KR101717768B1 - 부품 결함 검사 방법 및 그 장치 - Google Patents

부품 결함 검사 방법 및 그 장치 Download PDF

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Publication number
KR101717768B1
KR101717768B1 KR1020150086184A KR20150086184A KR101717768B1 KR 101717768 B1 KR101717768 B1 KR 101717768B1 KR 1020150086184 A KR1020150086184 A KR 1020150086184A KR 20150086184 A KR20150086184 A KR 20150086184A KR 101717768 B1 KR101717768 B1 KR 101717768B1
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South Korea
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dimensional
image
defect
component
free
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KR1020150086184A
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English (en)
Korean (ko)
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KR20160149106A (ko
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윤준혁
김규년
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주식회사 쓰리디산업영상
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Priority to KR1020150086184A priority Critical patent/KR101717768B1/ko
Priority to PCT/KR2016/004634 priority patent/WO2016204402A1/fr
Publication of KR20160149106A publication Critical patent/KR20160149106A/ko
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Publication of KR101717768B1 publication Critical patent/KR101717768B1/ko

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • G01N23/043—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material using fluoroscopic examination, with visual observation or video transmission of fluoroscopic images
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/03—Investigating materials by wave or particle radiation by transmission
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/10—Different kinds of radiation or particles
    • G01N2223/101—Different kinds of radiation or particles electromagnetic radiation
    • G01N2223/1016—X-ray
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/40—Imaging
    • G01N2223/401—Imaging image processing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/40—Imaging
    • G01N2223/408—Imaging display on monitor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/40—Imaging
    • G01N2223/41—Imaging imaging specifically internal structure
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/40—Imaging
    • G01N2223/414—Imaging stereoscopic system
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/40—Imaging
    • G01N2223/42—Imaging image digitised, -enhanced in an image processor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/646—Specific applications or type of materials flaws, defects

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  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Radiology & Medical Imaging (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
KR1020150086184A 2015-06-17 2015-06-17 부품 결함 검사 방법 및 그 장치 KR101717768B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020150086184A KR101717768B1 (ko) 2015-06-17 2015-06-17 부품 결함 검사 방법 및 그 장치
PCT/KR2016/004634 WO2016204402A1 (fr) 2015-06-17 2016-05-03 Procédé d'inspection de défaut de composant, et appareil associé

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150086184A KR101717768B1 (ko) 2015-06-17 2015-06-17 부품 결함 검사 방법 및 그 장치

Publications (2)

Publication Number Publication Date
KR20160149106A KR20160149106A (ko) 2016-12-27
KR101717768B1 true KR101717768B1 (ko) 2017-03-27

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KR1020150086184A KR101717768B1 (ko) 2015-06-17 2015-06-17 부품 결함 검사 방법 및 그 장치

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Country Link
KR (1) KR101717768B1 (fr)
WO (1) WO2016204402A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10679336B2 (en) 2018-01-25 2020-06-09 Samsung Electronics Co., Ltd. Detecting method, detecting apparatus, and computer readable storage medium

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3814758A1 (fr) 2018-06-29 2021-05-05 Universiteit Antwerpen Inspection d'article par sélection dynamique d'angle de projection
KR102075872B1 (ko) * 2019-08-09 2020-02-11 레이디소프트 주식회사 투과영상 기반의 비파괴검사 방법 및 이를 위한 장치
KR102249836B1 (ko) * 2019-08-26 2021-05-10 레이디소프트 주식회사 투과영상 기반의 비파괴검사 기능을 제공하기 위한 방법 및 컴퓨터 판독 가능한 저장 매체
WO2021029625A1 (fr) * 2019-08-09 2021-02-18 레이디소프트 주식회사 Procédé d'inspection non destructive à base d'image de transmission, procédé de fourniture d'une fonction d'inspection non destructive, et dispositif associé
KR102415928B1 (ko) * 2019-08-26 2022-07-05 레이디소프트 주식회사 투과영상 기반의 비파괴검사 방법
KR102616867B1 (ko) * 2021-04-20 2024-01-03 레이디소프트 주식회사 비파괴검사 방법
CN114460093B (zh) * 2022-01-29 2024-05-28 新拓三维技术(深圳)有限公司 一种航空发动机缺陷检测方法及系统

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100942379B1 (ko) * 2009-06-30 2010-02-12 한국전력공사 3차원 레이저 스캐너를 이용한 전력구 결함 탐사장치 및 방법
KR101094412B1 (ko) 2011-05-23 2011-12-15 주식회사 쓰리디산업영상 3차원 영상 기반 ｂｇａ 칩의 볼 접합 부위 결함 검출 방법
KR101125109B1 (ko) * 2010-04-29 2012-03-21 주식회사 쓰리디산업영상 레퍼런스 정보를 이용한 부품의 내부 결함 검사 방법 및 그 시스템
KR101293532B1 (ko) 2011-05-12 2013-08-07 주식회사 쎄크 반도체칩의 ｃｔ 검사방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003510568A (ja) * 1999-09-20 2003-03-18 松下電器産業株式会社 パターン比較によるｌｃｄ検査方法およびｌｃｄ検査装置
US20020146120A1 (en) * 2001-04-05 2002-10-10 Hugh Anglin Inspecting print quality using digital watermarks
KR20150056148A (ko) 2013-11-15 2015-05-26 (주)자비스 검사 효율이 향상된 엑스레이 검사 장치 및 엑스레이 검사 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100942379B1 (ko) * 2009-06-30 2010-02-12 한국전력공사 3차원 레이저 스캐너를 이용한 전력구 결함 탐사장치 및 방법
KR101125109B1 (ko) * 2010-04-29 2012-03-21 주식회사 쓰리디산업영상 레퍼런스 정보를 이용한 부품의 내부 결함 검사 방법 및 그 시스템
KR101293532B1 (ko) 2011-05-12 2013-08-07 주식회사 쎄크 반도체칩의 ｃｔ 검사방법
KR101094412B1 (ko) 2011-05-23 2011-12-15 주식회사 쓰리디산업영상 3차원 영상 기반 ｂｇａ 칩의 볼 접합 부위 결함 검출 방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10679336B2 (en) 2018-01-25 2020-06-09 Samsung Electronics Co., Ltd. Detecting method, detecting apparatus, and computer readable storage medium

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WO2016204402A1 (fr) 2016-12-22
KR20160149106A (ko) 2016-12-27

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