KR101686565B1 - Unit for supplying liquid and Apparatus for treating a substrate with the unit - Google Patents

Unit for supplying liquid and Apparatus for treating a substrate with the unit Download PDF

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Publication number
KR101686565B1
KR101686565B1 KR1020150066813A KR20150066813A KR101686565B1 KR 101686565 B1 KR101686565 B1 KR 101686565B1 KR 1020150066813 A KR1020150066813 A KR 1020150066813A KR 20150066813 A KR20150066813 A KR 20150066813A KR 101686565 B1 KR101686565 B1 KR 101686565B1
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South Korea
Prior art keywords
liquid
liquid supply
diaphragm
flow path
nozzle
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KR1020150066813A
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Korean (ko)
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KR20160133807A (en
Inventor
김강설
유양열
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세메스 주식회사
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Priority to KR1020150066813A priority Critical patent/KR101686565B1/en
Publication of KR20160133807A publication Critical patent/KR20160133807A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Coating Apparatus (AREA)

Abstract

The present invention relates to a liquid supply unit, a substrate processing apparatus including the same, and a liquid supply method. According to an embodiment of the present invention, there is provided a substrate processing apparatus comprising: a chamber for providing a space for processing a substrate; a substrate supporting unit for supporting the substrate in the chamber; and a liquid supply unit for supplying liquid to the substrate supported by the supporting unit Wherein the liquid supply unit comprises a liquid supply line connected to the nozzle and the nozzle, a liquid storage member for storing the liquid and connected to the liquid supply line, and a liquid supply member provided on the liquid supply line, And a liquid supply valve for supplying the liquid supply valve.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a liquid supply unit,

The present invention relates to a liquid supply unit for supplying liquid onto a substrate, a substrate processing apparatus including the liquid supply unit, and a method for supplying liquid.

A photolithography process for forming a circuit pattern by applying a photoresist on a substrate such as a semiconductor wafer in a semiconductor manufacturing process, exposing the resist film in accordance with a predetermined circuit pattern, and developing it is used. In the photolithography process, a processing system in which an exposure apparatus is connected to a coating and developing apparatus is usually used.

Korean Patent Laid-Open Publication No. 10-2012-0083859 discloses a chemical liquid supply system for supplying a drug onto a substrate. The chemical solution on the substrate is supplied to the nozzle through a pump in a tank where the chemical solution is stored. The nozzle performs a process of treating the substrate by supplying a chemical solution to the upper portion of the substrate.

However, the method of supplying the chemical liquid to the substrate using the pump has a disadvantage that it is difficult to control when supplying a minute amount of chemical liquid to the substrate.

The present invention provides a chemical liquid supply unit capable of regulating and supplying a small amount of chemical liquid on a substrate, a substrate processing apparatus including the chemical liquid supply unit, and a method of supplying chemical liquid.

The present invention provides an apparatus for processing a substrate.

According to an embodiment of the present invention, the substrate processing apparatus includes a chamber for providing a space for processing a substrate, a support unit for supporting the substrate in the chamber, and a liquid supply unit for supplying the liquid to the substrate supported by the support unit. Wherein the liquid supply unit includes a liquid supply line connected to the nozzle and the nozzle, a liquid storage member for storing the liquid and connected to the liquid supply line, and a liquid supply member provided on the liquid supply line, And a liquid supply valve for supplying a supply pressure.

According to an embodiment of the present invention, the liquid supply valve includes a body having a flow path of the liquid, a first diaphragm provided on the flow path in the body, and a second diaphragm extending in the direction toward the flow path, And a second driver for moving the first actuator in the first direction.

According to one embodiment, the liquid supply valve blocks the flow passage, and a second diaphragm, which is located farther from the liquid storage member than the first diaphragm, and a second diaphragm that separates the second diaphragm from the first diaphragm, And a second driver for moving the first actuator in the second direction.

According to one embodiment, the flow path may have an inflow end connected to the liquid supply line and an outflow end connected to the liquid supply line on the nozzle side.

According to one embodiment, the liquid supply unit may further include a stover valve installed in the liquid supply line, for preventing the liquid from being dropped from the nozzle.

According to one embodiment, the quartz valve may be installed between the nozzle and the liquid supply valve.

According to one embodiment, the quartz valve is provided in the same structure as the liquid supply valve, and the inlet end of the quartz valve can be disposed closer to the nozzle than the outlet end of the quartz valve.

According to one embodiment, the liquid supply unit further includes a controller for controlling the first driver and the second driver, wherein the controller moves the first diaphragm in a direction away from the flow path, The liquid is sucked from the liquid storage member in the direction of movement of the first diaphragm, the first diaphragm moves in the direction toward the flow passage, and the second diaphragm moves in the direction away from the flow passage The controller may control the first driver and the second driver such that the sucked liquid is discharged in a direction toward the nozzle.

According to one embodiment, the controller can control the first driver and the second driver such that the liquid is sucked from the liquid storage member while the stomach valve sucks the liquid from the nozzle.

According to one embodiment, the liquid supply unit may further include a check valve installed in the liquid supply line and preventing the liquid from flowing back to the liquid storage member.

According to one embodiment, the liquid supply unit may further include a pressure member for pressing the liquid into the liquid storage member when the liquid is supplied to the nozzle.

The present invention provides a liquid supply unit for supplying a liquid to a substrate.

According to an embodiment of the present invention, the liquid supply unit may include a liquid supply line connected to the nozzle and the nozzle, a liquid storage member for storing the liquid and connected to the liquid supply line, And a liquid supply valve for supplying a pressure to supply the liquid to the nozzle.

According to an embodiment of the present invention, the liquid supply valve includes a body having a flow path of the liquid, a first diaphragm provided on the flow path in the body, and a second diaphragm extending in the direction toward the flow path, And a second driver for moving the first actuator in the first direction.

According to one embodiment, the liquid supply valve blocks the flow passage, and a second diaphragm, which is located farther from the liquid storage member than the first diaphragm, and a second diaphragm that separates the second diaphragm from the first diaphragm, And a second driver for moving the first actuator in the second direction.

According to one embodiment, the flow path may have an inflow end connected to the liquid supply line and an outflow end connected to the liquid supply line on the nozzle side.

According to one embodiment, the liquid supply unit may further include a stover valve installed in the liquid supply line, for preventing the liquid from being dropped from the nozzle.

According to one embodiment, the quartz valve may be installed between the nozzle and the liquid supply valve.

According to one embodiment, the quartz valve is provided in the same structure as the liquid supply valve, and the inlet end of the quartz valve can be disposed further to the nozzle than the outlet end of the quartz valve.

According to one embodiment, the liquid supply unit further includes a controller for controlling the first driver and the second driver, wherein the controller moves the first diaphragm in a direction away from the flow path, The liquid is sucked from the liquid storage member in the direction of movement of the first diaphragm, the first diaphragm moves in the direction toward the flow passage, and the second diaphragm moves in the direction away from the flow passage The controller may control the first driver and the second driver such that the sucked liquid is discharged in a direction toward the nozzle.

According to one embodiment, the controller can control the first driver and the second driver such that the liquid is sucked from the liquid storage member while the stomach valve sucks the liquid from the nozzle.

According to one embodiment, the liquid supply unit may further include a check valve installed in the liquid supply line and preventing the liquid from flowing back to the liquid storage member.

According to one embodiment, the liquid supply unit may further include a pressure member for pressing the liquid into the liquid storage member when the liquid is supplied to the nozzle.

The present invention provides a method for supplying a liquid to a substrate.

According to an embodiment of the present invention, a liquid supply unit supplies liquid to a nozzle for supplying liquid onto a substrate placed on a support unit through a liquid supply line in a liquid storage member in which liquid is stored, A first diaphragm provided on the flow path and movable in a direction toward the flow path or in a direction away from the flow path; and a second diaphragm provided on the first diaphragm, the first diaphragm being disposed farther from the liquid storage member than the first diaphragm Supplying the liquid to the nozzle using a liquid supply valve having a second diaphragm, wherein the liquid supply valve moves the first diaphragm in a direction away from the flow path, and when the second diaphragm moves in a direction toward the flow path, The liquid is sucked from the liquid storage member in the moving direction of the first diaphragm The first diaphragm moves in a direction toward the flow path and the sucked liquid is discharged in a direction toward the nozzle when the second diaphragm moves in a direction away from the flow path to supply the liquid to the nozzle .

According to one embodiment, the liquid supply unit may further include a stover valve installed in the liquid supply line, for preventing the liquid from being dropped from the nozzle.

According to one embodiment, the quartz valve is provided in the same structure as the liquid supply valve, and the inlet end of the quartz valve can be disposed closer to the nozzle than the outlet end of the quartz valve.

According to an embodiment, the liquid may be sucked from the liquid storage member while the stomach valve sucks the liquid from the nozzle.

According to an embodiment of the present invention, it is possible to supply a liquid supply valve to the liquid supply unit to regulate and supply a minute amount of liquid onto the substrate.

In addition, according to an embodiment of the present invention, a minute amount of liquid can be regulated and supplied onto the substrate, and the efficiency of the substrate processing process can be improved.

1 is a cross-sectional view illustrating a substrate processing apparatus according to an embodiment of the present invention.
2 is a cross-sectional view showing the liquid supply valve of Fig.
3 is a cross-sectional view showing the quartz valve of Fig.
FIGS. 4 and 5 are views schematically showing the suction and discharge of the liquid in the liquid supply valve of FIG. 2. FIG.
FIGS. 6 and 7 are views schematically showing a process of supplying liquid from the liquid supply valve and the stoneware valve of FIG. 1. FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments of the present invention can be modified in various forms, and the scope of the present invention should not be construed as being limited to the following embodiments. This embodiment is provided to more fully describe the present invention to those skilled in the art. Thus, the shape of the elements in the figures has been exaggerated to emphasize a clearer description.

1 is a cross-sectional view illustrating a substrate processing apparatus according to an embodiment of the present invention. 1, the substrate processing apparatus 1 is an apparatus for processing a substrate W by supplying a liquid to the substrate W. The substrate processing apparatus 1 includes a chamber 10, a support unit 20, and a liquid supply unit 30.

The chamber 10 provides a processing space therein.

The housing (11) is located inside the chamber (10). The housing 11 is provided in an open top shape. The housing 11 is provided in the form of a cup. The housing (11) is provided wrapping around the support unit (20). (The housing 11).

The support unit 20 is located in the processing space. The support unit 20 supports the substrate W and rotates the substrate W during the process. The support unit 20 includes a support plate 21, a support pin 22, a chuck pin 24, a support shaft 26 and a rotation driver 28.

The support plate (21) supports the substrate (W). The support plate 21 has an upper surface which is provided in a generally circular shape when viewed from above. A support shaft (26) rotatable by a rotation driver (28) is fixedly coupled to the bottom surface of the support plate (21). A plurality of support pins 22 are provided. The support pins 22 are spaced apart from the edge of the upper surface of the support plate 21 by a predetermined distance and project upward from the support plate 21. The support pins 22 are arranged so as to have a generally annular ring shape in combination with each other. The support pin 22 supports the rear edge of the substrate W such that the substrate W is spaced apart from the upper surface of the support plate 21 by a predetermined distance.

A plurality of chuck pins (24) are provided. The chuck pin (24) is disposed farther from the center of the support plate (21) than the support pin (22). The chuck pin (24) is provided so as to protrude upward from the support plate (21). The chuck pin 24 supports the side of the substrate W so that the substrate W is not laterally displaced from the correct position when the support plate 21 is rotated. The chuck pin 24 is provided so as to be linearly movable between the standby position and the support position along the radial direction of the support plate 21. [ The standby position is a position far from the center of the support plate 21 as compared with the support position. The chuck pin 24 is placed in the standby position when the substrate W is loaded or unloaded and the chuck pin 24 is placed in the supporting position when the substrate W is being processed . At the support position, the chuck pin (24) is in contact with the side of the substrate (W).

The liquid supply unit 30 supplies the liquid to the substrate W during the substrate processing process. The liquid may be provided as a sensitizing solution. For example, the photosensitive liquid may be a photoresist. The liquid supply unit 30 includes a nozzle 100, a liquid supply line 200, a liquid storage member 300, a liquid supply valve 400, a quartz valve 500, a check valve 600, .

Liquid is supplied from an external liquid storage member (300), and liquid is supplied onto the substrate (W). The nozzle 100 has a nozzle support 110, a liquid nozzle 120, a support shaft 130, and a liquid driver 140. The liquid driver 140 is coupled to the lower end of the support shaft 130. The liquid driver 140 rotates and lifts the support shaft 130. The nozzle support 110 is vertically coupled to the opposite end of the support shaft 130 coupled to the liquid driver 140. The liquid nozzle 120 is installed at the bottom end of the nozzle support 110. The liquid nozzle 120 has a circular tube shape and can supply liquid to the center of the substrate W. [ Optionally, the liquid nozzle 120 may have a length corresponding to the diameter of the substrate W. [ The discharge port of the liquid nozzle 120 may be provided as a slit. The liquid nozzle 120 is moved to the process position and the standby position by the liquid driver 140. The process position is a position in which the liquid nozzle 120 is disposed at a vertically upper portion of the housing 11 and a standby position is a position at which the liquid nozzle 120 is deviated from the vertical upper portion of the housing 11. The liquid nozzle 120 supplies the liquid to the central region of the substrate W.

The liquid storage member 300 stores the liquid and supplies the liquid to the liquid supply line 200. The liquid storage member 300 has a space therein. The space inside is the space where the liquid is received. For example, the liquid to be stored may be a sensitizing solution.

The pressing member 310 presses the inside of the liquid storage member 300. The pressing member 310 is connected to the liquid storage member 300. The pressing member 310 can pressurize the liquid inside the liquid storage member 300 when the liquid is supplied from the nozzle 100 described later. For example, the pressing member 310 can pressurize the inside of the liquid storage member 300 using gas. The gas may be provided as nitrogen gas or air.

The liquid supply line 200 is a line through which the liquid flows. One end of the liquid supply line 200 is connected to the liquid storage member 300 and the other end is connected to the nozzle 100.

The liquid supply valve 400 sucks the liquid to the liquid storage member 300 and supplies the liquid to the nozzle 100. The liquid supply valve 400 is installed in the liquid supply line 200. The liquid supply valve 400 includes a body 410, a first diaphragm 430, a second diaphragm 440, a first driver 450, and a second driver 460.

A flow path 420 through which liquid flows is formed in the body 410. The flow path 420 has an inlet end 421 and an outlet end 423. The inlet end 421 is connected to the liquid supply line 200. The inlet end 421 is positioned closer to the liquid storage member 300 than the outlet end 423. The inlet end 421 is a space into which the liquid is supplied from the liquid storage member 300 to the liquid supply valve 400. The outlet end 423 is connected to the liquid supply line 200. The outflow end 423 is an inlet for discharging the liquid from the flow path 420 toward the nozzle 100.

The first diaphragm 430 is located inside the body 410. The first diaphragm 430 is installed on the oil passage 420 in the body 410. The first diaphragm 430 is movable in the direction toward the flow path 420 or in the direction away from the flow path 420.

The first driver 450 is connected to the first diaphragm 430. The first driver 450 is installed inside the body 410. The first driver 450 is located at the top of the first diaphragm 430. The first driver 450 is movable in a direction toward the flow path 420 or a direction away from the flow path 420.

The second diaphragm 440 may block the flow path 420. The second diaphragm 440 is located inside the body 410. The second diaphragm 440 is installed on the oil passage 420 in the body 410. The first diaphragm 430 is movable in the direction toward the flow path 420 or in the direction away from the flow path 420. The second diaphragm 440 is located farther from the liquid storage member 300 than the first diaphragm 430.

The second driver 460 is connected to the second diaphragm 440. The second driver 460 is installed inside the body 410. The second driver 460 is located above the second diaphragm 440. The second driver 460 is located farther away from the liquid storage member 300 than the first driver 450. The second driver 460 is movable in the direction toward the flow path 420 or in the direction away from the flow path 420.

The quartz valve 500 prevents the liquid, which is discharged from the nozzle 100, from dropping onto the substrate W when the discharge is stopped. A quartz valve 500 is installed on the liquid supply line 200. A quartz valve 500 is installed between the nozzle 100 and the liquid supply valve 400. The quartz valve 500 may be provided in the same structure as the liquid supply valve 400.

The quartz valve 500 includes a body 510, a first quartz diaphragm 530, a second quartz diaphragm 540, a first driving unit 550, and a second driving unit 560.

A flow path 520 through which liquid flows is formed inside the body 510. The flow path 520 has an inlet end 521 and an outlet end 523. The inlet end 521 is connected to the liquid supply line 200. The inlet end 521 is a space through which the liquid is supplied from the liquid supply valve 400 to the stoichiometric valve 500. The inlet end 521 is located farther away from the nozzle 100 than the outlet end 523. The outflow end 523 is connected to the liquid supply line 200. The outflow end 523 is an inlet through which the liquid is discharged from the flow path 520 toward the nozzle 100.

The first quartz diaphragm 530 is located inside the body 510. The first quartz diaphragm 530 is installed on the flow path 520 in the body 510. The first quartz diaphragm 530 is movable in the direction toward the channel 520 or in the direction away from the channel 520.

The first driving unit 550 is connected to the first quartz diaphragm 530. The first driving unit 550 is installed inside the body 510. The first driving unit 550 is located above the first quartz diaphragm 530. The first driving unit 550 is movable in the direction toward the channel 420 or the chamber 5 away from the channel 420.

The second quartz diaphragm 540 may block the flow path 520. The second quartz diaphragm 540 is located inside the body 510. The second quartz diaphragm 540 is mounted on the flow path 520 in the body 510. The first quartz diaphragm 530 is movable in a direction toward the channel 520 or in a direction away from the channel 420. The second quartz diaphragm 540 is located farther away from the nozzle 100 than the first quartz diaphragm 530.

The second driving unit 560 is connected to the second quartz diaphragm 540. The second driving unit 560 is installed inside the body 510. The second driving unit 560 is located above the second quartz diaphragm 540. The second driving unit 560 is located farther from the nozzle 100 than the first driving unit 550. The second driving unit 560 is movable in the direction toward the channel 520 or in the direction away from the channel 520.

The non-return valve (600) prevents the backflow of the liquid from the liquid supply valve (400) to the liquid storage member (300). The check valve (600) is installed in the liquid supply line (200). The check valve (600) is installed between the liquid storage member (300) and the liquid supply valve (400). For example, the check valve 600 may be provided as an on-off valve.

The controller 700 controls the liquid supply valve 400 and the starboard valve 500. The controller 700 controls the first driver 450 and the second driver 460. The controller 700 controls the first driver 450 and the second driver 460 to suck the liquid from the liquid storage member 300 and discharge the liquid toward the nozzle 100. [ The controller 700 controls the first driver 450 and the second driver 460 when the liquid is sucked from the liquid supply valve 400 to the liquid storage member 300. The controller 700 moves the first diaphragm 430 in the direction away from the flow path 420 and moves the second diaphragm 440 in the direction toward the flow path 420 when the liquid is sucked, And the second driver 460 are controlled. When the liquid is discharged from the liquid supply valve 400 toward the nozzle 100, the controller 700 moves the first diaphragm 430 in the direction toward the flow path 420, And controls the first driver 450 and the second driver 460 to move away from the second driver 420, respectively.

The controller 700 controls the first driving unit 550 and the second driving unit 560. The controller 700 controls the first driving unit 550 and the second driving unit 560 so as to prevent the droplets from dropping onto the substrate W when the liquid discharge is stopped in the nozzle 100, And the second driving unit 560. [ The controller 700 moves the first quartz diaphragm 530 in the direction away from the flow path 520 and moves the second quartz diaphragm 540 in the direction toward the flow path 520 when the liquid is sucked from the nozzle 100 And controls the first driving unit 550 and the second driving unit 560, respectively. The controller 700 moves the first quartz diaphragm 530 in the direction toward the flow channel 520 and moves the second quartz diaphragm 540 away from the flow channel 520 And controls the first driving unit 550 and the second driving unit 560.

The controller 700 controls the first driver 450 and the second driver 460 such that the liquid is sucked from the liquid storage member 300 while the stover valve 500 sucks the liquid from the nozzle 100 do.

Hereinafter, a liquid supply method for supplying liquid to the substrate W will be described.

The liquid supply unit 30 supplies the liquid onto the substrate W on which the support unit 20 is placed via the liquid supply line 200 in the liquid storage member 300 in which the liquid is stored. The liquid is supplied to the upper portion of the substrate W through the nozzle 100 located inside the chamber 10. [

When the liquid is supplied to the substrate W, the liquid supply valve 400 sucks the liquid from the liquid storage member 300. The liquid supply valve 400 moves the first diaphragm 430 in a direction away from the flow path 420 as shown in FIG. At the same time, the second diaphragm 440 is moved in the direction toward the flow path 420. The first diaphragm 430 moves away from the flow path 420 and decompresses the liquid supply line 200 so that the liquid flows into the liquid storage member 300 through the inlet end 421 and into the liquid supply valve 400. At this time, the second diaphragm 440 moves in the direction toward the flow path 420 to block the flow path 420, thereby suppressing the discharge to the nozzle 100.

5, the first diaphragm 430 moves in the direction toward the flow path 420 and the second diaphragm 440 moves in the direction away from the flow path 420. In this case, Move. The first diaphragm 430 pressurizes the flow path 420 while the second diaphragm 440 is shut off and the unroller open solution is discharged to the nozzle 100 through the outflow end 423.

During the process of processing the substrate W, the liquid in the nozzle 100 repeats ejection and interruption. A stoop valve 500 is used to prevent the dropping of the liquid onto the substrate W when the discharge of the liquid from the nozzle 100 is stopped.

Hereinafter, the operation of the liquid supply valve 400 and the starboard valve 500 will be described.

The liquid supply valve 400 sucks the liquid from the liquid storage member 300. In the liquid supply valve 400, liquid is sucked as shown in FIG. While the liquid is being sucked from the liquid supply valve 400, the stoneware valve 500 sucks the liquid remaining in the nozzle 100 in which the discharge is stopped by the stoneware valve 500. The quartz valve 500 moves the first quartz diaphragm 530 in a direction away from the channel 520 as shown in FIG. 6 when sucking the liquid. At the same time, the second quartz diaphragm 540 is moved in the direction toward the flow path 520. The first pneumatic diaphragm 530 moves away from the flow path 520 and decompresses the liquid supply line 200 so that the liquid flows into the lava valve 500 through the outflow end 523. At this time, the second pneumatic diaphragm 540 moves in the direction toward the flow path 520 to block the flow path 520, thereby suppressing the discharge of the liquid to the liquid supply valve 400.

7, the first diaphragm 430 of the liquid supply valve 400 moves in a direction toward the flow path 420 and the second diaphragm 440 moves in the direction of the flow path 420. As a result, 420). The first diaphragm 430 presses the flow path 420 and simultaneously opens the flow path 420 in which the second diaphragm 440 is blocked and discharges the solution through the outflow end 423.

The first quartz diaphragm 530 of the quartz valve 500 moves in the direction toward the channel 520 and the second quartz diaphragm 540 moves in the direction away from the channel 520. [ The liquid moved from the liquid supply valve 400 is supplied to the nozzle 100 through the outlet end 523.

The present invention can supply a small amount of liquid to the nozzle 100 by using the liquid supply valve 400 instead of the pump when supplying the liquid to the substrate W. [

Although the liquid supplied from the liquid supply unit 30 has been described by taking the photosensitive liquid as an example, the developer and the cleaning liquid may be supplied.

The foregoing detailed description is illustrative of the present invention. In addition, the foregoing is intended to illustrate and explain the preferred embodiments of the present invention, and the present invention may be used in various other combinations, modifications, and environments. That is, it is possible to make changes or modifications within the scope of the concept of the invention disclosed in this specification, within the scope of the disclosure, and / or within the skill and knowledge of the art. The embodiments described herein are intended to illustrate the best mode for implementing the technical idea of the present invention and various modifications required for specific applications and uses of the present invention are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. It is also to be understood that the appended claims are intended to cover such other embodiments.

1: substrate processing apparatus 10: chamber
11: housing 20: support unit
30: liquid supply unit 100: nozzle
200: liquid supply line 300: liquid storage member
400: liquid supply valve 410: body
420: flow path 421: inlet end
423: outlet 440: first diaphragm
450: second diaphragm 460: first driver
470; Second driver 500: Stone valve
600: Anti-backflow valve `700: Controller

Claims (26)

An apparatus for processing a substrate,
A chamber for providing a space for processing the substrate;
A support unit for supporting the substrate in the chamber; And
A liquid supply unit for supplying liquid to the substrate supported by the support unit; Including,
The liquid supply unit includes:
A nozzle;
A liquid supply line connected to the nozzle;
A liquid storage member that stores the liquid and is connected to the liquid supply line; And
A liquid supply valve provided on the liquid supply line and providing a pressure for supplying liquid to the nozzle;
A quartz valve installed in the liquid supply line to prevent the liquid from dropping from the nozzle;
And a controller for controlling the liquid supply valve,
The liquid supply valve includes:
A body having a flow path for the liquid;
A first diaphragm installed on the flow path in the body; And
A first driver that moves the first diaphragm in a direction toward the flow path or in a direction away from the flow path;
A second diaphragm that blocks the flow passage and is located farther from the liquid storage member than the first diaphragm;
And a second actuator for moving the second diaphragm in a direction toward the flow path or in a direction away from the flow path,
The controller moves the first diaphragm in a direction away from the flow path and the liquid is sucked in the direction of movement of the first diaphragm from the liquid storage member when the second diaphragm moves in a direction toward the flow path, The first diaphragm is moved in the direction toward the flow passage and the second diaphragm is moved in the direction away from the flow passage so that the liquid sucked is discharged in a direction toward the nozzle, and,
And the quartz valve controls the first driver and the second driver such that the liquid sucks the liquid from the liquid storage member while sucking the liquid from the nozzle. delete delete The method according to claim 1,
The flow path includes:
An inlet end connected to the liquid supply line;
An outlet end connected to the liquid supply line on the nozzle side; The substrate processing apparatus comprising: delete The method according to claim 1,
Wherein the quartz valve is installed between the nozzle and the liquid supply valve. The method according to claim 1,
Wherein the inlet end of the quartz valve is disposed further away from the nozzle than the outlet end of the quartz valve. delete delete The method according to claim 1,
Wherein the liquid supply unit further comprises a backflow prevention valve installed in the liquid supply line and preventing the liquid from flowing back to the liquid storage member. The method of claim 1,
Wherein the liquid supply unit further comprises a pressing member for pressing the liquid into the liquid storage member when the liquid is supplied to the nozzle. A liquid supply unit for supplying liquid to a substrate supported on a support unit,
A nozzle;
A liquid supply line connected to the nozzle;
A liquid storage member that stores the liquid and is connected to the liquid supply line; And
A liquid supply valve provided on the liquid supply line and providing a pressure for supplying liquid to the nozzle;
Wherein the liquid supply unit is provided in the liquid supply line, the quartz valve preventing the liquid from being dropped from the nozzle;
And a controller for controlling the liquid supply valve,
The liquid supply valve includes:
A body having a flow path for the liquid;
A first diaphragm installed on the flow path in the body; And
A first driver that moves the first diaphragm in a direction toward the flow path or in a direction away from the flow path;
A second diaphragm that blocks the flow passage and is located farther from the liquid storage member than the first diaphragm;
And a second actuator for moving the second diaphragm in a direction toward the flow path or in a direction away from the flow path,
The controller moves the first diaphragm in a direction away from the flow path and the liquid is sucked in the direction of movement of the first diaphragm from the liquid storage member when the second diaphragm moves in a direction toward the flow path, The first diaphragm is moved in the direction toward the flow passage and the second diaphragm is moved in the direction away from the flow passage so that the liquid sucked is discharged in a direction toward the nozzle, and,
And the quartz valve controls the first driver and the second driver such that the liquid is sucked from the liquid storage member while the liquid is sucked from the nozzle. delete delete 13. The method of claim 12,
The flow path includes:
An inlet end connected to the liquid supply line;
An outlet end connected to the liquid supply line on the nozzle side; Liquid supply unit. delete 13. The method of claim 12,
Wherein the quartz valve is installed between the nozzle and the liquid supply valve. 13. The method of claim 12,
Wherein the inlet end of the quartz valve is disposed further away from the nozzle than the outflow end of the quartz valve. delete delete 13. The method of claim 12,
And the liquid supply unit further includes a check valve installed in the liquid supply line and preventing the liquid from flowing back to the liquid storage member. 13. The method of claim 12,
Wherein the liquid supply unit further comprises a pressing member for pressing the liquid into the liquid storage member when the liquid is supplied to the nozzle. An apparatus for processing a substrate,
A chamber for providing a space for processing the substrate;
A support unit for supporting the substrate in the chamber; And
A liquid supply unit for supplying liquid to the substrate supported by the support unit; Including,
The liquid supply unit includes:
A nozzle;
A liquid supply line connected to the nozzle;
A liquid storage member that stores the liquid and is connected to the liquid supply line; And
A liquid supply valve provided on the liquid supply line and providing a pressure for supplying liquid to the nozzle;
And a pneumatic valve provided downstream of the liquid supply valve with respect to a direction in which the liquid is supplied from the liquid supply line and which prevents the liquid from being dropped from the nozzle,
The liquid supply valve includes:
A first flow path through which the liquid flows, a first space communicating with the first space, and a first space communicating with the first space;
A first diaphragm movable in a direction toward or away from the first flow path to adjust the pressure of the first flow path in any one of the first spaces;
And a second diaphragm movable in a direction toward or away from the first flow path to open or shut off the first flow path in the other of the first spaces,
Wherein the stoneware valve comprises:
A second flow path of the liquid is formed and has second spaces divided from each other, the second spaces communicating with the second flow path;
A first quartz diaphragm movable in a direction toward or away from the second flow path to regulate the pressure of the second flow path in any one of the second spaces;
And a second choke diaphragm movable in a direction toward or away from the second flow path to open or shut off the second flow path in the other of the second spaces. 24. The method of claim 23,
Wherein one of the first spaces is located upstream of the other one with respect to a direction in which the liquid is supplied,
Wherein one of the second spaces is located downstream of the other one with respect to a direction in which the liquid is supplied. 26. The method according to claim 23 or 24,
The liquid supply unit includes:
Further comprising a controller for controlling the liquid supply valve and the chalk valve,
Wherein the controller moves the first diaphragm in a direction away from the first flow path and moves the second diaphragm in a direction toward the first flow path to suck the liquid from the liquid storage member in the direction of movement of the first diaphragm And,
The first diaphragm moves in a direction toward the first flow path and the second diaphragm moves in a direction away from the first flow path to supply the sucked liquid to the nozzle. 26. The method of claim 25,
Wherein the controller controls the liquid supply valve so that the liquid is sucked from the liquid storage member while the stomach valve sucks the liquid from the nozzle.
KR1020150066813A 2015-05-13 2015-05-13 Unit for supplying liquid and Apparatus for treating a substrate with the unit KR101686565B1 (en)

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KR20210028787A (en) * 2019-09-04 2021-03-15 세메스 주식회사 Unit for supplying liquid and apparatus and method for treating a substrate with the unit
US11655907B2 (en) 2018-10-02 2023-05-23 Semes Co., Ltd. Substrate treating apparatus and safety valve applied thereto

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KR101994425B1 (en) * 2017-09-29 2019-07-01 세메스 주식회사 Apparatus and Method for treating substrate

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Publication number Priority date Publication date Assignee Title
US11655907B2 (en) 2018-10-02 2023-05-23 Semes Co., Ltd. Substrate treating apparatus and safety valve applied thereto
KR20210028787A (en) * 2019-09-04 2021-03-15 세메스 주식회사 Unit for supplying liquid and apparatus and method for treating a substrate with the unit
KR102361473B1 (en) * 2019-09-04 2022-02-11 세메스 주식회사 Unit for supplying liquid and apparatus and method for treating a substrate with the unit

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