KR101742386B1

KR101742386B1 - Conductive heat exchanger containing graphene

Info

Publication number: KR101742386B1
Application number: KR1020150135112A
Authority: KR
Inventors: 박봉식; 김동기
Original assignee: 강계수; 강민희; 박봉식; 김동기
Priority date: 2015-09-24
Filing date: 2015-09-24
Publication date: 2017-06-15
Also published as: KR20170036219A

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat exchanger, and more particularly, to a conductive heat exchanger containing graphene for improving the surface of a heat exchanger made of metal or non- will be.

Description

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The present invention relates to a heat exchanger, and more particularly, to a heat exchanger comprising graphene for improving the cooling efficiency while improving the thermal conductivity and stably releasing the high temperature heat to the outside for a short time, To a conductive heat exchanger.

Generally, a heat exchanger performs cooling or heating by exchanging heat between a fluid and a fluid or between a fluid and a gas with a conductor having a large thermal conductivity interposed therebetween. Generally, a cooler for cooling a fluid or a gas of a hot body A heater for heating a fluid or a gas of a low-temperature body, a condenser for liquefying the vapor by condensing the vapor, and an evaporator for evaporating the fluid on the low-temperature side.

Meanwhile, in the cooler of the heat exchanger, the coolant circulating along the coolant pipe is heat-exchanged with the outside air to allow the heat to be exchanged, thereby generating cool air.

In addition, electronic devices such as computers generally include components that generate heat, and air-cooled or gas and refrigerant cooling devices are used to cool the heat of the components that generate such heat.

However, the conventional cooling heat exchanger has a structure in which a large number of radiating fins are formed on the surface of the main pipe or the main body, so that it is possible to release heat through the radiating fin simply, and the heat radiating effect is limited.

Korean Patent Publication No. 2001-0000940. Korean Patent Application Registration No. 10-0350952.

SUMMARY OF THE INVENTION The present invention has been devised to solve the above problems, and it is an object of the present invention to provide a heat exchanger comprising a metal or a non-ferrous metal, The present invention has the object of providing a conductive heat exchanger.

In order to achieve the above object, there is provided a heat exchanger in which a plurality of heat dissipation fins are formed on a surface of a main body,

A heat conductive layer made of a thermally conductive material containing a graphene solution is further formed on the surfaces of the main body and the radiating fin,

The thermally-

The coating solution is composed of 0.1 to 5 wt% of a graphene solution, 25 to 30 wt% of a binder, 40 to 50 wt% of a flux powder, and 20 to 30 wt% of a solvent, based on 100 wt%

The heat conduction layer is constituted of a coating layer coated with a coating liquid made of a thermally conductive material on the surface of the body and the radiating fin,

The thermally-

The plating solution is composed of 0.1 to 5 wt% of a graphene solution, 30 to 40 wt% of Zn, 2 to 10 wt% of Mg, 0.5 to 8 wt% of Si and 40 to 50 wt% of Al,

The heat conduction layer can be achieved by forming a plated layer made of a thermally conductive material on the surface of the body and the heat dissipation fin by plating.

As described above, the conductive heat exchanger containing the graphene of the present invention has a coating or a plating formed on the surface of the main body of the heat exchanger and the surface of the heat dissipation fin containing graphene, which is highly thermally conductive, It is possible to obtain an effect of improving the heat dissipation effect due to the heat dissipation.

In addition, since the size of the heat exchanger can be reduced due to the improvement of the heat radiation effect, it is possible to reduce the cost due to the reduction of the facility.

1 is a sectional view of a conductive heat exchanger containing graphene according to a first embodiment of the present invention.
2 is a sectional view of a second embodiment of a conductive heat exchanger containing graphene of the present invention.
3 is a sectional view of a third embodiment of a conductive heat exchanger containing graphene of the present invention.
4 is a cross-sectional view of a fourth embodiment of a conductive heat exchanger containing graphene of the present invention.
5 is a cross-sectional view of a fourth embodiment of a conductive heat exchanger containing graphene of the present invention.

The terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary terms and the inventor may appropriately define the concept of the term in order to best describe its invention It should be construed as meaning and concept consistent with the technical idea of the present invention.

Therefore, the embodiments described in the present specification and the configurations shown in the drawings are merely the most preferred embodiments of the present invention, and not all of the technical ideas of the present invention are described. Therefore, It should be understood that various equivalents and modifications may be present.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a partial cross-sectional view of a conductive heat exchanger containing graphene of the present invention. FIG.

As shown in FIG. 1, the conductive heat exchanger 1 of the present invention includes a plurality of heat generating fins 20 formed on a surface of a main body 10,

The thermally conductive layer 100 may be formed by forming a thermally conductive material containing a graphene solution on the surfaces of the main body 10 and the radiating fins 20.

At this time, the heat conductive layer 100 is possible by various embodiments,

First, in the first embodiment,

The thermally conductive layer 100 may be composed of a coating layer 110. The thermally conductive material constituting the coating layer 110 may include 0.1 to 5% by weight of the graphene solution, 30 to 30 wt.% Of the powder, 40 to 50 wt.% Of the flux powder and 20 to 30 wt.% Of the solvent to obtain a coating solution. The coating solution thus obtained is coated on the surfaces of the main body 10 and the radiating fin 20.

The graphene solution was prepared by heating 50 ml of sulfuric acid (H2SO4) to 90 占 폚 using a hot water heater, adding 10 g of potassium persulfate (K2S2O8) and 10 g of phosphorus pentoxide, stirring the mixture until it was completely dissolved, The mixture was cooled to 80 DEG C, 12 g of graphite was added thereto, and the mixture was reacted for 4 to 5 hours. After heating was stopped, the mixture was diluted with 2 L of distilled water for 12 hours while stirring. The diluted solution was filtered through a nylon filter , The graphite is filtered out, and only the solution is extracted.

Thereafter, 2 L beakers were put in a thermostatic chamber at 0 ° C, 460 mL of sulfuric acid was put in a beaker, and pre-treated grains were placed in a beaker. The mixture was stirred in 60 g of potassium permanganate (KMnO 4) Then, the beaker was taken out and placed in a thermostatic chamber at 35 ° C. and stirred for 2 hours. While maintaining the temperature at 40 ° to 50 ° C. in a thermostatic chamber at 0 ° C., 920 mL of distilled water was divided into 20 to 30 mL and stirred for 2 hours. (H 2 O) and distilled water were mixed in a volume ratio of 1: 2, and the mixture was stirred for 3 hours. Then, hydrogen peroxide (H 2 O 2) Water is added to obtain a graphene solution corresponding to PH 5 to 7.

The binder is prepared by mixing a selected one of an alkoxide and colloidal silica or a mixture thereof.

The flux powder was selected from among K-Al-F, K-Zn-F and K-Si-F materials.

As the solvent, at least one of 2-propanol, 1-propanol, ethylene glycol, ethyl ether and the like is mixed and used.

Meanwhile, the binder, the flux powder, and the solvent used in the above may be a known material instead of the newly implemented material, and the present invention is preferably applied to the production of a coating solution using the graphene solution.

That is, since the heat generated in the heat exchanger 1 is discharged to the outside through the radiating fin 20, the thermal conductivity is improved through the coating layer 110 containing the graphene component having excellent thermal conductivity, Thereby improving the rate.

Further, in the second embodiment,

2, a plurality of filling grooves 40 may be further formed on the surfaces of the main body 10 and the radiating fins 20. In the filling grooves 40, graphene having a particle size of 200 to 300 mesh The coating layer 110 is formed on the surfaces of the main body 10 and the heat dissipation fin 20 by coating the coating solution so that the graphene powder 200 is covered.

Further, in the third embodiment,

3, a receiving space 50 may be further formed at the boundary between the main body 10 and the radiating fin 20. A graphene powder having a particle size of 200 to 300 mesh The coating layer 110 is formed on the surfaces of the main body 10 and the radiating fin 20 by coating the coating solution so that the graphene powder 200 is covered.

Further, in the fourth embodiment,

A plurality of filling grooves 40 are formed on the surfaces of the main body 10 and the radiating fins 20 as shown in Fig. 4 and a receiving space 50 is further formed at the boundary between the main body 10 and the radiating fins 20 A graphene powder 200 having a particle size of 200 to 300 mesh is filled in the filling groove 40 and the accommodation space 50. On the surfaces of the main body 10 and the radiating fin 20, The coating layer 110 is formed by coating the coating liquid so that the powder 200 is covered.

The graphenes filled in the filling grooves 40 and the accommodating space 50 as described above are materials in which carbon is hexagonal and connected to each other to form a honeycomb two-dimensional planar structure. It is thinner than 0.2 nm thick and has high transparency. It can deliver 100 times more current than copper at room temperature and 100 times faster than silicon at room temperature. In addition, the thermal conductivity is twice as high as the highest diamond. Although the mechanical strength is more than 200 times stronger than that of steel, it is stretchable and does not lose its electrical conductivity even if stretched or folded. In the present invention, graphene in the form of powder particles is applied.

That is, the heat generated inside the heat exchanger 1 is discharged to the outside through the radiating fin 20, and the graphene powder 200, which is filled in the filling groove 40 and the accommodation space 50 and is excellent in thermal conductivity, And at the same time, the thermal conductivity is improved through the coating layer 110 containing the graphene component, and the heat exchange rate is improved.

Further, in the fifth embodiment,

The thermally conductive layer 100 may be formed of a plated layer 120 as shown in Fig. 5. The thermally conductive material constituting the plated layer 120 may be 0.1 to 5 wt% of a graphene solution % Of Al, 30 to 40 wt% of Zn, 2 to 10 wt% of Mg, 0.5 to 8 wt% of Si, and 40 to 50 wt% of Al can be obtained. And is plated on the surfaces of the heat sink 10 and the heat radiating fins 20.

Thereafter, 2 L beakers were put in a thermostatic chamber at 0 ° C, 460 mL of sulfuric acid was put in a beaker, and pre-treated grains were placed in a beaker and stirred. To the beaker was added 60 g of potassium permanganate (KMnO 4) Then, the beaker was taken out and placed in a thermostatic chamber at 35 ° C. and stirred for 2 hours. While maintaining the temperature at 40 ° to 50 ° C. in a thermostatic chamber at 0 ° C., 920 mL of distilled water was divided into 20 to 30 mL and stirred for 2 hours. (H 2 O) and distilled water were mixed in a volume ratio of 1: 2, and the mixture was stirred for 3 hours. Then, hydrogen peroxide (H 2 O 2) Water is added to obtain a graphene solution corresponding to PH 5 to 7.

In addition, Zn dissolves preferentially to Fe, which is a refractory iron, to retard Fe corrosion. This is called sacrificial antimicrobiality, and the saccharophilic property is ensured at a content of Zn of 30% by weight or more based on the total weight of the composition.

Even if the Zn content exceeds 40% by weight, the sacrificial corrosion resistance gradually increases, but the degree is not so large, and the Al2O3 coating formed on the plating surface by the Al component can not be densely formed, so that the basic corrosion resistance of the Al- . If the content of Zn is more than 50 wt%, the increase of the specific gravity of the whole composition is insufficient for the cost.

Mg is an important element for improving corrosion resistance.

Mg further improves the original corrosion resistance of Al-Zn alloy-plated steel by coating the exposed surface of the plating layer with the corrosion product including Mg when the coated steel coated with the Al-Zn based alloy coating composition is exposed to the corrosive environment .

Mg in the plating layer is bonded to Si to form an intermetallic compound [Mg 2 Si phase]. The Mg2Si phase promotes stable corrosion product formation in the corrosive environment and is the source of the Mg component. As a result, the surface of the plated layer is quickly covered with a uniform corrosion product. This corrosion product acts as a stable protective film and improves the corrosion resistance of the plating layer.

At this time, Mg is required to be added in an amount of 2% by weight or more based on the total weight of the composition in order to secure distinctive corrosion resistance. However, since Mg has a strong oxidizing property, when it exceeds 10% by weight, the plating bath becomes saturated and the melting point becomes high, making it difficult to treat the plating bath. Then, an Mg oxide film is formed on the surface of the plating bath, and the surface of the plating is deteriorated.

Si is added to suppress the growth of the Fe-Al alloy layer formed on the substrate iron and the interface, and to improve the fluidity of the plating bath to impart gloss. When the production of the Fe-Al alloy layer is suppressed, the workability is improved.

A Mg2Si phase containing Mg is formed for the Si addition. This image is effective for improving the corrosion resistance of the front end face of the plating layer and the processed portion. Therefore, it is necessary to manufacture a metal structure in which the Mg2Si phase is mixed in the solidification structure of the plating layer by increasing the amount of Si added.

In order to obtain the effect of improving the corrosion resistance by the Mg2Si phase, the shape of the Mg2Si phase should be uniformly dispersed throughout the entire plating layer in a Chinese character shape or a polygonal shape having a size of less than 10 mu m. When the Mg2Si phase is a polygonal phase having a size of 10 mu m or more, the effect of improving the corrosion resistance is not large.

The above-mentioned effect can be expected if Si is added in an amount of 0.5% by weight or more based on the total weight of the composition. However, when it is added in an amount exceeding 8% by weight, needle-like Si needles precipitate in the plating layer, and the corrosion resistance and workability of the plating layer are remarkably lowered.

That is, since the heat generated in the heat exchanger 1 is discharged to the outside through the radiating fin 20, the thermal conductivity is improved through the plating layer 120 containing the graphene component having excellent thermal conductivity, Thereby improving the rate.

As described above, the conductive heat exchanger containing the graphene of the present invention improves the heat exchange rate between the inside and the outside of the heat exchanger by improving the thermal conductivity of the surface.

10: main body 20: radiating fin
40: filling groove 50: accommodation space
100: heat conduction layer 110: coating layer
120: plated layer 200: graphene powder

Claims

A heat exchanger in which a plurality of heat dissipation fins are formed on a surface of a main body to enable heat emission,
A heat conduction layer 100 made of a thermally conductive material containing a graphene solution is further formed on the surfaces of the main body 10 and the radiating fins 20,
The thermally-
The coating solution is composed of 0.1 to 5 wt% of a graphene solution, 25 to 30 wt% of a binder, 40 to 50 wt% of a flux powder, and 20 to 30 wt% of a solvent, based on 100 wt%
The heat conduction layer 100 includes a body 110 and a coating layer 110 coated on the surfaces of the heat dissipation fins 20 with a coating liquid made of a thermally conductive material,
The graphene solution,
10 ml of potassium persulfate (K2S2O8) and 10 g of phosphorus pentoxide were added to 50 ml of sulfuric acid (H2SO4) heated to 90 deg. C with a hot water bath,
The stirred mixture was cooled to 80 DEG C, 12 g of graphite was added thereto, and the mixture was reacted for 4 to 5 hours. Then, heating was stopped, and the mixture was diluted with 2 L of distilled water for 12 hours while stirring.
The diluted solution was filtered through a 0.2 mu m nylon mesh filter to extract the solution,
The extracted solution was put in a 2 ° C beaker in a thermostat at 0 ° C, 460 ml of sulfuric acid was put in a beaker, and the pretreated graphene was placed in a beaker,
60 g of potassium permanganate (KMnO 4) was added to the beaker and stirred until the mixture was completely dissolved. The beaker was taken out, placed in a thermostatic chamber at 35 ° C, stirred for 2 hours,
The mixture was further stirred in a constant temperature oven at 40 ° C to 50 ° C for 2 hours while 920 ml of distilled water was divided into 20 to 30 ml. The mixture was diluted with stirring for 3 hours,
A solution of hydrogen peroxide (H 2 O 2) in an amount of 20 to 30% by weight based on 100% by weight of diluted water and then adding water mixed with hydrogen chloride (HCl) and distilled water in a volume ratio of 1: Wherein the graphene-containing conductive heat exchanger comprises a graphene-containing solution.

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The method according to claim 1,
The binder,
An alkoxide, and a colloidal silica, or a mixture thereof,
The flux powder,
A K-Al-F system, a K-Zn-F system, and a K-Si-F system material,
The solvent,
Propanol, 2-propanol, 1-propanol, ethylene glycol, ethyl ether, and the like.

The method according to claim 1,
A plurality of filling grooves 40 are further formed on the surfaces of the main body 10 and the radiating fins 20,
The filling groove 40 is filled with a graphene powder 200 having a particle size of 200 to 300 mesh,
A coating layer (110) is formed by coating a surface of a body (10) and a radiating fin (20) with a thermally conductive material so that the graphene powder (200) filled in the filling groove (40) One conductive heat exchanger.

The method according to claim 1,
A receiving space 50 is further formed at a boundary between the main body 10 and the radiating fin 20,
The graphene powder 200 having a particle size of 200 to 300 mesh is filled in the accommodation space 50,
A coating layer (110) is formed by coating a thermally conductive material on the surfaces of the main body (10) and the radiating fin (20) so that the graphene powder (200) filled in the accommodating space (50) One conductive heat exchanger.

The method according to claim 1,
A plurality of filling grooves 40 are formed on the surfaces of the main body 10 and the radiating fins 20 and a receiving space 50 is further formed in a boundary portion between the main body 10 and the radiating fins 20,
The filling groove 40 and the accommodation space 50 are filled with the graphene powder 200 having a particle size of 200 to 300 mesh,
The coating layer 110 is formed by coating a thermally conductive material on the surface of the main body 10 and the radiating fin 20 so that the graphene powder 200 filled in the filling groove 40 and the accommodation space 50 is covered. &Lt; / RTI > wherein the graphene comprises a graphene.

The method according to claim 1,
The thermally-
The plating solution is composed of 0.1 to 5 wt% of a graphene solution, 30 to 40 wt% of Zn, 2 to 10 wt% of Mg, 0.5 to 8 wt% of Si and 40 to 50 wt% of Al,
The conductive heat exchanger according to any one of the preceding claims, wherein the heat conductive layer (100) comprises a plated layer (120) made of a thermally conductive material on a surface of the body (10) and the heat dissipation fin (20).

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