KR101686633B1 - Antenna module package and method of fabricating the same - Google Patents

Abstract

The present invention relates to a chip antenna in which an antenna coil is wound on at least a part of a core; And a chip antenna coupled to the chip antenna and capable of performing an illumination function in addition to the chip antenna function, the chip antenna comprising: an antenna coil wound around at least a part of the core; And a sensor coupled to the chip antenna, the sensor being used to recognize or recognize a surrounding situation in addition to the chip antenna function, or a chip antenna having an antenna coil wound on at least a part of the core; And a camera module coupled to the chip antenna and capable of photographing an object in addition to the chip antenna function, and a method of manufacturing the antenna module package.

Description

An antenna module package and method of fabricating the same

The present invention relates to an antenna module package and a manufacturing method thereof, and more particularly, to an antenna module package capable of performing various additional functions in addition to an antenna function and a manufacturing method thereof.

Recently, batteries are being used in portable terminals such as smart phones and tablet PCs. Various technologies for facilitating the charging of the battery using the above-described wireless charging techniques have been developed as the portable terminals evolve. In recent years, mobile devices including a wireless charging antenna structure and an antenna function capable of transmitting and receiving various frequency bands have been introduced.

In addition, a battery or a product directly coupled to the main board of the portable terminal has been introduced. However, in this case, a process of separately joining the various antenna structures to the battery is additionally required to increase the manufacturing cost, Space is required, which leads to the problem that the size of the battery is increased for purposes other than charging.

However, in order to reduce the thickness of the portable terminal, when the antenna coil is installed in the portable terminal body or the battery case of the portable terminal, a connection contact connected to the detachable battery is required. In addition, a coil may be provided on one surface of the battery of the portable terminal, but the problem that the thickness of the battery becomes thick can not be avoided.

It is another object of the present invention to provide an antenna module package for reducing a common space and a manufacturing method thereof. However, these problems are exemplary and do not limit the scope of the present invention.

According to one aspect of the present invention, an antenna module package is provided. The antenna module package comprising: a chip antenna having an antenna coil wound on at least a part of a core; And a device coupled to the chip antenna and capable of performing an illumination function in addition to the chip antenna function.

The antenna module package may further include a sensor disposed adjacent to the device and coupled to the chip antenna to be used to recognize or recognize a surrounding situation.

According to another aspect of the invention, an antenna module package is provided. The antenna module package comprising: a chip antenna having an antenna coil wound on at least a part of a core; And a sensor coupled to the chip antenna, the sensor being used for recognizing or recognizing a surrounding situation in addition to the chip antenna function.

In the antenna module package, the sensor may include at least one of an illuminance sensor, a heart rate sensor, a temperature sensor, a pressure sensor, a salinity sensor, and a gas sensor.

According to another aspect of the present invention, an antenna module package is provided. The antenna module package comprising: a chip antenna having an antenna coil wound on at least a part of a core; And a camera module coupled to the chip antenna and capable of photographing an object in addition to the chip antenna function.

In the antenna module package, the chip antenna may perform at least one of an NFC antenna, a wireless charging antenna, and a wireless card payment antenna.

In the antenna module package, the chip antenna may be mounted on a printed circuit board (PCB) or a conductive plate.

In the antenna module package, a pad portion may be formed on a lower surface of the substrate, the pad portion being electrically connected to the main board.

The antenna module package may include a molding part that can prevent defects of the chip antenna by sealing at least a part of the antenna coil with a sealing material.

In the antenna module package, the chip antenna may include a groove penetrating from a top surface to a bottom surface of the core, and the antenna coil surrounds an outer surface of the core.

According to another aspect of the present invention, an antenna module package is provided. The antenna module package comprising: a chip antenna having an antenna coil wound on at least a part of a core; And a flash LED coupled to the chip antenna and capable of performing an illumination function in addition to the chip antenna function.

The antenna module package may further include an illuminance sensor disposed adjacent to the flash LED and coupled to the chip antenna to operate according to the brightness of light in the vicinity of the object.

According to another aspect of the present invention, an antenna module package is provided. The antenna module package comprising: a chip antenna having an antenna coil wound on at least a part of a core; And a light sensor coupled to the chip antenna, the light sensor being capable of operating in accordance with the brightness of light in the vicinity of the object other than the chip antenna function.

According to another aspect of the present invention, a method of manufacturing an antenna module package is provided. A method of manufacturing an antenna module package includes: preparing a chip antenna in which an antenna coil is wound on at least a portion of a core; Sealing at least a portion of the antenna coil with a first encapsulant to protect the chip antenna; Mounting at least one of a device, a sensor and a camera module in a groove penetrating from the upper surface to the lower surface of the core; And sealing the inner space with the second encapsulant by mounting at least one of the device, the sensor, and the camera module.

According to another aspect of the present invention, a method of manufacturing an antenna module package is provided. A method of manufacturing the antenna module package includes: preparing a substrate; Mounting a chip antenna in which an antenna coil is wound on at least a part of the core on the substrate; Sealing at least a portion of the antenna coil with a first encapsulant to protect the chip antenna; Mounting at least one of a device, a sensor and a camera module in a groove penetrating from the upper surface to the lower surface of the core; And sealing the inner space with the second encapsulant by mounting at least one of the device, the sensor, and the camera module.

According to the embodiment of the present invention as described above, an antenna module package which is advantageous in integration and miniaturization, has excellent space utilization, can perform various additional functions in addition to antenna functions, and a manufacturing method thereof can be implemented. Of course, the scope of the present invention is not limited by these effects.

1A and 1B are perspective views schematically illustrating a structure of a chip antenna according to an embodiment of the present invention.
2 to 5 are perspective views schematically illustrating the structure of an antenna module package according to various embodiments of the present invention.
6A to 6E are perspective views schematically illustrating a method of manufacturing an antenna module package according to an embodiment of the present invention.
7A to 7F are perspective views schematically illustrating a manufacturing method of an antenna module package according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, Is provided to fully inform the user. Also, for convenience of explanation, the components may be exaggerated or reduced in size.

It is to be understood that throughout the specification, when an element such as a film, region or substrate is referred to as being "on", "connected to", "laminated" or "coupled to" another element, It is to be understood that elements may be directly "on", "connected", "laminated" or "coupled" to another element, or there may be other elements intervening therebetween. On the other hand, when one element is referred to as being "directly on", "directly connected", or "directly coupled" to another element, it is interpreted that there are no other components intervening therebetween do. Like numbers refer to like elements. As used herein, the term "and / or" includes any and all combinations of one or more of the listed items.

Although the terms first, second, etc. are used herein to describe various elements, components, regions, layers and / or portions, these members, components, regions, layers and / It is obvious that no. These terms are only used to distinguish one member, component, region, layer or section from another region, layer or section. Thus, a first member, component, region, layer or section described below may refer to a second member, component, region, layer or section without departing from the teachings of the present invention.

Also, relative terms such as "top" or "above" and "under" or "below" can be used herein to describe the relationship of certain elements to other elements as illustrated in the Figures. Relative terms are intended to include different orientations of the device in addition to those depicted in the Figures. For example, in the figures the elements are turned over so that the elements depicted as being on the top surface of the other elements are oriented on the bottom surface of the other elements. Thus, the example "top" may include both "under" and "top" directions depending on the particular orientation of the figure. If the elements are oriented in different directions (rotated 90 degrees with respect to the other direction), the relative descriptions used herein can be interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a," "an," and "the" include singular forms unless the context clearly dictates otherwise. Also, " comprise "and / or" comprising "when used herein should be interpreted as specifying the presence of stated shapes, numbers, steps, operations, elements, elements, and / And does not preclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups.

Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically showing ideal embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention should not be construed as limited to the particular shapes of the regions illustrated herein, but should include, for example, changes in shape resulting from manufacturing.

1A and 1B are perspective views schematically illustrating a structure of a chip antenna according to an embodiment of the present invention.

1A, a chip antenna 100 according to an embodiment of the present invention includes a core 10, a coil 10, a coil 10, Can be formed. The core 10 may be made of, for example, a nickel ferrite core. In addition, the material of the core 10 can be variously changed according to the wavelength band of the frequency to be used. In general, the ferrite core is made by compressing the iron powder to prevent the eddy current loss at high frequency, The shape of the core can be designed in various forms. Here, the core 10 is a well-known technique, and a detailed description thereof will be omitted.

An antenna coil 20 of at least one of an NFC antenna coil, a wireless charging antenna coil, and a wireless card payment antenna coil wound on at least a part of the one core 10 described above. If all of the antenna coils are formed, the antenna coils 20 may be spaced apart from each other in the same core 10. In addition, if antennas of different frequency bands are required in addition to the antenna function, various antennas may be incorporated depending on the size of the core 10 and the arrangement of the conductive wires.

More specifically, a chip antenna 1000 including an inductor capable of resonating in a constant frequency band can have various winding structures. For example, when the constant frequency band is the NFC frequency band, the NFC antenna coil 20 may be formed in a predetermined shape at the edge of the core 10. The NFC antenna coil 20 can generate a 13.56 MHz frequency band for NFC communication using the resonance generated in the capacitor and communicate with the NFC device.

On the other hand, the NFC antenna coil 20 can be formed by wrapping and surrounding at least a part of the outer surface of the core 10 at least once. The shape in which the NFC antenna coil 20 is wound is in the form of a loop, and the loop has any shape capable of generating an inductance, and the loop is not necessarily limited to a closed loop.

In the same manner as the NFC antenna coil 20, the wireless charging antenna coil and the wireless card payment antenna coil can also be formed by wrapping and surrounding at least a part of the outer surface of the core at least once. At this time, the NFC antenna coil 20, the wireless charging antenna coil, and the wireless card payment antenna coil may be spaced apart from each other and disposed side by side. Here, if both ends of the wireless charging antenna coil are electrically connected to the capacitors, a closed loop is formed, and a frequency band for wireless charging communication of 125 kHz can be generated using the resonance generated in the capacitor to communicate with the wireless charging device .

On the other hand, if both ends of the wireless card payment antenna coil are electrically connected to the capacitors, a frequency band for wireless card settlement of about 250 kHz can be generated using the resonance generated in the capacitor to communicate with the mobile payment system. Here, the frequency band of about 250 kHz may be changed depending on whether the use of the wireless transmission / reception frequency band in the country or abroad is permitted.

In addition, the wireless card settlement frequency band is a frequency band used for mobile settlement, and a frequency band capable of transmitting and receiving wirelessly with a separate external device for connecting a debit card or credit card information to a smartphone app and a smartphone It means. In addition, the wireless card payment antenna function can control a security function in a control unit included in a main body such as a driver IC or a smart phone. Here, the wireless card payment antenna function can be understood as a magnetic secure transmission technique.

Further, although not shown here, the chip antenna 100 may form a pad portion (not shown) on an upper surface or a lower surface. The pad portion may include a plurality of connection terminals, and may be formed of a conductive pad. And may be electrically connected to the main board by the pad unit. Further, since the insulator is formed between the pad portion and the core 10, the connection terminals can be insulated from each other.

 The main board includes a main board of an electronic device (for example, a smart phone, a mobile phone, a smart pad, or a tablet computer) electrically connected to the battery pack to receive power from the battery pack or supply power to the battery pack can do. Hereinafter, the main board may be referred to as a main set.

Referring to FIG. 1B, the chip antenna 100 is wound with the antenna coil 20 surrounding the outer surface of the core 10, as described above with reference to FIG. 1A, And therefore it is omitted. The chip antenna 100 shown in FIG. 1A differs from the chip antenna 100 shown in FIG. 1B in an inner space formed by a groove H passing through the lower surface of the core 10 from the upper surface thereof . It is possible to perform various functions at the same time by combining at least one additional device capable of performing an additional function in addition to the antenna function in the inner space. In addition, it is possible to perform various functions in an electronic device such as a portable electronic device The utilization can be higher. Here, the attachment device may include at least one of a device, a sensor, and a camera module, for example. A detailed description thereof will be given later with reference to Figs. 2 to 5.

2 to 5 are perspective views schematically illustrating the structure of an antenna module package according to various embodiments of the present invention.

Referring to FIG. 2, an antenna module package 1100 according to an embodiment of the present invention is coupled to the chip antenna 100 shown in FIG. 1A or 1B and performs a lighting function in addition to the function of the chip antenna 100 And may include an element 200, Here, the device 200 can be roughly classified into an LED device or a lamp device. The LED device includes a flash LED, a general LED, an LED of a wafer level packaging (WLP), a chip scale packaging (CSP) LEDs, and infrared (IR) LEDs. Here, in the case of the element 200, one of the above-described elements may be used, or a commercially available element may be selected according to a desired characteristic (use). The element 200 is a known technology, A detailed description thereof will be omitted.

Specifically, when the chip antenna 100 shown in FIG. 1A is used, the antenna 200 and the lighting function can be performed simultaneously by stacking the elements 200 on the upper surface of the chip antenna 100. [ The detailed description of the chip antenna 100 is the same as that described above with reference to FIG. In this case, since a separate molding process can be omitted, the process time and cost can be reduced.

On the other hand, when the chip antenna 100 shown in FIG. 1B is used, the device 200 may be disposed in an inner space defined by a groove H penetrating downward from an upper portion of the core 10. If the chip 200 and the chip antenna 100 having the same size are used, a much more advantageous effect can be obtained in terms of space utilization.

Referring to FIG. 3, an antenna module package 1200 according to another embodiment of the present invention includes a chip antenna 1200 shown in FIG. 1A or 1B, (300) coupled to the antenna (100) and utilized for recognizing or recognizing the surrounding situation in addition to the function of the chip antenna (100). Here, the sensor 300 may include at least one of an illuminance sensor, a heart rate sensor, a temperature sensor, a pressure sensor, a salinity sensor, and a gas sensor. In addition to the above functions, Various sensors can be used. At this time, one of the commercially available sensors can be selected according to a desired characteristic. Each of the sensors 300 is a well-known technique, and a detailed description thereof will be omitted. The method of combining the chip antenna 100 and the sensor 300 is the same as that described above with reference to FIG.

Referring to FIG. 4, an antenna module package 1300 according to another embodiment of the present invention includes an antenna module package 1300 in addition to the antenna module package 1100 shown in FIG. 2, One sensor 300 may be further included. In this case, the chip antenna 100, which is larger than the size of the chip antenna 100 shown in FIG. 2, can be used. In addition to the antenna function, the additional devices capable of simultaneously performing the illumination function and various sensor functions are combined There is an advantage that space utilization is more advantageous. In addition, devices that can perform other additional functions can be selectively added or changed.

For example, the antenna module package 1300 may include a chip antenna 100. It is also possible to use a flash LED element 200 coupled to the chip antenna 100 and capable of performing an illumination function in addition to the function of the chip antenna 100 and disposed adjacent to the flash LED element 200 When using a light sensor 300 coupled with the chip antenna 100 and capable of operating in accordance with the brightness of the light in the vicinity of the object, the flash LED element 200 and the illuminance sensor 300 And can operate in conjunction with each other. If the surroundings of the object are dark, the illuminance sensor 300 operates by operating any arbitrary switch, and when the ambient light sensor 300 detects the ambient brightness, the control unit (not shown) included in the electronic device The function of illuminating the periphery of the object by operating the flash LED element 200 can be performed.

Referring to FIG. 5, an antenna module package 1400 according to another embodiment of the present invention includes an antenna module package 1400 as shown in FIGS. 1A and 1B, as described above with reference to FIGS. And a camera module 400 coupled to the illustrated chip antenna 100 and capable of photographing an object in addition to the function of the chip antenna 100. [ Here, in the case of the camera module 400, the camera module 400 can be selected according to a desired characteristic among commercialized camera modules, and a detailed description thereof will be omitted. The combining method of the chip antenna 100 and the camera module 400 is the same as that described above with reference to FIG. 2 to FIG.

6A to 6E are perspective views schematically illustrating a method of manufacturing an antenna module package according to an embodiment of the present invention.

Referring to FIGS. 6A and 6B, a method of manufacturing an antenna module package according to an embodiment of the present invention can prepare the chip antenna 100 shown in FIG. 1B. The chip antenna 100 may include an inner space formed by a groove H passing through the bottom surface from the upper surface of the core 10. [ And an antenna coil 20 surrounding the outer surface of the core 10 at least once. At least a portion of the antenna coil 20 may then be sealed with the first encapsulant 30 to protect the chip antenna 100 thereafter. The first encapsulant 30 may be, for example, an epoxy molding compound (EMC) or an epoxy. If the EMC is used as an encapsulating material, it is advantageous to minimize the effect of electromagnetic waves on the human body because of the excellent electromagnetic shielding effect.

Referring to FIGS. 6C to 6D, the device 200 and the sensor 300 can be mounted in the inner space shown in FIGS. 6A and 6B. The antenna module package 1300 can be manufactured by sealing the inner space with the second encapsulant 40 after the device 200 and the sensor 300 are mounted. Here, the first encapsulant 30 and the second encapsulant 40 may be molding members of the same material.

6E shows a lower surface of the antenna module package 1300. The pad unit 11 of the chip antenna 100 and the pad 200 are electrically connected to the main board through the device 200 and the sensor 300, Portions 210 and 310 may be formed, respectively.

At least one or more of the device 200, the sensor 300, and the camera module 400 shown in FIG. 5 are mounted to add additional functions in addition to the antenna function, and the remaining internal space is mounted on the second encapsulant 40 ). Here, the detailed description of the element 200, the sensor 300, and the camera module 400 is the same as that described above with reference to FIG. 5, and therefore will not be described.

7A to 7F are perspective views schematically illustrating a manufacturing method of an antenna module package according to another embodiment of the present invention.

Referring to FIG. 7A, in a method of manufacturing an antenna module package according to another embodiment of the present invention, a substrate 50 may be prepared. The substrate 50 may be a conductive plate, such as, for example, a printed circuit board (PCB) or a lead frame.

When a printed circuit board (PCB) is used as the substrate 50, since the pad portions capable of coming into contact with the respective elements are already formed, the elements can be simply mounted. In the case of using the lead frame, The elements can be mounted on the lead frame made of leads. Further, in the embodiments of the present invention, the lead frame may be distinguished from the printed circuit board in which the lead terminals are patterned on the metal frame and on which the metal wiring layer is formed on the insulating core, in terms of structure and thickness. Therefore, when the lead frame is used as a substrate, its thickness is remarkably reduced as compared with the case of using a printed circuit board (PCB), which is a great advantage in space utilization. When a lead frame is used as a substrate, the step of sealing with an encapsulating material may be performed only once, which may be a process advantage.

Hereinafter, for convenience of description, an antenna module package using a printed circuit board (PCB) as the substrate 50 will be described in the embodiment of the present invention.

For example, on the upper surface of the prepared printed circuit board 50, a chip antenna 100 to be mounted as shown in FIG. 7D, a device 200, and a pad portion 51 to be electrically connected to the sensor 300 .

Referring to FIGS. 7B and 7C, the chip antenna 100 shown in FIG. 1B can be prepared later. The chip antenna 100 may include an inner space formed by a groove H passing through the bottom surface from the upper surface of the core 10. [ And an antenna coil 20 surrounding the outer surface of the core 10 at least once. At least a portion of the antenna coil 20 may then be sealed with the first encapsulant 30 to protect the chip antenna 100 thereafter. The first encapsulant 30 may be, for example, an epoxy molding compound (EMC) or an epoxy.

7D to 7E, the device 200 and the sensor 300 can be mounted in the inner space shown in FIGS. 7B and 7C. The antenna module package 1300 can be manufactured by sealing the inner space with the second encapsulant 40 after the device 200 and the sensor 300 are mounted. Here, the first encapsulant 30 and the second encapsulant 40 may be molding members of the same material.

7F is a bottom view of the antenna module package 1300 and shows the pad portions 52 so that the chip antenna 100, the device 200 and the sensor 300 can be electrically connected to the main board .

As described above, by adding additional devices capable of performing a separate function to a chip antenna capable of performing at least one of an NFC antenna, a wireless charging antenna, and a wireless card payment antenna, It can contribute to the reduction of the size of the used product. The additional devices can be connected to the main board of the mobile device without being large in size, such as, for example, an element capable of performing a lighting function, a sensor and a camera module used for recognizing or recognizing the surrounding situation It can be all parts.

In addition, the joining process or the molding process, which is performed individually by combining the additional devices having similar functions in addition to the space utilization effect, for example, by coupling the device and the sensor on one chip antenna or placing the device on the inner space of the chip antenna, So that it is possible to obtain a process time and a cost saving effect.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

10: Core
11, 51, 52, 210 and 310:
20: antenna coil
30: First encapsulant
40: second bag material
50: substrate
100: chip antenna
200: element
300: sensor
400: camera module
1100, 1200, 1300, 1400: antenna module package

Claims (12)

A chip antenna having an antenna coil wound on at least a part of the core; And
An element coupled to the chip antenna and capable of performing an illumination function in addition to the chip antenna function;
/ RTI >
Wherein the chip antenna includes a groove portion penetrating from a top surface to a bottom surface of the core, the antenna coil surrounding the outer surface of the core,
And the element is mounted on the groove,
Antenna module package. The method according to claim 1,
Further comprising a sensor disposed adjacent to the device and coupled to the chip antenna to be used to recognize or perceive a surrounding situation.
Antenna module package. A chip antenna having an antenna coil wound on at least a part of the core; And
A sensor coupled to the chip antenna, the sensor being used for recognizing or recognizing a surrounding situation in addition to the chip antenna function;
/ RTI >
Wherein the chip antenna includes a groove portion penetrating from a top surface to a bottom surface of the core, the antenna coil surrounding the outer surface of the core,
Wherein the sensor is mounted on the groove,
Antenna module package. The method of claim 3,
Wherein the sensor comprises at least one of an illuminance sensor, a heart rate sensor, a temperature sensor, a pressure sensor, a salinity sensor and a gas sensor.
Antenna module package. A chip antenna having an antenna coil wound on at least a part of the core; And
A camera module coupled to the chip antenna and capable of taking an object in addition to the chip antenna function;
/ RTI >
Wherein the chip antenna includes a groove portion penetrating from a top surface to a bottom surface of the core, the antenna coil surrounding the outer surface of the core,
Wherein the camera module is mounted on the groove,
Antenna module package. 6. The method according to any one of claims 1 to 5,
The chip antenna may perform at least one of an NFC antenna, a wireless charging antenna, and a wireless card payment antenna.
Antenna module package. 6. The method according to any one of claims 1 to 5,
Wherein the chip antenna is mounted on a printed circuit board (PCB) or a conductive plate.
Antenna module package. 6. The method according to any one of claims 1 to 5,
The chip antenna being mounted on a substrate and being electrically connected to a main board on a lower surface of the substrate,
Antenna module package. 6. The method according to any one of claims 1 to 5,
And a molding part capable of preventing defects of the chip antenna by sealing at least a part of the antenna coil with an encapsulating material.
Antenna module package. delete Preparing a chip antenna in which an antenna coil is wound on at least a part of the core;
Sealing at least a portion of the antenna coil with a first encapsulant to protect the chip antenna;
Mounting at least one of a device, a sensor and a camera module in a groove penetrating from the upper surface to the lower surface of the core; And
Sealing at least one of the device, the sensor, and the camera module with a second encapsulant in the remaining inner space;
/ RTI >
A method of manufacturing an antenna module package. Preparing a substrate;
Mounting a chip antenna in which an antenna coil is wound on at least a part of the core on the substrate;
Sealing at least a portion of the antenna coil with a first encapsulant to protect the chip antenna;
Mounting at least one of a device, a sensor and a camera module in a groove penetrating from the upper surface to the lower surface of the core; And
Sealing at least one of the device, the sensor, and the camera module with a second encapsulant in the remaining inner space;
/ RTI >
A method of manufacturing an antenna module package.

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