TWI540478B - Touch screen panel and method of fabricating touch screen panel - Google Patents

Description

Touch panel and method of manufacturing same

The invention relates to a touch panel and a manufacturing method thereof, in particular to a touch panel which can replace the use of rare metals, reduce the resistance of the electrode layer, reduce the use of the process, and reduce the thickness of the panel and the manufacturing method thereof.

The conventional touch detection device includes a touch panel, and the user inputs the information through the screen to confirm the input information. The touch panel of the general touch detection device is divided into a resistive type, a capacitive type, an ultrasonic type, and an infrared type. Among them, the input of the capacitive touch panel is the easiest, so that the capacitive touch panel is most attractive. Attention.

The capacitive touch panel has a structure in which a plurality of X-axis detecting electrodes are disposed on a substrate, and a plurality of Y-axis detecting electrodes are arranged to cross the X-axis detecting electrodes. The X-axis detecting electrodes positioned in the same row must be electrically connected to each other, and the Y-axis detecting electrodes positioned in the same column also need to be electrically connected to each other. Since the X-axis detecting electrode and the Y-axis detecting electrode must be insulated while maintaining the above-described connection structure state, the X-axis detecting electrodes are formed on one substrate, the Y-axis detecting electrodes are formed on the other substrate, and the two substrates are formed. Bonding. Further, the method of maintaining the electrical connection may be such that a plurality of insulating layers are formed on the X-axis detecting electrode and the Y-axis detecting electrode, respectively, and a connecting electrode is formed on the insulating layer to electrically connect the X-axis detecting electrode and the Y-axis detecting electrode. But a similar approach will increase the substrate The number of the touch panel as a whole increases the thickness of the entire touch panel, so that a thin panel cannot be fabricated. Furthermore, as the number of insulating layers increases, the manufacturing process is also more difficult, the manufacturing cost is increased, and the time required for the process is also increased. In addition, the problem of the arrangement of the insulating layers is also derived.

At the same time, the detection electrode of the touch panel is made of a transparent conductive material, and in particular, ITO (Indium Tin Oxide) is most widely used. When the detection electrode uses ITO as a material, exposure, development, etching, stripping, or the like is required. Moreover, ITO uses rare metals, and rare metals are gradually depleted, and the cost is also rising. A related art document using a polymer polymer as a transparent conductive electrode of a touch panel can be referred to the Korean Patent Application No. 10-2010-0057586.

The present invention is to provide a touch panel that can replace rare metal in the ITO detection electrode layer, reduce the resistance of the detection electrode layer, and a method of manufacturing the touch panel. According to the touch panel and the manufacturing method of the present invention, it is possible to reduce processing difficulty, process cost, and processing time. At the same time, the disadvantages of the aforementioned prior art are improved without using a base substrate or an insulating layer.

An embodiment of the present invention provides a touch panel including: a support member; a first insulating layer formed on the support member, the first insulating layer further includes a touch electrode layer support portion and a connecting portion; a first touch electrode layer formed on the first touch electrode layer supporting portion of the first insulating layer; a second insulating layer formed on the first insulating layer and the first touch electrode layer, and the second insulating layer The touch electrode layer support portion and the connection portion are further included; and a second touch electrode layer is formed on the touch electrode layer support portion of the second insulation layer. The thickness of the electrode layer support portion of the first insulating layer is larger than the thickness of the first insulating layer connection portion; and the thickness of the electrode layer support portion of the second insulating layer The degree is greater than the thickness of the second insulating layer connecting portion.

The material of the first and second insulating layers may be a photoresist material. The first and second touch electrode layers may be transparent conductive layers. A conductive material containing a metal can be used for the transparent conductive layer. The first touch electrode layer may extend in the first direction, and the second touch electrode layer may extend in the second direction perpendicular to the first direction.

Another embodiment of the present invention provides a touch panel, a support member, and a first photosensitive resin layer formed on the surface of the support member. The first photosensitive resin layer has a concave portion and a convex portion; The layer is formed on the convex portion of the first photosensitive resin layer; a second photosensitive resin layer is formed on the first photosensitive resin layer and the first conductive layer, and the second photosensitive resin layer has a first portion and a second portion In part, the second thickness of the second portion is larger than the first thickness of the first portion, and the second conductive layer is formed on the second portion of the second photo-sensitive resin layer.

A further embodiment of the present invention relates to a method for manufacturing a touch panel, the method comprising: providing a support member, providing a lower photoresist film on the support member and a lower transparent conductive layer formed on the lower photoresist film; Performing multiple exposures on the lower photoresist film to form a first photoresist hardening layer including the touch electrode support portion and the connection portion; developing the lower photoresist film to form a first transparent conductive layer; and providing an upper photoresist film And an upper transparent conductive layer formed on the upper photoresist film, the upper photoresist film is disposed on the first photoresist layer and the first transparent conductive layer; and the upper photoresist film is exposed to multiple times to form a touch electrode a second photoresist layer of the support portion and the connection portion; and the upper photoresist film is developed to form a second transparent conductive layer. The first and second transparent conductive layers may use a conductive material containing a metal.

The forming step of the first photoresist layer includes: exposing the lower photoresist film to form a support portion of the touch electrode layer of the first photoresist layer, and then performing the lower photoresist film Exposure forms a connection portion of the second photoresist layer, and the thickness of the connection portion is smaller than the thickness of the touch electrode layer support portion.

The step of forming the touch electrode layer support portion of the first photoresist layer comprises: exposing the lower photoresist film by a photomask, corresponding to the region of the touch resist layer support portion of the first photoresist layer, and It is not covered by the reticle, so it can be in contact with the underlying transparent conductive layer. The step of forming the connection portion of the first photoresist layer includes: exposing the lower photoresist film to the region of the touch resist layer support portion and the connection portion of the first photoresist layer by a mask, the mask A distance is maintained between the underlying transparent conductive layer.

The formation of the touch-resist layer connection portion of the first photoresist layer can be performed for all areas of the lower photoresist film.

The first transparent conductive layer may be formed on the touch electrode layer support portion of the first photoresist layer.

The step of forming the touch electrode layer supporting portion of the second photoresist layer includes: exposing the upper photoresist film, forming a touch electrode layer supporting portion and a connecting portion in the second photoresist layer, and the thickness of the connecting portion is smaller than The thickness of the touch electrode layer support portion.

The second transparent conductive layer may be formed on the touch electrode layer support portion of the first photoresist layer.

For other related matters in the embodiment, please refer to the drawings and detailed descriptions in the embodiment.

In view of the foregoing invention, the present invention can indeed solve the disadvantages of the prior art and achieve the object and effect of the present invention.

20‧‧‧1st insulation layer

21‧‧‧Electrode Layer Support

22‧‧‧Connecting Department

30‧‧‧2nd insulation layer

31‧‧‧Electrode Layer Support

32‧‧‧Connecting Department

40‧‧‧1st touch electrode layer

50‧‧‧2nd touch electrode layer

120, 130‧‧‧ photoresist film

140, 150‧‧‧ transparent conductive layer

D1~d4‧‧‧ thickness

S500~S550‧‧‧Steps

1 is a top view of an embodiment of a touch panel in accordance with the present invention.

Fig. 2 is a cross-sectional view of the touch panel cut along the section line II-II' in Fig. 1.

Fig. 3 is a cross-sectional view of the touch panel cut along the section line III-III' in Fig. 1.

Fig. 4 is a cross-sectional view showing the touch panel cut along the line IV-IV' in Fig. 1.

FIG. 5 is a flow chart showing a method of manufacturing a touch panel according to an embodiment of the invention.

6A to 6H are cross-sectional views showing a process of manufacturing a touch panel according to an embodiment of the present invention.

The specific embodiments of the present invention are intended to be illustrative of the technical scope of the present invention. The present invention is not limited to the present invention, and may be used in the technical field. Those skilled in the art will be fully aware of the present invention. The scope of protection of the present invention is based on the scope disclosed in the scope of the patent application.

In this specification, the same reference numerals are used to designate the same or similar elements. The phrase "layer, film, region" or "substrate" or "substrate" when used in the <RTI ID=0.0>

Although the component names use "first", "second", etc., this is used to identify the names of the same constituent elements, and the names of the constituent elements are not limited to the order. Therefore, the first constituent element referred to below may be the second constituent element within the technical scope of the present invention. Like reference numerals in the specification denote like elements. In addition, configurations such as size and thickness in the drawings are for convenience of description and understanding, and are not intended to be limiting.

The various features of several embodiments of the invention may be partially or completely Combinations, and in technology and various connections, will be fully understood by those skilled in the art, and the various embodiments can be carried out independently or in accordance with the associated. The technical content disclosed in the present invention will be described below with reference to specific embodiments.

1 is a top view of an embodiment of a touch panel of the present invention. As shown, a touch panel 100 includes a support member 10, a first insulating layer 20 formed on the support member 10, and a first The touch electrode layer 40, the second insulating layer 30, and the second touch electrode layer 50. The support member 10 is a transparent insulating material support body for supporting the components constituting the touch panel 100. The support member 10 can also be made of a material having strength, for example, tempered glass and acryl resin; Hard materials suitable for flexible displays, such as polyethylene terephthalate (PET), polycarbonate (PC), polyethersulfone (PES), polyimide (PI), and polymethylmethaacrylate methyl acrylate (PMMA) ) or similar materials. The first insulating layer 20 includes a first touch electrode layer supporting portion 21 and a connecting portion 22, and the first touch electrode layer 40 is formed on the electrode layer supporting portion 21 of the first insulating layer 20. The second insulating layer 30 is formed on the first insulating layer 20 and the first touch electrode layer 40. The second insulating layer 30 includes a second touch electrode layer supporting portion 31 and a connecting portion 32, and the second touch electrode layer. 50 is formed on the second touch electrode layer supporting portion 31 of the second insulating layer 30.

The first insulating layer 20, the first touch electrode layer 40, the second insulating layer 30, and the second touch electrode layer will be described in more detail below with reference to FIGS. 2 to 4.

2 is a cross-sectional view taken along the line II-II' in FIG. 1, that is, a cross-sectional view of the upper surface of the touch panel 100 in the diagonal direction; and FIG. 3 is a view of III-III in the first figure. 'A cross-sectional view of the hatching line, that is, a cross-sectional view of the touch panel 100 in the Y direction; FIG. 4 is a cross-sectional view taken along the line IV-IV' in FIG. 1 , that is, the X direction of the upper surface of the touch panel 100 Sectional view.

As shown in FIGS. 2 to 4, the first insulating layer 20 is formed on the support member 10, and the first insulating layer 20 may be a photoresist material, particularly a photoresist hardened layer. Since the first insulating layer 20 is a photoresist material, the first insulating layer 20 can be referred to as a first photosensitive resin layer. The first insulating layer 20 further includes an electrode layer supporting portion 21 and a connecting portion 22, and the electrode layer supporting portion 21 is for supporting the first touch electrode layer 40 on the first insulating layer 20. The connecting portion 22 is for connecting adjacent electrode layer supporting portions 21.

The thickness d1 of the electrode layer support portion 21 of the first insulating layer 20 is larger than the thickness d2 of the connection portion 22 of the first insulating layer 20, see FIGS. 2 to 4, when the first insulating layer 20 is formed on the flat surface of the support member 10. At the time, the height of the electrode layer support portion 21 on the first insulating layer 20 is larger than the height of the connection portion 22 on the first insulating layer 20. Therefore, the electrode layer support portion 21 on the first insulating layer 20 can be regarded as a convex portion, and the connection portion 22 on the first insulating layer 20 can be regarded as a concave portion. The formation of the electrode layer supporting portion 21 and the connecting portion 22 on the first insulating layer 20 can be achieved by a method of exposing the photoresist material a plurality of times, which will be described below in conjunction with FIGS. 5 and 6.

Before the connection portion 22 on the first insulating layer 20 is not formed, a gap is formed between the first insulating layer 20 and the second insulating layer 30, and the second insulating layer 30 is an electrode from the support member 10 and the first insulating layer 20. Since the layers are formed between each other, there is a space between the first insulating layer 20 and the second insulating layer 30. In the present embodiment, the smallest space electrode layer supporting portion 21 is formed between the first insulating layer 20 and the second insulating layer 30, and the adjacent electrode layer supporting portions 21 are connected by the connecting portion 22. The first touch electrode layer 40 is formed on the electrode layer support portion 21 of the first insulating layer 20, the electrode layer is a detection electrode layer, and the first touch electrode layer 40 is in the first direction of the support member 10. The first embodiment shows an extension of the first touch electrode layer 40 in the Y-axis direction of the present invention, but this embodiment is not intended to limit the present invention.

The first touch electrode layer 40 includes a plurality of detecting electrodes and connecting electrodes, and detecting The electrodes may have various shapes, and the detecting electrodes shown in Fig. 1 have a diamond shape and are connected by a connection electrode. The shape of the detecting electrode may be a columnar shape, a block shape, a circular shape or a polygonal shape. The shape of the first touch electrode layer 40 on one surface is substantially the same as the electrode layer support portion 21 of the first insulating layer 20. As shown in FIG. 1, the first touch electrode layer 40 extends in the Y-axis direction, and the electrode layer The support portion 21 also extends in the Y-axis direction, and the shape of the upper surface of the electrode layer support portion 21 is the same as the diamond-like shape of the first touch electrode layer 40. The first touch electrode layer 40 is a transparent conductive material, and may also contain metals such as silver nanowires, metal mesh, and graphene. According to an embodiment of the present invention, the first touch electrode layer 40 of the touch panel 100 uses a metal-containing conductive material, and ITO is not used. Therefore, a rare metal can be used instead.

The second insulating layer 30 is formed on the first insulating layer 20 and the first touch electrode layer 40, and the second insulating layer 30 may be a photoresist material, in particular, a photoresist hardened layer which is cured by a photoresist. Since the second insulating layer 30 is a photoresist material, it can be regarded as a light-sensitive resin layer. The second insulating layer 30 further includes an electrode layer supporting portion 31 and a connecting portion 32. The electrode layer supporting portion 31 supports the second touch electrode layer 50 formed on the second insulating layer 30. The connecting portion 32 is for connecting adjacent electrode layer supporting portions 31.

The thickness d3 of the electrode layer support portion 31 of the second insulating layer 30 is larger than the thickness d4 of the connection portion 32 of the second insulating layer 30, and the electrode layer support portion 31 and the connection portion 32 on the second insulating layer 30 may be formed multiple times. The method of exposing the photoresist material is achieved, and the process method will be described below in conjunction with Figures 5 and 6.

When the connection portion 32 is not formed on the second insulating layer 30, the visibility between the first touch electrode layer 40 and the second touch electrode layer 50 is poor. Generally, the touch panel 100 is used in a display device to display an image. If a pattern is excessively spaced on the upper surface of the touch panel 100, the display device is The image on it will not be obvious. In the present embodiment, the connection portion 32 is formed on the second insulating layer 30, whereby visibility can be improved. The second touch electrode layer 50 is formed on the electrode layer support portion 31 of the second insulating layer 30. At the same time, the second touch electrode layer 50 extends in the second direction of the support member 10. As shown in FIG. 1 , the second touch electrode layer 50 extends in the X-axis direction, but the embodiment is not limited thereto. this invention.

The second touch electrode layer 50 includes a plurality of detecting electrodes and connecting electrodes. The detecting electrodes may have various shapes. The detecting electrodes shown in FIG. 1 have a diamond shape and are connected by connecting electrodes. The shape of the detecting electrode may be a columnar shape, a block shape, a circular shape or a polygonal shape. The shape on the surface of the second touch electrode layer 50 is substantially the same as the electrode layer support portion 31 of the second insulating layer 30. As shown in FIG. 1, the second touch electrode layer 50 extends in the X-axis direction, and the electrode layer The support portion 31 extends in the X-axis direction in the same manner, and the shape of the upper surface of the electrode layer support portion 31 is the same as the diamond-like shape of the second touch electrode layer 50. The second touch electrode layer 50 is a transparent conductive material, and may also contain a metal such as a silver nanowire, a metal mesh, and graphene, or the same material as the first touch electrode layer.

The thickness d1 of the electrode layer support portion 21 of the first insulating layer 20 is equal to or smaller than the thickness d3 of the electrode layer support portion 31 of the second insulating layer 30, and the thickness d2 of the first touch electrode layer 40 is equal to the second touch electrode layer. 50 thickness d4. Therefore, the total thickness of the first touch electrode layer 40 on the electrode layer support portion 21 on the first insulating layer 20 is less than or equal to the electrode layer support portion 31 on the second insulating layer 30 plus the second touch electrode layer 50. The total thickness. When the thickness of the second insulating layer 30 formed on the first insulating layer 20 is relatively smaller than that of the first insulating layer 20, a gap is formed between the first insulating layer 20 and the second insulating layer 30, and the first gap is formed. The insulating layer 20 and the second insulating layer 30 create a space. Therefore, the space generated by the first insulating layer 20 and the second insulating layer 30 can be minimized by making the thickness of the second insulating layer 30 greater than or equal to the thickness of the first insulating layer 20. In some embodiments, the first insulation The total thickness of the first touch electrode layer 40 is added to the electrode layer support portion 21 on the layer 20, and the total thickness of the electrode layer support portion 31 on the second insulating layer 30 plus the second touch electrode layer 50 is 10 μm. Or less than 10μm.

The touch panel 100 of the present invention is a horizontal touch panel. The touch panel 100 calculates the first touch electrode layer 40 and the second touch electrode layer on the touch coordinate by detecting whether the touch occurs. 50 changes in resistance. When ITO is used as the electrode layer, the touch distance is generally 100 μm or more than 100 μm. This touch distance is sufficient to detect whether there is a touch action and calculate the touch position coordinates, so the ITO is suitable for vertical use. Type of touch panel. However, according to an embodiment of the present invention, the electrode layer thickness of the touch panel 100 is 10 μm, or less than 10 μm, and a transparent conductive material such as a silver nanowire, a metal mesh, and graphene is used instead of ITO, so the present invention It is more difficult to apply to the vertical touch panel. However, as described above, the touch panel 100 of the present invention is suitable for a touch panel of a horizontal type, and detects changes in resistance of the first touch electrode layer 40 and the second touch electrode layer 50 when the touch is detected. Calculate the coordinates of the touch position.

In some embodiments, the touch panel 100 further includes a wiring for transmitting an input signal through the first touch electrode layer 40 and the second touch electrode layer 50, and the wiring is made of a conductive material, such as a metal material. The wiring may be formed in a certain region, such as a region where the first insulating layer 20 and the second insulating layer 30 are not formed on the support member 10, in other words, regions other than the first insulating layer 20 and the second insulating layer 30, and may be The input signal is turned on from the first touch electrode layer 40 and the second touch electrode layer 50.

Hereinafter, a method of manufacturing the touch panel of the present invention will be described with reference to FIGS. 5 and 6A to 6H in accordance with a specific embodiment.

FIG. 5 is a flow chart of a method for manufacturing a touch panel according to the present invention. 6A to 6H The figure shows a cross-sectional view of a touch panel made according to the manufacturing method of the embodiment.

First, referring to step S500 shown in FIG. 5, the lower photoresist film 120 and the lower transparent conductive layer 140 formed on the lower photoresist film 120 are disposed on the support 10. The underlying photoresist film 120 and the underlying transparent conductive layer 140 formed on the underlying photoresist film 120 will be described in detail below in conjunction with FIG. 6A.

The lower photoresist film 120 is a photoresist film for forming the first insulating layer 20, and is disposed on the lower side between the first insulating layer 20 and the second insulating layer 30 of the touch panel 100, and the lower photoresist layer. The film 120 is made of a photoresist material and is in the form of a film. The lower transparent conductive layer 140 is used to form the first touch electrode layer 40 and is disposed on the lower side of the first touch electrode layer 40 and the second touch electrode layer 50. The lower transparent conductive layer 140 is a transparent conductive material, for example, a conductive material containing a metal.

The lower transparent conductive layer 140 is first formed on the lower photoresist film 120 and then disposed on the support member 10. In other words, the lower transparent conductive layer 140 is formed by adding a liquid conductive material and forming it on the lower photoresist film 120, followed by drying. The lower photoresist film 120 and the lower transparent conductive layer 140 are provided on the support member 10 by lamination. However, this formation method is not intended to limit the present invention, and the lower photoresist film 120 and the lower transparent conductive layer 140 formed on the lower photoresist film 120 can be formed in various ways.

Next, referring to step S510 shown in FIG. 5, the first insulating layer 20 further has an electrode layer supporting portion 21 and a connecting portion 22 for performing multiple exposures on the lower photoresist film 120. The detailed process of forming the first insulating layer 20 will be described below in conjunction with Figs. 6A and 6C.

Referring to FIG. 6B, the lower photoresist film 120 is subjected to the first exposure to form the electrode layer support portion 21 in the first insulating layer 20. Forming the electrode layer support portion 21 to be exposed In the process, the first mask 190 is covered on the lower transparent conductive layer 140, and the first mask 190 is not covered in the region where the electrode layer support portion 21 is to be formed. Thereafter, the first mask 190 is irradiated with ultraviolet rays, and the lower photoresist film 120 is made of a negative photoresist material. In the region where the first mask 190 is not covered, electrode layer support is formed on the first insulating layer 20 by exposure hardening. Department 21.

Referring to FIG. 6C again, in order to form the connection portion 22 in the first insulating layer 20, the lower photoresist film 120 is subjected to the second exposure. In order to form the connection portion 32 in the second insulating layer 30, the lower transparent conductive layer 140 is exposed to ultraviolet light. As shown in the figure, the mask is not covered with respect to the region where the electrode layer support portion 21 and the connection portion 22 are to be formed in the first insulating layer 20. The thickness of the connecting portion 22 can be adjusted by the number of times of ultraviolet exposure, for example, the thickness of the connecting portion 22 is smaller than the thickness of the electrode layer supporting portion 21.

Further, in the present embodiment, the electrode layer supporting portion 21 adjacent to the first insulating layer is connected to the lower layer resist film 120 a plurality of times, and each electrode layer supporting portion 21 is connected to reduce the number of manufacturing steps. Optimize the opening phenomenon.

Step S520, as shown in FIG. 6D, the first touch electrode layer 40 is formed by developing the lower photoresist film 120. The detailed process of forming the first touch electrode layer 40 will be described below with reference to FIG. Description.

In FIG. 6D, after the lower photoresist film 120 is subjected to multiple exposures, the remaining underlying photoresist film 120 can be removed by development. When the remaining underlying photoresist film 120 is removed, the underlying transparent conductive layer 140 formed thereon is also removed. The developing solution used for the lower photoresist film 120 is an inorganic alkali solution or an organic alkali solution. However, the present invention is not limited thereto, and various development methods can be used. As described above, the first touch electrode layer 40 is formed on the electrode layer supporting portion 21 of the first insulating layer 20 after development. In other embodiments, the first touch electrode is formed After the layer 40, a hardening treatment process can be additionally performed on the first insulating layer 20.

In the touch panel technology using ITO as an electrode layer, ITO needs to be deposited on a support member to form a photoresist layer, and after ITO, development, etching, and lift-off, the ITO is patterned. However, it can be seen from the embodiments of the present invention that the present invention can perform the processes of exposure and development on the lower photoresist film 120 formed on the support member 10 and the lower transparent conductive layer 140 formed on the photoresist film 12. Finish the patterning. Etching, stripping, and other similar processes used by conventional techniques are completely eliminated. Therefore, the present invention can reduce manufacturing cost, time, and process and processing difficulty.

Referring to step S530 shown in FIG. 6E, the photoresist film 130 and the transparent conductive layer 150 formed on the photoresist film 130 are disposed on the first insulating layer 20 and the first electrode layer 40. The formation of the photoresist film 130 and the transparent conductive layer 150 will be described in detail below in conjunction with FIG. 6E.

The upper photoresist film 130 is a photoresist film used to form the second insulating layer 30, and is disposed on a higher side between the first insulating layer 20 and the second insulating layer 30 of the touch panel 100. The upper photoresist film 130 is made of a photoresist material and is in the form of a film.

The upper transparent conductive layer 150 is used to form the second touch electrode layer 50 and is disposed on the higher side of the first touch electrode layer 40 and the second touch electrode layer 50 of the touch panel 100 . The upper transparent conductive layer 150 may use the same material as the lower transparent conductive layer 140.

Before the upper photoresist film 130 and the upper transparent conductive layer 150 are disposed on the first insulating layer 20 and the first touch electrode layer 40, the upper transparent conductive layer 150 is first formed on the upper photoresist film 130, and the method and the method are formed. The lower transparent conductive layer 140 is formed on the lower photoresist film 120 in the same manner.

The upper photoresist film 130 and the upper transparent conductive layer 150 are disposed in a lamination method. The first insulating layer 20 and the first touch electrode layer 40. However, the formation method is not intended to limit the present invention, and the upper photoresist film 130 and the upper transparent conductive layer 150 formed on the upper photoresist film 130 can be formed in various ways.

In step S540, as shown in FIGS. 6F and 6G, the second insulating layer 30 further has an electrode layer supporting portion 31 and a connecting portion 32 which are exposed to the upper photoresist film 130 a plurality of times. The process of forming the second insulating layer 30 is described in detail below in conjunction with Figures 6F and 6G.

As shown in FIG. 6F, in order to form the electrode layer support portion 31 in the second insulating layer 30, the upper photoresist film 130 is subjected to the first exposure. In the process of forming the electrode layer support portion 31, the second mask 191 is covered on the upper transparent conductive layer 15, but the second mask 191 is not covered in the region where the electrode layer support portion 31 is to be formed. Thereafter, the second mask 191 is irradiated with ultraviolet rays, and in the region where the second mask 191 is not covered, the electrode layer supporting portion 31 is formed in the second insulating layer 30 by exposure curing.

Next, referring to FIG. 6G, in order to form the connection portion 32 in the second insulating layer 30, the upper photoresist film 130 is subjected to the second exposure. In order to form the connection portion 32 in the second insulating layer 30, the upper transparent conductive layer 150 is exposed to ultraviolet light. As shown in FIG. 6G, a region in which the electrode layer support portion 31 and the connection portion 32 are to be formed in the second insulating layer 30 is used, but a separate photomask is not used, but a layer is disposed above the upper transparent conductive layer 150. But the reticle is not in contact with the upper transparent conductive layer 150. As described above, the mask is not used or the mask is not in contact with the upper transparent conductive layer 150. During the exposure of the ultraviolet light, oxygen flows through the upper surface of the upper photoresist film 130, and then contacts the upper transparent conductive layer 150. The upper surface of the resistive film 130 is hardened by oxygen turbulence, and the lower surface of the upper photoresist film 130 is in contact with the first insulating layer 20 and the first touch electrode layer 40. Therefore, the upper photoresist film 130 is driven from the bottom to the bottom. Hardening is formed on it. It can be seen from the embodiment that it can be borrowed The thickness of the connecting portion 32 of the second insulating layer 30 is adjusted by the number of times of ultraviolet light exposure.

Further, in the present embodiment, the electrode layer supporting portion 31 adjacent to the second insulating layer 30 is formed by forming the connecting portion 32 by performing the exposure to the upper photoresist film 130 a plurality of times, and thus the first touch electrode layer 40 is connected. The process between the second touch electrode layer 50 and the second touch electrode layer 50 is reduced, and the visibility can be improved.

In step S550, as shown in FIG. 6H, the upper photoresist film 130 is developed to form the second touch electrode layer 50. The detailed process of forming the second touch electrode layer 50 will be described below in conjunction with FIG. 6H.

As shown in FIG. 6H, after the upper photoresist film 130 is subjected to multiple exposures, the remaining upper photoresist film 130 can be removed by development. When the remaining upper photoresist film 130 is removed, the upper transparent conductive layer 150 formed thereon is also removed. The developing solution used for the upper photoresist film 130 is an inorganic alkali solution or an organic alkali solution. However, the present invention is not limited thereto, and various development methods can be used.

As described above, the second touch electrode layer 50 is formed on the electrode layer supporting portion 31 of the second insulating layer 30 after development. In another embodiment, after the second touch electrode layer 50 is formed, a hardening treatment process may be additionally performed on the second insulating layer 30.

In the touch panel technology using ITO as an electrode layer, ITO needs to be deposited on a support member to form a photoresist layer, and after ITO, development, etching, and lift-off, the ITO is patterned. Moreover, if an ITO electrode layer is to be formed on an ITO electrode layer, an additional support member must be provided between the two ITO electrode layers, which increases the manufacturing cost and increases the thickness of the touch panel. It is not possible to manufacture a thin touch panel.

However, it can be seen from the manufacturing method in the embodiment of the present invention that the present invention only needs to expose and develop the upper transparent resist layer 150 formed on the upper photoresist film 130 and the upper photoresist film 130. The process can be completed. Etching, stripping, and other similar processes used by conventional techniques are completely eliminated. Therefore, the present invention can reduce the manufacturing cost, time, process, process, and unnecessary materials, and can produce a thin touch panel.

Furthermore, if an ITO electrode layer is to be formed on an ITO electrode layer, an insulating layer (not the aforementioned support member) is disposed between the two ITO electrode layers. In this case, the insulating layer is formed only at the intersection of the two ITO electrode layers to minimize the increase in the thickness of the touch panel. Moreover, the masks need to be separately used in the process, and the insulating layers cannot be precisely arranged.

However, in the manufacturing method of the embodiment of the present invention, the second conductive layer 50 is cured by the upper photoresist film 130, and the second insulating layer 30 insulates the first conductive layer 40 and the second conductive layer 50. Therefore, the present invention does not A separate process for forming an insulating layer is required.

The above is only the specific embodiment of the present invention, and the scope of the present invention is not limited thereto. That is, the equivalents and modifications of the scope of the invention as claimed in the present invention are not to be construed as a departure from the scope of the invention.

20‧‧‧1st insulation layer

21‧‧‧Electrode Layer Support

22‧‧‧Connecting Department

30‧‧‧2nd insulation layer

31‧‧‧Electrode Layer Support

32‧‧‧Connecting Department

40‧‧‧1st touch electrode layer

50‧‧‧2nd touch electrode layer

D1~d4‧‧‧ thickness

Claims (14)

A touch panel includes: a support member; a first insulating layer formed on the support member, further comprising an electrode layer support portion and a connection portion; a first touch electrode layer formed on the first insulation layer a second insulating layer formed on the first insulating layer and the first touch electrode layer, further comprising an electrode layer supporting portion and a connecting portion; and a second touch electrode layer, Formed on the electrode layer support portion of the second insulating layer; wherein the thickness of the electrode layer support portion of the first insulating layer is larger than the thickness of the first insulating layer connection portion; and the thickness of the electrode layer support portion of the second insulating layer is greater than a thickness of the second insulating layer connecting portion; wherein the first touch electrode layer extends along the first direction, and the second touch electrode layer extends in a second direction perpendicular to the first direction. The touch panel of claim 1, wherein the first insulating layer and the second insulating layer are made of a photoresist material. The touch panel of claim 1, wherein the first touch electrode layer and the second touch electrode layer are transparent conductive layers. The touch panel of claim 3, wherein the transparent conductive layer is a conductive material containing a metal. A touch panel comprising: a support member; a first photosensitive resin layer formed on a surface of the support member, the first photosensitive resin layer a concave portion and a convex portion; a first conductive layer formed on the convex portion of the first photosensitive resin layer; and a second photosensitive resin layer formed on the first photosensitive resin layer and the first conductive layer, The second photosensitive resin layer has a first portion and a second portion, wherein the second thickness of the second portion is greater than the first thickness of the first portion; and a second conductive layer is formed on the second photosensitive resin The second part of the layer. A method for manufacturing a touch panel, the method comprising: providing a support member, disposing a photoresist film on the support member and a lower transparent conductive layer formed on the lower photoresist film; and performing the lower photoresist film on the lower photoresist film Multiple exposures to form a first photoresist hardened layer including a touch electrode support portion and a connection portion; developing the lower photoresist film to form a first transparent conductive layer; providing an upper photoresist film and forming an upper layer An upper transparent conductive layer of the photoresist film, wherein the upper photoresist film is disposed on the first photoresist layer and the first transparent conductive layer; and the upper photoresist film is exposed to multiple times to form a touch electrode support a second photoresist layer of the portion and the connecting portion; and developing the upper photoresist film to form a second transparent conductive layer. The method of manufacturing a touch panel according to claim 6, wherein the first and second transparent conductive layers can use a conductive material containing a metal. The method for manufacturing a touch panel according to claim 6, wherein the forming step of the first photoresist layer comprises: Exposing the lower photoresist film to form a support portion of the touch electrode layer of the first photoresist layer; and exposing the lower photoresist film to form a connection portion of the second photoresist layer; The thickness of the portion is smaller than the thickness of the support portion of the touch electrode layer. The method for manufacturing a touch panel according to claim 8, wherein the step of forming the touch electrode layer supporting portion of the first photoresist layer comprises: exposing the lower photoresist film by a mask, corresponding to The region of the touch resist layer support portion of the first photoresist layer is not covered by the mask, so that it can be in contact with the underlying transparent conductive layer. The method of manufacturing a touch panel according to claim 8, wherein the forming step of the connecting portion of the first photoresist layer comprises: matching the lower photoresist film to the first photoresist by a photomask The hardened layer touch electrode layer support portion and the region of the connection portion are exposed, and the photomask maintains a distance from the lower transparent conductive layer. The method of manufacturing a touch panel according to claim 8, wherein the first photoresist layer of the first photoresist layer is formed by exposing the entire area of the lower photoresist film. The method of manufacturing a touch panel according to claim 8, wherein the first transparent conductive layer is formed on a touch electrode layer supporting portion of the first photoresist layer. The method of manufacturing a touch panel according to claim 6, wherein the forming step of the touch electrode layer supporting portion of the second photoresist layer comprises: exposing the upper photoresist film to the second photoresist hardening Layer forming touch electrode layer support And a connecting portion, the connecting portion having a thickness smaller than a thickness of the touch electrode layer supporting portion. The method of manufacturing a touch panel according to claim 13, wherein the second transparent conductive layer is formed on the touch electrode layer supporting portion of the first photoresist layer.