KR101658406B1 - Density uniform supply equipment of the solder paste - Google Patents

Density uniform supply equipment of the solder paste Download PDF

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Publication number
KR101658406B1
KR101658406B1 KR1020150078157A KR20150078157A KR101658406B1 KR 101658406 B1 KR101658406 B1 KR 101658406B1 KR 1020150078157 A KR1020150078157 A KR 1020150078157A KR 20150078157 A KR20150078157 A KR 20150078157A KR 101658406 B1 KR101658406 B1 KR 101658406B1
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KR
South Korea
Prior art keywords
pressure
solder paste
buffer
chamber
buffering
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KR1020150078157A
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Korean (ko)
Inventor
고형래
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고형래
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Priority to KR1020150078157A priority Critical patent/KR101658406B1/en
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Publication of KR101658406B1 publication Critical patent/KR101658406B1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H05K3/3484—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The present invention relates to an apparatus for supplying solder paste with uniform density. The apparatus for supplying solder paste with uniform density includes: a body housing (100) for supplying the solder paste to a mask with the uniform density; a pressurizing chamber (300) to which a pressurizing means (200) for applying pressure to the solder paste is coupled; a pressure buffer adjusting chamber (500) to which a buffer adjusting means (400) is coupled; a buffer accommodating unit (600) in which the solder paste is accommodated and is moved by the pressure; a nozzle unit (700) spraying the solder paste to the outside; and a solder paste supplying unit (800) receiving the solder paste from the outside.

Description

[0001] The present invention relates to a solder paste uniform density supply apparatus,

The present invention relates to a solder paste uniform density supply apparatus, and more particularly, to a solder paste uniform density supply apparatus which is connected to a screen printer and supplies solder paste corresponding to a pattern formed on a mask for mounting various chips on a printed circuit board, By adjusting the solder paste to a uniform density, it is possible to improve the print quality through the supply of the solder paste of the same density at all times, thereby minimizing the product defects and minimizing the amount of residual solder paste after supplying the solder paste. Uniform density feeder.

2. Description of the Related Art Generally, a solder paste in a molten state is mounted on a printed circuit board (PCB), which is a main component of electronic devices such as computers and home appliances, so that various types of electronic components such as semiconductor chips and resistive chips can be mounted. And is printed in a constant pattern. The printing process of the solder paste is performed by a screen printer apparatus. The screen printer squeegees the solder paste supplied on the metal mask on which the opening of the specific pattern is formed, and applies the solder paste to the component mounting portion of the printed circuit board .

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic illustration of an interior of an example of a solder pump. Fig. 1, the solder pump 10 is for mounting solder paste on a mask mounted on a screen printer. The solder pump 10 includes a first chamber 13, a second chamber 14, a first pressure plate 15 A first pressing rod 11, a second pressing plate 16, a second pressing rod 12, and a nozzle unit 18. The first pressing rod 11,

The interior of the solder pump 10 is divided into a first chamber 13 and a second chamber 14 and solder paste is received in the first chamber 13 and the second chamber 14, respectively. The first pressure plate 15 reciprocates inside the first chamber 13 and contacts the solder paste accommodated in the first chamber 13. A first pressing rod 11 is coupled to the first pressing plate 15 and a driving unit is connected to the first pressing rod 11 to apply pressure to the solder paste accommodated in the first chamber 13. Likewise, the second pressure plate 16 reciprocates within the second chamber 14 and contacts the solder paste contained in the second chamber 14. A second pressing rod 12 is coupled to the second pressing plate 16 and a driving unit is connected to the second pressing rod 12 to apply pressure to the solder paste accommodated in the second chamber 16.

The solder paste contained in the first chamber 13 and the second chamber 14 is discharged through the nozzle portion 18 while the first pressing rod 11 and the second pressing rod 12 repeatedly rise and fall And is sprayed onto the mask.

The solder pump 10 as shown in Fig. 1 can dispense the solder paste contained in two different chambers while alternately pressing the solder paste onto the mask, thereby supplying the solder paste of the same quality, It is designed to be minimized, but it is not operational. The reason is that when the first chamber 13 side is pressed by the first pressure plate 15, the solder paste is discharged through the nozzle portion 18, but the second pressure plate 16 due to the change of the solder paste pressure on the nozzle portion 18 side So that the discharge density of the solder paste actually discharged through the nozzle portion 18 is also irregularly discharged.

Therefore, in the printing process of the solder paste, the mounting condition of the electronic components on the printed circuit board becomes poor due to the uneven quality of the solder paste, and the cost of the solder paste remaining in the solder pump after the completion of the process . ≪ / RTI >

On the other hand, a conventional solder paste supplying apparatus shown in Fig. 2 is disclosed. The first chamber and the second chamber are symmetrically formed, and a bottleneck connecting portion connecting the first chamber and the second chamber is formed and formed in a "V" shape. The first and second pressurizing portions are formed symmetrically with respect to the first chamber and the second chamber, respectively. A nozzle portion is formed in the bottleneck connecting portion.

In the conventional solder paste supplying device, the first and second pressing portions provided on the left and right sides are operated to press the solder paste accommodated in each chamber to move to the bottleneck connecting portion, and the solder paste is discharged to the nozzle portion of the bottleneck connecting portion .

The feature is that the pressure on the nozzle side is higher than the pressure of each chamber through the bottleneck connecting portion, thereby making it possible to discharge the solder paste uniformly by compensating the pressure drop when the solder paste is discharged through the nozzle portion.

However, this also forms a bottleneck connecting part of the narrow section. If the initial solder paste is sufficient, it is possible to discharge the solder paste with a uniform density. However, if the solder paste amount is insufficient, Resulting in non-uniform density of the solder paste, resulting in poor printing and poor product quality.

In addition, although a shielding plate for partial cross-sectional shielding is provided to compensate for the pressure drop of the bottleneck connecting portion of the conventional solder paste supplying apparatus, the pressure compensation is difficult when the remaining amount of the solder paste is small, So that there is a problem that uneven solder paste is discharged.

1) Korean Patent Registration No. 10-1356562, registered on January 22, 2014. 2) Korean Patent Registration No. 10-1196284, registered on October 25, 2012.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a solder paste dispenser which is capable of maintaining a constant pressure in a chamber containing a solder paste, It is possible to minimize the pressure change in the chamber by buffering the pressure shock which may be generated when the chamber is pressurized and to continuously compensate the pressure drop of the nozzle portion to cope with the pattern formed on the mask in order to mount various electronic components on the printed circuit board It is possible to supply solder paste of the same density at all times by adjusting the solder paste to uniform density at the time of screen printing by supplying solder paste so as to improve the print quality, minimize the product defect, and maintain the amount of residual solder paste after supplying the solder paste Solder Fee minimizes waste of raw material And to provide a uniform density supply device.

In order to achieve the above object, a solder paste uniform density supply device according to the present invention is formed to be long in a direction intersecting with a direction in which a squeegee of a screen printer moves, and includes a main body housing 100 for supplying a solder paste to a mask at a uniform density )and; A pressurizing chamber 300 to which a pressurizing unit 200 for applying pressure to the solder paste is coupled to the right side of the cross section orthogonal to the longitudinal direction of the main body housing 100; A pressure impact due to the application of the solder paste pressure is buffered by the pressure means coupled to the pressure chamber 200 to the right side of the cross section orthogonal to the longitudinal direction of the main body housing 100, A pressure buffer adjusting chamber 500 to which the buffer adjusting means 400 is coupled so that the paste is discharged in a predetermined amount; A cross section that crosses the solder paste movement direction of the pressure chamber 300 and a cross section that is larger than a cross section that crosses the cross section of the solder paste movement direction of the pressure buffer adjustment chamber 500 is formed, And the pressure buffering adjustment chamber 500 is connected to the pressure chamber 300 and the pressure buffer chamber 500 so as to prevent sudden solder paste injection while buffering the pressure shock caused by the pressure buffering 600; A nozzle unit 700 penetrating the lower surface of the buffer accommodating unit 600 and discharging the solder paste accommodated in the buffer accommodating unit 600 to the outside; And a solder paste supply unit 800 formed above the buffer receiving unit 700 and supplied with solder paste from the outside.

Here, the pressing means 200 has a cylindrical shape and includes a piston rod 210 having a hermetic sealing O-ring coupled to the outer circumferential edge of the piston rod 210; And a piston head 220 integrally formed on the piston rod 210 and having an airtight O ring coupled to an outer circumferential center of the piston rod 210. The pressurizing means 200 is coupled to the pressurizing chamber 300 The pressure is applied to the solder paste while moving in the pressure chamber 300, and is discharged to the nozzle unit 700 below the buffer receiving unit 600.

The pressure chamber 300 includes a pressure applying part 310 and a pressure applying part 310. The pressure applying part 310 is formed to receive a part of the solder paste and to apply pressure to the solder paste while the piston rod 210 of the pressing part 200 is air- ; The piston head 220 communicates with the pressure applying part 310 and the piston head 220 reciprocates by compressed air so that the piston rod 210 moves in the pressure applying part 310, And a cylinder part (320) coupled thereto.

Furthermore, the buffer adjusting means 400 is formed in a cylindrical shape, and includes a buffer rod 410 having an airtight O-ring at one end and an outer periphery thereof; And a buffering head 430 having a coupling hole to which a buffering adjusting member 420 provided to buffer a pressure shock due to a sudden pressure change is formed on the buffering rod 410. The buffering adjusting means 400 may be formed of, The pressure buffering adjusting chamber 500 is coupled to the pressure buffering adjusting chamber 500 to buffer the pressure shock due to a sudden pressure change of the solder paste while moving in accordance with a pressure applied in the buffer receiving portion 600, And is adjusted by the buffer adjusting member 420 to maintain the discharge pressure of the solder paste discharged through the nozzle unit 700 of the buffer receiving unit 600.

Here, the buffer adjusting member 420 may be one of an elastic spring and compressed air. The pressure buffering adjusting chamber 500 may be configured such that the solder paste is discharged by the pressure applied to the buffer receiving portion 600 The buffering rod 410 of the buffer adjusting means 400 is hermetically coupled to be moved by the solder paste flowing in from the buffer receiving portion 600 A cushioning guide portion 510 formed thereon; The buffer adjusting member 420 is connected to the buffering guide portion 510 and the pressure applied to the buffering rod 410, which is moved as the buffering head 430 is moved in accordance with the inflow of the buffering guide portion 510 of the solder paste, And the buffering head 430 is hermetically coupled so as to be buffered and adjusted.

The present invention relates to a solder paste dispenser, a solder paste dispenser, and a method of dispensing solder paste, the dispenser dispenser comprising: The solder paste is supplied so as to correspond to the pattern formed on the mask in order to mount various electronic components on the printed circuit board by minimizing the pressure change and continuously compensating the pressure drop in the nozzle portion, So that it is possible to supply the solder paste with the same density at all times, thereby improving the print quality, minimizing the product defects, and minimizing the amount of residual solder paste after supplying the solder paste, thereby reducing waste of raw materials.

1 is a view showing an example of a conventional solder paste pump.
2 is a view showing an example of a conventional solder paste supplying apparatus.
3 is an overall perspective view of a solder paste uniform density supply device in accordance with the present invention.
4 is a cross-sectional view taken along line AA of the solder paste uniform density supplying apparatus according to the present invention.
5 is a sectional view of an operating state of a solder paste uniform density supplying apparatus according to the present invention.
6 is a cross-sectional view showing another embodiment of the solder paste uniform density supplying apparatus according to the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and how to accomplish them, will become apparent by reference to the embodiments described in detail below with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described below, but may be embodied in various forms.

In the present specification, the present embodiment is provided to complete the disclosure of the present invention and to fully disclose the scope of the invention to a person having ordinary skill in the art to which the present invention belongs. And the present invention is only defined by the scope of the claims. Accordingly, in some embodiments, well known components, well known operations, and well-known techniques are not specifically described to avoid an undesirable interpretation of the present invention.

Like reference numerals refer to like elements throughout the specification. And, the terms used (hereafter) used herein are intended to illustrate the embodiments and are not intended to limit the invention in any way. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. Also, components and acts referred to as " comprising (or comprising) " do not exclude the presence or addition of one or more other components and operations.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless they are defined.

Hereinafter, technical features of the solder paste uniform density supplying apparatus of the present invention will be described in detail with reference to the accompanying drawings.

4 is a cross-sectional view taken along the line AA of the solder paste uniform density supplying apparatus according to the present invention, and FIG. 5 is a sectional view of the solder paste uniform density supplying apparatus according to the present invention. And FIG. 6 is a cross-sectional view showing another embodiment of the solder paste uniform density supplying apparatus according to the present invention.

The solder paste uniformity density supply device according to the present invention can be generated in the chamber by pressurizing means so that the pressure in the chamber in which the solder paste is received is always kept constant so that the discharge of the solder paste can be discharged more stably with a uniform density 3 and 4, the pressure drop generated in the chamber is buffered to minimize the sudden pressure change in the chamber and to constantly maintain the discharge pressure of the solder paste at a constant discharge pressure. As shown in FIGS. 3 and 4, The pressure buffering adjusting chamber 400, the pressure buffering adjusting chamber 500, the buffer receiving portion 600, the nozzle portion 700, the solder paste supplying portion 800, the pressing portion 200, the pressing portion 300, .

The main housing 100 is formed long in the direction in which the squeegee of the screen printer crosses the running direction on the mask. That is, when the solder paste is supplied to the mask, the squeegee is formed to follow the mask pattern on the mask so as to be printed in a position in front of the squeegee in parallel with the squeegee. And is formed to supply the solder paste to the mask at a uniform density. The pressure chamber 200, the pressure chamber 300, the buffer adjustment unit 400, the pressure buffer adjustment chamber 500, the buffer chamber 600, the nozzle unit 700, And a solder paste supply unit 800 are formed.

Here, the pressurizing chamber 300 and the pressure buffering adjusting chamber 500, which will be described later, formed in the main body housing 100 are preferably formed symmetrically so as to be advantageous from the viewpoint of processability. In addition, the joining direction of the pressurizing means 200 and the buffer adjusting means 400 coupled to the respective chambers can be arbitrarily changed, so that it is formed to have versatility in the applied equipment.

The pressing means 200 is formed to be coupled to a pressurizing chamber 300 to press the solder paste to discharge the solder paste with a uniform density by a uniform pressure. The pressing means 200 includes a piston rod 210 And a piston head 220, as shown in Fig. The piston rod 210 is formed in a cylindrical shape, and a hermetic retaining O-ring (not shown) is coupled to the outer circumferential edge of one end. The piston rod 210 is hermetically coupled to the pressure applying part 310 of the pressurizing chamber 300, which will be described later, to directly press the solder face.

The piston head 220 is integrally formed on the piston rod 210 and is hermetically coupled to the cylinder portion 320 of the pressurizing chamber 300 to be described later, And is configured to operate through the inflow and outflow of compressed air from the outside. That is, when air flows into the piston head 220 from the upper side of the cylinder part and air is discharged from the lower side of the cylinder part, the piston head 220 moves downward in the cylinder part, So that the piston rod 210 moves in the pressure applying part 310 to directly apply pressure to the solder paste.

For example, when the rice gruel is pulled out, the rice flour is pressed and bundled so that the rice flour is compressed and discharged at a uniform density. Thus, the solder paste is directly pressurized to press the solder paste at a constant density. That is, when the pressing means 200 is coupled to the pressurizing chamber 300 to be described later and moves in the pressurizing chamber 300 and directly applies pressure to the solder paste, (700).

The pressure chamber 300 is formed such that the solder paste is discharged at a uniform density by applying pressure to the solder face coupled with the pressing means 200. The pressure chamber 300 is orthogonal to the longitudinal direction of the main body housing 100, And the pressing means 200 for applying pressure to the solder paste to the right side of the cross section. Here, the pressurizing chamber 300 is formed of a pressure applying part 310 and a cylinder part 320.

As described above, the pressure applying unit 310 is formed such that the piston rod 210 of the pressing unit 200 is hermetically coupled and moves in the pressure applying unit 310. The solder paste is partially accommodated, The piston rod 210 of the pressing means 200 is hermetically coupled and formed so as to apply pressure to the solder paste. The piston rod 210 and the pressure applying unit 310 are kept hermetic so that the pressure is directly applied to the solder paste by the direct pressing force caused by the movement of the piston rod 210 do.

The cylinder 320 is communicated with the pressure application unit 310 and the piston rod 220 is moved by the compressed air so that the piston rod 210 moves in the pressure application unit 310, The head 220 is tightly coupled. That is, as the piston head 220 operated by the compressed air moves in the cylinder part 320, the piston rod 210 moves while changing the entire volume of the pressure applying part 310, The solder paste flowing directly under pressure and flowing by a volume change moves to the buffer accommodating portion described later. Thereafter, the solder paste introduced into the buffer accommodating portion flows into the pressure buffering adjusting chamber 500 and the nozzle portion 700 according to the added volume, as the solder paste flowing into the volume of the buffer applying portion flows in addition to the entire volume of the buffer accommodating portion. .

In this case, a pressure shock due to a sudden change in volume due to excessive pressure is generated, and a phenomenon occurs in which the discharge amount of the solder paste repeatedly increases and decreases due to repetitive pressure increase and decrease due to the pressure impact, And the buffer adjusting means. The description thereof will be described in detail again with the following configuration.

The buffer adjusting means 400 is formed so as to buffer a pressure shock caused by a sudden pressure change caused by the pressing means 200 and to discharge a uniform density through the discharge of the solder paste with the same pressure. Is coupled to the pressure buffer adjustment chamber 500, which will be described later.

Here, the buffer adjusting means 400 includes a buffering rod 410, a buffer adjusting member 420, and a buffering head 430. The buffer rod 410 is formed so as to maintain a uniform pressure in the chamber by preventing abrupt pressure rise and sudden pressure drop due to abrupt movement of the solder paste which causes a sudden change in volume due to abrupt pressure change by the pressure means , And is formed to prevent abrupt discharge of the solder paste to the nozzle unit 700, which will be described later, by being divided into the movement path of the solder paste subjected to the abrupt pressure change, so as to be coupled to the buffering guide unit 510 of the pressure buffering adjustment chamber 500 And is formed in such a manner that a hermetic sealing O-ring is coupled to the outer circumferential edge of one end to prevent abrupt descent of the pressure.

The cushioning head 430 is integrally formed on the cushioning rod 410 and integrally formed on the cushioning rod 410. The cushioning adjusting member 420 is coupled to the cushioning rod 410, A ball is formed. The cushioning head 430 is provided to correspond to the cushioning rod 410 with respect to the adjustment of the cushioning force of the cushioning adjusting member 420.

The buffer adjusting member 420 is formed to maintain a uniform pressure of the buffer receiving portion, which will be described later, and is buffered and adjusted by an elastic spring or compressed air. That is, when the former elastic spring is applied, one end of the elastic spring is coupled to the coupling hole, and the other end of the elastic spring is coupled to the upper end of the pressure buffer adjustment chamber 500, A range for maintaining the pressure in the buffer accommodation portion is set. In the latter case, the compressed air is controlled through a control unit (not shown) so that the pressure in the buffer receiving portion is uniformly maintained so that uniform solder paste can always be discharged.

That is, the buffer adjusting means 400 is coupled to the pressure buffering adjusting chamber 500 to be described later and moves in accordance with the pressure applied in the buffer receiving portion 600 described later in the pressure buffering adjusting chamber 500, And is adjusted by the buffer adjusting member 420 so as to buffer the pressure shock due to a sudden pressure change and to maintain the discharge pressure of the solder paste discharged through the nozzle unit 700 of the buffer accommodating unit 600.

The pressure buffering adjustment chamber 500 may be configured to allow the cushioning adjustment means 400 described above to be combined with the cushioning portion to be described later to solve the problem of repetitive discharge of increase and decrease of the discharge amount of the solder paste due to abrupt pressure change of the solder paste. A pressure shock due to the application of the solder paste pressure is buffered by the pressure means coupled to the pressure chamber 200 to the right side of the cross section orthogonal to the longitudinal direction of the main body housing 100 And the buffer adjustment means 400 is coupled to adjust the pressure change due to the pressure impact so that the solder paste is discharged in a predetermined amount. Here, the pressure buffering adjustment chamber 500 includes a buffering guide unit 510 and a buffer adjustment unit 520.

The cushioning guide part 510 controls the sudden pressure change of the solder paste due to the pressure impact and the flow of the solder paste due to the flow. The cushioning guide part 510 prevents the solder paste from being discharged The buffering rod 410 of the buffer adjusting means 400 is hermetically coupled to be moved by the solder paste flowing from the buffer receiving portion 600 do. That is, the cushioning guide unit 510 works together with the cushioning rod 410 described above. For example, when the catcher catches a baseball ball thrown by a pitcher, the cushioning guide unit 510 moves the baseball ball in the advancing direction If you grab it, you can get the same effect as catching a baseball without any impact.

When the solder paste buffer is continuously accommodated as described above, the buffer adjuster 520 may reduce the pressure of the buffer accommodating portion, which will be described later. Therefore, the buffer adjuster 520 may be connected to the buffer accommodating portion And the buffering rod 430 is connected to the buffering guide portion 510 and is moved in accordance with the inflow of the buffering guide portion 510 of the solder paste 410 Is applied to the buffer adjusting member 420 so that the buffering head 430 is hermetically coupled so as to be damped and adjusted.

The buffer accommodating portion 600 is filled with solder paste so that the solder paste is discharged only by the volume change of the pressing means 200 in a state in which the constant pressure is maintained at all times. A cross section that crosses the paste moving direction and a cross section that is larger than a cross section that intersects the solder paste moving direction of the pressure buffer adjustment chamber 500 are formed so that the pressure shock due to the instantaneous pressure by the pressing means 200 is firstly buffered And communicates with the pressure chamber 300 and the pressure buffering adjustment chamber 500 to prevent abrupt solder paste injection, and the solder paste is formed so as to be accommodated and moved by pressure.

Here, since the buffer receiving portion 600 has a volume larger than the cross section of the pressure applying portion 310, it is possible to prevent the pressure shock due to the abrupt pressure change by the pressing means 200, And interacts with the adjustment means 400 to control the pressure shock. That is, at the time of normal pressure, the solder paste accommodated in the buffer accommodating portion 600 at a uniform density is discharged through the nozzle portion 700 described later by the volume change by the pressing means. However, The discharge amount of the solder paste through the portion is not proper, resulting in failure due to the increase and decrease discharge, so that the buffer adjusting means 400 buffers and adjusts the pressure of the buffer receiving portion 600.

The nozzle unit 700 is formed to penetrate through the lower surface of the buffer receiving unit 600 and the solder paste accommodated in and passed through the buffer receiving unit 600 is discharged to the outside.

The solder paste supplying part 800 is formed in communication with the upper side of the buffer receiving part 700 to receive the solder paste from the outside. That is, even though the solder paste is continuously supplied to the buffer receiving portion 600 and the solder paste can be uniformly discharged, the pressure shock due to the abrupt pressure change of the pressing means can be absorbed by the cushioning Adjustment means 400 enables pressure adjustment to enable solder paste discharge with buffering and uniform density.

If the pressure buffering adjusting chamber 500 and the buffer adjusting means 400 are not configured when the solder paste is rapidly pressurized by the pressing means 200, Even if buffering is performed, the flow of the solder paste due to the pressure impact is generated, so that the solder paste discharged through the nozzle unit 700 rapidly increases the discharge amount, resulting in sudden pressure drop, The defective rate is increased due to the characteristics of the printed circuit board which must be printed and supplied with the solder paste of a constant amount of uniform density at all times.

However, by providing the pressure buffering adjustment chamber 500 and the buffer adjustment means 400, as described above, the catcher can stably catch the ball when the catcher catches the ball, The buffer adjusting means 400 and the pressure buffer adjusting chamber 500 receive the solder paste due to a sudden change in pressure to thereby prevent the sudden flow of the solder paste and to prevent the pressure of the buffer adjusting member 420 Through compensation, the solder paste discharge is always constant at a constant and uniform density.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. As such, the present invention can be implemented by combining these. Accordingly, the invention is only defined by the scope of the claims set forth in the claims.

100: main body housing 200: pressing means
210: Piston rod 220: Piston head
300: pressure chamber 310: pressure applying part
320: cylinder part 400: buffer adjusting means
410: buffer rod 420: buffer adjustment member
430: buffer head 500: pressure buffer adjustment chamber
510: buffer guide part 520: buffer adjustment part
600: Buffer accommodating portion 700: Nozzle portion
800: Solder paste supply part

Claims (6)

A main body housing 100 formed to be elongated in a direction intersecting with the moving direction of the squeegee of the screen printer and supplying the solder paste to the mask at a uniform density;
A pressurizing chamber 300 to which a pressurizing unit 200 for applying pressure to the solder paste is coupled to the right side of the cross section orthogonal to the longitudinal direction of the main body housing 100;
The pressure shock due to the application of the solder paste pressure is buffered by the pressure means coupled to the pressure chamber 300 to the right side of the cross section orthogonal to the longitudinal direction of the main body housing 100, A pressure buffer adjusting chamber 500 to which the buffer adjusting means 400 is coupled so that the paste is discharged in a predetermined amount;
A cross section that crosses the solder paste movement direction of the pressure chamber 300 and a cross section that is larger than a cross section that crosses the cross section of the solder paste movement direction of the pressure buffer adjustment chamber 500 is formed, And the pressure buffering adjustment chamber 500 is connected to the pressure chamber 300 and the pressure buffer chamber 500 so as to prevent sudden solder paste injection while buffering the pressure shock caused by the pressure buffering 600;
A nozzle unit 700 penetrating the lower surface of the buffer accommodating unit 600 and discharging the solder paste accommodated in the buffer accommodating unit 600 to the outside;
And a solder paste supply unit 800 formed above the buffer receiving unit 600 and supplied with solder paste from the outside.
The method according to claim 1,
The pressing means 200 is formed in a cylindrical shape, and includes a piston rod 210 having a hermetic sealing O-ring coupled to the outer periphery at one end thereof;
A piston head 220 integrally formed on the piston rod 210 and having an airtight O-ring coupled to an outer circumferential center thereof,
The pressing means 200 is coupled to the pressurizing chamber 300 and moves in the pressurizing chamber 300 to apply pressure to the solder paste to be discharged to the nozzle portion 700 below the buffer receiving portion 600 Features Solder Paste Uniform Density Feeder.
3. The method of claim 2,
The pressure chamber 300 includes a pressure applying unit 310 configured to apply a pressure to the solder paste while reciprocally moving the piston rod 210 of the pressing unit 200 in a hermetically sealed manner and partially receiving the solder paste.
The piston head 220 communicates with the pressure applying part 310 and the piston head 220 reciprocates by compressed air so that the piston rod 210 moves in the pressure applying part 310, And a cylinder part (320) coupled to the solder paste.
The method according to claim 1,
The buffer adjusting means 400 has a cylindrical shape and includes a buffer rod 410 having an airtight O-ring at one end and an outer periphery thereof;
And a buffering head 430 having a coupling hole to which a buffer adjusting member 420 provided to buffer a pressure shock due to a sudden pressure change is coupled to the buffering rod 410,
The buffer adjusting means 400 is coupled to the pressure buffering adjusting chamber 500 and moves according to the pressure applied in the buffer receiving portion 600 in the pressure buffer adjusting chamber 500, Is adjusted by the buffer adjusting member (420) so as to buffer the pressure shock due to the solder paste and to maintain the discharge pressure of the solder paste discharged through the nozzle part (700) of the buffer receiving part (600) Uniform density supply.
5. The method of claim 4,
Wherein the buffer adjusting member (420) is any one of an elastic spring and compressed air.
5. The method of claim 4,
The pressure buffering adjustment chamber 500 is configured such that a part of the solder paste pushed by the pressure equal to or higher than the discharge pressure at which the solder paste is discharged by the pressure applied to the buffer receiving portion 600 is pushed and accommodated, A buffer guide portion 510 formed to be hermetically coupled with the buffer rod 410 and moved by the solder paste pushed in from the buffer receiving portion 600;
The buffer adjusting member 420 is connected to the buffering guide portion 510 and the pressure applied to the buffering rod 410, which is moved as the buffering head 430 is moved in accordance with the inflow of the buffering guide portion 510 of the solder paste, And a cushioning adjusting unit 520 to which the cushioning head 430 is hermetically coupled so as to be damped and adjusted.
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102100515B1 (en) 2019-03-20 2020-04-13 고혜영 Density uniform supply equipment of the solder past with improved washability
KR20210055222A (en) 2019-11-07 2021-05-17 고혜영 Solder paste supply device with vacuum unit and dumping method of solder paste through it
KR20240104711A (en) 2022-12-28 2024-07-05 주식회사이에스이 Sealed squeegee capable of supplying solder paste with uniform density

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101196284B1 (en) 2012-09-18 2012-11-06 이동주 Apparatus for supplying solder paste
KR101356562B1 (en) 2013-10-24 2014-01-29 유원근 Head apparatus for solder paste pump
KR101512767B1 (en) * 2013-11-14 2015-04-16 한형수 Solder paste dispenser

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101196284B1 (en) 2012-09-18 2012-11-06 이동주 Apparatus for supplying solder paste
KR101356562B1 (en) 2013-10-24 2014-01-29 유원근 Head apparatus for solder paste pump
KR101512767B1 (en) * 2013-11-14 2015-04-16 한형수 Solder paste dispenser

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102100515B1 (en) 2019-03-20 2020-04-13 고혜영 Density uniform supply equipment of the solder past with improved washability
KR20210055222A (en) 2019-11-07 2021-05-17 고혜영 Solder paste supply device with vacuum unit and dumping method of solder paste through it
KR20240104711A (en) 2022-12-28 2024-07-05 주식회사이에스이 Sealed squeegee capable of supplying solder paste with uniform density

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