KR101703685B1 - Dimpling Apparatus for TWB and Dimpling method of TWB - Google Patents

Abstract

The present invention minimizes the height deviation between the thin plate portion and the thick plate portion in a plurality of stacked stacks after dimpling so that the transportation, storage and handling of the TWB can be made accurately and easily, The present invention relates to a TWB dimpling apparatus and a TWB dimming method for improving a height of a thin plate portion and a thick plate portion of a stacked TWB stack, A press for performing dimpling on a thin plate of TWB; And a controller for controlling the press to control the press in response to a difference in height between the thin plate portion and the thick plate portion based on the measurement result, wherein the height difference is electrically connected to the height measuring device and the press to receive the measurement result measured by the height measuring device, And a control unit for performing ring processing.

Description

[0001] The present invention relates to a dimpling apparatus for a TWB and a dimpling method for the TWB,

The present invention relates to a TWB dimming device and a TWB dimming method, and more particularly, to a TWB dimming device for minimizing the height deviation between a thin plate portion and a thick plate portion in a plurality of stacked stacks after dimpling, To a TWB dimpling device and a TWB dimpling method for improving the productivity of a product using the TWB.

Generally, a TWB (Tailor Welder Blanks) is manufactured by cutting a steel sheet having different thickness, strength, or material to an appropriate size (cutting) and then welding it with a laser This welding method is mainly used for reinforcement parts for the body. The steel sheet processed by the TWB method has a reduced number of parts compared with the conventional forming method, and the weight of the steel sheet can be reduced because a reinforcing material for connecting the metal sheet is not used. In addition, the steel plate processed by the TWB method is superior in quality and safety to a general steel plate. TWB products are mainly used for manufacturing automobiles, and have advantages such as reduction of weight of automobile body, improvement of safety, shortening of manufacturing process, and shortening of manufacturing process and cost reduction of automobile manufacturers.

In particular, TWB products are manufactured by welding different thicknesses, i.e., relatively thin plates and relatively thick plates, to maximize the thickness and strength of specific areas and to omit the process of adding stiffeners , Whereby a thick plate portion made of a thick plate and a thin plate portion made of a thin plate coexist in one TWB.

As shown in FIG. 1, when the TWB is produced, the upper surface of the thin plate where the thin plates of the TWB are stacked and the upper surface of the thick plate where the thick plates of the TWB are stacked have different heights, So that the upper surface of the substrate can not be flat.

When the upper surface of the stack can not be flat, automation using a transfer robot or the like is difficult for all TWB transporting and stacking operations, including transferring the TWB stacked for forming a product to a molding machine, and using a transfer robot There is a problem in that the steel sheet itself is deformed or damaged due to dropping during transportation due to incomplete adsorption because the uniform adsorption is not carried out or the incomplete adsorption occurs, which leads to a decrease in productivity.

In order to solve this problem, a dimpling process for forming a dimple on a thin plate for compensating the height of the thin plate is performed during the production of the TWB, and usually the predetermined portion of the thin plate, A dimple having a depth of 2.0 to 2.8 mm is formed on a portion to be removed without being left, and the dimple heightens the thin plate portion by the thick plate portion, thereby reducing the height deviation between the thin plate portion and the thick plate portion.

However, in the conventional dimpling process, the dimple depth is set so as to compensate for the depth of the dimple ring set in advance, that is, the thickness difference between the thin plate portion and the thick plate portion, The dimpling operation is carried out with respect to the dimming operation. However, this unconditionally dimpling of all the TWB sheets is diminished because of the stacking state of the TWB, i.e., regardless of the height deviation between the thick plate portion and the thin plate portion in the stacked state of the plurality of TWBs, The dimples formed on the thin plate of the TWB located at the lower portion of the TWB stack due to the self weight of the overlapped TWB are not self-centering due to the thickness compensation of the thin plate portion being insufficient, or depending on the kind of the steel, The height of the thin plate portion may be greater than the height of the thick plate portion. In this case, the height of the thin plate portion may be greater than the height of the thick plate portion, In both cases, the thick plate portion and the thin plate portion in the stacked state, which is the original purpose of the dimple ring, There is a problem that it is difficult to completely achieve the object of eliminating the height deviation between the two. For example, when a stack is formed by stacking 200 TWB sheets having a thickness of 0.7 mm and a thickness of 1.6 mm, the thickness of the thin plate portion is 140 mm and the thickness of the thick plate portion is 320 mm, And the depth of the dimple is usually set to 2.0 to 2.8 mm (assuming dimple deformation due to its own weight or the like) in order to compensate for the difference in height, to form dimples for all the thin plates, A difference in height may occur.

Korean Utility Model Laid-Open No. 20-2008-0002375 is directed to a cut-to-thickness customized cut-formed steel sheet having dimples formed therein. When a plurality of TWBs made by welding different types of steel plates having different thicknesses are stacked, In order to prevent the occurrence of an error in the conveyance of the TWB due to the difference in height between the steel plate side and the thin steel plate side, a dimple shape is formed on a steel sheet having a relatively small thickness, Discloses a TWB in which a thin steel plate has a height equal to that of a steel plate having a thick thickness so that the transfer of the TWB by the transfer robot becomes smooth, thereby further improving workability and productivity. .

Korean Patent Registration No. 10-0770951 discloses a dimple ring apparatus capable of automatically setting at least one upper fixed hanger having at least one dimple cylinder and installed at regular intervals, At least one lower fixed hanger provided with a dimple cap and installed at regular intervals, and at least one running shaft for transferring the fixed hanger to a desired position by a predetermined left and right transfer means, A transfer means for transferring the dimple cylinder and the dimple cap to a desired position and a transfer means for transferring the left and right transfer means and the pre- And a controller for automatically controlling the coordinate setting and transferring the apparatuses. Discloses a dimpling machine capable of automatically setting a work time delay due to safety accidents and coordinate settings by a supplier.

Korean Utility Model Publication No. 20-2008-0002375 Korean Patent No. 10-0770951

SUMMARY OF THE INVENTION The present invention has been made in order to solve the conventional problems as described above, and it is an object of the present invention to provide a method and apparatus for accurately transporting, storing and handling TWB by minimizing a height deviation between a thin plate portion and a thick plate portion, And to provide a dimpling device for a TWB and a dimpling method for a TWB for improving the productivity of a product using the TWB.

According to an aspect of the present invention, there is provided a height measuring device for measuring a height of a thin plate portion and a thick plate portion of a stacked TWB stack, A press for performing dimpling on a thin plate of TWB; And a controller for controlling the press to control the press in response to a difference in height between the thin plate portion and the thick plate portion based on the measurement result, wherein the height difference is electrically connected to the height measuring device and the press to receive the measurement result measured by the height measuring device, And a control unit for performing ring processing on the dimple ring.

The height measuring device may include a height measuring sensor selected from the group consisting of a non-contact height measuring sensor, preferably an infrared measuring sensor, a laser measuring sensor, an ultrasonic measuring sensor, and a microwave measuring sensor.

The height measuring device may include a thin plate height measuring device and a thick plate height measuring device.

According to another aspect of the present invention, there is provided a lamination method comprising: laminating sequentially TWBs including a thick plate and a thin plate having different thicknesses; A measuring step of measuring the height of the thick plate portion and the thin plate portion of the stacked TWB stack; And a dimpling step of performing a dimpling process on the TWB to be laminated subsequently when the height difference between the thick plate portion and the thin plate portion is out of a predetermined range.

The dimpling method of the TWB is a dimpling process in which dimpling is performed so that the dimpling position (second position) of the trailing TWB is different from the dimpling position (first position) of the preceding TWB when the TWB is continuously dimpled. Can be performed.

The second position may be spaced from the first position by an interval of 5 to 50 mm.

According to the present invention, it is possible to accurately and easily transport, store and handle the TWB by minimizing the height deviation between the thin plate portion and the thick plate portion in a plurality of stacked stacks after dimpling, The present invention provides a dimpling device for TWB and a dimpling method for TWB for improving the productivity, thereby providing a transfer robot for transferring and stacking all the TWBs, including the operation of transferring the TWB, And it is possible to carry out homogeneous adsorption and conveyance by using a transfer robot or the like and to prevent the occurrence of imperfect adsorption to cause a deformation or damage of the steel sheet itself due to dropping during conveyance It is possible to solve the problems that occur and improve the productivity.

1 is a photograph showing a state of a stack in which a plurality of TWBs are stacked.
Fig. 2 is a schematic diagram showing a dimple ring device for a TWB according to the present invention.
Fig. 3 is a side view showing a press constituting the TWB dimple ring device of Fig. 2; Fig.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

In order to achieve the above object, a TWB dimple ring apparatus according to one aspect of the present invention, which is devised to achieve the above object, includes a thin plate portion A and a thick plate portion B of a stacked TWB (1) stack, A height measuring device (2, 3) for measuring the height of the object; A press 4 for performing dimpling on the thin plate 11 of the TWB 1; And a measuring unit (3) electrically connected to the height measuring instrument (2, 3) and the press (4) to receive measurement results measured by the height measuring instruments (2, 3) (5) for controlling the press (4) to perform dimpling when the difference in height between the upper and lower portions (B) is out of a predetermined range.

The height measuring instruments 2 and 3 function to measure the heights of the thin plate portion A and the thick plate portion B of the stacked TWB 1 stack and transmit the measurement result to the control portion 5 To function to determine the dimpling performance of the thin plate 11 of the following TWB 1.

The height measuring instruments 2 and 3 can be any of those including a sensor capable of measuring the height of the TWB 1, particularly the height of the thin plate portion A and the thick plate portion B of the TWB 1 Preferably a non-contact type height measuring sensor, more preferably a height measuring sensor selected from the group consisting of an infrared measuring sensor, a laser measuring sensor, an ultrasonic measuring sensor, and a microwave measuring sensor, An appropriate sensor may be selected and used depending on the working environment, especially the environment where the stack formed by stacking the TWB 1 is located.

The height measuring devices 2 and 3 may separately include a first height measuring device 2 for measuring the height of the thin plate portion and a second height measuring device 3 for measuring the height of the thick plate portion. The first and second height measuring devices 3 and 4 are separately arranged to measure the thin plate portion A and the thick plate portion B of the stack of the TWB 1 simultaneously and simultaneously transmit the measurement results to the control portion 5 ) So that the measurement speed and the measurement accuracy can be increased.

The press 4 is an apparatus for performing dimpling on the thin plate 11 of the TWB 1, and preferably has a structure as shown in Fig. 3, that is, when dimpling is performed on the thin plate 11, A dimpling die 41 for supporting the dimpling die 41 and a dimpling stamp 42 for shaping the dimple by applying pressure while varying toward the dimpling die 41, A guide roller 43 for guiding and conveying the thin plate 11 between the dimpling die 41 and the dimpling die 41 so as to press the thin plate 11 to form a dimple, (Not shown). Preferably, the press (4) may be one disclosed in Korean Patent No. 10-0770951 filed by the present applicant and entitled " dimpling machine capable of automatic setting. &Quot; Preferably, the press (4) can be controlled and operated by the control unit (5), which will be described later, via the hydraulic system (6).

The control unit 5 is electrically connected to the height measuring instruments 2 and 3 and the press 4 to receive measurement results measured by the height measuring instruments 2 and 3, And controls the press 4 to perform dimpling when the height difference between the thick plate A and the thick plate B is out of a predetermined range. The control unit 5 may be a computer including a storage device, an arithmetic device, and an input / output device. It should be understood that the predetermined range may be appropriately selected according to the size of the TWB 1 to be processed, the size, thickness and type of the thin plate 11 and the thick plate 12 constituting the TWB 1, Preferably in the range of 1 to 5 mm, more preferably in the range of 1.5 to 4.5 mm, and most preferably in the range of 2 to 4 mm. In the case of performing the dimpling process even in the case where the height difference is less than 1 mm, dimpling is performed more frequently in a state in which the height difference is not large. Therefore, when a certain height difference occurs, dimpling is performed to form dimples There is a problem in that too many dimples are formed not in accordance with the object of the present invention in which the height deviation between the thin plate portion and the thick plate portion is minimized in the stack where a plurality of chips are stacked after dimpling, In contrast, when the thickness is more than 5 mm, the frequency of performing the dimpling is too small to meet the object of the present invention in which the height deviation between the thin plate portion and the thick plate portion is minimized in the stack where a plurality of chips are stacked after dimpling So that the dimples of the TWB 1 are not flattened You can.

The depth of the dimple in the dimple ring may be within a range of 1 to 3 mm. The depth of the dimple may have an important influence on the height compensation of the thin plate portion A. If the depth of the dimple is less than 1 mm, the depth of the dimple may be too low to compensate the height sufficiently, There is a problem that too much dimpling is required to achieve height compensation by dimpling of the thickness of the stack, and conversely, when the thickness is more than 3 mm, the depth of each dimple formed is too deep, The dimple is deformed and the height-compensated thin plate portion A is lowered again during the storage and transportation, so that the height difference on the upper surface of the stack can easily recur.

According to another aspect of the present invention, there is provided a method of dimming a TWB, comprising: a laminating step of sequentially laminating TWBs including a thick plate and a thin plate having different thicknesses; A measuring step of measuring the height of the thick plate portion and the thin plate portion of the stacked TWB stack; And a dimpling step of performing dimpling on the TWB to be laminated when the height difference between the thick plate part and the thin plate part is out of a predetermined range.

The laminating step is performed by sequentially laminating TWBs including a thick plate and a thin plate having different thicknesses. That is, in the conventional case, unlike the case of performing the dimpling operation for all the TWB thin plates, the TWBs that have been welded once are laminated, and the height of the thick plate portion and thin plate portion of the subsequently stacked TWB stack is measured And the dimple processing is performed on the TWB to be laminated subsequently when the height difference between the thick plate portion and the thin plate portion is out of a predetermined range based on the measured result.

Therefore, after the laminating step, a measuring step is performed, and the measuring step can be performed by measuring the height of the thick plate portion and the thin plate portion of the stacked TWB stack. The measurement may be performed by height measuring devices installed adjacent to a stack of TWBs stacked in the stacking step, and the height measuring device is as described above. That is, any type of sensor including a sensor capable of measuring the height of the TWB, in particular, the height of the thin plate portion and the thick plate portion of the TWB can be used. Preferably, the sensor includes a noncontact type height measurement sensor, more preferably, A height measuring sensor selected from the group consisting of a sensor, a laser measuring sensor, an ultrasonic measuring sensor, and a microwave measuring sensor, and may be suitable for a working environment, especially an environment where a stack formed by stacking TWB is located, Sensors can be selected and used. Preferably, the thin plate portion and the thick plate portion of the TWB stack are simultaneously measured using a first height meter for measuring the height of the thin plate portion and a second height meter for measuring the plate portion height, Simultaneous measurement results can be sent to the control unit to increase the measurement speed and measurement accuracy. .

The dimpling may be performed by performing a dimpling process on the TWB to be laminated when the height difference between the thick plate portion and the thin plate portion of the TWB is out of a predetermined range, and the dimple ring is controlled by the controller as described above The press used for the dimpling may be as described above, and the press may be implemented by driving the press in accordance with Korean Patent No. 10-0770951 (entitled " automatic setting ") filed and registered by the present applicant, A possible dimpling machine).

Particularly, in the method of dimming the TWB according to the present invention, when the TWB is continuously dimpled, the dimming position (second position) of the trailing TWB is positioned different from the dimpling position (first position) of the preceding TWB A dimpling process for dimpling may be performed, and the second position may be spaced apart by an interval of 5 to 50 mm from the first position. This is because when the dimple ring is performed on the thin plate of the TWB as described above, the dimples prevent the dimples from being formed at the same position over a plurality of TWBs, so that an external force such as vibration So that the compensation of the height difference can not be sufficiently performed. As described above, when the distance from the first position at which the dimple is performed to the thin plate of the preceding TWB is less than 5 mm, the second position where the thinning of the thin plate of the trailing TWB is performed, There is a problem that it is difficult to prevent the dimples from overlapping due to an external force such as shaking and the compensation of the height difference is not sufficiently performed. On the contrary, when the thickness exceeds 50 mm, It may be difficult to form dimples in a predetermined area of the thin plate, particularly in a subsequent product production process, where the dimples are not left in the product and thus the dimpling itself can not be performed.

The present invention can be summarized as shown in Table 1 below by way of illustrative examples. Here, the TWB thick plate having a thickness of 1.6 mm and the thin plate having a thickness of 0.7 mm were used, and the error between the thick plate and the thin plate of TWB was not taken into account, and the thickness difference was calculated arithmetically, Dimpling is performed whenever the difference in thickness between the two ends exceeds 3.0 mm.

As shown in Table 1, when the thickness difference between the thick plate portion and the thin plate portion exceeds 3.0 mm, the thickness difference between the thick plate portion and the thin plate portion can be always controlled within a certain range by performing dimpling. It is possible to carry out dimpling so that the difference in thickness between the thick plate portion and the thin plate portion in the final stack does not exceed a maximum of 4.0 mm at all times even when stacking more than 200 sheets.

According to the above-described configuration, since the height deviation between the thin plate portion and the thick plate portion is minimized in a plurality of stacked stacks after dimpling, the transportation, storage and handling of the TWB can be accurately and easily performed, The present invention provides a TWB dimpling device and a TWB dimpling method for enhancing the productivity of a product to which the TWB is transferred, It is possible to easily perform automation using a transfer robot or the like and uniformly perform adsorption and transfer by using a transfer robot or the like and to prevent the incomplete adsorption from occurring, It is possible to solve the problem of occurrence of damage or the like and to improve the productivity.

1: TWB 11: thin plate
12: Plate 2: First height measuring instrument
3: second height measuring instrument 4: press
41: dimpling die 42: dimpling press
43: Guide roller 44: Hydraulic cylinder
5: Controller 6: Hydraulic system
A: thin plate part B: thick plate part

Claims (7)

A height measuring device for measuring the height of the thin plate portion and the thick plate portion of the TWB stack in which a plurality of TWBs are stacked;
A press for performing dimpling on a thin plate of TWB; And
The TWB stack is electrically connected to the height measuring device and the press to receive the measurement result measured by the height measuring device. Only when the height difference between the thin plate portion and the thick plate portion of the TWB stack exceeds a predetermined range, Controlling the press to control the press so as to perform dimpling processing on the TWB to be laminated subsequently when the height difference between the thin plate portion and the thick plate portion of the TWB stack is within a predetermined range, ;
And a dimple ring for the TWB. The method according to claim 1,
And the height measuring device includes a non-contact type height measuring sensor. 3. The method of claim 2,
Wherein the height measuring device includes a height measuring sensor selected from the group consisting of an infrared measuring sensor, a laser measuring sensor, an ultrasonic measuring sensor, and a microwave measuring sensor. The method according to claim 1,
Wherein the height measuring device includes a thin plate height measuring device and a thick plate height measuring device. A stacking step of sequentially stacking TWBs including a thick plate and a thin plate having different thicknesses to form a TWB stack;
Measuring a height of the thick plate portion and the thin plate portion of the TWB stack; And
When a height difference between the thick plate portion and the thin plate portion of the TWB stack is out of a predetermined range, dimpling processing is performed on the TWB to be laminated subsequently, and when the height difference between the thick plate portion and the thin plate portion of the TWB stack is within a predetermined range, An optional dimpling step of not performing a dimpling process on the TWB to be laminated;
Gt; TWB < / RTI > 6. The method of claim 5,
The dimpling method of the TWB is a dimpling process in which the dimpling position (second position) of the trailing TWB is positioned different from the dimpling position (first position) of the preceding TWB when the TWB is continuously dimpled, Is performed. ≪ Desc / Clms Page number 24 > The method according to claim 6,
Wherein the second location is spaced from the first location by an interval of 5 to 50 mm.

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