KR101282461B1 - In-mold Transfer Film For Injection Molding - Google Patents

In-mold Transfer Film For Injection Molding Download PDF

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Publication number
KR101282461B1
KR101282461B1 KR1020090126168A KR20090126168A KR101282461B1 KR 101282461 B1 KR101282461 B1 KR 101282461B1 KR 1020090126168 A KR1020090126168 A KR 1020090126168A KR 20090126168 A KR20090126168 A KR 20090126168A KR 101282461 B1 KR101282461 B1 KR 101282461B1
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KR
South Korea
Prior art keywords
layer
injection molding
hard coating
under
film
Prior art date
Application number
KR1020090126168A
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Korean (ko)
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KR20110069436A (en
Inventor
이강엽
이승훈
한상희
함영주
Original Assignee
(주)엘지하우시스
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Priority to KR1020090126168A priority Critical patent/KR101282461B1/en
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Abstract

The present invention relates to an in-mold injection molding film, and more particularly, to an in-mold injection molding film including a hard coating layer, a printing layer, and an adhesive layer, The hard coating layer relates to a molded film for in-mold injection molding, characterized in that the mixture of a radiation-curable resin and a thermosetting resin.
According to the present invention, a hard coating layer including a mixture of a radiation-curable resin and a thermosetting resin is included in a hard coating layer of an in-mold injection molding molding film, and thus the elongation at the time of manufacture is improved, so that a hard coating layer is deep even when the curved surface of the molded article is deep. There is an effect of providing a molded film excellent in the physical properties required for the injection molding such as surface hardness is not broken or peeled off.
Molded film, In-mold, Injection molding, Radiation hardening, Elongation, Hard coating

Description

Molded Film for In-Mold Injection Molding {I-Mold

The present invention relates to an in-mold injection molding film, and more particularly, to an in-mold injection molding film including a hard coating layer, a printing layer, and an adhesive layer, The hard coating layer relates to a molded film for in-mold injection molding, characterized in that the mixture of a radiation-curable resin and a thermosetting resin.

Due to the information and communication revolution, the world is progressing differently every day, and in particular, various electric and electronic products that can provide various conveniences are continuously generated, and in particular, the consumption of information and communication products such as mobile phones and laptops is increasing. In addition, the use of PDA, navigation, etc. are frequently used, miniaturized and advanced, and the demand is increasing rapidly. Recently, the aesthetics of the exterior as well as the performance of the electronic products are very important, and various attempts have been made on the exterior color and design.

As a post-processing method for the exterior design of the conventional electronic products, it was common to spray spray on the exterior surface or to plate a part of the exterior case after injection molding, which causes a problem that harmful substances are discharged during processing. Therefore, a method of forming various colors and printed patterns on the exterior surface of electronic products using an in-mold film has been used.

However, in the case of using an in-mold film, since only the radiation-curing is performed during the first curing immediately after the coating of the hard coating layer, there is a problem of cracking or peeling of the hard coating layer due to the lack of elongation of the injection molded hard coating layer having a deep curved surface. When molding a notebook or a mobile phone, there are technical limitations in the injection molding transfer of a molded product having a deep curved surface, and when only the thermosetting mold is used, there is a difficulty in preparing a composition according to the required physical properties of the molded product.

In order to solve the problems of the prior art as described above, the present invention includes a mixture of a radiation-curable resin and a thermosetting resin in the hard coating layer of the in-mold injection molding molding film, the elongation at the time of manufacture is improved molded articles It is an object of the present invention to provide an in-mold injection molding film having excellent physical properties required for injection molding such as surface hardness, even when the curved surface depth of the hard coating layer is not broken or peeled off.

These and other objects of the present invention can be achieved by the present invention described below.

In order to achieve the above object, the present invention is a molded film for forming an in-mold injection molding comprising a hard coating layer, a printing layer and an adhesive layer, the radiation-curable resin and the hard coating layer of the molded film It provides a molded film for in-mold injection molding containing a mixture of thermosetting resin.

According to the present invention, the in-mold injection molding film includes an in-mold injection molding film including a hard coating layer, a printing layer, and an adhesive layer, wherein the hard coating layer is radiation-curable. Made of a mixture of resin and thermosetting resin, the elongation is improved, so that even if the curved surface of the molded product is deep, the hard coating layer is not broken or peeled off, and the in-mold yarn having excellent physical properties required for injection molding such as surface hardness is It brings the effect of providing a molded film for extrusion molding.

Hereinafter, the present invention will be described in detail.

In-mold injection molding molded film of the present invention is an in-mold injection molding film comprising a hard coating layer, a printing layer and an adhesive layer, wherein the hard coating layer is a radiation-curable resin and It consists of a mixture of thermosetting resins.

An example of an in-mold injection molding molded film (hereinafter referred to as a molded film) of the present invention is schematically illustrated in FIG. 1.

The molding film 100 of FIG. 1 has a release layer 20, a hard coating layer 30, a primer layer 40, a printing layer 50, a metal effect layer 60, and an adhesive layer under the base layer 10. 70) consists of a structure provided in turn.

The substrate layer 10 is a layer used as a substrate for forming a pattern, and uses at least one member selected from the group consisting of polyethylene terephthalate, polycarbonate, polyvinyl alcohol, and the like.

The release layer 20 is a layer for separating the base layer 10 from the hard coating layer 30 after injection molding of the molding film is completed, is formed under the base layer 10.

The hard coating layer 30 is formed below the release layer 20, and comprises 70 to 100% by weight of the radiation-curable resin and 0 to 30% by weight of the thermosetting resin, more specifically, the radiation-curing resin 70 ~ 99 wt%, 1 to 30 wt% of the thermosetting resin.

When using the above content, the elongation is improved compared to the radiation-curable resin alone, even if the curvature depth of the molded article is not broken or peeled off, it is excellent in that it can satisfy the surface hardness properties required for the injection molding at the same time.

The radiation curable resins include those containing photoinitiators and additives in at least one oligomer selected from acrylate oligomers, urethane acrylate oligomers, and epoxy acrylate oligomers. The photoinitiator and additives are used in the art and do not particularly limit the components.

The thermosetting resin is used in which a curing agent or the like is contained in at least one polyol having two or more alcohol groups selected from acrylate, urethane acrylate, epoxy acrylate and amine-based modified acrylate. It is preferable to use isocyanate etc. for the said hardening | curing agent.

The hard coating layer 30 is dried on the base layer 10 by coating such as gravure coating, micro gravure coating, roll coating, dip coating and spray coating.

Radiation curing of the hard coating layer 30 is carried out under a condition of 10 ~ 150 mJ (cm 2), more preferably 20 ~ 70 mJ (cm 2) of radiation dose using a high pressure mercury and metal halide lamp, within this range Has the effect of primary partial curing.

In addition, the radiation of the hard coating layer 30 is cured with a radiation of 200 ~ 450 nm wavelength, more preferably 350 ~ 400 nm wavelength, there is an optimum light amount control effect for partial curing when curing at a wavelength within this range.

Thermal curing of the hard coating layer 30 is carried out in the aging room for 1 ~ 72 hours 40 ~ 70 ℃ after drying the coating to form a hard coating layer, under the time and temperature conditions excellent curing properties.

The hard coating layer 30 may further include a photoinitiator, a colorant, a slip agent, an antifoaming agent, a leveling agent, a quencher, and the like used in the ultraviolet curable resin.

The hard coating layer 30 has a thickness of 1 to 10 μm, more preferably 3 to 7 μm, but the hard coating layer within the thickness range is excellent in strength and curability.

The primer layer 40 is formed under the hard coating layer 30 and serves to improve adhesion between the hard coating layer and the ink layer coated behind.

The print layer 50 is a layer formed under the primer layer to implement colors and pictures, and may be a non-curable or thermosetting ink or a transparent coating agent.

The metal effect layer 60 is formed under the print layer 50 to provide a metal effect.

The adhesive layer 70 is formed under the metal effect layer 60 to improve the adhesion of the molded film of the present invention to the injection molding or metal plate of the synthetic resin product.

The method of laminating the molded film is not particularly limited to a method used in the art.

Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to the following Examples.

[Example]

Example  One

Polyethylene terephthalate film was used as the base material layer 10, and in order to form the release layer 20, a release layer composition containing silicon was applied to the lower part of the base material layer 10 by a gravure method and dried at 150 ° C. It was. And in order to form the hard coating layer 30, the hard coating layer composition comprising 80% by weight of the urethane acrylate oligomer resin, a radiation-curable resin, 20% by weight of the thermosetting resin acrylate polyol resin below the release layer (20) Prepared and coated by a comma coating method, radiation cured at a radiation dose of 50 mJ (cm 2), wavelength 375 nm, and after the coating was thermally cured for 48 hours at 50 ℃ in the aging room, the thickness of the hard coat layer was 7 It was μm.

The primer layer 40 made of acryl-based under the hard coating layer 30, the printing layer 50 formed by printing with gravure, the metal effect layer 60 coated with gravure and the adhesive layer 70 made of urethane acrylic A molded film was prepared.

Example  2

Except for using the epoxy acrylate oligomer resin as a radiation-curable resin was carried out in the same manner as in Example 1 to prepare a molded film.

Comparative Example 1

When forming the hard coating layer was carried out in the same manner as in Example 1 without using a radiation-curable resin to prepare a molded film.

Comparative example  2

When forming the hard coating layer was carried out in the same manner as in Example 1 without using a thermosetting resin to prepare a molded film.

Test Example

Using the molded films of Examples 1 and 2 and Comparative Examples 1 and 2, various physical properties, surface hardness, heat resistance during injection molding, normal moldable R value boiling resistance, and thermal shock test were measured and The results are shown in Table 1 below.

1) R value during normal molding: It was performed by injection molding machine.

2) Surface hardness (pencil hardness): carried out by a pencil hardness tester.

3) Heat resistance during molding: It was carried out by injection molding machine.

4) Boiling resistance: It was carried out by boiling water.

5) Thermal shock test: It was performed by a thermo-hygrostat.

division Example 1 Example 2 Comparative Example 1 Comparative Example 2 R value at normal molding
(R value, mm)
2 to 3 4 2 8
Surface hardness
(Pencil hardness)
H 2H B H
Heat resistance during molding
(Heat resistance temperature ℃)
260 265 240 280
Boiling resistance
(100 ° C, 5 minutes)
Appearance change
none
Same as left Same as left Same as left
Thermal shock test
(-40 ℃, 85 ℃ for 2 hours each)
Appearance change
none
Same as left Gloss change
has exist
Appearance change
none

As shown in Table 1, the in-mold injection molding molding film of the present invention (Examples 1 to 2) is superior to Comparative Examples (1 to 2), and at the same time satisfying the surface hardness It was confirmed that the cracking problem was improved (the R value was improved).

1 is a cross-sectional view schematically showing a molded film of the present invention.

* Description of Major Symbols in Drawings *

10: base material layer 20: release layer

30: hard coating layer 40: primer layer

50: printed layer 60: metal effect layer

70: adhesive layer 100: molded film

200: injection molded product

Claims (6)

  1. Base layer,
    A release layer formed by applying a composition containing silicon under the substrate layer by a gravure method,
    A hard coating layer formed by coating a composition comprising a radioactive curable resin and a thermosetting resin under the release layer by a comma coating method,
    A primer layer formed under the hard coating layer,
    A printing layer formed under the primer layer,
    A metal effect layer formed under the printed layer,
    In-mold injection molding molding film comprising an adhesive layer formed under the metal effect layer.
  2. The method of claim 1,
    The hard coating layer, in-mold injection molding molded film, characterized in that formed of a mixture consisting of 70 to 100% by weight of the radiation-curable resin and 0 to 30% by weight of the thermosetting resin.
  3. The method of claim 1,
    The radiation-curable resin is a molded film for in-mold injection molding, characterized in that the photoinitiator and additives are contained in at least one oligomer selected from an acrylate oligomer, urethane acrylate oligomer, epoxy acrylate oligomer.
  4. The method of claim 1,
    The thermosetting resin is an in-mold injection, characterized in that the curing agent is contained in at least one polyol having at least two alcohol groups selected from acrylates, urethane acrylates, epoxy acrylates and amine-based modified acrylates. Molded film for molding.
  5. An injection molded article to which the in-mold injection molding film according to any one of claims 1 to 4 is applied.
  6. Base layer,
    Forming a release layer by applying a composition containing silicon under the substrate layer by a gravure method,
    Forming a hard coat layer by applying a composition comprising a radioactive curable resin and a thermosetting resin to the lower part of the release layer by a comma coating method, followed by radiation curing and thermal curing or thermosetting;
    Forming a primer layer under the hard coating layer;
    Forming a printing layer under the primer layer,
    Forming a metal effect layer under the printed layer; and
    Method for producing a molded film for injection molding (In-mold) comprising the step of forming an adhesive layer under the metal effect layer.
KR1020090126168A 2009-12-17 2009-12-17 In-mold Transfer Film For Injection Molding KR101282461B1 (en)

Priority Applications (1)

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KR1020090126168A KR101282461B1 (en) 2009-12-17 2009-12-17 In-mold Transfer Film For Injection Molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090126168A KR101282461B1 (en) 2009-12-17 2009-12-17 In-mold Transfer Film For Injection Molding

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KR101282461B1 true KR101282461B1 (en) 2013-07-04

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101426129B1 (en) 2012-01-11 2014-08-05 (주)엘지하우시스 Hard-coating composition and decoration film including thereof with improving yellowing
KR101332533B1 (en) * 2012-02-06 2013-11-22 주식회사 윌리언스 Insert injection molding mehtod using inmold decoration film
KR20130106012A (en) * 2012-03-19 2013-09-27 (주)엘지하우시스 In-mold transcription film and method for fabricating the same
KR101404235B1 (en) * 2012-03-30 2014-06-05 (주)엘지하우시스 In-mold transcription film and method for fabricating the same
CN104582928B (en) * 2012-11-27 2017-02-22 松下知识产权经营株式会社 In-mold molding method, in-mold transfer film and manufacturing method therefor

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09240386A (en) * 1996-03-05 1997-09-16 Nissha Printing Co Ltd Imitated wooden pattern panel of resin for vehicle ornamentation
JPH11170784A (en) * 1997-12-05 1999-06-29 Dainippon Printing Co Ltd Transfer sheet
JP2001152027A (en) 1999-11-26 2001-06-05 Nippon Paint Co Ltd Radiation curable resin composition for transfer sheet, method of manufacturing transfer sheet and decorative laminated sheet using the same
KR20030069981A (en) * 2000-07-31 2003-08-27 피피지 인더스트리즈 오하이오 인코포레이티드 Dual cure coating compositions having improved scratch resistance, coated substrates and methods related thereto

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09240386A (en) * 1996-03-05 1997-09-16 Nissha Printing Co Ltd Imitated wooden pattern panel of resin for vehicle ornamentation
JPH11170784A (en) * 1997-12-05 1999-06-29 Dainippon Printing Co Ltd Transfer sheet
JP2001152027A (en) 1999-11-26 2001-06-05 Nippon Paint Co Ltd Radiation curable resin composition for transfer sheet, method of manufacturing transfer sheet and decorative laminated sheet using the same
KR20030069981A (en) * 2000-07-31 2003-08-27 피피지 인더스트리즈 오하이오 인코포레이티드 Dual cure coating compositions having improved scratch resistance, coated substrates and methods related thereto

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