KR101647307B1 - Single layered touch panel and method for preparing the same - Google Patents

Abstract

A method of manufacturing a single-layer touch panel of the present invention includes: forming a first pattern electrode on a substrate by forming an isolation region along a first direction; and a second pattern electrode electrically insulated from the first pattern electrode, Forming an insulating layer which is formed on the isolation region and which insulates the first pattern electrode and the second pattern electrode from the first pattern electrode and the second pattern electrode; And forming a photoresist layer on the layer on which the insulating layer is formed, forming a pattern in the photoresist layer to form a bridge and a trace electrode, filling the pattern with a conductive material, doctoring and removing the photoresist.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a touch panel,

The present invention relates to a single-layer touch panel and a method of manufacturing the same.

A touch panel is an input device of a display, and typically includes a bank ATM, a navigation system, a mobile phone, etc., and inputs a command or graphic information designated by a user by generating a voltage or current signal corresponding to a position where a stylus pen or a finger is pressed .

The touch panel is divided into resistance film, electrostatic capacitance, surface ultrasonic wave conduction and infrared light type according to the technology of the sensing sensor. In recent years, among the flat panel display devices, the analog type resistive film type integrated with the liquid crystal panel and the capacitive type Touch panel is mainly used.

Meanwhile, the electrodes formed on the touch panel are used to determine the presence or absence of contact input, detect the input coordinates, and transmit signals to the touch sensor chip. Examples of the touch panel electrode forming method include a printing method, an offset method, A sputtering method, and the like.

In the conventional printing method, a printed electrode paste is printed on a substrate to a predetermined thickness using a screen patterned with a predetermined electrode structure, and then dried to form an electrode.

However, this method is simpler in manufacturing equipment and process than the offset method, the photolithography method and the sputtering method. However, it is difficult to realize the fine pattern of the electrostatic capacity type touch panel electrode wiring, There is a problem that an allignment tolerance occurs.

Further, in the photolithography method, due to residual conductive material on the photoresist, separation is not performed properly, and there is a problem of visibility and deterioration of functionality.

SUMMARY OF THE INVENTION An object of the present invention is to provide a single-layer touch panel and a manufacturing method thereof that can achieve material and cost reduction.

Another object of the present invention is to provide a single-layer touch panel with improved process efficiency, visibility and functionality and a method of manufacturing the same.

It is still another object of the present invention to provide a thin single layer touch panel and a method of manufacturing the same.

The above and other objects of the present invention can be achieved by the present invention described below.

One aspect of the present invention is to provide a manufacturing method of a touch panel.

According to one embodiment, there is provided a plasma display panel comprising a first patterned electrode formed by forming an isolation region along a first direction on a substrate, and a second patterned electrode electrically insulated from the first patterned electrode, Forming an insulating layer for insulating the first pattern electrode and the second pattern electrode from the first pattern electrode, the second pattern electrode, and the second pattern electrode; Forming a photoresist layer over the layer on which the insulating layer is formed, forming a pattern in the photoresist layer to form bridge and trace electrodes, filling the pattern with a conductive material, implanting the conductive material into a doctor ring doctoring and removing the photoresist.

According to another embodiment, the step of filling the conductive material and the step of doctoring may be performed at the same time.

According to another embodiment, the electrode forming step may include forming a layer of indium tin oxide (ITO) on a substrate, forming a photoresist layer on the indium tin oxide (ITO) layer , Patterning the photoresist layer to form a first patterned electrode and a second patterned electrode, etching the indium tin oxide (ITO) layer, and removing the photoresist layer .

According to another embodiment of the present invention, the step of forming the insulating layer may include coating a photosensitive insulating material on the layer on which the first pattern electrode and the second pattern electrode are formed, And patterning the photosensitive insulating material so as to be insulated.

According to another embodiment, the electrode forming step comprises the steps of forming a photoresist layer on a substrate, forming a pattern in the photoresist layer to form a first pattern electrode and a second pattern electrode, Filling the material, doctoring the conductive material, and removing the photoresist.

According to another embodiment, the step of filling the conductive material and the step of doctoring can be performed at the same time.

According to another embodiment of the present invention, the step of forming the insulating layer includes the steps of forming a photoresist layer on a layer on which the first pattern electrode and the second pattern electrode are formed, Forming a pattern on the photoresist layer so as to be insulated, filling the pattern with an insulating material, doctoring the insulating material, and removing the photoresist.

According to another embodiment, the step of filling the insulating material and the step of doctoring may be performed at the same time.

According to another embodiment, the substrate may be a glass or a flexible film.

According to another embodiment, the conductive material may be a conductive paste including conductive particles and a binder.

According to another embodiment of the present invention, the conductive particles may be formed of indium tin oxide (ITO), zinc tin oxide (ZTO), carbon nanotubes (CNT), gold, silver, , Nickel, graphene, and a conductive polymer.

Another aspect of the present invention is to provide a single layer touch panel.

According to one embodiment, a single layer touch panel can be manufactured by one of the above methods.

According to another embodiment, the single layer touch panel may have a thickness of between 0.1 and 20 micrometers in the thickness of the bridge and trace electrodes.

According to another embodiment, the single layer touch panel may have a pattern electrode spacing of 0.5 [mu] m to 150 [mu] m.

The present invention has the effect of providing a manufacturing method of a single-layer touch panel capable of reducing material and cost as well as being excellent in process efficiency, visibility and functionality and being thin.

FIG. 1 schematically shows one step in the manufacturing process of a touch panel according to one embodiment of the present invention.
FIG. 2 is a schematic view showing one step of the manufacturing process of a touch panel according to one embodiment of the present invention.
FIG. 3 schematically illustrates one step of the manufacturing process of a touch panel according to one embodiment of the present invention.
4 schematically shows a touch panel according to one embodiment of the present invention.
5 is a schematic view illustrating a method of manufacturing a touch panel according to an embodiment of the present invention.
6 schematically illustrates a doctoring process according to one embodiment of the present invention.
Figure 7 is a simplified illustration of the filling and doctoring process according to one embodiment of the present invention.

Embodiments of the present application will now be described in more detail with reference to the accompanying drawings. However, the techniques disclosed in the present application are not limited to the embodiments described herein but may be embodied in other forms.

It should be understood, however, that the embodiments disclosed herein are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the width, thickness, and the like of the components are enlarged in order to clearly illustrate the components of each device. In addition, although only a part of the components is shown for convenience of explanation, those skilled in the art can easily grasp the rest of the components.

It is to be understood that when an element is described above as being located above or below another element, it is to be understood that the element may be directly on or under another element, It means that it can be done. It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention. In the drawings, the same reference numerals denote substantially the same elements.

Meanwhile, the meaning of the terms described in the present application should be understood as follows. The terms " first " or " second " and the like are used to distinguish one element from another, and the scope of the right should not be limited by these terms.

For example, the first pattern electrode may be referred to as a second pattern electrode, and similarly, the second pattern electrode may also be referred to as a first pattern electrode.

The 'first direction' to 'second direction' used in the specification of the present invention set arbitrary directions that can be set in the multidimensional structure. In one embodiment, the first pattern electrode 21 And the second pattern electrode 22 can intersect vertically with each other in the two-dimensional structure.

It should be understood, however, that the singular forms "a", "an", and "the" include plural referents unless the context clearly dictates otherwise, and the terms "comprise" That does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, parts, or combinations thereof, .

Further, in carrying out the method or the manufacturing method, the respective steps of the method may take place differently from the stated order unless clearly specified in the context. That is, each process may occur in the same order as described, may be performed substantially concurrently, or may be performed in the opposite order.

Hereinafter, the present invention will be described in detail.

One aspect of the present invention is to provide a manufacturing method of a touch panel.

According to one embodiment, there is provided a method of fabricating a semiconductor device, comprising: forming a first pattern electrode on a substrate by forming an isolation region along a first direction, and a second pattern electrode electrically insulated from the first pattern electrode, Forming an insulating layer for insulating the first pattern electrode and the second pattern electrode from each other, forming an insulating layer on the first pattern electrode, the second pattern electrode, and the second pattern electrode; Forming a layer of photoresist over the layer on which the layer is formed, forming a pattern in the photoresist layer to form bridge and trace electrodes, filling the pattern with a conductive material, conducting the conductive material through a doctoring ) And removing the photoresist.

Electrode formation step

1 schematically shows one step in the manufacturing process of a single-layer touch panel according to an embodiment of the present invention. Specifically, the step of forming the first pattern electrode 21 and the second pattern electrode 22 is schematically shown.

The first pattern electrode 21 and the second pattern electrode 22 are formed on the base 10 in a single layer. As one embodiment, one pattern electrode 21 is formed on the substrate 10 so that the isolation regions are arranged along the first direction, and the second pattern electrode 22 is formed on the isolation region in the second direction can do.

The substrate 10 may have a curved surface or a planar structure to provide a space for forming the first pattern electrode 21 and the second pattern electrode 22 and to form an outer periphery of the mobile device.

The substrate 10 may be a glass or a flexible film.

The glass may be a glass for a liquid crystal display element, a substrate for an organic EL display element, a color filter substrate, a solar cell substrate, or the like.

The flexible film may use a polymer. Specific examples of the polymer include a polycarbonate (PC) resin, a (meth) acrylic resin, a polyester resin, a polyether sulfone (PES) resin, a cellulose ester resin, a benzocyclobutene BCB) resin, and a polyvinyl chloride (PVC) resin, but the present invention is not limited thereto.

The first and second pattern electrodes 21 and 22 may have a rhombic shape as illustrated in FIG. 1, but are not limited thereto. For example, the first and second pattern electrodes 21 and 22 may be formed in various shapes such as a rectangular shape, an octagonal shape, a circular shape, an elliptical shape, or a polygonal shape having an uneven portion. Further, The shape is not necessarily limited thereto as long as the characteristic can be realized. In addition, the cross section of the fine lines constituting the first and second pattern electrodes 21 and 22 may be a square, a triangle, a semicircle, a semi-ellipse, or the like.

According to one embodiment, the electrode forming step includes forming a layer of indium tin oxide (ITO) on a substrate, forming a photoresist layer on the indium tin oxide (ITO) layer , Patterning the photoresist layer to form a first patterned electrode (21) and a second patterned electrode (22), etching the indium tin oxide (ITO) layer, and And removing the photoresist layer.

The step of forming the indium tin oxide (ITO) layer may form an indium tin oxide (ITO) layer by a sputtering method, an i-beam method, or the like, but is not limited thereto.

The step of forming and patterning the photoresist layer on the indium tin oxide (ITO) layer may be performed by a conventional photoresist pattern forming method. For example, the photoresist may be coated on the indium tin oxide (ITO) to form a photoresist layer, followed by exposure and development using a photomask.

Specifically, the method of forming the photoresist pattern 70 comprises coating a substrate with a photoresist, which is cured or decomposed by UV light, and scanning the photoresist with a UV light source to cure or decompose the scanned photoresist portion, And selectively developing the photoresist while leaving a portion other than the pattern to be formed.

Most of the developing step for selectively removing the photoresist may use a water-soluble alkali solution, but it is not necessarily limited thereto.

As an example of the water-soluble alkali solution, an aqueous solution of KOH and TMAH (TetraMethyl-Ammonium-Hydroxide) may be used, but is not limited thereto. In general, the development time is about 60 seconds, but it may be advantageous to reduce development time if the thickness of the photosensitive agent is low.

In addition, soft baking can be performed at a low temperature to remove residual organic solvent after forming the photoresist pattern, and post-exposure baking (PEB) can be performed. After the development, Finally, a hard bake can be performed.

(HCl + HNO ₃ ) etchant as an etchant for etching in the step of etching the indium tin oxide (ITO) layer, and a material selected from hydrochloric acid, weak acid and alcohol An etching solution made of iron chloride (FeCl ₃ ), an etching solution made of oxalic acid or a salt thereof or aluminum chloride, and the like may be used, but not always limited thereto.

According to another embodiment, the step of forming the first and second pattern electrodes 21 and 22 may include a step of masking with a photoresist, and the first pattern electrode or the second pattern electrode may be formed by wet- Or by dry deposition.

The conductive material 20 may be a conventionally used conductive paste.

Specifically, the conductive material 20 may be a sol, gel, or liquid ink including conductive particles and a binder for fixing the conductive particles, and other possible conductive and fillable materials may be used. For example, the conductive particles may include at least one selected from the group consisting of indium tin oxide (ITO), zinc tin oxide (ZTO), and carbon nanotubes (CNT) , Nickel, carbon nanotubes, graphene, and conductive polymers. Of these, indium tin oxide (ITO) is preferably used, but not always limited thereto. In the case of indium tin oxide (ITO), there is an advantage of improving visibility.

The average particle diameter of the conductive particles may be 1 nm to 5 탆, for example, 10 nm to 5 탆. And may vary according to the fine pitch and desired conductivity to be implemented within the above range. Advantageous for improving visibility and conductivity.

The binder may include at least one of alkyl, amine, acrylic, urethane, silicone, and ethylene resins. For example, the binder may be dissolved in an organic solvent, and the conductive paste may be in the form of a sol, gel, or liquid ink in which the conductive particles are dispersed in an organic solvent in which the binder is dissolved.

In the conductive paste, the content of the conductive particles may be 60 to 80% by weight, the content of the binder may be 10 to 20% by weight, and the content of the solvent may be 10 to 20% by weight, .

The wet plating method may be an electroplating method or an electroless plating method.

In one embodiment, an electroplating method may be used in which a positive electrode and a negative electrode are placed in a solution containing at least one metal ion among gold, silver, copper, and nickel, and a metal is precipitated by performing oxidation-reduction reaction through electricity.

In another embodiment, an electroless plating method may be employed in which metal ions in a metal salt aqueous solution are precipitated into a metal by a reducing agent without being supplied with external electric energy. The reducing agent may be formaldehyde or hydrazine, but is not limited thereto.

CVD (Chemical Vapor Deposition) and PVD (Physical Vapor Deposition) may be used as the dry deposition method.

In the case of using plasma CVD, since the indium (In) precipitates due to non-stochiometry due to oxygen deficiency during deposition, blackening phenomenon occurs. Therefore, in order to improve the electrical conductivity and light transmittance, Heat treatment can be performed for 4 minutes.

PVD (Physical Vapor Deposition), vacuum deposition, cathode sputtering, ion plating, etc. can be used.

Insulating layer forming step

2 schematically illustrates one step in the fabrication of a single layer touch panel in accordance with embodiments of the present invention. Specifically, the step of forming the insulating layer 30 is schematically shown.

The insulating layer 30 may be made of an acrylic resin, a urethane resin, a silicone resin or the like, and they may be used alone or in combination of two or more. The insulating layer 30 may be formed to have a uniform thickness on the intersection of the first and second pattern electrodes 21 and 22. The insulating layer 30 may be formed as in the prior art or may be formed by electrodeposition in another embodiment.

According to one embodiment, the step of forming the insulating layer 30 may use a photolithography method. In an embodiment, the photolithography method can use a photosensitive insulating material. Specifically, the step of forming the insulating layer 30 using the photolithography method includes a step of coating a photosensitive insulating material on the layer on which the first pattern electrode 21 and the second pattern electrode 22 are formed, And patterning the photosensitive insulating material so that the first pattern electrode 21 and the second pattern electrode 22 are insulated from each other. The step of coating and patterning the photosensitive insulating material can be performed by a conventional photolithography method and the thickness thereof can be adjusted.

According to a specific example, the insulating layer 30 may be formed to have a thickness of 0.1 탆 to 5 탆, which may be configured to have a reduced thickness than a conventional insulating layer. It is advantageous in improving the visibility of the touch panel in the thickness range and advantageously in the structural reliability of the second pattern electrode 22 formed on the upper part.

Step of forming bridge and trace electrodes

3 schematically illustrates one step in the manufacturing process of a single layer touch panel according to embodiments of the present invention. Specifically, the step of forming the bridge 40 and the trace electrodes 24 and 41 is schematically shown.

According to one embodiment, the bridge 40 and the trace electrodes 24 and 41 may be formed simultaneously or separately. When forming at the same time, there is an advantage of shortening the process time.

The bridge layer 40 is formed on the insulating layer 30 and electrically connects the first pattern electrodes 21 to each other. At least one of the position, size or shape of the bridge layer 40 may not be limited.

The conductive bridge layer 40 may be formed into a rod shape or a strip shape.

In addition, as shown in FIG. 4, the conductive bridge layer 40 may have a rectangular bar shape. However, the conductive bridge layer 40 is not limited to such a shape. In another embodiment, the conductive bridge layer 40, which is exposed by the insulating layer 30, may have a shape in which both ends of the conductive bridge layer 40 are wider than other portions (for example, a pinnate shape).

The trace electrodes 24 and 41 are formed by a plurality of lines formed on the rim of the first and second pattern electrodes 21 and 22 to receive an electric signal from the first and second pattern electrodes 21 and 22, (Not shown). May be formed in one pattern as shown in FIG. 5, but the present invention is not limited thereto.

5 is a schematic view illustrating a method of manufacturing a touch panel according to an embodiment of the present invention. Specifically, the step of forming the bridge 40 and the trace electrodes 41 and 24 is schematically shown.

A step of forming a photoresist layer (not shown) on the layer 11 on which the first pattern electrode 21, the second pattern electrode 22 and the insulating layer 30 are formed, forming bridge and trace electrodes Forming a pattern in the photoresist layer to fill the pattern, filling the pattern with a conductive material, and removing the photoresist. Although not shown in FIG. 5, the method further includes the step of doctoring after the step of filling the conductive material. (See Fig. 6)

The step of forming the photoresist layer may be a method of coating a liquid photoresist, or a film-type photoresist may be used.

The above-mentioned method of coating the photoresist can be performed by spin coating. For example, a photoresist composition can be deposited at the center of the substrate and then coated by spinning the substrate at high speed (about 3000 rpm). The step of coating the photoresist may control the thickness of the photoresist to be coated in order to control the thickness of the pattern to be formed.

S1 in Fig. 5 schematically shows a step of forming a photoresist pattern. Forming a pattern in the photoresist layer comprises coating a substrate with a photoresist that is cured or degraded by UV light and scanning the photoresist with a UV light source to cure or decompose the scanned photoresist portion, Or may be a method of selectively developing while leaving a portion other than the pattern to be formed.

The photoresist may be a diazonaphthoquinone-novolak resin (DNQ / NR), a chemically amplified photoresist, a KrF excimer laser resist, an ArF excimer laser resist, a lactone ring-introduced ArF resist, or an ArF dip resist have. These may be used alone or in combination of two or more.

The photoresist is applicable to both a positive type and a negative type in response to a UV light source and includes both a liquid and a film formed product

The laser beam may be a g-line, an i-line, a KrF laser, or an ArF laser. The laser beam may be an Extreme Ultra Violet Lithography (EUVL) It can also be used.

The step of coating the photoresist may control the thickness of the photoresist to be coated to adjust the thickness of the pattern of the bridge 40 and the trace electrodes 24 and 41 to be formed.

Most of the developing step for selectively removing the photoresist may use a water-soluble alkali solution, but it is not necessarily limited thereto.

As an example of the water-soluble alkali solution, an aqueous solution of KOH and TMAH (TetraMethyl-Ammonium-Hydroxide) may be used, but is not limited thereto. In general, the development time is about 60 seconds, but it may be advantageous to reduce development time if the thickness of the photosensitive agent is low.

In addition, soft baking can be performed at a low temperature to remove residual organic solvent after forming the photoresist pattern, and post-exposure baking (PEB) can be performed. After the development, Finally, a hard bake can be performed.

S2 of Fig. 5 schematically shows a step of filling the conductive material. The conductive material 20 may be a conventionally used conductive paste. The conductive material 20 filled between the photoresist patterns 70 may be a sol, gel or liquid ink including conductive particles and a binder for fixing the conductive particles, and other possible conductive and fillable materials may be used. have. For example, the conductive particles may include at least one selected from the group consisting of indium tin oxide (ITO), zinc tin oxide (ZTO), and carbon nanotubes (CNT) , Nickel, carbon nanotubes, graphene, and conductive polymers. Of these, indium tin oxide (ITO) is preferably used, but not always limited thereto. In the case of indium tin oxide (ITO), there is an advantage of improving visibility.

The average particle diameter of the conductive particles may be 1 nm to 5 탆, for example, 10 nm to 5 탆. And may vary according to the fine pitch and desired conductivity to be implemented within the above range. Advantageous for improving visibility and conductivity.

The binder may include at least one of alkyl, amine, acrylic, urethane, silicone, and ethylene resins. For example, the binder may be dissolved in an organic solvent, and the conductive paste may be in the form of a sol, gel, or liquid ink in which the conductive particles are dispersed in an organic solvent in which the binder is dissolved.

In the conductive paste, the content of the conductive particles may be 60 to 80% by weight, the content of the binder may be 10 to 20% by weight, and the content of the solvent may be 10 to 20% by weight, .

As a method for filling the conductive material, a squeezer, a wet plating, a dry deposition, an inlay, a printing, or a sputtering method may be used. In addition, a conductive material filling method may be included .

In the method using the above-described squeegee, a method in which a conductive material is injected into the substrate having the photoresist mask formed thereon at a low rate and then the substrate is solidified by applying a high voltage thereto may be used. It is a method to control the occurrence of casting defects by applying high pressure to the solidification process in which the conductive material changes volume and to realize high quality with improved resistance and strength. When a squeezer is used, gas bubbles can be largely removed, mechanical properties (strength) are improved, and adhesion with other materials is advantageous.

6 schematically illustrates a doctoring process according to one embodiment of the present invention. Specifically, doctoring is performed after filling the photoresist pattern with the conductive material 20 to form a conductive film.

 If a conductive material is applied to the surface of the photoresist in the case of a lift-off process for filling a conductive paste, the contact with the peeling liquid may be blocked when the photoresist is removed, or the photoresist may be difficult to remove due to the residual conductive pattern material However, when using the blade, it is possible to remove the conductive material on the photoresist, thereby facilitating the removal of the photoresist and improving the remnants of the residue

The removal of the conductive material remaining on top of the photoresist by doctoring has the advantage of facilitating removal of the photoresist upon lift-off. This completely removes the photoresist, improves the visibility and functionality of the touch panel, and can recover the conductive material, thereby reducing the material and reducing the cost.

The doctoring blade at the time of doctoring may be a metal or plastic material. It is preferable to select a material which can be adjusted in accordance with the photoresist and the conductive material and which does not damage and scratch the photoresist while removing the conductive material on the photoresist.

The angle formed by the doctoring photoresist pattern surface and the blade may be 10 degrees to 80 degrees, preferably 10 degrees to 60 degrees, more preferably 10 degrees to 50 degrees. There is an advantage of reducing scratches or damage to the photoresist in the above range.

According to another embodiment, the step of forming the conductive film and the step of doctoring the conductive film may be performed at the same time. This has the effect of shortening the process time and saving time. (See Fig. 7)

5 schematically shows a step of drying and curing the conductive paste. In embodiments, the curing may be thermosetting, ultraviolet curing or catalytic curing. For example, thermosetting is a reaction curing at 80 ° C to 150 ° C, and a curing agent and a catalyst are mixed with a resin having a functional group such as a hydroxyl group or a carboxyl group.

Step S4 of FIG. 5 schematically shows the step of removing the photoresist. And specifically lift-off the remaining photoresist to form the conductive pattern 25. The step of lifting off the photoresist may be a physical or chemical method.

Chemical methods of lift-off include acetone, trichlorethylene (TCE), phenol-based strippers (Indus-Ri-Chem J-100), methyl ether ketone methyl ethyl ketone (MEK), methyl isobutyl ketone (MIBK), and the like.

Physical methods of the lift-off include plasma etching with oxygen (O 2) or stripping using Shipley 1165 stripper (n-methyl-2-pyrrolidone) a stripper may be used but is not limited thereto.

According to one embodiment, the surface of the bridge layer 40 and the first and second pattern electrodes 21 and 22 may be further formed with a protective layer 50. 4). The protective layer 50 prevents scratches or other damage to the first and second pattern electrodes 21 and 22 when the touch panel 100 is formed, and is preferably made of a heat resistant material so as not to be exposed to high temperatures Lt; / RTI > The protective layer 50 may be made of a transparent and insulating ceramic material, for example. More specifically, the protective layer 50 may be made of a transparent and insulating film type material.

For example, acrylic resin, urethane resin, silicone resin, or the like may be used as the protective layer 50, and these may be used alone or in combination of two or more. In addition, the protective layer 50 may be formed on the substrate 10 so as to cover the first and second pattern electrodes 21 and 22 through a lamination process.

In another embodiment, the electrode may be formed by the photoresist patterning, the conductive material filling, the doctoring, and the photoresist removal in the electrode forming step. Specifically, the above method is applicable when an electrode is formed of a transparent electrode material having fluidity. For example, when the electrode is formed of Ag paste, nanowire, and carbon nanotube (CNT), the above method may be applied. Those skilled in the art will understand that the present invention is applicable to the electrode forming step can do. In this case, there is an advantage that material and cost can be saved.

Specifically, the method includes forming a photoresist layer on a substrate in an electrode formation step, forming a pattern in the photoresist layer to form a first pattern electrode and a second pattern electrode, filling the pattern with a conductive material, The step of doctoring the conductive material and removing the photoresist may be included.

As another specific example, in the step of forming the insulating layer 30, when the photosensitive insulating material is pasted, the insulating layer 30 is formed by a method of photoresist patterning, filling of insulating material, doctoring, (30) can be formed. In this case, there is an advantage that material and cost can be saved.

Forming a photoresist layer on the layer on which the first pattern electrode and the second pattern electrode are formed; forming a pattern on the photoresist layer such that the first pattern electrode and the second pattern electrode are isolated from each other in the isolation region; , Filling the pattern with an insulating material, doctoring the insulating material, and removing the photoresist.

Another aspect of the present invention is to provide a single layer touch panel.

In one embodiment, the single layer touch panel may be manufactured by one of the single layer touch panel manufacturing methods.

According to another embodiment, the thickness of the bridge and trace electrodes of the touch panel may be 0.1 占 퐉 to 20 占 퐉, preferably 0.1 占 퐉 to 19 占 퐉, and more preferably 0.1 占 퐉 to 18 占 퐉. There is an advantage that resistance reduction and visibility are improved in the above-mentioned range.

According to another embodiment, the pattern electrode of the touch panel manufactured by the above method may have a gap of 0.5 占 퐉 to 150 占 퐉, preferably 0.5 占 퐉 to 140 占 퐉, more preferably 0.5 占 퐉 to 130 占 퐉.

100: touch panel 10: substrate
11: layer formed with first pattern electrode, second pattern electrode and insulating layer
20: conductive material 21: first pattern electrode
22: second pattern electrode 24: trace electrode
25: conductive pattern 30: insulating layer
40: conductive bridge layer 41: trace electrode
50: protective layer 70: photoresist pattern

Claims (14)

A first pattern electrode arranged on the base material with an isolation region formed along a first direction and an electrode electrically insulated from the first pattern electrode and forming a second pattern electrode arranged in the isolation region in a second direction, Forming step;
Forming an insulating layer on the isolation region, the insulating layer insulating the first pattern electrode and the second pattern electrode;
Forming a photoresist layer on the first pattern electrode, the second pattern electrode, and the layer on which the insulating layer is formed;
Forming a pattern in the photoresist layer to form bridge and trace electrodes;
Filling the pattern with a conductive material;
Doctoring the conductive material; And
Removing the photoresist;
Lt; / RTI >
Wherein forming the insulating layer comprises:
Coating a photosensitive insulating material on a layer on which the first pattern electrode and the second pattern electrode are formed; And
And patterning the photosensitive insulating material so that the first pattern electrode and the second pattern electrode are insulated from each other in the isolation region,
The conductive material may include at least one of indium tin oxide (ITO), zinc tin oxide (ZTO), carbon nanotube (CNT), graphene, and conductive polymer Wherein said method comprises the steps of:
The method of claim 1, wherein the step of filling the conductive material and the step of doctoring are simultaneously performed.
The method according to claim 1,
Forming a layer of indium tin oxide (ITO) on the substrate;
Forming a photoresist layer on the indium tin oxide (ITO) layer;
Patterning the photoresist layer to form a first pattern electrode and a second pattern electrode;
Etching the indium tin oxide (ITO) layer; And
Removing the photoresist layer;
Wherein the first and second electrodes are electrically connected to each other.
delete The method according to claim 1,
Forming a photoresist layer on the substrate;
Forming a pattern in the photoresist layer to form a first pattern electrode and a second pattern electrode;
Filling the pattern with a conductive material;
Doctoring the conductive material; And
Removing the photoresist;
Wherein the first and second electrodes are electrically connected to each other.
The method of claim 5, wherein the step of filling the conductive material and the step of doctoring are simultaneously performed.
The method of claim 1, wherein forming the insulating layer comprises:
Forming a photoresist layer on the layer on which the first pattern electrode and the second pattern electrode are formed;
Forming a pattern in the photoresist layer so that the first pattern electrode and the second pattern electrode are isolated from each other in the isolation region;
Filling the pattern with an insulating material;
Doctoring the insulating material; And
Removing the photoresist;
Wherein the first and second electrodes are electrically connected to each other.
8. The method of claim 7, wherein the step of filling the insulating material and the step of doctoring are performed at the same time.
The method of manufacturing a touch panel according to claim 1, wherein the substrate is glass or a flexible film.
The method of claim 1, wherein the conductive material is a conductive paste including conductive particles and a binder.
delete A touch panel produced by the method according to any one of claims 1 to 3 and 5 to 10.
13. The touch panel according to claim 12, wherein the thickness of the bridge and trace electrodes of the touch panel is 0.1 占 퐉 to 20 占 퐉.
13. The touch panel according to claim 12, wherein a distance between the pattern electrodes of the touch panel is 0.5 占 퐉 to 150 占 퐉.

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