KR101342900B1 - Method of forming replication mold for nanoimprint and replication mold for nanoimprint - Google Patents

Abstract

The present invention relates to a replica mold for nanoimprint, and more particularly, to a method of manufacturing a replica mold for nanoimprint with improved releasability from a polymer material to which a nanopattern is transferred. According to the present invention, (a) forming a master pattern by forming an embossed and intaglio nano pattern on the master substrate, (b) applying a polymer solution on the master mold and cured to form a reversed nano pattern Producing a polymer mold, (c) separating the polymer mold from the master mold, and (d) forming a metal layer on a reversed nanopattern of the polymer mold. A method for producing a mold is provided. The replica mold for nanoimprint according to the present invention has a metal layer formed on the nanopattern, or is composed of a single metal thin plate, which is superior in releasability as compared with a conventional mold for nanoimprint. Therefore, the quality of the nano pattern transferred to the polymer material is excellent.

Description

METHOD OF FORMING REPLICATION MOLD FOR NANOIMPRINT AND REPLICATION MOLD FOR NANOIMPRINT}

The present invention relates to a replica mold for nanoimprint, and more particularly, to a method of manufacturing a replica mold for nanoimprint with improved releasability from a polymer material to which a nanopattern is transferred.

Conventionally, a method of directly processing silicon-based materials using photolithography or electron beam lithography has been used as a method of forming nanoscale patterns. However, these methods are equipment dependent, require high process costs, and have low efficiency in terms of time and energy.

In order to overcome this problem, a nanoimprint process that can obtain a high resolution pattern at a low cost has attracted attention. The nanoimprint fabricates a mold having a nanoscale structure, applies a polymer material cured by heat or ultraviolet rays onto the substrate, presses the mold toward the substrate, and transfers the nanoscale structure to the polymer material. It is a method of obtaining a nanostructure by curing a polymer material in which a nanopattern is transferred through heat or ultraviolet rays. The etching process can then replicate the nanostructure of the polymeric material onto the substrate. This method is called nanoimprint lithography.

The nanoimprint process transfers a nanopattern to a polymer material using a mold on which a nanoscale pattern is formed, and then performs a release process of separating the mold from the polymer material. In order to separate the mold from the polymer material without damaging the polymer material during the release process, adhesion between the mold and the polymer material should be minimized during curing of the polymer material, and frictional force between the mold and the polymer material should be small during the release process. If the mold release is not good, the polymer material is damaged during the release process, and the quality of the nanopattern transferred to the polymer pattern is greatly degraded. In other words, when the mold pattern is transferred to the polymer material, the mold release process is performed to improve the productivity of the nanoimprint process.

Molds used in nanoimprints have been made of soft elastomeric materials such as polydimethylsiloxane (PDMS) or hard materials such as quartz, glass and silicon.

Among the materials of molds used for nanoimprint lithography, soft elastomeric materials, such as polydimethylsiloxane (PDMS), are fluid, so they can be easily released from the master mold without splitting, facilitating replication and withstanding multiple imprinting steps. There is an advantage.

However, in terms of dysplasia, there are the following problems. Most elastomers, such as polydimethylsiloxane (PDMS), swell when exposed to organic solvents. Therefore, the solvent of the polymer solution penetrates into the mold during the inprinting process, causing the mold to expand, which may cause mold release problems.

Hard materials such as quartz, glass and silicon outperform polydimethylsiloxane (PDMS) in modulus and expansion resistance but lack flexibility. Lack of fluidity impedes even distribution of force for release from the substrate leading to defects in the mold or replicated pattern during the separation process.

In addition, in terms of releasability, ceramic hard molds such as quartz, glass, and silicon have high surface energy and low interfacial energy with other materials, resulting in poor releasability. To compensate for this, the surface of the hard mold may be fluorinated.

The present invention is to improve the problem that the mold release property of the conventional nano-imprint falls as described above, and an object of the present invention is to provide a method for producing a replica mold for nano-imprint excellent in release properties.

Method of manufacturing a replica mold for nano imprint according to an embodiment of the present invention for achieving the above object is (a) forming a nano pattern of the embossed and intaglio on the master substrate to produce a master mold, (b) the Applying a polymer solution onto a master mold and curing to prepare a polymer mold having a reversed nano pattern formed thereon; (c) separating the polymer mold from the master mold; and (d) inverting the polymer mold. Forming a metal layer on the nano-pattern of may include.

The method of manufacturing a replica mold for nano imprinting includes (e) applying a polymer solution onto the polymer mold having a metal layer formed on the reverse nano pattern, and curing the second polymer to form the same nano pattern as the nano pattern of the master substrate. The method may further include preparing a mold, (f) separating the second polymer mold from the polymer mold, and (g) forming a metal layer on the nanopattern of the second polymer mold. .

Method for manufacturing a replica mold for nano imprint according to another embodiment of the present invention for achieving the above object comprises the steps of (a) forming an embossed and intaglio nano pattern on the master substrate to produce a master mold, and (b) the Applying a polymer solution onto a master mold and curing to prepare a polymer mold having a reversed nano pattern formed thereon; (c) separating the polymer mold from the master mold; and (d) inverting the polymer mold. Forming a metal layer on the nano-pattern of (e), forming a plating layer on the metal layer, and (f) separating the metal layer and the plating layer from the polymer mold. .

According to another aspect of the present invention, there is provided a method of manufacturing a replica mold for imprinting nanoimprints, the method comprising: (a) forming a master pattern by forming an embossed and intaglio nanopattern on a master substrate, and (b) Applying a polymer solution onto the master mold and curing to prepare a polymer mold having a reversed nano pattern formed thereon; (c) separating the polymer mold from the master mold; and (d) Forming a metal layer on the reverse phase nanopattern, and (e) applying a polymer solution onto the polymer mold on which the metal layer is formed on the reverse phase nanopattern and curing the same. Preparing a formed second polymer mold, (f) separating the second polymer mold from the polymer mold, and (g) a nano pattern of the second polymer mold Forming a metal layer thereon, (h) forming a plating layer over the metal layer of the second polymer mold, and (i) separating the metal layer and the plating layer from the second polymer mold. It may include.

According to another aspect of the present invention, there may be provided a replica mold for nanoimprint comprising a polymer material formed on the embossed and intaglio nanopatterns and a metal layer formed on the nanopattern of the polymer material.

The replica mold for nanoimprint according to the present invention has a metal layer formed on the nanopattern, or is composed of a single metal thin plate, which is superior in releasability as compared with a conventional mold for nanoimprint. Therefore, the quality of the nano pattern transferred to the polymer material is excellent.

In the case of the metal mold according to the present invention, it is superior to a polymer mold such as polydimethylsiloxane (PDMS) in modulus and expansion resistance, and in fluidity, it can be used in a mold made of hard materials such as quartz, glass and silicon. Outstanding compared to In addition, since the interfacial energy with the high molecular material is also relatively high, the releasability is excellent.

1 is a view for explaining the master mold manufacturing step of the manufacturing method of the replica polymer mold according to an embodiment of the present invention.
2 is a view for explaining a process of manufacturing a replica polymer mold using a master mold of the method of manufacturing a replica polymer mold according to an embodiment of the present invention.
3 is a view for explaining a method of manufacturing a replica metal mold according to an embodiment of the present invention.
4A is an electron micrograph of the silicon master mold.
Figure 4 (b) is an electron micrograph of the polyurethane mold separated from the silicon master mold.
Figure 4 (c) is an electron micrograph of the polyurethane mold separated from the primary replica polymer mold.
5A is an electron micrograph of a silicon master mold.
Figure 5 (b) is an electron micrograph of the polydimethylsiloxane mold separated from the silicon master mold.
5C is an electron micrograph of the polydimethylsiloxane mold separated from the primary replica polymer mold.

Hereinafter, with reference to the accompanying drawings will be described in detail with respect to the present invention.

Method for producing a replica polymer mold for nanoimprint according to the present invention comprises the steps of manufacturing a master mold, manufacturing a polymer mold, separating the polymer mold from the master mold and forming a metal layer on the nano-pattern of the polymer mold Steps.

The production of the master mold is performed by a general photolithography process or electron beam lithography process. The photolithography process is described as an example.

First, as shown in FIG. 1A, after cleaning the substrate 1, a bottom anti-reflective coating (BARC) 2 is formed on the substrate 1. As the substrate 1, a hard material such as silicon, glass, or quartz may be used. The antireflection film 2 is for forming a fine pattern. The anti-reflection film 2 includes a bottom anti-reflective coating (BARC) formed under the photoresist layer and a top anti-reflective coating (TARC) formed on the photoresist layer.

Next, as shown in FIG. 1B, a layer of photoresist 3 is formed on the antireflection film 2. The photoresist 3 layer can be formed by a method such as a spin coating method using a spin coater.

Next, as shown in FIG. 1C, the nanopattern 4 is formed on the photoresist layer through a photolithography process.

Next, as shown in FIG. 1D, the antireflection film 2 and the substrate 1 are etched through dry or wet etching to prepare a master mold 5.

Next, the steps for producing the polymer mold will be described.

First, as shown in (a) of FIG. 2, the polymer solution 6 is dropped on the surface of the finished master mold 5, and then the surface of the master mold 5 is covered with the support substrate 7. The polymer solution 6 may be a polyurethane (PU) -based or polydimethylsiloxane (PDMS) -based solution. The support substrate 7 may be a polymer material such as polycarbonate (PC) or polydimethylsiloxane (PDMS), or a substrate made of a rigid material such as silicon, quartz, or glass.

Next, as shown in FIG. 2 (b), pressure is applied to the support substrate 7. As a method of applying pressure to the support substrate 7, there is a method of rubbing the support substrate 7 using a rubber roller and a method of applying pressure using a gas.

In the case of using polydimethylsiloxane (PDMS) as a supporting substrate, first, the polymer solution applied on the surface of the master mold is cured, and then the polydimethylsiloxane (PDMS) is applied again on the cured polymer material and then cured. It is also possible to form a supporting substrate.

In this case , it is preferable to harden for 65 to 75 degreeC for 2 to 24 hours. In less than 2 hours, PDMS does not cure completely. After 24 hours, the master mold and the polymer mold stick together and are difficult to separate.

Next, the polymer solution 6 is cured. As a method of hardening the polymer solution 6, there are a method of applying heat and a method of irradiating ultraviolet rays.

When the ultraviolet curable polyurethane (PU) solution is cured by irradiating with ultraviolet rays, the ultraviolet irradiation amount is preferably 670 to 863 mJ / cm 2. For example, when irradiating at an energy level of 19.16 mA / cm 2, irradiate about 35 seconds to 45 seconds. If it is less than 670 mJ / cm 2, an uncured polyurethane solution remains between the polymer molds because it is not cured perfectly. In the case of more than 863 mJ / ㎠, since the ultraviolet light is irradiated more than necessary, there may be damage of the polyurethane material itself, there is a problem that the separation of the master mold and the polyurethane mold is difficult.

When the thermosetting polydimethylsiloxane (PDMS) solution is cured using heat, it is preferable to cure at 65 ° C to 75 ° C for 20 to 40 minutes. Uncured polydimethylsiloxane (PDMS) solution remains in the polymer mold because it does not fully cure in less than 20 minutes. At 40 minutes or more, the polymer mold is excessively shrunk and deformation occurs.

Next, as shown in FIG. 2C, the cured polymer mold 8 and the support substrate 7 are separated from the master mold 5.

Next, as shown in FIG. 2 (d), the replica polymer mold 10 is formed by forming a metal layer 9 using an electron beam or a sputter on the nanopattern of the polymer mold 8 separated from the master mold. To complete. The metal layer 9 is to improve the releasability by increasing the interfacial energy between the replica polymer mold 10 and the polymer material to which the nanopattern is transferred through the nanoimprint. Table 1 shows the interfacial energy between the platinum layer and the polyurethane according to the thickness of the platinum (pt) layer. In the case where the platinum layer is not formed, the interface energy is theoretically close to zero.

Platinum layer thickness (nm) Interfacial energy (mJ / ㎡) 15 1.765 20 1.966 25 1.97 30 1.972

Although there is a difference depending on the shape of the nanopattern, as can be seen in Table 1, the thickness of the metal layer is preferably 15nm to 20nm thickness. The metal layer comprises at least one selected from the group consisting of Au, Ni, Cu, Al, Zn, Fe, Co, W, Sn, P.

If necessary, the second replica polymer mold may be manufactured again using the replica polymer mold. Since the method of manufacturing the secondary replica polymer mold is the same as the method of manufacturing the replica polymer mold described above, except that a replica polymer mold having a metal layer is formed in place of the master mold, a detailed description thereof will be omitted. The secondary replica polymer mold differs from the replica polymer mold in which the reverse phase nanopattern is formed in that a nanopattern having the same shape as the master mold is formed. If necessary, the replica polymer mold may be manufactured again using the secondary replica polymer mold.

Hereinafter, the manufacturing method of the replica metal mold is demonstrated.

Method of manufacturing a replica metal mold for nanoimprint according to the present invention comprises the steps of manufacturing a master mold, manufacturing a polymer mold, separating the polymer mold from the master mold, fixing the polymer mold to a substrate, Forming a metal layer on the nanopattern, forming a plating layer over the metal layer, and separating the metal layer and the plating layer from the polymer mold.

Since the step of separating the polymer mold from the master mold is the same as the manufacturing method of the replica polymer mold described above, only the following steps will be described.

As shown in FIG. 3A, after coating the UV curable adhesive layer 12 on the substrate 11, the polymer mold 8 coupled with the supporting substrate 7 is placed thereon, and UV cured. The polymer mold 8 coupled with the support substrate 7 is fixed on the substrate 11. It is preferable that ultraviolet irradiation amount is 2870-3450 mJ / cm <2>. For example, when irradiating at an energy level of 19.16 ㎽ / ㎠, irradiate about 150 seconds to 180 seconds. If it is less than 2870 mJ / ㎠ does not cure the ultraviolet curable adhesive, if it is more than 3450 mJ / ㎠ because more than the required ultraviolet radiation may be damaged of the ultraviolet curable adhesive itself.

Next, as shown in FIG. 3B, the metal layer 13 is formed on the nanopattern of the polymer mold 8 by using a vacuum deposition apparatus such as an electron beam evaporator, a sputter, or the like. The metal layer 13 serves as a seed layer for plating. The metal layer of FIG. 2 (d) is for improving the releasability and has a difference in role from the metal layer. Due to this difference, the metal layer shown in (b) of FIG. 3 is about thousands of micrometers, and is thinner than the metal layer of (d) of FIG.

Next, as shown in FIG. 3C, the plating layer 14 is formed on the metal layer 13. The plating layer 14 includes at least one selected from the group consisting of Au, Ni, Cu, Al, Zn, Fe, Co, W, Sn, and P. The plating layer 14 is formed by plating methods, such as electrolytic plating and electroless plating.

Next, as shown in FIG. 3C, the metal layer 13 and the plating layer 14 are separated from the polymer mold 8 to complete the replica metal mold 20.

In the above, the replica metal mold is manufactured by using the replica polymer mold replicated directly from the master mold, but it is also possible to manufacture the replica metal mold by using the secondary replica polymer mold. In this case, a replica metal mold in which a nanopattern with a reversed phase is formed can be manufactured.

Hereinafter, the present invention will be described in detail through examples.

&Lt; Example 1 >

Manufacturing Method of Silicon Master Mold

Coating an anti-reflective coating (BARC) (K-131, Dongjin Semichem) to 580Å thickness on an 8 inch silicon wafer and photoresist (LX-429, Dongjin Semichem) to 0.4㎛ thickness It was. It was exposed through a UV reticle with a nano pattern using a KrF laser scanner (NSR-S203B, Nikon). Subsequently, the exposed substrate was developed in a developer (DPD 200, Dongjin Semichem) for 60 seconds, and then an anti-reflection film was etched while maintaining a vacuum of 7 mtorr using a silicon etching machine (TCP9400, Lam). Silicon etching was performed while maintaining a vacuum of 17 mtorr to form a plurality of grooves having a width of 300 nm to 800 nm and a depth of 300 nm to 2400 nm on the silicon wafer. 4A is an electron micrograph showing a silicon master mold.

Manufacturing method of primary replica polymer mold

Polycarbonate (PC) film was subjected to oxygen plasma treatment using a plasma cleaner (Yes-G5OO, Yield Engineering Systems. Inc), and then washed with deionized water and dried with nitrogen gas. . Three drops of the polyurethane solution (MINS-311RM, Minuta tech) was dropped in the center of the surface of the silicon master mold, and the prepared polycarbonate film was covered on the silicon master mold. And rubbed using the silicone rubber roller. Then, the polyurethane solution was UV cured for 35 seconds using an ultraviolet aligner (EVG-R60, EVGroup) at an energy level of 19.16 kW / cm 2, and then the polyurethane and the polycarbonate film were separated from the silicone master mold. Figure 4 (b) is an electron micrograph showing the polyurethane mold separated from the silicon master mold.

Next, the platinum layer was coated on the side where the nanostructure of the primary polymer mold (polyurethane mold) was formed by using an RF sputter. The thickness of the platinum layer varies depending on the shape of the nanostructure, but was formed to a thickness of approximately 15 nm to 20 nm to complete the primary replica polymer mold. The platinum layer is formed to improve the releasability of the primary replica polymer mold. In this way, a primary replica polymer mold was obtained in which the nanostructure of the silicon master mold was reversed.

Manufacturing method of secondary replica polymer mold

The polycarbonate film is treated in the same manner as the production method of the primary replica polymer mold. Subsequently, about 3 drops of a polyurethane solution is dropped in the center of the surface of the primary replica polymer mold, and the polycarbonate film is placed on the primary replica polymer mold so that no bubbles are formed. The polyurethane solution was UV cured at an energy level of 19.16 mA / cm 2 for 35 seconds using an ultraviolet aligner while a transparent 8-inch glass wafer was placed on the polycarbonate film. After separating the polyurethane and the polycarbonate film from the primary replica polymer mold and coating the platinum layer using RF sputter on the side where the nanostructure is formed, the secondary replica polymer mold with the same nanostructure as the silicon master mold is realized. Got. Figure 4 (c) is an electron micrograph of the mold of the polyurethane separated from the primary replica polymer mold.

<Example 2>

Manufacturing method of primary replica polymer mold

The platinum layer was coated on the side where the nanostructure was formed on the silicon master mold prepared in the same manner as in Example 1 by using an RF sputter. This is to easily separate the primary replica polymer mold from the master mold.

First, the manufacturing method of a high hardness PDMS solution and a PDMS solution is demonstrated. High hardness PDMS refers to a PDMS that is harder than a general PDMS.

First, the manufacturing method of a high hardness PDMS solution is demonstrated. 2.5g: 2 drops: 1 drop of VDT-731 copolymer (Vinylmethylsiloxane-Dimethysiloxane Copolymer, Trimethylsiloxy Terminated, Gelest inc) and platinum catalyst (Platium-1,3-divinyl-1,1,3,3-tetramethyl- High hardness modified polydimethysiloxane (PDMS) made by mixing disiloxane-complex, Karstedt catalyst in Xylene, JSI silicon corp) and monomer (2,4,6,8-Tetramethyl-2,4,6,8-tetravinylcycloterasiloxane, Sigma Aldrich corp) The solution was placed in a disposable container and mixed for about 1 minute using a glass rod. The mixed liquid high hardness PDMS was then evacuated for about 5 minutes at room temperature using a vacuum oven. Thereafter, 1 g of HMS-301 copolymer (Methylhvdrosiloxane-Dimethylsiloxane Copolymer, Trimethylsiloxane Terminated, Gelest Inc) was mixed with the liquid high hardness PDMS to prepare a high hardness PDMS solution.

Next, the manufacturing method of a PDMS solution is demonstrated. A PDMS (polydimethysiloxane, Dow Corning) solution prepared by mixing a base (Sylgard 184 elastomer base) and a curing agent (Sylgard 184 elastomer curing agent) at a mass ratio of 10: 1 in a disposable container was mixed using a glass bar. Bubbles were then removed from the mixed PDMS solution using a vacuum oven (OV-12, JEIO Tech). Bubble-free PDMS solution was poured into a Petri dish.

The silicon master mold was placed on a chuck of a spin coater (ACE-1020, Dong Ah Trade corp), and 0.3 ml of the prepared high hardness PDMS solution was poured on it. And spin-coated the hardened PDMS solution for 5 seconds at 500 rpm and then 60 seconds at 800 rpm. Subsequently, the silicone master mold was cured in an oven (LDO-150F, LabTech) at 70 ° C. for 30 minutes, and then the silicon master mold coated with high hardness PDMS was placed in the center of a Petri dish, and the prepared PDMS was poured. After curing at 70 ° C. for 2 hours in an oven, the PDMS was cut using a cutter along the inner diameter of the Petri dish, and the first polymer mold was prepared by separating the high hardness PDMS and the PDMS from the silicon master mold. Figure 5 (b) is an electron micrograph of the PDMS mold separated from the silicon master mold.

 Next, a platinum layer was coated on the side where the nanostructure of the primary polymer mold was formed by using RF sputter to complete the primary replica polymer mold. The platinum layer is formed to improve the releasability of the primary replica polymer mold.

Manufacturing method of secondary replica polymer mold

After spin coating a hard PDMS solution through spin coating on the first replica polymer mold and curing, the primary replica polymer mold coated with the hard PDMS was placed on a petri dish, and the PDMS was poured. After curing in an oven, the PDMS was cut using a cutter, and the high hardness PDMS and the PDMS were separated from the primary replication polymer mold to prepare a secondary replication polymer mold. 5C is an electron micrograph of the polydimethylsiloxane mold separated from the primary replica polymer mold.

 Next, the platinum layer was coated on the side where the nanostructure of the secondary replica polymer mold was formed by using an RF sputter. The platinum layer is formed to improve the releasability of the secondary replica polymer mold.

<Example 3>

Method for manufacturing primary replica metal mold

A spin coater (LSM-250, sawatec) was used to coat an ultraviolet curable adhesive layer (UV bond) on an 8 inch silicon wafer for 30 seconds at 3000 rpm. After aligning and arranging the secondary polymer mold of Example 1 on the UV curable adhesive layer, using an UV aligner for 8 minutes with an 8 inch glass wafer, the energy level of 19.16 kW / cm 2 was used. The ultraviolet curable adhesive layer was cured. It was then exposed to oxygen plasma for 1 minute in an oxygen atmosphere at an energy level of 450 W. Using a electron beam evaporator (KVE & T-C500200, Korea vacuum tech) was deposited at a deposition rate of 4 kW per second for a total of 12 minutes to form a seed layer of 2000 kPa. A nickel plating layer was then formed on the seed layer using an electroplating apparatus (EP2000, Sambang ENG). Nickel plating solution (Sulfamic) with a profile of 90 minutes at 100 VDC, 60 minutes at 200 VDC, 60 minutes at 400 VDC, 60 minutes at 800 VAC, 90 minutes at 1400 VDC, and 7 hours at 9000 Hz. aicd, C & C tech).

Then, the metal layer and the plating layer were separated from the secondary polymer mold to prepare a primary replica metal mold having a thickness of 200 μm.

Manufacturing method of secondary replica metal mold

The secondary replica metal mold was made in the same way as the primary replica metal mold. However, since the primary polymer mold of Example 1 was used, a metal replica mold having a nanopattern having the same shape as the silicon master mold of Example 1 was formed.

1: substrate 2: antireflection film
3: photoresist 5: master mold
6: polymer solution 7: support substrate
8: polymer mold 9: metal layer
10: replica polymer mold 11: substrate
12: UV curable adhesive 13: metal layer
14: plating layer 20: replica metal mold

Claims (16)

(a) forming a master mold by forming an embossed and intaglio nanopattern on the master substrate,
(b) applying a polymer solution onto the master mold and curing to prepare a polymer mold having a reversed nano pattern formed thereon;
(c) separating the polymer mold from the master mold;
(d) forming a metal layer as a release film for improving releasability on the reversed nanopattern of the polymer mold to improve releasability between the polymer mold and the polymer material to which the nano pattern of the polymer mold is transferred; Method for producing a replica mold for nano imprint comprising a. The method of claim 1,
The metal layer is a method of manufacturing a replica mold for nano imprint comprising at least one selected from the group consisting of Au, Ni, Cu, Al, Zn, Fe, Co, W, Sn, P. The method of claim 1,
The polymer solution is a polyurethane (Poly urethane, PU) or polydimethylsiloxane (Polydimethylsiloxane, PDMS) polymer solution of the manufacturing method of the replica mold for nanoimprint. The method of claim 1,
The step (b)
Applying a polymer solution onto the master mold;
Placing a support substrate on the applied polymer solution;
Method for producing a replica mold for nano imprint comprising the step of curing the polymer solution. The method of claim 1,
The polymer solution is a UV-curable polyurethane (PU) -based polymer solution, the step of curing the polymer solution is a step of irradiating ultraviolet light, the UV irradiation amount of 670 ~ 863 mJ / ㎠ of the replication mold for nano imprint Manufacturing method. The method of claim 1,
The polymer solution is a thermosetting polydimethylsiloxane (PDMS) -based polymer solution, and the step of curing the polymer solution is a step of curing for 20 to 40 minutes at 65 ~ 75 ℃ curing method for a nano imprint replication mold . 5. The method of claim 4,
The support substrate is
A polycarbonate (PC) -based, polydimethylsiloxane (PDMS) -based polymer, a silicon, or a glass substrate manufacturing method of a replica mold for nanoimprint. The method of claim 1,
(e) applying a polymer solution onto the polymer mold having a metal layer for improving releasability on the reversed nanopattern and then curing the same to prepare a second polymer mold having the same nanopattern as the nanopattern of the master substrate; ,
(f) separating the second polymer mold from the polymer mold,
(g) forming a metal layer for improving releasability on the nanopattern of the second polymer mold. delete delete delete delete delete (a) forming a master mold by forming an embossed and intaglio nanopattern on the master substrate,
(b) applying a polymer solution onto the master mold and curing to prepare a polymer mold having a reversed nano pattern formed thereon;
(c) separating the polymer mold from the master mold;
(d) forming a metal layer as a release film for improving releasability on the reversed nanopattern of the polymer mold to improve releasability between the polymer mold and the polymer material to which the nano pattern of the polymer mold is transferred; Wow,
(e) applying a polymer solution onto the polymer mold having a metal layer for improving releasability on the reversed nanopattern and then curing the same to prepare a second polymer mold having the same nanopattern as the nanopattern of the master substrate; ,
(f) separating the second polymer mold from the polymer mold,
(g) forming a metal layer on the nanopattern of the second polymer mold to serve as a seed layer for plating;
(h) forming a plating layer on the metal layer of the second polymer mold,
(i) separating the metal layer and the plating layer from the second polymer mold. Polymer material that forms the nano pattern of the embossed and intaglio
And a metal layer as a release film for improving release property formed on the nanopattern of the polymer material to improve the release property between the polymer mold and the polymer material to which the nanopattern of the polymer mold is transferred. 16. The method of claim 15,
The metal layer is a replica mold for nanoimprint comprising at least one selected from the group consisting of Au, Ni, Cu, Al, Zn, Fe, Co, W, Sn, P.

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