KR101705990B1 - Method for fabricating polymer structure and method for fabricating structure with a micro-pattern using the same - Google Patents

Abstract

The present invention relates to a method for fabricating a polymer structure and a method for fabricating a structure having micro-patterns formed thereon using the polymer structure, wherein the method for fabricating a structure having micro-patterns formed thereon comprises the steps of: preparing a structure mold patterned with an embossed portion and an engraved portion; subjecting the prepared structure mold to hydrophobic treatment and hydrophilic treatment; applying a fluid polymer solution on an upper part of the structure mold undergone the hydrophobic treatment and hydrophilic treatment to fill the engraved portion with a first polymer; bringing the upper part of the structure mold filled with the first polymer in contact with a substrate and curing the first polymer while applying pressure to the substrate; and separating the substrate from the structure mold to produce a first polymer structure having a first polymer pattern at the upper part of the substrate. Accordingly, the present invention can fabricate a polymer structure having micro-patterns.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a polymer structure and a method of manufacturing a structure having a fine pattern using the polymer structure,

The present invention relates to a method of manufacturing a polymer structure capable of forming a polymer material pattern on a substrate using a structural mold having a predetermined pattern, and a method of manufacturing a structure having a fine pattern formed using the polymer structure.

As is well known, when a semiconductor, an electron, a photoelectric field, a magnet, a display device, a microelectromechanical device, or the like is manufactured, a process of forming a fine pattern on a substrate is inevitably performed. There is a photolithography process in which fine patterns are formed by using light.

Such a photolithography process is performed by applying a polymer material (for example, a photoresist or the like) having reactivity to light onto a substrate on which a material to be patterned is laminated (or vapor-deposited), and a reticle designed with a desired arbitrary pattern A pattern mask (or an etching mask) having a target pattern is formed on the material to be patterned by removing the exposed polymer material through a development process.

Thereafter, by performing an etching process using a pattern mask, the material deposited on the substrate is patterned into a desired pattern.

Since the above-described photolithography process determines an ultrafine pattern (for example, an ultrafine pattern having a line width of 100 nm or less) on the substrate because the circuit line width (or pattern line width) is determined by the wavelength of light used in the exposure process, It is very difficult to form the film.

In order to form a nanometer-scale fine pattern, new researches are being carried out to replace the photolithography process. Although etch processes using electron beams and X-rays are being studied, there is a problem that a long process time and a high cost are required Therefore, it is very difficult to apply to mass production.

In recent years, researches are being conducted to improve productivity by replicating patterns by using a nanoimprint process, and it is possible to manufacture nanostructures very economically and effectively.

The nanoimprint process is classified into two types. First, the stamp stamped with the nanostructures is spin-coated on the substrate or pressed on the surface of the dispensed liquid material to solidify the liquid material, and then the stamp is separated from the coagulated material The second is a hot embossing nanoimprint lithography process. The nano-imprinted lithography process is used to stamp a resist of a polymer material, which is previously coated with a stamp in the form of a nano-sized pattern, in a desired form, to a temperature higher than the glass transition temperature And then pressed at high pressure to be stamped and cooled again to separate the stamp from the plastic deformation resist.

On the other hand, in order to form a fine pattern, a polymeric material for pattern is coated on the surface of the mold using a polymeric elastomer, and then directly printed on the surface of the secondary substrate to form a desired pattern on the secondary substrate, And a method of forming a reversed phase pattern on a secondary substrate by transferring the material coated on the mold in its entirety.

However, a problem with various techniques studied as described above is that the microstructures are overlapped due to the surface tension, the structure uniformity is lowered, or the transferred microstructure can not form an independent structure, and the remaining hardening Since the microstructure is formed on the film, it is necessary to remove the remaining cured film until the surface of the substrate is exposed by performing an additional etching process. Therefore, a great deal of time and cost is required, and furthermore, There is a problem that it is difficult to implement a precise structure.

1. Registration No. 10-0568581 (registered on March 31, 2006): a composition for a fine pattern forming mold and a mold made therefrom

As a constitution of the present invention, hydrophobic treatment (or polymer non-affinity treatment) is carried out with a hydrophobic substance (or a polymer non-affinity substance) of the embossed portion of the structure mold, and a depressed portion of the structure mold is treated with a hydrophilic substance After the hydrophilic treatment (or polymer affinity treatment) is performed, the polymeric material is transferred onto the substrate surface by filling the fluidic polymer material, contacting and pressing and curing the substrate thereon, and separating the structural mold, The present invention relates to a method for producing a polymer structure which does not require an etching process and which can prevent damage to a microstructure due to the additional etching process and can improve productivity in terms of time and cost, To provide a method of manufacturing a patterned structure.

In another aspect of the present invention, there is provided a method of manufacturing a structure, comprising the steps of: coating a structural mold with a fluid polymeric material; etching the fluidic polymeric material to an upper portion of a relief portion of the structural mold; patterning the fluidic polymeric material; A polymer structure having no residual film can be easily formed while forming a polymer fine pattern on a substrate and thereby productivity can be improved in terms of time and cost, and a method of manufacturing a polymer structure using the polymer structure To provide a method of manufacturing a patterned structure.

Further, as another constitution of the present invention, the surface of the structural mold is treated with a semi-hydrophilic treatment (or a semi-polymer affinity treatment) with a semi-hydrophilic substance (or a semi-polymer affinity substance) The substrate is contacted, pressed and cured on top of the fluidic polymer material, the structure mold is separated, and the minimized residual engraved portion of the transferred polymer material on the substrate is selectively etched, A method of manufacturing a polymer structure capable of easily producing a polymer structure having no residual film while forming a polymer fine pattern on the polymer structure and improving productivity in terms of time and cost, and a method of manufacturing a structure having a fine pattern using the polymer structure .

The objects of the embodiments of the present invention are not limited to the above-mentioned objects, and other objects not mentioned can be clearly understood by those skilled in the art from the following description .

According to a first aspect of the present invention, there is provided a method of manufacturing a structure, comprising the steps of: preparing a structural mold having an embossed portion and an engraved portion patterned thereon; subjecting the prepared structural mold to a hydrophobic treatment and a hydrophilic treatment; Filling the recessed portion with a first polymer, contacting the upper portion of the structural mold filled with the first polymer with the substrate, and curing the first polymer while pressing the substrate, And separating the substrate from the structural mold to produce a first polymer structure having a first polymer pattern formed on the substrate.

According to a second aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising the steps of preparing a structural mold having an embossed portion and an engraved portion patterned thereon, and applying a fluid polymer solution to an upper portion of the prepared structural mold, Forming a first polymer layer on the substrate, removing the first polymer layer until the relief portion is exposed, removing the first polymer layer and removing the structure mold, And curing the first polymer while pressurizing the polymer structure, and separating the substrate from the structural mold to produce a first polymer structure having a first polymer pattern formed on the substrate, Can be provided.

According to a third aspect of the present invention, there is provided a method of manufacturing a structure, comprising the steps of: preparing a structural mold having an embossed portion and an engraved portion patterned; Forming a first polymer layer on the upper portion of the first polymer layer by applying a fluid polymer solution after the first polymer layer is filled with the first polymer, The method comprising the steps of: curing the first polymer while pressurizing the substrate; separating the substrate from the structural mold to produce a first polymer structure having a first polymer pattern formed on the first polymer layer; The second polymer structure having the first polymer pattern formed on the substrate by etching until the substrate is exposed, A method for producing a polymer structure including the step of producing a polymer structure may be provided.

According to a fourth aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: forming a metal or metal oxide fine pattern having the first polymer pattern or a reversed phase pattern corresponding to the first polymer pattern using the polymer structure A method of manufacturing a structure in which a fine pattern is formed using a polymer structure including the step of forming a fine pattern can be provided.

According to a fifth aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: preparing a structural mold having an embossed portion and an engraved portion patterned; applying a fluid polymer solution to an upper portion of the prepared structural mold to fill the recessed portion with a polymer; Forming a polymer layer on the substrate; contacting the substrate with the structure mold on which the polymer layer is formed; curing the polymer while pressurizing the contacted substrate; separating the substrate from the structure mold, And forming a polymer pattern on the substrate by etching until the substrate is exposed until the substrate is exposed, thereby forming a fine structure using the polymer structure. A method of manufacturing a patterned structure can be provided.

The present invention is capable of patterning various structures up to connected patterns as well as connected patterns because previous patterning and etching processes are unnecessary or minimized, unlike conventional techniques, and when applied to a large area structure, It is possible to remarkably reduce the pattern precision due to repetition of the patterning process and to easily form a polymer structure having no residual film while forming a fine pattern on the upper surface of the fluid polymer material, Can be improved.

In addition, the present invention is characterized in that defects such as bubbles generated in a process of separating from a structural mold in contact with a liquid polymeric material, bubbles generated before a liquid polymeric material comes into contact with a substrate after curing, It is possible to fabricate a defect-free structure in a wider area, and it is possible to fabricate a structure with a width of several nm to several mm without a structural defect in a very small line width but in a wide range. It is possible to easily manufacture a high aspect ratio structure having a large aspect ratio and it is possible to reduce the manufacturing facility cost and shorten the processing time because expensive equipment such as a vacuum chamber and a high pressure stage used in the past is not required can do.

That is, in the non-vacuum environment, air bubbles are generated in the final pattern due to the inflow of air during the process. After the surface selective treatment of the substrate to adjust the tension with the substrate, a liquid polymer material is applied The microstructures are filled and then the substrate is brought into contact with the microstructures, the flow is not induced on the structural mold and the polymer material. Therefore, the probability of occurrence of defects is greatly reduced. Thus, the line width is extremely small, nm to several mm can be realized, and a polymer structure having a large aspect ratio in which a fine pattern is formed can be easily manufactured.

1A to 1G are views illustrating a process of fabricating a polymer structure according to a first embodiment of the present invention,
FIGS. 2A to 2H are views illustrating a process of fabricating a polymer structure according to a second embodiment of the present invention,
3A to 3G are views illustrating a process of fabricating a polymer structure according to a third embodiment of the present invention,
4 is a view illustrating a process of fabricating a structure having a fine pattern using a polymer structure according to a fourth embodiment of the present invention,
5 is a view illustrating a process of fabricating a structure having fine patterns formed using a polymer structure according to a fifth embodiment of the present invention,
6 is a view illustrating a process of fabricating a structure having fine patterns formed using a polymer structure according to a sixth embodiment of the present invention,
7 is a view illustrating a process of fabricating a micropattern structure using a polymer structure according to a seventh embodiment of the present invention.

Advantages and features of embodiments of the present invention and methods of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. The following terms are defined in consideration of the functions in the embodiments of the present invention, which may vary depending on the intention of the user, the intention or the custom of the operator. Therefore, the definition should be based on the contents throughout this specification.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

First, a process of manufacturing a structural mold used in various embodiments of the present invention will be described. A substrate using silicon, glass, quartz or the like is cleaned, an antireflection film is formed on the substrate, The resist layer can be formed by a method such as spin coating.

After the photoresist layer is patterned through the photolithography process, the antireflection film and the substrate are removed through dry etching or wet etching to form the structural mold.

1A to 1G are views illustrating a process of fabricating a polymer structure according to a first embodiment of the present invention.

First, as shown in FIG. 1A, a structure mold 110 having a reverse pattern corresponding to a desired pattern is prepared, and a hydrophobic structure is formed on the upper portion of the convex relief portion of the structure mold 110 prepared as shown in FIG. After hydrophobic treatment (or polymer non-affinity treatment) for maximizing interfacial energy using a substance (or a polymer non-affinity substance), a hydrophilic substance (or a polymer affinity substance) A hydrophilic treatment (or a polymer affinity treatment) may be performed for minimization.

Here, the structure mold 110 may be a surface-selective replication polymer mold made from a master mold produced by a photolithography process, an electron beam lithography process, a machining process, or the like.

Examples of the hydrophobic substance (or polymer non-affinity substance) for hydrophobic treatment (or polymer non-affinity treatment) include polytetrafluoroethylene (PTFE), tetrafluoroethylene hexafluoropropylene copolymer (FEP), ethylene tetra At least one selected from the group consisting of fluoroethylene copolymer (ETFE), ethylene tetrafluoroethylene copolymer (ETFE), perfluoropolyether (PFPA) and perfluoroalkoxy polymer (PFA).

Such a hydrophobic treatment (or polymer non-affinity treatment) may employ a plasma induced surface bonding method using a hydrophobic substance (or a polymer non-affinity substance) as described above.

In the case of a hydrophilic substance (or a polymer affinity substance) for a hydrophilic treatment (or a polymer affinity treatment), as in the case of a cation, an oxygen moiety of a water molecule and, in the case of an anion, -NH2, and the like, at least one selected from the group consisting of polyimide, polyamide, nylon, polyvinyl alcohol, and polyethyleneimine can be selected.

Such a hydrophilic treatment (or polymer affinity treatment) may be a plasma induced surface bonding method using a hydrophilic substance (or a polymer affinity substance) as described above together with a plasma gas such as oxygen, argon, nitrogen and the like.

1C, the fluid polymer solution 120 is applied to the upper part of the structure mold 110, and then the spin polymer is applied to the interior of the structure mold 110 to form a fluid polymer solution 120 As shown in FIG. 1D, the polymer material 120a can be filled and formed in the recessed portion of the structural mold 110.

Here, the fluid polymer solution may be prepared by using a solution selected from a natural curable polymer, an evaporation-curable polymer, a thermosetting polymer, and a photo-curable polymer, or a polymer selected from a natural curable polymer, an evaporative curable polymer, a thermosetting polymer and a photo- A solution in which the same solid components are mixed can be used.

The flowable polymer may be at least one selected from the group consisting of acrylic, polyfunctional (meth) acrylate and epoxy polymers, and the polymer curing conditions may be selected depending on the heat initiator or the photo initiator.

Examples of the monomer of the acrylic resin include butyl acrylate, 2-ethylhexyl acrylate, acrylic acid, 2-hydroxyethyl (meth) acrylate, methyl (meth) acrylate, styrene monomer, glycidyl At least one selected from the group consisting of isopropyl acrylate, isooctyl acrylate, stearyl methacrylate, dodecyl acrylate, decyl acrylate, vinyl acetate and acrylonitrile may be used.

The polyfunctional urethane (meth) acrylate can be produced by reacting a (meth) acrylate having a hydroxy group with a trifunctional isocyanate. The trifunctional isocyanate includes trifunctional isocyanate derived from hexamethylene diisocyanate, isophorone di At least one compound selected from the group consisting of trifunctional isocyanate derived from isocyanate or trimethane propanol adduct toluene diisocyanate can be used.

On the other hand, the (meth) acrylate having a hydroxy group is preferably selected from the group consisting of 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate or caprolactone- (Meth) acrylate can be used.

Examples of the epoxy resin include bisphenol A type, bisphenol F type, bisphenol S type, brominated bisphenol A type, hydrogenated bisphenol A type, bisphenol AF type, biphenyl type, naphthalene type, fluorene type, phenol novolak type, At least one selected from bifunctional epoxy resins such as orthocresol novolak type, trishydroxyphenylmethane type and tetraphenylol ethane type, polyfunctional epoxy resin, trisglycidyl isocyanurate type and glycidyl amine type Can be used.

Further, at the time of heating, zero may be added to the reaction mixture in the presence of a catalyst such as dicumyl peroxide, t-butyl cumyl peroxide, bis (t-butylperoxy-isopropyl) benzene, di- Dihydroperoxide, 2,5-dimethylhexyne-3,2,5-dihydroperoxide, dibenzoylperoxide, bis- (2,4-dichlorobenzoyl) peroxide, t-butylperbenzoate, etc. Azo compounds such as azo-bis-isobutyronitrile and azo-bis-cyclohexanenitrile, dimercaptoethane, 1,6-dimercaptohexane, 1,3,5-trimercaptotriazine and the like At least one selected from the group consisting of dimercapto and polymercapto compounds.

Examples of the photoinitiator include 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropanone-1, diphenyl ketone, benzyldimethyl ketal, 2- -1-one, 4-hydroxycyclophenyl ketone can be used.

In order to maximize the interfacial energy, the fluidic polymer solution 120 is not deposited on the upper portion of the embossed portion subjected to the hydrophobic treatment. In order to minimize the interfacial energy, So that the polymer material 120a can be formed.

In the first embodiment of the present invention, the fluidic polymer solution 120 is coated and then spin-coated to fill the depressed portion of the structural mold 110. However, when the fluidic polymer solution 120 is dropped, It is needless to say that the flowable polymer solution 120 can be filled in the recessed portion of the structural mold 110 by using a dropping, printing, or spraying method.

 Next, the upper surface of the structural mold 110 on which the polymer material 120a is formed is brought into contact with the substrate 130, and ultraviolet (UV) light is applied while the pressure P is applied to the entire structure as shown in FIG. The polymer material 120a can be bonded to the substrate 130 while curing the polymer material 120a.

Here, the substrate 130 may use one selected from silicon, metal, polymer, glass, and oxide.

In the meantime, in the first embodiment of the present invention, when the polymer material is photo-curable, ultraviolet light (UV) in the ultraviolet wavelength region is irradiated. However, when the polymer material is thermosetting, And in the case of an evaporation-setting or natural-setting substance, it can be cured by evaporation of the solvent or elapse of time.

1F, when the polymeric material 120a filled between the substrate 130 and the structural mold 110 is solidified to form the polymeric pattern 120b, the structural mold 110 is removed from the substrate 130, The polymer structure having the polymer pattern 120b formed on the substrate 130 without the residual film as shown in FIG. 1G can be manufactured.

Accordingly, the present invention is characterized in that the embossed portion of the structural mold is subjected to a hydrophobic treatment (or polymer non-affinity treatment) with a hydrophobic substance (or a polymer non-affinity substance) and a hydrophilic substance (or a polymer affinity substance) (Or polymer affinity treatment), then filling the fluid polymeric material, contacting and pressing and curing the substrate thereon, and separating the structural mold, when the polymeric material is transferred to the substrate surface, an additional residual film It does not require an etching process, prevents damage to the microstructure due to the additional etching process, and improves the productivity in terms of time and cost.

Next, unlike the first embodiment as described above, the hydrophobic treatment (or the polymer non-affinity treatment) and the hydrophilic treatment (or the polymer affinity treatment) are not performed on the embossed portion and the recessed portion of the structural mold, The second embodiment will be described.

2A to 2H are views illustrating a process of fabricating a polymer structure according to a second embodiment of the present invention.

2A, a structure mold 210 having a reverse pattern corresponding to a desired pattern is prepared, and a fluid polymer solution 220 is applied onto the structure mold 210 as shown in FIG. 2B As shown in FIG. 2C, the spin coating process may be performed to spin-coat the structure mold 210 with the flowable polymer solution 220 filled in the recessed portion of the structure mold 210, The polymer material 220a may be formed at a predetermined height on the upper surface of the embossed portion.

Here, the fluid polymer solution may be prepared by using a solution selected from a natural curable polymer, an evaporation-curable polymer, a thermosetting polymer, and a photo-curable polymer, or a polymer selected from a natural curable polymer, an evaporative curable polymer, a thermosetting polymer and a photo- A solution in which the same solid components are mixed can be used.

In the second embodiment of the present invention as described above, the polymeric material 220a is formed by applying the fluid polymeric solution 220 and then spin-coating the polymeric material 220a. However, when the flowable polymeric solution 220 is dropped, The polymeric material 220a may be formed using a printing method, a spray method, or the like.

2C, the upper portion of the polymeric material 220a is etched until the upper surface of the relief portion of the structure mold 210 is exposed, as shown in FIG. 2D, The polymeric material 220a may be formed only inside the depressed portion of the structural mold 210 as shown in FIG.

Next, after the polymer material 220a formed inside the engraved portion of the structure mold 210 is brought into contact with the substrate 230, ultraviolet light (UV) is applied while applying pressure as shown in FIG. 2F, The polymeric material 220a may be transferred to the substrate 230 while the polymeric material 220a is cured.

Here, the substrate 230 may be formed of one selected from silicon, metal, polymer, glass, and oxide.

Meanwhile, in the second embodiment of the present invention, when the polymer material is photo-curable, the ultraviolet (UV) light of ultraviolet wavelength band is irradiated. However, when the polymer material is thermosetting, And in the case of an evaporation-setting or natural-setting substance, it can be cured by evaporation of the solvent or elapse of time.

2G, by separating the structural mold 210 from the substrate 230, there is no residual film as shown in FIG. 2H, and a polymer pattern 220b is formed on the substrate 230 A polymer structure can be produced.

Accordingly, the present invention relates to a method for manufacturing a semiconductor device, which comprises coating a structural polymer with a fluid polymer material, etching the structure mold to the upper portion of the relief portion, patterning the fluid polymer material, contacting the structure with the substrate, It is possible to easily produce a polymer structure having no residual film while forming a polymer fine pattern on the substrate, thereby improving the productivity in terms of time and cost.

Next, unlike the first embodiment as described above, the hydrophilic treatment (or the polymer non-affinity treatment) and the hydrophilic treatment (or the polymer affinity treatment) are not performed on the embossed portion and the recessed portion of the structural mold, By making the entire surface semi-hydrophilic (or semi-polymer affinity-treated), polymeric structures transferred to the substrate are minimized and the additional etching process is also minimized to easily produce a polymer structure free from residual film The third embodiment will be described.

3A to 3G are views illustrating a process of fabricating a polymer structure according to a third embodiment of the present invention.

First, as shown in FIG. 3A, after preparing the structural mold 310 having a reverse pattern corresponding to a desired pattern, the surface of the structural mold 310 is treated with a semi-hydrophilic substance (or a semi-polymer affinity substance (Or semi-polymer affinity treatment) can be carried out using the above-mentioned hydrophilic / hydrophobic treatment process 310a.

A semi-hydrophilic treatment (or a semi-polymer affinity treatment) carried out using such a semi-hydrophilic substance (or a semi-polymer affinity substance) (Or polymer affinity treatment) method using a hydrophilic substance (or a polymer non-affinity substance) and a hydrophobic treatment (or a polymer affinity treatment method) using a hydrophilic substance (or a polymer non-affinity substance).

As shown in FIG. 3B, the fluid polymer solution 320 may be applied to the upper portion of the structure mold 310, and then the spin coating may be performed. The substrate 330 may be contacted with the upper surface of the structure 330, By disposing the substrate 330 on the upper portion of the fluid polymer solution 320, the fluid polymer solution 320 is filled in the recessed portion of the structure mold 210 as shown in FIG. 3C, The polymer material 320a may be formed.

Here, the fluid polymer solution may be prepared by using a solution selected from a natural curable polymer, an evaporation-curable polymer, a thermosetting polymer, and a photo-curable polymer, or a polymer selected from a natural curable polymer, an evaporative curable polymer, a thermosetting polymer and a photo- A solution in which the same solid components are mixed can be used.

In the third embodiment of the present invention as described above, the fluid polymer solution 320 is coated and then spin-coated to form the polymer material 320a. However, when the fluid polymer solution 320 is dropped, The polymer material 320a may be formed by using a spin coating method, a printing method, or a spray method.

In the third embodiment of the present invention as described above, the substrate 330 is contacted and the substrate 330 is disposed on the fluidic polymer solution 320 through the pressure rolling. However, , The surface pressing, or the like, and may be omitted depending on the degree of filling of the fluid polymer solution 320.

In the case where the substrate 330 is a flexible substrate, the substrate 330, which is wound on the rollers, may be formed on the upper part of the fluid polymer solution 320. For example, the substrate 330 may be formed of silicon, metal, When the substrate 330 is an inflexible substrate, the substrate 330 is disposed on the upper portion of the fluid polymer solution 320, and then the substrate 330 is pressurized using a roller, Of course.

3D, the polymer material 320a may be bonded to the substrate 330 while curing the polymer material 320a by irradiating ultraviolet rays (UV) while applying pressure P to the entire structure. have.

In the meantime, in the third embodiment of the present invention, when the polymer material is photo-curable, ultraviolet light (UV) in the ultraviolet region is irradiated. However, when the polymer material is thermosetting, And in the case of an evaporation-setting or natural-setting substance, it can be cured by evaporation of the solvent or elapse of time.

Subsequently, as shown in FIG. 3E, the structural mold 310 is detached from the substrate 330, and the minimized residual (not shown) is removed until the substrate 330 is exposed at the recessed portion of the polymer material 320a as shown in FIG. By etching the polymer material, a polymer structure having the polymer pattern 320b formed on the substrate 330 without the residual film as shown in FIG. 3G can be manufactured.

Thus, after the surface of the structural mold is treated with a semi-hydrophilic treatment (or a semi-polymer affinity treatment) with a semi-hydrophilic substance (or a semi-polymer affinity substance) And then the substrate is contacted, pressed and cured on the upper surface thereof, the structure mold is separated, and the minimized residual engraved portion of the polymer material transferred to the substrate is selectively etched to form a polymer fine pattern on the substrate, It is possible to easily produce a polymer structure free from a film, thereby improving the productivity in terms of time and cost.

In the first, second, and third embodiments as described above, the polymer structure is manufactured without forming additional films on the structural molds 110, 210, and 310. However, the substrate 130 (Au), platinum (Pt), nickel (Ni), copper (Cu), and aluminum (Al) as the release materials when the polymer materials 120a, 220a, and 230a are not transferred ), Zinc (Zn), iron (Fe), cobalt (Co), tungsten (W), tin (Sn), silver (Ag), titanium (Ti), tantalum ) May be deposited on the surface of the structure mold 110, 210, 310. The metal or metal oxide film may be deposited on the surface of the structure mold 110, 210,

Next, a fourth embodiment of manufacturing a secondary structure and a tertiary structure using the polymer structure manufactured through the first embodiment as described above and using the process of the first embodiment will be described.

4 is a view illustrating a process of fabricating a micro patterned structure using a polymer structure according to a fourth embodiment of the present invention.

Referring to FIG. 4, a second polymer material, which is a sacrificial layer, is coated on the upper surface of the polymer structure manufactured through the first embodiment as described above, and then the same is fabricated as in the first embodiment, (Brown pattern structure in Fig. 4), and an additional tertiary subsequent film (for example, a metal, a metal oxide , And then the second tertiary polymer pattern and the additional tertiary subsequent film (the red film structure shown in Fig. 4) are removed by a method such as lift-off or the like, (The final red film structure of FIG. 4).

Next, a fifth embodiment for manufacturing the secondary structure and the tertiary structure through the process of using the third embodiment as described above in the structural mold will be described.

5 is a view illustrating a process of fabricating a micro patterned structure using a polymer structure according to a fifth embodiment of the present invention.

Referring to FIG. 5, a first polymeric material, which is a sacrificial layer, is coated on a structural substrate and then deposited. Then, the first polymeric material is etched in the same manner as in the third embodiment, (A brown pattern structure in FIG. 5), and an additional secondary subsequent film (e.g., a metal, a metal oxide, or the like) is deposited over the independent primary polymer pattern (Fig. 5) by removing the second secondary subsequent film (the red film structure shown in Fig. 5) on the upper side with the first polymer pattern by a method such as lift-off, The structure of the final red film) can be manufactured.

Next, a sixth embodiment in which the polymer structure manufactured through the third embodiment as described above is used and the secondary structure and the tertiary structure are manufactured through the process using the first embodiment will be described.

6 is a view illustrating a process of fabricating a micropatterned structure using a polymer structure according to a sixth embodiment of the present invention.

Referring to FIG. 6, a tertiary structure film (for example, metal, metal oxide, or the like) is first deposited on a substrate on which a secondary structure as a sacrifice layer is to be patterned, A second polymeric material as a sacrificial layer is coated on the upper surface of the structure and deposited, and then an independent secondary polymer pattern (brown pattern structure of FIG. 6) can be manufactured as in the first embodiment as described above, After that, the exposed side of the tertiary structure film is removed through an additional etching process, and the remaining secondary polymer material is removed, so that an additional tertiary subsequent film (final red film structure of FIG. 6) structure can be produced.

Next, a seventh embodiment in which the secondary structure and the tertiary structure are manufactured through the process of using the third embodiment as described above in the structural mold will be described.

7 is a view illustrating a process of fabricating a micropattern structure using a polymer structure according to a seventh embodiment of the present invention.

Referring to FIG. 7, a secondary structure film (for example, metal, metal oxide, or the like) is first deposited on a substrate on which a primary structure as a sacrifice layer is to be patterned, a primary polymer material as a sacrifice layer is coated on the structure substrate After the deposition, an independent primary polymer pattern (brown pattern structure in FIG. 7) can be formed as in the third embodiment including the etching of the recessed portions of the primary structure film to the substrate surface, An additional secondary subsequent film (final red film structure of FIG. 7) structure can be prepared by removing the exposed side of the film of the structure through an additional etching process and then removing the remaining primary polymeric material.

On the other hand, when the above-described embodiment is applied, the secondary structure and the tertiary structure can be manufactured using the polymer structure manufactured through the second embodiment, and the tertiary structure film is first deposited on the substrate It goes without saying that the tertiary structure can be manufactured through the same processes as those of the first, second, and third embodiments as described above, and further by removing the etching process and the secondary structure.

Accordingly, unlike the conventional technique, the prior patterning and etching processes are unnecessary or minimized. Therefore, it is possible to pattern various structures such as connected patterns as well as connected patterns. When applied to a large-area structure, The cost can be drastically reduced and the pattern precision can be prevented from being lowered due to repetition of the patterning process and a polymer structure free from the residual film can be easily manufactured while forming a fine pattern on the upper surface of the fluid polymer material, The productivity can be improved.

In addition, the present invention is characterized in that defects such as bubbles generated in a process of separating from a structural mold in contact with a liquid polymeric material, bubbles generated before a liquid polymeric material comes into contact with a substrate after curing, It is possible to fabricate a defect-free structure in a wider area, and it is possible to fabricate a structure with a width of several nm to several mm without a structural defect in a very small line width but in a wide range. It is possible to easily manufacture a high aspect ratio structure having a large aspect ratio and it is possible to reduce the manufacturing facility cost and shorten the processing time because expensive equipment such as a vacuum chamber and a high pressure stage used in the past is not required can do.

That is, in the non-vacuum environment, air bubbles are generated in the final pattern due to the inflow of air during the process. After the surface selective treatment of the substrate to adjust the tension with the substrate, a liquid polymer material is applied The microstructures are filled and then the substrate is brought into contact with the microstructures, the flow is not induced on the structural mold and the polymer material. Therefore, the probability of occurrence of defects is greatly reduced. Thus, the line width is extremely small, nm to several mm can be realized, and a polymer structure having a large aspect ratio in which a fine pattern is formed can be easily manufactured.

Meanwhile, by using the polymer structure manufactured through the first to third embodiments of the present invention as described above and applying the fourth to seventh embodiments, a structure in which various fine patterns are formed can be manufactured Hereinafter, the manufacturing process will be briefly described.

First, by using the polymer structure manufactured according to the first, second, and third embodiments of the present invention as described above, as described with reference to FIGS. 4, 5, and 6, By forming a metal or metal oxide fine pattern having a polymer pattern or a reverse phase pattern corresponding to the first polymer pattern, a structure having a fine pattern can be produced.

The metal or metal oxide fine pattern may be formed by depositing a metal or metal oxide on the upper surface of the first polymer structure having the first polymer pattern formed thereon as described with reference to FIG. 5, The metal or metal oxide deposited on the first polymer pattern is removed at the same time, whereby the structure having the fine pattern can be effectively manufactured.

4 and 6, the second fluid polymer solution is applied to the upper portion of the first polymer structure having the first polymer pattern formed thereon, The second polymer is filled with the second polymer, the substrate is contacted with the first polymer structure filled with the second polymer, and then the second polymer is cured while pressing the substrate. Then, the substrate is separated from the first polymer structure, By producing the second polymer structure having the polymer pattern formed thereon, the structure having the fine pattern can be effectively produced.

Here, the metal or metal oxide fine pattern may be formed by depositing a metal or a metal oxide on the upper surface of the second polymer structure having the second polymer pattern formed thereon as described with reference to FIG. 4, 2 < / RTI > polymer, the metal or metal oxide deposited on top of the second polymer pattern may be simultaneously removed.

6, a metal or metal oxide is deposited on a substrate in contact with the first polymer structure to form a second polymer structure having a second polymer pattern formed on the metal or metal oxide layer Can be manufactured.

6, the metal or metal oxide layer exposed on the substrate is etched to form a pattern in which the second polymer is stacked on the metal or metal oxide layer on the substrate .

6, the second polymer is removed from the second polymer structure in which the metal or the metal oxide and the second polymer are laminated to form a fine pattern, so that the metal or the metal oxide forms a fine pattern Can be formed.

Meanwhile, as described with reference to FIGS. 4 and 6, in the course of manufacturing the structure having the metal or metal oxide fine pattern, the second fluid polymer solution is applied on the first polymer structure having the first polymer pattern formed thereon, Forming a second polymer layer filled with a second polymer, removing the second polymer layer until the relief portion of the first polymer structure is exposed, removing the second polymer layer and removing the second polymer layer from the first polymer layer filled with the second polymer, A second polymer structure having a second polymer pattern formed on the substrate by separating the substrate from the first polymer structure by pressing the substrate with the polymer structure, Can be effectively produced.

Here, the metal or metal oxide fine pattern may be formed by depositing a metal or a metal oxide on the upper surface of the second polymer structure having the second polymer pattern formed thereon as described with reference to FIG. 4, 2 < / RTI > polymer, the metal or metal oxide deposited on top of the second polymer pattern may be simultaneously removed.

6, a metal or metal oxide is deposited on a substrate in contact with the first polymer structure to form a second polymer structure having a second polymer pattern formed on the metal or metal oxide layer Can be manufactured.

6, the metal or metal oxide layer exposed on the substrate is etched to form a pattern in which the second polymer is stacked on the metal or metal oxide layer on the substrate .

6, the second polymer is removed from the second polymer structure in which the metal or the metal oxide and the second polymer are laminated to form a fine pattern, thereby forming a metal or metal oxide fine pattern .

5 and 7, the mold is prepared by patterning the embossed portion and the recessed portion, the fluidic polymer solution is applied on the prepared mold, and the depressed portion is polymerized A polymer layer is formed on the upper part, a substrate is contacted with a structural mold having a polymer layer formed thereon, the polymer is cured while pressing the contacted substrate, and a substrate is separated from the structural mold to form a polymer pattern After the polymer structure is prepared, the depressed portion of the polymer pattern is etched until the substrate is exposed to form the polymer pattern on the substrate, thereby effectively forming the structure having the fine pattern.

Here, as described with reference to FIG. 5, a structure in which a fine pattern is formed may be formed by depositing a metal or a metal oxide on a surface of a polymer structure on which a polymer pattern is formed, removing the polymer by a lift- The metal or metal oxide deposited on the upper portion can be simultaneously removed.

In addition, as described with reference to FIG. 7, a structure having a fine pattern can be produced by depositing a metal or metal oxide on a substrate in contact with the polymer structure to form a polymer pattern on the metal or metal oxide layer.

7, a polymer structure in which a metal or a metal oxide and a polymer are laminated to form a fine pattern is patterned by etching the polymer in the recessed portion until the metal or metal oxide layer is exposed, The metal or metal oxide layer may be etched until the metal or metal oxide layer is completely removed to form a pattern in which the polymer is stacked on the metal or metal oxide layer.

Here, as described with reference to FIG. 7, a structure in which a fine pattern is formed can form a metal or metal oxide fine pattern by removing a polymer from a polymer structure in which a metal or a metal oxide and a polymer are laminated and a fine pattern is formed.

In the embodiment of the present invention as described above, the metal or the metal oxide may be at least one selected from Cr, Ti, Pt, Mn, Au, Ni, Cu, Al, Zn, Fe, Co, W, .

Here, the fluid polymer solution may be applied using any one selected from spin coating, dropping, printing and spraying.

Further, the substrate may be contacted to a structural mold or the like using any one selected from pressure rolling, rubbing and face lengthening.

On the other hand, the fluid polymer solution may be selected from natural curable polymers, evaporation curable polymers, thermosetting polymers, and photo-curable polymers.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be readily apparent that such substitutions, modifications, and alterations are possible.

110, 210, 310: Structure mold
120, 220, 320: Fluid polymer solution
120a, 220a, 320a:
120b, 220b, 320b: Polymer pattern
130, 230, 330: substrate

Claims (26)

Preparing a structural mold having an embossed portion and an engraved portion patterned,
Subjecting the prepared structure mold to a hydrophobic treatment and a hydrophilic treatment, wherein the embossed portion is subjected to a hydrophobic treatment and the engraved portion is subjected to hydrophilic treatment,
Applying a fluid polymer solution onto the hydrophobic and hydrophilic treated structure mold to fill the depressed portion with a first polymer;
A step of bringing the upper part of the structural mold filled with the first polymer into contact with the substrate and then curing the first polymer while pressing the substrate,
Separating the substrate from the structural mold to produce a first polymeric structure having a first polymer pattern formed thereon
Wherein the polymer structure is a polymer.
delete The method according to claim 1,
The hydrophobic treatment and the hydrophilic treatment may be performed by a hydrophobic treatment using a plasma induced surface bonding method using a hydrophobic substance and a plasma induced surface bonding method using a hydrophilic substance in addition to at least one plasma gas selected from oxygen, Wherein the hydrophilic treatment is carried out using a hydrophilic treatment.
delete Preparing a structural mold having an embossed portion and an engraved portion patterned,
Wherein the hydrophilic treatment is performed using a plasma induced surface bonding method using a hydrophobic substance, and the hydrophilic treatment is performed using a hydrophobic treatment and a hydrophilic treatment, , A plasma induced surface bonding method using a hydrophilic material, with at least one plasma gas selected from argon and nitrogen,
A step of applying a fluid polymer solution after the semi-hydrophilic treatment to form the first polymer layer on the recessed portion and the first polymer layer on the upper portion,
Contacting the structural mold having the first polymer layer formed thereon with a substrate,
Curing the first polymer while pressurizing the substrate;
Separating the substrate from the structural mold to produce a first polymeric structure having a first polymer pattern formed on the first polymeric layer,
Forming a first polymer structure having the first polymer pattern on the substrate by etching the recessed portion of the first polymer pattern until the substrate is exposed;
Wherein the polymer structure is a polymer.
delete A polymer structure produced by any one of claims 1, 3, and 5, wherein a metal or metal oxide having the first polymer pattern or a reversed phase pattern corresponding to the first polymer pattern And forming a fine pattern using the polymer structure.
8. The method of claim 7,
The forming of the metal or metal oxide fine pattern may include depositing a metal or a metal oxide on a surface of the first polymer structure having the first polymer pattern formed thereon and removing the first polymer by a lift- And removing the metal or the metal oxide deposited on the first polymer pattern at the same time. The method for manufacturing a structure using the polymer structure according to claim 1,
8. The method of claim 7,
A method of manufacturing a structure having the fine pattern formed thereon,
Applying a second fluid polymer solution to an upper portion of the first polymer structure on which the first polymer pattern is formed to fill an engraved portion with a second polymer;
Curing the second polymer while contacting the substrate with the first polymer structure filled with the second polymer and pressing the second polymer structure,
Separating the substrate from the first polymeric structure to produce a second polymeric structure having a second polymeric pattern formed thereon
Wherein the fine structure is formed using the polymer structure.
10. The method of claim 9,
The step of forming the metal or metal oxide fine pattern may include depositing a metal or a metal oxide on the surface of the second polymer structure having the second polymer pattern formed thereon and removing the second polymer by a lift- And removing the metal or the metal oxide deposited on the second polymer pattern at the same time. The method for manufacturing a structure using the polymer structure according to claim 1,
10. The method of claim 9,
The method for fabricating the fine patterned structure may further include the step of fabricating a second polymer structure having a metal or metal oxide layer deposited on the substrate in contact with the first polymer structure to form a second polymer pattern on the metal or metal oxide layer Wherein the fine structure is formed using the polymer structure.
12. The method of claim 11,
The method of fabricating the fine patterned structure may include etching the metal or metal oxide layer exposed on the substrate to form a pattern in which the second polymer is laminated on the metal or metal oxide layer on the substrate Wherein the fine structure is formed using the polymer structure.
13. The method of claim 12,
A method of manufacturing a structure having the fine pattern formed thereon,
Removing the second polymer from the second polymer structure where the metal or metal oxide and the second polymer are laminated to form a fine pattern to form a fine pattern of the metal or metal oxide
Wherein the fine structure is formed using the polymer structure.
8. The method of claim 7,
A method of manufacturing a structure having the fine pattern formed thereon,
Applying a second fluid polymer solution on the first polymer structure on which the first polymer pattern is formed to form a second polymer layer filled with a second polymer on the concave portion;
Removing the second polymer layer until an embossed portion of the first polymer structure is exposed;
Curing the second polymer while contacting the substrate with the first polymeric structure having the second polymeric layer removed and filled with the second polymeric material,
Separating the substrate from the first polymeric structure to produce a second polymeric structure having a second polymeric pattern formed thereon
Wherein the fine structure is formed using the polymer structure.
15. The method of claim 14,
The step of forming the metal or metal oxide fine pattern may include depositing a metal or a metal oxide on the surface of the second polymer structure having the second polymer pattern formed thereon and removing the second polymer by a lift- And removing the metal or the metal oxide deposited on the second polymer pattern at the same time. The method for manufacturing a structure using the polymer structure according to claim 1,
15. The method of claim 14,
The method for fabricating the fine patterned structure may further include the step of fabricating a second polymer structure having a metal or metal oxide layer deposited on the substrate in contact with the first polymer structure to form a second polymer pattern on the metal or metal oxide layer Wherein the fine structure is formed using the polymer structure.
17. The method of claim 16,
The method of fabricating the fine patterned structure may include etching the metal or metal oxide layer exposed on the substrate to form a pattern in which the second polymer is laminated on the metal or metal oxide layer on the substrate Wherein the fine structure is formed using the polymer structure.
18. The method of claim 17,
A method of manufacturing a structure having the fine pattern formed thereon,
Removing the second polymer from the second polymer structure where the metal or metal oxide and the second polymer are laminated to form a fine pattern to form a fine pattern of the metal or metal oxide
Wherein the fine structure is formed using the polymer structure.
Preparing a structural mold having an embossed portion and an engraved portion patterned,
Applying a fluid polymer solution to an upper part of the prepared structure mold to fill the intaglio part with a polymer and forming a polymer layer on the upper part;
Contacting the substrate with the structural mold having the polymer layer formed thereon,
Curing the polymer while pressurizing the contacted substrate;
Separating the substrate from the structural mold to produce a polymer structure having a polymer pattern formed on the substrate,
Forming a polymer pattern on the substrate by etching the recessed portion of the polymer pattern until the substrate is exposed;
Depositing a metal or a metal oxide on the upper surface of the polymer structure having the polymer pattern formed thereon and simultaneously removing the polymer or the metal oxide deposited on the polymer pattern while removing the polymer by a lift-
Wherein the fine structure is formed using the polymer structure.
delete 20. The method of claim 19,
Wherein the polymer structure is formed by depositing a metal or a metal oxide on the substrate in contact with the polymer structure to form a polymer pattern on the metal or metal oxide layer, To form a fine pattern.
22. The method of claim 21,
A method of manufacturing a structure having the fine pattern formed thereon,
Removing the polymer from the polymer structure in which the metal or the metal oxide and the polymer are laminated and forming a fine pattern to form a fine pattern of the metal or the metal oxide
Wherein the fine structure is formed using the polymer structure.
23. The method according to any one of claims 19, 21 and 22,
Wherein the metal or metal oxide comprises at least one selected from Cr, Ti, Pt, Mn, Au, Ni, Cu, Al, Zn, Fe, Co, W, Sn, Ta and Ag. To form a fine pattern.
23. The method according to any one of claims 19, 21 and 22,
Wherein the application of the fluid polymer solution is performed using any one selected from spin coating, dropping, printing, and spraying. Gt;
23. The method according to any one of claims 19, 21 and 22,
Wherein the contact of the substrate is performed using any one selected from the group consisting of pressure rolling, rubbing and face lengthening.
23. The method according to any one of claims 19, 21 and 22,
Wherein the liquid crystalline polymer solution is selected from natural curable polymers, evaporation curable polymers, thermosetting polymers, and photo-curable polymers.

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