KR101696085B1 - Connecting type mold structure - Google Patents

Abstract

The present invention provides a connection-type mold structure including a plurality of mold units having a cooling line adjacent to a forming surface of a material and continuously connected along the forming surface, and a sealing member formed between connected surfaces of the mold units sealing the connected surfaces of the mold units by being pressed and transformed by a force which the adjoining connected surfaces of the mold units adheres to each other to prevent a leakage from the cooling line. The cooling line of the mold unit on one side and the cooling line of the mold unit on the other side are directly connected in the connected surfaces of the mold units, and continuously formed along the forming surface. The mold unit comprises: a mold body wherein the forming surface of the material is formed; the cooling line installed inside the mold body, and formed to be adjacent to the forming surface; and a connection groove unit formed to be recessed in the connected surface of the mold unit wherein the sealing member is inserted and installed. The connection groove unit is formed into a dovetailed shape of which a cross section becomes wider to an inner side of the mold from the connected surface. The transformation of the sealing member is guided to a direction where the cross section of the connection groove unit becomes wider.

Description

CONNECTING TYPE MOLD STRUCTURE [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a connection-type metal mold structure, and more particularly, to a connection-type metal mold structure having improved cooling efficiency of the metal mold.

It should be noted that the contents described in this section merely provide background information on the present invention and do not constitute the prior art.

Recently, automobile manufacturers are increasing the use of high-strength materials in order to meet the social demands for environmentally friendly fuel economy and light weight in applying parts to automobiles. However, molding of a high strength material has problems such as spring back and dimensionality, and the use thereof is limited due to the difficulty of molding.

Such a molding problem can be solved by a method in which a material is molded at a high temperature with good moldability, and at the same time, the material is rapidly cooled in a mold to produce a high-strength part. This method is referred to as a hot press forming process. According to such a process, a component having a strength of usually at least 1500 MPa can be molded.

In the case of hot press forming, it is necessary to cool the molding material at a sufficiently high speed in order to obtain a high strength by a method in which the material is heated to a high temperature and then the molding is completed,

In this case, in order to absorb the heat transferred from the high-temperature molding material to the mold, a cooling hole is formed in the mold and cooling water is flowed in the cooling hole to cool the mold.

However, for efficient cooling, it is ideal when the cooling holes are machined along the forming surface of the component, but there is a problem that the cooling holes are processed only in a linear form, and such cooling holes hardly contribute to the cooling There is a problem that the vertical holes are essentially formed, and unnecessary vertical holes that do not participate in actual cooling must be processed in a large number.

In addition, since the vertical hole is machined inside the metal mold at a certain distance from the outer circumferential surface of the metal mold for structural safety, cooling water does not flow between the outer circumferential surface of the metal mold and the vertical hole.
Korean Patent Laid-Open No. 10-2009-0067765 (mold having a cooling structure, published on Jun. 25, 2009) is disclosed as a prior art of the present invention.

The present invention relates to a mold structure for connecting a plurality of mold units to improve the processability of a cooling hole of a mold and unnecessarily forming a cooling hole and removing a vertical hole which is not directly involved in cooling .

In one aspect, the present invention provides a connection mold structure capable of maximizing cooling efficiency by directly connecting cooling lines to each other on a connection surface of a plurality of connected mold units.

According to an aspect of the present invention, there is provided a mold assembly comprising: a plurality of mold units, each having a cooling line formed adjacent to a molding surface of a workpiece and continuously connected along the molding surface; And a sealing member provided on a connection surface of the mold unit and sealing the connection surface of the mold unit while being pressurized and deformed by a force in which adjacent connection surfaces of the adjacent mold units are in close contact with each other to prevent leakage of the cooling line. Wherein the cooling line of the mold unit on one side and the cooling line of the mold unit on the other side are connected directly to each other at the connection surface of the mold unit and are formed continuously along the molding surface, A mold body on which a surface is formed; A cooling line provided inside the mold body and formed adjacent to the molding surface; And a connection groove portion provided in the form of being inserted into the connection surface of the mold unit and into which the sealing member is inserted, wherein the connection groove portion has a shape in which a cross section is widened toward the inside of the mold unit And the sealing member is deformed in a direction in which a cross section of the connecting groove portion is widened.

Preferably, the diameter of the inner diameter portion of the deformed sealing member may be kept larger than the diameter of the outer diameter portion of the cooling line.

Preferably, the cooling line may extend to an installation surface of the connection groove portion into which the sealing member is inserted.

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Preferably, the base unit further includes a base plate on which a location pin for determining a position of the mold unit to be connected is formed, and a pin insertion hole to be inserted into the location pin may be provided on a bottom surface of the mold unit.

Preferably, the location pin includes a tapered protrusion guide and a separation preventing portion extending from a tapered large-diameter portion of the protrusion guide, wherein the pin insertion hole descends along the location pin, The connecting surface of the unit can be closely contacted.
According to another aspect of the present invention, there is provided a mold apparatus comprising: a plurality of mold units, each having a cooling line formed adjacent to a molding surface of a workpiece and continuously connected along the molding surface; A sealing member provided on a connection surface of the mold unit and sealing the connection surface of the mold unit while being pressurized and deformed by a force in which adjacent connection surfaces of the adjacent mold units are in close contact with each other to prevent leakage of the cooling line; And a base plate on which a location pin for determining the position of the mold unit to be connected is formed, wherein a pin insertion hole for inserting into the location pin is provided on a bottom surface of the mold unit, And a diameter of the pin insertion hole is larger than a diameter of the location pin release preventing portion, and the pin insertion hole has a diameter larger than the diameter of the location pin release preventing portion, The mold unit connected to the mold unit while the holes descending along the location pins are disposed adjacent to each other and the auxiliary connection jig provided between the mold units moves the mold unit in the horizontal direction to closely contact the connection surface.

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Preferably, a plurality of cooling lines are spaced apart from each other at a predetermined distance on a bottom surface of the molding surface, and the mold unit, which is disposed at one end of the plurality of the mold units to be connected, And an outflow line through which the cooling water passed through the inflow line and the cooling line flows out to the base plate is formed in the mold unit disposed at the other end of the plurality of the mold units connected to the inflow line .

The mold unit may further include a side fixing frame for closely fixing both end portions of the plurality of the mold units to be connected.

The fixing unit may further include a fixing jig for fixing the mold unit and the base plate in a state in which the connection surfaces of the mold units are in close contact with each other.

According to another aspect of the present invention, there is provided a mold apparatus comprising: a plurality of mold units, each having a cooling line formed adjacent to a molding surface of a workpiece and continuously connected along the molding surface; A sealing member provided on a connection surface of the mold unit and sealing the connection surface of the mold unit while being pressurized and deformed by a force in which adjacent connection surfaces of the adjacent mold units are in close contact with each other to prevent leakage of the cooling line; And a subsidiary connecting jig provided on both side surfaces of the connecting surface of the mold unit to be connected and closely contacting the connecting surfaces of the connected mold units, wherein cooling lines of the mold unit on one side and cooling Line provides a connection-type mold structure which is directly connected to the connection surface of the mold unit and is formed continuously along the molding surface.

Preferably, the connecting surfaces of the connected mold units may be in close contact with each other while forming inclined surfaces inclined at a predetermined angle in the vertical direction.

Preferably, the sealing member is a ring-shaped O-ring member, and the difference between the diameter of the inner diameter portion of the O-ring member and the diameter of the outer diameter portion of the cooling line is 0.8 to 5.5 mm.

According to an embodiment of the present invention as described above, a plurality of mold units are connected to improve the processability of a cooling hole of a mold, and a hole in a vertical direction, which is unnecessarily formed in the molding process of the cooling hole and does not directly participate in cooling It is possible to reduce the machining cost of the mold.

According to an embodiment of the present invention, the cooling line of the mold unit is directly connected to the cooling line of the mold unit to be connected, so that the cooling water flows smoothly, thereby maximizing the cooling efficiency.

According to an embodiment of the present invention, by forming a connection mold structure by connecting a plurality of mold units, it is possible to improve the convenience of installation of the mold structure by providing the weight of the metal mold structure by weight.

According to an embodiment of the present invention, the connection surfaces of the mold units connected to each other while the pin insertion holes descend along the location pins are closely contacted with each other. Thus, the weight of the plurality of mold units, So that it is possible to secure an excellent sealing performance.

FIG. 1 is a view showing a connection-type mold structure in which cooling lines formed in a plurality of mold units are indirectly connected.
2 is a view illustrating a connection mold structure according to an embodiment of the present invention in which cooling lines formed in a plurality of mold units are directly connected.
3 is a view showing a connection-type mold structure according to an embodiment of the present invention.
4 is a view showing deformation of a sealing member which may occur when a mold member is connected.
5 is a view showing a connection groove portion of a mold member according to various embodiments and a sealing member provided in the connection groove portion.
FIG. 6 is a view showing a connection-type mold structure according to another embodiment of the present invention.
7 is a view illustrating a connection-type mold structure according to an embodiment of the present invention.
Fig. 8 and Fig. 9 are views showing the diameter of the cooling holes, the dimensions of the sealing member, and the like of the various cooling lines having the hole numbers 1 to 10.
FIG. 10 is a view showing the type of the location pin applied to the holes 1 to 10, the pin insertion hole type, whether or not leakage is caused by the use of the auxiliary connection jig, and the tightness of the mold unit.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Further, the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. The shape and size of elements in the drawings may be exaggerated for clarity.

In order to efficiently cool the connection-type mold structure 10, it is ideal when the cooling holes are machined along the molding surface 111 of the component, but the cooling holes must be processed in a linear shape.

1, the cooling water flows upward through the vertical holes in one mold unit 100, passes through the molding surface 111 to cool the mold unit 100, And then flows downward from the base plate 400 at the bottom to the bottom of the next mold unit 100 to be connected again to the next mold unit 100 and then goes up through the vertical holes of the mold unit 100 Structure.

Therefore, as shown in FIG. 1, vertical holes that do not substantially contribute to cooling are essentially formed during the processing of the cooling holes, and unnecessary vertical holes that do not participate in actual cooling are formed in a large number of processes, There is a problem in that the machining cost of the semiconductor device is remarkably increased.

Since the vertical holes are machined inward from the connection surface 113 of the mold unit 100 for the purpose of structural safety, cooling water does not flow between the vertical holes and the connection surface 113, There is a problem of deterioration.

In addition, there is a problem that the machining hole sealing member M must be separately installed.

Therefore, it is necessary to develop a connection-type mold structure 10 that can optimize the cooling efficiency while reducing the processing cost of the mold.

Hereinafter, a connection-type mold structure 10 according to an embodiment of the present invention will be described in detail with reference to the drawings.

2 to 10, a connection-type mold structure 10 according to an embodiment of the present invention includes a plurality of mold units 100, and further includes a sealing member 200, a subsidiary connecting jig 300, A plate 400, a fixing jig 600, and a side fixing frame 500.

2, the connection-type mold structure 10 includes a cooling line 130 formed adjacent to a molding surface 111 of a workpiece, and a plurality of mold units 110, which are continuously connected along the molding surface 111, The cooling line 130 of the mold unit 100 on one side and the cooling line 130 of the mold unit 100 on the other side are connected to the connection surface 113 of the mold unit 100 But may be formed continuously along the molding surface 111. [

It is possible to improve the ease of installation of the connection-type metal mold structure 10 by providing the connection-type metal mold structure 10 in a light weight by connecting the plurality of mold units 100 to form the connection mold structure 10 have.

2, the cooling line 130 may be continuously connected to the cooling line 130 of the adjoining mold unit 100 to be connected to the lower side of the molding surface 111, as shown in FIG.

The molding surface 111 of the connecting mold structure 10 can be continuously formed in the connecting direction of the mold unit 100 while the plurality of mold units 100 are continuously connected to each other, 111) adjacent to each other in the direction of connection of the mold unit (100).

Also, although not shown, the cooling lines 130 connected in series may be formed in a plurality of rows on the bottom surface of the molding surface 111, spaced apart from the connected mold structure 10 at regular intervals.

The connection type mold structure 10 shown in FIG. 2 is different from the connection type mold structure 10 shown in FIG. 1 in that the cooling line 130 between the mold units 100 is connected to the connection surface 113 So that unnecessary vertical holes as shown in FIG. 1 can be reduced and cooling water can be flowed to the end of the connection surface 113 of the mold unit 100, thereby improving cooling efficiency.

The connection mold structure 10 may be formed such that the plurality of mold units 100 are continuously connected in the transverse direction and the cooling line 130 is continuously formed in the lateral direction adjacent to the molding surface 111. [

The plurality of mold units 100 are connected in the horizontal direction so that the molding surface 111 of the connecting mold structure 10 is formed in the horizontal direction and the cooling line 130 is formed in the horizontal direction adjacent to the molding surface 111 Can be continuously formed.

3, the plurality of mold units 100 are connected in the horizontal direction so that the molding surface 111 of the connection-type mold structure 10 is formed in a horizontal direction, and the cooling line 130 And may be formed continuously in the horizontal direction adjacent to the molding surface 111.

At this time, the adjacent cooling lines 130 of the connected mold unit 100 may be formed at mutually corresponding positions and arranged to communicate with each other.

Although not shown, a plurality of mold units 100 are continuously connected to each other in the longitudinal direction of the connection-type mold structure 10, and the cooling line 130 is continuously formed in the longitudinal direction adjacent to the molding surface 111 As shown in FIG.

The sealing member 200 may be provided on the connection surface 113 of the mold unit 100 to prevent leakage of the cooling line 130 as shown in FIG.

That is, the connection-type mold structure 10 includes a plurality of mold units 100 formed with a cooling line 130 adjacent to a molding surface 111 of a work and continuously connected along the molding surface 111, And a sealing member 200 provided on a connection surface 113 of the mold unit 100 of the mold unit 100 to prevent the leakage of the cooling line 130. The cooling line of the mold unit 100 130 may be directly connected to the cooling line 130 of the mold unit 100 to which they are connected.

At this time, the sealing member 200 seals the connecting surface 113 of the mold unit 100 while being pressed and deformed by the force that the adjacent connecting surfaces 113 of the adjacent mold units 100 are in close contact with each other, The diameter of the inner diameter portion of the sealing member 200 may be kept larger than the diameter of the outer diameter portion of the cooling line 130. [

In order to directly connect the cooling line 130 of the connected mold unit 100, a sealing member 200 is provided between the connection surfaces 113 of both the mold units 100, It is necessary to prevent the cooling water from leaking through the cooling pipe 113.

The mold unit 100 may include a mold body 110, a cooling line 130, and a connection groove 150.

The mold unit 100 includes a mold main body 110 in which a molding surface 111 of a material is formed and a cooling line 130 provided inside the mold main body 110 and formed adjacent to the molding surface 111, And a connection groove part (150) inserted in the connection surface (113) of the mold unit (100) and into which the sealing member (200) is inserted, wherein the cooling line (130) To the mounting surface of the connection groove 150 into which the antenna 200 is inserted.

The pin insertion hole 170 of the mold unit 100 moves along the protrusion guide 411 of the location pin 410 of the base plate 400 as shown in FIGS. 3 (a) and 3 (b) There is a gap between the mold units 100 on both sides so that interference between the sealing member 200 and the connecting surface 113 of the mold does not occur.

3 (c), when the pin insertion hole 170 of the mold unit 100 reaches the large diameter portion of the protrusion guide 411 of the location pin 410 of the base plate 400 The mold units 100 on both sides can be brought into close contact with each other at the connecting surface 113.

In this process, the sealing member 200 may be separated from the connection groove part 150 while interfering with the mold member to which the sealing member 200 is closely adhered. As a result, the sealing performance of the connection surface 113 of the mold unit 100 may be deteriorated.

4 (a), when the sealing member 200 is deformed, interference occurs between the sealing member 200 and the cooling line 130, and the flow of the cooling water with the deterioration of the sealing performance The cooling efficiency may be lowered due to disturbance by the sealing member 200, or in the worst case, the sealing may not be completed and leakage may occur.

5 (b), the connection groove part 150 may be provided in a dovetail shape having a cross section widening from the connection surface 113 toward the inside of the mold unit 100, The member 200 may be deformed in a direction in which the cross section of the connection groove portion 150 is widened while being pressed and deformed by the force of the adjacent surfaces 113 of the adjacent mold units 100 being in close contact with each other.

This is to prevent the sealing member 200 inserted into the connection groove portion 150 provided on the connection surface 113 of the mold unit 100 from being detached from the mold unit 100 during the assembly process.

As shown in FIG. 4, when the connection groove part 150 is formed in the dovetail shape, even if the adjacent mold unit 100 is closely contacted while moving in the vertical direction, The coupling groove 150 may be fixed to the deck-tail coupling groove 150 while being deformed in a direction in which the cross-sectional area of the coupling groove 150 is increased toward the inner side rather than being deviated to the outer side of the coupling groove 150.

The sealing member 200 is provided as a ring-shaped O-ring member, and the diameter of the inner diameter portion of the O-ring member is larger than the diameter of the cooling line 130 (see FIG. 4B) May be larger than the diameter of the outer diameter portion.

The sealing member 200 may have a diameter larger than that of the outer diameter portion of the cooling line 130 because the diameter of the inner diameter portion is larger than the diameter of the cooling water passing through the cooling line 130 due to interference between the sealing member 200 and the cooling water. In order to prevent the fluidity of the fluid.

The difference between the diameter of the inner diameter portion of the O-ring member and the diameter of the outer diameter portion of the cooling line 130 may be 0.8 mm or more.

When the distance between the inner diameter portion of the O-ring member and the outer diameter portion of the cooling line 130 is too close, the cooling line 130 due to the deformation during assembly of the O-ring member prevents interference, And to prevent the occurrence of water leakage when the o-ring is deformed to the inside of the cooling hole at the time of assembly. If the distance between the inner diameter portion of the O-ring member and the outer diameter portion of the cooling line 130 is too large, interference with the neighboring cooling holes will occur, thereby causing a problem that the cooling holes need to be spaced farther apart than necessary.

Preferably, the sealing member 200 is a ring-shaped O-ring member, and the difference between the diameter of the inner diameter portion of the O-ring member and the diameter of the outer diameter portion of the cooling line 130 may be in the range of 0.8 to 5.5 mm have.

A subsidiary connecting jig 300 installed on both sides of the connecting surface 113 of the connected mold unit 100 and closely contacting the connecting surface 113 of the connected mold unit 100, As shown in FIG.

The auxiliary connection jig 300 can be applied to the case where the diameter of the pin insertion hole 170 is provided in the form of a slot hole H2 having a diameter larger than the diameter of the separation preventing portion 413 of the location pin 410 have.

The mold unit 100 to which the pin insertion holes 170 are coupled while descending along the location pins 410 may be disposed adjacent to the mold unit.

The connection surface 113 of the mold unit 100 disposed adjacently by the auxiliary connection jig 300 can be closely contacted with the mold unit 100 disposed adjacent to each other.

3, the diameter of the pin insertion hole 170 may be larger than the diameter of the hole H1 having a diameter corresponding to the diameter of the separation preventing portion 413 of the location pin 410, The present invention is not limited thereto.

The mold unit 100 to be lowered while inserting the protrusion guide 411 of the location pin 410 into the pin insertion hole 170 moves finely in the direction of the other mold unit 100 requiring connection, And the auxiliary connecting jig 300 are further brought into close contact with each other, so that the sealing performance can be ensured.

The connecting surface 113 of the mold unit 100 connected primarily by the load of the mold unit 100 itself and the guide pin of the location pin 410 and the pin insertion hole 170 is pressed and sealed, A mold unit 100 connected to the mold unit 100 through the auxiliary connecting jig 300 installed on both sides of the connecting surface 113 of the mold unit 100 and closely contacting the connecting surface 113 of the connected mold unit 100, It is possible to seal the connecting surface 113 of the battery pack 100 by sealing.

The base unit 400 further includes a base plate 400 on which a location pin 410 for determining the position of the connected mold unit 100 is formed as shown in FIGS. 3, 6, and 7, A pin insertion hole 170 inserted into the location pin 410 may be provided on the bottom surface of the housing 100.

2, a connection groove portion (not shown) formed in the mold unit 100 is formed on at least one of the base plate 400 and the mold unit 100 at a connection portion between the base plate 400 and the mold unit 100 150 may be formed in the connection groove portion, and the sealing member 200 may be inserted into the connection groove portion to prevent leakage.

As shown in FIG. 3, the location pin 410 may include a protrusion guide 411 and a release preventing portion 413.

The location pin 410 may include a tapered protrusion guide 411 and a release preventing portion 413 extending downward from the large diameter portion of the protrusion guide 411.

The connection surface 113 of the mold unit 100 to which the pin insertion hole 170 is coupled while descending along the location pin 410 may be closely contacted as shown in FIG.

The pin insertion hole 170 can be inserted into the location pin 410 while the mold unit 100 is vertically lowered.

At this time, the diameter of the pin insertion hole 170 may be in the form of a hole H1 having a diameter corresponding to the diameter of the separation preventing portion 413 of the location pin 410.

The mold unit 100 descending while the protrusion guide 411 of the location pin 410 is inserted into the pin insertion hole 170 moves finely toward the other mold unit 100 requiring connection, May be in close contact with each other.

As shown in the right side of FIG. 3 (a), the location pin 410 includes a location pin 410 of the existing T1 and a location pin 410 of the refined workpiece T2. In the case of the location pin 410 of the existing T1, the ratio of the protrusion guide 411 to the release preventing portion 413 is substantially the same.

In the case of the location pin 410 of the existing T1, the length of the departure prevention portion 413 is considerably long, and as shown in FIGS. 3 (b) and 3 (c) There is a high possibility that deformation of the sealing member 200 occurs while the distance moved while being in close contact with the mold unit 100 increases.

On the other hand, in the case of the location pin 410 of the modified workpiece T2, the mold unit 100 can be fixed while minimizing the length of the departure prevention portion 413, It is possible to prevent the leakage phenomenon of the connection surface 113 of the fuel cell 100.

Therefore, as shown in FIG. 10, when the conventional location pin 410 is applied, the fastening property of the mold unit 100 is lowered due to the deformation of the sealing member 200, The fastening property of the mold unit 100 can be improved when the location pin 410 of the mold unit T2 is applied.

At this time, the height of the deviation preventing portion 413 of the location pin 410 of the quartz workpiece T2 may be 3 mm or more. This is because, when the height of the departure prevention portion 413 of the location pin 410 of the quadrangular workpiece T2 is too small, it is difficult to settle in the correct position when the mold unit 100 is assembled.

6, the location pin 410 may include a tapered protrusion guide 411 and a release preventing portion 413 extending downward from the large diameter portion of the protrusion guide 411 .

At this time, the diameter of the pin insertion hole 170 may be provided in the form of a slot hole H2 having a diameter larger than the diameter of the separation preventing portion 413 of the location pin 410.

The mold unit 100 to which the pin insertion holes 170 are coupled while descending along the location pins 410 may be disposed adjacent to the mold unit.

The connection surface 113 of the mold unit 100 disposed adjacently by the auxiliary connection jig 300 can be closely contacted with the mold unit 100 disposed adjacent to each other.

6 (a) and 6 (b), when the pin insertion hole 170 of the slot hole (H2) type is applied, while the mold unit 100 is vertically assembled, The mold unit 100 of the sealing member 200 can not be brought into close contact with each other, and deformation of the sealing member 200 can be prevented.

6 (c), after the mold unit 100 is completely placed on the base plate 400, the mold unit 100 is moved in the horizontal direction by utilizing the auxiliary connection jig 300, 113 are in close contact with each other so that the sealing can be secured.

At this time, since the sealing member 200 protrudes to some extent in the horizontal direction, it is not possible to obtain perfect close contact of the connection surface 113 simply by a small force.

The mold unit 100 is brought into close contact with the mold unit 100 in the horizontal direction by using the auxiliary connecting jig 300 that moves the mold unit 100 in the horizontal direction, (600) to fix the mold unit (100) in a fixed position.

The auxiliary connection jig 300 may be detachably provided in the mold unit 100.

This is because, after the mold unit 100 is completely fastened by the fixing jig 600, the auxiliary connection jig 300 that tends to horizontally tilt the mold unit 100 is not essential and there is a problem such as interference on the mold If you want to remove it.

As shown in FIG. 2, the apparatus may further include a side fixing frame 500 for closely fixing both ends of the plurality of connected mold units 100.

The side stationary frame 500 may be fixed to the mold unit 100 and the base plate 400 disposed at both ends of the connection mold structure 10. The side stationary frame 500 may be fixed to the base unit 400 by fixing the mold unit 100 and the base plate 400 The fixing jig 600 can be used for fixing.

3, 4 and 7, the connection type mold structure 10 is configured such that the connection surfaces 113 of the mold unit 100 are in close contact with each other, And a fixing jig 600 that fixes the fixing unit 400.

2, a plurality of cooling lines 130 are formed on the bottom surface of the molding surface 111 at predetermined intervals,

An inflow line 180 for introducing cooling water from the base plate 400 to the cooling line 130 is formed in the mold unit 100 disposed at one end of the plurality of the mold units 100 to be connected ,

The cooling water flowing through the inflow line 180 and the cooling line 130 flows out to the base plate 400 in the mold unit 100 disposed at the other end of the plurality of the mold units 100 to be connected An outflow line 190 may be formed.

Cooling water flows into the inflow line 180 formed in the mold unit 100 in a direction perpendicular to the mold unit 100 through the cooling water inlet formed in the base plate 400 and passes through the cooling line 130 formed in the plurality of mold units 100, The cooling water outlet of the base plate 400 may be discharged through the outflow line 190 formed in the vertical direction to the mold unit 100 after the substrate 111 is rapidly cooled.

As shown in FIG. 7, the connecting surface 113 of the adjacent mold unit 100 may form a sloped surface 115 inclined at a predetermined angle? In the vertical direction.

The connection surface 113 of the adjacent mold unit 100 is formed not to be vertical but to be inclined at a predetermined angle in the vertical direction so that the mold unit 100 is fixed to the base plate 400 by the fixing jig 600 The mold unit 100 connected to the fixed mold unit 100 can move along the inclined surface 115 inclined downward from the upper side of the connecting surface 113. [

Accordingly, the interference between the mold unit 100 and the sealing member 200 is minimized, and deformation of the sealing member 200 during the assembly process of the mold unit 100 can be reduced.

FIGS. 8 and 9 show the diameter of the cooling holes of the various cooling lines 130 having the hole numbers 1 to 10, the dimensions of the sealing member 200, and the like.

FIG. 10 is a side view showing the type of the location pin 410 applied to the hall numbers 1 through 10, the type of the pin insertion hole 170, the leakage of water depending on whether the auxiliary connection jig 300 is used, (100) according to the present invention.

As shown in FIGS. 3A and 10, when the location pin 410 of the quartz workpiece T2 is utilized, the number of the mold pins of the mold unit 100 Can be improved.

In addition, as shown in FIGS. 3, 6 and 10, a pin insertion hole 170 of a slot hole (H2) type can be applied.

6 (a) and 6 (b), when the pin insertion hole 170 of the slot hole type H2 and the auxiliary connection jig 300 are simultaneously applied, the mold unit 100 is vertically The mold unit 100 on both sides to be connected can not be closely contacted and deformation of the sealing member 200 can be prevented.

6 (c), after the mold unit 100 is completely placed on the base plate 400, the mold unit 100 is moved in the horizontal direction by utilizing the auxiliary connection jig 300, 113 are in close contact with each other so that the sealing can be secured.

The present invention can be applied to forming a hot press, and the connection mold structure 10 of the present invention can be applied to an upper mold and a lower mold of a hot press.

The connection mold structure 10 of the present invention is vertically arranged so that the connection mold structure 10 disposed on the upper side forms the upper mold and the connection mold structure 10 disposed on the lower side forms the lower mold .

At this time, the first molding surface of the material may be formed on the lower mold, and the second molding surface of the material may be formed on the upper mold.

The upper mold is connected to the upper side of the lower mold, and the material can be formed by the first molding surface and the second molding surface of the material.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. And will be apparent to those skilled in the art.

10: Connectable mold structure 100: Mold unit
110: mold body 111: molding surface
113: connecting surface 115: inclined surface
130: cooling line 150: connection groove
170: pin insertion hole 180: inflow line
190: outlet line 200: sealing member
300: auxiliary connection jig 400: base plate
410: Location pin 411: Extrusion guide
413: Departure preventing portion 500: Side fixing frame
600: Fixing jig H1: Holes
H2: Slot hole M: Machining hole sealing member
T1: Existing location pin T2: Correction workpiece location pin

Claims (13)

A plurality of mold units formed with cooling lines adjacent to a molding surface of a workpiece and continuously connected along the molding surface; And
And a sealing member provided on a connection surface of the mold unit and sealing the connection surface of the mold unit while being pressurized and deformed by a force in which adjacent connection surfaces of the adjacent mold units are in close contact with each other to prevent leakage of the cooling line ,
The cooling line of the mold unit on one side and the cooling line of the mold unit on the other side,
The mold unit being directly connected to the connection surface of the mold unit and formed continuously along the molding surface,
The mold unit includes:
A mold body in which a molding surface of a workpiece is formed;
A cooling line provided inside the mold body and formed adjacent to the molding surface; And
And a connection groove portion that is inserted into the connection surface of the mold unit and into which the sealing member is inserted,
Wherein the connection groove portion has a dovetail shape in which a cross section is widened toward the inside of the mold unit on a connection surface,
Wherein the sealing member comprises:
And a deformation of the connection groove portion is induced in a direction in which a cross section of the connection groove portion is widened.
The method according to claim 1,
Wherein the diameter of the inner diameter portion of the deformed sealing member is kept larger than the diameter of the outer diameter portion of the cooling line.
3. The method of claim 2,
And the cooling line extends to an installation surface of the connection groove portion into which the sealing member is inserted.
delete The method according to claim 1,
And a base plate on which a location pin for determining a position of the mold unit to be connected is formed,
And a pin insertion hole to be inserted into the location pin is provided on a bottom surface of the mold unit.
6. The apparatus of claim 5,
A tapered protrusion guide,
And a separation preventing portion extending from a tapered large-diameter portion of the projecting guide,
And the connecting surface of the mold unit to be connected is closely contacted while the pin insertion hole descends along the location pin.
A plurality of mold units formed with cooling lines adjacent to a molding surface of a workpiece and continuously connected along the molding surface;
A sealing member provided on a connection surface of the mold unit and sealing the connection surface of the mold unit while being pressurized and deformed by a force in which adjacent connection surfaces of the adjacent mold units are in close contact with each other to prevent leakage of the cooling line; And
And a base plate on which a location pin for determining a position of the mold unit to be connected is formed,
Wherein the mold unit has a pin insertion hole for inserting into the location pin,
The location pin
A tapered protrusion guide,
And a separation preventing portion extending from a tapered large-diameter portion of the projecting guide,
Wherein the diameter of the pin insertion hole is larger than the diameter of the location pin release preventing portion,
And the auxiliary connection jig provided between the mold units moves the mold unit in the horizontal direction so that the connection surface is closely contacted with the mold unit. And a connecting mold structure.
6. The method of claim 5,
A plurality of cooling lines are formed on the bottom surface of the molding surface at a predetermined interval,
An inflow line for introducing cooling water from the base plate to the cooling line is formed in the mold unit disposed at one end of the plurality of the mold units to be connected,
And an outflow line is formed in the mold unit disposed at the other end of the plurality of the mold units to be connected to allow the coolant flowing through the inflow line and the cool line to flow out to the base plate.
8. The method according to claim 6 or 7,
And a side fixing frame for closely fixing both ends of a plurality of the mold units connected to each other.
8. The method according to claim 6 or 7,
And a fixing jig for fixing the mold unit and the base plate with the connection surfaces of the mold units being in close contact with each other.
A plurality of mold units formed with cooling lines adjacent to a molding surface of a workpiece and continuously connected along the molding surface;
A sealing member provided on a connection surface of the mold unit and sealing the connection surface of the mold unit while being pressurized and deformed by a force in which adjacent connection surfaces of the adjacent mold units are in close contact with each other to prevent leakage of the cooling line; And
And auxiliary connection jigs provided on both sides of a connection surface of the mold unit to be connected to closely contact the connection surfaces of the connected mold units,
The cooling line of the mold unit on one side and the cooling line of the mold unit on the other side,
Wherein the mold unit is directly connected to the connection surface of the mold unit, and is formed continuously along the molding surface.
The method according to claim 1,
Wherein the connection surfaces of the mold units connected to each other are in close contact with each other while forming inclined surfaces inclined at a predetermined angle in the vertical direction.
The method according to claim 1,
Wherein the sealing member is a ring-shaped O-ring member, and the difference between the diameter of the inner diameter portion of the O-ring member and the diameter of the outer diameter portion of the cooling line is 0.8 to 5.5 mm.

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