KR101705237B1 - Power supply device for semiconductor inspection device and the driving method - Google Patents

Abstract

The present invention relates to a power supply device for semiconductor inspection equipment and an operation method thereof, and more specifically, to a power supply device for semiconductor inspection equipment, capable of easily understanding failure of an internal fan when the internal fan is failed, and easily replacing the internal fan, and an operation method thereof. To this end, the power supply device comprises: a power supply module to supply power to the semiconductor inspection equipment by voltage and current levels required by the semiconductor inspection equipment; the fan installed around the power supply module to cool the power supply module in an air cooling manner; a case having a reception space to receive the power supply module and the fan, and having an opened part on one side; and a display panel unit combined with the opened part of the case, and displaying the voltage and current level supplied to the semiconductor inspection equipment from the power supply module. The fan is installed between the display panel unit and the power supply module, and the display panel unit is detachably combined with the opened part.

Description

TECHNICAL FIELD [0001] The present invention relates to a power supply apparatus and a method of driving the same,

The present invention relates to a power supply apparatus for a semiconductor inspection station and a method of driving the same. More particularly, the present invention relates to a power supply apparatus for a semiconductor inspection station, Cost power supply and a driving method thereof.

Among the semiconductor inspection equipments, the semiconductor chip inspecting device checks the voltage value and the current value of the output terminal by passing minute current to the input terminal of the semiconductor chip, and checks whether the semiconductor chip is normally operated.

Here, the semiconductor testing equipment uses a specially designed power supply for applying current to the semiconductor chip. Usually, the cost of the semiconductor inspection center power supply unit is composed of a case type and mounted on a tower case of semiconductor inspection equipment or mounted on a separate tower case.

Since the power supply for such a semiconductor inspection station is continuously operated, a fan for cooling the internal electric elements is mounted. Such a fan is a consumable part, and after a certain period of time, The cooling efficiency is lowered. In this case, the power supply unit causes an abnormality in the inspection power supply to the semiconductor inspection equipment due to the deterioration of the cooling efficiency. Further, since the life of the power supply unit is lowered due to deterioration of the internal electric device, must do it.

Here, in the operation of replacing the fan, first, the worker performs an operation of releasing the electrical connection between the power supply device and the semiconductor inspection equipment, and then the worker separates the power supply into the tower case, , The operator opens the outer panel of the power supply separated from the tower case to replace the fan. Next, the operator installs the power supply unit in the tower case and conducts electrical connection with the semiconductor inspection equipment.

However, as described above, in the operation of replacing the conventional fan of the power supply unit, the power supply unit and semiconductor inspection equipment must be electrically disconnected and connected, and after the power supply unit is separated from the tower case, The work of disassembling the case of the apparatus must be carried out, resulting in a problem that it takes a lot of time for the operation. Particularly, since the power supply unit installed in the semiconductor inspection equipment weighs more than 30 kg, there is a problem that the worker is forced to work alone.

In addition, the conventional power supply device can recognize this only when a trouble occurs in the fan and an abnormality occurs in the supply of power to the semiconductor inspection equipment, when the fan is being replaced. Of course, there is a method of replacing every certain period of time. However, since the lifetime of the fan is different depending on the manufacturing method and bearing characteristics, the replacement time of the fan can not be precisely specified.

As described above, since the conventional power supply device can not accurately know the timing of replacing the fan, only when the fan fails, the voltage value and the current value supplied to the semiconductor testing equipment at the time of the failure of the fan are abnormal Therefore, the semiconductor chip inspected in the semiconductor inspection process during the failure period of the fan is not accurately inspected, resulting in defects in the product of the semiconductor chip, resulting in a large economic loss.

In addition, when the fan is broken, the internal electric elements of the power supply apparatus are operated in a deteriorated state, so that the lifetime of the electric elements is lowered, and eventually the life of the power supply apparatus is lowered.

Korean Registered Patent No. 10-1304876 (2013.09.02.)

SUMMARY OF THE INVENTION The present invention has been made to solve the problems of the conventional art as described above, and it is an object of the present invention to provide a method and apparatus for reducing the time required for replacing a fan inside a power supply unit, The present invention also provides a power supply apparatus for a semiconductor inspection center capable of easily determining a replacement timing of a fan and a driving method thereof.

To this end, the present invention provides a power supply module for supplying power to the semiconductor inspection equipment with a voltage value and a current value required by a semiconductor inspection equipment; A fan installed around the power supply module and cooling the power supply module in an air cooling manner; A housing having a housing space for housing the power supply module and the fan, and having an opening formed at one side thereof; And a display panel unit coupled to an opening of the case and configured to display a voltage value and a current value supplied from the power supply module to the semiconductor inspection equipment, And the display panel unit is detachably coupled to the opening.

In this case, the power source for the semiconductor inspection center may further include a handle and a bolt for separating the panel. In this case, a bolt coupling hole is further formed in the casing, and a bolt passage hole is further formed in the display panel portion The handle may be in close contact with the display panel portion so that the bolt hole is aligned with the bolt through-hole and the bolt passage hole. In this case, the panel- And the head is screwed to the bolt coupling hole through the bolt through-hole of the bolt, and the head is brought into close contact with the knob to fix the knob to the display panel unit.

Also, the power source for the semiconductor inspection center may further include a fan failure detecting unit, and the fan failure detecting unit is electrically connected to the motor unit of the fan, and the motor unit of the fan is disconnected, It is possible to generate a fan fault signal when the current value of the motor part is increased by more than the preset value.

The power supply unit for the semiconductor inspection center may further include a lighting unit. The lighting unit is installed on a front surface of the display panel unit. The power supply unit is electrically connected to the fan failure detection unit, can do.

The power supply for the semiconductor inspection center may further include a buzzer, and the buzzer may be installed on the front surface of the display panel, and may be electrically connected to the fan failure detecting unit to receive the fan failure signal Alarm sound can be output.

The power supply for the semiconductor inspection center may further include a warning release switch. The warning release switch is installed at a power supply end input to the fan failure detection unit. When the power supply unit is turned on, the fan failure detection unit Power is supplied to the fan failure detecting unit, and when power is turned off, the power supplied to the fan failure detecting unit can be cut off.

Meanwhile, the method for driving the power supply unit for the semiconductor inspection center supplies electric power for inspecting a semiconductor chip with a semiconductor inspection equipment and supplies electric power to the fan so that the fan cools the power supply module in an air cooling manner, A power supply step of supplying power to the fan failure detecting unit to drive the fan failure detecting unit; A fan monitoring step of continuously detecting a power failure state and a current value state of the motor unit of the fan by the fan failure detection unit; A fan abnormality signal output step of outputting a fan abnormality signal when the fan failure detection unit detects that the motor of the fan is disconnected or when an overload is applied to the motor unit of the fan and a predetermined current value is exceeded; And an alarming step of outputting an alarm sound by receiving a fan abnormality signal from the lighting unit and receiving the fan abnormality signal.

According to the present invention, it is possible to drastically shorten the working time for replacing the fan inside the power supply unit and to replace the fan for the semiconductor inspection cost.

In addition, according to the present invention, it is possible to easily determine the replacement time of the fan, so that deterioration of the electric element can be prevented and the life of the power supply device can be prevented from being lowered. Thereby preventing the defective semiconductor chip from being shipped, thereby preventing the economic loss of the defective product.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a photograph of a power supply apparatus for a semiconductor inspection station according to an embodiment of the present invention, as viewed from the front perspective. FIG.
FIG. 2 is a photograph of the state in which the display panel portion shown in FIG. 1 is separated from the case; FIG.
FIG. 3 is a photograph of the display panel part and the case shown in FIG.
FIG. 4 is a photograph showing a state in which a power supply module of a semiconductor inspection center cost power supply shown in FIG. 3 is removed. FIG.
5 is a photograph of the state in which the power supply module shown in FIG. 4 is detached.
FIG. 6 is an exploded perspective view of the power supply system for the semiconductor inspection station shown in FIG.
FIG. 7 is a plan view of the semiconductor test station-based power supply shown in FIG. 6 coupled.
FIG. 8 is a block diagram showing an electrical connection relationship of the power supply for the semiconductor test center shown in FIG. 6;
9 is a flow chart of a method of driving a semiconductor test center cost power supply according to an embodiment of the present invention.
10-13 are plan views of a work process for each of the operations of replacing a fan inside a power supply for a semiconductor test center according to an embodiment of the present invention.

The terms used in this specification will be briefly described and the present invention will be described in detail.

While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments. Also, in certain cases, there may be a term selected arbitrarily by the applicant, in which case the meaning thereof will be described in detail in the description of the corresponding invention. Therefore, the term used in the present invention should be defined based on the meaning of the term, not on the name of a simple term, but on the entire contents of the present invention.

When an element is referred to as "including" an element throughout the specification, it is to be understood that the element may include other elements, rather than controlling other elements, unless otherwise specifically stated. Furthermore, the term "part" or the like described in the specification means a unit for processing at least one function or operation, which may be implemented by hardware or software, or a combination of hardware and software.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.

1 to 8, a power supply apparatus for a semiconductor test center according to an embodiment of the present invention includes a power supply module 10, a fan 20, a case 30, and a display panel unit 40 do.

The power supply module 10 includes an input side filter portion 11, a bias portion 12, a rectification portion 13, a switching portion 14, an output side filter portion 15, and a converter portion 16.

The input side filter unit 11 is a circuit for receiving an AC power source and removing high frequency noise included in the received AC power by using electric elements such as a resistor and a capacitor. An example of such an input side filter unit 11 may be a loss pass filter.

The bias unit 12 is electrically connected to the input side filter unit 11 and receives power supplied from the input side filter unit 11 and divides the input power into a rectified part 13, a converter part 16, a fan 20, and the fan failure detecting unit 70 and the display panel unit 40, respectively.

The rectifying unit 13 is connected to the bias unit 12 and receives AC power. The rectifying unit 13 performs a half-wave rectification of the AC power inputted thereto by using a rectifier circuit such as a bridge diode and then converts the half-wave rectified AC power into a capacitor and a diode Smooth and convert to DC power.

The switching unit 14 is connected to the rectifying unit 13 to receive the smoothed direct current power and converts the received direct current power into a voltage value and a current value required by the semiconductor inspection equipment. In this case, the switching unit 14 converts the voltage value by using a regulator, converts the voltage value by a chopper method or a converter method by fast switching of a switching element such as a FET, It can be converted into a voltage value. In addition, the switching unit 14 may be provided with a current limiting circuit so that the current value may not exceed a predetermined value to set a current value required by the semiconductor inspection equipment.

The output side filter unit 15 is electrically connected to the switching unit 14 and supplies power to the semiconductor testing equipment in a state in which the noise included in the power output from the output side filter unit 15 is removed, . Here, the power supplied to the semiconductor inspection equipment is supplied through the connection terminal on the opposite side of the display panel unit 40.

The converter unit 16 is electrically connected to the output filter unit 15 and detects a voltage value, a current value, and a temperature value of the output filter unit 15. The converter unit 16 transmits the voltage value and the current value of the output filter unit 15 to the display panel unit 40 so that the voltage and current output to the semiconductor inspection equipment are displayed by the display panel unit 40 .

The power supply module 10 converts the smoothed direct current power into a voltage value and a current value required by the semiconductor inspection equipment and supplies the rectified smoothed direct current power to the semiconductor chip, Inspection can be carried out in accordance with the inspection process. When the power supply module 10 is to supply different voltage values and current values to inspect semiconductor chips having different specifications, the power supply module 10 is provided with a plurality of different voltage values and current values, respectively, . However, it is needless to say that the power supply module is not limited to the above example, and that the configuration of the power supply module 10 may be replaced or added with the above-described configurations depending on the characteristics of the semiconductor inspection equipment.

In the present embodiment, the power supply module 10 includes a rectifying unit 13, a switching unit 14, an output filter unit 15, and a converter unit 16 mounted on a single board. The input side filter unit 11 and the bias unit 12 are mounted on a separate substrate and electrically connected to the power supply module 10 and the fan 20, the display panel unit 40, And supplies power to the fan failure detecting unit 70 as an example.

The fan 20 includes a wing portion 21 having a plurality of blades for generating wind, a motor portion 22 for rotating the wing portion 21, a motor driving circuit 23 for controlling the driving of the motor portion 22 An electric wire 24 for electrical connection with the motor drive circuit 23 and an electric connection with the fan failure detecting unit 70 and a power supply unit 24 provided at one end of the electric wire 24 for connecting the fan 20 to the power supply, And a socket type connector 25 for easily detaching and attaching electrical connection and detachment when electrically connected to the failure detection unit 70. Here, the fan 20 may be configured as a DC motor. However, in the present invention, the configuration of the fan 20 is not limited to the DC motor, and the fan 20 can be replaced with a configuration of all fans capable of cooling the power supply module 10 in an air-cooling manner, to be. The fan 20 may be coupled to the power supply module 10 by a fastening member 26 such as a bolt or may be coupled to the case 30 by a fastening member. The fan 20 is disposed between the display panel unit 40 and the power supply module 10 so that when the display panel unit 40 is separated from the opening 31 of the case 30, 31).

The case 30 is composed of a rectangular box-shaped metal frame having a receiving space formed therein for receiving the power supply module 10 and the fan 20, and an opening 31 having a front side opened is formed And a plurality of through holes are formed in a part of the body for air circulation to the outside.

The display panel unit 40 is coupled to the front plate 41 and the front plate 41 coupled to the front opening 31 of the case 30 and includes a voltage value and a current value output from the power supply module 10, A liquid crystal 42 for displaying temperature information, and a controller 42 for receiving information on the voltage value, the current value, and the temperature value of the output filter unit 15 coupled to the front plate 41 and from the converter unit 16, And converting the display information of the liquid crystal 42 into display information.

In addition, the semiconductor test center-based power supply apparatus according to the embodiment of the present invention may further include a handle 50 and a panel separating bolt 60.

The handle 50 is formed in a "C" shape, and a bolt inner hole 51 is formed in each of the portions of both ends. In this case, a bolt coupling hole 32 is further formed in the case 30, and a bolt passage hole 41a corresponding to the bolt coupling hole 32 is further formed on the front plate 41 of the display panel portion 40 And the bolt passage hole 41a, the bolt inner hole 51, and the bolt coupling hole 32 are formed at positions corresponding to each other. The handle 50 is configured such that when the bolt inner hole 51 is in close contact with the display panel 40 so as to correspond to the bolt coupling hole 32, the operator can hold the handle 50 by hand. And the like.

The panel separating bolt 60 is screwed to the bolt coupling hole 32 through the bolt through-hole 51 of the handle 50 and the bolt passing hole 41a of the display panel 40, And is screwed to the bolt coupling hole 32 until it is brought into close contact with the additional knob 50, thereby fixing the knob 50 to the display panel unit 40.

The power supply apparatus for a semiconductor test center according to an embodiment of the present invention may further include a fan failure detecting unit 70, a lighting unit 80, a buzzer unit 90, and a warning release switch 100 .

The fan failure detecting unit 70 may be coupled to the display panel unit 40 or may be coupled to the inside of the case 30. [ The fan failure detecting unit 70 is electrically connected to the motor unit 22 of the fan 20 and continuously monitors the disconnection state of the motor unit 22 of the fan 20, Detects a power failure state when the power is off, and generates a fan abnormality signal when the power is in the power failure state. The fan failure detecting unit 70 stores the current value for the case where the motor unit 22 rotates normally and continuously monitors the current value flowing in the motor unit 22 of the fan 20 . The fan failure detecting unit 70 detects the fan failure when the motor unit 22 of the fan 20 is overloaded and the current value of the motor unit 22 increases by a predetermined value or more, The wing portion 21 vibrates due to abrasion of the bearing installed at the shaft end of the wing portion 21 and generates a fan abnormality signal when the current value forms a peak value in the form of a pulse and exceeds the stored current value.

The lighting unit 80 includes a light emitting device such as a light emitting diode and is coupled to the front plate 41 of the display panel unit 40. The lighting unit 80 is electrically connected to the fan failure detection unit 70. When the fan failure detection unit 70 generates a fan failure signal, the fan failure detection unit 70 inputs a fan failure signal And is turned on.

The buzzer section 90 is installed on the front plate 41 of the display panel section 40 as a sound reproducing element such as a piezoelectric element or a speaker. The buzzer unit 90 is electrically connected to the fan failure detection unit 70 and outputs an alarm sound when the fan failure signal is input.

The warning release switch 100 is installed on the front surface of the display panel unit 40. Further, the warning release switch 100 is electrically connected to a power source input to the fan failure detection unit 70 as a one-contact switch. The alarm release switch 100 is configured to allow power to be supplied to the fan failure detection unit 70 when the switch is turned on and to be supplied to the fan failure detection unit 70 when the switch is turned off, Power off.

Hereinafter, a method of driving a power supply apparatus for a semiconductor inspection station according to an embodiment of the present invention will be described.

FIG. 9 is a flowchart of a method of driving a semiconductor test center cost power supply according to an embodiment of the present invention.

As shown in FIG. 9, a method of driving a power supply for a semiconductor inspection center according to an embodiment of the present invention includes a power supply step S01, a fan monitoring step S02, a fan abnormality signal output step S03, Step S04.

First, in the power supply step S01, power for semiconductor chip inspection is supplied to the semiconductor inspection equipment from the semiconductor inspection facility cost power supply. In this case, the voltage value and the current value of the power supplied to the semiconductor inspection equipment And the fan 20 is supplied with electric power to cool the power supply module 10 in an air-cooling manner. At the same time, in the power supply step S01, power is supplied to the fan failure detecting unit 70 to drive the fan failure detecting unit 70.

Next, in the fan monitoring step S02, the fan failure detecting unit 70 continuously detects the power failure state and the current value state of the motor unit 22 of the fan 20.

Next, in the fan abnormality signal output step S03, the fan failure detecting unit 70 detects that the motor unit 22 of the fan 20 is disconnected or the motor unit 22 of the fan 20 is overloaded And outputs a fan abnormality signal when the preset current value is exceeded.

Thereafter, in the warning step S04, the fan abnormality signal is inputted to the lighting unit 80 to be illuminated, thereby visually warning the operator of the abnormality of the fan 20, or the fan abnormality signal is inputted to the buzzer unit 90, The operator can be warned of the abnormality of the fan 20 audibly.

In addition, the power source for the semiconductor test center according to the embodiment of the present invention may further include a warning releasing step (S05).

The warning releasing step S05 is a step in which when the lighting part 80 which receives the fan abnormality signal in the warning step S04 continuously emits light or when the buzzer part 90 continuously outputs an alarm sound, To stop the monitoring operation of the fan failure detecting unit 70 by turning off the power of the fan failure detecting unit 70 so that an immediate action is taken so as not to affect the operation of the semiconductor process other than the inspection process .

As described above, since the power supply apparatus for the semiconductor inspection station according to the embodiment of the present invention informs the operator of the failure state of the fan 20 that cools the internal electric elements of the power supply apparatus while supplying the inspection power to the semiconductor inspection equipment, The operator can immediately know when the fan 20 should be replaced. Accordingly, the power supply apparatus for the semiconductor inspection center according to the embodiment of the present invention stops the semiconductor inspection process immediately at the time of failure of the fan 20, prevents untested semiconductor chips from being shipped, So that the life of the power supply device can be prevented from being shortened by preventing the electric elements inside the power supply device from deteriorating.

Next, as described above, when an abnormality of the fan 20 is detected in the power supply for the semiconductor inspection center according to the embodiment of the present invention, the replacement of the fan 20 can be proceeded in the following manner.

FIGS. 10 to 13 are plan views of a work process for replacing a fan in a power supply for a semiconductor inspection facility according to an embodiment of the present invention.

10, the operator releases the bolt connection of the panel separating bolt 60 by releasing the screw connection of the panel separating bolt 60 of the display panel unit 40, (40) is separated from the case (30) so that the opening (31) of the case (30) is exposed.

11, the operator unlocks the fastening member such as the bolt of the fan 20 exposed through the opening 31, separates it from the power supply module 10, The connector 25 of the electric wire is disconnected for power supply of the fan 20 and the fan failure state is detected, and then the failed fan 20 is disconnected.

12, the operator joins the normal new fan 20a to the power supply module 10 through the opening 31, and the connector of the electric wire for power supply of the fan and for detecting the fan failure state (25) is electrically connected to the fan so that the power is applied to the fan and the fan failure detecting unit (70) is electrically connected to the fan.

13, the operator closely contacts the display panel portion 40 so as to cover the open portion 31 of the case 30, and attaches the panel separating bolt 60 to the handle 50 and the display panel 40, And the display panel portion 40 is coupled to the opening portion 31 of the case 30 by bolt coupling to the case 30 through the opening portion 40. [

As described above, according to the embodiment of the present invention, when the operation of replacing the fan 20 is carried out, the power supply for the semiconductor test center can be performed without separating the case 30 from the tower case (not shown) The electric connection and disconnection of the power supply device and the semiconductor inspection equipment and the operation of detaching the case 30 from the tower case and the entire operation of the case 30 It is not necessary to disassemble and replace the fan 20, so that the replacement time of the fan 20 is greatly shortened. Further, the replacement operation of the fan 20 can be performed very easily.

Although the present invention has been described in connection with what is presently considered to be preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined in the appended claims.

10; Power supply module 11; The input-
12; Bias unit 13; Rectifying part
14; A switching unit 15; The output-
16; Converter section 20; Pan
21; A wing portion 22; The motor section
23; A motor drive circuit 24; wire
25; Connector 30; case
31; An opening 32; Bolt coupling ball
40; A display panel section 41; Front plate
41a; Bolt through hole 42; Liquid crystal
43; Information converting unit 50; handle
51; Bolt opening 60; Panel detachment bolt
70; A fan failure detecting unit 80; The lighting unit
90; A buzzer section 100; Warning Release Switch

Claims (7)

A power supply module for supplying power to the semiconductor inspection equipment with a voltage value and a current value required by the semiconductor inspection equipment; A fan installed around the power supply module and cooling the power supply module in an air cooling manner; A housing having a housing space for housing the power supply module and the fan, and having an opening formed at one side thereof; A display panel unit coupled to an opening of the case and displaying a voltage value and a current value supplied from the power supply module to the semiconductor inspection equipment; And a fan failure detecting unit which is electrically connected to the motor unit of the fan and generates a fan abnormality signal when the current value of the motor unit increases by a predetermined value or more because the motor unit of the fan is cut off or an overload is applied to the motor unit of the fan, Lt; / RTI >
Wherein the fan is disposed between the display panel unit and the power supply module, and the display panel unit is detachably coupled to the opening unit.
The method according to claim 1,
A bolt coupling hole is further formed in the case, a bolt passage hole is further formed in the display panel portion,
Bolts not the construction is formed, the bolt mounting the ball and the coupling hole and the bolt handle to be brought into close contact with the display panel such that the ball neolbu match the bolt barrel; And
A panel detachment bolt for fixing the handle to the display panel unit, the body being screwed to the bolt coupling hole through the bolt through-hole and the bolt passage hole, and the head part being in close contact with the handle;
Further comprising: a semiconductor test center cost power supply.
delete The method according to claim 1,
A lighting unit installed on a front surface of the display panel unit and electrically connected to the fan failure detection unit to emit light when the fan failure signal is input;
Further comprising: a semiconductor test center cost power supply.
The method according to claim 1,
A buzzer unit installed on a front surface of the display panel unit and electrically connected to the fan fault detection unit to output an alarm sound when the fan fault signal is input;
Further comprising: a semiconductor test center cost power supply.
The method according to claim 1,
An alarm release switch installed at a power terminal input to the fan failure detection unit and configured to supply power to the fan failure detection unit when the device is turned on and to shut off power supplied to the fan failure detection unit when the device is turned off;
Further comprising: a semiconductor test center cost power supply.
A power supply for inspecting a semiconductor chip is provided with a semiconductor inspection device and power is supplied to the fan so that the fan cools the power supply module in an air cooling manner, A supply step;
A fan monitoring step of continuously detecting a power failure state and a current value state of the motor unit of the fan by the fan failure detection unit;
A fan abnormality signal output step of outputting a fan abnormality signal when the fan failure detection unit detects that the motor of the fan is disconnected or when an overload is applied to the motor unit of the fan and a predetermined current value is exceeded; And
A warning step of receiving the fan abnormality signal to emit light when the lighting unit receives the fan abnormality signal, and outputting an alarm sound by receiving the fan abnormality signal;
The method comprising the steps of:

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