KR101736211B1 - Thin sheet for electric connecting terminal having improved soldering property - Google Patents

Abstract

The present invention relates to a thin sheet of a contact terminal for an antenna having a plating layer of a first surface satisfying corrosion resistance and wear resistance and a plating layer of a second surface having an excellent soldering property and a manufacturing method thereof. The present invention provides the method for manufacturing the thin sheet of the contact terminal for the antenna, comprising: a nickel plating layer forming step of supplying the thin sheet of the contact terminal for the antenna forming copper foil and a tin plating layer composed of tin or tin containing alloy on one side of the copper foil and forming a nickel plating layer on the first side of the copper foil by electrolytic plating; a gold plating layer forming step of forming a gold or gold alloy plating layer on the nickel plating layer by electrolytic plating; and a tin plating layer forming step of forming a tin or tin alloy plating layer on a second surface of the copper foil by using a plating solution containing tin by electrolytic plating.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact terminal thin film sheet for an antenna having excellent bonding properties with aluminum and an aluminum alloy,

The present invention relates to a thin film sheet for an antenna having a first surface plated layer satisfying corrosion resistance and abrasion resistance and a second surface plated layer excellent in bonding characteristics, and a method for manufacturing the same.

Along with the recent rapid development of communication devices, miniaturization, weight reduction, and high performance of devices have been achieved. Also, it is difficult to mount a plurality of antennas in a limited size of a terminal, and thus a broadband antenna technology capable of realizing multi-band with one antenna has been developed. In order to solve such a problem, the case of the terminal is implemented as a metal material, and then a technique of operating the metal case as an antenna has been developed.

As a method for connecting the metal case and the antenna circuit, a screw connection method has been used in the past, but a bonding method using a plated contact terminal is used due to the space utilization and the inconvenience of designing the external appearance. Plated contact terminals are mainly made of gold plating or gold plating on copper foil, nickel plated and gold plated. Efficiency is good for all frequencies and reflection loss due to contact part is small.

On the other hand, the metal case and the contact terminal are joined by welding. Laser welding is applied as a general welding method. However, such a laser welding method causes a change in the material of the metal case and the contact terminal, thereby causing the antenna performance to be degraded. Further, in order to perform the welding, the thickness of the contact terminal must be 100 mu m or more, which is disadvantageous in reducing the thickness of the terminal.

Another method for welding the metal case and the contact terminal is ultrasonic welding. The ultrasonic welding is a method in which two metals are brought into contact with each other and high-frequency vibration is applied parallel to the contact surface on one side thereof, Of the oxide layer is removed and the surface is heated and bonded. The ultrasonic welding can weld without deforming the material, and the thickness of the contact terminal can be lowered to 20 탆 or less, thereby reducing the thickness of the mobile phone. However, ultrasonic welding has a disadvantage in that the bonding force between the contact terminal and the metal case is weak because the welding area is small. Therefore, although the welding is performed by applying the adhesive coating of about 10 탆 thickness to the contact terminal and the bonding site, problems arise due to product defects and losses occurring in the welding process.

An object of the present invention is to provide a method for manufacturing and processing a thin film sheet for antenna having excellent corrosion resistance and wear resistance as a contact terminal and having excellent characteristics of bonding with aluminum and aluminum alloy.

In one aspect, the present invention provides a contact terminal thin film sheet for an antenna, comprising: a copper foil; and a tin plating layer made of tin or a tin-containing alloy on one surface of the copper foil.

The tin plating layer preferably has a thickness of 1 to 5 mu m.

The tin-containing alloy may be an alloy of tin and bismuth, or an alloy of tin, bismuth and indium.

The tin-containing alloy may be 40 to 80% by weight of tin, 20 to 60% by weight of bismuth, and 15% by weight or less of indium.

The copper foil includes a nickel plating layer on the other surface of the one surface on which the tin plating layer is formed and a gold plating layer of gold or gold alloy formed on the nickel plating layer.

It is preferable that the nickel plating layer has a thickness of 4 to 8 占 퐉 and the gold plating layer has a thickness of 0.05 to 0.2 占 퐉.

The gold alloy plating layer may be an alloy of gold and at least one of indium, cobalt and nickel.

The gold alloy plating layer preferably has a gold content of 99 wt% or more.

The copper foil may include a pressure-sensitive adhesive layer having a thickness of 0.1 to 5 탆 and made of an acrylic pressure-sensitive adhesive having a carboxyl group or an epoxy group on the tin plating layer.

Another aspect of the present invention provides a method of manufacturing a contact terminal thin film sheet for an antenna comprising the steps of forming a nickel plating layer on the first surface of a copper foil by electroplating to form a nickel plating layer on the nickel plating layer, A gold plating layer forming step of forming a gold plating layer of gold or gold alloy and a tin plating layer forming step of forming a plating layer of tin or tin alloy on the second surface of the copper foil by using a plating solution containing tin by electrolytic plating .

The plating solution containing the tin may be a tin-containing compound containing 5 to 100 g / l of tin ion concentration, 50 to 250 g / l of complexing agent and 0.01 to 20 g / l of surfactant.

The tin-containing compound may be at least one selected from the group consisting of tin sulfate, tin chloride, tin sulfamate, tin methosulfonate, and tin oxide.

The plating solution containing the tin may further contain a bismuth-containing compound having a bismuth ion concentration of 5 to 100 g / l and an indium-containing compound having a concentration of 20 g / l of indium ion.

The complexing agent may be at least one selected from the group consisting of citric acid, lactic acid, glyconic acid, methanesulfonic acid, tartaric acid, oxalic acid and malic acid.

The nickel plating layer forming step includes a step of forming a nickel plating layer containing nickel sulfide hydroxide having a nickel ion concentration of 50 to 100 g / l, nickel chloride having a concentration of 20 to 50 g / l and 20 to 50 g / l of boric acid, Is formed by electrolytic plating using a plating solution of phosphorus.

The step of forming the gold-plated layer includes 20 to 100 g / l of at least one selected from the group consisting of potassium cyanide 1 to 10 g / l, citric acid, sodium citrate and potassium citrate, at a temperature of 40-60 ° C, Or may be formed by electrolytic plating using a phosphorus plating solution.

The plating solution in the gold plating layer forming step may further include at least one metal selected from the group consisting of indium, cobalt, and nickel in an amount of 0.1 to 5 g / l in total.

The alkaline degreasing is carried out in an amount of 5 to 20 g / l of caustic soda, 20 to 40 g / l of sodium carbonate, 5 to 20 g / l of sodium tertiary phosphate, 5 to 10 g / l of sodium metasilicate And 1 to 5 g / l of a surfactant, wherein the sulfuric acid activation treatment is carried out by immersion in an aqueous sulfuric acid solution at a concentration of 5-10% by weight of sulfuric acid have.

And applying an acrylic pressure sensitive adhesive having a carboxyl group or an epoxy group on the tin plating layer to form a pressure sensitive adhesive layer having a thickness of 0.1 to 5 탆.

The contact terminal according to the present invention is excellent in corrosion resistance and abrasion resistance on the upper surface and has a plating layer excellent in electrical conductivity, so that loss due to contact is small.

The contact terminal according to the present invention is excellent in reliability due to welding by having a tin or tin-bismuth alloy plating or tin-bismuth indium alloy plating layer excellent in bonding properties with aluminum and an aluminum alloy on the lower surface.

1 is a cross-sectional view of a thin film sheet for a contact terminal according to an embodiment of the present invention.

An object of the present invention is to provide a contact terminal for an antenna which is provided with a multilayer plating process on both surfaces of a copper foil as a base material and which is excellent in corrosion resistance, wear resistance and bonding properties.

The contact terminal for an antenna provided by the present invention includes a multilayer plating layer on both sides of a copper foil. The copper foil may be an electrolytic copper foil, though not limited thereto. Although the thickness of the copper foil is not limited, it is possible to use a sheet having a thickness of 8 to 20 mu m so as to be suitable for miniaturization of the product and easy welding. In the case of less than 8 탆, there is a problem that it is not easy to handle such as cutting the product during handling or being easily damaged in the welding process. When it exceeds 20 탆, the thickness of the product becomes thick, Falls.

The copper foil is provided with a plating layer on both sides to improve the corrosion resistance and wear resistance of the copper foil. In this case, before forming the plating layer, degreasing may be performed using an alkaline degreasing solution to remove foreign matter adhering to the surface, if necessary.

The alkali degreasing solution may be a solution containing caustic soda, sodium carbonate, sodium tertiary phosphate, sodium metasilicate, and a surfactant.

The caustic soda is contained for maintaining the alkalinity of the degreasing liquid, and it is preferably contained in an amount of 5 to 20 g / l. If it is contained in an amount of less than 5 g / l, there is a problem that degreasing performance by consumption of alkaline ion is lowered, and when it exceeds 20 g / l, alkalinity becomes high and corrosion of the material occurs.

Meanwhile, the sodium carbonate serves as a degreasing agent through hydrolysis, and may be contained in an amount of 20 to 40 g / l. If the content of the soda carbonate is less than 20 g / l, there is a problem that the degreasing power is weak. When the content is more than 40 g / l, the alkalinity is increased and the material is corroded.

In addition, the tertiary phosphate serves as a surfactant and acts as a peptizer, and is preferably contained in an amount of 5 to 20 g / l. If the content of sodium tertiary phosphate is less than 5 g / l, the degreasing power is weak. If it exceeds 20 g / l, the alkalinity becomes high, which causes the material to corrode.

Further, the degreasing liquid may contain sodium metasilicate in an amount of 5 to 10 g / l. When the sodium metasilicate content is less than 5 g / l, the ability to inhibit corrosion is deteriorated. When the content of the sodium metasilicate is less than 10 g / l, There is a problem that stains are generated.

The degreasing liquid may contain 1 to 5 g / l of a surfactant. The surfactant is not particularly limited as long as it is usually used, and a cationic surfactant, an anionic surfactant, an amphoteric surfactant, and a nonionic surfactant can be applied to the present invention. When the surfactant is contained in an amount of less than 1 g / l, there is a problem that partial degreasing is not possible. When the surfactant is more than 5 g / l, foaming occurs frequently and washing is difficult.

Foreign matter adhering to the surface of the copper foil can be removed by immersing the copper foil sheet in the degreasing solution. At this time, the degreasing solution has a degreasing effect at a low temperature and takes a long degreasing time. When the temperature is high, the degreasing solution has a problem of frequent replenishment of water due to severe evaporation, . Although the degreasing time varies depending on the condition of the material, it is preferable to immerse the substrate for about 20 to 60 seconds.

After the copper foil is treated with the degreasing solution, the copper foil is washed to remove the degreasing solution on the surface of the copper foil, followed by activating the copper foil surface. In the activation treatment step, the oxidation layer present on the surface of the copper foil is removed to improve the plating ability on the surface of the copper foil. To this end, the copper foil is treated with sulfuric acid.

The sulfuric acid activating the copper foil preferably has a concentration of 5 to 10% by weight. If the concentration of the sulfuric acid is less than 5 wt%, there is a problem that the material is not sufficiently activated. If the concentration is more than 10 wt%, the material is corroded and damaged.

And then forming a nickel plating layer on the surface of the activated copper foil. The nickel plating layer may be formed by performing electrolytic nickel plating on the surface of the copper foil to plated with nickel metal, followed by washing with water, thereby improving the corrosion resistance and hardness of the copper foil.

The electrolytic nickel plating is a method of dissolving nickel sulfamate (50 to 100 g / l in terms of nickel metal), nickel chloride (20 to 50 g / l) in nickel sulfate as a supply and complexing agent, A plating solution containing boric acid of 20 to 50 g / l and a brightener may be used. At this time, it is preferable that the plating solution is maintained at a cathode current density of 1 to 10 A / dm ² at a pH of 3 to 5 and a temperature of 40 to 60 ° C.

The nickel plating is not particularly limited, and a watt bath or a sulfamic acid bath can be used, and more preferably, a sulfamic acid bath is more preferable in terms of plating rate and uniformity.

The nickel plating layer can be formed on the surface of the copper foil by the above-mentioned nickel electroplating. Thus, the nickel plating layer formed on the surface of the copper foil is preferably formed to a thickness of 4 to 8 탆. If the thickness is too thin, there is a problem that the strength and corrosion resistance of the product are inferior. If the thickness is too large, the cost is increased.

The contact terminal for an antenna of the present invention further comprises a gold plating layer on the nickel plating layer. The gold-plated layer is excellent in electrical conductivity and is not easily oxidized in the air, so that the change in electrical conductivity due to oxidation is small, and thus plays an important role in use as a contact point.

The gold plating layer may be a gold alloy plating layer further including a metal such as indium, cobalt, nickel or the like, if necessary. The above-mentioned gold alloy plating layer is preferably a hard gold alloy plating layer having a high hardness and excellent gloss and other properties as compared with pure gold, because it can improve wear resistance as a contact terminal.

The plating layer of the gold or gold alloy may be formed by immersing in an electrolytic acid gold plating solution to form a gold or gold alloy plating layer on the surface, followed by washing with water.

The gold plating may also be performed by electrolytic plating, and the gold plating amount includes gold potassium cyanide. The gold potassium cyanide is a source of gold ions and contains 1 to 10 g / l. When the potassium cyanide is contained in an amount of less than 1 g / l, there is a problem of precipitation efficiency, while in the case of exceeding 10 g / l, the cost is disadvantageous.

In order to form a hard gold-plated layer having improved wear resistance, it is possible to include at least one of indium, cobalt and nickel in a total amount of 0.1 to 5 g / l.

The gold plating solution may contain at least one of citric acid, sodium citrate, and potassium citrate as a complexing agent and a conductive salt. These preferably contain 20 to 100 g / l.

Furthermore, it is possible to additionally include, if necessary, a predetermined additive for improving the performance of the plating liquid.

When plating is performed using the electrolytic plating solution, the plating may be performed at a pH of 2 to 5 and at a temperature of 40 to 60 ° C under a cathode current density of 0.5 to 5 A / dm ² .

The gold plating layer or the gold alloy plating layer can be formed on the nickel plating layer by electrolytic plating of the gold or the gold alloy. When the gold alloy plating layer is formed on the nickel plating layer, the gold content of the gold alloy plating layer is preferably 99 wt% or more. When the amount of the gold component is less than 99% by weight, the hardness can be increased by increasing the content of the alloy component, but the contact resistance is increased and the corrosion resistance is weakened.

The gold or gold alloy plating layer formed on the surface of the nickel plating layer preferably has a thickness of 0.05 to 0.2 탆. If the thickness of the gold or gold alloy plating layer is less than 0.05 탆, there is a problem that contact resistance and corrosion resistance are lowered, and if it exceeds 0.2 탆, the cost increases.

On the other hand, the other surface of the copper foil on which the nickel plating and the gold or gold alloy plating layer is formed includes a tin or tin alloy plating layer. The other surface including the tin or tin alloy plating layer is a surface on which the junction terminal thus obtained is bonded to the metal metal case. Therefore, by having a plated layer of tin or tin alloy on its surface, it is possible to secure high bonding properties with aluminum and aluminum alloy, which are metal case materials.

The tin or tin alloy plating may be formed by plating tin or tin and a bismuth alloy or a tin, bismuth, and indium alloy on the other surface of the copper foil, followed by washing with water. The tin or tin alloy plating layer provides excellent weldability, so that the adhesion between the aluminum and aluminum alloy used as the metal case and the contact terminal of the present invention can be improved.

Specifically, the tin plating layer or the tin alloy plating layer has a low melting point, and in particular, the alloy plating layer has a low melting point due to its alloy composition. Therefore, it is possible to exhibit excellent weldability with less energy at the time of welding.

As the source of the tin, tin sulfate, tin chloride, tin sulfamate, tin methosulfonate, tin oxide, etc. may be used alone or in combination. At this time, the concentration of the tin ions in the plating solution is preferably 5 to 100 g / l, more preferably 10 to 50 g / l. When the concentration of tin ions is less than 5 g / l, the precipitation efficiency is lowered, and when it exceeds 100 g / l, the cost increases.

As described above, the contact terminal of the present invention may be formed on the other surface with a plating layer made of an alloy including tin and at least one of bismuth and indium.

Examples of the source of bismuth ions in the plating solution include bismuth sulfate, bismuth chloride, bismuth sulfamate, bismuth methosulfonate and bismuth oxide, and these may be used singly or in combination. The concentration of the bismuth ions is preferably 5 to 100 g / l, more preferably 10 to 50 g / l.

Thereby, the alloy plating layer of tin and bismuth can form a plating layer having a composition of 40 to 80% by weight of tin and 20 to 60% by weight of bismuth, and the obtained tin and bismuth alloy plating layer has a melting point of 140 to 150 ° C , Good adhesion can be obtained.

Furthermore, the plating liquid may contain indium in addition to the tin and bismuth to form an alloy plating layer of tin, bismuth, and indium. To this end, the plating solution may also comprise a source of indium ions. The source of the indium ions may include indium sulfate, indium chloride, indium sulfide, indium methanesulfonate and indium oxide. These indium ions may be used singly or in admixture of two or more. The concentration of the indium ions is preferably 1 to 20 g / l, more preferably 2 to 10 g / l.

As a result, an alloy plating layer having a composition of 40 to 80% by weight of tin, 20 to 60% by weight of bismuth and 15% by weight or less of indium (excluding 0% by weight) as an alloy plating layer of tin, bismuth and indium is formed on the surface of the copper foil Can be obtained. The alloy plating layer thus obtained has a lower melting point of 120 to 140 캜, and therefore, a better adhesion can be secured.

The tin or tin alloy plating solution may contain a complexing agent to facilitate formation of a plating layer on the surface of the copper foil. As the complexing agent, citric acid, lactic acid, glyconic acid, methanesulfonic acid, tartaric acid, oxalic acid, malic acid, etc. may be used, and any one of them may be used singly or two or more complexing agents may be used . The content of the complexing agent is preferably 50 to 250 g / l, more preferably 100 to 200 g / l. If the amount of the complexing agent is insufficient, the metal will not be ignited and the appearance of the plating becomes poor.

Further, the above-mentioned tin or tin alloy plating solution can be used by adding a surfactant if necessary. The surfactant may be selected from a variety of surfactants such as nonionic, cationic, anionic and amphoteric surfactants. At this time, the concentration of the surfactant in the plating solution is preferably 0.01 to 20 g / l, more preferably 0.5 to 10 g / l.

The plating solution can be used by adding additives such as antioxidants and brighteners to improve the plating properties. If additives such as antioxidants and brighteners are generally used in this field, they can be suitably used in the present invention. .

Preferably, the tin or tin alloy plating solution maintains a temperature of 20 to 50 캜, and a preferable cathode current density is 1 to 10 A / dm ² .

By performing electrolytic plating using such a plating solution, tin or tin alloy is formed on one surface of the copper foil to improve the adhesion with the metal case and the like. In order to improve the adhesion, the tin or tin alloy plating layer is preferably formed to a thickness ranging from 1 to 5 mu m. When the thickness is less than 1 탆, the weldability of the product is poor. When the thickness exceeds 5 탆, the cost is not preferable.

1, the contact terminal includes a nickel plating layer 120 and a gold or gold alloy plating layer 130 formed on one surface of the copper foil 110 to provide excellent corrosion resistance and wear resistance And a tin or tin alloy plating layer 140 is formed on the other surface of the copper foil 110 so that the metal or the aluminum or aluminum alloy 150 to which the contact terminal 100 of the present invention is attached, It is possible to obtain the contact terminal 100 having excellent adhesion with the contact terminal 100.

In the method of manufacturing the contact terminal thin film sheet for an antenna according to the present invention, the nickel plating layer and the gold plating layer are formed on one surface of the copper foil and the tin plating layer is formed on the other surface of the copper foil. However, A nickel plating layer and a gold plating layer can be formed on the other surface of the copper foil and a nickel plating layer is formed on one surface of the copper foil and a tin plating layer is formed on the other surface of the copper foil, A gold-plated layer can be formed on the substrate, and the order can be variously set as needed.

The contact terminal provided by the present invention preferably has a total thickness including a plurality of plated layers in the range of 10 to 30 mu m, more preferably 15 to 25 mu m. More specifically, the nickel plating layer, the gold or gold alloy plating layer formed on one surface of the copper foil, and the tin or tin alloy plating layer formed on the other surface of the copper foil are respectively 20 to 40%, 0.001 to 0.01% It is preferably formed at a ratio of 10 to 20%.

The contact terminal provided by the present invention can be bonded by a method such as ultrasonic welding, laser welding, spot welding, etc. after contacting the tin or tin alloy plating layer 140 with the aluminum and aluminum alloy 150.

The copper foil containing the plating layer according to the present invention has a low melting point of tin or tin alloy formed on one side of the copper foil and is excellent in weldability with a metal case made of aluminum or an aluminum alloy material and can be suitably used as a contact terminal sheet for an antenna through welding .

In order to facilitate the welding and processing of the aluminum and aluminum alloy 150, the contact terminal provided by the present invention may be formed of a tin or tin alloy plating layer 140 made of an acrylic adhesive having a carboxyl group or an epoxy group, As shown in FIG.

The method of forming the adhesive layer is not particularly limited and may be formed by applying the adhesive on the tin plating layer of the antenna contact terminal sheet by a conventional method. For example, the adhesive layer may be formed by applying an adhesive, Various methods such as coating can be applied.

The pressure-sensitive adhesive layer can be suitably used for fixing the product during processing and welding of the product. The thickness of the pressure-sensitive adhesive layer is suitably 0.1 to 5 占 퐉. If the thickness is less than 0.1 탆, the product as a pressure-sensitive adhesive is not sufficiently fixed, and if it is more than 5 탆, it acts as a factor that interferes with welding, thereby deteriorating the weldability.

Example

Hereinafter, the present invention will be described in more detail with reference to examples. However, the following examples are illustrative of the present invention and are not intended to limit the present invention.

Example  1 to 8

An electrolytic copper foil having a thickness of 12 탆 was subjected to a degreasing treatment carried out at a temperature of 55 캜 consisting of 20 g / l of caustic soda, 30 g / l of sodium carbonate, 10 g / l of sodium tertiary phosphate, 10 g / l of sodium metasilicate, And then washed with water.

Subsequently, the degreased copper foil was immersed in a sulfuric acid activation tank having sulfuric acid at room temperature and having a concentration of 7 wt%, and the oxide layer on the surface of the copper foil was removed, activated and then washed with water.

After the alkaline degreasing and sulfuric acid activation pretreatment were completed, the copper foil was electrolyzed in a plating bath containing a nickel plating solution consisting of nickel sulfide (75 g / l of nickel metal), 30 g / l of nickel chloride and 30 g / l of boric acid A nickel plating layer was formed on one surface of the copper foil.

At this time, the electrolytic nickel plating solution was maintained at a temperature of 50 캜, a pH of 4.2, and a current density of 5 A / dm ² .

Thereafter, electrolytic plating was carried out in a plating bath carrying an acidic gold alloy plating solution composed of 2 g / l of gold potassium cyanide, 20 g / l of citric acid, 60 g / l of sodium citrate and 2 g / l of cobalt sulfate and the plating was carried out on the nickel plating layer An alloy plating layer of gold and cobalt was formed.

The plating solution of the acidic gold alloy was maintained at a temperature of 50 캜, a pH of 4.5, and maintained at a current density of 1 A / dm ² .

A tin and bismuth alloy plating or a tin, bismuth and indium alloy plating was performed on the other side of the copper foil on which the nickel plating layer and the gold-cobalt alloy plating layer were formed on one side.

In the plating solution used for the above tin and bismuth alloy plating and tin and bismuth and indium alloy plating, tin chloride was used as tin ion, bismuth chloride was used as tin ion and indium chloride was used as indium ion in replenishment of metal ions. As the complexing agent, citric acid, oxalic acid, methanesulfonic acid, and tartaric acid were used. Polyethylene glycol was used as the surfactant and benzene aldehyde as the polishing agent was used as the one shown in Table 1 below.

The stability of the obtained plating solution was evaluated, and the results are shown in Table 1. The solution stability of the plating solution was evaluated for unstability and stability according to the presence or absence of precipitation by recording the solution stability for 1 week after the bath was set.

Using the obtained plating bath, plating was performed at the cathode current density shown in Table 1 under the plating bath temperature condition as shown in Table 1. [

The composition of the plated layer of the obtained specimen was analyzed, and the contents of Bi and In in the plated layer were shown in Table 1.

On the other hand, the melting point of the tin alloy plating layer formed on one surface of the test piece was measured by the above plating, and the results are shown in Table 1.

The bonding strength between Al and the specimen was evaluated by ultrasonic welding the surface of the specimen obtained in each example with the tin plate layer. The results are shown in Table 1.

The above weldability test and evaluation were carried out as follows.

After the obtained specimen was welded to the Al plate, a physical force was applied to separate the specimen from the Al plate.

At this time, when the specimen was torn and separated from the Al plate, it was evaluated that the weldability was good. On the other hand, when the specimen and the Al plate are separated from each other on the weld, the weldability is evaluated to be poor.

The weldability evaluation test was conducted ten times for the same specimen, and the case where the weldability evaluation was evaluated to be good at least eight times was finally described as good.

Example One 2 3 4 5 6 7 8 ingredient
g / l Sn ion 15 15 15 15 15 15 15 15 Bi ion 20 20 20 20 20 20 20 20 In ion - - - - 3 3 3 3 Citric acid 120 120 - - 120 120 - - Oxalic acid 20 20 - - 20 20 - - Methanesulfonic acid - - 150 150 - - 150 150 Tartaric acid - - 50 50 - - 50 50 Surfactants 5 5 5 5 5 5 5 5 Polish One One One One One One One One Condition Temperature (℃) 25 25 25 25 25 25 25 25 Cathode current density (A / dm ² ) One 3 One 3 One 3 One 3 evaluation Melting point (℃) 146 144 143 143 138 137 136 136 Bath stability stability stability stability stability stability stability stability stability Bi content (% by weight) 52.1 54.5 58.2 59.1 47.1 48.3 45.2 45.9 In content (% by weight) - - - - 10.2 11.3 13.4 14.1 Weldability Good Good Good Good Good Good Good Good

From the above Table 1, the plating solution prepared under the conditions of the above Examples 1 to 8 was excellent in the solution stability.

On the other hand, in the case of the sheet including the plating layer plated with the plating solution, the melting point of the tin alloy plating layer was lower than 150 캜, and the weldability was also good. From this, it can be seen that, when a plating layer of tin or tin alloy according to the present invention is included, the weldability with aluminum is good and excellent bonding strength can be ensured. In addition, the plating state was good without appearance of stains or streaks on the appearance.

As a result of evaluating the weldability through ultrasonic welding as compared with the uncoated sheet of Comparative Example 1, the weldability was excellent and the bonding strength with aluminum and aluminum alloy was excellent.

The contact terminal sheet for an antenna manufactured according to the embodiment of the present invention can be used as a contact terminal for an antenna through welding with a metal case made of aluminum and an aluminum alloy material.

Comparative Example  One

The same copper foil as in Example 1 was subjected to nickel plating on one surface of the copper foil under the same conditions as in Example 1 except that plating of tin or tin alloy was not performed on one surface, To prepare a specimen.

The obtained specimens were welded in the same manner as in Example 1 to evaluate the weldability. As a result of the evaluation, the specimen was separated from the Al plate and weldability was poor.

100: contact terminal 110: copper
120: Nickel plated layer 130: Gold or gold alloy plated layer
140: tin or tin alloy plating layer
150: Aluminum or aluminum alloy substrate

Claims (19)

Copper foil;
A tin plating layer made of tin or a tin-containing alloy on one surface of the copper foil;
A nickel plating layer on the other surface of the copper foil; And
A gold plated layer of gold or gold alloy formed on the nickel plated layer;
The contact terminal thin film sheet for an antenna.
The contact terminal thin film sheet for an antenna according to claim 1, wherein the tin plating layer has a thickness of 1 to 5 mu m.
The contact terminal thin film sheet for an antenna according to claim 1, wherein the tin-containing alloy is an alloy of tin and bismuth or an alloy of tin, bismuth and indium.
The contact terminal thin film sheet for an antenna according to claim 3, wherein the tin-containing alloy is 40 to 80% by weight of tin, 20 to 60% by weight of bismuth, and 15% by weight or less of indium.
delete The contact terminal thin film sheet for an antenna according to claim 1, wherein the nickel plating layer has a thickness of 4 to 8 占 퐉 and the gold plating layer has a thickness of 0.05 to 0.2 占 퐉.
The contact terminal thin film sheet for an antenna according to claim 1, wherein the gold alloy plating layer is an alloy of gold and at least one of indium, cobalt and nickel.
The contact terminal thin film sheet for an antenna according to claim 7, wherein the gold alloy plated layer is an alloy with a metal having a gold content of 99 wt% or more.
The adhesive sheet according to any one of claims 1 to 4 and 6 to 8, wherein the copper foil comprises a 0.1 to 5 탆 thick adhesive layer made of an acrylic adhesive having a carboxyl group or an epoxy group on the tin plating layer Contact terminal thin film sheet for antenna.
A nickel plating layer forming step of forming a nickel plating layer on the first surface of the copper foil by electrolytic plating;
A gold plating layer forming step of forming a gold plating layer of gold or gold alloy on the nickel plating layer by electrolytic plating; And
A tin plating layer forming step of forming a plating layer of tin or tin alloy by using a plating solution containing tin by electrolytic plating on the second surface of the copper foil
And the contact terminal thin film sheet for antenna.
The plating apparatus according to claim 10, wherein the plating liquid containing tin
As the tin-containing compound, a tin ion concentration of 5 to 100 g / l;
Complexing agent 50 to 250 g / l; And
0.01 to 20 g / l of surfactant
Wherein the contact terminal thin film sheet for an antenna is made of a metal.
12. The method according to claim 11, wherein the tin-containing compound is at least one selected from the group consisting of tin sulfate, tin chloride, tin sulfamate, tin methosulfonate and tin oxide.
The method of manufacturing a contact terminal thin film sheet for an antenna according to claim 11, wherein the plating solution containing tin further comprises a bismuth-containing compound having a bismuth ion concentration of 5 to 100 g / l and an indium-containing compound having an indium ion concentration of 20 g / .
12. The method according to claim 11, wherein the complexing agent is selected from the group consisting of citric acid, lactic acid, glyconic acid, methanesulfonic acid, tartaric acid, oxalic acid and malic acid.
The method according to claim 10, wherein the nickel plating layer forming step includes a step of forming a nickel plating layer containing nickel sulfide having a nickel ion concentration of 50-100 g / l, nickel chloride having a concentration of 20-50 g / l and 20-50 g / l boric acid, , And is formed by electrolytic plating using a plating solution having a pH of 3 to 5.
11. The method according to claim 10, wherein the step of forming the gold-plated layer comprises 20 to 100 g / l of at least one member selected from the group consisting of potassium cyanide and potassium citrate at 1 to 10 g / l, citric acid, sodium citrate and potassium citrate, And a plating liquid having a pH of 2 to 5 is used for electrolytic plating.
The method according to claim 16, wherein the plating solution in the gold plating layer further comprises at least one metal selected from the group consisting of indium, cobalt and nickel in an amount of 0.1 to 5 g / l in total.
11. The method according to claim 10, wherein the copper foil is subjected to alkali degreasing and sulfuric acid activation treatment,
The alkaline degreasing is carried out at a temperature of 50 < 0 > C containing 5 to 20 g / l of caustic soda, 20 to 40 g / l of sodium carbonate, 5 to 20 g / l of sodium tertiary phosphate, 5-10 g / l of sodium metasilicate, Deg.] C to 60 [deg.] C,
Wherein the sulfuric acid activation treatment is performed by immersing in an aqueous solution of sulfuric acid having a concentration of 5-10 wt% sulfuric acid.
The contact terminal thin film for an antenna according to any one of claims 10 to 18, further comprising a step of forming an adhesive layer having a thickness of 0.1 to 5 탆 by applying an acrylic adhesive having a carboxyl group or an epoxy group on the tin plating layer / RTI >

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