KR101648905B1 - Conductive film and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a cushion layer which is attached to at least one of surfaces of a base substrate and a base substrate and in which a cushion layer in which an energizing column of a cavity is formed and a cushion layer which is provided on the opposite surface of the cushion layer, A conductive film comprising a metal thin film layer to be formed.

Description

FIELD OF THE INVENTION [0001] The present invention relates to a conductive film,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive film applied to various electronic devices such as a mobile device, a home appliance, and a display device, and a manufacturing method thereof.

Heat generated from internal heat sources in various electronic devices circuits and other electronic devices is concentrated in heat generating areas, which may deteriorate the performance of peripheral components, paralyze functions, and shorten the life of the entire electronic device.

As electronic devices have become more sophisticated and miniaturized, many devices are integrated in a narrow circuit space, so that there is a possibility that electromagnetic waves may leak or enter from a shield can or taped joints in an electronic device. Therefore, A conductive film can be used as a gasket or a film tape of a can.

The conductive film has electrical conductivity and a shock absorbing function (cushioning) to closely adhere to the gap (adhesion) to protect the electronic device from external impact, and a thermally conductive It is advantageous.

In order to produce a film having excellent electrical conductivity, thermal conductivity, cushioning and adhesion, a method of mixing and dispersing a conductive material into a polymer such as a polymer resin, a plastic or a rubber, or a method of mixing a highly conductive mesh- It is common to form a conductive film by adhering or laminating on the surface of the polymer and plating or depositing a conductive material on the polymer.

However, the technique of dispersing the conductive material in the polymer requires a high filling ratio of the conductive material in order to exhibit high conductivity, but in this case, the cushioning property of the conductive film is remarkably deteriorated. Conductivity is lowered by lowering the filling rate of the conductive material.

In addition, the technique of densifying a conductive material to a polymer matrix is limited in thickness when the mesh dough material is masticated, the conductivity is changed in accordance with the density of the mesh state, and when the densification is high in order to obtain sufficient conductivity, There is a problem that falls significantly.

In addition, the technique of adhering and laminating a highly conductive material to the polymer surface loses elasticity or adherence to the surface of the conductive sheet when the metal mesh or the like is adhered and laminated.

Accordingly, there is a need for a method for producing a conductive film which is excellent in both electrical conductivity, thermal conductivity, cushioning and adhesion, and which can reduce the manufacturing cost by reducing the number of process steps and the development of technology for such a conductive film.

The present invention provides a conductive substrate and a multifunctional conductive film which is disposed on a conductive substrate and has a conductive column formed therein, and which is excellent in both thermal conductivity, electrical conductivity, cushioning property, adhesiveness and light shielding property, and a method for producing the same.

According to an aspect of the present invention, there is provided a semiconductor device comprising: a base substrate; a cushion layer attached to at least one surface of the base substrate, the cushion layer having a cavity energizing column formed therein; And a metal thin film layer formed on the inner wall surface of the conductive column.

At this time, the conductive substrate may be a copper or aluminum substrate.

At this time, the base substrate may be a substrate including at least one of a fabric and a nonwoven fabric.

At this time, the metal thin film layer may be plated with at least one metal selected from the group consisting of nickel, copper, silver, gold, iron, tin and cobalt.

At this time, the metal thin film layer may include at least one of carbon black and nickel.

At this time, the conductive column may be a linear aggregate in which adjacent pores among the plurality of pores in the conductive film are linearly connected.

At this time, the energizing column may extend from a surface of the cushion layer on which the base substrate is attached, and may extend to a surface opposite to a surface of the cushion layer to which the base substrate is attached.

At this time, a plurality of the energizing columns may be formed so as to form a network structure.

In this case, the cushion layer may be a polymer sponge layer adhered to one surface of the base substrate.

At this time, the cushion layer may be a polymer foam bonded to one side of the base substrate.

At this time, the polymer foam may be a polyurethane foam.

According to another aspect of the present invention, there is provided a method for preparing a polyurethane solution, comprising the steps of preparing a polyol solution and an isocyanate solution, stirring the polyol solution and the isocyanate solution to prepare a polyurethane mixed solution, injecting nitrogen into the polyurethane mixed solution, There is provided a method for manufacturing a conductive film comprising foaming a polyurethane mixed liquid to a base substrate.

At this time, the conductive film manufacturing method of the present invention may further include a step of electroless plating the polyurethane foam foamed with the base substrate.

At this time, after the electroless plating process is completed, at least one of carbon black and nickel may be coated on the formed metal thin film layer.

At this time, the polyurethane mixture preparation step and the nitrogen injection step can be performed simultaneously.

At this time, in the nitrogen injection step, liquefied nitrogen may be injected into the polyurethane mixed solution.

At this time, in the polyurethane mixed solution foaming step, the polyurethane mixed solution can be foamed directly on the base substrate.

The conductive film according to an embodiment of the present invention is excellent in adhesion because the cushion layer is foamed on the surface of the conductive substrate, the cushion layer is a polymer material having elasticity, and a large number of pores are formed in the cushion layer, , And a metal thin film layer is deposited on the energizing column and the cushion layer, whereby the electrical conductivity and the thermal conductivity are also excellent.

1 is a perspective view showing a conductive film according to a first embodiment of the present invention.
2 is a sectional view taken along the line II-II in Fig.
3 is a photograph showing a cross section of Fig.
Fig. 4 is a cross-sectional view for explaining the arrangement relationship of the energizing columns according to the first modification of the present invention, in which the energizing columns are arranged in a linear arrangement (a), a linear arrangement (c) FIG.
5 is a schematic view showing a conductive film according to a second modification of the present invention.
6 is a photograph showing a sponge-like cushion layer according to a second embodiment of the present invention.
7 is a photograph showing a state in which a sponge-like cushion layer according to a second embodiment of the present invention is coupled to a conductive substrate.
8 is a photograph showing that a metal thin film layer is plated on a spongy cushion layer according to the second embodiment of the present invention.
9 is a flowchart illustrating a method for manufacturing a conductive film according to the first embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art to which the present invention pertains. The present invention may be embodied in many different forms and is not limited to the embodiments described herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and the same or similar components are denoted by the same reference numerals throughout the specification.

The sizes and thicknesses of the respective components shown in the drawings are arbitrarily shown for convenience of explanation, and the present invention is not necessarily limited to those shown in the drawings. In addition, when a part is referred to as including any constituent element throughout the specification, it is understood that the present invention can include other constituent elements, not excluding the other constituent elements unless specifically stated otherwise.

The term 'conductive' in the present invention is defined to mean both 'electrically conductive' and 'thermally conductive' in the sense that heat or electricity is easily conducted inside the film.

FIG. 1 is a perspective view showing a conductive film according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along the line II-II of FIG.

The conductive film 10 according to the first embodiment of the present invention is installed in various electronic device internal circuits such as a mobile device, a household appliance, and a display device, a shield can, an antenna portion, a portion where a conductive tape is required, And can be formed of a material excellent in electrical and thermal conductivity so as to be able to radiate an electric signal or heat generated in the case to the outside, and excellent in cushioning property so as to protect the electronic device from external impact.

Referring to FIGS. 1 and 2, the conductive film 10 includes a base substrate 100 and a cushion layer 200 and a metal thin film layer 300, which are positioned on the upper surface of the base substrate.

The base substrate 100 may be a plate-like member disposed under the cushion layer 200. Accordingly, the electric signal generated from the electronic device and the divergent heat can be easily transmitted to the base substrate 100.

In the first embodiment, the base substrate 100 may be a copper foil or an aluminum foil having relatively good electrical and thermal conductivity. The base substrate 100 has a relatively high tensile strength and is formed at a high density as compared with a commonly used mesh fabric. Therefore, when an external force is applied to the conductive film 10, plastic deformation (elongation, Tearing, etc.) can be minimized.

but. The base substrate 100 of the present invention is not limited to a base plate 100 having a copper foil or an aluminum foil and may be fabric or nonwoven fabric made of various materials such as nylon, And the like). As described above, the base substrate 100 may be formed in various shapes or materials depending on the application position of the conductive film 10 in the electronic equipment, the position of the heat source in the electronic equipment, the type of the electronic equipment,

The cushion layer 200 may be attached to either side of the base substrate 100. The cushion layer 200 may receive an electric signal or heat from a surface to which the base substrate 100 is attached and may transmit the electric signal or heat to a surface opposite to the surface to which the base substrate 100 is attached.

The cushion layer 200 may be a polymeric material having elasticity, for example, a polymer synthetic resin such as polyurethane, silicone, polyethylene, or the like.

On the other hand, in the first embodiment, the cushion layer 200 may be a polyurethane foam such as PORON (R) foamed and attached to the surface of the base substrate 100. That is, the polyurethane foam is advantageous in that it is not necessary to form a separate adhesive layer between the cushion layer 200 and the base substrate 100 by directly foaming without forming a separate adhesive layer on the surface of the base substrate 100. In addition, the polyurethane foam is foamed directly on the surface of the base substrate 100, so that the adhesion between the base substrate 100 and the cushion layer 200 can be more firmly maintained.

Meanwhile, in the first embodiment, the cushion layer 200 may include the energizing column 210 and the pores 220.

1 and 2, a plurality of the energizing columns 210 are extended from the surface of the cushion layer 200 on which the base substrate 100 is attached, and the base substrate 100 of the cushion layer 200 is attached And may extend to the opposite side of the face. A cavity may be formed inside the energizing column 210.

When the cushion layer 200 is a polymer foam, a plurality of pores 220 may be formed in the cushion layer 200 foamed on the base substrate 100. When the impact is applied to the cushion layer 200, the plurality of pores 220 are elastically deformed to disperse the impact.

Meanwhile, in the first embodiment, the energizing column 210 may be a linear aggregate in which a plurality of pores 220 are linearly extended. That is, neighboring pores among the plurality of pores 220 may be linearly connected as shown in FIG. 2 to form the conductive columns 210.

As described above, in the first embodiment, the energizing column 210 is formed as a linear aggregate connecting adjacent pores 220 in the cushion layer 200, thereby forming the energizing column 210 in the cushion layer 200 There is an advantage in that it is not necessary to carry out a process such as punching or incising. However, the scope of the present invention is not necessarily limited to this, and may be applied to the cushion layer 200 according to the thickness of the cushion layer 200, the material of the base substrate 100, It is needless to say that the perforation, incision, and the like may be additionally formed in addition to the above.

The metal thin film layer 300 may be deposited on the opposite surface of the cushion layer 200 on which the base substrate 100 is attached and on the inner wall surface of the conductive pillar 210, respectively. An electric signal or heat transferred from the electronic device to the base substrate 100 can be transmitted to the surface of the cushion layer 200 through the current supply pillar 210 and the base substrate 100 can be transferred to the surface of the cushion layer 200, the cushion layer 200 may be formed of a polymer material and may have a relatively low thermal conductivity or electrical conductivity. The cushion layer 200 may include a cushion layer 210 through the metal foil layer 300, Layer 200, the function of the conductive film 10 can be smoothly performed.

The thickness of the metal thin film layer 300 deposited on the inner surface of the energizing column 210 may be set to a thickness such that the pores 220 are not blocked, So that it can be deposited to such a thickness that elasticity can be restored.

Meanwhile, in the first embodiment, the metal thin film layer 300 may be electroless plated with at least one metal selected from nickel, copper, silver, gold, iron, tin and cobalt. In addition, the metal thin film layer 300 may include at least one of carbon black and nickel. Carbon black or nickel may be incorporated in the electroless plating process or may be further coated on the surface of the metal thin film layer 300 after the metal thin film layer 300 is electroless plated. Thus, the metal thin film layer 300 having excellent thermal conductivity, electrical conductivity, and light shielding properties can be formed.

3 is a photograph showing the conductive film of the first embodiment.

3, it can be seen that a cushion layer 200 is applied to the upper surface of the base substrate 100, and a plurality of pores 220 are formed in the cushion layer 200.

 3, a plurality of pores 220 may be connected to each other as shown in FIG. 3. A linear assembly of the pores 220 may be formed from the upper surface of the base substrate 100 to the base substrate 100 and the cushion layer 200 are extended to the opposite surface of the bonded surface.

On the other hand, it is confirmed that the metal thin film layer 300 is plated on the opposite surface of the base substrate 100 and the surface to which the cushion layer 200 is adhered and the inner surface of the plurality of pores 220, respectively.

As described above, the conductive film 10 according to the first embodiment has excellent adhesion by foaming the cushion layer 200 on the surface of the base substrate 100, and the cushion layer 200 is made of a polymer material having elasticity At the same time, a large number of pores 220 are included therein, so that excellent cushioning can be provided.

The conductive film 10 has a plurality of neighboring pores 220 connected to each other to form an energizing column 210 and a metal thin film layer 300 is deposited on the energizing column 210 and the cushion layer 200 The metal thin film layer 300 may be coated with a light shielding material such as carbon black or nickel or may be further coated on the metal thin film layer 300 to provide excellent light shielding property have.

4 is a cross-sectional view for explaining the arrangement relationship of the energizing columns according to the first modification of the present invention.

Referring to FIG. 4, the conductive film 10 of the first modification describes that the conductive columns 210 in the cushion layer 200 can be variously arranged, and the arrangement relationship of the conductive columns 210 is excluded And has the same structure as that of the first embodiment described above. The same reference numerals are used for the same members as in the first embodiment.

The energizing columns 210 of the first modification may be arranged in parallel to each other toward the upper portion of the base substrate 100 (see FIG. 4A) or randomly arranged in a curved shape (see FIG. 4 (b)), a plurality of them may be intertwined to form a network structure (see FIG. 4 (c)).

The conductivity and cushioning properties of the conductive film 10 can be variously adjusted by varying the arrangement relationship of the conductive columns 210. Therefore, the types of electronic appliances, the cushion layer 200, and the metal thin film layer The thickness of the conductive film 10, and the thickness of the conductive film 10, 300, and the like.

5 is a schematic view showing a conductive film according to a second modification of the present invention.

5, the conductive film 10 of the second modification has the same structure as that of the first embodiment described above, except that the cushion layer 200 is located on both sides of the base substrate 100, respectively. The same reference numerals are used for the same members as in the first embodiment.

The cushion layer 200 may be attached to both surfaces of the conductive film 10, respectively. Each of the attached cushion layers 200 may have a different arrangement structure as in the first modification described above. Thus, the cushion layer 200 is attached to both surfaces of the conductive film 10 of the second modification, thereby providing excellent electrical and thermal conductivity to both surfaces of the conductive film 10, There is an advantage that it can be utilized even when different conductivity is required in the lower part.

FIG. 6 is a photograph showing a sponge-like cushion layer according to a second embodiment of the present invention, FIG. 7 is a photograph showing a state in which a sponge-like cushion layer according to a second embodiment of the present invention is coupled to a conductive substrate And FIG. 8 is a photograph showing that the metal thin film layer is plated on the sponge-like cushion layer according to the second embodiment of the present invention.

6 to 8, the conductive film 20 of the second modification has the same configuration as that of the first embodiment except that the cushion layer 400 is formed of a sponge-like structure. The same reference numerals are used for the same members as in the first embodiment.

In the second embodiment, the cushion layer 400 may be formed of a sponge-like structure. Unlike the cushion layer 200 of the first embodiment, the cushion layer 400 may be attached to the base substrate 100 in a lipped state. The adhesion of the cushion layer 400 can be secured.

In the second embodiment, the cushion layer 400 may include a bridge 420 formed in a network structure between the conductive columns 410 and the conductive columns 410, due to the sponge-like structure. The metal thin film 300 may be deposited on the surface of the bridge 420 as shown in FIG.

As described above, the conductive film 20 according to the second embodiment has an effect of securing excellent adhesion, conductivity and cushioning property even by using the cushion layer 400 having a different microstructure from that of the first embodiment.

The constitution of the conductive film of the present invention has been described above. Hereinafter, a method for producing a conductive film for producing a conductive film of the present invention will be described. The above manufacturing method is a manufacturing method for manufacturing the conductive film of the first embodiment, and the same reference numerals are used for the same members as in the first embodiment.

9 is a flowchart illustrating a method for manufacturing a conductive film according to the first embodiment of the present invention.

Referring to FIG. 9, a method of manufacturing a conductive film 10 according to a first embodiment of the present invention includes preparing a polyol solution and an isocyanate solution (S10), stirring the polyol solution and the isocyanate solution to prepare a polyurethane mixed solution (S30), injecting nitrogen into the polyurethane mixed solution (S30), foaming the polyurethane mixed solution to the conductive substrate (S40), and electroless plating step (S50).

In the polyol solution and isocyanate solution preparation step (S10), a polyol solution and an isocyanate solution are prepared as monomers for the production of a polyurethane foam.

In the polyurethane mixture preparation step (S20), the polyol solution and the isocyanate solution are introduced into a stirrer and the polyurethane polymerization is induced while stirring.

In the nitrogen injection step (S30), liquefied nitrogen is injected into the polyurethane mixed solution under stirring to induce the formation of a plurality of pores (220) in the polyurethane mixed solution. That is, the conductive film manufacturing method according to this embodiment can be controlled so that the polyurethane mixture preparation step (S20) and the nitrogen injection step (S30) are simultaneously performed. In the present embodiment, the amount of liquefied nitrogen: polyurethane mixture (mixture of polyol solution and isocyanate solution) is mixed at a ratio of 1: 1 in mass ratio so that a plurality of pores 22 can form energizing columns 210 in the foaming step, It is not necessarily limited to such a mass ratio. Considering that the ratio of the internal pores of the polyurethane mixture increases with the amount of the liquid nitrogen, the amount of the liquid nitrogen or the amount of the polyol solution The mixing ratio of the isocyanate solution and the like can be variously controlled.

In the polyurethane mixed solution foaming step (S40), the polyurethane mixed liquid into which the liquefied nitrogen is injected is discharged onto the base substrate (100). At this time, the polyurethane mixed solution is directly foamed (first-stage foamed) on the base substrate 100 without a separate adhesive. The foamed polyurethane mixed solution is coated through a comma coater to complete the polyurethane foam on the base substrate 100. At this time, a plurality of pores 210 may be formed by collecting a plurality of pores 22 generated through a nitrogen injection step (S30) inside the polyurethane foam.

In the electroless plating step (S50), the completed polyurethane foam is subjected to electroless plating with at least one metal selected from the group consisting of nickel, copper, silver, gold, iron, tin and cobalt. The metal thin film layer 300 can be plated on the upper surface of the polyurethane foam and the inner wall surface of the conductive column 210 through the electroless plating process. Meanwhile, at the plating step S50 of the metal thin film layer 300, at least one of carbon black or nickel may be mixed and plated together during the electroless plating step. As a result, the plated metal thin film layer 300 may further include light shielding in addition to conductivity. However, the present invention is not limited thereto. After the electroless plating process is completed, at least one of carbon black or nickel is formed on the metal thin film layer 300 by electroless plating of the metal thin film layer 300 And may be further coated on the metal foil layer 300 after completion.

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As shown in the first embodiment, the completed conductive film 10 has a plurality of conductive columns 210 inside the polyurethane foam, and the metal foil layer 210 is formed on the upper surface of the polyurethane foam and the inner surface of the conductive column 210, (300) can be plated.

As described above, the method of manufacturing the conductive film 10 according to the first embodiment of the present invention can induce the formation of the conductive columns 210 by injecting the liquefied nitrogen in the polyurethane mixed solution process unlike the general polyurethane foaming process, The polyurethane mixed liquid can be directly foamed on the base substrate 100, thereby reducing the number of process steps.

Further, the method of manufacturing the conductive film 10 according to the first embodiment of the present invention allows the cushion layer to be foamed without any additional adhesive layer on the surface of the base substrate, thereby providing excellent adhesion, and the cushion layer is a polymer material having elasticity A plurality of pores are formed in the cushion layer to provide excellent cushioning property, and a metal thin film layer containing at least one of carbon black and nickel is plated on the energizing column and the cushion layer to provide a multi-functional The conductive film 10 can be manufactured.

While the present invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those of ordinary skill in the art that various changes and modifications may be made without departing from the spirit and scope of the following claims. Those skilled in the art will readily understand.

10, 20: conductive film 100: base substrate
200, 400: cushion layer 210, 410:
220: pore 300: metal thin film layer
420: Bridge

Claims (17)

delete delete delete delete delete delete delete delete delete delete delete Preparing a polyol solution and an isocyanate solution;
Stirring the polyol solution and the isocyanate solution to prepare a polyurethane mixed solution;
Introducing liquid nitrogen into the polyurethane mixed solution to induce formation of a plurality of pores in the polyurethane mixed solution; And
Foaming the polyurethane mixed liquid to a base substrate to form a polyurethane foam containing the plurality of pores; And
Electroless plating the formed polyurethane foam to form a metal thin film layer on an upper surface of the polyurethane foam and an inner wall surface of each of the plurality of pores;
Lt; / RTI >
The polyurethane mixture preparation step and the liquefied nitrogen injection step are performed at the same time,
Wherein each of the plurality of pores in which the metal thin film layer is formed includes a cavity. delete 13. The method of claim 12,
Wherein the metal thin film layer is coated with at least one of carbon black and nickel after the electroless plating process is completed. delete delete 13. The method of claim 12,
Wherein the polyurethane mixed solution is foamed directly on the base substrate in the polyurethane mixed solution foaming step.

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