KR101666163B1 - Gate valve and substrate processing apparatus having the same - Google Patents

Gate valve and substrate processing apparatus having the same Download PDF

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Publication number
KR101666163B1
KR101666163B1 KR1020150069652A KR20150069652A KR101666163B1 KR 101666163 B1 KR101666163 B1 KR 101666163B1 KR 1020150069652 A KR1020150069652 A KR 1020150069652A KR 20150069652 A KR20150069652 A KR 20150069652A KR 101666163 B1 KR101666163 B1 KR 101666163B1
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KR
South Korea
Prior art keywords
opening
closing member
injection
passage
gate valve
Prior art date
Application number
KR1020150069652A
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Korean (ko)
Inventor
김경모
강한묵
이근우
Original Assignee
주식회사 케이씨텍
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Filing date
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Application filed by 주식회사 케이씨텍 filed Critical 주식회사 케이씨텍
Priority to KR1020150069652A priority Critical patent/KR101666163B1/en
Application granted granted Critical
Publication of KR101666163B1 publication Critical patent/KR101666163B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

Abstract

A gate valve is disclosed. The gate valve includes a valve that selectively opens and closes the substrate transfer path so that the substrate can be drawn in and out. The valve is provided so as to be movable up and down with respect to the first opening and closing member and the first opening and closing member. A driving part for moving the second opening and closing member, an injection part for supplying gas to the second opening and closing member, a flow path part formed inside the second opening and closing member for guiding the gas provided from the injection part, And a jetting portion formed on a surface of the second opening and closing member which faces the first opening and closing member, for jetting gas provided from the flow path portion to the outside.

Description

BACKGROUND OF THE INVENTION Field of the Invention [0001] The present invention relates to a substrate processing apparatus having a gate valve,

The present invention relates to a gate valve, and more particularly, to a substrate processing apparatus having a gate valve for opening and closing an entrance formed between a process chamber and a transfer section.

In general, in order to manufacture a semiconductor device, various processes such as lithography, deposition, and etching are repeatedly performed. Examples of the drying method include a spin drying method and a drying method using a Marangoni effect by iso-propyl alcohol (IPA).

Among them, isopropyl alcohol is used to dry the substrate in a vertical direction (DIW), and isopropyl alcohol and nitrogen gas (N 2) The substrate is dried by generating a marangoni effect.

(DIW), isopropyl alcohol (IPA), and nitrogen gas (N2) into a rotating substrate, and a cleaning unit for maintaining a cleanliness in the chamber And a gate valve for performing the above operation.

In spite of the closing of the gate valve, there is a problem that the air flows into the clearance and the change of the air pressure in the chamber becomes large.

Therefore, it is necessary to develop a device capable of preventing a change in air pressure in the chamber.

An object of the present invention is to provide a substrate processing apparatus having a gate valve capable of preventing a change in air pressure in a chamber.

A gate valve according to embodiments of the present invention will be described. The valve for selectively opening and closing the substrate transfer path so that the substrate can be drawn in and out is provided so as to be movable up and down relative to the first opening and closing member and the first opening and closing member and configured to close the conveying passage when the valve is in contact with the first opening and closing member A flow path part for guiding the gas provided in the injection part, and a flow path part for guiding the gas supplied from the flow path part to the flow path part, And a jetting portion formed on a surface of the second opening and closing member facing the first opening and closing member.

According to one aspect, the injection unit can be configured to be operated when the second openable and closable member is lowered.

According to one aspect, the ejecting portion may be a plurality of holes or openings formed in the surface of the second opening and closing member, and the ejecting portion may be formed to be inclined from the surface of the second opening and closing member.

According to one aspect, the flow path portion may be formed in the interior of the second opening and closing member so as to distribute the gas and to face the entire surface of the second opening and closing member. The flow path includes a first injection path formed to penetrate the surface of the second opening and closing member, a second injection path passing through the driving part, and a connection path connecting the first injection path and the second injection path between the second opening and closing member and the driving part can do.

According to one aspect of the present invention, the connection passage is formed in a manner that the second on-off valve is expandable and contractible so that the first injection passage and the second injection passage are connected while the second on-off valve is moving up and down.

 The driving unit may include a cylinder for lifting and lowering the second opening and closing member, and an expanding and contracting unit provided on the outer periphery of the cylinder to expand and contract according to the operation of the cylinder. The second opening and closing member may be in the form of a tube, An elastic material may be provided on the inner peripheral surface.

A substrate processing apparatus according to another embodiment of the present invention will be described. A transfer chamber for transferring the substrate to the process chamber, and a gate valve disposed between the process chamber and the transfer chamber for opening and closing an entrance through which the substrate is transferred, the gate valve including a first opening and closing member, A second opening / closing member configured to move up and down with respect to the member and configured to close the conveying passage when the first opening and closing member comes in contact with the member, a driving unit configured to raise and lower the second opening and closing member, A flow passage formed in the second opening and closing member for guiding the gas supplied from the injecting portion and a gas provided from the flow passage portion to the outside and being formed on a surface facing the first opening and closing member in the second opening and closing member And a jetting portion.

According to one aspect, the injection unit can be configured to be operated when the second openable and closable member is lowered.

According to one aspect, the ejecting portion may be a plurality of holes or openings formed in the surface of the second opening and closing member, and the ejecting portion may be formed to be inclined from the surface of the second opening and closing member.

According to one aspect, the flow path portion may be formed in the interior of the second opening and closing member so as to distribute the gas and to face the entire surface of the second opening and closing member. The flow path includes a first injection path formed to penetrate the surface of the second opening and closing member, a second injection path passing through the driving part, and a connection path connecting the first injection path and the second injection path between the second opening and closing member and the driving part can do.

According to one aspect of the present invention, the connection passage is formed in a manner that the second on-off valve is expandable and contractible so that the first injection passage and the second injection passage are connected while the second on-off valve is moving up and down.

The driving portion may be constituted by a cylinder for lifting and lowering the second opening and closing member, and a retractable portion provided on the outer periphery of the cylinder so as to expand and contract in accordance with the operation of the cylinder, and the second opening and closing member may be in the form of a tube.

According to the present invention, even when the gate valve is opened, the nitrogen gas is injected to the outside through the plurality of guide passages formed in the second opening and closing member, and the change in the air pressure in the process chamber can be prevented.

Further, when the gate valve is closed, the process chamber can be closed from the outside, and the particles can be prevented from entering the process chamber.

FIG. 1 is a view showing a gate valve provided between a transfer part and a process chamber according to an embodiment of the present invention.
2 is a front view of a gate valve according to an embodiment of the present invention.
3 is a side view showing a state in which the gate valve is opened according to the embodiment of the present invention.
4 is a side view showing a closed state of the gate valve according to the embodiment of the present invention.

FIG. 1 is a view showing a gate valve provided between a transfer part and a process chamber according to an embodiment of the present invention. Referring to FIG.

A transfer unit 200 for transferring the substrate to the process chamber 300 and a gate valve 100 for opening and closing an entrance formed between the process chamber 300 and the transfer unit 200, May be provided.

The process chamber 300 may be, for example, a cleaning apparatus in which a cleaning and drying process of the substrate is performed by receiving and rotating a single substrate. However, the present invention is not limited to the present invention (or the process chamber 300), and the process chamber 300 may be various devices for processing substrates for producing semiconductors in addition to the cleaning apparatus.

A gate valve 100 may be provided between the transfer part 200 and the process chamber 300 to keep the inside of the process chamber 300 in a vacuum state and prevent dust and foreign matter from entering the process chamber 300.

2 is a front view of a gate valve according to an embodiment of the present invention. Referring to FIG.

The gate valve 100 selectively opens and closes the substrate transfer path 10 and the substrate transfer path 10 so that a predetermined substrate can be drawn in and drawn out. The gate valve 100 includes a first opening / closing member 31, a second opening / closing member 32, And may include a drive portion 35, a flow path portion 41 formed in the second opening and closing member 32, a jetting portion 45, a cylinder 33, a stretchable portion 34, and an injection portion 40.

The gate valve 100 provided at one side adjacent to the substrate transfer path 10 of the process chamber may be configured to selectively open and close the transfer passage 10. [ The gate valve 100 may be formed on the side wall of the process chamber 300. That is, not only the side wall, but also the structure in which the substrate transfer passage 10 is effectively opened and closed and the apparatus layout is taken into consideration is formed on the lower surface of the process chamber.

First, the second opening / closing member 32 for opening / closing the substrate transfer path 10 may be configured to be movable up and down by the operation of the driving unit 35. A bellows-shaped stretchable and contractible portion 34 provided at the outer periphery of the cylinder 33 and the cylinder 33 may be provided at the lower end of the second opening and closing member 32. The second opening and closing member 32 may be moved up and down by the operation of the cylinder 33 provided in the driving unit 35. [ The stretchable and contractible portion 34 can be configured in such a stretchable form that the drive portion 35 and the second openable and closable member 32 are connected and folded or stretched according to the operation of the cylinder.

The first opening and closing member 32 may be formed in a tube shape and the first opening and closing member 31 disposed at the upper end of the second opening and closing member 32 corresponds to the second opening and closing member 32, Shaped inner peripheral surface is formed so as to correspond to the shape of the first opening and closing member 32 and the second opening and closing member 32 and the first opening and closing member 31 are in contact with each other.

The second opening and closing member 32 may have a plurality of jetting portions 45 formed on the surface of the second opening and closing member 32 so that the nitrogen gas supplied from the injecting portion passes through the surface of the second opening and closing member 32, .

The jetting section 45 may be formed on the entire surface of the second opening and closing member 32 so as to form a plurality of jetting sections 45 spaced apart from each other by a predetermined distance so as to inject nitrogen gas toward the upper end .

The jetting section 45 receives the nitrogen gas from the injection section 40 and passes through the drive section 35 and passes through the branching guide passage section 46 formed on the second opening and closing member 32 to form nitrogen The gas may be flowed, and nitrogen gas may be injected into the jetting section 45.

The flow path portion 46 includes a first injection flow path 42 formed inside the entire surface of the second on-off valve 32, a second injection flow path 41 formed inside the entire surface of the drive portion 35, A distributing passage formed in a plurality of branching shapes on the inner surface of the second opening / closing valve 32 by distributing the gas from the distributing passage 42, a jetting section 45 formed to jet the gas flowing from the distributing passage 44, 42 and the second injection flow path 41, as shown in FIG.

The gas flows from the injection section 40 to the second injection flow passage 41 formed in the driving section 35 and flows through the connection flow passage 43 to flow into the first injection flow passage 42, And the gas is distributed to the outside of the second on-off valve 32 by passing through the distributing channel and passing through the jetting section 45, This is possible. The gas may be configured to be injected toward the first opening / closing valve 31.

The jetting section 45 may be formed to be inclined at a predetermined angle with respect to the vertical direction of the second opening / closing valve 32. The tilt angle may be between 0 [deg.] And 90 [deg.].

The jetting section 45 may be a plurality of holes or openings formed on the surface of the second opening and closing member 32.

The expansion and contraction portion 34 is provided between the driving portion 35 and the second opening and closing valve 32 so as to enclose the connection flow path 43, The second opening / closing valve can be configured to be movable up and down. The extensible portion 34 may be a bellows.

This is because when the gate valve 100 is opened, the substrate transfer passage 10 formed on one side of the process chamber 1 is opened by the operation of the injection unit 40, It is possible to form the inside of the process chamber 300 in a vacuum state even though nitrogen gas is injected from the injection part 45 and the gate valve 100 is opened.

As the nitrogen gas is injected, it is possible to prevent a change in air pressure even when the process chamber 300 is in the open state.

FIG. 3 is a side view showing a state in which a gate valve according to an embodiment of the present invention is opened, and FIG. 4 is a side view illustrating a state in which a gate valve according to an embodiment of the present invention is closed. Referring to FIG.

It is possible to open and close the substrate transfer path 10 by the gate valve outside the process chamber 300.

The substrate transfer passage 10 formed on one side of the process chamber 300 must be opened in order to transfer the substrate into the process chamber 300. The cylinder 33 may be lowered to lower the second openable and closable member 32 to open the substrate transfer path 10. The second opening and closing member 32 is lowered and the substrate transfer path 10 is opened.

When the substrate transfer path 10 is opened as described above, the substrate is transferred by the robot arm (not shown) into the process chamber 300 through the substrate transfer path 10 formed on one side of the process chamber 300 .

When the substrate is transferred into the process chamber 300, the process is performed on the substrate. At this time, in order to vacuum the inside of the process chamber 300, the jetting section 45 formed in the second open / . The jetting section 45 receives the nitrogen gas from the injection section 40 and passes through the drive section 35 and passes through the plurality of distribution channels 44 formed in the second opening and closing member 32 to flow nitrogen gas , And injecting nitrogen gas into the jetting section (45).

When the gate valve 100 is opened in the substrate transfer path 10 formed on one side of the process chamber 1, the injection part 40 is operated to open the second opening / closing member 32, It is possible to form the inside of the process chamber 300 in a vacuum state even though nitrogen gas is injected from the quartz portion 45 and the gate valve 100 is opened.

After the substrate is transferred into the process chamber 300, the second openable and closable member 32 of the gate valve 30 is raised to close the substrate transfer passage 10 so that the substrate can be processed, The second opening and closing member 32 and the first opening and closing member 31 are brought into contact with each other so that the substrate transfer path 10 can be completely sealed. The substrate transfer path 10 can be closed while the second opening / closing member 32 is lifted.

The inner circumferential surface of the first opening and closing member 31 may be provided with an elastic sealing material. When the first opening and closing member 31 and the second opening and closing member 32 are in contact with each other, a complete sealing shape can be formed.

Thus, the substrate transfer path 10 can be closed, a vacuum state can be formed inside the process chamber 300, and the transfer path 10 can be closed to perform the substrate processing.

This can seal the process chamber 300 from the outside when the gate valve 100 is closed, thereby preventing the particles from entering the process chamber 300.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. In addition, the present invention is not limited to the above-described embodiments, and various modifications and changes may be made thereto by those skilled in the art to which the present invention belongs. Therefore, the spirit of the present invention should not be construed as being limited to the above-described embodiments, and all of the equivalents or equivalents of the claims, as well as the following claims, are included in the scope of the present invention.

32: second opening and closing member 31: first opening and closing member
33: cylinder 34:
35: driving part 40:
41: first injection channel 42: second injection channel
43: connection channel 44: distribution channel
45: jetting part 46:
100: gate valve 200:
300: process chamber

Claims (21)

A gate valve for selectively opening and closing a substrate transfer path so that a substrate can be drawn in and taken out from a processing apparatus of a semiconductor substrate,
A first opening and closing member;
A second opening and closing member provided so as to be movable up and down with respect to the first opening and closing member and configured to close the conveying passage when the first opening and closing member is in contact with the first opening and closing member;
A driving unit for moving the second opening and closing member up and down;
An injection unit for supplying gas to the second opening and closing member;
A flow path portion formed in the second opening and closing member and guiding the gas provided from the injection portion; And
And a jetting portion formed on a surface of the second opening and closing member facing the first opening and closing member,
Wherein the flow path portion includes a first injection path formed to penetrate the surface of the second opening and closing member, and a second injection path penetrating the driving portion.
The method according to claim 1,
Wherein the injecting portion is operated when the second open / close member descends. The method according to claim 1,
Wherein the ejection portion is a plurality of holes or openings formed in the surface of the second opening and closing member. The method according to claim 1,
And the ejection portion is formed to be inclined from the surface of the second opening and closing member. The method according to claim 1,
Wherein the flow path portion is formed inside the second opening / closing member so as to distribute the gas and to face the entire surface of the second opening / closing member. delete The method according to claim 1,
And a connection channel connecting the first injection channel and the second injection channel between the second opening and closing member and the driving unit.
8. The method of claim 7,
Wherein the connection passage is formed so that the second opening and closing member is expandable and contractible so that the first injection passage and the second injection passage are kept connected when the second opening and closing member is moved up and down. 8. The method of claim 7,
Wherein the connecting passage has a bellows shape. The method according to claim 1,
The driving unit
A cylinder for moving the second opening and closing member up and down;
A stretchable portion provided on an outer circumferential portion of the cylinder and configured to expand and contract in accordance with the operation of the cylinder;
Wherein the gate valve comprises a valve body. The method according to claim 1,
And the upper surface of the second opening / closing member is formed in a tube shape.
The method according to claim 1,
And an inner surface of the first opening and closing member is provided with an elastic material. A process chamber in which a substrate processing process is performed;
A transfer unit for transferring the substrate to the process chamber;
A gate valve provided between the process chamber and the transfer unit for opening and closing an entrance port through which the substrate is transferred;
Including the
The gate valve
A first opening and closing member;
A second opening / closing member provided so as to be movable up and down with respect to the first opening and closing member, and configured to close the conveying passage when the first opening and closing member is in contact with the first opening and closing member;
A driving unit including a cylinder for lifting and lowering the second opening and closing member and an expanding and contracting unit provided on an outer periphery of the cylinder and configured to expand and contract according to the operation of the cylinder;
An injection unit for supplying gas to the second opening and closing member;
A flow path portion formed in the second opening and closing member and guiding the gas provided from the injection portion; And
A jetting portion formed on a surface of the second opening and closing member facing the first opening and closing member,
The substrate processing apparatus comprising:
14. The method of claim 13,
Wherein the injection unit is operated when the second open / close member descends. 14. The method of claim 13,
Wherein the ejection portion is a plurality of holes or openings formed in the surface of the second opening and closing member. 14. The method of claim 13,
Wherein the flow path portion is formed inside the second opening and closing member so as to distribute the gas and to face the entire surface of the second opening and closing member. 14. The method of claim 13,
The flow-
A first injection path formed to penetrate the surface of the second opening and closing member;
A second injection path through the driving unit;
The substrate processing apparatus comprising: 18. The method of claim 17,
And a connection channel for connecting the first injection channel and the second injection channel between the second opening and closing member and the driving unit. 19. The method of claim 18,
Wherein the connection passage is formed so that the second opening and closing member is expandable and contractible so that the first injection passage and the second injection passage are kept connected when the second opening and closing member is moved up and down. 19. The method of claim 18,
Wherein the connection passage has a bellows shape. delete
KR1020150069652A 2015-05-19 2015-05-19 Gate valve and substrate processing apparatus having the same KR101666163B1 (en)

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KR1020150069652A KR101666163B1 (en) 2015-05-19 2015-05-19 Gate valve and substrate processing apparatus having the same

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200035682A (en) 2018-09-27 2020-04-06 강택상 Substrate treatment apparatus

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1064919A (en) * 1996-08-23 1998-03-06 Toshiba Corp Manufacturing system for semiconductor device
KR20120089770A (en) * 2009-12-18 2012-08-13 생?고뱅 퍼포먼스 플라스틱스 팜푸스 게엠베하 System, method and apparatus for tolerance ring with functional layers
KR20160038948A (en) * 2014-09-30 2016-04-08 주식회사 원익아이피에스 Gate valve for processing substrate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1064919A (en) * 1996-08-23 1998-03-06 Toshiba Corp Manufacturing system for semiconductor device
KR20120089770A (en) * 2009-12-18 2012-08-13 생?고뱅 퍼포먼스 플라스틱스 팜푸스 게엠베하 System, method and apparatus for tolerance ring with functional layers
KR20160038948A (en) * 2014-09-30 2016-04-08 주식회사 원익아이피에스 Gate valve for processing substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200035682A (en) 2018-09-27 2020-04-06 강택상 Substrate treatment apparatus

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