KR101691015B1 - Power stack - Google Patents

Abstract

A power stack is provided which can be used by selectively changing the connection state between power users. The power stack includes a substrate portion having a plurality of power elements arranged thereon, a first bus bar plate having a first connection circuit formed in contact with or separated from the substrate portion and connecting between the power elements, A first bus bar, a second bus bar, and a base, and a second bus bar having a second bus bar connected to the first bus bar, And a driving unit for selectively connecting to the bus bar plate.

Description

Power stack {Power stack}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power stack in which power elements are installed, and more particularly, to a power stack in which a connection state between power elements can be selectively changed.

A converter, an inverter, and a rectifier are power conversion devices that convert AC and DC to each other, adjust the size of the output, and adjust the phase and frequency of the AC output to the load. The power produced by the generator is first stabilized via a transformer and is properly converted through these power converters before being provided to the load.

The power conversion device includes a plurality of power devices, and is configured to convert power by an electrical operation of each power device. Since more power devices can be used as the capacity of the power conversion device increases, the power devices can be distributed on a plurality of boards and stacked in order to stably install the power devices.

One or more topologies may be used to place these power devices. That is, the arrangement state of the power devices can be determined in a specific manner in consideration of the convenience in circuit configuration, the efficiency of power conversion, or the specificity of the application subject to which the device is applied. However, the arrangement state of the power devices determined once is very difficult to change again.

That is, since the electric power source is fixed on the substrate by soldering or the like, and these substrates are arranged in a stacked form and are densely packed, it is possible to replace or switch the specific devices even if they operate more or less depending on the topology There is a difficult problem. This makes it difficult to uniformly maintain the lifetime of power devices, and even when the lifetime of the device is unnecessarily reduced due to overheating of a specific device, there is a problem that is very difficult to solve.

Korean Patent Publication No. 10-2001-0104006, (2001, 11.24)

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and it is an object of the present invention to provide a power stack capable of selectively changing a connection state between power users.

The technical problem of the present invention is not limited to the above-mentioned problems, and other technical problems which are not mentioned can be clearly understood by those skilled in the art from the following description.

A power stack according to the present invention includes: a substrate portion in which a plurality of power elements are arranged; A first bus bar plate that is brought into contact with or separated from the substrate portion and has a first connection circuit connecting between the power devices; A second bus bar plate which is brought into contact with or separated from the substrate part and in which a second connection circuit connecting the power devices with the first connection circuit is formed; And a driving unit for moving at least one of the first bus bar plate, the second bus bar plate and the board unit to selectively connect the board unit to the first bus bar board or the second bus bar board.

The first bus bar plate and the second bus bar plate may be disposed parallel to the substrate portion with the substrate portion interposed therebetween.

Wherein the power stack comprises a plurality of contact portions formed on one of the substrate portion and the first bus bar plate or a contact surface where the substrate portion and the second bus bar plate contact each other, And a plurality of connection protrusions connected to the contact portion.

The first connection circuit and the second connection circuit may connect between the plurality of contact portions formed on the first bus bar plate and the second bus bar plate or between the plurality of connection protrusions by different paths.

The driving unit may include a sliding bar connected to the base unit to move the base unit in parallel between the first bus bar plate and the second bus bar plate, and a driving motor for providing a driving force to the sliding bar.

According to the present invention, a connection state between different power devices of a power stack in which a plurality of power devices are arranged can be changed as needed. Therefore, for example, even when a problem such as overheating of a specific device occurs, the connection state between the power devices can be changed so that the device with a small number of operations can replace the device, The overheating problem of the power device can be solved easily.

In this way, it is possible to obtain an extremely useful effect of increasing the life span of the device and enabling more efficient use, by uniformly controlling the number of times of operation of different devices by preventing the devices from being overheated, .

1 is a perspective view of a power stack according to an embodiment of the present invention.
Figure 2 is a side view of the power stack of Figure 1;
3 is a front view of the substrate portion of the power stack of FIG.
4 is a front view and a rear view of a first bus bar of the power stack of FIG.
5 is a front view and a rear view of a second bus bar of the power stack of FIG.
6 is an operation diagram showing a process of connecting the substrate portion to the first bus bar plate.
7 is a view for explaining the connection state between the board portion and the first bus bar plate.
8 is an operation diagram showing a process in which the substrate portion is connected to the second bus bar plate.
9 is a view for explaining the connection state of the board portion and the second bus bar plate.
10 is a flowchart showing an operation sequence of the power stack of FIG.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and methods for achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the present invention is only defined by the claims. Like reference numerals refer to like elements throughout the specification.

Hereinafter, a power stack according to an embodiment of the present invention will be described in detail with reference to FIGS. 1 to 10. FIG.

1 is a perspective view of a power stack according to one embodiment of the present invention, and Fig. 2 is a side view of the power stack of Fig.

1 and 2, a power stack 1 according to an embodiment of the present invention includes a substrate unit 100 on which a plurality of power devices 110 are arranged, And the first bus bar plate 200 and the second bus bar plate 300 are connected to each other by a different path between the first bus bar plate 200 and the second bus bar plate 300, (See 210 in FIG. 4) and the second connection circuit 310 are formed. The power stack 1 may be configured to move at least one of the first bus barb 200, the second bus barb 300 and the base 100 to move the base 100 to the first bus barb 200 or And a driving unit 400 for selectively connecting to the second bus bar board 300. Accordingly, at least one of the first bus barb 200, the second bus barb 300 and the substrate 100 is moved to move the first bus barb 200 and the base part 100 or the second bus barb 300 And the substrate unit 100 can be selectively connected to constitute a circuit.

That is, a plurality of power devices 110 are arranged on the substrate unit 100, and the plurality of power devices 110 are arranged in a path different from that of the first bus bar plate 200 or the first connection circuit 210 in which the first connection circuit 210 is formed The connection state between the power devices 110 arranged on the board unit 100 can be selectively changed by making contact with the second bus bar plate 300 formed with the second connection circuit 310 selectively. Accordingly, for example, among the power devices 110 that perform the same role, the positions of the devices having a relatively large number of operations and the devices having a relatively small number of operations are exchanged with each other, thereby reducing the amount of heat generated by the power devices 110 A plurality of power devices 110 can be used equally. Hereinafter, the power stack 1 having these features will be described in more detail with reference to the respective drawings.

 A plurality of power devices 110 are arranged on the substrate 100. The power device 110 may include various types of devices that can be used in a power conversion process, such as a switching device including a semiconductor switch such as an IGBT, or a rectifying diode device. The power devices 110 may be regularly arranged on the substrate portion 100 at regular intervals. As shown in FIG. 1, the substrate unit 100, the first bus bar plate 200, and the second bus bar plate 300 may be configured as one set, and a plurality of such sets may be formed in parallel. Lt; / RTI > The power devices 110 may be arranged in the substrate 100 in the same manner, and at least one of the power devices 110 may be formed in a different arrangement.

1 and 2, the first bus bar plate 200 and the second bus bar plate 300 are disposed in parallel to the substrate portion 100 with the substrate portion 100 interposed therebetween. Accordingly, the substrate unit 100 moves between the first bus bar plate 200 and the second bus bar plate 300 to selectively contact any one of them. However, such an arrangement is only an example, and is not necessarily limited to such. The arrangement of the first bus barb 200, the second bus barb 300 and the substrate part 100 can be changed in various ways that can be easily contacted with or separated from the substrate part 100. For example, the first bus bar 200 and the second bus bar 300 may be configured to move and selectively contact with the front surface of the substrate 100, or the substrate 100 may be rotated around the axis, It may be possible to configure it to be in contact with the bar plate 200 or the second bus bar plate 300.

That is, the first bus barb 200 and the second bus barb 300 may be formed in various ways that can be selectively connected to the substrate 100. The substrate part 100 is positioned between the first bus bar plate 200 and the second bus bar plate 300 and selectively contacts the first bus bar plate 200 and the second bus bar plate 300 The explanation is based on the configuration. In this case, since the board portion 100 is easily connected and separated only by the parallel movement in the space between the first bus bar board 200 and the second bus bar board 300, the space utilization is greatly increased .

The first bus bar 200 and the second bus bar 300 are connected to a first connection circuit 210 (see FIG. 4) for connecting the plurality of power devices 110 by different paths and a second connection circuit 310 Respectively. Accordingly, the substrate unit 100 can selectively be connected to the first bus bar plate 200 or the second bus bar plate 300 to selectively change the connection relationship between the power devices 110. [ The first connection circuit 210 and the second connection circuit 310 may be formed in such a manner that a plate-shaped conductor such as a bus bar, a power line, or the like is connected by different paths.

The contact portion between the substrate portion 100 and the first bus bar plate 200 or the contact portion between the substrate portion 100 and the second bus bar plate 300 A plurality of contact portions 111 may be formed on any one of the first bus bar side and the second bus side bus bar, and the other one of the contact surfaces may be provided with a plurality of The connection protrusions 211 and 311 can be formed. That is, the first bus bar plate 200 and the substrate portion 100, or the second bus bar plate 300 and the substrate 100, or the second bus bar plate 300 are formed by using a pair of contact portions 111 and connection protrusions 211, It is possible for the portions 100 to be easily connected to each other.

The power stack 1 moves at least one of the first bus bar plate 200, the second bus bar plate 300 and the board portion 100 so that the board portion 100 is separated from the first bus bar 200 And a driving unit 400 for selectively connecting to one of the two bus bar boards 300. The driving unit 400 includes a sliding bar 410 connected to the board unit 100 and moving the board unit 100 in parallel between the first bus bar board 200 and the second bus bar board 300, And a driving motor 420 for providing a driving force to the sliding bar 410. [ As shown in FIGS. 1 and 2, the sliding bar 410 may be connected to a plurality of the substrate portions 100 through different bus bar plates. The first bus barb 200 and the second bus barb 300 may be fixed independently of each other with the power stack 1 formed thereon.

The sliding bar 410 may be formed to include a rack gear or the like coupled to a gear formed on a rotating shaft of the driving motor 420. The driving motor 420 may be a step motor, have. However, the method of forming the driving unit 400 is not limited to this method, and the driving unit 400 may be deformed in various manners in which the substrate unit 100 can be easily moved.

The driving unit 400 may be formed to move the different substrate units 100 simultaneously under the control of a control unit so that each substrate unit 100 is moved by the first bus bar 200 2 bus baffle 300, as shown in FIG. The connection state between the plurality of power devices 110 can be easily changed. However, if necessary, it is also possible to connect the driving units 400 to the different substrate units 100, respectively, so that they can independently move.

Hereinafter, the structure of the first bus bar plate, the second bus bar plate, and the substrate portion will be described in more detail with reference to FIGS. 3 to 5. FIG.

FIG. 3 is a front view of the substrate portion of the power stack of FIG. 1, FIG. 4 is a front view and a rear view of the first bus bar plate of the power stack of FIG. 1, Fig. In the drawings, the front surface can be defined as a direction toward the drive motor in the perspective view of Fig. 1, and the back surface can be defined as a direction toward the opposite side.

3, the power device 110 arranged in the substrate unit 100 includes a first diode 110e and a second diode 110f connected in series to each other, a first diode 110e and a second diode 110f A second switching element 110b, a third switching element 110c, and a fourth switching element 110d, which are dispersedly disposed on the substrate 100 around the substrate 110. The first switching element 110a, the second switching element 110b, the third switching element 110c, Each of the power devices 110 can be connected to both ends of the contact part 111 and can be energized. The power device 110 includes a first diode 110e and a second diode 110f, The first switching element 110a and the fourth switching element 110d, the second switching element 110b and the third switching element 110c may be symmetrically arranged. The sliding bar 410 may be connected to one side of the substrate unit 100 to move the substrate unit 100.

Referring to FIG. 4, a first connection circuit 210 is formed on the first bus bar 200. The first connection circuit 210 may be formed in a shape as shown in FIG. 4 (a) as viewed from the front of the first bus bar plate 200, The first connection circuit 210 may be formed in a shape as shown in FIG. 4 (b). The first connection circuit 210 may be formed in such a manner that one of the connection protrusions 211 protruding from the first bus bar 200 is connected continuously or intermittently.

Referring to FIG. 5, a second connection circuit 310 is formed on the second bus bar 300. The second connection circuit 310 may be formed in a shape as shown in FIG. 5 (a) as viewed from the front of the second bus bar plate 300, The second connection circuit 310 may be formed in a shape as shown in FIG. 5 (b). The second connection circuit 310 may also be formed in such a manner that one of the connection protrusions 311 protruding from the second bus bar 300 is connected continuously or intermittently. The first connection circuit 210 and the second connection circuit 310 may be formed symmetrically with respect to each other and their arrangement directions may be reversed with respect to each other.

That is, the first connection circuit 210 and the second connection circuit 310 are connected to each other between a plurality of connection protrusions 211 and 311 formed on the first bus bar 200 and the second bus bar 300, And connected by a path. However, the present invention is not limited to this, and in the case where connection protrusions are formed on the base plate 100 and contact portions are formed on the first bus bar plate 200 and the second bus bar plate 300, The first connection circuit 210 and the second connection circuit 310 may be formed by connecting the first connection circuit 210 and the second connection circuit 310 with each other. The first and second connection circuits 210 and 310 extending in different paths as described above allow the power elements 110 arranged in the substrate portion 100 to be electrically connected to the first bus barb 200 and the second bus bar 200, When one of the bus bar boards 300 is connected to the board unit 100, the connection state between the bus bars 300 is selectively changed through different paths.

Hereinafter, with reference to FIGS. 6 to 9, a process of selectively connecting the substrate portion to the first bus barb board or the second bus barbanner will be described in more detail.

7 is a view for explaining a connection state between the substrate portion and the first bus bar plate, and FIG. 8 is a sectional view of the substrate portion between the second bus bar plate and the second bus bar plate. And FIG. 9 is a view for explaining the connection state of the board portion and the second bus bar plate. FIG. 7 (a) shows a cross section taken along the line A-A 'of FIG. 6, and FIG. 9 (a) shows a cross section taken along the line B-B' of the power stack of FIG.

First, as shown in FIG. 6, the driving unit 400 operates to move the sliding bar 410 to one side. The substrate unit 100 is connected to the sliding bar 410 so that the substrate unit 100 can move together in a direction in which the sliding bar 410 moves and can be completely in contact with the first bus bar plate 200. Particularly, when the connection protrusions 211 and the contact portions 111 are in close contact with each other, the power elements 110 are connected to each other along the first connection circuit 210 (see FIG. 7).

The connection relationship between the first connection circuit 210 and the power device 110 can be shown in FIG. 7A and expressed as a circuit diagram in which the power devices 110 on the substrate 100 are connected to each other 7 (b). 7A and 7B, when the first bus bar 200 and the substrate 100 are connected to each other, the first and second switching elements 110a and 110b One end of the third switching element 110c and the fourth switching element 110d are connected to the input terminal of the second diode 110f, The other end of the third switching element 110b and the other end of the third switching element 110c are connected in series. At this time, the other ends of the first switching device 110a and the fourth switching device 110d may be separated from each other.

In this case, a neutral line is connected between the first diode 110e and the second diode 110f, and the DC terminals are connected to the other ends of the first switching element 110a and the fourth switching element 110d, . When the power source is applied, the first switching device 110a and the third switching device 110c operate in a complementary manner, and the second switching device 110b and the fourth switching device 110d operate in a complementary manner, DC power can be converted into AC power and output. The substrate unit 100 is connected to the first bus bar plate 200 and can operate in this manner.

8, when the sliding bar 410 is moved to the other side opposite to the operation of the driving unit 400, the board unit 100 is separated from the first bus bar board 200 and the second bus bar board 300 . At this time, the connection protrusions 311 and the contact portions 111 described above are brought into close contact with each other, and the power elements 110 along the second connection circuit (see 310 in FIG. 9) .

 The connection relationship between the second connection circuit 310 and the power device 110 can be illustrated as shown in FIG. 9A and expressed as a circuit diagram in which the power devices 110 on the substrate 100 are connected to each other And can be shown as FIG. 9 (b). That is, when the second bus bar plate 300 and the substrate unit 100 are connected to each other, as shown in FIGS. 9A and 9B, the first and second switching elements 110a and 110b One end of the third switching element 110c and the fourth switching element 110d are connected to the input terminal of the second diode 110f, The other ends of the fourth switching element 110a and the fourth switching element 110d may be connected in series and the other ends of the second switching element 110b and the third switching element 110c may be separated from each other.

In this case, a neutral line is connected between the first diode 110e and the second diode 110f, and a DC terminal is connected to the other end of the second switching element 110b and the third switching element 110c, Can be applied. At this time, the first switching device 110a operates in a complementary manner with the third switching device 110c, the second switching device 110b operates in a complementary manner with the fourth switching device 110d, The element position is changed so that the switching element 110b and the third switching element 110c are connected. The substrate portion 100 may be connected to the second bus bar plate 300 and operated in this same manner, but the position of the element on the circuit may be changed.

In the case of the topology in which four different switching elements are connected as described above, the number of switching operations of the switching elements directly connected to the power source side may be larger than the number of switching operations of the remaining switching elements. The first and second switching elements 110a and 110d may be connected directly to the power supply side by connecting the substrate unit 100 to the first bus bar plate 200 as described above, Can be selectively connected to the second bus bar plate 300 so that the second switching device 110b and the third switching device 110c are directly connected to the power supply side. Accordingly, the number of switching times of each switching element can be made uniform, and the load can be maintained so as not to be applied to only one switching element, thereby prolonging the lifetime of the element and greatly reducing the heat generation amount.

Hereinafter, an operation sequence of the power stack according to an embodiment of the present invention will be described in detail with reference to FIG.

10 is a flowchart showing an operation sequence of the power stack of FIG.

Referring to Fig. 10, the power stack (see 1 in Fig. 1) operates in the following manner to equalize the load applied to each element, reduce the heat generation amount, and increase the life of the device. First, the entire power conversion apparatus formed by arranging the power stack 1 is driven first, and the driving state of the apparatus is monitored through the control unit of the power conversion apparatus (S100).

As a result, it is judged that the switching element of the power stack 1 may be unreasonable if the number of times that the power conversion apparatus operates at the rated output counts and the power output apparatus operates at a rated output of more than a predetermined number of times. For example, it is possible to determine whether the number of times that the power conversion apparatus is driven to the rated output is 100 or more and determine the number of times that the power conversion apparatus is driven (Step S200).

1) of the power stack 1 is divided into a first bus bar plate (see 200 in Fig. 1) and a second bus bar plate (300 in Fig. 1) in the manner as described above, (Refer to FIG. 1), and is brought into close contact with the other. Accordingly, the connection state between the power devices (see 110 in FIG. 1) arranged in the power stack 1 is changed to switch the power stack 1 (S300).

At this time, switching of the power stack 1 can be performed when the voltage of the DC link is less than 10 V in a state where the power conversion apparatus is not operated. When the switching is completed in a state in which the safety is secured as described above, the driving signal applied to the switching element is changed corresponding to the position of the changed switching element, and the number of times of operation is initialized (S400). In this manner, the elements can be normally operated corresponding to the changed positions of the switching elements.

This process can be repeatedly performed after that. That is, when the power conversion apparatus is continuously operated, the initialized number of operations is counted again, and the number of times driven by the rated output is counted. If the number of times exceeds 100, the power stack 1 can be switched again (S500) . When the sliding bar (see 410 in FIG. 1) and the like are connected to the plurality of board portions 100 as described above, the different board portions 100 are simultaneously connected to the respective first bus barb 200 and the second bus barb 100, (300), and can be switched at once.

Thus, in this way, power devices can be used uniformly without unnecessarily heavy loads or repeatedly switching devices, which can equalize the load on the device, reduce the heating value, and effectively increase the life of the device Do.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

1: power stack 100: substrate portion
110: power device 110a: first switching device
110b: second switching element 110c: third switching element
110d: fourth switching element 110e: first diode
110f: second diode 111: contact portion
200: first bus bar plate 210: first connection circuit
211, 311: connection protrusion 300: second bus barb
310: second connection circuit 400:
410: Sliding bar 420: Driving motor

Claims (5)

A substrate portion in which a plurality of power elements are arranged;
A first bus bar plate that is brought into contact with or separated from the substrate portion and has a first connection circuit connecting between the power devices;
A second bus bar plate which is brought into contact with or separated from the substrate part and in which a second connection circuit connecting the power devices with the first connection circuit is formed; And
And a driving part for moving at least one of the first bus barb, the second bus barb, and the board part to selectively connect the board part to the first bus bar board or the second bus bar board. 2. The power stack of claim 1, wherein the first bus barb and the second bus barb are disposed parallel to the substrate portion with the substrate portion therebetween. The plasma display panel of claim 1, further comprising: a plurality of contact portions formed on any one of the substrate portion, the first bus bar plate, or the contact surface where the substrate portion and the second bus bar plate contact each other, And a plurality of connection protrusions connected to the contact portions. The electronic apparatus according to claim 3, wherein the first connection circuit and the second connection circuit are provided between a plurality of the contact portions formed on the first bus bar plate and the second bus bar plate, or between the plurality of connection protrusions A power stack connected by a path. [2] The apparatus of claim 1, wherein the driving unit comprises: a sliding bar connected to the substrate unit to move the substrate unit in parallel between the first bus bar plate and the second bus bar plate;
And a driving motor for providing a driving force to the sliding bar.

Images