KR101724214B1 - Single crystal ingot growing apparatus - Google Patents
Single crystal ingot growing apparatus Download PDFInfo
- Publication number
- KR101724214B1 KR101724214B1 KR1020150174986A KR20150174986A KR101724214B1 KR 101724214 B1 KR101724214 B1 KR 101724214B1 KR 1020150174986 A KR1020150174986 A KR 1020150174986A KR 20150174986 A KR20150174986 A KR 20150174986A KR 101724214 B1 KR101724214 B1 KR 101724214B1
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- South Korea
- Prior art keywords
- magnetic field
- coils
- change
- single crystal
- field coils
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/20—Controlling or regulating
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02598—Microstructure monocrystalline
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
The present invention relates to a monocrystalline ingot growing apparatus capable of detecting changes in magnetic field distribution before and after a single crystal ingot growing step and controlling the magnetic field distribution to be eliminated.
In general, a single crystal ingot used as a material for producing electronic parts such as semiconductors is manufactured by Czochralski (hereinafter referred to as CZ) method.
A method of producing a single crystal ingot using the CZ method is a method of manufacturing a single crystal ingot by filling a quartz crucible with a solid raw material such as poly silicon and heating it with a heater to form a silicon melt, The bubbles in the silicon melt are removed, and then a necking process, a shouldering process, a body growth process, and a tailing process are sequentially performed.
Of course, in the CZ method, natural convection occurs in the silicon melt because the silicon melt is heated using a heater provided on the side of the crucible.
In addition, since the rotational speed of the single crystal or the quartz crucible is adjusted to obtain a defect-free high-quality silicon single crystal due to vacancy or self-interstitial, Convection also occurs.
Natural convection and forced convection of the silicon melt are controlled by a method of suppressing the convection of the silicon melt in the vertical direction by applying a horizontal magnetic field.
However, due to the asymmetrical convection distribution of the silicon melt, a relatively temperature difference occurs on the surface of the silicon melt, and the oxygen concentration distribution at the silicon solid-liquid interface can not be maintained constant due to such temperature difference, have.
Therefore, it is important to control the magnetic field distribution before proceeding with the single crystal ingot growing process in order to stabilize the flow of the silicon melt and to control the quality such as oxygen concentration.
FIG. 1 is a plan view showing the structure of magnetic field coils applied to a monocrystalline ingot growing apparatus according to the prior art, and FIG. 2 is a diagram showing an initial magnetic field measuring apparatus applied to a monocrystalline ingot growing apparatus according to the prior art.
1, a conventional single crystal ingot growing apparatus is provided with a chamber C for providing a space in which a single crystal ingot growing process is performed, and four
Accordingly, when the
Of course, when the magnetic field distribution is set in advance to improve the quality of the ingot, the current supplied to the magnetic field coils (1, 2, 3, 4) is also set accordingly, .
When the chamber C is assembled inside the
Therefore, as shown in FIG. 2, a magnetic field distribution is measured by mounting a jig having a grid shape in a state where only the magnetic field coils (1, 2, 3, 4) are installed.
However, according to the related art, there are various factors such as a change in the current supplied to the magnetic field coil, a magnetic field interference caused by other magnets, a minute change in magnetic field coil or part, There is a problem that it is difficult to periodically measure the fluctuation.
In addition, according to the related art, even when a change in the magnetic field distribution is detected, since the current flows in only one direction due to the structure in which the magnetic field coils are connected to each other, it is difficult to precisely control the respective directional components of the magnetic field, There is a problem that appears.
Disclosure of Invention Technical Problem [8] Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and it is an object of the present invention to provide a single crystal ingot growing apparatus capable of detecting changes in magnetic field distribution before and after a single crystal ingot growing step, It has its purpose.
The present invention provides a method of manufacturing a silicon single crystal ingot, comprising: a chamber for providing a space for growing a single crystal ingot from a silicon melt; A plurality of magnetic field coils positioned around the chamber at regular intervals and forming a magnetic field distribution; A plurality of current supply units for applying respective currents to the magnetic field coils; And a magnetic field sensing unit that is insertable between the chamber and the magnetic field coils and senses a change in a magnetic field distribution. The magnetic field sensing unit senses a change in the magnetic field distribution, Or varying the respective currents applied to the magnetic field coils.
delete
In the single crystal ingot growing apparatus according to the present invention, each of the magnetic field coils is supplied with a current by each of the current supplying units to form a magnetic field distribution. The magnetic field distribution sensing unit detects a change in the magnetic field distribution before and after the single crystal ingot growing step Further, the height of the magnetic field coils can be adjusted so as to eliminate the change in the magnetic field distribution, or the current supplied to each magnetic field coil can be varied.
Therefore, the initial magnetic field distribution is maintained as it is during the growth of the single crystal ingot, thereby stabilizing the flow of the silicon melt and controlling the oxygen concentration, thereby reducing the quality fluctuation of the single crystal ingot.
1 is a plan view showing the structure of magnetic field coils applied to a single crystal ingot growing apparatus according to the related art.
2 is a view showing an initial magnetic field measuring apparatus applied to a single crystal ingot growing apparatus according to the prior art.
3 is a side cross-sectional view illustrating a single crystal ingot growing apparatus according to the present invention.
4 is a plan view showing the structure of magnetic field coils applied to the single crystal ingot growing apparatus according to the present invention.
5 is a side view showing a magnetic field sensing unit applied to the single crystal ingot growing apparatus according to the present invention.
6 is a flowchart showing a method of correcting a magnetic field of a single crystal ingot growing apparatus according to the present invention.
Hereinafter, the present embodiment will be described in detail with reference to the accompanying drawings. It should be understood, however, that the scope of the inventive concept of the present embodiment can be determined from the matters disclosed in the present embodiment, and the spirit of the present invention possessed by the present embodiment is not limited to the embodiments in which addition, Variations.
FIG. 3 is a side sectional view showing a single crystal ingot growing apparatus according to the present invention, and FIG. 4 is a plan view showing a structure of magnetic field coils applied to the single crystal ingot growing apparatus according to the present invention.
3, the single crystal ingot growing apparatus includes a
The
Therefore, when the polycrystalline silicon is injected into the
The
Further, as the height of the
The
At this time, the
Of course, the magnitude of the magnetic field generated by the
The magnetic
In the embodiment, the magnetic
5 is a side view showing a magnetic field sensing unit applied to the single crystal ingot growing apparatus according to the present invention.
The magnetic
The
Of course, the
The
In the embodiment, the
The
The power transmission means 144 is provided between the
4) and the
Of course, before or after the monocrystalline ingot growing step proceeds, it is possible to detect the change in the magnetic field distribution.
Therefore, when the change in Bz is indicated, the vertical coils of the
In the embodiment, when the change of Bz is indicated, the
Further, when the change of Bx and By is shown, the respective currents applied to the
In the embodiment, in order to form a magnetic field distribution in a direction opposite to the change of Bx and By when the change of Bx and By is shown, the
6 is a flowchart showing a magnetic field correction method of the single crystal ingot growing apparatus according to the present invention.
The magnetic field correction method of the single crystal ingot growing apparatus of the present invention is characterized in that when the initial magnetic field and the corresponding current value are set before the ingot growth as shown in FIG. 6, the actual magnetic field distribution is measured at various points of the maximum magnetic field position (Refer to S1)
Next, the current magnetic field distribution after ingot growth is measured equally at one point of the maximum magnetic field position (MGP) (see S2).
Of course, the magnetic field distribution before and after the ingot growth is measured as a vector component representing both the magnitude and direction of the magnetic field, and can be expressed as Bx, By, Bz.
However, as the ingot growth process proceeds, the magnetic field distribution can be changed by various factors described above.
Therefore, it is determined whether or not the magnetic field distribution changes at one point of the maximum magnetic field position MGP before and after the ingot growth (see S3).
First, if there is no change in the magnetic field distribution, the magnetic field distribution change is determined again by changing the magnetic field measurement position to another point of the maximum magnetic field position MGP (see S4).
However, if there is a change in the magnetic field distribution, control is performed so as to eliminate the change in accordance with the Bx, By, and Bz components.
At this time, if there is a Bz component change, the up / down coils of the magnetic field coils are changed to the point where there is no Bz component change (refer to S5 and S6)
Further, if there is a change in the Bx and By components, the current values applied to the magnetic field coils are varied so that the Bx and By component variations are canceled (see S7 and S8)
As described above, the initial magnetic field distribution is maintained as it is during the growth of the monocrystalline ingot repeatedly grown, so that the flow of the silicon melt can be stabilized and the oxygen concentration can be controlled, thereby reducing fluctuations in the quality of the single crystal ingot.
110:
131, 132, 133, 134: current supply units 140:
141: Guide 142: Sensor
143: motor 144: power transmission means
Claims (11)
A plurality of magnetic field coils positioned outside the chamber at regular intervals and forming a magnetic field distribution;
A plurality of current supply units for applying respective currents to the magnetic field coils; And
And a magnetic field sensing unit located between the chamber and the magnetic field coils and sensing a change in the magnetic field distribution,
Wherein the magnetic field sensing unit comprises:
A shaft-shaped guide inserted vertically into a space between the chamber and the magnetic field coils and positioned so as to include a maximum magnetic field position of the magnetic field coils,
A sensor installed in the guide for measuring the magnitude and direction of the magnetic field,
And a motor provided at an upper side of the guide and providing a driving force for the sensor to ascend and descend along the guide,
In order to eliminate a change in the magnetic field distribution sensed by the magnetic field sensing unit,
The height of the magnetic field coils may be varied in the vertical direction,
And varying each current applied to the magnetic field coils.
Wherein the magnetic field sensing unit comprises:
In the Maximum Gauss Plane (MGP), the change of the current magnetic field distribution is detected as a vector component based on the initial magnetic field distribution,
Wherein Bx and By are magnetic field components in the X and Y axis directions orthogonal to each other in a horizontal plane passing through the centers of the magnetic field coils and Bz which is a magnetic field component in the Z axis direction located on the central axis of the chamber.
And the elevation of the magnetic field coils is adjusted so as to eliminate the change of Bz.
And each of the currents applied to the magnetic field coils is adjusted so as to eliminate the change of Bx and By.
Wherein the magnetic field coils comprise four superconducting coils arranged at regular intervals around the chamber,
Wherein the current supplying portions comprise four current supplying portions for supplying current to the respective magnetic field coils.
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KR1020150174986A KR101724214B1 (en) | 2015-12-09 | 2015-12-09 | Single crystal ingot growing apparatus |
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KR1020150174986A KR101724214B1 (en) | 2015-12-09 | 2015-12-09 | Single crystal ingot growing apparatus |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113638037A (en) * | 2020-05-11 | 2021-11-12 | 西安奕斯伟材料科技有限公司 | Single crystal furnace and preparation method of monocrystalline silicon |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001302393A (en) | 2000-04-26 | 2001-10-31 | Mitsubishi Electric Corp | Device for pulling silicon single crystal |
JP2004189559A (en) * | 2002-12-12 | 2004-07-08 | Sumitomo Mitsubishi Silicon Corp | Single crystal growth method |
KR100793950B1 (en) | 2005-07-27 | 2008-01-16 | 주식회사 실트론 | Silicon single crystal ingot and manufacturing method thereof |
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- 2015-12-09 KR KR1020150174986A patent/KR101724214B1/en active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001302393A (en) | 2000-04-26 | 2001-10-31 | Mitsubishi Electric Corp | Device for pulling silicon single crystal |
JP2004189559A (en) * | 2002-12-12 | 2004-07-08 | Sumitomo Mitsubishi Silicon Corp | Single crystal growth method |
KR100793950B1 (en) | 2005-07-27 | 2008-01-16 | 주식회사 실트론 | Silicon single crystal ingot and manufacturing method thereof |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113638037A (en) * | 2020-05-11 | 2021-11-12 | 西安奕斯伟材料科技有限公司 | Single crystal furnace and preparation method of monocrystalline silicon |
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