KR101642472B1 - Touch type keypad integrated with element and touch sensor as laminated structure - Google Patents

Touch type keypad integrated with element and touch sensor as laminated structure Download PDF

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Publication number
KR101642472B1
KR101642472B1 KR1020150106428A KR20150106428A KR101642472B1 KR 101642472 B1 KR101642472 B1 KR 101642472B1 KR 1020150106428 A KR1020150106428 A KR 1020150106428A KR 20150106428 A KR20150106428 A KR 20150106428A KR 101642472 B1 KR101642472 B1 KR 101642472B1
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KR
South Korea
Prior art keywords
layer
led
keypad
touch
layers
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KR1020150106428A
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Korean (ko)
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박재순
최성호
박상민
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(주)레온
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Priority to KR1020150106428A priority Critical patent/KR101642472B1/en
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/02—Input arrangements using manually operated switches, e.g. using keyboards or dials
    • G06F3/0202—Constructional details or processes of manufacture of the input device
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Push-Button Switches (AREA)

Abstract

A touch keypad having an integrated layer structure of a device and a touch sensor according to the present invention includes: a first layer including a device in a pattern portion formed on a surface of at least one of an upper surface and a lower surface; A second layer stacked on the first layer, the second layer including a space and a perimeter having a supporter surrounding at least one circumferential surface of the space; A third layer that is laminated on the second layer and includes a touch sensor that performs a touch recognition function by reflecting a light source of an LED on a pattern portion formed on at least one surface of an upper surface and a lower surface; An LED mounted on one side of any one of the first to third layers; And a medium for electrically connecting the respective layers on which the pattern units are formed.
According to the touch keypad having the integrated device and the touch sensor according to the present invention in an integrated laminated structure, the device and the touch sensor are structured in an integrated manner, thereby achieving miniaturization of the keypad and providing an intuitive control function.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a touch keypad having an integrated device and a touch sensor,

The present invention relates to a touch keypad having an integrated device and a touch sensor in an integrated laminate structure. More particularly, the present invention relates to a keypad (hard key) provided on a bezel of an electronic device such as a smart phone, a tablet PC, The touch sensor element for controlling the touch recognition is provided as an integral laminated structure without being separated from the touch sensor circuit board by a separate device. In other words, when the touch sensor element is touch- The LED and the touch recognition unit are integrally formed in a vertically stacked structure in a region where the LED and the touch recognition unit are not provided at a separate position spaced apart from the LED and the touch recognition unit so as to perform more intuitive control while reducing the size of the bezel, To a touch-type keypad.

Currently, smart phones and tablet PCs are manufactured with a touch panel of a display panel, and various operations and commands can be implemented according to the user's touch.

Such a touch-type electronic device, that is, an electronic device having a touch screen as a display panel can operate / operate the device by a simple touch operation within a display or an electronic device without a physical input means occupying a separate space like a conventional keyboard, It is possible to provide an advantage that it can pursue its own miniaturization.

The keypad provided in the display panel of the touch-type electronic device may be referred to as a soft key. Alternatively, a keypad provided in a part / region other than the display panel, for example, a bezel, There is also a hard key, which is a keypad.

1 is a conceptual diagram illustrating a touch-operated keypad provided on a bezel of a conventional electronic device.

The keypad shown in FIG. 1 is a kind of the above-mentioned physical key, that is, a hard key, wherein the bezel refers to a peripheral portion of a display panel or an electronic product such as an LCD, an LED, and an OELED.

There is a product in which the display panel fills the front portion of the touch-type electronic device so that the display panel fills the front region with almost no bezel portion. However, in some cases, the keypad, There is a disadvantage that the size of a screen output to the display panel is reduced due to the presence of a soft key or a soft key. Therefore, a large number of products including a keypad (hard key) separately exist in a bezel portion around the display panel.

1, a conventional hard key, i.e., a keypad 1, provided in a part of an electronic device other than a display panel such as a touch screen is mainly composed of one to three buttons such as a home button or a previous button And touch recognition has provided a visual indication of the recognition while the LED is illuminated. As a related art related thereto, Korean Patent Laid-Open No. 10-2013-0081939 entitled " mobile terminal equipped with a hard key & 10-2011-0017239 " Touch type key input bar ", Korean Patent Laid-Open No. 10-2011-0019839 " Multi view keypad "

In general, a keypad (hard key, key input bar) 1 as shown in FIG. 1 is composed of a touch recognition unit such as a driver or a passive element and a touch sensor, and an LED, The control touch sensing IC unit based on the touch sensor 3 is provided at a position separate from the keypad 1 and connected to the keypad via the lead 2. [

However, if the keypad itself is not provided with a PCB and is controlled and powered by a PCB 3 provided in a spaced-apart area, the size of the bezel 5 may be unnecessarily increased, The disadvantage is that the overall control of the keypad is not intuitive and functional loss can occur.

Accordingly, a PCB-based control unit and a power supply unit are integrally formed at the lower part of the keypad to perform intuitive control, and at the same time, it is possible to manufacture a keypad with a laminated structure durably while reducing the installation size. There is a need to develop an advanced touch-type keypad structure.

The present invention has been conceived in order to overcome the problems of the above-described technology, and it is an object of the present invention to provide a touch sensor device, in which a PCB unit functioning as a control for a touch recognition unit and the like are mounted on different layers in the lower part thereof, And a keypad structure of the present invention can be miniaturized while ensuring intuitive control of the keypad.

Another object of the present invention is to mount a layer implementing a bumper or bridge function between a touch recognition part and a device.

It is a further object of the present invention to derive various structures of a layer that performs a bumper or a bridge function to ensure ease of injection process of a mold liquid.

It is still another object of the present invention to provide a multilayer structure of three layers based on the three layers.

It is a further object of the present invention to provide a variety of LED mounting areas to pursue a variety of manufacturing and use environments.

According to an aspect of the present invention, there is provided a touch keypad including an element and a touch sensor in an integrated laminated structure, including: a first layer including a device in a pattern portion formed on a surface of at least one of an upper surface and a lower surface; A second layer stacked on the first layer, the second layer including a space and a perimeter having a supporter surrounding at least one circumferential surface of the space; A third layer that is laminated on the second layer and includes a touch sensor that performs a touch recognition function by reflecting a light source of an LED on a pattern portion formed on at least one surface of an upper surface and a lower surface; An LED mounted on one side of any one of the first to third layers; And a medium for electrically connecting the respective layers on which the pattern units are formed.

The circumferential supporters are formed in two in the form of an eleventh letter, and are additionally provided on the opposing face in the form of a straight line on one circumferential surface, and between the supporters, And an open portion is formed.

In addition, the LED may be mounted on one side of the pattern part of the first layer which is a lower space of the second layer, and the third layer may include a through hole formed through the area corresponding to the mounting position of the LED .

In addition, the keypad may further include a mold injected through the opening to be cured.

According to the touch keypad having an integrated layer structure of the device and the touch sensor according to the present invention,

1) By integrally structuring the device and the touch sensor, the miniaturization of the keypad is sought, the intuitive control function is provided,

2) It is possible to provide a physical structure capable of forming a separate electrode while seeking structural stability as well as semiconductor and circuit protection by a layer providing a bumper or a bridge function between each laminated substrate,

3) The structure of the layer acting as a bumper or bridge can be variously handled to provide diversity of support and ease of injection of mold liquid.

4) It is efficient and diverse layout structure of LED to provide miniaturization of keypad, while ensuring variety of production and use environment,

5) It is possible to provide a keypad that is selectively made of three layers or four layers and can be expanded and compatible with various structures.

1 is a conceptual diagram showing an LED driving keypad provided in a bezel of a conventional electronic device.
2 is a cross-sectional view showing a combined state of a basic structure of a keypad according to the present invention;
3 is a perspective view of the first and second embodiments of the three-layer structure constituting the keypad according to the present invention.
FIG. 4 is a perspective view of the third and fourth embodiments of the three-layer structure constituting the keypad according to the present invention; FIG.
FIG. 5 is a perspective view of a first embodiment of a four-layer structure constituting a keypad according to the present invention; FIG.
FIG. 6 is a perspective view of a second embodiment of a four-layer structure constituting a keypad according to the present invention; FIG.
7 is a perspective view showing a schematic structure of a manufacturing apparatus for manufacturing a keypad according to the present invention.
8 is a flowchart showing a schematic process for manufacturing a keypad according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The accompanying drawings are not drawn to scale and wherein like reference numerals in the various drawings refer to like elements.

The keypad according to the present invention can be manufactured individually in units of units in a manufacturing process and can also be provided with a plurality of strips in which a plurality of keypads are continuously arranged along one column as a unit of cells A process of manufacturing a final keypad by cutting each cell, i.e., a keypad, in a structure (first and second strip assemblies) can be applied. In addition, the keypad according to the present invention may have a laminated structure for three layers (10, 20, 30), or a structure comprising four layers (10, 20, 30, 40) The former is described in Figs. 2 to 4, and the latter is explained in Figs. 5 and 6.

The keypad of the present invention, that is, the keypad for performing touch recognition while outputting the LED light, is formed by integrally laminating PCBs including LEDs and devices for providing control and power supply functions to the touch recognition unit in one area, And a multi-layer structure capable of improving the spatial arrangement efficiency. In FIGS. 2 to 4, a structure in which three layers are stacked is shown.

2, the second to third layers 20 and 30 are sequentially stacked on the first layer 10, which is the lowermost layer serving as a printed circuit board (PCB), on the first layer 10, The LEDs 50 may be mounted on any one of the first, second and third layers 10, 20 and 30 and the adhesive layers 60 and 70 may be provided between the respective layers 10, Is applied as required or optional. Furthermore, by forming a mold that surrounds the outer structure of the keypad as well as between the layers 10, 20, and 30, the coupling relation to each of the layers 10, 20, and 30 is achieved.

The first layer 10 of the present invention is a substrate on which a circuit for performing main functions such as control as well as sensing of light emission or touch recognition of the LED 50 provided on the keypad is formed, (Flexible PCB). The first layer 10 may be a single-sided circuit board having a circuit formed on an upper surface thereof, as well as a double-sided circuit board having circuits formed on both upper and lower surfaces thereof.

That is, when the first layer 10 is a double-sided circuit board, the top surface pattern portion 11 and the bottom surface pattern portion 12, in which the circuit is formed through the via hole 13, And can be electrically connected through a pattern (or a conductive coating layer) in the via hole. In other words, the top surface pattern portion 11 or the bottom surface pattern portion 12 may be connected to a material such as a conductive wire or conductive ink for connecting the semiconductor driving chip and the circuit board, and may be plated for this purpose.

The first layer 10 may have a width of about 3 to 20 mm, and the subsequent layer may be formed of the same or similar size, which is sequentially stacked on the first layer 10.

In addition, a surface treatment can be performed on the surface (the top surface in the case of the end face, or the top face in the case of the both surfaces) on which the pattern portions 11 and 12 are formed on the first layer 10. For example, a PSR (Photo Solder Resist) Thereby protecting the pattern units 11 and 12 of the first layer 10.

In addition, the semiconductor junction circuit (pattern portion) structure for driving the keypad of the present invention is not necessarily formed only on the first layer 10, but may be formed on the second and third layers 20 and 30 as will be described later.

In addition, in order to electrically connect each layer, a cable extending from the third layer 30 extends to the first layer 10 through the second layer 20, so that the respective layers are electrically connected through the cable It is also possible to conduct the conductive treatment to the conductive holes formed in the respective layers in the state where the respective layers are electrically connected to each other so as to achieve the interlayer conductive coupling relationship without the cables.

The elements included in the pattern units 11 and 12 of the first layer 10 perform a main control function for controlling the LED driving and the touch sensor and are described as a concept including both a driving element and a passive element These elements may be formed in the pattern units 11 and 12 in the form of an embeded type semiconductor or other elements.

The first adhesive layer 60 is provided between the first and second layers 10 and 20 to join the first and second adhesive layers 60 and 60. The first adhesive layer 60 may be a physical layer composed of an adhesive, Or may be formed of various materials such as an epoxy adhesive ink and a conductive material ink in order to ensure an electrical connection with other layers.

The second layer 20 of the present invention is laminated on the first layer 10 via the first adhesive layer 60 and not only electrically connects the first and third layers, As well.

In other words, the second layer 20 functions as a buffer for the first layer 10, which mainly performs control / sensing like a control tower, and the third layer 30, which mainly performs a touch recognition function, (10, 30) is pressed to a thin thickness, electrical shorts between the patterns formed on the respective layers (10, 30), pressing phenomenon of the semiconductor and the wires, and other unnecessary interference And a physical buffering function to prevent the possibility of contact with the contact surface.

In addition, a separate pattern portion 21 is additionally formed on the upper surface to the lower surface of the peripheral portion 23 in the second layer 20 to serve as an electrode body for electrically connecting the substrate or the electrode and the first and third layers .

The second layer 20 is not formed of a single closed curved surface structure such as the first layer 10 but has a three-dimensional structure having an open space, that is, a space 22 through which the central portion penetrates, And a circumferential portion 23 provided in the periphery.

The space 22 is formed by pattern portions 12 and 31 (pattern portions having a three-dimensional shape such as a wire bonding structure) formed on the upper surface of the first layer 10 and the lower surface of the third layer 30, The circuit configured to protrude by the device may be pressed or deformed to solve the problem that the circuit may become structurally unstable, and it may be formed in various shapes depending on the shape of the peripheral portion 23. [ In addition, as will be described later, the space 22 is filled with a mold liquid to provide a spatial basis for forming a mold structure.

The peripheral portion 23 functions as a conductor by the supporting function and the pattern portion 21 including the physical structure around the space 22 and is formed by the mounting structure of the LED 50 and the mounting structure of the LED 50, 3 to 4 according to the interlocking relationship, and basically includes the supporter 24 and the opening 25.

The supporter 24 means a physical structure which acts as a support and conductor between the first and third layers 10 and 30 in a state where the pattern portion 21 is formed on the upper surface or the lower surface, It means open space. The periphery 23 including the supporter 24 and the opening 25 may have a variety of structures depending on the number and position of the supporter 24. The mounting of the LED 50 and the attachment of the third layer 30, And will be described later.

The second adhesive layer 70 is formed between the second and third layers 20 and 30 and functions to adhere the two layers. The adhesive layer 70 is structurally similar to the conductive adhesive layer of the conductive ink or the conductive film, (Or adhesion) of the second and third layers 20 and 30 while connecting the electrodes of the second and third layers 20 and 30 by applying a conductive adhesive agent or a mold liquid, And may be made of the same material as the adhesive layer 60. This second adhesive layer 70 is not an essential component and can be an optional configuration that can be replaced by a mold as described below.

The third layer 30 of the present invention is a substrate on which a touch recognition unit including a circuit for touch recognition, i.e., a touch sensor, is mounted, The pattern portion 31 is formed. The pattern portion 31 of the third layer 30 can be formed of a plating for device bonding so that passive elements such as a capacitor and a resistor can be bonded.

The third layer 30 is subjected to a surface treatment with a PSR or a white film or the like for reflecting the LED light to protect the pattern unit 31 and to provide a light reflection effect, 10 and 20, the through hole 32 serving as an inlet for the mold liquid is formed in various shapes on one side of the central region or on one side of the peripheral region. .

As described above, the cable, which is one of the constituent elements for electrically connecting each layer, extends from the pattern portion 12 of the lower surface of the first layer 10, or extends from the pattern portion 11 of the upper surface, The first to third layers 10, 20 and 30 can be electrically connected to the third layer 30 and the LED 50 provided in the third layer 30 can be electrically connected to the third layer 30, Or branched as a branch pattern so that the branched cable can electrically connect the first layer 10 and the third layer 30.

Furthermore, although not shown in the drawings, the cable may be replaced with a conductive hole, that is to say, a conductor / cable type, but it is also possible to form a conductive hole in each layer, conduct conductive treatment on the inner wall, It is of course possible to make the electrical connection by the conduction hole so that the cable passes. In other words, in the present invention, a cable or a conductive hole for electrically connecting elements formed on the first, second, and third layers 10, 20, and 30, a touch sensor, a pattern portion, an LED, .

With the above structure, the keypad of the present invention can realize a sensing and control function in a laminated structure in which the three layers 10, 20, and 30 are integrated, thereby ensuring a slim and stable structure, A mold made of a transparent material is formed on each of the layers 10 and 20 by a molding device to be described later so as not to interfere with the exposure of the LED light while ensuring a safe and firm connection relationship between the respective layers 10, 30, as well as outside the layers 10, 20, 30.

FIG. 3 is a perspective view of the first and second embodiments of the three-layer structure constituting the keypad according to the present invention, and FIG. 4 is a perspective view of the third and fourth embodiments of the three-layer structure constituting the keypad according to the present invention. It is a perspective view.

The keypad according to Fig. 3 (a) is formed on one side of the first layer 10, more specifically, on one side of the top surface pattern portion 11 of the first layer 10, which is the lower end region of the space 22 of the second layer 20 And the periphery 23 of the second layer 20 is made up of a supporter 24 extending in correspondence with the length of one circumferential surface of the first layer 10, The supporters 24 are formed in a shape of a one-letter shape and are opposed to each other, and are formed in a total of two, and have the same structure as the eleven letters.

Of course, such a supporter 24 is not limited to FIG. 2 (a) having the same 11-character structure but may be formed of '1' (straight) to 'A' In this asymmetric structure, the mold to be described later is filled in the remaining space of the second layer 20 and cured to secure the structural stability and symmetry, but the structure having the 11-member structure as shown in FIG. 2 (a) More preferable. In addition, by the structure of the supporter 24, the inflow path through which the mold liquid can enter through the open portion 25, which is the open space between the supporters 24, can be secured to the left and right sides of the second layer 20 have.

Correspondingly, in the third layer 30, a through hole 32 is formed in a region corresponding to a mounting portion of the LED 50.

3 (a), the light of the LED 50 is transmitted to the outside through the through hole 32 of the third rare-earth 30 It is possible to create a mold structure capable of connecting the respective layers 10, 20 and 30 in the vertical direction by filling the mold liquid through the through holes 32 as well as naturally exposed. In this case, the through hole 32 is formed to be slightly larger than the size of the LED 50, so that the mold liquid can be injected into the vicinity of the LED 50 inserted into the through hole 32, Can be generated.

The third layer 30 is stably supported by the supporter 24 of the second layer 20 and the second layer 20 is supported by the supporter 24 when the mold is formed on the keypad of the present invention in the manufacturing process. 24 can be injected into the open part 25 to provide ease of manufacture and robust durability of the mold structure.

3B, the keypad according to the embodiment of the present invention includes two supporters 24 of the second layer 20 as shown in Fig. 3 (a) and two LEDs 50, A through hole 32 of the third layer 30 is formed on the upper surface of the supporter 24 of the third layer 30, So that the third layer 30 has a shape similar to a 'C' shape.

In this case, the cross-sectional area of the through-hole 32 of the third layer 30 is larger than the cross-sectional area of the LED 50 so that the LED 50 can easily inject the mold liquid into the remaining space accommodated in the through- . That is, it provides a structural basis through which the mold liquid can be injected in the vertical direction through the through-holes 32.

3B is characterized in that the LED 50 is mounted on the supporter 24 of the second layer 20. The pattern portion 21 formed on the supporter 24 The through hole 32 of the third layer 30 ensures the visibility of the LED light while the LED 50 and other components are electrically connected to each other through the through hole 32 The mold liquid can be injected into the keypad in the vertical and horizontal directions through the open space 25 between the remaining space of the LEDs 32 and the supporter 24 to ensure a durable mold structure, It provides the characteristics that can guarantee the position.

The embodiment of the keypad according to FIG. 4A also includes the LED 50 on the first layer 10 in a state in which the second layer 20 has the eleven supporter 24 as in FIG. 3 (a) The through hole 32 of the third layer 30 starts from the circumferential surface and is inserted and penetrated in a predetermined length in the inner direction as shown in FIG. 2 (b).

In this case, the cross-sectional area of the through-hole 32 is larger than the cross-sectional area of the LED 50 so that the mold liquid can be easily injected in the vertical direction.

The embodiment according to FIG. 4 (a) also provides a simple structure for injecting the mold liquid in the vertical / horizontal direction and is capable of accommodating the mold liquid, and can expand the mounting position of the LED 50 .

The embodiment of the keypad according to FIG. 4 (b) is such that the LED 50 is arranged on one side of the third layer 30, that is, on the side of the second layer 30 The LED 50 is then introduced through the openings 25 between the through holes 32 and the supporter 24 to form a hardened mold And is directly exposed to the outside in the state of being overlapped by.

3 and 4, the supporters 24 are opposed to the respective circumferential surfaces opposed to each other and have the openings 25 opened to the left and right sides respectively, so that the third layer 30 can be stably And provides a structure that is easy to accommodate the mold liquid. In addition, the through hole 32 of the third layer 30 serves as an inlet for injecting the mold liquid in the vertical direction, and at the same time provides a function of protecting the LED 50 or ensuring visibility, 20, 30) due to the conductive properties of the first to third layers (10, 20, 30) provided with the LEDs (10, 20, 30) It provides characteristics that can guarantee scalability.

FIG. 5 is a perspective view of a first embodiment of a four-layer structure constituting a keypad according to the present invention, and FIG. 6 is a perspective view of a second embodiment of a four-layer structure constituting the keypad according to the present invention.

5 and 6 illustrate a structure in which the fourth layer 40 is further laminated on the third layer 30. In other words, the keypad of the present invention has a laminated structure for three layers But it is possible to extend to four layer laminated structures.

5, the second layer 20 includes LEDs 50 on the fourth layer 40 in a state of having the supporter 24 formed in an eleven-letter shape as shown in FIGS. As shown in FIG.

The forth layer 40 of the present invention is a top layer structure of the keypad and is adhered to the third layer 30 by the third adhesive layer 80 which is additionally provided with the LED 50 Bonded to each other). This fourth layer 40 not only provides space for accommodating the LED 50 but also provides the function of protecting the third layer 30 from external impact.

Specifically, the fourth layer 40 includes a space 41 and a peripheral portion 42 formed around the space 41, like the second layer 20, (43) and an opening (44).

5, the supporter 43 in the circumferential portion 42 surrounding the space 41 is constituted by an opening portion 44 formed by a structure extending over three surfaces like a letter U and the other one surface being opened have. At this time, the number, the structure, and the position of the supporter 43 may be variously changed, so that the number, the structure, and the position of the opening 44 may be variously configured. to be.

5, the LED 50 connected to the three layers 30 is received and coupled to the opening 44, and the LED 50 is formed as a module or a semiconductor, And is electrically connected to either the third layer 30 or the first or second layer 10 or 20 through a cable or a conductive hole.

Alternatively, the LED 50 may be stacked on the pattern portion 31 of the third layer 30 to be electrically connected to the third layer 30, that is, the fourth layer 40 may have a separate pattern And there is no electrical circuit structure, so that the LED 50 is electrically connected to the pattern portion of the third layer 30 in order to drive the LED 50. Preferably, the LED 50 is laminated on the pattern portion 31 of the third layer 30 via the SMT or conductive ink or the like on the LED connecting pattern portion having the +/- electrodes. So that an electrical connection state can be realized.

The space 41 of the fourth layer 40 serves as a space for recognizing the touch and is filled with a mold to protect the pattern portion 31 of the third layer 30 from being exposed to the outside You may.

6 has a structure in which the space 41 is present in the second layer 20 but the supporter 43 forms the entire circumference 42 without the opening 44. That is, As shown in Fig. At this time, the mold liquid can be injected through the holes formed in the space 41 or the periphery of the fourth layer 40 through the holes.

 The structure of the second rare gas 20 may be applied to a structure in which the three layers 10, 20, and 30 according to FIGS. 2 and 3 are laminated. Such a structure may be such that the mold liquid does not flow into the side The second layer 20 serves to stably support the third layer 30 by its own structure while minimizing the help of the mold.

As described above, the keypad of the present invention can provide a laminated structure in which three or four layers are electrically connected to each other. Hereinafter, the keypad of the present invention is laminated with three layers or four layers, An apparatus for manufacturing a keypad through a structure serving as an intermediate in a manufacturing process having a structure in which a plurality of cells are continuously arranged in a plurality of lines as a specific line pattern and a schematic manufacturing method using the same Describe the process.

FIG. 7 is a perspective view showing a schematic structure of a manufacturing apparatus for manufacturing a keypad according to the present invention, and FIG. 8 is a flowchart showing a schematic process for manufacturing the keypad of the present invention.

As described above, the keypad of the present invention has a structure in which a plurality of layers are stacked on top and bottom, and each layer can be adhered (further adhered) by the above-mentioned adhesive layer. However, A mold is proposed for joining the durable coupling relation in which the layers are combined together in the horizontal direction as well as the vertical direction.

The mold is produced by curing the mold liquid. The mold is provided with the same function as the housing surrounding the outside of the layers constituting the keypad of the present invention, and can also serve as an adhesive layer for durably bonding the respective layers .

However, when the molding process is performed through the semiconductor package equipment or other mold liquid injecting apparatus in the keypad manufacturing process of the present invention, the through hole 32 of the third layer 30 located at the top or the space of the fourth layer 40 It is difficult to inject the mold liquid in the lateral direction when the sides of each layer are clogged, so that it is possible to cover the outside of the layers as well as between the layers. There is a problem in that it is difficult to propose a durable mold structure having a certain thickness.

3 to 6, the periphery 23 of the second layer 20 is not formed as a closed curved surface, and at least one side is opened. In other words, in the circumferential portion 23, The opening 25 provided in the peripheral portion 23 of the second layer 20 is provided with at least one opening 25 between the opening 22 and the opening 22, Molds are formed in the vertical and horizontal directions with respect to the second layer 20 by injecting the mold liquid through the first and second molds 25, 25, thereby completing a more durable and robust keypad.

Further, in the known liquid phase injection step in the LED chip or the semiconductor manufacturing process, a problem arises in that a layer type PCB continuously arranged in a strip structure is bent or a joint portion between PCBs is dropped or swollen. In order to prevent the flexure of the keypad and to withstand the pressure during mold injection, the injection path 120 is formed to fill the mold liquid between successive strips of each keypad.

FIG. 7 shows a schematic structure of an apparatus for manufacturing a keypad according to the present invention, in particular, a molding apparatus (a mold). More specifically, the first and second strip assemblies 100 and 200 are assembled, The first and second strip assemblies 100 and 200, which are formed by stacking the upper and lower laminate structures up to the third layer 30 (or the fourth layer), are cut in a cell unit to form a mold in the process of manufacturing one completed keypad ≪ / RTI >

The first strip assembly 100 of the present invention is an intermediate structure in which the first and second layers 10 and 20 are combined, that is, the cells including the structure of the first and second layers 10 and 20 &Quot; means < / RTI >

Specifically, the first strip assembly 100 includes a strip 110 in which cells each stacked with the first and second layers 10 and 20 are continuously arranged in units of columns (vertical lines in the drawing) And an injection path 120 arranged to extend along an extension line of the strip 110 between the first and second strips 110 and 120. In addition, a side injection hole 130 is formed through the side surface so as to pass through the injection path 120 from the side.

 Accordingly, the second strip assembly 200 is a structure in which the third layer 30 itself or the third and fourth layers 30 and 40 are incorporated, and the third layer 30 (or third and fourth layers) A strip 210 arranged in a row in a combined state is formed and an injection hole 220 penetrating through upper and lower sides of the strip 210 and a vent 230 for discharging air are formed through the strip 210 .

The first and third layers 10, 20 and 30 (or four layers) are arranged in the order of the top and bottom in the order of mutual seating (the second strip assembly is seated on the first strip assembly) The mold liquid is injected by the molding apparatus 300 at this time.

The molding apparatus 300 of the present invention injects the mold solution into the first and second strip assemblies 100 and 200 which are seated with each other. The first and second strip assemblies 100 and 200 include a base frame 310 And a mold liquid injector 320 branch-processed so as to be inserted into the side injection holes 312, respectively. At this time, an injection hole 311 is formed around the upper surface of the base frame 310 and a side injection hole 312 is formed through the side surface of the base frame 310. The injection hole 220 of the first and second strip assemblies 100, And the side injection holes 130, respectively.

The process of manufacturing the keypad of the present invention by the molding apparatus 300 will be described with reference to FIG.

First, the first and second strip assemblies 100 and 200 are manufactured by stacking the first and second strips 100 and 200 in the order of the first and second layers 20 and 10 through the first adhesive layer 60 And the second strip assembly 200 stacks the fourth and third layers 40 and 30 in the upper and lower order through the third layer 30 itself or the third adhesive layer 80. Since this process can be explained with reference to a known PCB package process, a detailed description will be omitted.

The first and second strip assemblies 100 and 200 thus manufactured are first received in the base frame 310 and then the second strip assembly 200 is seated on the upper surface of the first strip assembly 100.

A second adhesive layer 70 for adhering the second layer 20 forming the upper surface of the first strip assembly 100 and the third layer 30 forming the lower surface of the second strip assembly 200 A separate second adhesive layer forming step may be optionally added.

Thereafter, the mold liquid is injected through the mold liquid injector 320 coupled to the base frame 310 of the molding apparatus 300 or the side injection holes 130 of the first strip assembly 100, The mold liquid injected into the side injection holes 130 is injected into the open portion 25 of the second layer 20 while moving along the injection path 120. [ . That is, since the injection path 120 is formed on each of the left and right sides with respect to one strip 110, when the second layer is formed of the eleven-character supporter structure and the openings 25 are provided on the right and left sides, Can be naturally injected into the left and right openings 25, respectively. Such a molding apparatus 300 may refer to a transfer molding or injection molding apparatus.

In this case, when the supporter 24 is formed in a 'C' shape rather than an eleven character, that is, when an opening is formed on one side rather than on both sides, one strip 110 is provided per one line of each injection path 120, So that the mold liquid can be injected into the opening of one side.

The mold liquid injected into the opening 25 side of the second layer 20 through the injection path 120 as described above is firmly fixed to the first and second strip assemblies 100 and 200, The mold liquid is naturally filled in the inner structure of the keypad of each cell unit and the mold liquid is cured to form a mold to ensure a solid internal structure.

Further, the mold liquid can be further injected through the upper surface of the second strip assembly 200, specifically through the through-holes 32 of the third layer 30 or through the holes of the fourth layer 40, It is possible to generate a tower or tower mold vertically standing from the first layer 10 to the third layer 30 (or the fourth layer), thereby making it possible to ensure the durability of the keypad in the vertical direction I am responsible.

Thereafter, the strips 110 and 210 of the first and second strip assemblies 100 and 200 are cut into individual cells, thereby completing a single completed keypad.

As described above, the structure and operation of the touch keypad having an integrated laminate structure of the device and the touch sensor according to the present invention are described in the above description and drawings. However, It is to be understood that the invention is not limited to those precise embodiments and that various changes and modifications may be made therein without departing from the spirit of the invention.

1: Keypad 2: Lead
3: PCB 5: Bezel
10: first layer 11: upper surface pattern portion
12: underside pattern part 13: via hole
20: second layer 21: pattern part
22: Space 23:
24: supporter 25: opening part
30: third layer 31: pattern part
32: through hole 40: fourth layer
41: space 42:
43: Supporter 44: Opening
50: LED 60: first adhesive layer
70: second adhesive layer 80: third adhesive layer
100: first strip assembly 110: strip
120: injection path 130: side injection hole
200: second strip assembly 210: strip
220: Injection hole 230: Vent
300: molding device 310: base frame
311: injection hole 312: side injection hole
320: Mold liquid injector

Claims (6)

1. A touch keypad comprising an element and a touch sensor in an integrated laminate structure,
A first layer including a device in a pattern portion formed on a surface of at least one of an upper surface and a lower surface;
And a peripheral portion formed of a space, a supporter surrounding at least one circumferential surface of the space, and an opening portion formed between the supporter and serving as a passage through which the mold is injected, A second layer including;
A third layer that is laminated on the second layer and includes a touch sensor that performs a touch recognition function by reflecting a light source of an LED on a pattern portion formed on at least one surface of an upper surface and a lower surface;
An LED mounted on one side of any one of the first to third layers;
A medium for electrically connecting each of the layers on which the pattern portions are formed;
And a mold which is injected through the opening and cured. The touch keypad according to claim 1, wherein the mold has an integrated structure. The method according to claim 1,
The supporter of the peripheral portion includes:
And two additional teeth are formed on the circumferential surface in the form of a straight line,
Wherein the open-
And the touch sensor is integrated with the space as an open space between the supporters. The method according to claim 1,
Wherein the LED is mounted on one side of the pattern portion of the first layer which is a space lower region of the second layer,
Wherein the third layer comprises:
And a through hole formed through a region corresponding to a mounting position of the LED. The touch keypad according to claim 1, The method according to claim 1,
Wherein the LED comprises:
The second layer being mounted on one side of the pattern portion of the second layer,
Wherein the third layer comprises:
And a through hole formed through a region corresponding to a mounting position of the LED. The touch keypad according to claim 1, delete The method according to claim 3 or 4,
Wherein the through hole has a larger cross-sectional area than the LED,
The mold comprises:
And the mold liquid injected through the through hole is hardened. The touch keypad according to claim 1,
KR1020150106428A 2015-07-28 2015-07-28 Touch type keypad integrated with element and touch sensor as laminated structure KR101642472B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150106428A KR101642472B1 (en) 2015-07-28 2015-07-28 Touch type keypad integrated with element and touch sensor as laminated structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150106428A KR101642472B1 (en) 2015-07-28 2015-07-28 Touch type keypad integrated with element and touch sensor as laminated structure

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110000391U (en) * 2009-07-06 2011-01-13 실리텍 일렉트로닉스(광저우) 코오., 엘티디. Light Emitting Button and Electronic Device using the Button
CN103000416A (en) * 2012-10-31 2013-03-27 昆山特酷电脑科技有限公司 Touch key reflecting light-guide structure
JP2014112353A (en) * 2012-10-30 2014-06-19 Sharp Corp Operation device and image processor provided with the same
JP2014241133A (en) * 2013-05-17 2014-12-25 光寶電子（廣州）有限公司 Light-emitting touch-switch device and light-emitting touch-switch module

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110000391U (en) * 2009-07-06 2011-01-13 실리텍 일렉트로닉스(광저우) 코오., 엘티디. Light Emitting Button and Electronic Device using the Button
JP2014112353A (en) * 2012-10-30 2014-06-19 Sharp Corp Operation device and image processor provided with the same
CN103000416A (en) * 2012-10-31 2013-03-27 昆山特酷电脑科技有限公司 Touch key reflecting light-guide structure
JP2014241133A (en) * 2013-05-17 2014-12-25 光寶電子（廣州）有限公司 Light-emitting touch-switch device and light-emitting touch-switch module

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