deposition primer layer 140a, the second deposition primer layer 140b, and the third deposition primer layer 140c may increase interlayer adhesion in the transfer film 100c.

The first deposition primer layer 140a or the third deposition primer layer 140c may include an acrylic resin.

The second deposition primer layer 140b may include a urethane-based resin, and may further include an isocyanate trimer (Trimer Isocyanate). In particular, the urethane-based resin may be produced by the reaction of a urethane-based prepolymer and a chain extender. The chain extender has an effect of increasing the molecular weight of the urethane resin, thereby improving the elongation and adhesion of the second deposition primer layer 140b. The chain extender preferably has 2 to 12 carbon atoms, but is not limited thereto. At this time, when the carbon number of the chain extender is 13 or more, entanglement occurs and softness is remarkably reduced.

Accordingly, the second evaporation primer layer 140b can solve the problem of breaking the existing transfer film during molding, and can improve the heat resistance performance.

That is, since the second deposition primer layer 140b prevents the deposition layer 160 from being deformed without separately applying an expensive deposition primer layer to the lower portion of the deposition layer 160, have.

Heterogeneous layer (120)

The release layer 120 is formed for releasing the base layer 110 after attaching the transfer film 100 to the molded product.

And a release layer 120 formed between the base layer 110 and the hard coat layer 130. [

The release layer 120 may be formed of an epoxy resin, an epoxy-melamine resin, an aminoalkyd resin, an acrylic resin, a melamine resin, a silicone resin, a fluorine resin, a cellulose resin, a urea resin, a polyolefin resin, Or the like, but is not limited thereto.

The release layer 120 may be formed by one or more methods selected from the group consisting of gravure printing, flexographic printing, microgravure coating, comma coating, and roll coating.

The thickness of the release layer 120 is preferably 2 탆 to 7 탆, but is not limited thereto. At this time, if the thickness of the release layer 120 is less than 2 mu m, it may be too thin to realize a three-dimensional texture in the print layer 140. On the other hand, if the thickness of the release layer 120 exceeds 7 mu m There is a problem in that the release of the releasing agent causes detachment upon injection due to a change with time due to uncured.

Hereinafter, preferred embodiments of the present invention will be described in order to facilitate understanding of the present invention. However, the following examples are provided only for the purpose of easier understanding of the present invention, and the present invention is not limited by the following examples.

[ Example ]

Example  One

A melamine resin composition was coated on a PET film having a thickness of 38 mu m to a thickness of about 3 mu m by a microgravure coating method to form a release layer. Subsequently, an acrylic resin composition was applied to the release layer at a thickness of about 6 탆 by a micro gravure coating method and then heated at 120 캜 for 40 seconds to form a hard coating layer containing an acrylic resin, Respectively. Subsequently, a deposition primer containing an acrylic resin was laminated to a thickness of 2 mu m to form a first deposition primer layer. A first printing layer having a thickness of about 1.5 탆 containing an acrylic resin was formed on the first deposition primer layer by a microgravure coating method and then a vapor deposition primer containing an acrylic resin was laminated to a thickness of 2 탆 to form a third deposition primer layer . Sn was deposited on the third deposition primer layer thus formed to form a vapor deposition layer having a thickness of about 50 mu m, and then a second printing layer having a thickness of about 1.5 mu m containing a urethane-based resin was formed by a microgravure coating method. Subsequently, a deposition primer containing a urethane-based resin was laminated to a thickness of 2 탆 to form a second deposition primer layer, and then an adhesive layer containing a urethane resin and a block type isocyanate resin having a thickness of about 4 탆 was formed, .

Comparative Example  One

An in-mold transfer film was produced in the same manner as in Example 1, except that a soft adhesive layer was formed.

Comparative Example  2

An in-mold transfer film was produced in the same manner as in Example 1, except that a hard adhesive layer was formed.

Experimental Example : Evaluation of Moldability and Wettability

Moldability and moisture resistance discoloration of the in-mold transfer film produced according to Example 1 and Comparative Examples 1 and 2 were visually observed, and the results are shown in Table 1 below.

division Formability Fog Example 1 good none Comparative Example 1 good Has a little Comparative Example 2 Not good none

As shown in Table 1, it was confirmed that the in-mold transfer film produced according to Example 1 had good moldability and excellent thermal stability, and that no humidity-resistant discoloration occurred.

On the other hand, in the case of Comparative Example 1, the moldability was good, but there was a problem that the moisture resistance was slightly discolored, and the soft adhesive layer for securing the moldability could not prevent the water movement, It was confirmed that the vapor deposition layer was affected and the moisture resistance discoloration occurred. In the case of Comparative Example 2, no discoloration of moisture was observed, but it was confirmed that moldability was poor. It was confirmed that the hard adhesive layer for preventing the moisture-resistant discoloration had a bad influence on the moldability.

It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

100: Transfer film
110: base layer 120: release layer
130: hard coat layer 140a: first deposition primer layer
140b: second deposition primer layer 140c: third deposition primer layer
150a: first printing layer 150b: second printing layer
160: Deposition layer 170: Adhesive layer

Claims (19)

A base layer;
A hard coat layer formed under the substrate layer;
A first printing layer formed under the hard coating layer;
A deposition layer formed under the first printing layer;
A second printing layer formed directly below the deposition layer;
An adhesive layer formed under the second printing layer;
A first deposition primer layer formed between the hard coating layer and the first printing layer; And
And a second deposition primer layer formed between the second printing layer and the adhesive layer and different in component from the first deposition primer layer,
Wherein the first deposition primer layer comprises an acrylic resin,
Wherein the second printing layer, the second deposition primer layer, and the adhesive layer comprise a urethane-based resin,
Wherein at least one of the second deposition primer layer and the adhesive layer further comprises an isocyanate resin,
The urethane-based resin is produced by the reaction of a urethane-based prepolymer and a chain extender,
Wherein the chain extender has a carbon number of 2 to 12,
Transcriptional film with excellent thermal stability.
delete delete The method according to claim 1,
The thickness of the first printing layer or the second printing layer is preferably from 0.5 mu m to 3 mu m
Transcriptional film with excellent thermal stability.
delete delete delete delete delete The method according to claim 1,
The adhesive layer is formed by at least one method selected from the group consisting of gravure printing, flexographic printing, microgravure coating, comma coating and roll coating
Transcriptional film with excellent thermal stability.
The method according to claim 1,
The thickness of the adhesive layer is preferably from 3 탆 to 5 탆
Transcriptional film with excellent thermal stability.
The method according to claim 1,
Wherein the deposition layer comprises at least one of tin (Sn) and indium (In)
Transcriptional film with excellent thermal stability.
The method according to claim 1,
The deposition layer is formed in an island shape
Transcriptional film with excellent thermal stability.
The method according to claim 1,
The deposition layer is formed by a sputtering method
Transcriptional film with excellent thermal stability.
The method according to claim 1,
The thickness of the deposition layer is preferably from 30 탆 to 80 탆
Transcriptional film with excellent thermal stability.
The method according to claim 1,
And a third deposited primer layer formed between the first printed layer and the deposited layer
Transcriptional film with excellent thermal stability.
The method according to claim 1,
And a release layer formed between the substrate layer and the hard coat layer
Transcriptional film with excellent thermal stability.
18. The method of claim 17,
The thickness of the release layer is preferably from 2 탆 to 7 탆
Transcriptional film with excellent thermal stability.
The method according to claim 1,
The thickness of the hard coat layer is preferably from 4 탆 to 8 탆
Transcriptional film with excellent thermal stability.

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