KR101685835B1 - Conductive thin poly-urethane foam and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a conductive thin-film polyurethane foam which is formed by a structure having a plating functional group on a surface of a thin-film urethane foam superior in shock absorbing power and restoring force than conventional conductive foams, and is excellent in conductivity, A fabric layer woven to form four through holes; A foam casting layer formed by casting a hydrophilic polyurethane foam in a microcellular state into a fabric layer; And a plated layer formed by plating a foam casting layer with a plating liquid to prepare a conductive thin film polyurethane foam.

Description

TECHNICAL FIELD [0001] The present invention relates to a conductive thin polyurethane foam and a manufacturing method thereof,

TECHNICAL FIELD The present invention relates to a conductive thin film polyurethane foam and a method of manufacturing the same, and more particularly to a conductive thin film polyurethane foam which is formed with a structure having a functional group capable of being plated on a thin film urethane foam surface superior in shock absorbing power and restoring force to conventional conductive foam, And a method for producing the same.

The conductive foam is generally made of a microcell sponge structure and can be used not only for small smart devices such as mobile devices, game devices, and tablets but also for automobiles, ships, aerospace, defense, It is widely regarded as a shielding material in all industrial fields, and products of leading companies in the world are competing.

Korean Patent No. 10-1226773 (registered on Jan. 31, 2013) discloses a conductive thin film cushion sheet excellent in impact absorption and electromagnetic wave shielding property and a method for producing the same, wherein a polyethylene terephthalate film, a nonwoven fabric, Stacking a foamed urethane memory foam layer formed by foaming a urethane foam on one surface thereof; Forming a conductive line by laminating a urethane memory foam layer formed by foaming a urethane foam on one side of a polyethylene terephthalate film, a nonwoven fabric, a woven fabric or a mesh layer; Forming an electrolytic or electroless plating layer on one side or both sides of the integrated polyethylene terephthalate film, nonwoven fabric, woven fiber or mesh layer and foamed layer; And a step of forming a fingerprint-preventing and corrosion-resistant coating layer formed on one or both surfaces of the electrolytic or electroless plating layer and performing a chemical interface treatment process before forming an electrolytic or electroless plating layer on the perforated urethane memory foam foam layer . According to the disclosed technology, there is provided a conductive thin film cushion sheet having excellent surface condition, uniform electric conductivity, excellent electromagnetic shielding efficiency, good impact absorption, cushioning, adhesion to the adherend, It can be used for mobile terminals such as smart phones and tablet PCs, for improving adhesiveness to adhered materials such as digital TVs such as LED TVs and OLED TVs, flexible displays, shock absorbing, electromagnetic noise grounding, and ESD purposes.

Korean Patent No. 10-0936535 (registered on May 1, 2010) discloses a method for producing a conductive elastic composite sheet having good surface condition, uniform electric conductivity, excellent electromagnetic wave shielding efficiency, and good cushioning property. According to the disclosed technique, there is provided a method for producing a conductive elastic composite sheet, which comprises the steps of: (1) mixing a polymeric resin selected from the group consisting of a polyurethane resin, an ethylene vinyl acetate (EVA) resin, a polyvinyl chloride And 20 to 50 wt% of a conductive filler having an average particle size of 20 m or less and a tap density of 1.5 to 3.5 g / cm < 3 >, followed by adding 0.1 to 0.5 wt% of a vesicle and a defoaming agent, 0.1 to 0.3% by weight of a leveling agent and 0.3 to 0.5% by weight of a wet dispersant, and then 10 to 30% by weight of toluene and 5 to 15% by weight of ethyl acetate are added thereto. The reaction product is stirred, dispersed and filtered to obtain a conductive polymer paste ; Casting a conductive polymer paste on a polyethylene terephthalate (PET) release film to a thickness of 30 to 300 mu m and drying at a temperature of 50 to 120 DEG C to form a conductive polymer sheet; A conductive polymer paste is secondarily coated on the conductive polymer sheet to a thickness of 10 to 100 탆 and at least one metal having excellent electrical conductivity selected from the group consisting of copper, nickel, gold, silver, tin and cobalt is plated Forming a conductive elastic composite sheet by laminating a porous sponge elastic body and a conductive polymer sheet, and then drying at a temperature of 50 to 120 캜; And a conductive adhesive tape coated with a conductive adhesive component on one or both sides of a conductive fiber, a conductive mesh, a conductive nonwoven fabric, a copper foil, an aluminum foil or a nickel copper foil or an inorganic re- The method comprising the steps of:

Korean Patent No. 10-1160589 (registered on Jun. 21, 2012) discloses an adhesive sheet for electromagnetic wave shielding of a flexible printed circuit board improved in heat resistance, adhesiveness, bending resistance and conductivity and a flexible printed circuit board comprising the same And an electromagnetic shielding adhesive layer formed by drying and solidifying a composition for shielding electromagnetic waves, wherein the composition for electromagnetic shielding comprises a thermosetting epoxy resin, a thermosetting urethane resin, a conductive metal powder and a curing agent dispersed in a solvent, The metal powder content is 100 to 300 parts by weight per 100 parts by weight of the total amount of the thermosetting epoxy resin and the thermosetting urethane resin and the curing agent content is 5 to 30 parts by weight per 100 parts by weight of the total amount of the thermosetting epoxy resin and the thermosetting urethane resin, : The weight ratio of the thermosetting urethane resin is 2: 3 to 1: 4, and the composition of the electromagnetic wave shielding composition And solidifying temperatures is characterized in that more than 60 ℃ to 115 ℃ below. According to the disclosed technique, excellent heat resistance, adhesiveness, flexural resistance, and conductivity can be imparted to impart reliability to the process of manufacturing a flexible printed circuit board and to enhance the grounding property of the flexible printed circuit board.

The conventional conductive foam used as a shielding and grounding material (i.e., grounding material) as described above is a urethane foam of a microcell sponge structure. Such a conventional urethane foam is applied to a device in a compressed state at a certain level In this process, permanent compression is performed, and it is known that the recovery rate is less than 10% at the time of compression relaxation, which is very poor.

In the case of the foam / fabric bonding product which has been used in the prior art, not only the appearance of the product is deteriorated due to the burr of the cut surface at the time of die-cutting, Causing problems of generating workplace dust and short-circuiting the product.

These problems are common to all products in the world. These problems shorten product life and deteriorate performance. In addition, the product is not restored to its original state during reassembly after separation due to repairs of the product, and expensive accessories often need to be replaced.

The demand for improvement of these problems has been ongoing for a long time, but it is difficult to expect structural improvement in the restoration efficiency due to the large pore structure, low density, and poor mechanical strength of the current products which are plated on the foam of the existing microcell sponge structure. Therefore, in order to solve such a problem, it is expected that the structure of the foam itself must be changed, and the production technology and plating technology of the foam should be developed together.

Korean Patent No. 10-1226773 Korean Patent No. 10-0936535 Korean Patent No. 10-1160589

The object of the present invention is to solve the above-mentioned problems and to solve the above-mentioned problems, and it is an object of the present invention to provide a thin film urethane foam having a structure having a functional group capable of plating on a surface of a thin film urethane foam, And to provide a conductive thin film polyurethane foam excellent in conductivity and a method for producing the same.

According to one aspect of the present invention, there is provided a means for solving the above-mentioned problems, comprising: a fabric layer woven to form a plurality of through holes; A foam casting layer formed by casting a hydrophilic polyurethane foam in a microcellular state into the fabric layer; And a plating layer formed by plating the foam casting layer with a plating liquid.

In one embodiment, the fabric layer is characterized in that a tape is attached to one surface by a tape attaching device and fed to a foam casting device.

In one embodiment, the fabric layer is a support layer of woven fibers.

In one embodiment, the fabric layer is characterized in that when the natural or man-made fibers are formed by weaving, a plurality of through holes are formed therebetween.

In one embodiment, the fabric layer is characterized in that, when the foam casting layer is formed, the hydrophilic polyurethane foam in a microcell state flows through the through hole to form the foam casting layer on both sides do.

In one embodiment, the fabric layer is formed of at least one or more of a polyethylene terephthalate film, a nonwoven fabric, and a mesh sheet.

In one embodiment, the foam casting layer is formed by casting a hydrophilic polyurethane foam in an open cell state on the other side of the fabric layer by a foam casting device to produce a casting fabric.

In one embodiment, the foam casting layer also flows into the other side of the fabric layer through the through-hole when the polyurethane foam is cast on one side of the fabric layer and is cast on both sides of the fabric layer, Thereby obtaining a fabric.

In one embodiment, the foam casting layer is formed such that the size of the microcell is smaller than the size of the through hole.

In one embodiment, the foam casting layer is characterized in that the polyurethane foam is cast into the fabric layer by a foam casting device and then dried by a drying device.

In one embodiment, the foam casting layer is characterized in that the micro-cells formed in the polyurethane foam are corroded with a caustic solution.

In one embodiment, the foam casting layer is characterized in that a conductive line is formed by filling a micro-cell corroded at the time of forming the plating layer with a plating liquid.

In one embodiment, the corroded microcell is characterized in that an electrolytic or electroless plating solution is drawn at the time of forming the plating layer to obtain a finished plating product having a uniform surface and excellent electrical conductivity.

In one embodiment, the foam casting layer has a thickness of about 50 to 1000 탆.

In one embodiment, the foam casting layer is thinner than the thickness of the fabric layer.

In one embodiment, the plating layer is formed by plating the foam casting layer with an electrolytic or electroless plating liquid by a plating apparatus to produce a plating finished product.

In one embodiment, the plating layer flows into the other side of the casting fabric through the corroded microcell when the electrolytic or electroless plating liquid is plated on one side of the casting fabric, and is plated on both sides of the casting fabric Thereby obtaining a finished plating product.

In one embodiment, the plating layer is formed by forming at least one layer of at least one metal having excellent electrical conductivity selected from the group consisting of copper, nickel, gold, silver, tin, aluminum, stainless steel and cobalt do.

In one embodiment, the plating layer is formed in such a manner that a nickel layer is formed first, a copper layer is formed on the nickel layer, and a nickel layer and a copper layer are repeatedly formed on the copper layer.

In one embodiment, the conductive thin film polyurethane foam further comprises a protective layer for protecting the plating layer from the outside.

In one embodiment, the protective layer is formed of at least one or more of an epoxy resin, an unsaturated polyester, an alkyl, an alkyd resin, a urethane resin, an ebonite, a urea resin, a melamine resin, and a phenol resin.

In one embodiment, the conductive thin film polyurethane foam further comprises a subfabric layer formed by impregnating the foam casting layer.

In one embodiment, the sub-fabric layer is formed by impregnating the foam casting layer with an impregnating device before drying the foam casting layer by a drying device.

According to another aspect of the present invention, there is provided a method of fabricating a tape attaching apparatus, comprising the steps of: receiving a woven fabric layer so that a plurality of through holes are formed; attaching the tape to one surface of the fabric layer, The foam casting apparatus receives the hydrophilic polyurethane foam in a microcell state while receiving the tape attached with the fabric layer and casts the polyurethane foam on the other surface of the fabric layer to which the tape is attached, Forming a layer to produce a casting fabric; The corrosion device receiving the casting fabric and being supplied with the corrosive liquid and corroding the microcell with the corrosive liquid; And a plating device receiving the casting material with the microcells corroded and receiving the plating liquid and plating the casting material with the microcells which are corroded with the plating liquid to form a plating layer to thereby produce a finished plating product A method for producing a conductive thin film polyurethane foam is provided.

As the effect of the present invention, there is provided a conductive thin film polyurethane foam which is formed by a structure having a functional group capable of plating on a thin film urethane foam surface, which is superior in shock absorbing power and restoring force to that of conventional conductive foam, The present invention provides a foam having an open cell structure capable of performing up-and-down plating without deteriorating impact absorption and restoring force, and a foam and a fabric-integrated foam casting for imparting tensile properties. So that the foams are formed in the form of wrapping around the whole yarn of the fabric, so that the cutting residue hardly occurs and the generation of burrs on the cut surfaces can be minimized.

According to the present invention, since the conductive foam of microcell structure has high electrical conductivity while maintaining the excellent shock absorption and recovery ratio of the high-density thin foam foam, it can replace not only the conductive foam of the conventional microcell sponge structure, The two functions of electric conductivity can be stably provided up to the service life of the product without deteriorating the physical properties. In addition, the hybrid material is capable of simultaneously achieving shock absorption and shielding, and has the effect of sufficiently satisfying the demand for smaller and lighter products.

1 is a view for explaining a conductive thin film polyurethane foam according to a first embodiment of the present invention.
2 is a view illustrating a conductive thin film polyurethane foam according to a second embodiment of the present invention.
3 is a flowchart illustrating a method of manufacturing a conductive thin film polyurethane foam according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. However, the description of the present invention is merely an example for structural or functional explanation, and the scope of the present invention should not be construed as being limited by the embodiments described in the text. That is, the embodiments are to be construed as being variously embodied and having various forms, so that the scope of the present invention should be understood to include equivalents capable of realizing technical ideas. Also, the purpose or effect of the present invention should not be construed as limiting the scope of the present invention, since it does not mean that a specific embodiment should include all or only such effect.

The meaning of the terms described in the present invention should be understood as follows.

The terms "first "," second ", and the like are intended to distinguish one element from another, and the scope of the right should not be limited by these terms. For example, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component. It is to be understood that when an element is referred to as being "connected" to another element, it may be directly connected to the other element, but there may be other elements in between. On the other hand, when an element is referred to as being "directly connected" to another element, it should be understood that there are no other elements in between. On the other hand, other expressions that describe the relationship between components, such as "between" and "between" or "neighboring to" and "directly adjacent to" should be interpreted as well.

It should be understood that the singular " include "or" have "are to be construed as including a stated feature, number, step, operation, component, It is to be understood that the combination is intended to specify that it does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

All terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. Commonly used predefined terms should be interpreted to be consistent with the meanings in the context of the related art and can not be interpreted as having ideal or overly formal meaning unless explicitly defined in the present invention.

Now, a conductive thin film polyurethane foam according to an embodiment of the present invention and a method of manufacturing the same will be described in detail with reference to the drawings.

FIG. 1 is a view illustrating a conductive thin film polyurethane foam according to a first embodiment of the present invention, and FIG. 2 is a view illustrating a conductive thin film polyurethane foam according to a second embodiment of the present invention.

Referring to FIG. 1, the conductive thin film polyurethane foam 100 includes a fabric layer 110, a foam casting layer 120, and a plating layer 130.

The fabric layer 110 is a woven fabric layer that is woven to form a plurality of through holes. The fabric layer 110 is formed of a tape (for example, transparent Tape or the like) is attached and fed to the foam casting apparatus.

In one embodiment, the fabric layer 110 is a woven fabric layer that refers to a very dense fabric in a woven state, and is utilized as the support layer of the conductive thin-film polyurethane foam 100 according to this embodiment.

In one embodiment, the fabric layer 110 may be formed with a plurality of through-holes therebetween when the natural or man-made fibers are formed by weaving into a very dense state.

In one embodiment, the through-holes formed in the fabric layer 110 allow a hydrophilic polyurethane foam to flow in the microcell (i.e., open cell) state at the time of forming the foam casting layer 120, The foam layer 120 may be formed on both sides of the fabric layer 110.

In one embodiment, the fabric layer 110 refers to a woven fabric layer of natural or man-made fibers woven in a very tight state, but may also include at least one or more of a polyethylene terephthalate film, a nonwoven fabric, , Because a plurality of holes can be formed in each of them.

The foam casting layer 120 is formed by casting a hydrophilic polyurethane foam in a microcell (i.e., open cell) state on the other side of the fabric layer 110 by a foam casting device to produce casting fabric.

In one embodiment, the foam casting layer 120 is formed such that when the polyurethane foam is cast to the other side of the fabric layer 110 by a foam casting device, the cast polyurethane foam is formed in the fabric layer 110 The polyurethane foam is cast on both sides of the fabric layer 110 so that the polyurethane foam is cast on both sides of the fabric layer 110. [ Is formed on both sides of the layer (110) to obtain a hydrolytic casting fabric. The size of the microcells (i.e., open cells) formed in the foam casting layer 120 is much smaller than that of the through holes formed in the fabric layer 110, A plurality of micro cells (i.e., open cells) may be formed on the polyurethane foam flowing into the through holes.

In one embodiment, the foam casting layer 120 may be dried by a drying device, such as a blower, blower, dryer, etc., after the polyurethane foam is cast into the fabric layer 110 by a foam casting device.

In one embodiment, the foam casting layer 120 comprises a microcell (i. E., An open cell) formed in a foam casting layer 120 (i. E., A polyurethane foam) (I.e., open cells) formed in the polyurethane foam in the through holes formed in the fabric layer 110 can be corroded by the corrosion device with the corrosion solution.

In one embodiment, the corroded microcell (i. E., Open cell) described above can be filled with a plating liquid flowing at the time of forming the plating layer 130 by the plating apparatus, thereby forming a conductive line, You can do it. For reference, in the case of the prior art disclosed in Korean Patent No. 10-1226773 mentioned above, since the foam layer has to be punched after forming the foam layer, a piercing process is inevitably required. As a result, Causing problems such as cost increase or productivity deterioration. However, in the case of the present embodiment, the hydroformed polyurethane foam in the microcell (i.e., open cell) state can be cast on one side of the fabric layer 110 to form the foam casting layer 120, (I.e., an open cell) is formed in the substrate 120, it is not necessary to carry out the perforation process as before. Therefore, since the process can be made simpler than the conventional one, the cost can be reduced, and the productivity per unit time can be improved. In fact, reducing the perforation process is an innovative technology, so it should not be overlooked as a simple technology.

In one embodiment, the corroded microcells (i.e., open cells) described above are microscopic holes having a size that is thousands of times smaller than the human hair, and the electrolytic or electroless plating solution It is possible to obtain a finished plating product having a uniform surface and excellent electric conductivity.

In one embodiment, the foam casting layer 120 can serve to improve the adhesion to the adherend such as a mobile terminal such as a smart phone, a tablet PC, a digital TV such as an LED TV, an OLED TV, a flexible display, And may have a thickness of about 50-1000 microns and may be thinner than the thickness of the fabric layer 110, but it should be understood that the scope of the present invention is not limited in its numerical value and conditions.

The plating layer 130 is an electrolytic or electroless plating layer formed by plating a foam casting layer 120 (that is, casting fabric) (one surface) with a plating liquid by a plating apparatus to produce a plated finished product.

In one embodiment, the plated layer 130 is formed such that when the electrolytic or electroless plating liquid is plated on one side of the casting fabric (i.e., the foam casting layer 120) by a plating apparatus, (I.e., another foam casting layer 120) of the casting fabric to which the tape is attached through the micro-cell (i.e., open cell) and plated on the other side of the casting fabric, So that the finished product can be obtained.

In one embodiment, the plated layer 130 may form a conductive line through microcells (i.e. open cells) that have been corroded at the casting facade. That is, when the plating liquid is plated on one surface of the casting fabric by the plating apparatus to form the plating layer 130, the plating liquid flows into the micro-cells corroded from the casting fabric (i.e., open cells) .

In one embodiment, the plating layer 130 may be formed of a casting fabric (that is, a foam material), such as a casting fabric (i.e., a foam), while an electrolytic or electroless plating solution is charged into a micro- Casting layer 120). ≪ / RTI >

In one embodiment, the plated layer 130 may comprise at least one layer of at least one electrically conductive material selected from the group consisting of copper, nickel, gold, silver, tin, aluminum, stainless steel, and cobalt, . For example, in order to improve the adhesion with the adhering material, a nickel layer is first formed first, a copper layer is formed on the nickel layer, and a nickel layer and a copper layer are repeatedly formed on the copper layer. 130 may be formed.

In one embodiment, it is desirable to form a nickel layer on the plating layer 130, which can improve electrical conductivity in the case of a copper layer, while oxidizing easily in the copper layer, so that oxidation is less likely to occur depending on the ionization tendency .

The conductive thin-film polyurethane foam 100 having the above-described structure is formed in a structure having a functional group capable of being plated on the surface of a thin-film urethane foam, which is much superior in shock absorbing power and restoring force to the conventional conductive foam, , And the foam casting layer 120 is formed of an open cell polyurethane foam. Thus, the upper and lower plating processes can be carried out without lowering impact absorption and restoring force. Also, the casting fabric by the foam and fabric- So that the foam casting layer 120 is formed in the form of wrapping the entire outer surface of the fabric layer 110 so that the cutting residue hardly occurs and the occurrence of burrs on the cut surface can be minimized.

The conductive thin film polyurethane foam 100 having the above-described structure is formed by forming a foam casting layer 120 on a fabric layer 110 with a conductive foam of microcell structure (i.e., a polyurethane foam) to form a high- By providing high electrical conductivity while maintaining excellent shock absorption and restoration, it not only replaces the conductive foam of the conventional microcell sponge structure, but also has two functions of excellent shock absorption and electrical conductivity, It can be stably provided, and as a hybrid material capable of simultaneously implementing shock absorption and shielding, it may be sufficiently satisfied with a demand for a compact and light product.

In one embodiment, the conductive thin-film polyurethane foam 100 having the above-described structure may further include a protective layer (not shown in the figure) for protecting the outside of the plating layer 130 It is possible. Here, the protective layer may be formed by thinly applying at least one or more of epoxy resin, unsaturated polyester, alkyl, alkyd resin, urethane resin, ebonite, urea resin, melamine resin, phenol resin or the like to the outside of the plating layer 130, It is preferable to protect the plating layer 130. In this case, it is possible to prevent the plating layer 130 from being damaged or corroded.

The conductive thin film polyurethane foam 100 having the above-described structure may further include a sub-fabric layer 140 as shown in FIG. Here, the sub-fabric layer 140 is a woven fabric layer, which is formed on one side of the casting fabric by an impregnating device before the casting layer 120 is dried by a drying device on both sides of the fabric layer 110, And may be formed by impregnating the formed foam casting layer 120.

In one embodiment, the conductive thin-film polyurethane foam 100 having the above-described structure is impregnated into the foam casting layer 120 formed on the other surface of the casting fabric by an impregnation device to form another sub- (Not shown in the drawings) can also be formed.

In one embodiment, the conductive thin film polyurethane foam 100 having the above-described configuration is formed by forming a hydrophilic polyurethane foam in the microcell (i.e., open cell) state by the foam casting apparatus into the subfabric layer 140, Or other foam casting layers (not shown in the drawings for convenience of description) that are formed by casting to other sub-fabric layers to produce thicker casting fabrics.

3 is a flowchart illustrating a method of manufacturing a conductive thin film polyurethane foam according to an embodiment of the present invention.

3, in the tape attaching apparatus provided with a rolling apparatus or the like, a tape (for example, a transparent tape or the like) is supplied from the tape supply apparatus while receiving the fabric layer 110 from the fabric layer supply apparatus A tape is attached to one surface of the supplied fabric layer 110 (S301).

After attaching the tape to one surface of the fabric layer 110 in the above-described step S301, the tape attaching apparatus feeds the fabric layer 110 with the tape to the foam casting apparatus. Accordingly, in the foam casting apparatus, the fabric layer 110 on which the tape is attached is fed from the tape attaching apparatus, and a hydrophilic polyurethane foam in the form of a microcell (i.e., open cell) The polyurethane foam is supplied to the other side of the fabric layer 110 to form a foam casting layer 120 to produce a casting fabric (S302).

When the polyurethane foam is cast on the other surface of the fabric layer 110, the polyurethane foam to be cast is applied to the fabric layer 110 through the through holes formed in the fabric layer 110, (110), and is also cast on one side of the fabric layer (110). A polyurethane foam is cast on both sides of the fabric layer 110 to form a foam casting layer 120 on both sides of the fabric layer 110 to obtain a hydrolytic casting fabric.

In the drying apparatus such as the hot air fan, the blower, and the dryer in the above-described step S302, the foam casting layer 120 from the foam casting apparatus may receive and dry the casting fabric formed on both sides of the fabric layer 110.

After the casting fabric is generated in the above-described step S302, the casting apparatus transmits the casting fabric to the corrosion apparatus. Therefore, in the corrosion apparatus, the casting fabric is received from the foam casting apparatus and the corrosive liquid is supplied from the corrosive liquid supply apparatus, and the supplied corrosive liquid is supplied to the casting fabric to be delivered, and the supplied corrosive liquid is supplied to the foam casting layer (I.e., an open cell) formed in the through hole 120 (or an open cell formed in the fabric layer 110) (S303). At this time, since the microcells (i.e., open cells) are corroded, the physical properties of the foam casting layer 120 are not adversely affected, and excellent elasticity can be maintained. In addition, have.

After the microcell (i.e., the open cell) is corroded in the above-described step S303, the corrosion device transfers the casting fabric corroded to the microcell (i.e., open cell) to the plating apparatus. In the plating apparatus, the casting fabric having corroded microcells (i.e., open cells) is received from the corrosion apparatus, and at the same time, the plating liquid is supplied from the plating liquid supply apparatus, and the casting fabric (One side of the casting layer 120) is plated to form a plating layer 130, thereby completing the plating (S304).

In the above-described step S304, when the one side of the casting fabric is plated with the plating liquid, the plating liquid to be plated is applied to the other side of the casting fabric to which the tape is attached through the microcell (i.e., open cell) corroded from the casting fabric And is plated on the other side of the casting fabric. Thus, the plating liquid is plated on both sides of the casting fabric so that the plating layer 130 is formed on both sides of the casting fabric, thereby obtaining a finished plating product.

In one embodiment, in the tape removing apparatus provided with a rolling device or the like, after the casting fabric is formed in the above-described step S302 or after the microcell (i.e., open cell) is corroded in the above-described step S303 Alternatively, after the completion of the plating in step S304 described above, the tape attached to one surface may be removed in the above-described step S301.

The method of manufacturing the conductive thin film polyurethane foam 100 having the above-described structure is characterized in that in step S302, before the casting layer 120 is dried on both sides of the fabric layer 110, The foam casting layer 120 receives the casting fabric formed on both sides of the fabric layer 110 from the form casting device and simultaneously receives the subfabric layer 140 from the subfabric layer feeding device, And a first impregnation step of impregnating the sub-fabric layer 140 supplied to the foam casting layer 120 formed on one surface of the substrate 100.

In one embodiment, in the second impregnation step, the foam casting layer 120 formed on the other surface of the casting fabric supplied from the foam casting apparatus may be impregnated with another sub-fabric layer, A casting fabric thicker than the casting fabric generated in S302 can be generated.

In one embodiment, the method for manufacturing the conductive thin film polyurethane foam 100 having the above-described configuration is characterized in that, in addition to the first impregnation step or the second impregnation step described above, the other foam casting layer May be further formed.

According to the present embodiment having such a structure and function, the restoration force is much better than that of the conventional conductive foam, the surface plating is possible, and the occurrence of burrs and dust can be minimized.

First, the conductive thin film polyurethane foam 100 according to the present embodiment is much more resilient than the conventional conductive foam. In other words, the microcell structure can provide a better restoring force than the conventional conductive foam.

Second, surface plating, that is, plating of the upper and lower surfaces is possible. That is, the conductive thin-film polyurethane foam 100 of the present embodiment is an open cell structure capable of performing plating on the upper and lower surfaces without lowering impact absorption and restoring force.

Third, it has tensile properties that can minimize burr and dust generation. As described above, foam / fabric bonding products, which have been used in the prior art, are not only detrimental to the appearance of the product due to burrs on cutting surfaces during die-cutting, Has caused dust in the workplace and short-circuiting of the product. However, the electroconductive thin film polyurethane foam 100 of the present embodiment has almost no residue due to its structural characteristics and does not cause burrs on the cut surface.

In conclusion, the conductive foam of the conventional microcell sponge structure has a drawback in long term reliability of the product due to a high permanent compression ratio as well as a risk of short circuit due to generation of dust compared to a comparatively excellent electric conductivity. However, the electroconductive thin film polyurethane foam 100 according to the present embodiment having the above-described structural characteristics is a microcellular conductive foam, which can maintain high shock absorption and recovery of conventional high density thin foams, . Therefore, it is possible to substitute conductive foam of the existing microcell sponge structure and also to realize two functions of impact absorption and electric conductivity with good shock absorption without deteriorating physical properties and stable service life of the device. In addition, due to the demand for compact and lightweight products, it is expected to be worthy of use as a hybrid material capable of simultaneously achieving shock absorption and shielding in the design stage for finding thin film materials.

As described above, the embodiment of the present invention is not limited to the above-described apparatus and / or method, but may be implemented by a program for realizing a function corresponding to the configuration of the embodiment of the present invention and a recording medium on which the program is recorded And the present invention can be easily implemented by those skilled in the art from the description of the embodiments described above. While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It belongs to the scope of right.

100: conductive thin film polyurethane foam
110: Fabric layer
120: foam casting layer
130: Plating layer

Claims (7)

A fabric layer woven to form a plurality of through holes;
A foam casting layer formed by casting a hydrophilic polyurethane foam in a microcellular state into the fabric layer; And
And a plating layer formed by plating the foam casting layer with a plating liquid,
Wherein the foam casting layer
Wherein when the polyurethane foam is cast on one side of the fabric layer, the polyurethane foam is also flowed through the through hole to the other side of the fabric layer to be cast on both sides of the fabric layer to obtain a casting fabric, Wherein the formed microcell is corroded with a corrosive liquid.
delete delete The method of claim 1, wherein the foam-
Wherein the microcells corroded at the time of forming the plating layer are filled with a plating solution to form a conductive line.
The method according to claim 1,
The conductive thin film polyurethane foam according to claim 1, further comprising a protective layer for protecting the plating layer from the outside.
The method according to claim 1,
And a subfabric layer formed by impregnating the foam casting layer.
Receiving a woven fabric layer so as to form a plurality of through holes, attaching the tape to one side of the fabric layer by receiving a tape;
The foam casting apparatus receives the hydrophilic polyurethane foam in a microcell state while receiving the tape attached with the fabric layer and casts the polyurethane foam on the other surface of the fabric layer to which the tape is attached, Forming a layer to produce a casting fabric;
The corrosion device receiving the casting fabric and being supplied with the corrosive liquid and corroding the microcell with the corrosive liquid; And
Wherein the plating device receives a casting fabric having corroded microcells and simultaneously receives a plating liquid and forms a plating layer by plating the casting material with the microcells which are corroded with the plating liquid to form a plating finished product, (Method for producing thin film polyurethane foam).

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