KR101655686B1 - Fork for transferring wafer - Google Patents

Fork for transferring wafer Download PDF

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Publication number
KR101655686B1
KR101655686B1 KR1020150087113A KR20150087113A KR101655686B1 KR 101655686 B1 KR101655686 B1 KR 101655686B1 KR 1020150087113 A KR1020150087113 A KR 1020150087113A KR 20150087113 A KR20150087113 A KR 20150087113A KR 101655686 B1 KR101655686 B1 KR 101655686B1
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KR
South Korea
Prior art keywords
rubber
wafer
fork
fixing hole
styrene
Prior art date
Application number
KR1020150087113A
Other languages
Korean (ko)
Inventor
원상희
손국현
장석호
Original Assignee
에스케이씨솔믹스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 에스케이씨솔믹스 주식회사 filed Critical 에스케이씨솔믹스 주식회사
Priority to KR1020150087113A priority Critical patent/KR101655686B1/en
Application granted granted Critical
Publication of KR101655686B1 publication Critical patent/KR101655686B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Abstract

The present invention provides a fork for transferring a wafer, which enables detachment of fixing rubber not to occur when a wafer is mounted to be transferred, and prevents a leakage of an adhesive. The fork comprises: a fork for mounting a wafer; and a plurality of fixing rubber formed in the fork. The fixing rubber is inserted into a fixing hole formed in the fork, and comprises: a wafer contact unit which is in contact with the wafer; an insertion body; and a detachment prevention plate. The wafer contact unit is inserted into a contact unit fixing hole of the fixing hole, and the insertion body is inserted into a body fixing hole of the fixing hole. Moreover, the detachment prevention plate is inserted into a prevention plate fixing hole of the fixing hole.

Description

Fork for transferring wafer [0002]

The present invention relates to a wafer transfer fork, and more particularly, to a wafer transfer fork equipped with a fixing rubber for fixing a wafer.

In a semiconductor manufacturing process, a transfer device for transferring wafers to respective process chambers is used so that unit processes such as etching or diffusion of wafers can be performed. The wafers can be transported individually, or a plurality of wafers can be loaded and transported in a cassette. The wafer transfer device loads or transports the wafers loaded in the cassette individually into a specific device. In an apparatus for transferring wafers, a robot arm has a member called a fork, so that the wafer can be moved to a desired point using a fork. When transferring the wafer through the fork, the robot arm performs two-dimensional horizontal movement.

However, when the wafer is transferred to the fork, a slip phenomenon of the wafer placed on the fork may occur. When the wafer slips, the wafer is not aligned to the correct position and is released to one side. Transferring the detached wafer may result in damage due to contact with gate doors, up / down facilities, etc. In order to solve this problem, at least four fixing rods are usually mounted on the end portion of the fork. Since the fixed rubber itself has adhesiveness, it serves to prevent the wafer from slipping.

1 is a view showing a fork equipped with a conventional fixing rubber. 1, in a fork 100 including a release layer 102 coated with Teflon or the like on its front surface, four fixing rods 104 are mounted on a portion where a wafer is mounted. The securing rubber 104 is bonded to the release layer 102 with a rubber adhesive 106. Meanwhile, while the wafer is seated on the stationary rubber 104 and transported, a force causing slip is generated and applied to the stationary rubber 104. [ The force causes the fixing rubber 104 to be detached from the fixing hole 108. That is, the conventional fixed rubber 104 frequently detaches from the wafer during wafer transfer. Further, in the conventional fixing rubber 104, the rubber adhesive 106 flows out to the fork 100, and the wafer sticks to the fork 100, so that the wafer is not properly transported.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a wafer transfer fork that prevents detachment of a fixing rubber from occurring during transportation of a wafer, and prevents leakage of an adhesive.

A wafer transfer fork for solving the problems of the present invention includes a fork for mounting a wafer and a plurality of fixing rubbers formed on the fork. At this time, the fixing rubber is composed of a wafer contact portion inserted into a fixing hole formed in the fork and contacting the wafer, an insertion body and a detachment prevention plate, the wafer contacting portion being a contact portion fixing hole of the fixing hole, The body fixing hole and the detachment prevention plate are fitted into the fixing plate fixing hole of the fixing hole.

In the fork of the present invention, the wafer contact portion, the insertion body, and the detachment prevention plate may be integrally formed. The detachable protection plate may be adhered to the insertion body via an adhesive layer. It is preferable that the body fixing hole and the prevention plate fixing hole are rectangular holes. The fixing rubber may be at least one selected from the group consisting of silicone rubber, polyurethane rubber, fluorine rubber, acrylic rubber, polyamide rubber, polyisobutylene rubber, polyisoprene rubber, chloroprene rubber, butyl rubber, nitrile butyl rubber, styrene- Styrene-butadiene rubber, styrene-butadiene rubber, styrene-butadiene rubber, styrene-isoprene-styrene rubber, chlorosulfonated polyethylene rubber, or a mixture thereof. have.

In the preferred fork of the present invention, an adhesive layer is disposed between the wafer bonding portion, the bonding portion fixing hole, the detachable protection plate, and the prevention plate fixing hole, and the adhesive layer is not exposed to the outside of the fork. It is preferable that the adhesive layer is made of a thermosetting adhesive, and the heat treatment temperature of the adhesive layer is lower than the heat resistant temperature of the release layer applied to the fork.

According to the wafer transfer fork of the present invention, the detachment prevention plate is formed on the fixing rubber on which the wafer is seated, so that the detachment of the fixing rubber does not occur during transportation of the wafer. Further, the adhesive can be limited to the inside of the fixing hole of the fork, thereby preventing the adhesive from flowing out.

1 is a view showing a fork equipped with a conventional fixing rubber.
2 is a view showing a first fork for wafer transfer according to the present invention.
FIG. 3 is a plan view showing a fork body into which the first fixing rubber of FIG. 2 is inserted.
4 is a view showing a second fork for wafer transfer according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments described below can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. The embodiments of the present invention are provided to enable those skilled in the art to more fully understand the present invention.

The embodiment of the present invention proposes a fork that prevents detachment of the fixing rubber and prevents the adhesive from flowing out while the wafer is mounted and transported by forming a detachable plate on the fixing rubber on which the wafer is seated. To this end, a detailed description will be given of the structure of the fixed rubber having the detachment prevention plate formed thereon, and the process of preventing the detachment of the fixed rubber by the detachment prevention plate will be described in detail. In addition, the manner in which the adhesive for fixing the stationary rubber does not leak out will be described in detail. The fixed rubber of the present invention is applied to a process for manufacturing a semiconductor device. Hereinafter, a manufacturing process of a semiconductor device will be described as an example.

2 is a view showing a first fork 10 for wafer transfer according to an embodiment of the present invention. FIG. 3 is a plan view showing the fork body 20 into which the first fixing rubber 30 of FIG. 2 is inserted. For convenience of explanation, the vicinity of the first fixing rubber 30 is enlarged and expressed in a sectional view.

Referring to FIGS. 2 and 3, the first fork 10 has a release layer 22 formed on the fork body 20. The fork body 20 is typically made of a high hardness ceramic such as alumina. The fork body 20 is provided with a wafer mounting part (a) on which the wafer is mounted. The mounting part (a) is provided with a step 24 that fits around the wafer to facilitate mounting of the wafer. The fork body 20 has at least two fingers 26 to be inserted between the plurality of wafers to lift the wafers. Of course, other forms of fork body 20 may be applied within the scope of the present invention. Here, only one example of the fork body 20 is presented. The release layer 22 is provided to prevent adhesion of foreign matter, and is preferably coated with Teflon, for example, a fluorine resin.

The first fork 10 of the present invention includes a first securing rubber 30 for allowing the wafer to be stably mounted. When the wafer is placed on the first fixing rubber 30, the wafer can be more reliably mounted on the first fork 10 by the adhesive property of the first fixing rubber 30. Preferably, the first anchor rubber 30 is located at the end of the step 24 and the fingers 26. This is determined in consideration of the shape of the wafer. The number of the first fixing rubber 30 is not limited to this, but is preferably at least four. The number of the first fixing rubber 30 is set in advance in consideration of the size of the wafer, the stable mounting of the wafer, and the like.

The first fixing rubber 30 is divided into a wafer contact portion 30a, an insertion body 30b, and a detachable prevention plate 30c which are in contact with the wafer. The first fixing rubber 30 is fitted in the fixing hole 34. Specifically, the wafer contact portion 30a is fitted in the contact portion fixing hole 34a formed in the direction in which the wafer is mounted, the insertion body 30b is inserted into the body fixing hole 34b, Plate fixing hole 34c formed on the opposite side of the fixing hole 34a. Substantially, the wafer contact portion 30a, the insertion body 30b, and the detachment prevention plate 30c constituting the first fixing rubber 30 are integrally separated from each other. On the other hand, the wafer contact portion 30a is partly inclined by the inclined portion 32 that allows the wafer to be smoothly mounted.

The contact portion fixing hole 34a may have various shapes, but is preferably circular, and the body fixing hole 34b and the prevention plate fixing hole 34c are preferably rectangular. When the body fixing hole 34b and the prevention plate fixing hole 34c are made rectangular, it is possible to suppress unnecessary rotation of the first fixing rubber 30 by a force induced by the wafer. In some cases, the body fixing hole 34b and the prevention plate fixing hole 34c may have a shape other than a rectangular shape within the scope of the object of the present invention. The diameter of the contact portion fixing hole 34a is preferably larger than the diameter of the body fixing hole 34b and the prevention plate fixing hole 34c. In particular, the long diameter of the prevention plate fixing hole 34c can be determined to sufficiently prevent the first fixing rubber 30 from coming off and to easily insert it.

The first fixing rubber 30 is fixed to the fixing hole 34 by an adhesive layer 36. Specifically, the bottom surface of the wafer contact portion 30a and the side surface of the insertion body 30b are bonded to the upper surface of the contact portion fixing hole 34a and the side surface of the body fixing hole 34b, respectively. In other words, the detachment preventing plate 30c is not fixed to the adhesive layer 36. [ Since the adhesive layer 36 is not formed in the step of the contact portion fixing hole 34a and the prevention plate fixing hole 34c as described above, the adhesive of the adhesive layer 36 can be prevented from flowing out of the first fork 10 . When the adhesive flows out to the outside of the first fork 10, the wafer is adhered to the adhesive, so that separation of the wafer from the first fork 10 is not easy.

The first fixing rubber 30 may be formed of any one of silicone rubber, polyurethane rubber, fluorine rubber, acrylic rubber, polyamide rubber, polyisobutylene rubber, polyisoprene rubber, chloroprene rubber, butyl rubber, nitrile butyl rubber, styrene- Butadiene rubber, styrene-butadiene-styrene rubber, styrene-isoprene-styrene rubber, styrene-ethylene-butadiene rubber, styrene-ethylene-butylene-styrene rubber, styrene-isoprene- And a mixture thereof, and silicone rubber is preferable.

Examples of the adhesive layer 36 include a thermosetting resin, a thermoplastic resin, a rubber, a phenol resin, and an epoxy resin. The thermosetting resin includes urea, melamine, phenol, unsaturated polyester, epoxy, Examples of the thermoplastic resin include vinyl acetate, polyvinyl alcohol, vinyl chloride, polyvinyl acetal, acrylic, saturated polyester, polyamide, and polyethylene. Examples of the rubber-based resin include butadiene rubber, nitrile rubber, butyl rubber, silicone rubber, and chloroprene rubber. The phenolic resins include vinyl resins, phenol-crooprene rubber resins, and the epoxy resins include polyamide resins, nitrile rubber- Epoxy system and the like. Among these, a silicone-based rubber adhesive which is a rubber-based resin is preferable.

On the other hand, the adhesive layer 36 is preferably a thermosetting adhesive. Specifically, after the adhesive layer 36 is applied to the fixing hole 34, the first fixing rubber 30 is inserted. Thereafter, the heat treatment of the first fork 10, into which the first fixing rubber 30 is inserted, proceeds to thermally cure the adhesive layer 36. At this time, the heat treatment temperature is based on the heat resistance of the release layer 22, and the heat treatment time takes into account the adhesiveness of the adhesive layer 36. That is, the heat treatment temperature is lower than the heat resistant temperature of the release layer 22, and the heat treatment time ensures that the adhesive layer 36 has sufficient adhesiveness.

The first fixing rubber 30 according to the embodiment of the present invention is provided with the detachable prevention plate 30c on the side opposite to the direction in which the wafer is mounted so that the first fixing rubber 30 is removed by the force generated by the wafer You can block things. The detachment prevention plate 30c is integral with the insertion body 30b, and sufficiently provides resistance against detachment induced by the wafer. Further, the adhesive for bonding the first fixing rubber 30 does not flow out to the outside of the release layer 22. This can prevent the wafer from adhering to the first fork 10 due to leakage of the adhesive.

4 is a view showing a second fork 50 for wafer transfer according to an embodiment of the present invention. At this time, the second fork 50 is substantially the same as the first fork 10 except for the part of the detachable prevention plate 70c. Accordingly, a detailed description of the duplicated description will be omitted. For convenience of explanation, the vicinity of the second fixing rubber 70 is enlarged and shown in a sectional view.

Referring to FIG. 4, the second fixing rubber 70 is divided into a wafer contact portion 70a, an insertion body 70b, and a detachable prevention plate 70c which are in contact with the wafer. The second fixing rubber 70 is fitted in the fixing hole 74. Specifically, the wafer contact portion 70a is fitted into the contact portion fixing hole 74a formed in the direction in which the wafer is mounted, the insertion body 70b is inserted into the body fixing hole 74b, And is inserted into a locking plate fixing hole 74c formed on the opposite side of the fixing hole 74a. Here, the wafer contact portion 70a and the insertion body 70b are integral, but the detachment prevention plate 70c is separated from the insertion body 70b. At this time, the contact portion fixing hole 74a, the body fixing hole 74b, and the prevention plate fixing hole 74c are respectively fixed to the contact portion fixing hole 34a, the body fixing hole 34b, The function and role are the same as those of the hole 34c.

The second fixing rubber 70 is fixed to the fixing hole 74 by the adhesive layer 76. Specifically, the bottom surface of the wafer contact portion 70a and the side surface of the insertion body 70b are adhered to the adhesive layer 76a formed over the upper surface of the contact portion fixing hole 74a and the side surface of the body fixing hole 74b, respectively. The bottom surface of the insertion body 70b and the bottom surface of the prevention plate fixing hole 74c are adhered by the adhesive layer 76b. When the detachment prevention plate 70c is fixed by the adhesive layer 76b, the size of the detachment prevention plate 70c can be freely adjusted relative to the first fixing rubber 30. Since the adhesive layer 76 is not formed on the step of the contact portion fixing hole 74a and the step of the prevention plate fixing hole 74c in this manner, the adhesive of the adhesive layer 76 is prevented from flowing out of the second fork 50 . When the adhesive flows out to the outside of the second fork 50, the wafer is adhered to the adhesive, so that separation of the wafer from the second fork 50 is not easy.

The second fixing rubber 70 may be formed of any one of silicone rubber, polyurethane rubber, fluorine rubber, acrylic rubber, polyamide rubber, polyisobutylene rubber, polyisoprene rubber, chloroprene rubber, butyl rubber, nitrile butyl rubber, Butadiene rubber, styrene-butadiene-styrene rubber, styrene-isoprene-styrene rubber, styrene-ethylene-butadiene rubber, styrene-ethylene-butylene-styrene rubber, styrene-isoprene- Or a mixture thereof, and silicone rubber is preferable.

Examples of the adhesive layer 76 include a thermosetting resin, a thermoplastic resin, a rubber type, a phenol resin, and an epoxy resin. The thermosetting resin includes urea type, melamine type, phenol type, unsaturated polyester type, epoxy type, resorcinol type, Examples of the thermoplastic resin include vinyl acetate, polyvinyl alcohol, vinyl chloride, polyvinyl acetal, acrylic, saturated polyester, polyamide, and polyethylene. Examples of the rubber-based resin include butadiene rubber, nitrile rubber, butyl rubber, silicone rubber, and chloroprene rubber. The phenolic resins include vinyl resins, phenol-crooprene rubber resins, and the epoxy resins include polyamide resins, nitrile rubber- Epoxy system and the like. Among them, a silicone-based adhesive which is a rubber-based resin is preferable.

The second fixing rubber 70 according to the embodiment of the present invention has the detachable prevention plate 70c on the side opposite to the direction in which the wafer is mounted so that the second fixing rubber 70 is pulled out by the force generated by the wafer You can block things. The detachment prevention plate 70c fixed by the adhesive layer 76b sufficiently provides resistance against detachment induced by the wafer. In addition, the adhesive for bonding the second fixing rubber 70 does not flow out to the outside of the release layer 22. As a result, it is possible to prevent the wafer from adhering to the second fork 50 due to leakage of the adhesive.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but many variations and modifications may be made without departing from the scope of the present invention. It is possible.

10, 50; The first and second forks
20; A fork body 22; Heterogeneous layer
24; Wafer step 26; Finger
30; A first fixing rubber 70; The second fixed rubber
30a, 70a; Wafer contact
30b, 70b; Insert body
30c, 70c; Detachable plate
32; Inclined portion
34, 74; Fixed hole
34a, 74a; Contact portion fixing hole
34b, 74b; Body fixing hole
34c, 74c; Prevention plate fixing hole
36, 76; Adhesive layer

Claims (7)

A fork for mounting a wafer; And
And a plurality of fixing loops formed on the fork,
Wherein the fixing rubber is composed of a wafer contact portion inserted into a fixing hole formed in the fork and contacting with the wafer, an insertion body and a detachment prevention plate, the wafer contacting portion being a contact fixing hole of the fixing hole, The fixing hole and the detachment prevention plate are fitted into the fixing plate fixing hole of the fixing hole,
Wherein the body fixing hole and the prevention plate fixing hole are rectangular holes. The wafer transfer fork according to claim 1, wherein the wafer contact portion, the insertion body, and the detachment prevention plate are integrally formed. The wafer transfer fork according to claim 1, wherein the detachable protection plate is bonded to the insertion body via an adhesive layer. delete The method according to claim 1, wherein the fixing rubber is at least one selected from the group consisting of silicone rubber, polyurethane rubber, fluorine rubber, acrylic rubber, polyamide rubber, polyisobutylene rubber, polyisoprene rubber, chloroprene rubber, butyl rubber, nitrile butyl rubber, styrene- Styrene-butadiene-styrene rubber, styrene-isoprene-styrene rubber, styrene-ethylene-butadiene rubber, styrene-ethylene-butylene-styrene rubber, styrene-isoprene-propylene-styrene rubber and chlorosulfonated polyethylene rubber One or a mixture thereof. 2. The wafer transfer apparatus according to claim 1, wherein an adhesive layer is disposed between the wafer contact portion, the contact portion fixing hole, the detachable protection plate and the prevention plate fixing hole, and the adhesive layer is not exposed to the outside of the fork. fork. 7. The wafer transfer fork according to claim 6, wherein the adhesive layer is made of a thermosetting adhesive, and the heat treatment temperature of the adhesive layer is lower than the heat resistant temperature of the release layer applied to the fork.
KR1020150087113A 2015-06-19 2015-06-19 Fork for transferring wafer KR101655686B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108493136A (en) * 2018-04-26 2018-09-04 武汉华星光电技术有限公司 Support jig and dry ecthing device structure

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060127295A (en) * 2005-06-07 2006-12-12 삼성전자주식회사 Fork for transfering wafer
KR20090044048A (en) * 2007-10-31 2009-05-07 (주)소슬 Apparatus for transfering substrate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060127295A (en) * 2005-06-07 2006-12-12 삼성전자주식회사 Fork for transfering wafer
KR20090044048A (en) * 2007-10-31 2009-05-07 (주)소슬 Apparatus for transfering substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108493136A (en) * 2018-04-26 2018-09-04 武汉华星光电技术有限公司 Support jig and dry ecthing device structure

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