KR101694178B1 - Light Emitting Device - Google Patents
Light Emitting Device Download PDFInfo
- Publication number
- KR101694178B1 KR101694178B1 KR1020100070598A KR20100070598A KR101694178B1 KR 101694178 B1 KR101694178 B1 KR 101694178B1 KR 1020100070598 A KR1020100070598 A KR 1020100070598A KR 20100070598 A KR20100070598 A KR 20100070598A KR 101694178 B1 KR101694178 B1 KR 101694178B1
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- KR
- South Korea
- Prior art keywords
- pad
- light emitting
- pads
- soldering
- light
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
- Computer Hardware Design (AREA)
- Nonlinear Science (AREA)
- Led Device Packages (AREA)
- General Engineering & Computer Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
Abstract
The light emitting device according to the embodiment has a curved third pad formed between the light emitting chip and the soldering pad for connecting the ESD device to improve the insulation effect on the driving power.
Description
The present invention relates to a light emitting device, and more particularly, to a light emitting device that prevents a short circuit of a driving power supplied to a light emitting chip while reducing the size of the package.
An LED (Light Emitting Device) that generates light by using an energy band gap of an active layer provided between an N-side nitride and a P-side nitride of a semiconductor can be used not only for living lights such as conventional fluorescent lamps, incandescent lamps, T5, A backlight unit for providing white light has been replaced.
Currently, LEDs are required to be smaller in package size and are required to have higher light intensity.
If the size of the package is to be reduced while the LED is outputting a higher amount of light, it is necessary to take measures to prevent short-circuiting of the direct current driving power supplied to the LED in the inner space of the very narrow package.
The embodiment provides a light emitting device that improves the insulating effect between a plurality of soldering pads.
A light emitting device according to an embodiment of the present invention includes a body having a cavity, a first pad mounted on a bottom surface of the body, for mounting the light emitting chip, a first pad spaced from the first pad on the bottom surface, A second pad, a plurality of soldering pads for connecting the light emitting chip and the ESD element in the first pad and the second pad, and a third pad formed between the first pad and the second pad; And the soldering pads may be arranged adjacent to the third pad.
Here, the third pad is nonconductive and may be formed of one of epoxy, silicon oxide, and PSR (Photo Solder Resistor).
It is also preferable that the third pad has the shortest distance from the plurality of soldering pads.
In addition, a straight line hole may be formed which has the shortest distance between the rim of the third pad and the rim of each soldering pad.
The embodiment provides a light emitting element that maximizes the insulation effect of a soldering pad for mounting a light emitting chip and an ESD element.
In the embodiment, a hole is formed between the solder pad and the third pad so that a short of the positive voltage and the negative voltage, which are defined by the third pad, can be suppressed as much as possible.
1 is a perspective view of a light emitting device according to a first embodiment,
2 is an enlarged view of region A in Fig. 1,
3 is a view of another embodiment of the third pad shown in FIG. 1,
4 is a reference to a third pad according to the second embodiment,
FIG. 5 is a perspective view of a backlight unit according to a first embodiment of the present invention in which the light emitting devices according to the embodiment are arranged in an array,
FIG. 6 is a perspective view of a backlight unit according to a second embodiment of the present invention in which light emitting devices according to the embodiment are arranged in an array, and FIG.
7 is a perspective view of an example in which the light emitting device according to the embodiment is applied to a lighting device.
In the description of the embodiments, it is to be understood that each layer (film), region, pattern or structure may be referred to as being "on", "under", or "on" Quot; on ", " under ", " upper ", and lower " lower " directly "or" indirectly "through " another layer, or structure ".
Further, the description of the positional relationship between the respective layers or structures is referred to the present specification or the drawings attached hereto.
The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size and area of each component do not entirely reflect actual size or area.
Hereinafter, a light emitting device according to an embodiment will be described with reference to the accompanying drawings.
FIG. 1 is a perspective view of a light emitting device according to a first embodiment viewed from above, and FIG. 2 is an enlarged view of a region A of FIG.
1 and 2, a light emitting device according to an embodiment includes a
The
The
The
A
On the other hand, the
Here, the width d4 of the
In the present embodiment, the width of the
The
Here, the encapsulant may be formed by filling a single phosphor with a single layer, filling it with a plurality of layers, or filling a plurality of phosphors with a single layer or a plurality of layers. However, the present invention is not limited thereto.
Meanwhile, in the first embodiment shown and described with reference to FIGS. 1 and 2, the width d4 of the
3 shows a reference to another embodiment of the third pad shown in Fig.
Referring to FIG. 3, the
3, the
4 shows a reference diagram for a third pad according to the second embodiment.
The description of the light emitting chip, the body, the cavity, the bottom surface, and the upper electrode, the lower electrode, and the ESD element of the light emitting device in FIG. 4 is the same as that of the
4, the
On the other hand, the
FIG. 5 is a perspective view of a backlight unit according to a first embodiment of the present invention, in which the light emitting devices according to the embodiment are arranged in an array.
5, the backlight unit includes a
The light emitting
The
6 shows a perspective view of a second embodiment of a backlight unit constructed by arranging the light emitting elements according to the embodiment in an array.
6 illustrates a vertical type backlight unit. Referring to FIG. 6, the backlight unit may include a
At this time, the light emitting
On the other hand, when a plurality of protrusions are formed on the bottom surface of the
The
The
Further, the light emitting device according to this embodiment can be applied to a lighting apparatus.
An example in which the light emitting device according to the present embodiment is applied to the illumination device will be described with reference to Fig.
7, the
Fig. 7 illustrates a fluorescent lamp type light bulb. However, the light emitting device according to the present exemplary embodiment is not limited to the general bulb type, FPL type, fluorescent lamp type, halogen lamp type, metal lamp type, and various other types and socket standards.
The features, structures, effects and the like described in the embodiments are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects and the like illustrated in the embodiments can be combined and modified by other persons skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of illustration, It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
10: body 11: bottom surface
12: first pad 13: second pad
15: third pad 20: cavity
30: light emitting chip 40: ESD element
50:
Claims (12)
A first pad provided on a bottom surface of the body for mounting the light emitting chip;
A second pad spaced apart from the first pad on the bottom surface and mounting the ESD element;
A plurality of soldering pads for connecting the light emitting chip and the ESD device in the first pad and the second pad;
A third pad formed between the first pad and the second pad; And
And a hole provided between the third pad and the plurality of soldering pads,
And the soldering pads are arranged adjacent to the third pad.
The third pad may include:
And a width of 40 占 퐉 or more and 1000 占 퐉 or less.
The third pad may include:
Epoxy, silicon oxide, and PSR (Photo Solder Resistor).
The third pad may include:
The shortest distance to the plurality of soldering pads being the same as the shortest distance.
The third pad may include:
And a curved portion formed on the bottom surface with a width.
The third pad may include:
And the width decreases from one side toward the other side.
Wherein the plurality of soldering pads include:
Wherein at least one of the first pads is provided,
And at least two of the second pads are provided.
The third pad may include:
And a shortest distance between the solder pads and one of the solder pads is equal to a distance from the solder pads arranged on the second pads.
The hole
And a light emitting element provided on a straight line that forms a shortest distance between a rim of the third pad and a rim of each soldering pad.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100070598A KR101694178B1 (en) | 2010-07-21 | 2010-07-21 | Light Emitting Device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100070598A KR101694178B1 (en) | 2010-07-21 | 2010-07-21 | Light Emitting Device |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20120009001A KR20120009001A (en) | 2012-02-01 |
KR101694178B1 true KR101694178B1 (en) | 2017-01-09 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020100070598A KR101694178B1 (en) | 2010-07-21 | 2010-07-21 | Light Emitting Device |
Country Status (1)
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KR (1) | KR101694178B1 (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200342558Y1 (en) | 2003-11-19 | 2004-02-18 | 럭스피아 주식회사 | Side-type light emitting diode package |
KR200414831Y1 (en) | 2006-01-20 | 2006-04-26 | 유니티 옵토 테크노로지 주식회사 | Improved Structure of LED Support |
JP2006165326A (en) | 2004-12-08 | 2006-06-22 | Stanley Electric Co Ltd | Light emitting diode and its manufacturing method |
-
2010
- 2010-07-21 KR KR1020100070598A patent/KR101694178B1/en active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200342558Y1 (en) | 2003-11-19 | 2004-02-18 | 럭스피아 주식회사 | Side-type light emitting diode package |
JP2006165326A (en) | 2004-12-08 | 2006-06-22 | Stanley Electric Co Ltd | Light emitting diode and its manufacturing method |
KR200414831Y1 (en) | 2006-01-20 | 2006-04-26 | 유니티 옵토 테크노로지 주식회사 | Improved Structure of LED Support |
Also Published As
Publication number | Publication date |
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KR20120009001A (en) | 2012-02-01 |
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