KR101729758B1 - A stacking type digitizer using copper-nano-ink for low temperature sintering and a method for manufacturing the same - Google Patents

Abstract

One embodiment of the present invention provides a method of manufacturing a stacked type digitizer by printing a copper electrode wiring on a thin substrate using copper nano ink containing copper nano particles and sintering at a low temperature, thereby providing a stacked type digitizer. A method of manufacturing a multilayer type digitizer using a copper nano ink for low temperature sintering according to an embodiment of the present invention includes the steps of preparing an ink by mixing a binder and a copper nanoparticle formed of a polymer resin with a solvent, A step of printing the Y-axis electrode wiring on the Y-axis electrode wiring, a step of low-temperature sintering the printed Y-axis electrode wiring, a step of printing the first insulating layer on the Y- A step of curing the X-football electrode wiring on the first insulating layer using ink, a step of low-temperature sintering the printed X-football electrode wiring, and a step of forming a second And printing the insulating layer.

Description

[0001] The present invention relates to a stacking type digitizer using a copper nano ink for low temperature sintering and a method for manufacturing the same,

The present invention relates to a multilayer digitizer using a copper nano ink for low temperature sintering and a method of manufacturing the same, and more particularly, to a method of manufacturing a multilayer digitizer using a copper nano ink containing copper nano particles to print a copper electrode wiring on a thin substrate, To a method of manufacturing a stacked digitizer and a stacked digitizer therefor.

Recently, portable terminals and display devices equipped with a digitizer function have been attracting attention. The digitizer function can be applied to a small portable terminal device such as a smart phone, a tablet, and a display device of a large display.

A display device equipped with such a digitizer function can make a handwritten note using an electronic pen, draw a picture, and edit an image or a picture.

When the tip of the electronic pen approaches the touch screen, the electromagnetic induction phenomenon occurs, and the electromagnetic field is deformed in the digitizer panel disposed on the lower side of the panel, and the movement of the electronic pen is analyzed through the sensor.

The digitizer is composed of a Y-axis wiring layer, an insulating layer, and an X-axis wiring layer, and wiring is formed by direct printing with conductive ink and paste such as silver and copper.

Korean Patent No. 10-0329576 discloses a touch panel and a method for manufacturing the same, hereinafter referred to as a prior art 1, in which a lower substrate made of a transparent polymer material is prepared, and a patterned second Forming a transparent conductive film, forming a plurality of dot spacers on the lower substrate, forming a conductive lower electrode capable of conducting with the second transparent conductive film, drying the lower electrode, cutting the lower substrate into individual units, 2 transparent conductive film and a dot spacer, the second transparent conductive film is entirely applied, and a portion to be removed from the second transparent conductive film to be patterned on the lower substrate and a portion corresponding to a portion where the dot spacer is to be formed And printing the dielectric layer and drying the dielectric layer, and a method of manufacturing the touch panel.

The above-mentioned prior art 1 has a first problem that a complicated FPCB manufacturing process based on a vacuum deposition or an exposure process is manufactured and the investment cost for the manufacturing facility is increased.

The above-mentioned prior art 1 has a second problem that a manufacturing cost is increased by using silver paste as a material for printing a circuit.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not intended to limit the invention to the precise form disclosed. There will be.

According to an aspect of the present invention, there is provided a method of manufacturing an ink, comprising the steps of: i) preparing an ink by mixing a binder and a copper nanoparticle formed of a polymer resin with a solvent, ii) (Iii) low-temperature sintering of the Y-axis electrode wiring printed in the step (ii); iv) a step of printing on the Y-axis electrode wiring sintered at low temperature in the step (iii) Printing the first insulating layer, v) curing the first insulating layer printed in step iv), vi) using the ink to print the X-axis electrode wiring on the first insulating layer (C) low-temperature sintering the X-football electrode wiring printed in the step (vi), and (f) printing the second insulating layer on the X-football electrode wiring sintered at low temperature in the step And Using copper nano ink for low temperature sintering that provides a method for producing laminated type digitizer.

In an embodiment of the present invention, the step ii) or the step vi) may be performed through gravure offset printing.

In the embodiment of the present invention, the step i) may be carried out by mixing 10 to 30% by weight of the solvent, 60 to 80% by weight of the copper nanoparticles and 1 to 10% by weight of the binder, have.

In an embodiment of the present invention, the solvent of step (i) may be at least one selected from the group consisting of an alcohol-based solvent, a glycol-based solvent and an acetate-based solvent.

In an embodiment of the present invention, the solvent of step (i) may be prepared by mixing an alcohol solvent and an acetate solvent at a ratio of 1: 2 to 1: 4.

In an embodiment of the present invention, the binder in step (i) may be at least one selected from the group consisting of acrylic and urethane.

In the embodiment of the present invention, the binder in step (i) may be prepared by mixing 1 to 3% by weight of urethane and 5 to 7% by weight of acrylic.

In an embodiment of the present invention, the substrate of step ii) may be made of polyimide.

In the embodiment of the present invention, the Y soccer electrode wiring in the step iii) and the X-football electrode wiring in the step i) may be sintered at a temperature of 100 to 300 ° C.

In the embodiment of the present invention, the Y-axis electrode wirings in step (iii) and the X-axis electrode wirings in step (ii) are heated at a rate of 10 ° C / min to 150 ° C / min, Lt; / RTI >

In the embodiment of the present invention, the first insulating layer in the step iv) or the second insulating layer in the step b) may be formed of a curable insulating paste.

In the embodiment of the present invention, the first insulating layer printed in step iv) may be provided with a via hole capable of electrically connecting the Y-axis electrode wire and the X-axis electrode wire.

In the embodiment of the present invention, the first insulating layer in step (v) and the second insulating layer in step (c) may be cured with ultraviolet rays.

In the embodiment of the present invention, the step (i) may be carried out by further mixing a carboxylic acid or a reducing agent with the ink.

In an embodiment of the present invention, a step of kneading the copper nanoparticles may be further included between the step (i) and the step (ii).

According to an aspect of the present invention, there is provided an ink jet printer comprising a substrate formed of a polyimide material, a binder formed of a polymer resin, and an ink prepared by mixing copper nanoparticles with a solvent, A first insulating layer formed by printing with a curable insulating paste on the Y-axis electrode wire, a first insulating layer formed on the first insulating layer by gravure offset printing And a second insulating layer formed by printing with an ultraviolet (UV) curable insulating paste on the X-axis electrode wiring, wherein the first insulating layer is formed with a Y- And a via hole for electrically connecting the X electrode line and the X electrode line. Provided that the tie.

The present invention has a first effect that a digitizer can be mass-produced by a roll-to-roll process for printing with copper nano ink.

In addition, the present invention has the second effect that the manufacturing cost is reduced by replacing the conventional method of forming the electrode by Ag paste with copper.

The present invention has the third effect that the electrode wiring formed of the copper nano ink can be sintered at a low temperature, and the digitizer can be manufactured based on a thin and flexible synthetic resin material.

It should be understood that the effects of the present invention are not limited to the effects described above, but include all effects that can be deduced from the description of the present invention or the composition of the invention described in the claims.

FIG. 1 is a process schematic diagram of a method for manufacturing a stacked-type digitizer according to the present invention.
2 is a flowchart of a method of manufacturing a stacked-type digitizer according to the present invention.
3 is a cross-sectional view of a stacked digitizer according to an embodiment of the present invention.
4 is a photograph of the Y-axis electrode wiring printed on a substrate according to an embodiment of the present invention.
5 is a photograph of a stacked digitizer according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.

Throughout the specification, when a part is referred to as being "connected" (connected, connected, coupled) with another part, it is not only the case where it is "directly connected" "Is included. Also, when an element is referred to as "comprising ", it means that it can include other elements, not excluding other elements unless specifically stated otherwise.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, the terms "comprises" or "having" and the like refer to the presence of stated features, integers, steps, operations, elements, components, or combinations thereof, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a process diagram of a method of manufacturing a multilayered digitizer of the present invention, and FIG. 2 is a flowchart of a method of manufacturing a multilayered digitizer of the present invention. (The via hole 310 having a finer size in FIG. 1 is omitted).

As shown in FIG. 2, the method for fabricating a multilayer digitizer using copper nano ink for low temperature sintering comprises the steps of (S10) preparing an ink by mixing a binder and a copper nanoparticle formed of a polymer resin with a solvent, (S20) of printing the Y-axis electrode wiring 200 on one side of the substrate 100, (S30) low-temperature sintering the Y-axis electrode wiring 200 printed in the step (ii) A step S40 of printing the first insulating layer 300 on the low-temperature sintered Y-axis electrode wiring 200, a step S50 of curing the first insulating layer 300 printed in the step iv) (S60) of printing the X-axis electrode wiring 400 on the first insulating layer 300, and S70 (step S70) of low temperature sintering the X- (S80) of printing the second insulating layer 500 on the low-temperature sintered X-axis electrode wiring 400 in the step .

Hereinafter, a method of manufacturing a multilayer type digitizer using copper nano ink for low temperature sintering according to the present invention will be described.

First, an ink can be prepared by mixing a binder and a copper nanoparticle formed of a polymer resin with a solvent. (S10)

(The ink generated in the first step S10 is hereinafter referred to as "copper nanoink").

Here, the copper nanoparticles can be produced by pyrolyzing a copper formate-amine complex. Copper nanoparticles prepared by pyrolysis have smaller particle size distribution and smaller particle size than copper nanoparticles prepared by the conventional liquid phase method. In addition, when copper nano ink is manufactured by using the copper nano ink, copper electrode wiring can be formed more densely under low temperature sintering conditions.

The average particle diameter of the copper nanoparticles may be 50 to 150 nm, and preferably the average particle diameter may be 80 to 120 nm. When the size of the copper nanoparticles is less than 50 nm, the cohesive force between the copper nanoparticles is increased and it may be difficult to uniformly disperse the copper nanoparticles in the copper nano ink. If the surface area is excessively increased, the oxidation stability of the copper nanoparticles is lowered, .

If the size of the copper nanoparticles exceeds 150 nm, the contact interface between the copper nanoparticles can not be sufficiently secured under the low-temperature sintering condition, thereby increasing the defects of the copper electrode wiring, resulting in deterioration of conductivity.

The first step S10 may be carried out by mixing 10 to 30% by weight of a solvent, 60 to 80% by weight of copper nanoparticles and 1 to 10% by weight of a binder to prepare an ink.

In addition, the solvent in the first step S10 may be at least one selected from the group consisting of an alcohol-based solvent, a glycol-based solvent and an acetate-based solvent.

The solvent of the first step (S10) can be obtained by mixing the alcohol solvent and the acetate system solvent in a ratio of 1: 2 to 1: 4.

The binder of the first step S10 may be composed of one or more selected from the group consisting of acrylic and urethane.

In addition, the binder of the first step S10 may be a mixture of 1 to 3% by weight of urethane and 5 to 7% by weight of acrylic.

Copper nanoparticles are metal fillers that impart conductivity to conductive copper nanoinks. When the content of copper nanoparticles is less than 60 wt%, it may be difficult to achieve the desired electrical conductivity due to a shortage of metal particles. When the content of the copper nanoparticles exceeds 80 wt%, the viscosity of the copper nanoparticles may excessively increase, which may make the printing process difficult. In addition, the adhesion of the substrate to the substrate may be decreased due to a decrease in the content of the organic nanoparticles.

The solvent may be added to produce a uniform dispersion of the copper nanoparticles and a copper nano ink having a predetermined viscosity. If the content of the solvent is less than 10 wt%, the dispersion stability of the copper nanoparticles can not be sufficiently secured, so that it may be difficult to form the copper electrode wiring of high quality, and the viscosity may increase and the printing property may be deteriorated. When the content of the solvent is more than 30 wt%, the content of the metal filler is relatively low, so that the electrical conductivity may be deteriorated. Also, since the viscosity is low, spreadability of wiring between the wirings during printing is increased and it is difficult to form a high quality copper wiring Can occur.

The alcoholic solvent is selected from the group consisting of ethylene glycol, polyethylene glycol, terpenol, ethanol, isobutyl alcohol, butanol, butanediol, petanol, hexanol, clinohexanol, octyl alcohol, benzyl alcohol and eugenol solvents , But is not limited thereto. The acetate-based solvent may be at least one selected from the group consisting of butyl carbitol acetate, ethyl acetate, isobutyl acetate, ether acetate and tocopherol acetate, but is not limited thereto.

Preferably, terpineol and butyl carbitol acetate can be used. In this case, terpinol and butyl carbitol acetate may be mixed in a ratio of 1: 2 to 1: 4 and used as a solvent. When the ratio of the terpineol is lower than 1, the volatility is lowered, the solvent is not separated and the use is inferior. If the ratio is higher than 1, the volatility becomes too high and the solvent is easily decomposed before the electrode is formed. It can be bad. If the ratio of butyl carbitol acetate is less than 2, it is difficult to be used as a solvent because of difficulty in applying to the blanket. If the ratio is more than 4, it is too absorbed in the blanket, .

In the present invention, the binder may be added in order to control the viscosity of the copper nanoink and to give adhesion to the substrate. When the binder resin is added to the copper nano ink at less than 1 wt%, the effect of increasing the adhesion to the substrate is insufficient. When the binder resin is added in an amount exceeding 10 wt%, the viscosity excessively increases, It may be difficult to print using it, and it may be difficult to form the highly conductive copper electrode wiring due to an increase in the organic matter content in the copper nano ink.

The binder may be at least one selected from the group consisting of a cellulose resin, a polyvinyl chloride resin, a copolymer resin, a polyvinyl alcohol resin, a polyvinyl pyrrolidone resin, an acrylic resin, a vinyl acetate-acrylate copolymer resin, a butyral resin, an alkyd resin, , A rosin ester resin, a polyester resin, silicon, PVP and PVA, but the present invention is not limited thereto.

Preferably, urethane and acrylic may be mixed to form a binder. Mixing of 1 to 3 wt% of urethane and 4 to 7 wt% of acrylic may be effective. When the urethane is lowered to less than 1 wt%, the set is not set in the gravure offset printing and the formation of the electrode is poor. When the urethane is more than 3 wt%, the spreading phenomenon may be increased in the gravure offset printing. When less than 4wt% of acrylic is used, the line width of pattern is worsened because it is low in viscosity when the electrode is formed due to low viscosity, and when it is more than 7wt%, the viscosity becomes too high, .

The first step S10 may be performed by further mixing a carboxylic acid or a reducing agent with the copper nano ink.

The carboxylic acid or the reducing agent may increase the filling density of the copper nanoparticles and may have a function of promoting the sintering of the copper electrode wiring formed by printing the copper nano ink. (1 <c <5), Middle (6 <c <10) and Long (10 <c <5) depending on the number of carbon chains, 15). Preferably, a carboxylic acid containing the number of carbon chains in the middle can be added.

Secondly, the Y-axis electrode wiring 200 can be printed on one side of the substrate 100 using ink. (S20)

The substrate 100 in the second step S20 may be made of polyimide.

The substrate 100 (PI film) made of polyimide has high thermal resistance, electrical insulation, flexibility, and non-flammability without changing physical properties over a wide temperature range from minus 273 ° C to image 400 ° C, Lt; / RTI &gt;

In the present invention, the second step (S20) is described as manufacturing the substrate 100 with polyimide. However, the present invention is not limited thereto. For example, polybutylene terephthalate, polyethylene terephthalate, polysulfone, polyether, polyetherimide, Any one selected from polyethylene naphthalate, acrylic resin, heat-resistant epoxy, EVA, butyl rubber, polyarylate, polyimide, glass, silicone, ferrite, ceramic and FR-4 have.

The substrate 100 may have various shapes, but a film shape may be preferable in order to be suitable for the multilayered digitizer of the present invention.

The thickness of the Y-axis electrode wiring 200 may be 3 to 10 micrometers (占 퐉), preferably 5 to 7 占 퐉 (占 퐉). If the thickness of the Y-axis electrode wiring 200 is less than 3 micrometers (m), the electrical conductivity may be lowered. If the thickness of the Y-axis electrode wiring 200 is more than 10 micrometers (m) The efficiency may be lowered as compared with the efficiency, which is beyond the limit of the electric conductivity required for the electrode.

The width of the Y-axis copper electrode wiring 200 may be 100 to 150 micrometers (mu m), and the distance between the Y-axis copper electrode wiring 200 may be 100 to 150 micrometers (mu m).

If the width of the Y-axis copper electrode wiring 200 is less than 100 micrometers (탆), the electrical conductivity may be lowered. If the Y-axis copper electrode wiring 200 is more than 150 micrometers (탆) The performance of the digitizer may be deteriorated.

If the distance between the Y-axis copper electrode wirings 200 is less than 100 micrometers (탆), a problem of short circuit may occur. If the distance between the Y-axis copper electrode wirings 200 is more than 150 micrometers (탆) The performance of the stacked-type digitizer can be deteriorated.

The second step S20 may be performed through gravure offset printing.

The Y-axis electrode wiring 200 of the present invention can be formed in a pattern of a desired shape on the substrate 100 by a direct printing method. Any one of the screen printing method, the roll-to-roll printing method, the ink-jet printing method and the blade printing method may be used as the direct printing method. The roll-to-roll printing method may be gravure printing, gravure offset printing, Printing methods may be included.

In order to realize the fine line width, it may be desirable to use gravure offset printing, wherein the required viscosity may be from 3,000 to 30,000 Cps. When the viscosity of the copper nano ink is less than 3,000 cps, the line width of the electrode pattern is widened when the copper nano ink is printed, and the pattern may be broken in the gravure offset printing process. When the viscosity of the copper nano ink is more than 30,000 cps, the copper nano ink does not fall well in the blanket during the gravure offset printing process, so that the electrode pattern may not be formed well.

It is necessary that the Y-axis electrode wiring 200 is made of only copper nano ink, the electrical conductivity may be lowered so that the printing thickness is made as thick as possible and the wiring width is made wider. Additional plating layers may be formed to improve electrical conductivity.

Between the first step (S10) and the second step (S20), a step of kneading the copper nanoparticles may further be included.

For physical dispersion of the copper nanoparticles, the copper nanoparticles, the solvent and the binder may be mixed and kneaded for a predetermined time. Such a kneading process can increase the dispersion stability of the copper nanoparticles contained in the copper nano ink, and provides a copper nano ink having a more uniform composition, thereby making it possible to form high quality copper wiring.

As a kneading method, a 3-roll mill may be used.

Third, the Y-axis electrode wiring 200 printed in the second step S20 can be sintered at a low temperature (S30). [

The Y-axis electrode wiring 200 in the third step S30 can be sintered at a temperature of 100 to 300 캜.

Sintering is a process in which heat of a temperature lower than the melting point is applied to a binder or the like contained in the copper nano ink, thereby thermally decomposing the binder and providing connectivity between copper nanoparticles.

The sintering method at a low temperature may be a sintering method using a low temperature heat and a sintering method using a low temperature infrared light.

The low temperature sintering temperature may be 100 to 300 캜. If the sintering temperature is less than 100 ° C, sintering is not properly performed and the electrical conductivity of the copper electrode wiring may be lowered. If the sintering temperature is higher than 300 ° C, the substrate 100 may be deformed.

The sintering method using low-temperature heat can be performed by keeping the substrate 100 on which the copper electrode wirings are formed for a predetermined period of time in a drying apparatus equipped with a hot wire.

In the sintering method using low-temperature light, a halogen lamp, a halogen-xenon lamp, or an incandescent lamp may be used as a light source, preferably a halogen lamp or a halogen-xenon lamp. Halogen lamps or halogen-xenon lamps emit relatively constant energy until the end of their life, which may lead to higher quality copper electrode wiring.

Third Step (S30) The Y-axis electrode wiring 200 can be heated at a high rate at a rate of 10 [deg.] C / min to 150 [deg.] C / min to reach the sintering temperature.

The low-temperature sintering method is characterized in that it is heated at a high temperature at a heating rate of 10 ° C / min to 150 ° C / min by heat or light energy. When the heating rate is less than 10 ° C / min, the effect of shortening the sintering time may be insufficient. As the heating rate increases, the filling density of the copper thin film or wiring formed after sintering may increase. In the present invention, the maximum value of the temperature raising rate is set at 150 캜 / min, but the present invention is not limited thereto.

The step of sintering in the present invention may be carried out in an atmosphere of a gas selected from the group consisting of nitrogen, argon and helium or in a mixed gas atmosphere containing at least two kinds of gases. The gas atmosphere required for sintering is not limited unless it reduces the oxidation stability of the copper particles, but it may be desirable to perform in a nitrogen atmosphere or vacuum in terms of cost reduction.

Fourth, the first insulating layer 300 can be printed on the Y-axis electrode wiring 200 sintered at a low temperature in the third step S30 (S40)

The first insulating layer 300 of the fourth step S40 may be formed of a curable insulating paste.

An epoxy resin, a polyester resin, an acrylic resin, a xylene resin, a polyurethane resin, a urea resin, an amino resin, an alkyd resin or a mixture thereof may be used as the curable insulating paste for forming the first insulating layer 300. The first insulating layer can be formed by a printing method and can be formed by a direct printing method like the Y-axis electrode wiring 200.

The first insulating layer 300 printed in the fourth step S40 may be provided with a via hole 310 through which the Y-axis electrode wiring 200 and the X-axis storage electrode wiring 400 can be electrically connected.

The via hole 310 may be formed by not printing an insulating layer on a plurality of portions for electrical conduction between the Y-axis electrode wiring 200 and the X-axis electrode wiring 400, The side wall of the first insulating layer may be blocked by the first insulating layer. The cross section perpendicular to the side wall of the via hole 310 may be circular or polygonal.

Fifth, the printed first insulating layer 300 may be cured in the fourth step S40 (S50)

The first insulating layer 300 in the fifth step S50 may be cured with ultraviolet rays.

The curable insulating paste for forming the first insulating layer 300 is a thermosetting resin or an ultraviolet ray curable resin and maintains a liquid state at room temperature and has a property of curing when light of a short wavelength band such as heat or ultraviolet rays is applied. Ultraviolet rays having a wavelength of 100 to 350 nanometers (nm) can be used.

Sixth, the X-football electrode wiring 400 can be printed on the first insulating layer 300 using copper nano ink (S60). [

The sixth step (S60) may be performed through gravure offset printing.

The matters concerning the printing method of the sixth step (S60) may be the same as those relating to the printing method of the second step (S20).

The relationship between the width of the X-axis reed electrode wiring 400 and the distance between the X-axis reed electrode wiring 400 and the X- May be the same as that described above.

Seventh, the X-football electrode wiring 400 printed in the sixth step S60 can be sintered at a low temperature (S70). [

The X-axis electrode wiring 400 in the seventh step S70 can be sintered at a temperature of 100 to 300 캜.

The X-football electrode wiring 400 in the seventh step S70 can be heated at a high rate at a heating rate of 10 [deg.] C / min to 150 [deg.] C / min to reach the sintering temperature.

The matters concerning the low temperature sintering in the seventh step (S70) may be the same as those relating to the low temperature sintering in the third step (S30).

Eighth, in the seventh step S70, the second insulating layer 500 can be printed on the low-temperature sintered X-axis electrode wiring 400. (S80)

The second insulating layer 500 in the eighth step S80 may be formed of a curable insulating paste.

The second insulating layer 500 in the eighth step S80 may be cured with ultraviolet rays.

The matters relating to the second insulating layer 500 in the eighth step S80 may be the same as those relating to the first insulating layer 300 in the fourth step S40. However, the via hole 310 may not be formed in the second insulating layer 500.

3 is a cross-sectional view of a stacked digitizer according to an embodiment of the present invention.

3, the multilayer digitizer using copper nano ink for low temperature sintering is composed of a substrate 100 formed of a polyimide material, a binder formed of a polymer resin, and an ink prepared by mixing copper nanoparticles with a solvent. A Y-axis electrode wiring 200 formed by gravure offset printing on one side of the substrate 100 and then sintered at a low temperature, a first insulating layer 300 formed by printing with a curable insulating paste on the Y-axis electrode wiring 200, An X-football electrode wiring 400 formed by gravure offset printing on the first insulating layer 300 with ink and then sintered at a low temperature, and an X-football electrode wiring 400 printed with ultraviolet (UV) A via hole 310 for electrically connecting the Y-axis electrode wire 200 and the X-axis electrode wire 400 to the first insulating layer 300 is formed in the first insulating layer 300, .

FIG. 4 is a photograph of a Y-football electrode wiring 200 printed on a substrate 100 according to an embodiment of the present invention, and FIG. 5 is a photograph of a stacked-type digitizer according to an embodiment of the present invention.

Hereinafter, the present invention will be described in detail by way of examples.

[Example 1]

&Lt; Preparation of copper nano ink &

To the mixed solution of 3 wt% terpineol and 9 wt% butyl carbitol acetate, 2 wt% of a urethane binder (molecular weight: 4,500) and 6 wt% of an acrylic binder (molecular weight: 20,000) were homogeneously mixed and 80 wt %. The mixture was homogenized for 10 times by using 3Rollmill to prepare a copper nanoparticle ink by mixing the predetermined amount of carboxylic acid (long) containing 11 <c <15 carbon chain number.

&Lt; Preparation of stacked digitizer &

As shown in FIG. 4, using the copper nano ink produced, 5 micrometers (占 퐉) was formed on one surface of a polyimide substrate 100 (PI film) having a thickness of 50 micrometers (占 퐉) by gravure offset printing, The Y-axis copper electrode wiring 200, which is the thickness of the Y- At this time, the width of the Y-axis copper electrode wiring 200 was 100 to 120 micrometers (mu m), and the interval between the Y-axis copper electrode wiring 200 was 100 to 150 micrometers (mu m). For gravure offset printing, the doctoring was performed at a pressure of 30 kgf and the printing was performed at a pressure of 50 kgf at a speed of 30 (Off) -30 (Set) mm / s.

The substrate 100 on which the Y-axis copper electrode wiring 200 was printed was placed in a chamber to form a nitrogen atmosphere. The substrate was irradiated with infrared rays using a halogen lamp to reach 300 DEG C at a heating rate of 150 DEG C / min, Lt; / RTI &gt; for 30 minutes. Next, on the Y-axis copper electrode wiring 200 sintered at a low temperature, using a curing-type insulating paste made of an epoxy resin, a first insulating layer 300 having a thickness of 15 micrometers (m) by a screen or gravure offset printing method , And then the first insulating layer 300 was exposed to ultraviolet rays of 300 nanometers (nm) for 10 seconds to be cured. When printing the first insulating layer 300, a via hole 310 was formed so that a specific portion was not printed.

Next, the X-axis copper electrode wiring 400 was printed on the cured first insulating layer 300 in the same manner as the printing of the Y-axis copper electrode wiring 200. Next, the X-axis electrode wiring 400 was sintered at a low temperature in the same manner as the low-temperature sintering of the Y-axis copper electrode wiring 200. Thereafter, a second insulating layer 500 (having a thickness of 15 micrometers) is formed on the low-temperature sintered X-axis copper electrode wiring 400 by a screen or gravure offset printing method using a curable insulating paste made of an epoxy resin ), And then the second insulating layer 500 was cured by exposing it to ultraviolet rays at a wavelength of 300 nanometers (nm) for 5 minutes.

As shown in FIG. 4, the Y-axis electrode wiring 200 was wired on the substrate 100 without any phenomenon such that the Y-axis electrode wiring 200 was accidentally adhered to the substrate 100 and collapsed and spread.

The photograph of FIG. 5 shows the stacked digitizer performed until the hardening of the second insulating layer 500. (In the case of FIG. 5, the substrate 100 is formed of a material of polyimide (PI), and the multilayered digitizer of the present invention has a yellow color.)

[Experimental Example 1]

During the production of the stacked-type digitizer of Example 1, after the gravure offset printing, the low-temperature sintered Y-axis electrode wire 200 was energized and the resistance value was measured. The resistivity was measured to be 11.94 (μΩ · cm) And is suitable for use in a display device or the like.

It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

The scope of the present invention is defined by the appended claims, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present invention.

100: substrate
200: Y spindle electrode wiring
300: first insulating layer
310: Via hole
400: X-axis electrode wiring
500: second insulating layer

Claims (16)

A method of manufacturing a multilayer digitizer using a copper nano ink for low temperature sintering,
I) preparing an ink by mixing a binder and a copper nanoparticle formed of a polymer resin with a solvent;
Ii) printing the Y-axis electrode wiring on one side of the substrate using the ink;
Iii) low-temperature sintering the Y soccer electrode wiring printed in step ii);
Iv) printing a first insulating layer having a via hole formed on the Y-axis electrode wiring sintered at low temperature in step iii);
V) curing the first insulating layer printed in step iv);
Vi) printing the X-axis electrode wiring on the first insulating layer using the ink;
(C) low-temperature sintering the X-football electrode wiring printed in the step (vi); And
(D) printing a second insulating layer on the X-axis electrode wiring sintered at a low temperature in the step (e);
Lt; / RTI &gt;
Wherein the via hole is formed to penetrate through the first insulating layer in the thickness direction and has an upper end opened to the lower surface of the X-axis electrode wire and a lower end opened to the upper surface of the Y- The X-axis electrode wiring is energized,
The thickness of the Y-axis electrode wiring and the thickness of the X-axis electrode wiring are respectively 3 to 10 micrometers (占 퐉), the width of the Y-axis electrode wiring and the width of the X- Wherein the copper nanoparticles are prepared by pyrolyzing a copper formate-amine complex to have an average particle size of 50 to 150 nanometers (nm) so as to secure the thickness and the width,
Wherein the binder of step (i) comprises 1 to 3% by weight of urethane and 5 to 7% by weight of acrylate.
The method according to claim 1,
Wherein the step (ii) or the step (vi) is performed by gravure offset printing. &Lt; Desc / Clms Page number 20 &gt;
The method according to claim 1,
Wherein the step i) is carried out by mixing the solvent 10 to 30% by weight, the copper nanoparticles 60 to 80% by weight, and the binder 1 to 10% by weight to prepare the ink, Method of manufacturing a stacked digitizer using ink.
The method according to claim 1,
Wherein the solvent of step (i) comprises at least one selected from the group consisting of an alcohol solvent, a glycol solvent and an acetate solvent.
The method of claim 4,
Wherein the solvent of step (i) is prepared by mixing an alcohol solvent and an acetate solvent in a ratio of 1: 2 to 1: 4.
delete delete The method according to claim 1,
Wherein the substrate of step ii) is made of polyimide. 2. The method of claim 1, wherein the substrate is made of polyimide.
The method according to claim 1,
Wherein the Y-axis electrode wiring of step (iii) and the X-axis electrode wiring of step (ii) are sintered at a temperature of 100 to 300 ° C. .
The method according to claim 1,
Wherein the Y-axis copper electrode wiring in the step (iii) and the X-axis copper electrode wiring in the step (ii) are heated at a rate of 10 ° C / min to 150 ° C / min to reach a sintering temperature (METHOD FOR MANUFACTURING LAMINATED DIGITALIZER USING COPPER NANO INK FOR SINTERING).
The method according to claim 1,
Wherein the first insulating layer in step (iv) or the second insulating layer in step (c) is formed of a curable insulating paste.
delete The method according to claim 1,
Wherein the first insulating layer in step (v) and the second insulating layer in step (c) are cured with ultraviolet rays.
The method according to claim 1,
Wherein the step (i) is carried out by further mixing a carboxylic acid or a reducing agent with the ink. &Lt; RTI ID = 0.0 &gt; 8. &lt; / RTI &gt;
The method according to claim 1,
Further comprising a step of mixing the copper nanoparticles between the step (i) and the step (ii).
In a multilayer digitizer using a copper nano ink for low temperature sintering,
A substrate formed of a polyimide material;
A Y-axis electrode wire formed by gravure offset printing on one side of the substrate, which is made by mixing a binder made of a polymer resin and a copper nanoparticle with a solvent, followed by low-temperature sintering;
A first insulating layer formed on the Y-axis electrode wire by printing with a curable insulating paste;
An X-axis electrode wiring formed by gravure offset printing on the first insulating layer with the ink and then sintered at a low temperature;
A second insulation layer formed on the X-axis electrode wiring by printing with an ultraviolet (UV) curable insulation paste;
/ RTI &gt;
The first insulating layer is provided with a via hole for conducting the Y-axis electrode wiring and the X-axis electrode wiring,
The via hole is formed so as to penetrate in the thickness direction of the first insulating layer so as to electrically connect the Y-axis electrode wiring and the X-axis electrode wiring, and the upper end is open to the lower surface of the X- Open to the upper surface of the soccer electrode wiring,
The thickness of the Y-axis electrode wiring and the thickness of the X-axis electrode wiring are respectively 3 to 10 micrometers (占 퐉), the width of the Y-axis electrode wiring and the width of the X- Wherein the copper nanoparticles are prepared by pyrolyzing a copper formate-amine complex to have an average particle size of 50 to 150 nanometers (nm) so as to secure the thickness and the width,
Wherein the binder comprises 1 to 3% by weight of urethane and 5 to 7% by weight of acrylic in admixture with the copper nanoink for low temperature sintering.

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