KR101684133B1 - Pressure device and its fabricating method - Google Patents

Pressure device and its fabricating method Download PDF

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Publication number
KR101684133B1
KR101684133B1 KR1020150089068A KR20150089068A KR101684133B1 KR 101684133 B1 KR101684133 B1 KR 101684133B1 KR 1020150089068 A KR1020150089068 A KR 1020150089068A KR 20150089068 A KR20150089068 A KR 20150089068A KR 101684133 B1 KR101684133 B1 KR 101684133B1
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South Korea
Prior art keywords
film
electrode
flexible material
manufacturing
pressure device
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KR1020150089068A
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Korean (ko)
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이화성
박남우
백설희
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한밭대학교 산학협력단
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)

Abstract

The present invention relates to a pressure device and a manufacturing method thereof. The manufacturing method comprises the following steps of: manufacturing a first electrode including a first base film and a first metal film; manufacturing a second electrode including a second base film and a second metal film; coating a flexible material film on a glass substrate for manufacturing a micro-pattern film, separating the glass substrate for manufacturing a micro-pattern film, UVO-surface-treating at least one surface of an upper surface and a lower surface and releasing the at least one surface while both ends of the flexible material film are extended to manufacture a micro-pattern film having a corrugated type; and bonding the micro-pattern film between the first electrode and the second electrode to manufacture the pressure device. Therefore, the pressure device has high pressure sensitivity and has high flexibility to be restored to the original shape after the pressure device is easily deformed.

Description

[0001] PRESSURE DEVICE AND ITS FABRICATING METHOD [0002]

The present invention relates to a process for producing a micropatterned film having a corrugated shape by subjecting a flexible material to a surface treatment and then providing a micropattern film between the electrodes to produce a pressure device, To a pressure device having flexibility and a manufacturing method thereof.

As is well known, research on electronic devices having more advanced functions and flexibility is progressing actively. Electronic devices with flexibility include flexible displays, smart surgical tools, smart clothes, dielectric elastomeric polymer actuators and generators , Wearable treatment sensor system, and so on.

In order to prevent mechanical breakage and electrical damage of flexible electronic devices as described above, researches on flexible and stretchable electrodes are indispensable. Electrodes having flexibility and stretchability are required to have low creep characteristics, abrasion resistance, It is very important to have high flexibility and stretchability, which can withstand various types and sizes of deformations due to the requirement of high electrical conductivity such as metal, in particular, such as peel resistance, low cost, and easy manufacturing process.

In recent years, E-skin (Electronic-skin) is one of the fields that have been attracting attention due to research and development of electronic devices having high flexibility and elasticity. E-skin imitates the characteristics similar to human skin, In order to detect the physical force, temperature, and humidity, such as pressure, shear force, and twist, it should have properties such as self-resilience and elasticity.

Generally, a metal electrode having high electrical conductivity has a very low flexibility and stretchability. On the other hand, a polymer or a flexible material having a high flexibility has a very low electrical conductivity, and a polymer or a flexible material having a high flexibility and a high A technique for manufacturing an electrode using a metal having electrical conductivity and a pressure device using the electrode has been researched and developed.

1. Korean Registered Patent No. 10-1465366 (Registered Nov. 19, 2014): Energy-generating device with elasticity and method of making the same 2. Japanese Laid-Open Patent Application No. 2014-229690 (published on December 12, 2014): Piezoelectric element and manufacturing method thereof

The present invention relates to a method of manufacturing a micropatterned film having a corrugated shape by surface-treating a flexible substrate and then manufacturing a pressure device by bonding a micropattern film between the electrodes, And to provide a pressure element having high flexibility and a manufacturing method thereof.

In addition, the present invention relates to a method of manufacturing a micropatterned film having a corrugated shape by coating a flexible substrate with a UVO (Ultraviolet / Ozone) treatment on the substrate, separating the coated substrate from the substrate, A metal is deposited on the upper part of the substrate, and the electrode is manufactured by separating the metal from the substrate, or a metal is deposited on the wafer substrate to manufacture an electrode. By bonding the micropattern film between the electrodes, To provide a pressure device having high flexibility so that it can be easily recovered to a circular shape after being easily deformed while being sensitive and a manufacturing method thereof.

The objects of the embodiments of the present invention are not limited to the above-mentioned objects, and other objects not mentioned can be clearly understood by those skilled in the art from the following description .

According to an aspect of the present invention, there is provided a plasma display panel comprising a first electrode including a first base film and a first metal film, a second base film and a second metal film, And a micropattern film provided between the first electrode and the second electrode, wherein at least one of the upper surface and the lower surface has a corrugated shape.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising the steps of: fabricating a first electrode including a first base film and a first metal film; preparing a second electrode including a second base film and a second metal film; The glass substrate for manufacturing a micropattern is separated, and the surface of at least one of the upper surface and the lower surface is subjected to UVO surface treatment in a state where the flexible material film is stretched at both ends Forming a micropatterned film having a corrugated shape by releasing the micropatterned film and then bonding the micropatterned film between the first electrode and the second electrode to manufacture a pressure element, have.

The present invention relates to a process for producing a micropatterned film having a corrugated shape by surface treatment of a flexible substrate and then manufacturing a pressure device by bonding a micropattern film between the upper and lower electrodes, A pressure element having high flexibility can be manufactured.

In addition, the present invention relates to a process for producing a micropatterned film of a corrugated shape by coating a flexible substrate on a substrate, separating the substrate from the substrate, By depositing a metal and separating it from the substrate to manufacture an electrode, or by depositing metal on a wafer substrate to manufacture an electrode, and by bonding a micropatterned film between the electrodes to produce a pressure device, It is possible to manufacture a pressure element having high flexibility so that it can be restored to its original shape after being deformed.

1 is a view illustrating a pressure device according to an embodiment of the present invention,
2A to 2L are views illustrating a process of manufacturing a pressure device according to another embodiment of the present invention,
3A to 3C are SEM analysis results of a micropattern according to the kind of a flexible material according to an embodiment of the present invention,
4A to 4D are SEM analysis results of a micropattern film according to the execution time of UVO surface treatment according to an embodiment of the present invention,
5A to 5E are graphs showing results of thickness analysis of a micropattern film manufactured according to an embodiment of the present invention,
6A to 6D are graphs showing results of external stimulus analysis of a pressure device manufactured according to an embodiment of the present invention,
7A and 7B are graphs showing the results of performance analysis of the pressure device manufactured according to the embodiment of the present invention.

Advantages and features of embodiments of the present invention and methods of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. The following terms are defined in consideration of the functions in the embodiments of the present invention, which may vary depending on the intention of the user, the intention or the custom of the operator. Therefore, the definition should be based on the contents throughout this specification.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a view illustrating a pressure device according to an embodiment of the present invention.

Referring to FIG. 1, a pressure device according to an embodiment of the present invention may include a first electrode 110, a micropattern film 120, a second electrode 130, and the like.

The first electrode 110 includes a base film using a flexible material or a wafer substrate and a metal film having high electrical conductivity, and may include a first base film 111, a first metal film 112, and the like .

Here, the first base film 111 may be formed using PDMS (polydimethylsiloxane) or a wafer substrate when a flexible material is used, and the first metal film 112 may be formed of gold (Au), silver (Ag At least one of platinum (Pt) and palladium (Pd) may be selected and deposited by a physical vapor deposition (PVD) process such as vacuum evaporation or sputtering.

The first electrode 110 may be formed by applying a flexible material on a glass substrate using a spin-coating process, a drop-casting process, or the like, depositing a metal, As shown in FIG. In addition, the first electrode 110 can be manufactured in such a manner that a metal substrate is deposited on a wafer substrate using a wafer substrate.

The micro patterned film 120 is a flexible material film selected from at least one of PDMS, silicone rubber, acrylic rubber and ecoflex and having a corrugated shape on at least one of the upper and lower surfaces, Lt; RTI ID = 0.0 > um. ≪ / RTI > Here, the corrugated form formed in the micropatterned film 120 may have a width of about 5-50 μm and a height of 5-50 μm.

The micro patterned film 120 is formed by applying a flexible material on a glass substrate using a spin coating process or a drop casting process, separating the flexible material film from the glass substrate, clamping both ends of the separated flexible material film ), And UVO surface treatment is applied to at least one of the upper and lower surfaces in a state of 100% elongation to both sides, and the stretched flexible film is released when the UVO surface treatment is completed So as to have a corrugated shape on the surface.

For example, UVO surface treatment can be performed on the top and bottom surfaces using UVO, wherein the flexible material film is pulled at both ends to stretch 100% and then stretched for about 20-50 minutes in the top and bottom surfaces It is preferable to surface any one of the surfaces and turn over the flexible material film and surface the other surface for about 25-35 minutes.

The second electrode 130 is spaced apart from the first electrode 110 by a predetermined distance (for example, the entire thickness of the micropattern film 120). The second electrode 130 is electrically connected to the base film using a flexible material, a wafer substrate, An electrode including a conductive metal, and may include a second base film 131, a second metal film 132, and the like. Here, the second base film 131 may be formed using PDMS or the like, or a wafer substrate may be used. The second metal film 132 may be formed of Au, Ag, Pt, and Pd ) May be selected and deposited.

The second electrode 130 may be manufactured by coating a flexible material on a glass substrate using a spin coating process, a drop casting process, or the like, depositing a metal, and then separating the flexible material from the glass substrate. Further, the second electrode 130 can be manufactured in such a manner that the metal substrate is deposited on the wafer substrate using the wafer substrate.

The first electrode 110, the micropattern film 120 and the second electrode 130 as described above are formed on the first base film 111, the first metal film 112, the micropattern film 120, The metal film 132, and the second base film 131 in this order.

Accordingly, the present invention relates to a process for producing a micropatterned film having a corrugated shape by surface-treating a flexible substrate and then manufacturing a pressure device by bonding a micropattern film between the electrodes, A pressure element having high flexibility can be manufactured.

Next, a process of manufacturing a pressure element having the above-described structure will be described.

2A to 2L are views showing a process of manufacturing a pressure device according to another embodiment of the present invention. Hereinafter, the case where the first electrode 110 and the second electrode 130 are fabricated using the flexible material will be described as a first base film 111 and a second base film 131, respectively.

2A to 2L, a flexible material (for example, PDMS or the like) is applied onto a glass substrate 110a for manufacturing the first electrode 110 using a spin coating process, a drop casting process, or the like, The first base film 111 is formed.

Then, a metal (for example, gold (Au), silver (Ag), platinum (Pt), palladium (Pd) or the like) is deposited on the first base film 111, 1 metal film 112 is formed.

 The first base film 111 and the first metal film 112 are sequentially formed on the glass substrate 110a for manufacturing the first electrode 110 in which the first base film 111 and the first metal film 112 are sequentially formed, The first electrode 110 can be manufactured as shown in FIG. 2C.

If a flexible material (for example, PDMS or the like) is coated on the glass substrate 130a for manufacturing the second electrode 130 by a spin coating process, a drop casting process or the like in order to manufacture the second electrode 130 The second base film 131 is formed as shown in FIG.

Then, a metal (for example, gold (Au), silver (Ag), platinum (Pt), palladium (Pd) or the like) is deposited on the second base film 131, 2 metal film 132 is formed.

 The second base film 131 and the second metal film 132 are sequentially formed on the glass substrate 130a for manufacturing the second electrode 130 in which the second base film 131 and the second metal film 132 are sequentially formed. The second electrode 130 can be manufactured as shown in FIG. 2F.

In order to manufacture the micro patterned film 120, a flexible material is applied onto the glass substrate 120a for manufacturing the micro patterned film 120 by using a spin coating process, a drop casting process, or the like, Thereby forming a film 120b.

Then, as shown in Fig. 2H, the flexible material film 120b is separated from the glass substrate 120a for manufacturing the micropattern film 120. Then, as shown in Fig.

Next, both ends of the separated flexible material film 120b are fixed to the clamps C, and then 100% elongation to both sides as shown in Fig. 2I is maintained. Thereafter, as shown in Fig. 2J Similarly, at least one of the upper surface and the lower surface is UVO-treated.

Here, the UVO surface treatment is performed by pulling the flexible material film 120b at both ends and stretching 100% when it is performed on the upper surface and the lower surface, and then, for about 20-50 minutes, And then the other surface may be surface treated for about 25-35 minutes by turning over the flexible material film.

Meanwhile, in another embodiment of the present invention, the UVO surface treatment is performed on both the upper surface and the lower surface. However, it is needless to say that the UVO surface treatment can be performed on only one of the upper surface and the lower surface, -50 minutes. ≪ / RTI >

When the UVO surface treatment as shown in FIG. 2J is completed, the stretched flexible film 120b is released to produce the micropatterned film 120 having a corrugated shape on the surface as shown in FIG. 2K.

Then, the micropattern 120 is bonded between the first electrode 110 and the second electrode 130, which are manufactured through the above-described processes, to produce a pressure device as shown in FIG.

Here, the pressure element can be bonded in the order of the first base film 111, the first metal film 112, the micropattern film 120, the second metal film 132, and the second base film 131 have.

Accordingly, the present invention provides a micropatterned film of a corrugated shape by coating a flexible material on a substrate, separating the same, and fixing the both ends to UVO treatment while the substrate is stretched, coating a flexible material on the substrate, By depositing metal and then separating it from the substrate to produce electrodes, and by bonding the micropatterned membrane between the electrodes, it is possible to manufacture pressure devices with high flexibility and high flexibility so that they can be easily deformed after being deformed with high pressure sensitivity. A pressure element having a pressure-sensitive adhesive layer can be produced.

In another embodiment of the present invention, the first electrode 110 and the second electrode 130 may be formed by coating a flexible material on a substrate, depositing a metal on the flexible material, It is needless to say that they may be manufactured by depositing a metal on a wafer substrate, respectively.

As a result of SEM (Scanning Electron Microscope) analysis after the micropattern provided in the pressure device as described above, the micropattern film as shown in FIG. 3A was manufactured using PDMS, and the total thickness was about 200 μm , It can be seen that the corrugated form is produced with a width of approximately 25 [mu] m and a height of approximately 5 [mu] m.

Also, in the case of the micropattern film as shown in Fig. 3B (wrinkle formation on the upper surface only) and Fig. 3C (wrinkle formation on the upper and lower surfaces), it was produced using echo flex, , It can be seen that the corrugated form is produced with a width of approximately 35-40 [mu] m and a height of approximately 25 [mu] m.

Therefore, the flexible material used for producing the micro patterned film may be selected from PDMS (polydimethylsiloxane), silicone rubber, acrylic rubber, and ecoflex, and the eccoplex can be patterned with a more corrugated shape .

4A (20 min UVO surface treatment), Fig. 4B (30 min UVO surface treatment), Fig. 4C (40 min UVO surface treatment), and As shown in FIG. 4d (50 minutes UVO surface treatment), the micropattern film shows a corrugated shape. When 20 minutes UVO surface treatment is performed, small height and width wrinkles appear. Wrinkles appear, and the 40-minute UVO surface treatment and the 50-minute UVO surface treatment show wrinkles that are relatively uneven in height and width.

Thus, it can be seen that the UVO surface treatment can be performed for 20-50 minutes, preferably 25-35 minutes before the corrugated form is best formed.

On the other hand, as a result of analyzing the thickness of the micropattern film subjected to the UVO surface treatment for 30 minutes by using PDMS or Ecomplex, in the case of the flexible material film manufactured using PDMS without UVO surface treatment, As shown in FIG. 5B, the total thickness of the micropattern film is about 265 μm in the case of the micropattern film made of PDMS which has been subjected to the UVO surface treatment of about 268 μm and 30 minutes.

Further, in the case of a flexible material film produced using EcoFlex without UVO surface treatment, as shown in Fig. 5C, the total thickness was about 265 mu m, and the surface of either the upper surface or the lower surface was subjected to UVO surface treatment As shown in FIG. 5D, the micro patterned film prepared by the Ecoflex process was subjected to UVO surface treatment for about 30 minutes on both the top and bottom surfaces, and the total thickness of the micro patterned film was about 280 占 퐉. As shown in FIG. 5E, it can be seen that the total thickness of the micro patterned film is about 270 μm.

Therefore, it can be seen that when the UVO surface treatment is performed for the same time, the corrugated form of the micropattern made using Ekoflex is formed deeper and deeper than the micropattern made using PDMS.

As a result of the external stimulation of the pressure device having the above-mentioned micropattern film, as shown in FIGS. 6A and 6B, as well as the case of the pressure device having the micropattern film manufactured using the PDMS, It can be seen that the recovery and deformation are constantly changed according to the external stimulus even in the case of the pressure device having the micro patterned membrane manufactured using the eco flex.

On the other hand, as a result of the performance analysis of the pressure device having the micropattern as described above, in the case of the pressure device having the micropattern film manufactured using the hard wafer electrode, The change in capacitance due to the external pressure was smaller than that in the case where the corrugated pattern was formed on only one of the surfaces. However, in the case of the micropattern having both corrugated surfaces, the change in capacitance was observed even at a small external pressure Able to know.

Also, in the case of the pressure device provided with the soft PDMS electrode and the micro patterned film, as shown in FIG. 7B, although it is low, it can be seen that the change of the capacitance is largely caused even at the external minute pressure.

Therefore, when there is no pattern according to the characteristics of the hard or soft electrode, when the corrugated form is formed on only one surface, and when the corrugated form is formed on both the surfaces, When the micro patterned membrane is used for a pressure device, it is highly suitable for a pressure device due to high sensitivity due to an external stimulus, so that it can be confirmed that the application range is large.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be readily apparent that such substitutions, modifications, and alterations are possible.

110: first electrode 111: first base film
112: first metal film 120: micro patterned film
130: second electrode 131: second base film
132: second metal film

Claims (8)

A first electrode including a first base film and a first metal film;
A second electrode including a second base film and a second metal film, the second electrode being spaced apart from the first electrode by a predetermined distance;
Wherein at least one surface of the upper surface and the lower surface has a corrugated shape and is provided between the first electrode and the second electrode and has a micro patterned film made of ecoflex
And a piezoelectric element.
The method according to claim 1,
Wherein one of PDMS (polydimethylsiloxane) and a wafer substrate is selected as the first base film and the second base film, and the first metal film and the second metal film are respectively formed of gold (Au), silver (Ag) ) And palladium (Pd) are selected.
delete Fabricating a first electrode comprising a first base film and a first metal film,
Fabricating a second electrode comprising a second base film and a second metal film,
A step of producing a micropattern film from a flexible material comprising an ecoflex,
Forming a pressure element by bonding the micropattern film between the first electrode and the second electrode
And a step of forming the piezoelectric element.
5. The method of claim 4,
The first and second electrodes may be formed by one of PDMS (polydimethylsiloxane) and a wafer substrate, and the first and second base films may be formed of gold Wherein at least one of Au, Ag, Pt, and Pd is selectively deposited and deposited.
delete 5. The method of claim 4,
The step of fabricating the micro patterned film may include a step of applying a film of a flexible material on a glass substrate, separating the film of the flexible material from the glass substrate, stretching the flexible material film to both ends, Wherein at least one surface is subjected to UVO surface treatment and then released to produce a micropatterned film having a corrugated shape.
8. The method of claim 7,
Wherein the UVO surface treatment is performed for 20 to 50 minutes on any one surface of the flexible material.
KR1020150089068A 2015-06-23 2015-06-23 Pressure device and its fabricating method KR101684133B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108760144A (en) * 2018-05-29 2018-11-06 成都新柯力化工科技有限公司 A kind of flexible membrane improving pressure electronic transducer sensitivity
CN110095211A (en) * 2019-05-24 2019-08-06 清华大学深圳研究生院 A kind of stretchable tactile sensor array and preparation method thereof

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JP2011053149A (en) * 2009-09-03 2011-03-17 Konica Minolta Business Technologies Inc Pressure measuring device, pressure detection sensor, and pressure measurement method
KR101465366B1 (en) 2013-10-21 2014-11-25 성균관대학교산학협력단 Highly stretchable energy generator
JP2014229690A (en) 2013-05-21 2014-12-08 独立行政法人産業技術総合研究所 Piezoelectric element and method for manufacturing the same

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JP2011053149A (en) * 2009-09-03 2011-03-17 Konica Minolta Business Technologies Inc Pressure measuring device, pressure detection sensor, and pressure measurement method
JP2014229690A (en) 2013-05-21 2014-12-08 独立行政法人産業技術総合研究所 Piezoelectric element and method for manufacturing the same
KR101465366B1 (en) 2013-10-21 2014-11-25 성균관대학교산학협력단 Highly stretchable energy generator

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Cited By (3)

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Publication number Priority date Publication date Assignee Title
CN108760144A (en) * 2018-05-29 2018-11-06 成都新柯力化工科技有限公司 A kind of flexible membrane improving pressure electronic transducer sensitivity
CN110095211A (en) * 2019-05-24 2019-08-06 清华大学深圳研究生院 A kind of stretchable tactile sensor array and preparation method thereof
CN110095211B (en) * 2019-05-24 2023-12-19 清华大学深圳研究生院 Stretchable touch sensor array and preparation method thereof

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